JP2017101304A - Etching method of resin surface, and plating method on resin utilizing the same - Google Patents
Etching method of resin surface, and plating method on resin utilizing the same Download PDFInfo
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- JP2017101304A JP2017101304A JP2015237135A JP2015237135A JP2017101304A JP 2017101304 A JP2017101304 A JP 2017101304A JP 2015237135 A JP2015237135 A JP 2015237135A JP 2015237135 A JP2015237135 A JP 2015237135A JP 2017101304 A JP2017101304 A JP 2017101304A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/12—Etching, surface-brightening or pickling compositions containing heavy metal salts in an amount of at least 50% of the non-solvent components
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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Abstract
Description
本発明は、樹脂表面のエッチング方法およびこれを利用した樹脂へのめっき方法に関する。 The present invention relates to a method for etching a resin surface and a method for plating a resin using the same.
従来、プラスチック表面にめっきにより金属化処理を施す場合は、プラスチック表面とめっき皮膜との密着性を高めるために、めっき処理前にプラスチック表面をクロム酸と硫酸の混合液により粗化するエッチング処理を行うことが知られている。 Conventionally, when metallization treatment is applied to the plastic surface by plating, an etching treatment is performed to roughen the plastic surface with a mixed solution of chromic acid and sulfuric acid before the plating treatment in order to improve the adhesion between the plastic surface and the plating film. It is known to do.
しかし、上記エッチング処理では、有害な６価クロムを用いて６０℃以上の高温で作業するために、作業環境が悪くなり、またその廃水処理にも注意が必要であるという問題があった。 However, in the above etching process, there is a problem that the working environment is deteriorated because the work is performed at a high temperature of 60 ° C. or more using harmful hexavalent chromium, and the waste water treatment needs attention.
また、近年では、過マンガン酸を用いてプラスチックの表面をエッチングする技術も報告されているが（特許文献１）、使用条件によっては過マンガン酸が速やかに分解することがあり、工業的に使用するには問題がある場合があった。 In recent years, a technique for etching the surface of plastics using permanganic acid has also been reported (Patent Document 1). However, permanganic acid may be rapidly decomposed depending on use conditions, and is used industrially. There could have been a problem.
その後、上記過マンガン酸を用いたエッチング液の分解を抑制するために、過マンガン酸と、特定の無機酸、更にはハロゲンオキソ酸、ハロゲンオキソ酸塩、過硫酸塩、ビスマス酸塩から選ばれる１種の成分を含有させたエッチング処理用組成物も報告されているが（特許文献２）、上記成分は大量に使用するためコストが高く、やはり、これも工業的に使用するには問題があった。 Thereafter, in order to suppress the decomposition of the etching solution using the permanganic acid, it is selected from permanganic acid and a specific inorganic acid, and further halogen oxo acid, halogen oxo acid salt, persulfate, and bismuth acid salt. Although an etching composition containing one kind of component has also been reported (Patent Document 2), since the above component is used in a large amount, the cost is high. there were.
本発明はクロム酸を用いない樹脂のエッチング技術であって、工業的なレベルで運用できる新たな技術を提供することを課題とする。 It is an object of the present invention to provide a new technique that is an etching technique for a resin that does not use chromic acid and that can be operated at an industrial level.
本発明者らは、上記課題を解決するために鋭意研究した結果、意外にも、酸化剤を用いたエッチング工程を２段階に分けることにより酸化剤の分解が抑制でき、工業的なレベルで運用できることを見出し、本発明を完成させた。 As a result of diligent research to solve the above-mentioned problems, the present inventors have surprisingly been able to suppress the decomposition of the oxidant by dividing the etching process using the oxidant into two stages, and operate at an industrial level. The present invention has been completed by finding out what can be done.
すなわち、本発明は以下の工程（ａ）および（ｂ）
（ａ）酸化剤を含有する溶液で樹脂を処理し、樹脂表面に酸化剤を吸着させる工程
（ｂ）工程（ａ）で樹脂表面に吸着した酸化剤を活性化させる工程
を含むことを特徴とする樹脂表面のエッチング方法である。
That is, the present invention includes the following steps (a) and (b)
(A) treating the resin with a solution containing an oxidant and adsorbing the oxidant on the resin surface; (b) activating the oxidant adsorbed on the resin surface in step (a) This is a method of etching the resin surface.
