JP2017093892A - Game machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a game machine capable of effectively performing heat radiation of heat-generating components and eliminating an adverse effect from noises as much as possible as well.SOLUTION: A game machine includes a substrate mounted with a heat-generating component 120. A first conductor pattern 134, which constitutes a ground wiring path, is provided astride between an arrangement area of the heat-generating component 120 in a substrate body 112 of the substrate and an outer area of the arrangement area. Further, the heat-generating component 120 and the first conductor pattern 134 may be provided on a first surface 111b side of the substrate body 112, and an interlayer conduction part 96 connecting the first conductor pattern 134 and a second surface 111a side of the substrate body 112 may be provided both in the arrangement area of the heat-generating component 120 and in the outer area.SELECTED DRAWING: Figure 9

Description

  The present invention relates to gaming machines such as pachinko machines and slot machines.

Various gaming machines such as pachinko machines are equipped with a large number of boards such as an LED board on which LEDs are mounted, a relay board, and a control board. Many of these boards are equipped with heat-generating components such as LEDs and LED drivers for driving them.
In a board on which such a heat-generating component is mounted, it is necessary to appropriately dissipate heat from the heat-generating component in order to prevent malfunction due to overheating. For example, in the invention described in Patent Document 1, a heat radiation pattern corresponding to the LED chip is provided on the back side of the LED substrate, and the heat radiation pattern and the LED chip are connected to each other by a heat transfer passage portion in the plate thickness direction. The heat generated in is radiated from the heat radiation pattern through the heat transfer passage portion.

International Publication No. WO2013 / 136758A1

In the invention described in Patent Document 1, since heat is radiated by a heat radiation pattern arranged on the back side of the substrate with respect to the LED chip, there is a problem that it is difficult to obtain sufficient heat radiation efficiency.
In addition, the heat radiation pattern to which the LED chip is heat-transferred is electrically independent, and since this heat radiation pattern serves as an antenna to easily pick up noise, for example, an LED driver having a control function, and other control elements There is also a problem that it is difficult to adopt as a heat dissipation means.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a gaming machine that can effectively dissipate heat-generating components and can eliminate adverse effects due to noise as much as possible.

In the gaming machine including the boards 41 to 44 and 46 on which the heat generating components 80, 81, 120, 121, 146, 180, and 244 are mounted, the first conductor patterns 102, 134, and 158, 196, 258 are arranged on the substrate bodies 72, 112, 142, 172, 242 of the substrates 41, 44, 46, and on the outside of the arrangement region of the heat generating components 80, 81, 120, 121, 146, 180, 244. It is provided across the area.
Further, the heat generating components 80, 81, 120, 121, 146, 180, 244 and the first surface are formed on the first surfaces 71b, 111b, 141b, 171b, 241b side of the substrate bodies 72, 112, 142, 172, 242. Conductor patterns 102, 134, 158, 196, 258 are provided, and the first conductor patterns 102, 134, 158, 196, 258 and second surface sides 71 a, 111 a of the substrate bodies 72, 112, 142, 172, 242 are provided. , 141a, 171a, 241a may be provided in both the arrangement region of the heat generating components 80, 81, 120, 121, 146, 180, 244 and the outer region, You may provide only in the arrangement | positioning area | region of the said exothermic components 80,81,120,121,146,180,244. In this case, the second conductor patterns 101, 135, 159, 197, 257 constituting the ground wiring path are provided on the second surface 71a, 111a, 141a, 171a, 241a side, and the first conductor patterns 102, 134, 158, 196, 258 and the second conductor patterns 101, 135, 159, 197, 257 may be connected by the interlayer conductive portion 96.
The substrates 41 to 44 and 46 are LED substrates on which LEDs 84 to 87, 124 to 127, 147 to 150, 183 to 186, 245 to 248 are mounted, and the heat generating components 80, 81, 120, 121, 146, 180 are mounted. , 244 may be LED drivers for driving the LEDs.

  According to the present invention, it is possible to effectively dissipate heat from a heat-generating component, and it is possible to eliminate adverse effects due to noise as much as possible.

1 is an overall front view of a pachinko machine according to a first embodiment of the present invention. It is the back view of the front door of the pachinko machine, and the front view of an inner frame. It is a figure which shows arrangement | positioning of the LED board etc. in the front door of the pachinko machine. It is a wiring diagram of the left wiring path in the front door of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the same pachinko machine. It is a figure which shows the thermal radiation part provided in the connection part of LED of this pachinko machine, and a wiring path. It is the front view and side sectional drawing of the LED driver mounting part in the 1st LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 2nd LED board of the pachinko machine. It is the front view and bottom sectional drawing of the LED driver mounting part in the 2nd LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the pachinko machine. It is a wiring diagram of the right wiring path in the front door of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 4th LED board of the pachinko machine. It is a figure which shows each via arrangement | positioning etc. of the downstream connector vicinity (a1) (a2) and LED driver vicinity (b1) (b2) in the 4th LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 5th LED board of the pachinko machine. It is a figure which shows the via arrangement | positioning etc. of the upstream connector vicinity in the 5th LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 6th LED board of the pachinko machine. It is the front view and side sectional drawing of a LED driver mounting part in the 2nd LED board of the pachinko machine concerning a 2nd embodiment of the present invention. It is the front view and side sectional drawing of a LED driver mounting part in the 2nd LED board of the pachinko machine concerning a 3rd embodiment of the present invention. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the pachinko machine which concerns on the 4th Embodiment of this invention. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the pachinko machine which concerns on the 5th Embodiment of this invention. It is explanatory drawing which shows the connection state of LED of this pachinko machine, and the connection state of protection resistance, and the relationship between those both-ends voltage. It is a figure which shows the thermal radiation part provided in the connection part of LED of the pachinko machine which concerns on the 6th Embodiment of this invention, and a wiring path. It is a figure which shows the wiring pattern of the downstream connector vicinity (a) and LED driver vicinity (b) in the 4th LED board of the pachinko machine which concerns on the 7th Embodiment of this invention. It is a figure which shows the wiring pattern of the upstream connector vicinity in the 5th LED board of the pachinko machine which concerns on the 8th Embodiment of this invention. It is a figure which shows the wiring pattern of the upstream connector vicinity in the 5th LED board of the pachinko machine which concerns on the 9th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIGS. 1-16 has illustrated 1st Embodiment which employ | adopted this invention for the pachinko machine. 1 and 2, a gaming machine body 1 includes a rectangular outer frame 2 and an inner frame 4 pivotally attached to a front side of the outer frame 2 by a hinge 3 on one side, for example, the left side. I have.

  On the front side of the inner frame 4, a game board mounting frame 6 and the like for mounting the game board 5 on the upper side thereof, and a launching means 7 and a lower speaker 10 and the like are arranged on the lower side, respectively, A front door 8 is pivotally attached by a hinge 9 on the same side as the hinge 3 so as to be freely opened and closed.

  As shown in FIG. 2, the launch means 7 includes a sheet metal support plate 11, a launch rail 12 mounted on the front surface of the support plate 11, and a launch game ball mounted on the front surface of the support plate 11. A ball holder 13 that is held on the firing rail 12, a striking rod 15 that is swingably supported on the front surface of the support plate 11 around a driving shaft 14 in the front-rear direction, and a striking rod mounted on the back side of the support plate 11 15 and a firing drive means 16 such as a rotary solenoid for driving in the striking direction via the drive shaft 14, and when the firing handle 17 on the front door 8 side is operated, the firing drive means 16 according to the amount of operation. Thus, the striking rod 15 is continuously driven in the striking direction (clockwise). Thereby, the game balls supplied one by one on the firing rail 12 are fired along the firing rail 12 toward the game area 5 a of the game board 5.

  The game board 5 is mounted on the game board mounting frame 6 from the front side, for example, and is detachably fixed by one or a plurality of fixtures 18, and a game ball launched by the launching means 7 on the front side thereof. A guide rail 21 is attached in a ring shape, and a central display unit 22, a normal symbol starting means 23, a special symbol starting means 24, a big winning means 25, and a normal winning are placed in the game area 5 a inside the guide rail 21. Various game parts such as means 26 are arranged.

  The central display unit 22 is provided with an ordinary symbol display means 28, a special symbol display means 29, an ordinary reserved number display means 30 and the like in addition to an image display means 27 such as a liquid crystal display. The image display means 27 constitutes an effect symbol display means 31, a special reserved number display means 32, and the like.

