JP2017098460A - Electrode forming method and electrode forming apparatus of back electrode type solar cell - Google Patents
Electrode forming method and electrode forming apparatus of back electrode type solar cell Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000007772 electrode material Substances 0.000 claims abstract description 137
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- 238000007599 discharging Methods 0.000 claims abstract description 27
- 230000015572 biosynthetic process Effects 0.000 claims description 11
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000002161 passivation Methods 0.000 description 13
- 238000007747 plating Methods 0.000 description 7
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- 238000010586 diagram Methods 0.000 description 4
- 239000007774 positive electrode material Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
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- 239000007773 negative electrode material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 230000006798 recombination Effects 0.000 description 2
- 238000005215 recombination Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
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- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
本発明は、裏面電極型太陽電池の電極形成方法および電極形成装置に関する。 The present invention relates to an electrode forming method and an electrode forming apparatus for a back electrode type solar cell.
結晶シリコン太陽電池の光電変換効率を向上させる手法として、近年では太陽電池基板の受光面の電極を廃し、正極と負極のすべての電極を受光面とは反対側の裏面（非受光面）に配置することで電極の影による光学的損失を無くした、裏面電極型（バックコンタクト型）太陽電池が広く検討されるようになってきた。 As a technique to improve the photoelectric conversion efficiency of crystalline silicon solar cells, in recent years, the electrodes on the light receiving surface of the solar cell substrate have been eliminated, and all the positive and negative electrodes are placed on the back surface (non-light receiving surface) opposite to the light receiving surface. As a result, a back electrode type (back contact type) solar cell in which optical loss due to the shadow of the electrode is eliminated has been widely studied.
図１１は裏面電極型太陽電池１００の基本構造を示す断面図である。図では基板１０１の上側を裏面、下側を受光面として示している。基板１０１の裏面には、ｐ型の導電性を付与する添加物が高濃度拡散されたｐ＋領域１０２とｎ型の導電性を付与する添加物が高濃度拡散されたｎ＋領域１０３とが図面奥に向かってストライプ状に交互に形成されている。図１１に示す例では、基板１０１の裏面に凹凸が形成され、凸部がｐ＋領域１０２、凹部がｎ＋領域１０３とされている。ｐ＋領域１０２には正電極１０４が、ｎ＋領域１０３には負電極１０５が、それぞれ形成されている。更に、光励起されたキャリアの再結合による損失を低減するために、基板１０１の受光面及び裏面の各電極が形成されていない部分は、パッシベーション膜１０６及びパッシベーション膜１０７でそれぞれ覆われている。なお、図には示されていないが、基板１０１の受光面にはパッシベーション膜１０６の形成に先立ち、数ミクロンの凹凸をもった光閉じ込めのためのテクスチャが形成されるのが一般的である。 FIG. 11 is a cross-sectional view showing the basic structure of the back electrode type solar cell 100. In the figure, the upper side of the substrate 101 is shown as the back surface, and the lower side is shown as the light receiving surface. On the back surface of the substrate 101, there are a p + region 102 in which an additive imparting p-type conductivity is diffused at a high concentration and an n + region 103 in which an additive imparting n-type conductivity is diffused at a high concentration. They are alternately formed in stripes toward the back of the drawing. In the example shown in FIG. 11, unevenness is formed on the back surface of the substrate 101, the convex portion is a p + region 102, and the concave portion is an n + region 103. A positive electrode 104 is formed in the p + region 102, and a negative electrode 105 is formed in the n + region 103. Further, in order to reduce loss due to recombination of photoexcited carriers, the portions of the substrate 101 where the electrodes on the light receiving surface and the back surface are not formed are covered with a passivation film 106 and a passivation film 107, respectively. Although not shown in the drawing, a texture for confining light having irregularities of several microns is generally formed on the light receiving surface of the substrate 101 prior to the formation of the passivation film 106.
裏面電極型太陽電池の電極は、光励起した電荷の収集効率を上げるために、互いに導電性が異なる添加物高濃度拡散領域を交互に微細に形成する必要があり、そのため、各領域に形成される電極も必然的に微細に形成する必要がある。しかし、電極の微細化は電気抵抗損を増大させるため、電極の形成に際しては、メッキを用いた厚膜電極形成の手法などが採用されてきた。 In order to increase the collection efficiency of the photoexcited charge, the electrodes of the back electrode type solar cell need to be formed with minutely high concentration diffusion regions of additives having different conductivity from each other. The electrode must be formed finely. However, since miniaturization of the electrode increases electrical resistance loss, a method of forming a thick film electrode using plating has been adopted in forming the electrode.
例えば、特許文献１には、高濃度拡散領域を覆う熱酸化膜をエッチングペーストで開口し、その上に３層からなるシード金属層をスパッタ形成し、更にその上にメッキレジストをパターニングした上で、シード層が露出している各部分に厚膜電極をメッキを用いて形成し、最後に電極間のメッキレジストとシード金属層を化学エッチングで除去することにより電極を形成する方法が開示されている。 For example, in Patent Document 1, a thermal oxide film covering a high concentration diffusion region is opened with an etching paste, a seed metal layer composed of three layers is formed thereon by sputtering, and a plating resist is patterned thereon. A method is disclosed in which a thick film electrode is formed by plating on each part where the seed layer is exposed, and finally the plating resist between the electrodes and the seed metal layer are removed by chemical etching to form an electrode. Yes.
また、特許文献２には、メッキを使用しない簡略化された方法として、パッシベーション膜にエッチングペーストを使ってコンタクトホールを設け、コンタクトホールに導電性ペーストを印刷して焼成することにより電極を形成する方法が開示されている。 Further, in Patent Document 2, as a simplified method that does not use plating, an electrode is formed by providing a contact hole using an etching paste in a passivation film, printing the conductive paste in the contact hole, and baking it. A method is disclosed.
エッチングペーストやスパッタ、更にメッキレジストを多用する形成方法は、工程が複雑になりコストが高くなるという問題がある。 The forming method using a lot of etching paste, sputtering, and plating resist has a problem that the process becomes complicated and the cost becomes high.
また、導電性ペーストをスクリーン印刷塗布する形成方法についても、仕事関数の違いなどに起因してｐ＋領域とｎ＋領域それぞれに適したペーストを適用する必要から、各ペーストについて印刷と乾燥の工程が必要になるという問題がある。また、電極材を凹部であるコンタクトホールに印刷塗布した場合、印刷版と塗布面との間に空隙が生じて塗膜が広がるという問題もある。更に、印刷製版が印刷時に伸縮するという本質的な性質に起因し、正極と負極の精密なパターン形成が困難であるという問題もある。 Also, with respect to the forming method of applying the conductive paste by screen printing, it is necessary to apply a paste suitable for each of the p + region and the n + region due to a difference in work function and the like. There is a problem that is necessary. In addition, when the electrode material is printed and applied to the contact hole which is a concave portion, there is a problem that a gap is generated between the printing plate and the coated surface and the coating film spreads. Further, there is a problem that it is difficult to form a precise pattern of the positive electrode and the negative electrode due to the essential property that the printing plate-making process expands and contracts during printing.
