JP2017098308A - Component mounting device and operation test method for component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component capable of more surely observing a condition on which abnormality is generated when presence or absence of abnormality in an absorption state accompanied with movement is actually surveyed by a test method.SOLUTION: This component mounting device 100 includes: a head 32 capable of absorbing a component E and mounting it on a substrate P; drive parts (42, 53, 33, 34) for driving the head 32; and a controller 8 for controlling operation of the head 32. The controller 8 is constructed so that information Q on abnormality in an absorption state of the component E accompanied with movement is acquired by a test operation in which the component E is moved while being absorbed into the head 32 with a second absorption force F2 lower than a first absorption force F1 during mounting work.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus and an operation test method for the component mounting apparatus, and more particularly to a component mounting apparatus that performs component mounting by moving a suction portion and an operation test method for the component mounting apparatus.

  2. Description of the Related Art Conventionally, a component mounting apparatus that performs component mounting by moving a suction portion is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a component mounting apparatus that includes a movable suction unit and a control unit that controls the operation of the suction unit. The suction part generates a suction force by reducing the pressure inside the nozzle at the tip. When moving the suction part with the part sucked, if the moving speed (movement acceleration) is too large compared to the suction force, an abnormality in the suction state, such as a deviation of the suction position of the part or dropping of the part, may occur. is there. On the other hand, if the moving speed (moving acceleration) is too small, the mounting work efficiency decreases. Therefore, in Patent Document 1, the control unit calculates the moving speed (moving acceleration) of the suction unit during the mounting operation based on data such as pre-registered component mass and nozzle opening area.

  However, because there are various factors that are not reflected in the data such as individual differences in the mounted parts, the data such as the mass of the parts and the opening area of the nozzles can be used to suppress the abnormality occurrence rate and the work efficiency. It is difficult to derive an appropriate moving speed (moving acceleration) that achieves both. Therefore, a test is performed to move the suction part with the part picked up, the conditions under which the picked-up state abnormality occurs due to the movement are actually observed, and the moving speed (moving acceleration) during mounting work based on the test results Can be set.

JP 2012-156200 A

  However, for example, in the case of a light-weight component, there is a case where an abnormality in the suction state does not occur even if the suction part is moved at the maximum speed in the test operation (at most one or several tests). In this case, it is not possible to determine how much the moving speed (moving acceleration) should be set in consideration of variations due to individual differences among components to reduce the abnormality occurrence rate during the mounting operation. As described above, conventionally, there is a problem in that when the presence / absence of an adsorption state accompanying movement is measured by a test operation, the conditions under which the abnormality occurs may not be observed.

  The present invention has been made to solve the above-described problems, and one object of the present invention is that an abnormality occurs when the presence or absence of an adsorption state accompanying movement is measured by a test operation. It is an object to provide a component mounting apparatus and a component mounting apparatus operation test method capable of more reliably observing conditions.

  A component mounting apparatus according to a first aspect of the present invention includes a suction unit that can suck a component and mount it on a substrate, a drive unit that moves the suction unit, and a control unit that controls the operation of the suction unit. The unit is configured to acquire information related to abnormality in the suction state of the component accompanying the movement by a test operation that causes the suction portion to suck and move the component with a second suction force lower than the first suction force during the mounting operation. Has been. Here, “abnormality of the suction state of a component accompanying movement” means that the component sucked by the suction portion causes a positional shift (suction position shift) due to the movement, or if the component is sucked due to the movement. It is a concept including the case where it is canceled.

  In the component mounting apparatus according to the first aspect of the present invention, as described above, by performing the test operation in which the component is sucked and moved by the second suction force lower than the first suction force during the mounting operation. Even when the test is performed with the normal first suction force, even in a light-weight component that hardly causes the suction state abnormality, the suction state abnormality can be observed by reducing the suction force. As a result, when the presence / absence of an abnormality in the adsorption state accompanying the movement is actually measured by a test operation, the condition under which the abnormality occurs can be more reliably observed. In addition, using information on the abnormal state of the adsorption state obtained by the test operation as a clue, and taking into account variations due to individual differences in parts, it is appropriate to achieve both a reduction in the rate of abnormality and a reduction in work efficiency. It is possible to derive the movement speed (movement acceleration).

  In the component mounting apparatus according to the first aspect, preferably, the control unit is configured to determine the movement acceleration or movement speed of the adsorption unit based on information regarding abnormality in the adsorption state of the component in the test operation at a plurality of movement accelerations or movement speeds. Is configured to obtain an upper limit value. By configuring in this way, it is possible to grasp the upper limit value of the moving speed (moving acceleration) at which the adsorption state does not occur in the test operation, so by setting an appropriate safety factor to the obtained upper limit value, It is possible to more easily derive an appropriate moving speed (moving acceleration) in consideration of individual differences of components during mounting work.

  In the component mounting apparatus according to the first aspect described above, preferably, the control unit calculates the movement acceleration or movement speed of the suction unit during the mounting operation based on information regarding abnormality in the suction state of the component acquired by the test operation. It is configured as follows. With this configuration, it is not necessary for the user to set the moving speed (moving acceleration) during the mounting operation. Therefore, it is possible to easily set the appropriate safety factor without mounting the user's knowledge and experience. The moving speed (moving acceleration) can be set.

  The component mounting apparatus according to the first aspect preferably further includes an air pressure source for supplying an adsorption force to the adsorption unit, and an air path connecting the nozzle of the adsorption unit and the air pressure source, Is configured to perform suction with the second suction force when a part of the air path is opened to the outside during the test operation. With this configuration, it is possible to easily reduce the suction force of the suction portion from the first suction force to the second suction force by intentionally opening a part of the air path to the outside and releasing the pressure during the test operation. In addition, a mounting operation and a test operation can be performed using a common air pressure source.

  In this case, it is preferable to further include a first valve that can be opened and closed that connects a part of the air path to the outside, and the control unit opens the first valve in the test operation to thereby perform the adsorption via the air path. The suction power of the part is switched to the second suction power. If comprised in this way, the adsorption | suction force of an adsorption | suction part can be easily switched to a 1st adsorption force and a 2nd adsorption | suction force by the simple structure which only performs opening / closing switching of a 1st valve | bulb by a control part. As a result, it is possible to quickly switch between the mounting operation and the test operation.