また、本発明は樹脂をめっきするにあたり、樹脂を上記樹脂表面のエッチング方法でエッチングした後、めっきすることを特徴とする樹脂へのめっき方法である。 In addition, the present invention is a method for plating a resin, characterized in that, in plating a resin, the resin is etched by the etching method for the resin surface and then plated.
本発明の樹脂表面のエッチング方法は、エッチングに用いる酸化剤の分解を抑制することができるため、長時間エッチングを続けることができる。 Since the method for etching a resin surface according to the present invention can suppress decomposition of an oxidant used for etching, etching can be continued for a long time.
本発明の樹脂表面のエッチング方法（以下、「本発明方法」という）は、以下の工程（ａ）および（ｂ）を含むものである。
（ａ）酸化剤を含有する溶液で樹脂を処理し、樹脂表面に酸化剤を吸着させる工程
（ｂ）工程（ａ）で樹脂表面に吸着した酸化剤を活性化させる工程
The resin surface etching method of the present invention (hereinafter referred to as “method of the present invention”) includes the following steps (a) and (b).
(A) A step of treating a resin with a solution containing an oxidant and adsorbing the oxidant on the resin surface (b) A step of activating the oxidant adsorbed on the resin surface in step (a)
本発明のエッチング液で処理することのできる樹脂としては、特に制限されないが、例えば、アクリロニトリル・ブタジエン・スチレン（ＡＢＳ）、ポリカーボネート／アクリロニトリル・ブタジエン・スチレン（ＰＣ／ＡＢＳ）、アクリロニトリル・スチレン・アクリレート（ＡＳＡ）、シリコン系複合ゴム−アクリロニトリル−スチレン（ＳＡＳ）、ノリル、ポリプロピレン、ポリカーボネート（ＰＣ）、アクリロニトリル・スチレン、ポリアセテート、ポリスチレン、ポリアミド、芳香族ポリアミド、ポリエチレン、ポリエーテルケトン、ポリエチレンテフタレート、ポリブチレンテフタレート、ポリスルホン、ポリエーテルエーテルスルホン、ポリエーテルイミド、変性ポリフェニレンエーテル、ポリフェニレンスルフィド、ポリアミド、ポリイミド、エポキシ樹脂、液晶ポリマー等や上記各ポリマーのコポリマー等が挙げられる。これら樹脂の中でも、特にＡＢＳおよびＰＣ／ＡＢＳが好ましい。また、樹脂の形状も特に限定されない。 The resin that can be treated with the etching solution of the present invention is not particularly limited. For example, acrylonitrile butadiene styrene (ABS), polycarbonate / acrylonitrile butadiene styrene (PC / ABS), acrylonitrile styrene acrylate ( ASA), silicon-based composite rubber-acrylonitrile-styrene (SAS), noryl, polypropylene, polycarbonate (PC), acrylonitrile-styrene, polyacetate, polystyrene, polyamide, aromatic polyamide, polyethylene, polyetherketone, polyethylene terephthalate, poly Butylene terephthalate, polysulfone, polyether ether sulfone, polyether imide, modified polyphenylene ether, polyphenylene sulfide, poly De, polyimides, epoxy resins, copolymers such as a liquid crystal polymer or the like and the above polymers. Among these resins, ABS and PC / ABS are particularly preferable. Further, the shape of the resin is not particularly limited.
本発明方法の工程（ａ）において用いられる酸化剤は、特に限定されないが、例えば、過マンガン酸カリウム、過マンガン酸ナトリウム等の過マンガン酸塩、硫酸マンガン、硝酸マンガン、炭酸マンガン、塩化マンガン、酢酸マンガン、二酸化マンガン、マンガン酸ナトリウム、マンガン酸カリウム等のマンガン塩等が挙げられる。これら酸化剤の中でも特に過マンガン酸塩が好ましい。また、これら酸化剤は１種または２種以上を用いることができる。 The oxidizing agent used in step (a) of the method of the present invention is not particularly limited, and examples thereof include permanganates such as potassium permanganate and sodium permanganate, manganese sulfate, manganese nitrate, manganese carbonate, manganese chloride, Examples include manganese salts such as manganese acetate, manganese dioxide, sodium manganate, and potassium manganate. Among these oxidizing agents, permanganate is particularly preferable. Moreover, these oxidizing agents can use 1 type (s) or 2 or more types.