本発明の目的は、裏面電極型太陽電池の製造工程において、電極を簡易な工程で低コストに形成するための、裏面電極型太陽電池の電極形成方法および電極形成装置を提供することにある。 The objective of this invention is providing the electrode formation method and electrode formation apparatus of a back electrode type solar cell for forming an electrode at a low cost by a simple process in the manufacturing process of a back electrode type solar cell.
（１）本発明の電極形成方法は、太陽電池基板の受光面とは反対側の裏面にすべての電極が形成される裏面電極型太陽電池の電極形成方法であって、第１極性の電極材を吐出する複数の第１の吐出口と第２極性の電極材を吐出する複数の第２の吐出口とが太陽電池基板の裏面に対向して或る方向（以下「Ｘ方向」という。）に交互に並ぶように設けられた吐出手段の吐出口から電極材を吐出し垂下することにより太陽電池基板の裏面に電極材を塗布して第１極性の電極と第２極性の電極を形成することを特徴とする。これにより、従来の方法と比べ、工程をシンプルにすることができ、製造コストを抑えることができる。 (1) The electrode forming method of the present invention is an electrode forming method for a back electrode type solar cell in which all electrodes are formed on the back surface opposite to the light receiving surface of the solar cell substrate, and the electrode material having the first polarity. And a plurality of second discharge ports for discharging the electrode material of the second polarity are opposed to the back surface of the solar cell substrate in a certain direction (hereinafter referred to as “X direction”). The electrode material is applied to the back surface of the solar cell substrate to form the first polarity electrode and the second polarity electrode by discharging and dropping the electrode material from the discharge ports of the discharge means provided so as to be alternately arranged. It is characterized by that. Thereby, compared with the conventional method, a process can be simplified and manufacturing cost can be held down.
（２）吐出手段の当該太陽電池基板との相対位置を、Ｘ方向に対して略直角かつ当該太陽電池基板の裏面に略平行な方向（以下「Ｙ方向」という。）に直線的に変化させつつ、吐出口から電極材を吐出し当該太陽電池基板の裏面に垂下してもよい。これにより、電極材を太陽電池基板の裏面にストライプ状に、かつ広範囲に塗布することができる。 (2) The relative position of the discharge means with respect to the solar cell substrate is linearly changed in a direction substantially perpendicular to the X direction and substantially parallel to the back surface of the solar cell substrate (hereinafter referred to as “Y direction”). However, the electrode material may be discharged from the discharge port and hung on the back surface of the solar cell substrate. Thereby, an electrode material can be apply | coated to the back surface of a solar cell board | substrate in stripe form, and in a wide range.
（３）吐出手段として、複数の前記第１の吐出口が前記裏面に対向してＸ方向に一列に設けられた第１吐出手段と、複数の前記第２の吐出口が前記裏面に対向してＸ方向に一列に設けられた第２吐出手段と、を前記第１の吐出口と前記第２の吐出口とがＸ方向に交互に並ぶようにずらしてＹ方向に並べて配置したものを使用してもよい。これによっても、電極材を太陽電池基板の裏面にストライプ状に、かつ広範囲に同時に塗布することができる。 (3) As discharge means, a plurality of the first discharge ports are provided in a row in the X direction so as to face the back surface, and a plurality of the second discharge ports are opposed to the back surface. Second discharge means provided in a row in the X direction, and the first discharge ports and the second discharge ports that are shifted in the X direction and arranged in the Y direction are used. May be. This also makes it possible to apply the electrode material to the back surface of the solar cell substrate in a striped manner and simultaneously in a wide range.
（４）吐出手段の複数の吐出口からの電極材の吐出の有無を、吐出口ごとに制御するようにしてもよい。これにより、電極材を塗布する太陽電池基板の裏面の外形に応じて電極材の吐出の開始・終了タイミングを設定できるため、いかなる外形の基板に対しても万遍なく、かつ無駄なく電極材を塗布することができる。 (4) The presence or absence of discharge of the electrode material from the plurality of discharge ports of the discharge unit may be controlled for each discharge port. As a result, the start / end timing of discharge of the electrode material can be set in accordance with the outer shape of the back surface of the solar cell substrate to which the electrode material is applied, so that the electrode material can be applied to any outer shape substrate without waste. Can be applied.
（５）吐出手段を太陽電池基板に対してＹ方向に相対的に片道移動しつつ電極材を吐出した後、吐出手段をＸ方向に相対的に移動した上で、吐出手段を−Ｙ方向に相対的に片道移動しつつ電極材を吐出してもよい。これにより、電極材を太陽電池基板の裏面の一部に塗布した後に未塗布部分にも塗布することができ、このような動作を繰り返すことで、広い基板にも万遍なく電極材を塗布することができる。 (5) After discharging the electrode material while moving the discharge means relative to the solar cell substrate in the Y direction, the discharge means is moved in the X direction, and then the discharge means is moved in the -Y direction. The electrode material may be discharged while moving relatively one way. As a result, the electrode material can be applied to the uncoated portion after being applied to a part of the back surface of the solar cell substrate, and the electrode material is uniformly applied to a wide substrate by repeating such an operation. be able to.
（６）電極材の塗布に際しては、所定の電極材を塗布すべき太陽電池基板の裏面の所定の領域に、所定の電極材が垂下されるように、太陽電池基板と吐出手段との位置関係を調整した上で電極材の塗布を行うとよい。これにより、太陽電池基板の裏面の所定の領域に正確に所定の電極を形成することができる。 (6) When applying the electrode material, the positional relationship between the solar cell substrate and the discharge means so that the predetermined electrode material hangs down in a predetermined region on the back surface of the solar cell substrate to which the predetermined electrode material is to be applied. The electrode material may be applied after adjusting the above. Thereby, a predetermined electrode can be accurately formed in a predetermined region on the back surface of the solar cell substrate.
（７）本発明の電極形成装置は、太陽電池基板の受光面とは反対側の裏面にすべての電極が形成される裏面電極型太陽電池の電極形成装置であって、第１極性の電極材を吐出する複数の第１の吐出口と第２極性の電極材を吐出する複数の第２の吐出口とが太陽電池基板の裏面に対向してＸ方向に交互に並ぶように設けられた吐出手段を備え、当該吐出手段の吐出口から電極材を吐出し垂下することにより太陽電池基板の裏面に電極材を塗布して第１極性の電極と第２極性の電極を形成することを特徴とする。これにより、従来の方法と比べ、工程をシンプルにすることができ、製造コストを抑えることができる。 (7) The electrode forming apparatus of the present invention is an electrode forming apparatus for a back electrode type solar cell in which all electrodes are formed on the back surface opposite to the light receiving surface of the solar cell substrate, and the first polarity electrode material A plurality of first discharge ports for discharging the liquid and a plurality of second discharge ports for discharging the electrode material of the second polarity are provided so as to be alternately arranged in the X direction facing the back surface of the solar cell substrate. And a first polarity electrode and a second polarity electrode are formed by applying the electrode material to the back surface of the solar cell substrate by discharging and dropping the electrode material from the discharge port of the discharge means. To do. Thereby, compared with the conventional method, a process can be simplified and manufacturing cost can be held down.