  In the configuration further including the air path, preferably, a plurality of suction units are provided, and each of the plurality of suction parts is connected in parallel to a common air path via a second valve that switches ON / OFF of suction power supply. In the test operation, the control unit is configured to open the second valve of the suction unit that does not suck the component, thereby switching the suction force of the suction unit that sucks the component to the second suction force. If comprised in this way, only by opening the 2nd valve of other adsorption parts other than the adsorption part used as the object of a test operation, without adding the structure for reducing adsorption power to the 2nd adsorption power, It becomes possible to switch the suction force to the second suction force. For this reason, the structure of the component mounting apparatus for performing the test operation with the second suction force can be simplified.

  In the component mounting apparatus according to the first aspect, preferably, the suction unit is configured to be detachable from a nozzle for sucking the component, and the control unit has an opening area larger than that of the first nozzle used during mounting work. The test operation is performed in a state where the small second nozzle is attached to the suction portion. If comprised in this way, it will become possible to switch adsorption force to 2nd adsorption force only by changing from the 1st nozzle used at the time of mounting work to the 2nd nozzle. As a result, the configuration of the component mounting apparatus for performing the test operation with the second suction force can be simplified.

  An operation test method for a component mounting apparatus according to a second aspect of the present invention is an operation test method for a component mounting apparatus provided with a suction portion capable of sucking and moving a component and mounting the sucked component on a substrate, Adsorption by adsorbing a component to the adsorbing part with a second adsorbing force lower than the first adsorbing force during mounting work, moving the adsorbing part adsorbing the component with the second adsorbing force, and adsorbing the component with the second adsorbing force Acquire information related to abnormalities in the suction state of parts due to the movement of parts.

  In the operation test method for the component mounting apparatus according to the second aspect of the present invention, as described above, the test operation in which the component is adsorbed and moved by the second adsorbing force lower than the first adsorbing force during the mounting operation. By performing the above, it is possible to observe an abnormality in the suction state by reducing the suction force even for a lightweight component that is unlikely to cause an abnormality in the suction state when tested with the normal first suction force. As a result, when the presence / absence of an abnormality in the adsorption state accompanying the movement is actually measured by a test operation, the condition under which the abnormality occurs can be more reliably observed. In addition, using information on the abnormal state of the adsorption state obtained by the test operation as a clue, and taking into account variations due to individual differences in parts, it is appropriate to achieve both a reduction in the rate of abnormality and a reduction in work efficiency. It is possible to derive the movement speed (movement acceleration).

  According to the present invention, as described above, when the presence or absence of an adsorption state accompanying movement is measured by a test operation, the conditions under which the abnormality occurs can be more reliably observed.

It is a figure which shows the whole structure of the component mounting apparatus by the 1st-3rd embodiment of this invention. It is a block diagram which shows the control structure of the component mounting apparatus by 1st Embodiment of this invention. It is the model which showed the structure of the head periphery at the time of the test operation | movement of the component mounting apparatus by 1st Embodiment of this invention (A), and the mounting operation (B). It is the figure which showed the example of the operation test result of the component mounting apparatus by 1st Embodiment of this invention. It is the figure which showed the example of a setting of the movement acceleration at the time of mounting operation | work of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the control processing at the time of test operation | movement of the component mounting apparatus by 1st Embodiment of this invention. It is the figure which showed the example of the measurement result of the upper limit of movement acceleration. It is the schematic diagram which showed the structure of the head periphery of the component mounting apparatus by 2nd Embodiment of this invention. It is the schematic diagram which showed the structure of the head periphery of the component mounting apparatus by 3rd Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

[First Embodiment]
With reference to FIGS. 1-5, the structure of the component mounting apparatus 100 by 1st Embodiment of this invention is demonstrated.

(Configuration of component mounting device)
As shown in FIG. 1, the component mounting apparatus 100 is an apparatus for mounting a component E (electronic component) such as an IC, a transistor, a capacitor, and a resistor on a substrate P such as a printed circuit board.

  The component mounting apparatus 100 includes a base 1, a transport unit 2, a head unit 3, a support unit 4, a rail unit 5, a component recognition camera 6, a board recognition camera 7, and a control device 8 (see FIG. 2). The control device 8 is an example of a “control unit” in the claims. Hereinafter, the direction (conveyance direction) in which the conveyance unit 2 extends is defined as the X direction, the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction, and the vertical direction orthogonal to the X and Y directions is defined as the Z direction.

  Feeder arrangement portions 12 for detachably arranging a plurality of tape feeders 11 are respectively provided at both ends (Y1 side and Y2 side) of the base 1 in the Y direction.

  The tape feeder 11 holds a reel 11b around which a tape 11a holding a plurality of components E at a predetermined interval is wound. The tape feeder 11 is configured to supply the component E from the front end of the tape feeder 11 by pulling out the tape 11a holding the component E from the reel 11b and feeding it to the front end side.

  Each tape feeder 11 is arranged in the feeder arrangement unit 12 in a state of being electrically connected to the control device 8 via a connector (not shown) provided in the feeder arrangement unit 12. Thereby, each tape feeder 11 is configured to supply the component E based on the control signal from the control device 8.

  The conveyance unit 2 has a pair of conveyors 2a. The transport unit 2 has a function of transporting the substrate P in the horizontal direction (X direction) by the pair of conveyors 2a. Specifically, the transport unit 2 loads the substrate P before mounting from a transport path (not shown) on the upstream side (X1 side), transports the loaded substrate P to the mounting work position, and downstream (X2 side) ) Of the substrate P that has been mounted on the transfer path (not shown). Further, the transport unit 2 is configured to hold and fix the substrate P stopped at the mounting operation position by a substrate fixing mechanism (not shown) such as a clamp mechanism.

  The pair of conveyors 2a of the transport unit 2 is configured to be able to transport the substrate P in the horizontal direction (X direction) while supporting the substrate P from below. The pair of conveyors 2a is configured to be able to adjust the interval in the Y direction. Thereby, according to the magnitude | size (Y direction dimension) of the board | substrate P carried in, it is possible to adjust the space | interval of a pair of conveyor 2a in the Y direction.