  The normal symbol display means 28 is composed of, for example, two light emitters (for example, LEDs) corresponding to two types of normal symbols “O” and “X”, and the normal symbol starting means 23 including a passing gate or the like is a game. Under the condition that a ball is detected, the two light emitters blink alternately for a predetermined time, and the hit determination random number value acquired when the normal symbol starting means 23 detects the game ball matches the predetermined hit determination value. In some cases, the blinking ends when the “○” side light emitter corresponding to the hit state emits light, and in other cases, the “×” side light emitter corresponding to the disengagement state emits light. It has become.

  Note that the normal random number information such as the hit determination random number value acquired when the game ball is detected by the normal symbol starting means 23 is stored up to a predetermined upper limit reserved number, for example, four, and the symbol by the normal symbol display means 28 is stored. Each time a change is started, it is digested sequentially. The number of stored normal random number information (hereinafter referred to as the normal reserved number) is notified to the player by the normal reserved number display means 30 having, for example, the same number of light emitters as the upper limit reserved number, for example.

  The special symbol starting means 24 is for starting the symbol variation by the special symbol display means 29, and includes, for example, two upper and lower starting winning means 24a and 24b, and is arranged below the central display unit 22. The upper start winning means 24a is a non-opening / closing type winning means having no opening / closing means. The lower start winning means 24b can be opened / closed by the opening / closing means 33 so that the game ball can be switched between a closed state where it is impossible to enter (or difficult to enter) and an open state where it is possible to enter (or easier to enter than when closed). When the stop symbol after the variation of the normal symbol display means 28 becomes a hit state and the normal profit state occurs in the winning means of the formula, the closed state is opened to the open state for a predetermined time.

  The special symbol display means 29 is composed of one or a plurality of display means such as a 7-segment type capable of variably displaying one special symbol, for example, and the special symbol starting means 24 detects a game ball, In other words, a special symbol is variably displayed for a predetermined time on the condition that a game ball enters one of the two upper and lower start winning means 24a and 24b, and the jackpot determination obtained at the time of entering the start winning means 24a and 24b When the random number value matches a predetermined jackpot determination value, it is stopped in a predetermined jackpot mode (specific mode), and in other cases, for example, it is stopped in a losing mode.

  Note that the special random number information such as the jackpot determination random number value acquired when the game ball is detected by the special symbol starter 24 is stored up to a predetermined upper limit reserved number, for example, four, and the symbol by the special symbol display unit 29 is stored. Each time a change is started, it is digested sequentially. The number of stored special random number information (hereinafter referred to as “special reserved number”) is notified to the player by the special reserved number display means 32 by, for example, the display number of the reserved display image X.

  The effect symbol display means 31 displays, for example, a variety of effect symbols in parallel with the change display of the special symbol by the special symbol display means 29, for example, one or more, for example, three effect symbols in the left-right direction. The display screen 27a of the image display means 27 can be displayed in a variable manner together with the effect image, and when the special symbol starting means 24 detects a game ball, that is, the game is given to one of the two upper and lower starting winning means 24a, 24b. When the ball wins, for example, the effect symbol is started so that the change of the effect symbol starts according to any of a plurality of types of change patterns simultaneously with the start of the change of the special symbol, and finally stops simultaneously with the stop of the change of the special symbol. , Right, middle, etc., in a predetermined order.

  The big winning means 25 is an open / close winning means provided with an open / close plate 25a that can be switched between an open state in which a game ball can enter and a closed state in which a game ball cannot enter. When a special symbol is a big win and a special profit state occurs, the opening / closing plate 25a is opened to the front according to a predetermined opening pattern, and the game ball dropped thereon is awarded to the inside. .

  The front door 8 includes, for example, a resin door base 35 in which a window hole 34 corresponding to the front side of the game area 5a is formed. In the door base 35, for example, a pair of left and right upper first speakers 36 a and 36 b and a blowing effect means 37 are disposed near the upper side of the window hole 34, and a pair of left and right upper second speakers 38 a are disposed near the lower side of the window hole 34. , 38b are arranged. The air blowing effect means (movable effect means) 37 is for performing an air blowing effect for sending wind toward the player sitting in front of the gaming machine main body 1, such as a sirocco fan operated by a motor (driving means). A blower 37a is provided, and is disposed adjacent to the right upper first speaker 36b on the upper right end side of the door base 35 so that the blower opening 37b is directed obliquely downward, for example.

  Further, on the front side of the door base 35, as shown in FIG. 3, a plurality of (here, six) LED substrates 41 to 46 are arranged around the window hole 34. That is, the first LED substrate 41 is disposed at the lower left portion of the window hole 34, the second LED substrate 42 is disposed at the upper left portion of the window hole 34, and the third LED substrate 43 is disposed substantially at the center in the left-right direction above the window hole 34. The fourth LED substrate 44 is disposed at the lower right portion of the window hole 34, the fifth LED substrate 45 is disposed above the fourth LED substrate 44, and the sixth LED substrate 46 is disposed in the vicinity of the blowing effect means 37 at the upper right portion of the window hole 34.

  The first LED board 41 and the second LED board 42 are disposed between the left upper second speaker 38a and the upper first speaker 36a along the window hole 34, and the third LED board 43 is the left and right upper first speakers. It is arranged between 36a and 36b. The fourth LED board 44 and the fifth LED board 45 are arranged between the upper second speaker 38b on the right side and the air blowing effect means 37 along the window hole 34, and the sixth LED board 46 is, for example, an air blowing effect means. It is arrange | positioned at the outer periphery of 37 ventilation opening 37b.

  As shown in FIG. 1, on the lower front side of the door base 35, an upper plate 47 for storing a game ball to be supplied to the launching unit 7 is disposed, for example, on the left side. On the lower side, a lower plate 48 for storing surplus balls and the like when the upper plate 47 is full is arranged on the left end side, and the firing handle 17 is arranged on the right end side.

  Further, on the front side of the door base 35, an upper decorative cover 49 that substantially covers the periphery of the window hole 34 from the front side and a lower decorative cover 50 that substantially covers the upper plate 47, the lower plate 48, and the like from the front side are mounted. In the upper decorative cover 49, at least a portion corresponding to the front side of the first to sixth LED substrates 41 to 46 is a light-emitting lens portion having translucency. On the lower decorative cover 50, for example, an effect button 51 that can be operated by the player is disposed at the approximate center in the left-right direction on the front side of the upper plate 47, and a ball lending operation unit 52 is disposed on the side thereof.

  As shown in FIG. 2, a glass unit 53 that substantially closes the window hole 34 from the rear side is detachably mounted on the back side of the door base 35, and a ball feeding means 54, a lower dish guide are provided on the lower side thereof. Means 55, a front door relay board 56, and the like are arranged. The ball feeding means 54 supplies the game balls in the upper plate 47 one by one onto the firing rail 12, is arranged corresponding to the front side of the firing means 7, and operates in synchronization with the firing operation by the firing means 7. It is supposed to be. The lower tray guiding means 55 guides the surplus balls when the upper tray 47 is full and the foul balls that have been returned by the launching means 7 without reaching the game area 5a to the lower dish 48. For example, it is arranged on the hinge 9 side adjacent to the ball feeding means 54. Further, the front door relay board 56 includes an effect control board and the like arranged on the back side of the game board 5, the first to sixth LED boards 41 to 46 on the front door 8 side, the speakers 10, 36a, 36b, 38a, 38b, and the air blower. It relays between various rendering means such as the rendering means 37, and is disposed, for example, between the door base 35 and the lower tray guide means 55 on the rear side.

  Subsequently, among the various game parts provided on the front door 8, particularly the wiring relating to the first to sixth LED boards 41 to 46, the upper first speakers 36 a and 36 b, the upper second speakers 38 a and 38 b, and the air blowing effect means 37. This will be described in detail.

  First, an outline of the wiring route on the front door 8 will be described. As shown in FIG. 3 and the like, the wiring paths of the first to sixth LED boards 41 to 46 branch from the front door relay board 56 disposed on the lower side of the front door 8 to the left and right along the window hole 34. The first to third LED boards 41 to 43 constitute the left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 constitute the right wiring path 58 on the right side of the window hole 34. . Further, the drive wiring path of the upper first speakers 36 a and 36 b is provided on the left wiring path 57, and the drive wiring path of the air blowing effect means 37 is provided on the right wiring path 58. The upper second speakers 38a and 38b are independent of the left and right wiring paths 57 and 58, and are connected to the front door relay board 56 via the harnesses 59a and 59b, for example.