（８）本発明の電極形成装置は、吐出手段の太陽電池基板との相対位置をＸ方向に対して略直角かつ太陽電池基板の裏面に略平行な方向に変化させる移動手段と、吐出手段と移動手段を制御する制御手段と、を更に備え、制御手段が太陽電池基板と吐出手段との相対位置をＹ方向に直線的に変化させつつ電極材を吐出させるように構成してもよい。これにより、電極材を太陽電池基板の裏面にストライプ状に、かつ広範囲に塗布することができる。 (8) The electrode forming apparatus of the present invention includes a moving unit that changes a relative position of the discharging unit with the solar cell substrate in a direction substantially perpendicular to the X direction and substantially parallel to the back surface of the solar cell substrate, and a discharging unit. Control means for controlling the moving means, and the control means may discharge the electrode material while linearly changing the relative position between the solar cell substrate and the discharge means in the Y direction. Thereby, an electrode material can be apply | coated to the back surface of a solar cell board | substrate in stripe form, and in a wide range.
（９）吐出手段を、複数の第１の吐出口が太陽電池基板の裏面に対向してＸ方向に一列に設けられた第１吐出手段と、複数の第２の吐出口が太陽電池基板の裏面に対向してＸ方向に一列に設けられた第２吐出手段と、を第１の吐出口と第２の吐出口とがＸ方向に交互に並ぶようにずらしてＹ方向に並べて配置したものとしてもよい。これによっても、電極材を太陽電池基板の裏面にストライプ状に、かつ広範囲に同時に塗布することができる。 (9) The discharge means includes a first discharge means in which a plurality of first discharge ports are arranged in a row in the X direction so as to face the back surface of the solar cell substrate, and a plurality of second discharge ports are formed on the solar cell substrate. The second discharge means provided in a row in the X direction facing the back surface and arranged so that the first discharge ports and the second discharge ports are alternately arranged in the X direction and arranged in the Y direction. It is good. This also makes it possible to apply the electrode material to the back surface of the solar cell substrate in a striped manner and simultaneously in a wide range.
（１０）制御手段は、吐出手段の複数の吐出口からの電極材の吐出の有無を、吐出口ごとに制御するように構成してもよい。これにより、電極材を塗布する太陽電池基板の裏面の外形に応じて電極材の吐出の開始・終了タイミングを設定できるため、いかなる外形の基板に対しても万遍なく、かつ無駄なく電極材を塗布することができる。 (10) The control unit may be configured to control, for each discharge port, whether or not the electrode material is discharged from a plurality of discharge ports of the discharge unit. As a result, the start / end timing of discharge of the electrode material can be set in accordance with the outer shape of the back surface of the solar cell substrate to which the electrode material is applied, so that the electrode material can be applied to any outer shape substrate without waste. Can be applied.
（１１）制御手段は、吐出手段を太陽電池基板に対してＹ方向に相対的に片道移動させつつ電極材を吐出させた後、吐出手段をＸ方向に相対的に移動させた上で、吐出手段を−Ｙ方向に相対的に片道移動させつつ電極材を吐出させるように制御してもよい。これにより、電極材を太陽電池基板の裏面の一部に塗布した後に未塗布部分にも塗布することができ、このような動作を繰り返すことで、広い基板にも万遍なく電極材を塗布することができる。 (11) The control means discharges the electrode material while moving the discharge means relative to the solar cell substrate in the Y direction, and then moves the discharge means relative to the X direction. Control may be performed so that the electrode material is discharged while the means is relatively moved in one direction in the -Y direction. As a result, the electrode material can be applied to the uncoated portion after being applied to a part of the back surface of the solar cell substrate, and the electrode material is uniformly applied to a wide substrate by repeating such an operation. be able to.
（１２）所定の電極材を塗布すべき太陽電池基板の裏面の所定の領域に、所定の電極材が垂下されるように、太陽電池基板と吐出手段との位置関係を調整するアライメント機構を更に備えてもよい。これにより、太陽電池基板の裏面の所定の領域に正確に所定の電極を形成することができる。 (12) An alignment mechanism that adjusts the positional relationship between the solar cell substrate and the discharge means so that the predetermined electrode material is suspended in a predetermined region on the back surface of the solar cell substrate to which the predetermined electrode material is to be applied. You may prepare. Thereby, a predetermined electrode can be accurately formed in a predetermined region on the back surface of the solar cell substrate.
以下、本発明の実施形態について図面に基づいて説明する。背景技術の説明に用いた図も含め、各図面において共通の構成要素については同じ符号を付し、必要な場合以外、説明の繰り返しは行わない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. Constituent elements common to the drawings including those used for the description of the background art are denoted by the same reference numerals, and the description will not be repeated unless necessary.
図１及び図２は、本発明の裏面電極型太陽電池の電極形成方法を説明する図である。図１及び図２で示される裏面電極型太陽電池の断面は、図面上、基板１０１の上側が裏面側（非受光面側）、下側が受光面側としている。基板１０１の裏面には、ｐ型の導電性を付与する添加物が高濃度拡散されたｐ＋領域１０２とｎ型の導電性を付与する添加物が高濃度拡散されたｎ＋領域１０３とが図面奥に向かってストライプ状に交互に形成されている。図１に示す例では、基板１０１の裏面に凹凸が形成され、凸部がｐ＋領域１０２、凹部がｎ＋領域１０３とされている。また、光励起されたキャリアの再結合による損失を低減するため、基板１０１の受光面及び裏面に、パッシベーション膜１０６及びパッシベーション膜１０７がそれぞれ形成されている。パッシベーション膜１０７は、図１に示すように予めｐ＋領域１０２の一部及びｎ＋領域１０３の一部が露出するように形成しても、図２に示すようにｐ＋領域１０２及びｎ＋領域１０３の全てが覆われるように形成してもよい。 FIG.1 and FIG.2 is a figure explaining the electrode formation method of the back surface electrode type solar cell of this invention. In the cross section of the back electrode type solar cell shown in FIGS. 1 and 2, the upper side of the substrate 101 is the back side (non-light receiving surface side) and the lower side is the light receiving surface side in the drawings. On the back surface of the substrate 101, there are a p + region 102 in which an additive imparting p-type conductivity is diffused at a high concentration and an n + region 103 in which an additive imparting n-type conductivity is diffused at a high concentration. They are alternately formed in stripes toward the back of the drawing. In the example shown in FIG. 1, irregularities are formed on the back surface of the substrate 101, and the convex portions are p + regions 102 and the concave portions are n + regions 103. In order to reduce loss due to recombination of photoexcited carriers, a passivation film 106 and a passivation film 107 are formed on the light receiving surface and the back surface of the substrate 101, respectively. Even if the passivation film 107 is formed in advance so that a part of the p + region 102 and a part of the n + region 103 are exposed as shown in FIG. 1, the p + region 102 and the n + as shown in FIG. You may form so that the whole area | region 103 may be covered.