  The head unit 3 is disposed so as to be movable at a position above the tape feeder 11 and the transport unit 2 via the support unit 4 and the rail unit 5. The head unit 3 is configured to suck the component E sent to the tip of the tape feeder 11 and mount the sucked component E on the substrate P fixed at the mounting work position. The head unit 3 includes a ball nut 31, a plurality of (in FIG. 1, six) heads 32, five Z-axis motors 33 (see FIG. 2) respectively provided on the plurality of heads 32, and a plurality of heads 32. 5 R-axis motors 34 (see FIG. 2) provided respectively. The head 32 is an example of the “suction part” in the claims.

  The head unit 3 is configured to be movable in the X direction along the support portion 4. Specifically, the support portion 4 includes a ball screw shaft 41, an X-axis motor 42 that rotates the ball screw shaft 41, and a guide rail (not shown) that extends in the X direction. The head unit 3 is configured to be movable in the X direction along the support portion 4 together with the ball nut 31 engaged (screwed) with the ball screw shaft 41 when the ball screw shaft 41 is rotated by the X-axis motor 42. ing.

  Further, the support portion 4 is configured to be movable in the Y direction orthogonal to the X direction along a pair of rail portions 5 fixed on the base 1. Specifically, the rail portion 5 rotates a pair of guide rails 51 that support both end portions in the X direction of the support portion 4 so as to be movable in the Y direction, a ball screw shaft 52 that extends in the Y direction, and the ball screw shaft 52. Y axis motor 53 is included. The support portion 4 is provided with a ball nut 43 engaged (screwed) with the ball screw shaft 52. The support portion 4 is configured to be movable in the Y direction along the pair of rail portions 5 together with the ball nut 43 when the ball screw shaft 52 is rotated by the Y-axis motor 53.

  Each of the plurality of heads 32 is configured such that the component E can be sucked and mounted on the substrate P. The plurality of heads 32 are arranged in a line along the X direction on the lower surface side of the head unit 3. A nozzle 32 a (see FIG. 3) is detachably attached to the tip of each head 32. The head 32 is configured to be able to adsorb and hold the component E supplied from the tape feeder 11 by the negative pressure (suction force) generated at the tip of the nozzle 32a by the vacuum pump 35 (see FIG. 3). Has been. The vacuum pump 35 is an example of the “air pressure source” in the claims.

  Further, the arrangement direction (X direction) of the plurality of heads 32 coincides with the arrangement direction of the tape feeders 11, and each head 32 performs the suction operation of the component E from the separate tape feeders 11 in parallel. It is configured to be possible. A plurality of types of nozzles 32 a are provided according to the type of component E to be sucked, and each is accommodated in the nozzle replacement unit 9. In the nozzle replacement unit 9, the nozzle 32a attached to the head 32 can be replaced.

  The head 32 is configured to be movable up and down in the vertical direction (Z direction, see FIG. 3). Specifically, the head 32 is located between a lowered position when the component E is sucked, mounted (mounted), or a nozzle is replaced, and a raised position when the component E is transported. It can be moved up and down. Each of the plurality of heads 32 is configured to be individually movable up and down by a Z-axis motor 33 (see FIG. 2). Each of the plurality of heads 32 is configured to be individually rotatable around the central axis (Z direction) of the nozzle 32a by an R-axis motor 34 (see FIG. 2).

  With such a configuration, the plurality of heads 32 are configured to be movable in the X direction and the Y direction above the base 1 by the movement of the entire head unit 3. Each head 32 is configured to be individually movable in the vertical direction (Z direction) and the rotational direction (R direction) around the central axis by a Z-axis motor 33 and an R-axis motor 34. Each of the X-axis motor 42, the Y-axis motor 53, the Z-axis motor 33, and the R-axis motor 34 is an example of a “drive unit” in the claims. The operations of the head unit 3 and the individual heads 32 are controlled by the control device 8.

  The component recognition camera 6 has a function of recognizing the suction state of the component E prior to the mounting of the component E, and is configured to take an image of the component E sucked by the head 32. The component recognition camera 6 is fixed on the upper surface of the base 1 with the imaging direction facing upward, and is configured to capture the component E attracted by the head 32 from below the component E (Z2 direction). ing. The imaging result is acquired by the control device 8. Based on the imaging result of the sucked component E, it is possible to recognize the suction state of the component E (the rotation posture and the suction position with respect to the head 32) by the control device 8. At the time of mounting work, the control device 8 corrects the mounting position and the rotational position of the component E by the head 32 based on the recognized rotational posture and suction position.

  The board recognition camera 7 is configured to take an image of a position recognition mark (fiducial mark) (not shown) attached to the board P prior to mounting the component E. The position recognition mark is a mark for recognizing the position of the substrate P. The imaging result of the position recognition mark is acquired by the control device 8. Based on the imaging result of the position recognition mark, the control device 8 can recognize the exact position and orientation of the substrate P fixed by a substrate fixing mechanism (not shown). During the mounting operation, the control device 8 calculates the mounting position and the rotational position of the component E by the head 32 based on the recognized position and orientation of the board P.

  The board recognition camera 7 is attached to the side portion of the head unit 3 on the X2 side, and is configured to be movable together with the head unit 3 in the X direction and the Y direction above the base 1. The substrate recognition camera 7 images the position recognition mark attached to the substrate P from above the substrate P (Z1 direction).

  As shown in FIG. 2, the control device 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, and is configured to control the operation of the component mounting apparatus 100. ing. Specifically, the control device 8 controls the transport unit 2, the X-axis motor 42, the Y-axis motor 53, the Z-axis motor 33, the R-axis motor 34, and the like according to a pre-stored mounting program 81 a, and the tape feeder 11. The component E is adsorbed from the substrate P, and the component E is mounted on the substrate P. The control device 8 includes a storage unit 81 that stores a mounting program 81a and test data 81b obtained by a test operation described later, and a display unit 82 that displays various types of information. The display unit 82 has a touch panel, for example, and also functions as an input unit that receives an operation input by the user.

  Here, the control device 8 moves in the respective axial directions (X, Y, Z, and R directions) in a state in which the components are attracted to the head 32, and tests whether or not an abnormal suction state occurs due to the movement. It is configured to perform control. Specifically, in the first embodiment, the control device 8 is moved by a test operation in which the component E is attracted and moved by the head 32 with a second attracting force F2 lower than the first attracting force F1 during the mounting operation. The information Q regarding the abnormality in the suction state of the component E associated with is acquired.

<Adsorption force switching structure>
First, a structure for switching the suction force of the head 32 to the second suction force F2 lower than the first suction force F1 will be described.