  The first to third LED boards (first to third boards) 41 to 43 configuring the left wiring path 57 are connected in series via harnesses 61 and 62, and the first LED board 41 on the most upstream side is connected. The front door relay board 56 is connected via a harness 60. In the left wiring path 57, through-pass wiring paths (predetermined wiring paths) are provided in the first LED board 41 and the second LED board 42, and LEDs arranged on the third LED board 43 are driven downstream of the through-pass wiring paths. A circuit unit including an LED driver to be connected is connected. The first LED board 41 and the second LED board 42 are also provided with circuit portions including LEDs and LED drivers for driving the LEDs, and are connected to through-pass wiring paths. Further, a part of the drive wiring path of the upper first speakers (predetermined presentation means) 36a, 36b is provided on the first to third LED boards 41 to 43, and the third LED board 43 on the most downstream side and the upper first speaker 36a. 36b are connected via harnesses 63 and 64, respectively.

  The fourth to sixth LED boards 44 to 46 constituting the right wiring path 58 are connected in series via harnesses 66 and 67, and the fourth LED board 44 on the most upstream side is connected to the front door via the harness 65. It is connected to the relay board 56. In the right wiring path 58, through-pass wiring paths (predetermined wiring paths) are provided in the fourth LED board (first board) 44 and the fifth LED board (second board) 45, and the sixth LED board is located downstream of the through-pass wiring path. A circuit unit including an LED (third LED) disposed on the (third substrate) 46 and an LED driver (third LED driver) for driving the LED is connected. The fourth LED substrate (first substrate) 44 is also provided with a circuit unit including an LED (first LED) and an LED driver (first LED driver) for driving the LED (first LED), and is connected to a through-pass wiring path. The fifth LED substrate (second substrate) 45 is also provided with an LED (second LED), and this LED is driven by an LED driver (first LED driver) on the fourth LED substrate (first substrate) 44. In addition, a part of the drive wiring path of the blowing effect means (predetermined effect means) 37 is provided on the fourth and fifth LED boards 44 and 45, and the fifth LED board 45 and the blowing means 37 a of the blowing effect means 37 are harnesses 68. Connected through. In the present embodiment, parts other than LEDs, LED drivers, protective resistors, connectors, etc. are omitted on the first to sixth LED boards 41 to 46. Hereinafter, the configuration of the first to sixth LED substrates 41 to 46 will be described in detail.

[First LED board 41]
As shown in FIG. 3 and the like, the first LED substrate (first substrate) 41 includes a substrate body 72 having wiring layers on the front and rear surfaces. The substrate main body 72 has a right edge portion 72a formed in a substantially arc shape along the lower left portion of the window hole 34, and a left edge portion 72b formed in a substantially vertical direction. The width is gradually increased, and a notch 72c corresponding to the position of the left upper second speaker 38a is formed in the lower left portion.

  As shown in FIG. 4, the first LED substrate 41 has an upstream connector (substrate connection connector) 73, a downstream connector (substrate connection connector) 74, and an LED for connecting the connectors 73, 74. Through-pass wiring paths (predetermined wiring paths) 75 to 79 for power supply, LED driver power supply, signal, clock and ground, and through-pass wiring paths 76 to 79 for LED driver power supply, signal, clock and ground For example, two LED drivers 80 and 81 that are branched and connected, and protective resistors 82 and 83 that are connected in series between the RGB terminals of the LED drivers 80 and 81 and the through-pass wiring path 75 for the LED power source, and LEDs 84 to 87 and speaker drive wiring paths 88a to 88d for connecting the connectors 73 and 74 are provided. A circuit unit including the LED drivers 80 and 81, the LEDs 84 to 87, the protective resistors 82 and 83, and the like connected to the through-pass wiring paths 75 to 79 is an example of the first circuit unit.

  The upstream connector 73 is connected to the front door relay board 56 via the harness 60. For example, the two LED power terminals 89a and 89b to which the LED power through-pass wiring path 75 is connected and the LED driver power supply are connected. For example, one LED driver power supply terminal 90 to which the through-pass wiring path 76 is connected, for example one signal terminal 91 to which the signal through-path wiring path (digital signal wiring path) 77 is connected, and a clock through-path wiring path For example, one clock terminal 92 to which (digital signal wiring path) 78 is connected, three ground terminals 93a to 93c to which ground through-pass wiring path 79 is connected, and speaker drive wiring paths 88a to 88d are connected. Speaker terminals 94a to 94d, and a total of twelve terminals are arranged in two rows, for example, six each. It is. Then, two terminals on both ends in the terminal arrangement direction of the two rows, that is, a total of four terminals are speaker terminals 94a to 94d. In this way, the through-path wiring path 75 for the LED power supply is connected to the two LED power supply terminals 89a and 89b, and the through-path wiring path 79 for the ground is connected to the three ground terminals 93a to 93c. This reduces the electrical resistance generated at the contact area.

  For the eight terminals other than the speaker terminals 94a to 94d in the connectors 73 and 74, for example, the LED power terminals 89a and 89b, the ground terminal 93a, and the LED driver power terminal 90 are arranged in that order in one row. A ground terminal 93b, a signal terminal 91, a clock terminal 92, and a ground terminal 93c are arranged in that order in the column on the side. Of course, the arrangement of the terminals in the connectors 73 and 74 is arbitrary.

  FIG. 5 shows a specific wiring pattern of the first LED substrate 41 for each wiring layer. In the first LED board 41, LEDs 84 to 87 and the like are provided on the front wiring layer (second wiring layer) 71a on the front side, and the upstream connector 73, the downstream connector 74, and the like on the back wiring layer (first wiring layer) 71b on the back side. LED drivers 80 and 81, protective resistors 82 and 83, etc. are arranged, respectively.

  The front wiring layer 71a and the back wiring layer 71b are substantially entirely covered with the insulating film 106 (see FIG. 7), but in FIG. The lower wiring path and the like are indicated by solid lines. The same applies to FIG. 8, FIG. 10, FIG. 12, FIG. 14, and FIG.

  The upstream connector 73 is arranged, for example, on the lower end side of the back wiring layer 71b (FIG. 5B) so that the terminal arrangement is in the horizontal direction, and the downstream connector 74 is arranged on the upper end side of the back wiring layer 71b, for example. Are arranged in the vertical direction. Each terminal of the connectors 73 and 74 has, for example, a rectangular shape and is formed in an elongated shape in a direction orthogonal to the arrangement direction. The speaker terminals 94a and 94b on one end side of the upstream connector 73 are connected to, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a from the outside in the terminal arrangement direction (herein, left and right direction), and upstream. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 73 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream connector 74 from the outside in the terminal arrangement direction (herein, the vertical direction), and downstream. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction).

  Thus, the speaker drive wiring paths 88a to 88d are connected to the outermost terminals 94a to 94d in the arrangement direction among the plurality of terminals of the connectors 73 and 74 from the outside in the terminal arrangement direction. Although the speaker drive wiring paths 88a to 88d are formed wide, it is easy to avoid interference with other wiring paths. Further, since the speaker terminals 94a to 94d are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the speaker drive wiring paths 88a to 88d are connected by connecting to the long sides of the speaker terminals 94a to 94d. It is possible to secure a larger cross-sectional area of the portion and to keep the resistance low.

  The LEDs 84 to 87 are arranged in a line at substantially constant intervals along the longitudinal direction of the front wiring layer 71a (FIG. 5A), for example. The LEDs 84 and 85 driven by the LED driver 80 are vertically arranged on the upper side of the front wiring layer 71 a, for example, and are connected in series by an inter-LED wiring path 95. The LEDs 86 and 87 driven by the LED driver 81 are disposed obliquely along the right edge portion 72a of the substrate body 72 on the lower side of the front wiring layer 71a, for example, and are connected in series by the inter-LED wiring path 95. Yes. The LEDs 84 to 87 are full-color light emitting types incorporating red, green, and blue LED elements. For example, on both the anode side and the cathode side, an R electrode corresponding to red and a G electrode corresponding to green (second) Electrode) and a B electrode (third electrode) corresponding to blue are provided side by side so that, for example, the R electrode (first electrode) is in the center.

  Further, in the first LED board 41, the speaker drive wiring paths 88a to 88d, as well as the LED power supply, LED driver power supply, signal and clock through-pass wiring paths 75 to 78, for example, both ends thereof, that is, connectors. Except for a predetermined range in the vicinity of the connection portion to 73 and 74, substantially all of them are provided on the same front wiring layer (second wiring layer) 71a side as the LEDs 84 to 87.