正の極性の電極材２０３ａを吐出する複数の吐出口２０２ａ及び負の極性の電極材２０３ｂを吐出する複数の吐出口２０２ｂが基板１０１の裏面に交互に形成されたｐ＋領域１０２及びｎ＋領域１０３にそれぞれ対向して交互に設けられた吐出手段２０１の、当該吐出口２０２ａ及び吐出口２０２ｂから電極材２０３ａ及び電極材２０３ｂをそれぞれ吐出して垂下し、それぞれｐ＋領域１０２及びｎ＋領域１０３に塗布する。電極材としては、例えば一般的な焼結性の導電性ペーストを適用することができる。図１に示すようにｐ＋領域１０２及びｎ＋領域１０３の一部が露出するようにパッシベーション膜１０７を形成した場合は、電極材２０３ａ及び電極材２０３ｂをそれぞれｐ＋領域１０２及びｎ＋領域１０３に直接塗布して電極材２０３ａとｐ＋領域１０２ａとの電気的接触及び電極材２０３ｂとｎ＋領域１０３との電気的接触をそれぞれ実現することができる。一方、図２に示すようにｐ＋領域１０２及びｎ＋領域１０３が全て覆われるようにパッシベーション膜１０７を形成した場合は、例えば、電極材２０３ａ及び電極材２０３ｂに低軟化点のガラスフリットなどを添加しておき、太陽電池の製造で一般的に用いられるファイアスルー技術を適用して電極材２０３ａ及び電極材２０３ｂをそれぞれｐ＋領域１０２及びｎ＋領域１０３に接触させる。具体的には例えば、パッシベーション膜１０７上に塗布された電極材２０３ａ及び電極材２０３ｂに対し、８００℃程度の短時間熱処理を行い、電極材２０３ａ及び電極材２０３ｂの添加物でパッシベーション膜１０７を浸食させて電極材２０３ａとｐ＋領域１０２ａとの電気的接触及び電極材２０３ｂとｎ＋領域１０３との電気的接触をそれぞれ実現する。なお、この場合のパッシベーション膜１０７には主に酸化シリコン、窒化シリコン、炭化シリコン、酸化アルミニウム、酸化チタンなどの誘電体膜の使用が好適である。 A p + region 102 and an n + region in which a plurality of discharge ports 202 a that discharge a positive polarity electrode material 203 a and a plurality of discharge ports 202 b that discharge a negative polarity electrode material 203 b are alternately formed on the back surface of the substrate 101. In the discharge means 201 provided alternately opposite to each other 103, the electrode material 203a and the electrode material 203b are respectively discharged from the discharge port 202a and the discharge port 202b and dropped, and the p + region 102 and the n + region 103 are respectively dropped. Apply to. As the electrode material, for example, a general sinterable conductive paste can be applied. In the case where the passivation film 107 is formed so that a part of the p + region 102 and the n + region 103 is exposed as shown in FIG. 1, the electrode material 203a and the electrode material 203b are respectively made of the p + region 102 and the n + region 103. The electrode material 203a and the p + region 102a can be electrically applied to each other and the electrode material 203b and the n + region 103 can be electrically contacted with each other. On the other hand, when the passivation film 107 is formed so as to cover the p + region 102 and the n + region 103 as shown in FIG. 2, for example, a glass frit having a low softening point is applied to the electrode material 203a and the electrode material 203b. In addition, the electrode material 203a and the electrode material 203b are brought into contact with the p + region 102 and the n + region 103, respectively, by applying a fire-through technique generally used in the manufacture of solar cells. Specifically, for example, the electrode material 203a and the electrode material 203b applied on the passivation film 107 are subjected to short-time heat treatment at about 800 ° C., and the passivation film 107 is eroded by the additive of the electrode material 203a and the electrode material 203b. Thus, electrical contact between the electrode material 203a and the p + region 102a and electrical contact between the electrode material 203b and the n + region 103 are realized. In this case, it is preferable to use a dielectric film such as silicon oxide, silicon nitride, silicon carbide, aluminum oxide, or titanium oxide as the passivation film 107 in this case.
このように、本発明の裏面電極型太陽電池の電極形成方法及び電極形成装置は、基板の裏面に電極材を垂下して塗布し硬化させるだけで容易に電極を形成できるため、従来の物理蒸着・メッキを用いた形成方法やスクリーン印刷による形成方法と比べ、工程をシンプルにすることができ、また、電極材として安価な導電性ペーストを使用できるため、製造コストも抑えることができる。また、電極の線幅についても、スクリーン印刷によって形成した場合と同程度に形成することができ、精密なパターン形成を容易に行うことができる。 As described above, the electrode forming method and the electrode forming apparatus of the back electrode type solar cell according to the present invention can easily form an electrode simply by dripping and applying an electrode material on the back surface of the substrate, and thus the conventional physical vapor deposition. -Compared with the formation method using plating and the formation method by screen printing, the process can be simplified, and since an inexpensive conductive paste can be used as the electrode material, the manufacturing cost can be reduced. Further, the line width of the electrode can be formed to the same extent as that formed by screen printing, and a precise pattern can be easily formed.
また、基板１０１の裏面への電極材２０３ａ及び電極材２０３ｂの塗布に際しては、吐出手段２０１の基板１０１との相対位置を、吐出口２０２ａ及び吐出口２０２ｂが並んでいる方向（Ｘ方向）に対して略直角かつ基板１０１の裏面に略平行な方向（Ｙ方向）に直線的に変化させつつ、吐出手段２０１の吐出口２０２ａ及び吐出口２０２ｂから電極材２０３ａ及び電極材２０３ｂをそれぞれ吐出し基板１０１の裏面に垂下してもよい。図３は吐出手段２０１の基板１０１との相対位置を変化させつつ電極材２０３ａ及び電極材２０３ｂを基板１０１の裏面に垂下している様子を示したものである。 Further, when the electrode material 203a and the electrode material 203b are applied to the back surface of the substrate 101, the relative position of the discharge means 201 with respect to the substrate 101 is set with respect to the direction in which the discharge ports 202a and 202b are arranged (X direction). The electrode material 203a and the electrode material 203b are respectively discharged from the discharge port 202a and the discharge port 202b of the discharge means 201 while changing linearly in a direction (Y direction) substantially perpendicular to the back surface of the substrate 101. You may hang down on the back side. FIG. 3 shows a state in which the electrode material 203 a and the electrode material 203 b are suspended from the back surface of the substrate 101 while changing the relative position of the ejection means 201 to the substrate 101.