  As shown in FIG. 3, in the first embodiment, the component mounting apparatus 100 includes a vacuum pump 35 for supplying a suction force to the head 32, and an air path 36 that connects the nozzle 32 a of the head 32 and the vacuum pump 35. And. The vacuum pump 35 is installed, for example, inside the base 1, and is connected to the nozzles 32 a of the heads 32 of the head unit 3 via the air path 36. The air path 36 is configured by one or a plurality of combinations of piping members such as an air hose and a shaft, for example. A valve 37 is provided between the vacuum pump 35 and each head 32 (nozzle 32a).

  The valve 37 has a function of switching on and off the suction force supply to the corresponding head 32, and is provided individually for each of the plurality of heads 32. The valve 37 is, for example, an on / off valve that can be switched between on (open) and off (closed). The vacuum pump 35 supplies a predetermined constant pressure (negative pressure), for example. The control device 8 individually controls the suction (component suction) and non-suction (release of the suction component) of each head 32 by performing switching control of the valve 37.

  Here, in the first embodiment, the head 32 is configured to perform suction with the second suction force F2 when a part of the air path 36 is opened to the outside during the test operation. Specifically, the component mounting apparatus 100 includes an openable / closable valve 38 that connects a part of the air path 36 to the outside. In the example shown in FIG. 3, the valve 38 is disposed inside the head unit 3, and one end side is connected to a branch path 36 b branched from a path portion 36 a that connects the vacuum pump 35 and the valve 37. The branch path 36b and the valve 38 may be provided in a path portion 36c between the valve 37 and the nozzle 32a. The other end of the valve 38 is open to the outside or connected to a pipe communicating with the outside. The valve 38 is, for example, an on / off valve that can be switched between on (open) and off (closed). The valves 38 are individually provided for the plurality of heads 32. The valve 38 is an example of the “first valve” in the claims.

  The control device 8 is configured to switch the suction force of the head 32 via the air path 36 to the second suction force F2 by opening the valve 38 in the test operation shown in FIG. That is, during the test operation, the control device 8 opens both the valve 37 and the valve 38 of the head 32 and releases a part of the negative pressure of the air path 36 from the valve 38, so that the second adsorption force is applied to the head 32. F2 (<first adsorption force F1) is generated. At the time of the mounting operation shown in FIG. 3B, the control device 8 opens the valve 37 of the head 32 and closes the valve 38 to cause the head 32 to generate the first suction force F1. The second attracting force F2 is smaller than the first attracting force F1 by the amount by which a part of the negative pressure is released.

<Test operation>
Next, a test operation performed by switching the suction force of the head 32 to the second suction force F2 will be described.

  The test operation is an operation of moving the head 32 in a state where the component E is attracted to the head 32 with the second suction force F2 lower than the first suction force F1 during the mounting operation. The test operation is performed as work (a kind of production preparation work) separate from the mounting work. The test operation can be performed, for example, by switching the control device 8 to the test mode.

  Specifically, in the test operation, the movement operation in the X, Y, Z, and R axial directions is individually performed in a state where the component E is attracted to the head 32. At this time, the parts are recognized by the parts recognition camera 6 before and after the movement is completed, and the controller 8 recognizes the suction position of the part E. Then, the control device 8 provides information Q (see FIG. 4) regarding the abnormality in the suction state of the component E accompanying the movement, based on whether or not the amount of suction position deviation before the start of movement and after the completion of movement is outside the allowable range. get.

  The information Q regarding the abnormality in the suction state is information of a determination result as to whether or not a suction position shift or part dropout (falling) exceeding an allowable range has occurred with movement at a certain movement speed (movement acceleration). . The obtained information Q regarding the abnormality in the suction state becomes a judgment material for determining the moving speed (moving acceleration) when moving the head 32 (head unit 3) in the direction of each axis during the mounting operation.

  In the first embodiment, the control device 8 acquires the upper limit value of the movement acceleration or movement speed of the head 32 based on the information Q regarding the abnormality in the suction state of the component E in the test operation at a plurality of movement accelerations or movement speeds. Is configured to do. Further, the control device 8 is configured to calculate the movement acceleration T or the movement speed of the head 32 during the mounting operation based on the information Q regarding the abnormality in the suction state of the component E acquired by the test operation.

  Here, in the component mounting apparatus 100, the moving speed in each axial direction (X, Y, Z, and R directions) is expressed as a percentage with the maximum speed set for each axial direction as 100%. The movement acceleration in each axis direction is set to change in conjunction with the movement speed (%). Therefore, although “acceleration” is described in the following description and each drawing, this may be read as “speed” in this specification.

  The upper limit value (limit acceleration) of the moving acceleration of the head 32 in the test operation is the maximum speed determined that there is no abnormal suction state (OK). For example, when the movement acceleration in a certain axial direction is changed in units of 10% from 30% to 100% in the test operation, information Q regarding the abnormality in the suction state at each movement acceleration is obtained as shown in FIG. Suppose that In this case, the moving acceleration 60% is the upper limit value (limit acceleration) for the part A, the moving acceleration 40% is the upper limit value (limit acceleration) for the part B, and the moving acceleration 30% is the upper limit value (limit limit) for the part C. Acceleration). Note that the moving acceleration is not changed in units of 10%, but may be changed in units other than 10%, such as 5% units.

The control device 8 adds a predetermined safety factor to the limit acceleration obtained based on the information Q (OK or NG) regarding the abnormality in the suction state of the component E in the test operation, thereby moving the movement acceleration T during the mounting operation. (Movement speed) is calculated. The moving acceleration T during the mounting operation is calculated by, for example, the following expression (1).
Movement acceleration T during mounting work = Limit acceleration acceleration value / safety factor (1)
The limit acceleration conversion value of the limit acceleration is obtained by converting the limit acceleration obtained by the second adsorption force F2 into a value at the first adsorption force F1. The converted value can be obtained, for example, by the ratio between the first adsorption force F1 and the second adsorption force F2. For example, when the second suction force F2 is 50% of the first suction force F1, the converted value corresponds to twice the limit acceleration obtained with the second suction force F2. The value of the safety factor represents the amount of margin considering a statistical (probabilistic) factor such as the variation of the part E with respect to the acquired limit acceleration value, and is set to an appropriate value in advance.