  That is, the speaker drive wiring paths 88a and 88b are arranged on the front wiring layer 71a along, for example, the right edge portion 72a, and on both ends thereof via vias (interlayer conductive portions) 96, the rear wiring layer 71b side. The connectors 73 and 74 are connected to speaker terminals 94a and 94b. The speaker drive wiring paths 88c and 88d are arranged on the front wiring layer 71a along, for example, the left edge portion 72b, and the speakers in the connectors 73 and 74 on the rear wiring layer 71b side via the vias 96 at both ends. The terminals 94c and 94d are connected. The via 96 of this embodiment is assumed to be a through-hole type via in which a through hole is plated.

  The through-pass wiring paths 75 to 78 for LED power supply, LED driver power supply, signal and clock are, for example, the front wiring layer 71a along the right side of the upper side LEDs 84 and 85 and the left side of the lower side LEDs 86 and 87. The LED power terminals 89a and 89b, the LED driver power terminals 90, and the signals of the connectors 73 and 74 on the back wiring layer 71b side are connected via vias 96 at both ends thereof. The terminal 91 and the clock terminal 92 are connected.

  The LED power supply wiring path 97 branched from the LED power supply through-pass wiring path 75 is connected to the anode electrodes of the LEDs 84 and 87, for example, and the LED power supply wiring path 98 branched from the LED driver power supply through-pass wiring path 76 is formed. The signal wiring path 99 connected to the power supply terminals of the LED drivers 80 and 81 and branched from the signal through-path wiring path 77 is connected to the signal terminals of the LED drivers 80 and 81 and branched from the clock through-path wiring path 78. The clock wiring path 100 is connected to the clock terminals of the LED drivers 80 and 81.

  The front wiring layer 71a is provided with solid ground patterns 101 at a plurality of locations including between the through-pass wiring paths 75 to 78 including the digital signal wiring paths and the speaker drive wiring paths 88a to 88d. Each of the solid ground patterns 101 constitutes a ground through-pass wiring path (ground wiring path) 79 together with the solid ground pattern 102 on the back wiring layer 71b side, for example, via vias 96 and solid ground patterns 102. The connectors 73 and 74 are connected to the ground terminals 93a to 93c. Of the plurality of solid ground patterns 101, for example, the solid ground pattern 101a is arranged in a floating island shape below the LED 85 between the speaker drive wiring paths 88c and 88d and the through-pass wiring paths 75 to 78.

  The LED drivers 80 and 81 are disposed, for example, approximately at the center of the rear wiring layer 71b with a predetermined distance in the vertical direction, and through-path wirings (digital signal wiring paths) for signals and clocks on the front wiring layer 71a side. 77 and 78. Further, a solid ground pattern 101a on the front wiring layer 71a side is provided corresponding to the arrangement range of the LED drivers 80 and 81. That is, on the front wiring layer 71a side, signal and clock through-pass wiring paths 77 and 78 and speaker drive wiring paths 88c and 88d are arranged with the solid ground pattern 101a interposed therebetween, and the LED on the rear wiring layer 71b side. The drivers 80 and 81 are arranged at positions corresponding to the signal and clock through-path wiring lines 77 and 78 by moving away from the speaker drive wiring lines 88c and 88d, and the solid ground pattern 101a is the LED driver 80 and 81. Corresponds to the arrangement range.

  As described above, the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78 that can be noise sources are arranged at the positions corresponding to each other in the back wiring layer 71b and the front wiring layer 71a to drive the speaker that is vulnerable to noise. The wiring paths 88c and 88d are arranged away from the digital signal wiring paths 77 and 78 and the solid ground pattern 101a is arranged between them, so that the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78 can be connected to the speaker. The adverse effects of noise on the drive wiring paths 88c and 88d can be eliminated as much as possible.

  The protective resistors 82 and 83 are disposed, for example, in the vicinity of the LED drivers 80 and 81 in the back wiring layer 71b, and one end side thereof is connected to the RGB terminals of the LED drivers 80 and 81 via the LED drive wiring path 103, and the other end. The sides are connected to the cathode electrodes of the LEDs 85 and 86 via the cathode side wiring path 104 across the back wiring layer 71b with the via 96 interposed therebetween.

  A plurality of solid ground patterns 102 are provided on the back wiring layer 71 b around the LED drivers 80 and 81 and the protective resistors 82 and 83. These solid ground patterns 102 are connected to each other through, for example, a plurality of vias 96, the solid ground pattern 101 on the front wiring layer 71 a side, and the like, and the ground terminals 93 a to 93 c of the connectors 73 and 74 and the LED drivers 80 and 81. Connected to the ground terminal.

  In the first LED board 41, the speaker drive wiring paths 88a to 88d are digital signals such as signal and clock through-pass wiring paths 77 and 78, signal wiring path 99, and clock wiring path 100 for driving the LEDs 84 to 87. It is formed wider than the signal wiring path.

  Moreover, in the 1st LED board 41, the following structures are employ | adopted in order to improve the thermal radiation efficiency of LED84-87 and LED drivers 80 and 81 as an example of a heat-emitting component. First, regarding the LEDs 84 to 87, the wiring paths (that is, the copper foil patterns) connected to these electrodes are provided with heat dissipating portions 105a and 105b wider than the other portions in the wiring paths, and the heat dissipating portions 105a and 105b are provided. The LEDs 84 to 87 are configured to radiate heat.

  That is, as shown in FIG. 6, the inter-LED wiring path 95 and the cathode side wiring path 104 are, for example, except for the central R wiring path (first wiring path) 95R, 104R, and the G wiring paths (second wiring) on both sides thereof. Path) 95G, 104G and B wiring path (third wiring path) 95B, 104B are provided with heat radiating portions 105a. The heat dissipating part 105a is provided, for example, at a connection part with the G, B electrodes AG, AB, KG, KB, and widens on the side opposite to the R wiring paths 95R, 104R, that is, outside in the electrode arrangement direction. For example, it is formed in a rectangular shape. In addition, the LED power supply wiring path 97 is provided with, for example, a rectangular heat dissipating part 105b that widens on both sides in the width direction at the connection part of the electrodes 84, 87 with the electrodes AG, AR, AB. Thereby, the heat generated in the LEDs 84 and 87 can be efficiently radiated through the heat radiating portions 105a and 105b, and malfunction due to overheating of the LEDs can be prevented.

  In addition, as for the LED drivers 80 and 81, a part of the solid ground pattern (first conductor pattern) 102 is arranged between the substrate main body 72 and the LED drivers 80 and 81 via the solid ground pattern 102. It is designed to dissipate heat. In the present embodiment, as shown in FIG. 7, a part of the solid ground pattern 102 is disposed below the LED drivers 80 and 81, and the LED drivers 80 and 81 have an insulating film 106 that covers the solid ground pattern 102. The substrate is fixed to the substrate main body 72 with the back surface substantially in contact therewith. As a result, the heat generated in the LED drivers 80 and 81 can be efficiently radiated through the solid ground pattern 102 having a large area, and malfunction due to overheating of the LED driver can be prevented.

[Second LED substrate 42]
As shown in FIG. 3 and the like, the second LED substrate (second substrate) 42 includes a substrate body 112 having wiring layers on both front and rear surfaces. The substrate body 112 has a right edge portion 112a formed in a substantially arc shape along the upper left portion of the window hole 34, and a left edge portion 112b formed in a substantially vertical direction. It is gradually widening.

  As shown in FIG. 4, the board main body 112 has an upstream connector (board connection connector) 113, a downstream connector (board connection connector) 114, and an LED power source for connecting the connectors 113 and 114. Through-path wiring paths (predetermined wiring paths) 115 to 119 for LED driver power supply, signal, clock and ground, and through-pass wiring paths 116 to 119 for LED driver power supply, signal, clock and ground. For example, two LED drivers 120 and 121 that are branched and connected, and protective resistors 122 and 123 and LEDs 124 that are connected in series between the RGB terminals of the LED drivers 120 and 121 and the through-path wiring 115 for the LED power supply. To 127 and the speaker drive wiring path 1 connecting between the connectors 113 and 114 And 8a~128d is provided. A circuit unit including the LED drivers 120 and 121, the LEDs 124 to 127, the protective resistors 122 and 123, and the like connected to the through-pass wiring paths 115 to 119 is an example of the second circuit unit.