例えば、吐出手段２０１を固定しておき、基板１０１を−Ｙ方向に直線的に移動させつつ、吐出手段２０１の吐出口２０２ａ及び吐出口２０２ｂから電極材２０３ａ及び電極材２０３ｂをそれぞれ垂下させる。これにより、電極材２０３ａ及び電極２０３ｂを基板１０１の裏面にストライプ状に塗布することができる。 For example, the ejection unit 201 is fixed, and the electrode material 203a and the electrode material 203b are suspended from the ejection port 202a and the ejection port 202b of the ejection unit 201 while moving the substrate 101 linearly in the −Y direction. Thereby, the electrode material 203a and the electrode 203b can be applied to the back surface of the substrate 101 in stripes.
図４に電極材をストライプ状に塗布するための電極形成装置の機能ブロック図を示す。移動手段３０１は、吐出手段２０１の基板１０１との相対位置を変化させる機構であり、吐出手段２０１を移動させる機構として構成してもよいし、基板１０１を移動させる機構として構成してもよいし、両方を移動させる機構として構成してもよい。ストライプ状に塗布するには、移動手段３０１による相対位置の変更態様と吐出手段２０１による電極材２０３の吐出のタイミングを制御する必要があるため、例えばコンピュータや専用の装置により構成された制御手段３０２を更に設け、これにより移動手段３０１による吐出手段２０１の相対的な移動態様と吐出手段２０１による吐出タイミングを制御するとよい。 FIG. 4 shows a functional block diagram of an electrode forming apparatus for applying the electrode material in stripes. The moving unit 301 is a mechanism that changes the relative position of the discharge unit 201 with respect to the substrate 101, and may be configured as a mechanism that moves the discharge unit 201, or may be configured as a mechanism that moves the substrate 101. The mechanism may be configured to move both. In order to apply in a striped manner, it is necessary to control the change of the relative position by the moving unit 301 and the discharge timing of the electrode material 203 by the discharge unit 201. Therefore, for example, the control unit 302 configured by a computer or a dedicated device. In this way, the relative movement mode of the ejection unit 201 by the movement unit 301 and the ejection timing by the ejection unit 201 may be controlled.
また、図５に示すように、第１極性の電極用の第１の電極材２０３ａを吐出する第１の吐出手段２０１ａの複数の吐出口２０２ａと、第１極性と異なる第２極性の電極用の第２の電極材２０３ｂを吐出する第２の吐出手段２０１ｂの複数の吐出口２０２ｂと、がＸ方向に交互に並ぶようにずらして、第１の吐出手段２０１ａと第２の吐出手段２０１ｂとをＹ方向に並べて配置して使用してもよい。 Further, as shown in FIG. 5, a plurality of discharge ports 202a of the first discharge means 201a for discharging the first electrode material 203a for the first polarity electrode, and for the second polarity electrode different from the first polarity The plurality of discharge ports 202b of the second discharge unit 201b that discharges the second electrode material 203b are shifted so as to be alternately arranged in the X direction, and the first discharge unit 201a and the second discharge unit 201b May be arranged and used in the Y direction.
このような構成によっても、第１の極性の電極材２０３ａと第２の極性の電極材２０３ｂとを基板１０１の裏面に交互にストライプ状に、かつ広範囲に同時に塗布することができる。 Also with such a configuration, the first polarity electrode material 203a and the second polarity electrode material 203b can be applied to the back surface of the substrate 101 alternately in stripes and simultaneously in a wide range.
また、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）の吐出口２０２ａ及び吐出口２０２ｂからの、電極材２０３ａ及び電極材２０３ｂの吐出のタイミングを吐出口ごとに制御してもよい。図６は吐出口ごとに電極材の吐出タイミングを制御する必要性を説明する図である。この説明では電極材の極性は問題にならないため、吐出手段、吐出口、電極材について、それぞれ吐出手段２０１、吐出口２０２、電極材２０３と極性を分けずに説明することとする。基板１０１の裏面の電極材２０３を塗布すべき領域のＹ方向の始点と終点が、図６(a)の網掛け部に示すように全ての吐出口２０２について一律である場合には、全ての吐出口２０２から同時に電極材２０３を吐出しつつ、吐出手段２０１の基板１０１との相対位置をＹ方向に移動させればよい。しかし、図６(b),(c)に示すような外形の基板のように、塗布すべき領域のＹ方向の始点と終点が吐出口２０２について一律でない場合には、吐出口ごとに吐出タイミングの制御が必要となる。例えば図６(b)に示す円形の基板の場合には、塗布開始当初は吐出手段２０１の中央周辺の吐出口２０２のみが基板１０１の裏面の塗布すべき領域と対向しているが、吐出手段２０１がＹ方向に移動するにつれて対向する吐出口２０２の数が吐出手段２０１の両端に向けて増えていき、やがて全ての吐出口２０２が基板１０１の裏面の塗布すべき領域と対向するが、更にＹ方向に移動していくと、今度は対向する吐出口２０２の数が吐出手段２０１の中央に向けて減っていく。そこで、複数の吐出口２０２からの電極材２０３の吐出のタイミングを吐出口ごとに制御する。基板１０１の外形に応じ、一部の吐出口２０２についてのみ制御を独立し、残りの吐出口２０２について一体的に制御するようにしてもよい。制御は、例えば制御手段３０２によって行う。 Further, the discharge timing of the electrode material 203a and the electrode material 203b from the discharge port 202a and the discharge port 202b of the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b) may be controlled for each discharge port. FIG. 6 is a diagram for explaining the necessity of controlling the discharge timing of the electrode material for each discharge port. In this description, since the polarity of the electrode material does not matter, the discharge unit, the discharge port, and the electrode material will be described without dividing the polarity from the discharge unit 201, the discharge port 202, and the electrode material 203, respectively. When the start point and the end point in the Y direction of the region to which the electrode material 203 on the back surface of the substrate 101 is to be applied are uniform for all the discharge ports 202 as shown by the shaded portion in FIG. The relative position of the discharge means 201 and the substrate 101 may be moved in the Y direction while simultaneously discharging the electrode material 203 from the discharge port 202. However, when the starting point and the ending point in the Y direction of the region to be applied are not uniform with respect to the discharge port 202 as in the substrate having the outer shape as shown in FIGS. 6B and 6C, the discharge timing for each discharge port. Control is required. For example, in the case of the circular substrate shown in FIG. 6B, only the discharge port 202 around the center of the discharge means 201 is opposed to the area to be applied on the back surface of the substrate 101 at the beginning of the application. As 201 moves in the Y direction, the number of discharge ports 202 facing each other increases toward both ends of the discharge unit 201, and eventually all the discharge ports 202 face the region to be coated on the back surface of the substrate 101. As it moves in the Y direction, the number of opposing discharge ports 202 decreases toward the center of the discharge means 201 this time. Therefore, the discharge timing of the electrode material 203 from the plurality of discharge ports 202 is controlled for each discharge port. Depending on the outer shape of the substrate 101, only some of the discharge ports 202 may be controlled independently, and the remaining discharge ports 202 may be controlled integrally. Control is performed by the control means 302, for example.