  For example, when the safety factor = 1 and the second suction force F2 = 50% (first suction force ratio), as shown in FIG. 100%, part B = 80%, and part C = 70%. For part C, the moving acceleration 30% in the test operation is the upper limit value (limit acceleration), but in the case of a 10% increment test, the range of 30% to 39% is the upper limit value. Therefore, the moving acceleration T during the mounting operation may be set to 70% with reference to 35%, which is an intermediate value in the upper limit value range.

  Further, for example, when the safety factor = 2 and the second suction force F2 = 50% (first suction force ratio), the movement acceleration T during the mounting operation of the parts A to C is the part A = 60% and the part B. = 40% and part C = 30%. Although shown as a simple example for explanation in FIG. 5, the safety factor may be set to an appropriate value other than 1 and 2.

  The control device 8 is configured to perform a test operation for each type of component E used in the mounting operation, and to set the movement acceleration T during the mounting operation for each type of component E. Therefore, during the mounting operation, the nozzle 32a (head unit 3) is moved at the movement acceleration T corresponding to the component E sucked by the nozzle 32a.

(Test operation control process)
Next, with reference to FIG. 6, a control process when performing a test operation will be described.

  The test operation is performed, for example, when the control device 8 receives an instruction to switch to the test mode by an input operation from the user. The test operation may be performed before the mounting operation as one of the preparation operations when the production of the substrate P is started (when an operation instruction for starting the production is received).

  When the test mode is started, in step S1, the control device 8 causes the predetermined component E to be attracted to the nozzle 32a with the second attracting force F2. Specifically, the control device 8 moves the head unit 3 and the head 32 so that the target component E is attracted to the head 32 from the tape feeder 11 that supplies the target component E. At this time, the control device 8 causes both the valve 38 and the valve 37 of the head 32 to be turned on (opened) so that the component E is attracted to the head 32 by the second suction force F2.

  In step S2, the control device 8 causes the head 32 that has sucked the target component E to perform a test operation. First, the head 32 moves above the component recognition camera 6 to image the component E, and the controller 8 recognizes the suction position (contact position of the nozzle 32a with respect to the component E) based on the captured image. Next, the head 32 is moved while adsorbing the component E at a predetermined acceleration (for example, 30%) in a predetermined axial direction (for example, the X direction). Thereafter, the head 32 moves above the component recognition camera 6 to image the component E, and the controller 8 recognizes the suction position after the test operation (after a predetermined axial movement).

  In step S <b> 3, the control device 8 acquires information Q relating to the suction state abnormality accompanying the movement, based on the recognition result of the suction position before and after the test operation (predetermined axial movement). Specifically, the control device 8 determines whether or not the amount of displacement of the suction position before and after the test operation is outside a predetermined allowable range, for example, and thereby OK (the deviation of the component E is within the allowable range). Or NG (the deviation of the component E is out of the allowable range) is acquired. The presence / absence (OK or NG) of occurrence of the suction position shift is acquired in association with the setting of the movement acceleration during the test operation. The obtained information Q relating to the abnormal suction state and the corresponding set value of the moving acceleration are recorded as test data 81b (see FIG. 2).

  In step S4, the control device 8 determines whether or not the test has been completed for all the moving accelerations to be tested. As shown in FIG. 4, when the test is performed every 10% in the range of 30% to 100%, the control device 8 determines whether or not the test with these eight kinds of acceleration settings is completed, and completes. If not, steps S2 to S4 are repeated. Thereby, regarding the predetermined axial movement, information Q regarding the abnormality in the suction state corresponding to a plurality (eight types) of movement acceleration is acquired. If the test has been completed for all moving accelerations to be tested, the process proceeds to step S5.

  In step S5, the control device 8 determines whether or not all axial tests to be tested have been completed. In the first embodiment, a test is performed for each direction of the X, Y, Z, and R axes. The control device 8 determines whether or not these four types of axial tests have been completed, and if not completed, repeats steps S2 to S5. Thereby, the information Q regarding the abnormality in the suction state in each axial direction for the predetermined component E is acquired in association with the plurality of movement accelerations. When the tests in all the axial directions to be tested are completed, the process proceeds to step S6.

  In step S <b> 6, the control device 8 acquires the upper limit value (limit speed) of the moving acceleration of the head 32 based on the information Q regarding the abnormality in the suction state in the test operation with a plurality of moving accelerations. The upper limit value of the movement acceleration is acquired for each of the axial directions (X, Y, Z, and R).

  In step S <b> 7, the control device 8 calculates the movement acceleration T of the head 32 during the mounting operation based on the information Q regarding the abnormal suction state. Specifically, the control device 8 determines the upper limit value (limit speed) of the movement acceleration of the nozzle 32a obtained from the information Q related to the abnormal suction state, the first suction force F1 and the second suction force F2, and a predetermined value. Using the safety factor, the moving acceleration T of the head 32 during the mounting work is calculated by the above equation (1). The control device 8 records (sets) the calculated movement acceleration T during the mounting operation in the mounting program 81a. The movement acceleration T during the mounting operation is acquired for each of the axial directions (X, Y, Z, and R), and recorded in association with the type of the component E used for the test operation.

  The above processing is performed for each type of component E used for the mounting operation. As a result, the movement acceleration T during the mounting operation is set for each type of component E. When the mounting operation is started, the control device 8 reads the set value of the movement acceleration corresponding to the type of the component E sucked by the head 32 from the tape feeder 11, and the board P according to the set value of the movement acceleration in each axis direction. The movement control in each axis direction when mounted on is performed.

(Effect of 1st Embodiment)
In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, the control device 8 is configured to perform the test operation in which the component E is attracted and moved by the head 32 with the second attracting force F2 lower than the first attracting force F1 during the mounting operation. Configure. As a result, even when the test is performed with the normal first suction force F1, even in a light-weight component that hardly causes the suction state abnormality, the suction state abnormality can be observed by reducing the suction force. As a result, when the presence or absence of an abnormality in the adsorption state accompanying movement is measured by a test operation, the conditions under which the abnormality occurs can be more reliably observed. Further, the information Q regarding the abnormality in the suction state obtained by the test operation is used as a clue, and it is possible to achieve both the suppression of the abnormality occurrence rate and the suppression of the reduction in work efficiency in consideration of the variation due to the individual difference of the parts E. An appropriate moving speed (moving acceleration) can be derived.