上記酸化剤を含有する溶液は、上記酸化剤を、例えば、水等の溶媒に溶解させたものが挙げられる。この溶液における酸化剤の含有量は特に限定されないが、例えば、０.０００５ｍｏｌ／Ｌ以上、好ましくは０.００５〜２.０ｍｏｌ／Ｌである。 As for the solution containing the said oxidizing agent, what dissolved the said oxidizing agent in solvents, such as water, is mentioned, for example. The content of the oxidizing agent in this solution is not particularly limited, but is, for example, 0.0005 mol / L or more, preferably 0.005 to 2.0 mol / L.
また、上記酸化剤を含有する溶液には、この溶液の酸化作用を損なわない限り、例えば
界面活性剤、ｐＨ緩衝剤等を含有させてもよい。
Further, the solution containing the oxidizing agent may contain, for example, a surfactant, a pH buffering agent and the like as long as the oxidizing action of the solution is not impaired.
上記酸化剤を含有する溶液で樹脂を処理し、樹脂表面に酸化剤を吸着させる方法は特に限定されず、例えば、上記酸化剤を含有する溶液中に、樹脂を浸漬するだけでよい。樹脂を浸漬する条件も特に限定されず、例えば０〜１００℃、好ましくは３５〜８０℃の溶液中に、樹脂を３０秒以上、好ましくは１〜３０分浸漬すればよい。 The method for treating the resin with the solution containing the oxidant and adsorbing the oxidant on the resin surface is not particularly limited. For example, the resin only needs to be immersed in the solution containing the oxidant. The conditions for immersing the resin are not particularly limited. For example, the resin may be immersed in a solution at 0 to 100 ° C., preferably 35 to 80 ° C. for 30 seconds or more, preferably 1 to 30 minutes.
工程（ａ）で樹脂表面に酸化剤を吸着させた後には、必要により水洗を行ってもよい。その後、工程（ｂ）で樹脂表面に吸着した酸化剤を活性化させる。 After adsorbing the oxidizing agent on the resin surface in the step (a), washing with water may be performed as necessary. Thereafter, the oxidizing agent adsorbed on the resin surface in the step (b) is activated.
酸化剤を活性化させる方法は特に限定されず、例えば、無機酸、有機酸、過酸化水素、ハロゲンオキソ酸、ハロゲンオキソ酸塩および過硫酸塩からなる群から選ばれる活性化剤の１種または２種以上を含有する溶液で樹脂を浸漬するだけでよい。 The method for activating the oxidizing agent is not particularly limited, and for example, one or more activators selected from the group consisting of inorganic acids, organic acids, hydrogen peroxide, halogen oxo acids, halogen oxo acid salts and persulfate salts or It is only necessary to immerse the resin in a solution containing two or more.
上記活性化剤のうち、無機酸としては、例えば、硫酸、塩酸、硝酸、リン酸、フッ酸等が挙げられ、有機酸としては、例えば、酢酸、メタンスルホン酸等が挙げられ、ハロゲンオキソ酸、ハロゲンオキソ酸塩としては、例えば、過塩素酸カリウム、過ヨウ素酸ナトリウム、過臭素酸等が挙げられ、過硫酸塩としては、例えば、ペルオキソ二硫酸ナトリウム、ペルオキソ二硫酸アンモニウム等が挙げられる。これら活性化剤の中でも過酸化水素、リン酸、硫酸が好ましい。これら活性化剤は、例えば、水等の溶媒に溶解させた溶液とする。この溶液における活性化剤の含有量は特に限定されないが、例えば、０.０５ｍｏｌ／Ｌ以上、好ましくは０.５〜１７ｍｏｌ／Ｌである。 Among the above activators, examples of the inorganic acid include sulfuric acid, hydrochloric acid, nitric acid, phosphoric acid, and hydrofluoric acid. Examples of the organic acid include acetic acid and methanesulfonic acid. Examples of the halogen oxoacid salt include potassium perchlorate, sodium periodate, and perbrominated acid. Examples of the persulfate include sodium peroxodisulfate and ammonium peroxodisulfate. Of these activators, hydrogen peroxide, phosphoric acid and sulfuric acid are preferred. These activators are, for example, solutions in a solvent such as water. Although content of the activator in this solution is not specifically limited, For example, it is 0.05 mol / L or more, Preferably it is 0.5-17 mol / L.