これにより、電極材２０３を塗布する基板１０１の裏面の外形に応じて電極材２０３の吐出の開始・終了タイミングを設定できるため、いかなる外形の基板に対しても万遍なく、かつ無駄なく電極材を塗布することができる。 Thereby, since the start / end timing of discharge of the electrode material 203 can be set according to the outer shape of the back surface of the substrate 101 to which the electrode material 203 is applied, the electrode material can be applied to any outer shape of the substrate without any waste. Can be applied.
なお、図６の例では一体的な吐出手段２０１が複数の吐出口２０２を備える場合を示したが、外形が円形である場合（図６(b)）のように、隣接する吐出口２０２がＹ方向に塗布する始点・終点が互いに異なっている場合には、図７(a)に示すように、吐出の制御が可能な吐出口２０２を１つだけ備える吐出手段２０１を、複数連結して配置してもよい。また、外形が矩形の四隅を欠いている場合（図６(c)）のように、隣接する吐出口２０２がＹ方向に塗布する始点・終点が互いに同じである部分と互いに異なる部分が混在している場合には、図７(b)に示すように、塗布する始点・終点が同じである部分については、当該部分の複数の吐出口２０２を一体的な吐出手段２０１（吐出口２０２ごとの吐出制御ができなくても可）として構成し、始点・終点が異なる部分については吐出の制御が可能な吐出口２０２を１つだけ備える１以上の吐出手段２０１として構成し、これらを連結して使用してもよい。なお、いずれの場合も複数の吐出手段２０１を連結せずに個別にＹ方向に移動できるように構成し制御しても構わない。 In the example of FIG. 6, the case where the integral discharge means 201 includes a plurality of discharge ports 202 is shown. However, when the outer shape is circular (FIG. 6B), the adjacent discharge ports 202 are When the start point and the end point to be applied in the Y direction are different from each other, as shown in FIG. 7A, a plurality of discharge means 201 having only one discharge port 202 that can control discharge are connected. You may arrange. Further, as in the case where the outer shape lacks the four corners of the rectangle (FIG. 6 (c)), there are mixed portions where the start point and end point at which the adjacent discharge ports 202 apply in the Y direction are the same and different portions. 7 (b), with respect to a portion having the same start point and end point to be applied, a plurality of discharge ports 202 of the portion are connected to an integrated discharge means 201 (for each discharge port 202). It is also possible to perform the discharge control, and it is configured as one or more discharge means 201 having only one discharge port 202 that can control discharge for portions having different start points and end points. May be used. In either case, the plurality of ejection units 201 may be configured and controlled so that they can be individually moved in the Y direction without being connected.
また、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）のＸ方向の幅が基板１０１の幅より狭い場合には、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）を基板１０１に対して次のように相対移動させればよい。図８は基板の幅が吐出手段の幅より広い場合の塗布方法を説明する図である。この説明では電極材の極性は問題にならないため、吐出手段、吐出口、電極材について、それぞれ吐出手段２０１、吐出口２０２、電極材２０３と極性を分けずに説明することとする。図８(a)に示すように吐出手段２０１のＸ方向の幅が基板１０１の幅の半分であるとき、まず、吐出手段２０１を基板１０１に対してＹ方向に相対的に移動させつつ電極材２０３を吐出させることで、図８(b)に示すように基板１０１の左半分に電極材２０３をストライプ状に塗布することができる。続いて、図８(c)に示すように吐出手段２０１をＸ方向に相対的に移動させ、未塗布領域に到達した後、吐出手段２０１を−Ｙ方向に相対的に移動させつつ電極材２０３を吐出させることで、図８(d)に示すように残りの半分にも電極材２０３をストライプ状に塗布することができる。Ｘ方向の幅がより広い基板１０１の場合は、吐出手段２０１のＸ方向への移動とＹ方向又は−Ｙ方向の移動を、電極材２０３を吐出しつつ繰り返し行えばよい。なお、吐出手段２０１の相対的移動の制御と吐出手段２０１による電極材２０３の吐出タイミングの制御は、例えば制御手段３０２により行えばよい。 Further, when the width of the ejection unit 201 (or the ejection unit 201a and the ejection unit 201b) in the X direction is narrower than the width of the substrate 101, the ejection unit 201 (or the ejection unit 201a and the ejection unit 201b) is placed on the substrate 101. The relative movement may be performed as follows. FIG. 8 is a diagram for explaining a coating method when the width of the substrate is wider than the width of the discharge means. In this description, since the polarity of the electrode material does not matter, the discharge unit, the discharge port, and the electrode material will be described without dividing the polarity from the discharge unit 201, the discharge port 202, and the electrode material 203, respectively. As shown in FIG. 8A, when the width of the ejection unit 201 in the X direction is half the width of the substrate 101, first, the electrode member is moved while moving the ejection unit 201 relative to the substrate 101 in the Y direction. By discharging 203, the electrode material 203 can be applied to the left half of the substrate 101 in stripes as shown in FIG. Subsequently, as shown in FIG. 8C, the ejection unit 201 is moved relatively in the X direction, and after reaching the uncoated region, the electrode member 203 is moved while moving the ejection unit 201 relatively in the −Y direction. As shown in FIG. 8D, the electrode material 203 can be applied to the other half in a stripe shape. In the case of the substrate 101 having a wider width in the X direction, the movement of the discharge means 201 in the X direction and the movement in the Y direction or the −Y direction may be repeated while discharging the electrode material 203. Note that the relative movement of the discharge unit 201 and the discharge timing of the electrode material 203 by the discharge unit 201 may be controlled by the control unit 302, for example.
これにより、広い基板にも万遍なく電極材を塗布することができる。 Thereby, an electrode material can be uniformly applied to a wide substrate.