  In the first embodiment, as described above, the upper limit value of the moving acceleration or moving speed of the head 32 is based on the information Q regarding the abnormality in the suction state of the component E in the test operation at a plurality of moving accelerations or moving speeds. The control device 8 is configured to acquire By configuring in this way, it is possible to grasp the upper limit value of the moving speed (moving acceleration) at which the adsorption state does not occur in the test operation, so by setting an appropriate safety factor to the obtained upper limit value, It is possible to more easily derive an appropriate moving speed (moving acceleration) in consideration of individual differences of the parts E during the mounting operation.

  In the first embodiment, as described above, the movement acceleration T (movement speed) of the head 32 during the mounting operation is calculated based on the information Q regarding the abnormality in the suction state of the component E acquired by the test operation. The control device 8 is configured as follows. With this configuration, it is not necessary for the user to set the moving acceleration T (moving speed) at the time of mounting work. Therefore, at the time of mounting work at which an appropriate safety factor is set easily without requiring user knowledge and experience. The moving acceleration T (moving speed) can be set.

  In the first embodiment, as described above, the vacuum pump 35 for supplying the suction force to the head 32 and the air passage 36 for connecting the nozzle 32a of the head 32 and the vacuum pump 35 are provided to perform the test operation. Sometimes, the head 32 is configured to perform the suction with the second suction force F2 by partially releasing the air path 36 to the outside. According to this configuration, the suction force of the head 32 can be easily changed from the first suction force F1 to the second suction force by intentionally opening a part of the air path 36 to the outside and releasing the pressure during the test operation. In addition to being able to reduce to F2, mounting work and test operation can be performed using the common vacuum pump 35.

  In the first embodiment, as described above, an openable / closable valve 38 that connects a part of the air path 36 to the outside is provided, and the valve 38 is opened in the test operation, thereby allowing the air path 36 to pass through the air path 36. The control device 8 is configured to switch the suction force of the head 32 to the second suction force F2. With this configuration, the suction force of the head 32 can be easily switched between the first suction force F1 and the second suction force F2 with a simple configuration in which the control device 8 simply switches the opening and closing of the valve 38. it can. As a result, it is possible to quickly switch between the mounting operation and the test operation.

  Here, the effect of 1st Embodiment is demonstrated in detail with reference to FIG. FIG. 7 shows an example of a graph in which the second adsorption force F2 is taken on the horizontal axis and the movement acceleration is taken on the vertical axis, and the upper limit value (limit acceleration) of the movement acceleration at each second adsorption force F2 is plotted. In FIG. 7, the horizontal axis indicates the percentage when the first suction force F1 is 100%.

  When the test operation is performed with the first adsorption force F1 (adsorption force 100%), the parts B (limit acceleration about 80%) and the parts C (limit acceleration about 60%) are within the range up to 100% moving acceleration. The limit acceleration can be acquired. On the other hand, in the case of the lightweight component A, the limit acceleration cannot be acquired within the range of the movement acceleration up to 100%.

  In the example of FIG. 7, it can be seen that the limit acceleration of the part A can be acquired by performing the test operation with the second suction force F2 being less than 80% of the first suction force F1. In the case of this example, considering the limit acceleration of the part A at each second suction force F2, the limit acceleration of the part A corresponds to about 120% in the state of the suction force 100% (first suction force F1). Presumed.

  If the limit acceleration (120%) of the component A converted by the first suction force F1 can be acquired in this way, it is possible to appropriately set the movement acceleration T during the mounting operation by adding the safety factor to the limit acceleration. It becomes. Specifically, for example, when a margin (safety factor) for 10% of the moving acceleration is secured, if the limit acceleration of the component A is 120%, the moving acceleration T during the mounting operation is 100% even if the margin is secured. Can be set to On the other hand, if the limit acceleration of the component A is 105%, the moving acceleration T during the mounting work needs to be set to 95% if a margin is secured.

  As described above, when the test operation is performed in a state where the suction force is 100%, it is difficult to accurately obtain the limit acceleration of the component A. Therefore, the moving acceleration T during the mounting operation cannot be set appropriately. On the other hand, by acquiring the limit acceleration of the component A with the second suction force F2, the movement acceleration T during the mounting operation can be set appropriately.

  In the example of FIG. 7, the limit acceleration at a plurality of second adsorption forces F2 is shown for explanation, but the second adsorption force F2 may be a single value. The second suction force F2 may be set to a value (less than 80% in FIG. 7) that allows the limit acceleration to be acquired for the component E for which the limit acceleration cannot be acquired with the first suction force F1. Similarly, the test operation for the same component (for example, component A) does not need to be performed a plurality of times by changing the magnitude of the second adsorption force F2 as shown in FIG. 7, but the second adsorption force having a specific magnitude. It only needs to be performed once in F2. Note that when the test operation is performed a plurality of times by changing the magnitude of the second suction force F2 as shown in FIG. 7, more information Q regarding the suction state abnormality can be acquired accordingly, so that movement during the mounting operation can be obtained. The acceleration T can be set more appropriately.

[Second Embodiment]
With reference to FIG. 1 and FIG. 8, the structure of the component mounting apparatus 200 (refer FIG. 1) by 2nd Embodiment of this invention is demonstrated. In the second embodiment, unlike the first embodiment in which the valve 38 connected to the outside is provided in a part of the air path 36, the suction force is changed to the second suction force F2 by the valve 137 that switches on / off of the suction force supply. An example of a configuration for switching will be described. In addition, about the structure similar to the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

<Adsorption force switching structure>
As shown in FIG. 8, in the second embodiment, the component mounting apparatus 200 includes a plurality of heads 32 and an air path 136 that connects the nozzles 32 a of the heads 32 and the vacuum pump 35. Each of the plurality of heads 32 is connected in parallel to a common air path 136 via a valve 137 that switches on and off the suction force supply. That is, in the first embodiment, the individual heads 32 are individually supplied with the negative pressure from the vacuum pump 35 via the air paths 36 independent of each other, whereas in the second embodiment, the individual heads 32 are individually supplied. Negative pressure is supplied to the head 32 through a common air path 136. Each head 32, the valve 137, and a part of the air path 136 are provided in the movable head unit 3. The valve 137 is an example of the “second valve” in the claims.

