JP2017112238A5 - - Google Patents

Download PDF

Info

Publication number
JP2017112238A5
JP2017112238A5 JP2015245786A JP2015245786A JP2017112238A5 JP 2017112238 A5 JP2017112238 A5 JP 2017112238A5 JP 2015245786 A JP2015245786 A JP 2015245786A JP 2015245786 A JP2015245786 A JP 2015245786A JP 2017112238 A5 JP2017112238 A5 JP 2017112238A5
Authority
JP
Japan
Prior art keywords
time
processing apparatus
plasma processing
series data
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015245786A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017112238A (ja
JP6650258B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015245786A priority Critical patent/JP6650258B2/ja
Priority claimed from JP2015245786A external-priority patent/JP6650258B2/ja
Priority to KR1020160122799A priority patent/KR101835437B1/ko
Priority to US15/277,272 priority patent/US9934946B2/en
Priority to TW105131351A priority patent/TWI612554B/zh
Publication of JP2017112238A publication Critical patent/JP2017112238A/ja
Publication of JP2017112238A5 publication Critical patent/JP2017112238A5/ja
Application granted granted Critical
Publication of JP6650258B2 publication Critical patent/JP6650258B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015245786A 2015-12-17 2015-12-17 プラズマ処理装置及びプラズマ処理装置の運転方法 Active JP6650258B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015245786A JP6650258B2 (ja) 2015-12-17 2015-12-17 プラズマ処理装置及びプラズマ処理装置の運転方法
KR1020160122799A KR101835437B1 (ko) 2015-12-17 2016-09-26 플라스마 처리 장치 및 플라스마 처리 장치의 운전 방법
US15/277,272 US9934946B2 (en) 2015-12-17 2016-09-27 Plasma processing apparatus and operating method of plasma processing apparatus
TW105131351A TWI612554B (zh) 2015-12-17 2016-09-29 電漿處理裝置及電漿處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015245786A JP6650258B2 (ja) 2015-12-17 2015-12-17 プラズマ処理装置及びプラズマ処理装置の運転方法

Publications (3)

Publication Number Publication Date
JP2017112238A JP2017112238A (ja) 2017-06-22
JP2017112238A5 true JP2017112238A5 (OSRAM) 2019-02-14
JP6650258B2 JP6650258B2 (ja) 2020-02-19

Family

ID=59065241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015245786A Active JP6650258B2 (ja) 2015-12-17 2015-12-17 プラズマ処理装置及びプラズマ処理装置の運転方法

Country Status (4)

Country Link
US (1) US9934946B2 (OSRAM)
JP (1) JP6650258B2 (OSRAM)
KR (1) KR101835437B1 (OSRAM)
TW (1) TWI612554B (OSRAM)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6239294B2 (ja) * 2013-07-18 2017-11-29 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の運転方法
JP6173851B2 (ja) * 2013-09-20 2017-08-02 株式会社日立ハイテクノロジーズ 分析方法およびプラズマエッチング装置
WO2019099541A1 (en) * 2017-11-16 2019-05-23 Applied Materials, Inc. Predictive filter for polishing pad wear rate monitoring
KR102286360B1 (ko) * 2019-02-08 2021-08-05 주식회사 히타치하이테크 에칭 처리 장치, 에칭 처리 방법 및 검출기
CN112885694B (zh) * 2019-11-29 2025-10-03 东京毅力科创株式会社 夹具、处理系统及处理方法
CN113302722B (zh) * 2019-12-23 2023-12-08 株式会社日立高新技术 等离子处理方法以及等离子处理中使用的波长选择方法
TWI895368B (zh) * 2020-03-13 2025-09-01 日商東京威力科創股份有限公司 解析裝置、解析方法及解析程式
JP7467292B2 (ja) * 2020-03-13 2024-04-15 東京エレクトロン株式会社 解析装置、解析方法及び解析プログラム
US12062530B2 (en) * 2020-06-25 2024-08-13 Hitachi High-Tech Corporation Vacuum processing apparatus and vacuum processing method
KR102515864B1 (ko) * 2020-09-17 2023-03-31 주식회사 히타치하이테크 플라스마 처리 장치 및 플라스마 처리 방법