また、上記活性化剤を含有する溶液には、この溶液の活性化作用を損なわない限り、例えば界面活性剤、ｐＨ緩衝剤等を含有させてもよい。 The solution containing the activator may contain, for example, a surfactant, a pH buffering agent or the like as long as the activation action of the solution is not impaired.
樹脂表面に吸着した酸化剤を活性化させる方法は特に限定されず、例えば、活性化剤を含有する溶液を用いる場合には、例えば、０〜１００℃、好ましくは３５〜８０℃の溶液中に、樹脂を３０秒以上、好ましくは１〜３０分浸漬すればよい。 The method for activating the oxidizing agent adsorbed on the resin surface is not particularly limited. For example, when a solution containing an activator is used, for example, in a solution at 0 to 100 ° C., preferably 35 to 80 ° C. The resin may be immersed for 30 seconds or longer, preferably 1 to 30 minutes.
工程（ｂ）で樹脂表面に吸着した酸化剤を活性化させた後には、必要により中和・還元処理、コンディショナー処理等を行ってもよい。 After activating the oxidizing agent adsorbed on the resin surface in the step (b), neutralization / reduction treatment, conditioner treatment or the like may be performed as necessary.
以上説明した本発明方法により、樹脂表面をエッチングすることができる。なお、本発明方法は、従来公知の樹脂へのめっき方法における樹脂表面のエッチングに用いることができ、その他の工程は従来公知の樹脂へのめっき方法を利用することができる。 The resin surface can be etched by the method of the present invention described above. The method of the present invention can be used for etching a resin surface in a conventionally known plating method on a resin, and a conventionally known plating method on a resin can be used for other steps.
従来公知の樹脂へのめっき方法としては、例えば、無電解めっき法、ダイレクトめっき法等が挙げられる。 Examples of conventionally known plating methods for resins include electroless plating methods and direct plating methods.
以下、本発明を実施例を挙げて詳細に説明するが、本発明はこれら実施例に何ら限定されるものではない。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in detail, this invention is not limited to these Examples at all.
実 施 例 １
樹脂表面のエッチングおよびめっき（１）：
試料として５０×１００×３ｍｍのＡＢＳ樹脂の試験片（３００１Ｍ：ＵＭＧＡＢＳ株式会社製）を用いて、工程（ａ）および工程（ｂ）の順で処理を行った。処理に用いた水溶液の組成および条件を表１に示した。なお、めっき析出性は、以下のようにして無電解ニッケルめっきを形成させ、その析出性を以下の評価基準で評価したものである。その評価もあわせて表１に示した。
Example 1
Etching and plating of resin surface (1):
Processing was performed in the order of step (a) and step (b) using a specimen of ABS resin of 50 × 100 × 3 mm (3001M: manufactured by UMGABS Co., Ltd.) as a sample. The composition and conditions of the aqueous solution used for the treatment are shown in Table 1. In addition, plating precipitation property forms electroless nickel plating as follows, and evaluates the precipitation property on the following evaluation criteria. The evaluation is also shown in Table 1.