  The upstream connector 113 is connected to the downstream connector 74 on the first LED board 41 side by the harness 61, and has the same terminal configuration as the downstream connector 74. One of the downstream connectors 114 has a terminal configuration different from that of the upstream connector 113, for example, one LED power terminal 89 to which the LED power source through-path wiring 115 is connected, and a LED driver power source through-path wiring path. 116, for example, is connected to one LED driver power supply terminal 90, a signal through path wiring path (digital signal wiring path) 117 is connected to, for example, one signal terminal 91, and a clock through path wiring path (digital signal wiring). Path) 118 is connected to, for example, one clock terminal 92, ground through-pass wiring path 119 is connected to, for example, two ground terminals 93a and 93b, and speaker drive wiring paths 128a to 128d are connected to speaker terminals 94a. ~ 94d, and a total of 10 terminals, for example, 5 rows in 2 rows It is arranged. Then, two terminals on both ends in the terminal arrangement direction of the two rows, that is, a total of four terminals are speaker terminals 94a to 94d.

  As described above, in the second LED board 42, the number of terminals (here, the total number of terminals corresponding to the power supply system wiring paths in the upstream connector 113, that is, the through-path wiring paths 115, 116, and 119 for LED power supply, LED driver power supply, and ground). 6) is larger than the number of terminals corresponding to the wiring paths 115, 116, and 119 in the downstream connector 114 (four in this case).

  For the six terminals other than the speaker terminals 94a to 94d in the downstream connector 114, for example, the LED power terminal 89, the ground terminal 93a, and the LED driver power terminal 90 are arranged in that order in one row, and the other side. A signal terminal 91, a clock terminal 92, and a ground terminal 93b are arranged in that order in the column. Of course, the arrangement of the terminals in the connector 114 is arbitrary.

  FIG. 8 shows a specific wiring pattern of the second LED substrate 42 for each wiring layer. In the second LED board 42, the LEDs 124 to 127 and the like are arranged on the front wiring layer 111a (FIG. 8A) on the front side, and the upstream connector 113 and the downstream connector are arranged on the rear wiring layer 111b (FIG. 8B) on the back side. 114, LED drivers 120 and 121, protective resistors 122 and 123, and the like are arranged.

  For example, the upstream connector 113 is arranged on the lower end side of the back wiring layer 111b so that the terminal arrangement is in the left-right direction, and the downstream connector 114 is similarly arranged on the upper side of the back wiring layer 111b so that the terminal arrangement is in the left-right direction. Is arranged. Each terminal of the connectors 113 and 114 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (here, the left-right direction). For example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 113 from the outer side in the terminal arrangement direction (here, left and right direction), and upstream. For example, speaker drive wiring paths 128c and 128d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 113 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream connector 114 from the outside in the terminal arrangement direction (here, the left-right direction), and downstream. For example, speaker drive wiring paths 128c and 128d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 114 from the outside in the terminal arrangement direction (here, the left-right direction).

  In the second LED board 42, for example, the through-pass wiring path 115 for the LED power source has the same front surface as the LEDs 124 to 127 except for a predetermined range near both ends thereof, that is, in the vicinity of the connection portions to the connectors 113 and 114, for example. Although provided on the wiring layer 111 a side, the LED driver power supply, signal and clock through-pass wiring lines 116 to 118 in addition to the speaker driving wiring lines 128 a to 128 d are connected to the front wiring layer 111 a via the via 96. Except for some bypass parts to avoid on the side, almost all of them are provided on the back wiring layer 111b side.

  That is, the speaker drive wiring paths 128a and 128b are arranged along the right edge 112a on the back wiring layer 111b, and the speaker drive wiring paths 128c and 128d are arranged along the left edge 112b on the back wiring layer 111b. Yes. Further, the through-pass wiring paths 116 to 118 are arranged in the vertical direction between the speaker driving wiring paths 128a and 128b and the speaker driving wiring paths 128c and 128d, for example, on the rear wiring layer 111b. , 114.

  The LED driver power supply wiring path 131 branched from the LED driver power supply through-path wiring path 116 is connected to the power supply terminals of the LED drivers 120 and 121, and the signal wiring path 132 branched from the signal through-pass wiring path 117 is A clock wiring path 133 connected to the signal terminals of the LED drivers 120 and 121 and branched from the clock through-path wiring path 118 is connected to the clock terminals of the LED drivers 120 and 121.

  Here, the LED driver 120 and the protective resistor 122 corresponding thereto are arranged, for example, on the upper side of the downstream connector 114 in the rear wiring layer 111b, and the LED driver 121 and the corresponding protective resistor 123 are, for example, rear wiring layer 111b. Are disposed between the speaker drive wiring paths 128c and 128d and the through-pass wiring paths 116 to 118.

  Note that the LED power supply wiring 131, the signal wiring 132, and the clock wiring 133 corresponding to the LED driver 120 are provided substantially upward from the downstream connector 114 or the vicinity thereof, that is, in a substantially extending direction of the through-pass wirings 116 to 118. ing. Thus, since the downstream connector 114 of the second LED board 42 is disposed in the middle of the wiring path connecting the upstream connector 113 and the LED driver 120, the downstream connector 114 is located on the lowermost side of the second LED board 42. There is an advantage that the wiring path of the second LED substrate 42 is simplified as compared with the case where 114 is arranged.

  The back wiring layer 111b is provided with a plurality of solid ground patterns 134, for example. Each of the solid ground patterns 134 constitutes a ground through-pass wiring path (ground wiring path) 119 together with the solid ground pattern 135 on the front wiring layer 111a side. For example, via the via 96 and the solid ground pattern 135 The ground terminals 93a to 93c of the upstream connector 113, the ground terminals 93a and 93b of the downstream connector 114, and the ground terminals of the LED drivers 120 and 121 are connected.

  As shown in FIG. 9 and the like, a part of a solid ground pattern (first conductor pattern) 134 is disposed between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer 111a side are arranged. One or more vias (interlayer conductive portions) 96 that connect the solid ground pattern (ground wiring path, second conductor pattern) 135 to each other, for example, both inside and outside the arrangement region of the LED driver 120 are provided. ing. In addition, it is desirable to provide the via 96 outside the arrangement area of the LED driver 120 at one or a plurality of places including the vicinity of the arrangement area. The vias 96 corresponding to the arrangement area of the LED driver 120 are intensively arranged in the central area in the arrangement area of the LED driver 120 as shown in FIG. As described above, by arranging the via 96 in the arrangement region of the LED driver 120, heat conduction to the solid ground pattern 135 on the front wiring layer 111a side is promoted, and heat can be expected from the inner surface of the via 96. In addition, by arranging the vias 96 in a central area of the LED driver 120 having the highest temperature, the heat generated by the LED driver 120 can be radiated more efficiently. The vias 96 are arranged not only in the central area in the arrangement area of the LED driver 120 but also outside the peripheral area (peripheral area) in the arrangement area, and the vias 96 are located in the central area rather than the peripheral area. The arrangement density may be increased. Further, the via 96 that connects the solid ground pattern (first conductor pattern) 134 and the front wiring layer 111 a side may be provided only in the arrangement region of the LED driver 120.

  Further, the solid ground pattern 134 a among the plurality of solid ground patterns 134 of the back wiring layer 111 b is provided at a position corresponding to the LED driver 121. A portion of the solid ground pattern (first conductor pattern) 134a is disposed between the LED driver 121 and the substrate body 112, and the periphery thereof includes wiring including a clock through-pass wiring path (clock wiring path) 118. The front wiring layer 111a is formed by a path group, that is, a floating island shape surrounded by wiring paths such as speaker driving wiring paths 128c and 128d and through-pass wiring paths 116 to 118, and one or a plurality of vias (interlayer conductive portions) 96. It is electrically connected to a solid ground pattern (ground wiring path, second conductor pattern) 135 on the side. Thus, the LED driver 121 can be effectively dissipated through the solid ground pattern 134a, and adverse effects due to noise picked up by the solid ground pattern 134a can be eliminated as much as possible.

  Further, at least one via 96 that connects the solid ground pattern 134a on the back wiring layer 111b side and the solid ground pattern 135 on the front wiring layer 111a side is provided both inside and outside the LED driver 121 placement area. Is provided. The via 96 corresponding to the arrangement area of the LED driver 121 is arranged, for example, in the vicinity of one edge of the LED driver 121 in accordance with the arrangement of the solid ground pattern 135 on the front wiring layer 111a side. By providing the via 96 in the arrangement region of the LED driver 121, it is possible to dissipate the heat generated in the LED driver 121 more efficiently. Further, by providing the via 96 not only in the arrangement area of the LED driver 121 but also in the arrangement area, it is possible to more effectively eliminate the adverse effect due to noise picked up by the solid ground pattern 134a. Note that the via 96 for connecting the solid ground pattern 134a to the solid ground pattern 135 may be provided only in the arrangement region of the LED driver 121, for example.