  In the second embodiment, a valve 137 is provided in each of a plurality of branch portions 136b branched from the common portion 136a of the air path 136 toward each head 32, and is shared with the corresponding head 32 by opening and closing the valve 137. Connection and disconnection with the portion 136a (vacuum pump 35) are switched. Thereby, the on / off of the suction force supply to the corresponding head 32 is switched by opening and closing the valve 137. On the other hand, in the second embodiment, the valve 38 for connecting a part of the air path to the outside is not provided.

  In the second embodiment, in the test operation, the control device 8 opens the valve 137 of the head 32 that does not suck the component E, thereby switching the suction force of the head 32 that sucks the component E to the second suction force F2. It is configured. If each head 32 shown in FIG. 8 is first, second, third, fourth,... In order from the left, when switching the suction force of the first head 32 to the second suction force F2, for example, The valve 137a of the first head 32 that adsorbs E is opened, one of the second and subsequent heads 32 (eg 137b) that does not adsorb the component E is opened, and the other valves 137c and 137d are closed. As a result, part of the negative pressure in the air path 136 is released from the second head 32, and the suction force of the first head 32 is switched to the second suction force F2.

  In the second embodiment, among the heads 32 that do not attract the component E (the second and subsequent heads in FIG. 8), by increasing or decreasing the number of heads 32 that open the valve 137, the second adsorption force F2 is increased. It is also possible to change the size step by step. Therefore, the test operation can be performed with the second suction force F2 of various magnitudes (for example, about 50% or about 33% of the first suction force F1).

  During the mounting operation, the valve 137 corresponding to the head 32 that adsorbs the component E is opened and the valve 137 corresponding to the head 32 that does not adsorb the component E is closed, so that no negative pressure leakage occurs. Each can suck the part E with the first suction force F1.

(Effect of 2nd Embodiment)
In the second embodiment, the following effects can be obtained.

  In the second embodiment, similarly to the first embodiment, by performing a test operation in which the component E is sucked and moved by the head 32 with the second suction force F2 lower than the first suction force F1 during the mounting operation. The condition under which the abnormality in the suction state of the part E occurs can be observed more reliably. Then, using the information Q regarding the abnormality in the suction state obtained by the test operation as a clue, considering the variation due to the individual difference of the parts E, both the suppression of the abnormality occurrence rate and the suppression of the reduction in work efficiency are achieved. An appropriate moving speed (moving acceleration) can be derived.

  In the second embodiment, as described above, the plurality of heads 32 are connected in parallel to the common air path 136 via the valves 137 that switch on and off the suction force supply. In the test operation, the controller 8 is configured to switch the suction force of the head 32 that sucks the component E to the second suction force by opening the valve 137 of the head 32 that does not suck the component E. If comprised in this way, the valve | bulb 137 of heads 32 other than the head 32 used as the object of test operation | movement is added, without adding the structure (valve 38 etc.) for reducing adsorption | suction force to the 2nd adsorption | suction force F2. It is possible to switch the suction force to the second suction force F2 simply by opening it. For this reason, the structure of the component mounting apparatus 100 for performing the test operation with the second suction force F2 can be simplified.

[Third Embodiment]
With reference to FIG. 1 and FIG. 9, the structure of the component mounting apparatus 300 (refer FIG. 1) by 3rd Embodiment of this invention is demonstrated. In the third embodiment, unlike the first and second embodiments configured to open a part of the air path and release the negative pressure to the outside, the nozzle used for component suction is replaced by suction. The example of the structure which switches force to the 2nd adsorption | suction force F2 is demonstrated. In addition, about the structure similar to the said 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

<Adsorption force switching structure>
As shown in FIG. 9, in the third embodiment, the control device 8 performs the test operation in a state where the second nozzle 232 having a smaller opening area than the first nozzle 231 used during the mounting work is attached to the head 32. Is configured to implement.

  As described above, the nozzle 32a (231, 232) is configured to be detachable from the tip of the head 32, and various types of nozzles having different opening areas and shapes are prepared. In the mounting program 81a, the type of the component E and the nozzle 32a used for mounting (suction) the component E of that type are registered as setting information.

  Therefore, the control device 8 performs the test operation in a state where the second nozzle 232 is attached to the head 32 instead of the first nozzle 231 registered as a nozzle used during the mounting operation. The first nozzle 231 has an opening area AS1, and the second nozzle 232 has an opening area AS2 (<AS1). The suction force increases in proportion to the opening area when the negative pressure supplied from the vacuum pump 35 is constant. Therefore, in the head 32 equipped with the second nozzle 232 having the opening area AS2, it is possible to suck the component E with the second suction force F2 smaller than the first suction force F1 when the first nozzle 231 is attached. Become.

  For example, the second nozzle 232 is accommodated in the nozzle replacement unit 9 (see FIG. 1) except when performing the test operation. In the nozzle replacement unit 9, the first nozzle 231 and the second nozzle 232 attached to the head 32 are replaced.

  Although only two types of the first nozzle 231 and the second nozzle 232 are shown in the example of FIG. 9, a plurality of types of second nozzles 232 having different opening areas may be provided. In this case, if a plurality of types of second nozzles 232 are replaced, the test operation can be performed with the second suction force F2 having various sizes. The second nozzle 232 may be a dedicated nozzle for a test operation, or a nozzle registered as the first nozzle 231 for a component E of a type different from the component E to be tested is tested. It may be used as the second nozzle 232 for the target component E.

  During the mounting operation, the valve 32 is opened while the first nozzle 231 is mounted on the head 32, so that the head 32 can suck the component E with the first suction force F1.

(Effect of the third embodiment)
In the third embodiment, the following effects can be obtained.

  In the third embodiment, similarly to the first embodiment, by performing a test operation in which the component E is attracted and moved by the head 32 with a second attracting force F2 lower than the first attracting force F1 during the mounting operation. The condition under which the abnormality in the suction state of the part E occurs can be observed more reliably. Then, using the information Q regarding the abnormality in the suction state obtained by the test operation as a clue, considering the variation due to the individual difference of the parts E, both the suppression of the abnormality occurrence rate and the suppression of the reduction in work efficiency are achieved. An appropriate moving speed (moving acceleration) can be derived.

  In the third embodiment, as described above, the test operation is performed in a state where the second nozzle 232 having a smaller opening area than the first nozzle 231 used during the mounting work is attached to the head 32. The control device 8 is configured. If comprised in this way, it will become possible to switch adsorption power to the 2nd adsorption power F2 only by changing from the 1st nozzle 231 used at the time of mounting work to the 2nd nozzle 232. As a result, the configuration of the component mounting apparatus 300 for performing the test operation with the second suction force F2 can be simplified.