また、基板１０１と吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）との位置関係を調整するアライメント機構３０３を設けてもよい。電極材２０３ａ及び電極材２０３ｂの塗布に際しては、電極材２０３ａ及び電極材２０３ｂをそれぞれ塗布すべき基板１０１の裏面の所定の領域に、電極材２０３ａ及び電極材２０３ｂが垂下される必要がある。そのためには、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）の吐出口２０２ａ及び吐出口２０２ｂの間隔や位置が、基板１０１の裏面の電極材２０３ａ及び電極材２０３ｂを塗布すべき領域の間隔や位置と合っている必要がある。例えば図９に示すように、基板１０１の裏面にｐ＋領域１０２とｎ＋領域１０３が、図面奥に向けて交互にストライプ状に形成されている場合、吐出手段２０１において、第１極性たる正電極用の第１の電極材２０３ａを吐出する吐出口２０２ａがｐ＋領域１０２に対向するように、また第２極性たる負電極用の第２の電極材２０３ｂを吐出する吐出口２０２ｂがｎ＋領域１０３に対向するように、それぞれ形成されている必要がある。しかし、たとえ基板１０１の裏面と吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）をそれぞれ適切に設計したとしても、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）が相対的に移動する方向と基板１０１の裏面において塗布されるべき領域が帯状に形成されている方向とが合っていなければ、各領域上に適切に電極材を垂下することはできない。例えば図１０(a)に示すように、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）が相対的に移動するＹ方向と基板１０１の裏面においてｐ＋領域１０２とｎ＋領域１０３が帯状に形成されている方向（Ｙ＋方向）とが合っていないような場合である。そこで、図１０(b)に示すようにＹ方向とＹ＋方向とが合うように基板１０１と吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）との位置関係を調整するアライメント機構３０３を設ける。アライメント機構３０３は、吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）を動かして調整する機構として構成してもよいし、基板１０１を動かして調整する機構として構成してもよいし、両方を動かして調整する機構として構成してもよい。また、類似の機構を持つ移動手段３０１と一体的に構成してもよい。アライメント機能３０３の制御についても、制御手段３０２により行うようにしてもよいし、その他の方法により行うようにしてもよい。 Further, an alignment mechanism 303 that adjusts the positional relationship between the substrate 101 and the ejection unit 201 (or the ejection unit 201a and the ejection unit 201b) may be provided. When applying the electrode material 203a and the electrode material 203b, the electrode material 203a and the electrode material 203b need to be suspended in predetermined regions on the back surface of the substrate 101 to which the electrode material 203a and the electrode material 203b are to be applied, respectively. For this purpose, the interval or position between the discharge port 202a and the discharge port 202b of the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b) is the interval between the regions where the electrode material 203a and the electrode material 203b on the back surface of the substrate 101 should be applied. It needs to match the position. For example, as shown in FIG. 9, when p + regions 102 and n + regions 103 are alternately formed in a stripe shape toward the back of the drawing on the back surface of the substrate 101, the discharge means 201 has a positive polarity corresponding to the first polarity. The discharge port 202a for discharging the first electrode material 203a for the electrode faces the p + region 102, and the discharge port 202b for discharging the second electrode material 203b for the negative electrode having the second polarity is n +. Each needs to be formed so as to face the region 103. However, even if the back surface of the substrate 101 and the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b) are appropriately designed, the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b) move relatively. If the region to be applied on the back surface of the substrate 101 does not match the direction in which the region is formed in a strip shape, the electrode material cannot be properly suspended on each region. For example, as shown in FIG. 10A, the p + region 102 and the n + region 103 are strip-shaped in the Y direction in which the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b) relatively move and the back surface of the substrate 101. This is a case where the formed direction (Y + direction) does not match. Therefore, as shown in FIG. 10B, an alignment mechanism 303 is provided that adjusts the positional relationship between the substrate 101 and the ejection unit 201 (or the ejection unit 201a and the ejection unit 201b) so that the Y direction matches the Y + direction. . The alignment mechanism 303 may be configured as a mechanism that moves and adjusts the discharge unit 201 (or the discharge unit 201a and the discharge unit 201b), or may be configured as a mechanism that moves and adjusts the substrate 101, or both. You may comprise as a mechanism adjusted by moving. Moreover, you may comprise integrally with the moving means 301 which has a similar mechanism. Control of the alignment function 303 may also be performed by the control means 302 or may be performed by other methods.
アライメント機構３０３を設けることで、基板１０１と吐出手段２０１（又は吐出手段２０１ａ及び吐出手段２０１ｂ）との位置関係を調整した上で電極材２０３ａ及び電極材２０３ｂの塗布を行うことができるため、太陽電池基板の裏面の所定の領域に正確に所定の電極を形成することができる。 By providing the alignment mechanism 303, the electrode material 203a and the electrode material 203b can be applied after adjusting the positional relationship between the substrate 101 and the ejection unit 201 (or the ejection unit 201a and the ejection unit 201b). A predetermined electrode can be accurately formed in a predetermined region on the back surface of the battery substrate.
本発明の裏面電極型太陽電池の電極形成装置の各構成要素及び電極形成方法は、必要に応じ併合・分割・形成順序の変更などを行っても構わない。また、各実施形態はあくまで例示であり、本発明において表現されている技術的思想の範囲内で適宜変更が可能である。そして、その様な変更又は改良を加えた形態も本発明の技術的範囲に含まれ得ることが請求の範囲の記載から明らかである。 The constituent elements and the electrode forming method of the electrode forming apparatus of the back electrode type solar cell of the present invention may be merged, divided, or changed in order of formation as necessary. Moreover, each embodiment is an illustration to the last, and can be suitably changed within the range of the technical idea expressed in this invention. And it is clear from the description of the scope of claims that the embodiment added with such changes or improvements can be included in the technical scope of the present invention.
直径２００ｍｍのインゴットから切り出した縦横１５６ｍｍの疑似四角形単結晶シリコン基板を使用し、当該基板の裏面に、１．５ｍｍ幅の帯状の、５１本のｐ＋領域と５２本のｎ＋領域を、ストライプ状に交互に形成した。基板を移動手段である可動式ステージに真空チャックで固定し、アライメント機構であるＣＣＤカメラとサーボモータとにより位置合わせを行った後、ステージを１０ｃｍ／秒で直線的に移動させた。基板先端が光学式位置センサーで検知され、この信号により、ｐ＋領域への塗布を担う第１の吐出手段とｎ＋領域への塗布を担う第２の吐出手段から、それぞれ正電極材と負電極材を吐出開始した。上記ｐ＋領域とｎ＋領域の設計に対応し、第１の吐出手段は５１の吐出口で構成され、第２の吐出手段は５２の吐出口で構成されている。各吐出口の間隔は１．５ｍｍであり、吐出口の内径は１００μｍである。これらのうち、疑似正方形の角にかかる部分については吐出制御を独立させ、上記位置センサーによる基板端検出から所定時間のタイムラグを設けて吐出させる制御を行った。吐出の停止は吐出時間で制御した。基板端から内側に約１ｍｍのマージンを設けたため、最も長い部分で１．５４秒間吐出を行って塗布を停止した。 A quasi-rectangular single crystal silicon substrate having a length and width of 156 mm cut out from an ingot with a diameter of 200 mm is used, and a strip of 51 p + regions and 52 n + regions with a width of 1.5 mm are formed on the back surface of the substrate. Formed alternately. The substrate was fixed to a movable stage as a moving means by a vacuum chuck, aligned with a CCD camera as an alignment mechanism and a servo motor, and then the stage was moved linearly at 10 cm / second. The front end of the substrate is detected by an optical position sensor, and a positive electrode material and a negative electrode are respectively detected from the first discharge means responsible for application to the p + region and the second discharge means responsible for application to the n + region. Discharge of the electrode material was started. Corresponding to the design of the p + region and the n + region, the first discharge unit is configured by 51 discharge ports, and the second discharge unit is configured by 52 discharge ports. The interval between the discharge ports is 1.5 mm, and the inner diameter of the discharge ports is 100 μm. Among these, the discharge control is made independent for the portion corresponding to the corner of the pseudo square, and the discharge is performed with a predetermined time lag from the detection of the substrate edge by the position sensor. Discharge stop was controlled by the discharge time. Since a margin of about 1 mm was provided on the inner side from the substrate edge, the application was stopped by discharging for 1.54 seconds at the longest portion.