  The LEDs 124 and 125 driven by the LED driver 120 are, for example, arranged on the upper side of the front wiring layer 111 a on the left and right sides, and are connected in series by an inter-LED wiring path 136. The LEDs 126 and 127 driven by the LED driver 121 are arranged vertically on the lower side of the front wiring layer 111a, for example, and are connected in series by an inter-LED wiring path 136. The LEDs 124 to 127 are full-color light emitting types that incorporate red, green, and blue LED elements. For example, on the anode side and the cathode side, the R electrode corresponding to red, the G electrode corresponding to green, and the blue color are used. Corresponding B electrodes are provided side by side so that, for example, the R electrode is in the center.

  In the second LED board 42, the speaker drive wiring paths 128a to 128d are digital signal wirings such as signal and clock through-path wiring paths 117 and 118, a signal wiring path 132, and a clock wiring path 133 for driving the LED. It is formed wider than the road.

  Further, the through-pass wiring path 115 for the LED power source is disposed so as to cut substantially the center of the front wiring layer 111a, and both ends thereof are connected to the connectors 113 and 114 on the rear wiring layer 111b side through vias 96 and the like. Yes. The LED power supply wiring path 137 branched from the LED power supply through-pass wiring path 115 is connected to, for example, the anode electrodes of the LEDs 125 and 127, and the cathode electrodes of the LEDs 124 and 126 are connected to the back wiring layer 111b with the via 96 interposed therebetween. Are connected to the protective resistors 122 and 123 via the cathode-side wiring path 138 straddling the side. The inter-LED wiring path 136, the LED power supply wiring path 137, and the cathode side wiring path 138 are provided with heat radiation portions 105 a and 105 b similar to the first LED substrate 41.

[Third LED substrate 43]
As shown in FIG. 3 and the like, the third LED substrate (third substrate) 43 includes, for example, a horizontally long and substantially rectangular substrate body 142 having wiring layers on both front and rear surfaces. As shown in FIG. 4, the board main body 142 has an upstream connector (board connection connector) 143, a pair of speaker connectors (stage connection connectors) 144 and 145, an LED driver 146, LEDs 147 to 150, protective resistors. 151, 152, etc. are provided.

  The upstream connector 143 is connected to the downstream connector 114 on the second LED board 42 side by the harness 62, and has the same terminal configuration as the downstream connector 114. The speaker connectors 144 and 145 are connected to the upper first speakers 36a and 36b by harnesses 63 and 64. The speaker connector 144 has speaker terminals 153a and 153b, and the speaker connector 145 has speaker terminals 153c and 153c. 153d is provided. The speaker terminals 153a and 153b of the speaker connector 144 are connected to the speaker terminals 94a and 94b of the upstream connector 143 via the speaker drive wiring paths 154a and 154b, and the speaker terminals 153c and 153d of the speaker connector 145 are speaker driven. It is connected to the speaker terminals 94c and 94d of the upstream connector 143 via the wiring paths 154c and 154d.

  FIG. 10 shows a specific wiring pattern of the third LED substrate 43 for each wiring layer. In the third LED substrate 43, the LEDs 147 to 150 and the like are arranged on the front wiring layer (second wiring layer) 141a (FIG. 10A) on the front side, and the back wiring layer (first wiring layer) 141b (FIG. b)), an upstream connector 143, speaker connectors 144 and 145, an LED driver 146, protective resistors 151 and 152, and the like are arranged.

  The upstream connector 143 is disposed, for example, on the left and right ends of the back wiring layer 141b so that the terminal arrangement is in the horizontal direction, and the speaker connectors 144, 145 are, for example, on the left and right ends of the back wiring layer 141b, the terminal arrangement is in the vertical direction. It is arranged to be. Each terminal of the speaker connectors 144 and 145 is, for example, rectangular like the upstream connector 143, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (vertical direction here).

  Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 143 from the outside in the terminal arrangement direction (here, left and right direction), and the speaker terminal 94c on the other end side of the upstream connector 143. , 94d are connected to speaker drive wiring paths 154c, 154d from the outside in the terminal arrangement direction (here, the left-right direction). Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 153a and 153b of the speaker connector 144 from the outside in the terminal arrangement direction (the vertical direction here), and the speaker terminals 153c and 153d of the speaker connector 145 are driven by the speaker. The wiring paths 154c and 154d are connected from the outside in the terminal arrangement direction (here, the vertical direction). Note that the speaker drive wiring paths 154a to 154d are substantially the same as the front wiring layers (second wiring layers) of the LEDs 147 to 150 except for a predetermined range near both ends of the speaker driving wiring paths 154a to 154d. ) 141a side.

  For example, the LED driver 146 is disposed substantially at the center of the back wiring layer 141b, and protective resistors 151 and 152 connected to the RGB terminals of the LED driver 146 are disposed on the left and right sides of the LED driver 146, for example. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 146 of the upstream connector 143 are connected by the LED driver power supply, signal, and clock wiring paths 155 to 157. . Note that the LED driver power supply, signal, and clock wiring paths 155 to 157 are substantially entirely back wiring except for some bypass portions that are avoided to the front wiring layer 141a side via vias 96, for example. It is provided on the layer 141b side.

  One or a plurality of solid ground patterns 158 are provided on the back wiring layer 141b. The solid ground pattern 158 constitutes the ground wiring path 160 together with the solid ground pattern 159 and the like on the front wiring layer 141a side, and for example, the ground terminals 93a and 93b of the upstream connector 143 via the via 96, the solid ground pattern 159 and the like. And the ground terminal of the LED driver 146.

  A part of the solid ground pattern (first conductor pattern) 158 is disposed between the LED driver 146 and the substrate body 142. Of the vias 96 that connect the solid ground pattern 158 and the solid ground pattern (ground wiring path, second conductor pattern) 159 on the front wiring layer 141a side, the vias arranged in the arrangement region of the LED driver 146. 96 are intensively arranged, for example, in a central area in the arrangement area of the LED driver 146.

  The LEDs 147 to 150 are arranged, for example, in a zigzag shape in the longitudinal direction of the front wiring layer 141a. For example, the left LEDs 147 and 148 are connected in series by an inter-LED wiring path 161, and the right LEDs 149 and 150 are connected to each other, for example. The lines 161 are connected in series. The LEDs 147 to 150 are full-color light emitting types that incorporate red, green, and blue LED elements. For example, the R electrode corresponding to red, the G electrode corresponding to green, and the blue electrode on both the anode side and the cathode side, for example. Corresponding B electrodes are provided side by side so that, for example, the R electrode is in the center. Further, the anode electrodes of the LEDs 148 and 149 are connected to the LED power terminal 89 of the upstream connector 143 via the via 96 and the LED power wiring path 162 extending over the back wiring layer 141b. The cathode electrode is connected to the protective resistors 151 and 152 via the cathode side wiring path 163 across the back wiring layer 111b with the via 96 interposed therebetween. The inter-LED wiring path 161, the LED power supply wiring path 162, and the cathode-side wiring path 163 are provided with heat radiation portions 105a and 105b similar to the first LED substrate 41 and the like.

  In the third LED substrate 43, the speaker drive wiring paths 154a to 154d are formed wider than the digital signal wiring paths such as the signal wiring paths 156 and 157 for driving the LEDs.

  In the first to third LED boards 41 to 43 described above, through-pass wiring paths are provided across the first to third LED boards 41 to 43, but the current value is larger as the LED board on the upstream side is larger. Therefore, the through-path wiring path of the power supply system in the upstream LED board is formed wider than the through-pass wiring path of the power supply system in the downstream LED board. For example, the LED power supply and LED driver power supply through-pass wiring lines 75 and 76 on the first LED board 41 are wider than the LED power supply and LED driver power supply through-pass wiring lines 115 and 116 on the second LED board 42. Is formed.

  Further, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through-path wiring path of the power supply system is larger in the upstream connector than in the downstream connector. For example, the total number of LED power terminals 89a and 89b and LED driver power terminals 90 in the connectors 74 and 113 for connecting the first and second LED boards 41 and 42 is three, whereas the second and second LED power terminals 90 and 90 are three. The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 114 and 143 for connecting the 3LED substrates 42 and 43 is two.