＜無電解ニッケルめっきの形成＞
上記実施例１の各エッチング液で処理した試料を３５℃の中和・還元処理溶液ＤＳ−３５０（株式会社ＪＣＵ社製）に１分間浸漬し、表面を中和・還元した。
次に、中和・還元された試料を、２０ｍｌ／ＬのＣＴ−５８０（株式会社ＪＣＵ社製）および２.５ｍｏｌ／Ｌの塩酸を含有する３５℃のパラジウム／すず混合コロイド触媒溶液に４分間浸漬し、ＡＢＳ樹脂上に触媒を付与した。
最後に、触媒が付与された試料を１.２ｍｏｌ／Ｌの塩酸からなる３５℃の活性化処理液に４分間浸漬し、触媒を活性化させ、次いで、ｐＨ８.８、３５℃の無電解ニッケルめっき液ＥＮＩＬＥＸ ＮＩ−５（株式会社ＪＣＵ社製）に１０分間浸漬し、ＡＢＳ樹脂上に膜厚が０.５μｍとなるように無電解ニッケルめっきを施した。
<Formation of electroless nickel plating>
The sample treated with each etching solution of Example 1 was immersed in a neutralization / reduction treatment solution DS-350 (manufactured by JCU Corporation) at 35 ° C. for 1 minute to neutralize and reduce the surface.
Next, the neutralized / reduced sample is placed in a palladium / tin mixed colloid catalyst solution at 35 ° C. containing 20 ml / L CT-580 (manufactured by JCU Corporation) and 2.5 mol / L hydrochloric acid for 4 minutes. The catalyst was applied on the ABS resin by dipping.
Finally, the sample provided with the catalyst is immersed in an activation treatment liquid at 35 ° C. consisting of 1.2 mol / L hydrochloric acid for 4 minutes to activate the catalyst, and then electroless nickel at pH 8.8 and 35 ° C. It was immersed in a plating solution ENILEX NI-5 (manufactured by JCU Corporation) for 10 minutes, and electroless nickel plating was performed on the ABS resin so that the film thickness became 0.5 μm.
＜めっき析出性評価基準＞
（評価） （内容）
○ ：全面に皮膜が析出
× ：無電解めっき中に皮膜が剥がれた
×× ：エッチング液が分解し、皮膜が析出しなかった
<Plating deposition evaluation criteria>
(Evaluation) (Content)
○: A film was deposited on the entire surface. ×: The film was peeled off during electroless plating. XX: The etching solution was decomposed and the film was not deposited.
クロム酸と硫酸を含有する溶液でエッチングをした場合、建浴直後も翌日もよくエッチングができめっきの析出性も良好であった。
一方、過マンガン酸を含有する溶液でエッチングした後、硫酸で過マンガン酸を活性化させることにより、建浴直後は勿論、翌日もよくエッチングができめっきの析出性も良好であった。
なお、過マンガン酸および／または硫酸を含有する溶液でエッチングした場合、エッチングができないか、できたとしても建浴直後だけであった。
When etching was performed with a solution containing chromic acid and sulfuric acid, the etching was good both immediately after the bathing and the next day, and the deposition of the plating was also good.
On the other hand, after etching with a solution containing permanganic acid, permanganic acid was activated with sulfuric acid, so that etching could be performed well not only immediately after the building bath but also on the next day, and the deposition of the plating was also good.
In addition, when etching was performed with a solution containing permanganic acid and / or sulfuric acid, etching was not possible, or even if it was possible, it was only immediately after the building bath.
実 施 例 ２
樹脂表面のエッチングおよびめっき（２）：
試料として５０×１００×３ｍｍのＡＢＳ樹脂の試験片（３００１Ｍ：ＵＭＧＡＢＳ株式会社製）を用いて、工程（ａ）および工程（ｂ）の順で処理を行った。処理に用いた水溶液の組成および条件を表２に示した。なお、めっき析出性は、実施例１と同様にして評価した。その評価もあわせて表２に示した。
Example 2
Etching and plating of resin surface (2):
Processing was performed in the order of step (a) and step (b) using a specimen of ABS resin of 50 × 100 × 3 mm (3001M: manufactured by UMGABS Co., Ltd.) as a sample. The composition and conditions of the aqueous solution used for the treatment are shown in Table 2. The plating precipitation was evaluated in the same manner as in Example 1. The evaluation is also shown in Table 2.
工程（ｂ）において硝酸、塩酸、リン酸、メタンスルホン酸、過酸化水素、過硫酸ナトリウム、過ヨウ素酸ナトリウムを用いた場合でもエッチングができめっきの析出性も良好であった。 In the step (b), even when nitric acid, hydrochloric acid, phosphoric acid, methanesulfonic acid, hydrogen peroxide, sodium persulfate, or sodium periodate was used, etching was possible and the plating deposition was good.