このような方法により、基板の裏面にストライプ状に交互に形成された５１本のｐ＋領域と５２本のｎ＋領域に、正電極材と負電極材をそれぞれ塗布することができた。 By such a method, the positive electrode material and the negative electrode material could be applied to 51 p + regions and 52 n + regions alternately formed in a stripe pattern on the back surface of the substrate, respectively.
縦横１５６ｍｍの単結晶シリコン基板を使用し、当該基板の裏面に、１．５ｍｍ幅の帯状の、５０本のｐ＋領域と５０本のｎ＋領域を、ストライプ状に交互に形成した。基板を可動式ステージに真空チャックで固定し、ＣＣＤカメラとサーボモータにより位置合わせを行った後、ステージを１０ｃｍ／秒で直線的に移動させた。ｐ＋領域への塗布を担う第１の吐出手段とｎ＋領域への塗布を担う第２の吐出手段は共に２５の吐出口で構成され、各吐出口の間隔は１．５ｍｍであり、吐出口の内径は１００μｍである。各吐出手段はセットで基板の片側半分をカバーするように配置されている。基板先端が光学式位置センサーで検知され、この信号により第１の吐出手段と第２の吐出手段からそれぞれ正電極材と負電極材を吐出し、１．５４秒間の吐出を行って、基板片側半分の塗布を完了した。この直後、ステージを電極材塗布方向と直交する方向に７５ｍｍ移動させた後、初回の塗布とは逆方向へ１０ｃｍ／秒で直線的に移動させた。これと同時に各吐出手段から２回目の吐出を開始し、１．５４秒間吐出を行って塗布を停止した。 A single crystal silicon substrate having a length and width of 156 mm was used, and 50 p + regions and 50 n + regions each having a width of 1.5 mm were alternately formed in a stripe pattern on the back surface of the substrate. The substrate was fixed to a movable stage with a vacuum chuck, aligned with a CCD camera and a servo motor, and then the stage was linearly moved at 10 cm / second. The first discharge means responsible for application to the p + region and the second discharge means responsible for application to the n + region are both composed of 25 discharge ports, and the interval between the discharge ports is 1.5 mm. The inner diameter of the outlet is 100 μm. Each discharge means is arranged to cover one half of the substrate as a set. The front end of the substrate is detected by an optical position sensor, and by this signal, a positive electrode material and a negative electrode material are discharged from the first discharge means and the second discharge means, respectively, and discharge is performed for 1.54 seconds. Half application was completed. Immediately after this, the stage was moved 75 mm in a direction orthogonal to the electrode material application direction, and then moved linearly at a rate of 10 cm / second in the direction opposite to the first application. At the same time, the second ejection was started from each ejection means, and the ejection was stopped for 1.54 seconds.
このように電極材の塗布を、基板の半分ずつ２回に分けて行った場合においても、基板の裏面にストライプ状に交互に形成された５０本のｐ＋領域と５０本のｎ＋領域に、正電極材と負電極材をそれぞれ塗布することができた。 In this way, even when the electrode material is applied twice in half each of the substrate, the 50 p + regions and 50 n + regions alternately formed in stripes on the back surface of the substrate are applied. The positive electrode material and the negative electrode material could be applied respectively.
１００ 裏面電極型太陽電池
１０１ 基板
１０２ ｐ＋領域
１０３ ｎ＋領域
１０４ 正電極
１０５ 負電極
１０６、１０７ パッシベーション膜
２０１、２０１ａ、２０１ｂ 吐出手段
２０２、２０２ａ、２０２ｂ 吐出口
２０３、２０３ａ、２０３ｂ 電極材
３０１ 移動手段
３０２ 制御手段
３０３ アライメント機構
100 Back electrode type solar cell 101 Substrate 102 p + region 103 n + region 104 Positive electrode 105 Negative electrode 106, 107 Passivation film 201, 201a, 201b Discharge means 202, 202a, 202b Discharge port 203, 203a, 203b Electrode material 301 Movement Means 302 Control means 303 Alignment mechanism
Claims (12)
第１極性の電極材を吐出する複数の第１の吐出口と第２極性の電極材を吐出する複数の第２の吐出口とが前記裏面に対向して或る方向（以下「Ｘ方向」という。）に交互に並ぶように設けられた吐出手段の前記吐出口から前記電極材を吐出し垂下することにより前記裏面に前記電極材を塗布して第１極性の電極と第２極性の電極を形成することを特徴とする裏面電極型太陽電池の電極形成方法。 An electrode forming method for a back electrode type solar cell in which all electrodes are formed on the back surface opposite to the light receiving surface of the solar cell substrate,
A plurality of first discharge ports for discharging the first polarity electrode material and a plurality of second discharge ports for discharging the second polarity electrode material face the back surface in a certain direction (hereinafter referred to as “X direction”). The electrode material is applied to the back surface by discharging and dropping from the discharge port of the discharge means provided so as to be alternately arranged in the first and second polarity electrodes. A method for forming an electrode of a back electrode type solar cell, characterized by comprising:
第１極性の電極材を吐出する複数の第１の吐出口と第２極性の電極材を吐出する複数の第２の吐出口とが前記裏面に対向してＸ方向に交互に並ぶように設けられた吐出手段を備え、当該吐出手段の前記吐出口から前記電極材を吐出し垂下することにより前記裏面に前記電極材を塗布して第１極性の電極と第２極性の電極を形成することを特徴とする裏面電極型太陽電池の電極形成装置。 An electrode forming device for a back electrode type solar cell in which all electrodes are formed on the back surface opposite to the light receiving surface of the solar cell substrate,
A plurality of first discharge ports for discharging the first polarity electrode material and a plurality of second discharge ports for discharging the second polarity electrode material are provided so as to be alternately arranged in the X direction facing the back surface. A first polarity electrode and a second polarity electrode are formed by applying the electrode material to the back surface by discharging the electrode material from the discharge port of the discharge means and dropping it down. An electrode forming apparatus for a back electrode type solar cell.
前記吐出手段と前記移動手段を制御する制御手段と、
を更に備え、
前記制御手段は、前記相対位置をＹ方向に直線的に変化させつつ前記電極材を吐出させるように制御することを特徴とする請求項７に記載の裏面電極型太陽電池の電極形成装置。 Moving means for changing the relative position of the discharge means to the solar cell substrate in a direction substantially perpendicular to the X direction and substantially parallel to the back surface;
Control means for controlling the discharge means and the moving means;
Further comprising
8. The electrode forming apparatus for a back electrode type solar cell according to claim 7, wherein the control means controls the discharge of the electrode material while linearly changing the relative position in the Y direction.
An alignment mechanism for adjusting the positional relationship between the solar cell substrate and the discharge means so that the predetermined electrode material is suspended in a predetermined region on the back surface to which the predetermined electrode material is to be applied; The electrode forming apparatus for a back electrode type solar cell according to any one of claims 7 to 11, wherein:
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