  As a result, while securing the necessary voltage for each LED board, it is not necessary to use a power system wiring path thicker than necessary or a connector larger than necessary in the downstream LED board, thereby increasing the wiring space efficiency. It is possible.

[Fourth LED substrate 44]
As shown in FIG. 3, the fourth LED substrate 44 includes, for example, a vertically long and substantially rectangular substrate body 172 having wiring layers on both front and rear sides. As shown in FIG. 11, the board main body 172 includes an upstream connector (board connection connector) 173, a downstream connector (board connection connector) 174, and an LED power source for connecting the connectors 173 and 174. LED driver power supply, signal, clock and ground through-pass wiring paths (predetermined wiring paths) 175 to 179 and LED driver power supply, signal, clock and ground through-pass wiring paths 176 to 179 For example, one LED driver 180 connected in series, protective resistors 181 and 182 and LEDs 183 to 186 connected in series between the LED driver 180 and a through-pass wiring path 175 for LED power supply, For example, an example in which two sets of six RGB terminals and a downstream connector 174 are connected 2 sets six LED driving wiring path 187a~187c, 188a~188c and, and the blowing power line path 189a connecting the connectors 173, 174 and the blower ground wiring path 189b is provided if.

  The upstream connector 173 includes, for example, two LED power supply terminals 89a and 89b to which the LED power supply through-pass wiring path 175 is connected, and one LED driver power supply terminal 90 to which the LED driver power supply through-pass wiring path 176 is connected. For example, one signal terminal 91 to which a signal through-path wiring path 177 is connected, one clock terminal 92 to which a clock through-path wiring path 178 is connected, and a ground through-pass wiring path 179 are connected. For example, three ground terminals 93a to 93c, a blower power supply terminal 190a to which the blower power supply wiring path 189a is connected, and a blower ground terminal 190b to which the blower ground wiring path 189b is connected, and a total of ten of them. The terminals are arranged in a line, for example. And each one of the both ends in the terminal arrangement direction is a blowing power supply terminal 190a and a blowing ground terminal 190b. Regarding the eight terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the upstream connector 173, for example, LED power supply terminals 89a and 89b, ground terminal 93a, LED driver power supply terminal 90, ground terminal 93b, signal terminal 91, clock Terminals 92 and ground terminals 93c are arranged in that order.

  The downstream connector 174 includes, for example, one LED power supply terminal 89 to which a through-pass wiring path 175 for LED power supply is connected, and one LED driver power supply terminal 90 to which a through-pass wiring path 176 for LED driver power supply is connected. For example, one signal terminal 91 to which a signal through-path wiring path 177 is connected, one clock terminal 92 to which a clock through-path wiring path 178 is connected, and a ground through-pass wiring path 179 are connected. For example, two ground terminals 93a, 93b, for example, two sets of six LED drive wiring paths 187a-187c, 188a-188c, for example, two sets of six LED connection terminals 191a-191c, 192a-192c, and air blowing The blower power supply terminal 190a to which the power supply wiring path 189a is connected, And a blower ground terminal 190b of the ground wiring path 189b is connected, they are arranged in their total of 14 amino terminal, for example, seven by two columns. And two of the one end side in the terminal arrangement direction of these two rows becomes the ventilation power supply terminal 190a and the ventilation ground terminal 190b.

  As described above, in the fourth LED board 44, the number of terminals (here, the total number of terminals corresponding to the power supply system wiring path in the upstream connector 173, that is, the through-path wiring paths 175, 176, and 179 for LED power supply, LED driver power supply, and ground, respectively. 6) is larger than the number of terminals corresponding to the wiring paths 175, 176, 179 in the downstream connector 174 (four in this case). For the 12 terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the downstream connector 174, for example, the LED power supply terminal 89, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, and the signal terminal are arranged in one row. 91, clock terminals 92 are arranged in that order, and two sets of six LED connection terminals 191a to 191c and 192a to 192c are arranged in the other column.

  FIG. 12 shows a specific wiring pattern of the fourth LED substrate 44 for each wiring layer. In the fourth LED board 44, the LEDs 183 to 186 are arranged on the front wiring layer 171a (FIG. 12A) on the front side, and the upstream connector 173 and the downstream connector 174 are arranged on the rear wiring layer 171b (FIG. 12B) on the back side. LED driver 180, protective resistors 181, 182 and the like are respectively arranged.

  For example, the upstream connector 173 is arranged on the lower end side of the back wiring layer 171b so that the terminal arrangement is in the horizontal direction, and the downstream connector 174 is arranged on the upper end side of the back wiring layer 171b so that the terminal arrangement is in the vertical direction. Has been.

  Each terminal of the connectors 173 and 174 has, for example, a rectangular shape and is formed in an elongated shape in a direction orthogonal to the arrangement direction. The blower power supply wiring path 189a and the blower ground wiring path 189b are connected to the blower power supply terminal 190a and the blower ground terminal 190b on both ends of the upstream connector 173 from the outside in the terminal arrangement direction (here, the horizontal direction in this case). Similarly, for example, the blower power supply terminal 190a and the blower ground terminal 190b on the lower end side of the downstream connector 174 have a blower power supply wiring path 189a and a blower ground wiring path 189b outside the terminal arrangement direction (herein, the vertical direction). Connected from. As described above, the blower power supply wiring path 189a and the blower ground wiring path 189b are connected to the outermost terminals 190a and 190b in the arrangement direction of the plurality of terminals of the connectors 173 and 174 from the outside in the terminal arrangement direction. Since they are connected, it is easy to avoid interference with other wiring paths, although the blowing power supply wiring path 189a and the blowing ground wiring path 189b are formed wide. Further, since the blower power supply terminal 190a and the blower ground terminal 190b are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the blower power supply wiring path 189a and the blower ground wiring path 189b are connected to the blower power supply terminal 190a, By connecting to the long side of the blower ground terminal 190b, a larger cross-sectional area of the connecting portion can be secured.

  In the fourth LED board 44, through-path wiring paths 175 to 178 for LED power supply, LED driver power supply, signal and clock are provided via vias 96 in addition to the blowing power supply wiring path 189 a and the blowing ground wiring path 189 b. Except for a part of the bypass portion to be avoided on the front wiring layer 171a side, substantially all of them are provided on the rear wiring layer 171b side. That is, the blower power supply wiring path 189a and the blower ground wiring path 189b are arranged along the left edge 172a of the substrate body 172 on the back wiring layer 171b, and are used for LED power supply, LED driver power supply, signal use, and the like. The through-pass wiring paths 175 to 178 for the clock are also disposed along the right edge 172b of the substrate body 172 on the back wiring layer 171b.

  The LED driver power supply wiring path 193 branched from the LED driver power supply through-path wiring path 176 is connected to the power supply terminal of the LED driver 180, and the signal wiring path 194 branched from the signal through-path wiring path 177 is connected to the LED driver. A clock wiring path 195 connected to the signal terminal 180 and branched from the clock through-path wiring path 178 is connected to the clock terminal of the LED driver 180.

  Here, the LED driver 180 and the corresponding protective resistors 181 and 182 are, for example, the back wiring layer 171b so as to be sandwiched between the blowing power supply wiring path 189a, the blowing ground wiring path 189b, and the through-pass wiring paths 175 to 178. It is arrange | positioned in the approximate center.

  In addition, one or more solid ground patterns 196 are provided on the back wiring layer 171b. The solid ground pattern 196 constitutes a ground through-pass wiring path (ground wiring path) 179 together with the solid ground pattern 197 on the front wiring layer 171a side. For example, the solid ground pattern 196 is upstream via the via 96 and the solid ground pattern 197. The ground terminals 93 a to 93 c of the connector 173, the ground terminals 93 a and 93 b of the downstream connector 174, and the ground terminal of the LED driver 180 are connected.

  A part (or all) of the solid ground pattern 196 of the back wiring layer 171b is disposed between the LED driver 180 and the board body 172, and the periphery of the solid ground pattern 196 includes a through-pass wiring path 178 for clocks. That is, they are surrounded by wiring paths such as a blowing power supply wiring path 189a, a blowing ground wiring path 189b, and through-pass wiring paths 175 to 178. The solid ground pattern 196 is electrically connected to the ground terminals 93a to 93c of the upstream connector 173 and the ground terminals 93a and 93b of the downstream connector 174 via vias 96, a solid ground pattern 197, and the like. Furthermore, of the vias 96 that connect the solid ground pattern 196 and the solid ground pattern (ground wiring path, second conductor pattern) 197 on the front wiring layer 171a side, the vias 96 that are arranged in the arrangement region of the LED driver 180. However, for example, the LED driver 180 is intensively arranged in the central area in the arrangement area of the LED driver 180. Accordingly, the LED driver 180 can effectively dissipate heat through the solid ground pattern 196 and the via 96, and adverse effects due to noise picked up by the solid ground pattern 196 can be eliminated as much as possible.