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160621A (en) * 1999-09-30 2000-12-12 Lam Research Corporation Method and apparatus for in-situ monitoring of plasma etch and deposition processes using a pulsed broadband light source
US7476624B2 (en) * 2001-06-15 2009-01-13 Tokyo Electron Limited Dry-etching method
US6903826B2 (en) * 2001-09-06 2005-06-07 Hitachi, Ltd. Method and apparatus for determining endpoint of semiconductor element fabricating process
JP4833687B2 (ja) * 2006-02-27 2011-12-07 株式会社日立ハイテクノロジーズ プラズマ処理装置
JP2008218898A (ja) * 2007-03-07 2008-09-18 Hitachi High-Technologies Corp プラズマ処理装置
EP2232430A4 (en) * 2007-12-03 2011-11-23 Abbott Medical Optics Inc METHOD OF MANAGING MEDICAL PRODUCTS
AU2009275987B2 (en) 2008-07-28 2014-06-12 Bsh Hausgerate Gmbh Dishwasher machine comprising a sorption drying device
JP5383265B2 (ja) * 2009-03-17 2014-01-08 株式会社日立ハイテクノロジーズ エッチング装置、分析装置、エッチング処理方法、およびエッチング処理プログラム
JP5665746B2 (ja) * 2009-08-06 2015-02-04 芝浦メカトロニクス株式会社 プラズマエッチング装置及びプラズマエッチング方法
JP5411215B2 (ja) * 2011-08-01 2014-02-12 株式会社日立ハイテクノロジーズ プラズマ処理装置
US9887071B2 (en) * 2011-12-16 2018-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Multi-zone EPD detectors
JP6177513B2 (ja) * 2012-09-28 2017-08-09 株式会社日立ハイテクノロジーズ プラズマ処理装置
CN104736744B (zh) 2012-10-17 2017-06-06 东京毅力科创株式会社 使用多变量分析的等离子体蚀刻终点检测
JP6186152B2 (ja) * 2013-03-29 2017-08-23 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
JP6239294B2 (ja) * 2013-07-18 2017-11-29 株式会社日立ハイテクノロジーズ プラズマ処理装置及びプラズマ処理装置の運転方法

Similar Documents

Publication Publication Date Title
JP2017112238A5 (OSRAM)
JP2015023104A5 (OSRAM)
Fan et al. Online monitoring of nonlinear multivariate industrial processes using filtering KICA–PCA
JP2016082233A5 (OSRAM)
MX2016002882A (es) Metodos de esterilizacion y aparato y control adaptable del mismo.
JP2016119473A5 (OSRAM)
JP2017017067A5 (OSRAM)
WO2015200476A3 (en) Processing mutations for a remote database
WO2014141116A3 (en) Apparatus, methods and systems for measuring and detecting electrical discharge
JP2015128129A5 (OSRAM)
EP4552574A3 (en) Apparatus, systems and methods for predicting, screening and monitoring of encephalopathy / delirium
JP2019165890A5 (OSRAM)
IL274834B2 (en) A method for determining information about a printing procedure, a method for reducing errors in measurement data, a method for calibrating a metrology process, a method for selecting metrological targets
MY190143A (en) Device and method for generating a high-band signal from non-linearly processed sub-ranges
JP2016197680A5 (OSRAM)
JP2016092342A5 (OSRAM)
JP2016184638A5 (OSRAM)
EP3168770A3 (en) Executing process monitoring
EA201691643A1 (ru) Система анализа записей
JP2014202582A5 (OSRAM)
EP2944973A3 (en) Methods and apparatus to determine a position using light sources
JP2016075585A5 (OSRAM)
JP2015211139A5 (OSRAM)
JPWO2022195662A5 (OSRAM)
MX2016010066A (es) Aparato de difraccion de rayos x y metodo de medicion de difraccion de rayos x.