実 施 例 ３
ピール強度の測定：
試料として５０×１００×３ｍｍのＡＢＳ樹脂の試験片（３００１Ｍ：ＵＭＧＡＢＳ株式会社製）を用いて、実施例１の比較方法１、実施方法１、１０および１２で処理した後、以下の方法で硫酸銅めっきを形成し、以下の方法でピール強度を測定した。その結果を表３に示した。
Example 3
Peel strength measurement:
Using a test piece of ABS resin of 50 × 100 × 3 mm (3001M: manufactured by UMGABS Co., Ltd.) as a sample, the sample was treated by Comparative Method 1, Example 1, 10 and 12 of Example 1, and then sulfuric acid by the following method. Copper plating was formed and peel strength was measured by the following method. The results are shown in Table 3.
＜硫酸銅めっきの形成＞
無電解ニッケルめっきを施した後、１５０ｇ／ＬのＶ−３４５（株式会社ＪＣＵ社製）を含有する酸活性溶液に室温で１分間浸漬し、次いで０．７５ｍｏｌ／Ｌの硫酸ニッケル、０．４ｍｏｌ／Ｌの塩化ニッケルおよび０．５５ｍｏｌ／Ｌのホウ酸を含む４５℃のワット浴に２Ｖ／ｄｍ２で３分間浸漬した。
次に、これを１０ｍｌ／ＬのＰＤＣ（株式会社ＪＣＵ社製）および０．５ｍｏｌ／Ｌの硫酸を含有する室温の銅置換溶液に１分間浸漬し、銅置換をした。
最後に、これを０．９ｍｏｌ／Ｌの硫酸銅、０．３ｍｏｌ／Ｌの硫酸および０．００１７ｍｏｌ／Ｌの塩素を含有する２５℃の硫酸銅めっき液ＥＰ−３０（株式会社ＪＣＵ社製）中で、３Ａ／ｄｍ２で４０分間、膜厚が２０μｍとなるように硫酸銅めっきを施した。その後、これを７０℃で１時間アニールをした。
<Formation of copper sulfate plating>
After electroless nickel plating, it was immersed in an acid active solution containing 150 g / L of V-345 (manufactured by JCU Corporation) for 1 minute at room temperature, then 0.75 mol / L nickel sulfate, 0.4 mol It was immersed for 3 minutes at 2 V / dm 2 in a 45 ° C. watt bath containing / L nickel chloride and 0.55 mol / L boric acid.
Next, this was immersed in a room temperature copper replacement solution containing 10 ml / L PDC (manufactured by JCU Corporation) and 0.5 mol / L sulfuric acid for 1 minute to perform copper replacement.
Finally, this is in a copper sulfate plating solution EP-30 (manufactured by JCU Corporation) at 25 ° C. containing 0.9 mol / L copper sulfate, 0.3 mol / L sulfuric acid and 0.0017 mol / L chlorine. Then, copper sulfate plating was performed at 3 A / dm 2 for 40 minutes so that the film thickness was 20 μm. Thereafter, this was annealed at 70 ° C. for 1 hour.
＜ピール強度測定＞
上記硫酸銅めっきまで施した試料の密着強度を、ＪＩＳ Ｈ８６３０付属書６に従い、引っ張り強度試験機ＡＧＳ−Ｈ５００Ｎ（株式会社島津製作所製）を用いて測定した。
<Peel strength measurement>
The adhesion strength of the sample subjected to the copper sulfate plating was measured using a tensile strength tester AGS-H500N (manufactured by Shimadzu Corporation) in accordance with JIS H8630 Appendix 6.
過マンガン酸を含有する溶液でエッチングした後、硫酸で過マンガン酸を活性化させた後のめっき皮膜のピール強度は、従来のクロム酸エッチング後のめっき皮膜のピール強度と同程度であった。 After etching with a solution containing permanganic acid, the peel strength of the plating film after activating the permanganic acid with sulfuric acid was comparable to the peel strength of the plating film after conventional chromic acid etching.