[Modification]
In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims, and further includes meanings equivalent to the scope of claims and all modifications (variants) within the scope.

  For example, in the first to third embodiments, an example is shown in which the movement acceleration T of the head 32 during the mounting operation is calculated and set based on the information Q regarding the abnormality in the suction state of the component E acquired by the test operation. However, the present invention is not limited to this. In the present invention, it is not necessary to calculate the movement acceleration T of the head 32 at the time of the mounting operation by only acquiring the information Q regarding the abnormality in the suction state of the component E. If the information Q regarding the abnormality in the suction state of the component E with the second suction force F2 is obtained, the movement acceleration T during the mounting operation may be calculated and set on the user side based on the obtained information, for example. .

  Further, for example, the movement acceleration calculated based on the above equation (1) may be displayed on the display unit 82 as the recommended value of the movement acceleration T during the mounting operation. In this case, the user may determine whether or not to set the displayed recommended value as the movement acceleration T during the mounting operation.

  In the first to third embodiments, the upper limit value (limit acceleration) of the movement acceleration of the head 32 in the test operation is acquired, and the movement during the mounting work is performed using the above equation (1) based on the upper limit value. Although the example which calculates the acceleration T was shown, this invention is not limited to this. In the present invention, the movement acceleration T during the mounting operation may be calculated based on the information Q (OK or NG) relating to the abnormality in the suction state of the component E in the test operation. You may ask for. For example, the test operation may be performed a plurality of times, and the moving acceleration T during the mounting operation may be obtained from the test results of the plurality of times using a statistical method.

  Moreover, although the example which provided the valve | bulb 38 which consists of an on-off valve which can switch on (open | release) and off (closed) was shown in the said 1st Embodiment, this invention is not limited to this. In the present invention, the valve may be constituted by a pressure regulating valve such as an electropneumatic regulator. In this case, the magnitude of the second suction force F2 can be adjusted to an arbitrary value by adjusting the opening of the valve by the control device.

  In the first to third embodiments, the example in which the presence / absence of the suction state is determined by imaging the part E sucked by the head 32 by the part recognition camera 6 in the test operation has been described. The invention is not limited to this. The presence or absence of an abnormality in the suction state may be determined by a method other than image recognition.

  Moreover, although the example which uses the vacuum pump 35 as an air pressure source was shown in the said 1st-3rd embodiment, this invention is not limited to this. In the present invention, an ejector (vacuum ejector) other than the vacuum pump may be used as the pneumatic pressure source.

  In the first to third embodiments, the example in which the test operation is performed and the information Q regarding the abnormality in the suction state is obtained for each of the X, Y, Z, and R axial directions is shown. Not limited to. In the present invention, for example, only a part of each of the X, Y, Z, and R axial directions may be subjected to the test operation to acquire the information Q regarding the abnormal suction state.

  In the first to third embodiments, the example in which the motor (the X-axis motor 42 and the Y-axis motor 53) that rotationally drives the ball screw shaft (41, 52) is used as the drive unit has been described. Not limited to. In the present invention, for example, a linear motor or the like may be used as the drive unit.

  Moreover, in the said 1st-3rd embodiment, although the example which provided the six heads 32 was shown, this invention is not limited to this. In the present invention, the number of heads may be other than six.

8 Control device (control unit)
32 Head (Suction part)
33 Z-axis motor (drive unit)
34 R-axis motor (drive unit)
35 Vacuum pump (pneumatic source)
36 Air path 38 Valve (first valve)
42 X-axis motor (drive unit)
53 Y-axis motor (drive unit)
100, 200, 300 Component mounting device 137 Valve (second valve)
231 1st nozzle 232 2nd nozzle E Parts F1 1st adsorption force F2 2nd adsorption force P Substrate

Claims (8)

A suction part that can pick up components and mount them on the board;
A drive unit for moving the suction unit;
A control unit for controlling the operation of the adsorption unit,
The control unit obtains information on an abnormality in the suction state of the component due to movement by a test operation that causes the suction portion to suck and move the component with a second suction force lower than the first suction force during the mounting operation. A component mounting device configured to obtain.   The control unit is configured to acquire an upper limit value of the movement acceleration or movement speed of the adsorption unit based on information regarding an abnormality in the adsorption state of the component in the test operation at a plurality of movement accelerations or movement speeds. The component mounting apparatus according to claim 1.   The control unit is configured to calculate a movement acceleration or a movement speed of the suction unit during a mounting operation based on information on an abnormality in the suction state of the component acquired by the test operation. Or the component mounting apparatus of 2. An air pressure source for supplying an adsorption force to the adsorption unit;
An air path connecting the nozzle of the suction unit and the pneumatic source;
The suction unit is configured to perform suction with the second suction force when a part of the air path is opened to the outside during the test operation. The component mounting apparatus described in 1. A first valve that can be opened and closed to connect a part of the air path and the outside;
5. The control unit according to claim 4, wherein the control unit is configured to switch the suction force of the suction unit via the air path to the second suction force by opening the first valve in the test operation. The component mounting apparatus described. A plurality of the adsorbing portions;
Each of the plurality of suction portions is connected in parallel to the common air path via a second valve that switches on and off the suction power supply,
In the test operation, the control unit opens the second valve of the suction unit that does not suck the component so that the suction force of the suction unit that sucks the component is switched to the second suction force. The component mounting apparatus according to claim 4, wherein the component mounting apparatus is configured. The suction portion is configured to be detachable from a nozzle for sucking the component,
The control unit is configured to perform the test operation in a state where a second nozzle having an opening area smaller than that of a first nozzle used during a mounting operation is attached to the suction unit. The component mounting apparatus of any one of -6. It is an operation test method for a component mounting apparatus having a suction portion that can pick up and move a component and mount the sucked component on a board,
The component is adsorbed to the adsorbing portion with a second adsorbing force lower than the first adsorbing force during the mounting operation,
Moving the adsorbing part adsorbing the component with the second adsorbing force;
An operation test method for a component mounting apparatus, which acquires information related to an abnormality in an adsorption state of the component accompanying the movement of the adsorption unit that adsorbs the component with the second adsorption force.

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