本発明方法により、樹脂表面をエッチングすることができるため、従来公知の樹脂へのめっき方法に利用することができる。
以 上
Since the surface of the resin can be etched by the method of the present invention, it can be used in a conventionally known plating method for a resin.
that's all
Claims (6)
（ａ）酸化剤を含有する溶液で樹脂を処理し、樹脂表面に酸化剤を吸着させる工程
（ｂ）工程（ａ）で樹脂表面に吸着した酸化剤を活性化させる工程
を含むことを特徴とする樹脂表面のエッチング方法。 The following steps (a) and (b)
(A) treating the resin with a solution containing an oxidant and adsorbing the oxidant on the resin surface; (b) activating the oxidant adsorbed on the resin surface in step (a) Etching method for resin surface.
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| JP2015237135A JP2017101304A (en) | 2015-12-04 | 2015-12-04 | Etching method of resin surface, and plating method on resin utilizing the same |
| PCT/JP2016/085497 WO2017094754A1 (en) | 2015-12-04 | 2016-11-30 | Method for etching resin surface and method for plating resin utilizing said etching method |
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| JP2019203203A (en) * | 2017-09-01 | 2019-11-28 | 栗田工業株式会社 | Plating pretreatment method for abs resin surface, plating treatment method for abs resin surface, and abs resin-plated product |
| WO2021220527A1 (en) | 2020-04-28 | 2021-11-04 | 栗田工業株式会社 | Etching method for resin molded article and etching process system for resin molded article |
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| JP6551563B1 (en) * | 2018-03-06 | 2019-07-31 | 栗田工業株式会社 | Pre-plating method for ABS resin surface, plating method for ABS resin surface, and ABS resin plating product |
| JP6566064B1 (en) * | 2018-03-06 | 2019-08-28 | 栗田工業株式会社 | Method for treating polyphenylene sulfide resin surface |
| JP6540843B1 (en) * | 2018-03-06 | 2019-07-10 | 栗田工業株式会社 | Hydrophilization treatment method of polypropylene resin |
| CN113101940A (en) * | 2021-04-25 | 2021-07-13 | 山西中科国蕴环保科技有限公司 | Catalyst for activating persulfate and method for treating sewage by using catalyst |
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| JP2003055774A (en) * | 2001-08-13 | 2003-02-26 | Chuo Kaseihin Kk | Method for reforming surface of polyethylene terephthalate formed body, surface-reformed polyethylene terephthalate formed body and printed circuit board |
| JP2007100174A (en) * | 2005-10-05 | 2007-04-19 | Okuno Chem Ind Co Ltd | Pretreatment method for plating to styrene-based resin molded body |
| WO2008143190A1 (en) * | 2007-05-22 | 2008-11-27 | Okuno Chemical Industries Co., Ltd. | Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent |
| JP2009022948A (en) * | 2007-06-20 | 2009-02-05 | Okuno Chem Ind Co Ltd | Method for electrolyzing etching liquid |
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| JP2003055774A (en) * | 2001-08-13 | 2003-02-26 | Chuo Kaseihin Kk | Method for reforming surface of polyethylene terephthalate formed body, surface-reformed polyethylene terephthalate formed body and printed circuit board |
| JP2007100174A (en) * | 2005-10-05 | 2007-04-19 | Okuno Chem Ind Co Ltd | Pretreatment method for plating to styrene-based resin molded body |
| WO2008143190A1 (en) * | 2007-05-22 | 2008-11-27 | Okuno Chemical Industries Co., Ltd. | Pretreatment process for electroless plating of resin molded body, method for plating resin molded body, and pretreatment agent |
| JP2009022948A (en) * | 2007-06-20 | 2009-02-05 | Okuno Chem Ind Co Ltd | Method for electrolyzing etching liquid |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019203203A (en) * | 2017-09-01 | 2019-11-28 | 栗田工業株式会社 | Plating pretreatment method for abs resin surface, plating treatment method for abs resin surface, and abs resin-plated product |
| WO2021220527A1 (en) | 2020-04-28 | 2021-11-04 | 栗田工業株式会社 | Etching method for resin molded article and etching process system for resin molded article |
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