  The LEDs 183 to 186 driven by the LED driver 180 are arranged in a line at a substantially constant interval in the longitudinal direction (vertical direction) of the front wiring layer 171a, for example. The upper LEDs 183 and 184 and the lower LEDs 185 and 186 are connected by an inter-LED wiring path 198, respectively. The LEDs 183 to 186 are full-color light emitting types that incorporate red, green, and blue LED elements. For example, on both the anode side and the cathode side, the R electrode corresponding to red, the G electrode corresponding to green, and the blue color Corresponding B electrodes are provided side by side so that, for example, the R electrode is in the center.

  Further, the anode electrodes of the LEDs 183 and 186 are connected to the through-pass wiring path 175 for the LED power supply via the LED power supply wiring path 200 straddling the back wiring layer 171b side via the via 96, and the cathodes of the LEDs 184 and 185. The electrode is connected to the protective resistors 181 and 182 via the cathode side wiring path 201 straddling the back wiring layer 171b side with the via 96 interposed therebetween. The LED power supply wiring path 200 and the cathode-side wiring path 201 are provided with heat radiation portions 105a and 105b similar to those of the first LED substrate 41 and the like.

  For example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c are arranged on the front wiring layer (second wiring layer) 171a. The LED drive wiring paths 187a to 187c and 188a to 188c are connected to the RGB terminals 180a to 180f of the LED driver 180 on the back wiring layer 171b side via the vias (interlayer conduction portions) 96a to 96f on the upstream end side, respectively (see FIG. 13 (b2)), the downstream end side is connected to the LED connection terminals 191a to 191c and 192a to 192c of the downstream connector 174 on the back wiring layer (first wiring layer) 171b side via vias (interlayer conductive portions) 96g to 96l, respectively. (FIG. 13 (a2)).

  As shown in FIG. 13 (a2), the LED drive wiring paths 187a to 187c and 188a to 188c are, for example, in the terminal arrangement direction (vertical direction here) from the LED connection terminals 191a to 191c and 192a to 192c of the downstream connector 174. They are pulled out in parallel in the orthogonal direction (here, laterally) and connected to the vias 96g to 96l, respectively. These vias (interlayer conductive portions) 96g to 96l are arranged in the terminal arrangement direction of the downstream connector 174 (here, the vertical direction). ) For example in a row so as to be inclined with respect to.

  Here, the diameters of the vias 96g to 96l are based on the pitch of the LED drive wiring paths 187a to 187c and 188a to 188c in the vicinity of the downstream connector 174 (here, the same as the pitch of the LED connection terminals 191a to 191c and 192a to 192c). As described above, the vias 96g to 96l can be arranged with high space efficiency while avoiding mutual interference by being arranged obliquely with respect to the terminal arrangement direction of the downstream connector 174. .

  On the front wiring layer 171a side, as shown in FIG. 13 (a1), the LED driving wiring except for the LED driving wiring path (specific wiring path) 188c on one end side among the LED driving wiring paths 187a to 187c and 188a to 188c. The paths (predetermined wiring paths) 187a to 187c, 188a, and 188b are led out from the vias 96g to 96k, for example, in an obliquely downward direction (first direction), and substantially parallel to each other, and further downward, for example, via the refracting portions 271a to 271e ( Are arranged substantially parallel to each other in the second direction). Further, the LED drive wiring path (specific wiring path) 188c on one end side is drawn, for example, downward (second direction) from the via 96l. The refracting portions 271a to 271e are arranged in a substantially straight line, and a via 96l corresponding to the LED drive wiring path (specific wiring path) 188c is arranged on the straight line.

  Here, both the first direction (diagonally downward) and the second direction (downward) are the directions in which the LED drive wiring paths 187a to 187c and 188a to 188c are pulled out from the downstream connector 174 on the back wiring layer 171b side (sideways). However, one of the first direction and the second direction may be the same as the pull-out direction.

  Further, as shown in FIG. 13 (b2), the LED drive wiring paths 187a to 187c and 188a to 188c are parallel to, for example, the direction orthogonal to the terminal arrangement direction (here, the horizontal direction) from the RGB terminals 180a to 180f of the LED driver 180. Are connected to vias 96a to 96f, respectively, and these vias (interlayer conductive portions) 96a to 96f are formed in a zigzag shape along the terminal arrangement direction of the RGB terminals 180a to 180f in the LED driver 180 (here, the horizontal direction). Is arranged. Note that the via 96a and the via 96b, the via 96c and the via 96d, and the via 96e and the via 96f are examples of the first inclined arrangement portion in the first oblique direction (for example, upward to the right in FIG. 13B2). The via 96c, the via 96d, and the via 96e are examples of the second inclined arrangement portion in the second oblique direction (for example, lower right in FIG. 13B2).

  Here, the diameters of the vias 96a to 96f are based on the pitch of the LED drive wiring paths 187a to 187c and 188a to 188c in the vicinity of the RGB terminals 180a to 180f of the LED driver 180 (here, the same as the pitch of the RGB terminals 180a to 180f). Thus, by arranging the RGB terminals 180a to 180f in a zigzag shape along the terminal arrangement direction, the vias 96a to 96f can be arranged with high space efficiency while avoiding mutual interference. Yes.

  On the front wiring layer 171a side, as shown in FIG. 13 (b1), the LED drive wiring paths 187a to 187c and 188a to 188c are led out from the vias 96a to 96f, for example, in an upward direction (first direction) substantially parallel to each other. Furthermore, they are arranged substantially parallel to each other, for example, obliquely upward (second direction) via the refracting portions 272a to 271f. The refracting portions 272a to 272f are arranged in a substantially linear shape. Note that the first direction is the same as the direction in which the LED drive wiring paths 187a to 187c and 188a to 188c are drawn from the LED driver 180 on the back wiring layer 171b side, and the second direction is different from the same drawing direction. The first direction and the second direction may be different from the pull-out direction.

  The inter-LED wiring path 198, the LED power supply wiring path 200, and the cathode-side wiring path 201 are provided with heat radiation portions 105a and 105b similar to the first LED substrate 41 and the like. In the fourth LED board 44, the blowing power supply wiring path 189a and the blowing ground wiring path 189b are signals for driving the LEDs 183 to 186, clock through-path wiring paths 177 and 178, a signal wiring path 194, a clock It is formed wider than the digital signal wiring path such as the wiring path 195.

[Fifth LED board 45]
As shown in FIG. 3, the fifth LED substrate 45 includes, for example, a vertically long and substantially rectangular substrate body 212 having wiring layers on both front and rear sides. As shown in FIG. 11, the board main body 212 has an upstream connector (board connection connector) 213, a downstream connector (board connection connector) 214, and an LED power source for connecting the connectors 213 and 214. Through-pass wiring paths (predetermined wiring paths) 215 to 219 for LED driver power supply, signal, clock and ground, and protection connected in series between the through-pass wiring path 215 for LED power supply and the upstream connector 213 Resistors 220 and 221, LEDs 223 to 226, and a blower connector (effect means connecting connector) 227 are provided.

  The upstream connector 213 is connected to the downstream connector 174 on the fourth LED board 44 side by the harness 66, and has the same terminal configuration as the downstream connector 174. One downstream connector 214 is different from the terminal configuration of the upstream connector 213, for example, one LED power terminal 89 to which the LED power source through-pass wiring path 215 is connected, and a LED driver power source through-path wiring path. For example, one LED driver power supply terminal 90 to which 216 is connected, one signal terminal 91 to which a signal through-pass wiring path 217 is connected, and one clock terminal to which a clock through-pass wiring path 218 is connected, for example. 92 and, for example, two ground terminals 93a and 93b to which a through-pass wiring path 219 for ground is connected, and a total of six terminals are arranged in one row, for example. For the six terminals of the downstream connector 214, for example, an LED power terminal 89, a ground terminal 93a, an LED driver power terminal 90, a ground terminal 93b, a signal terminal 91, and a clock terminal 92 are arranged in that order.

  The blower connector 227 is connected to the blower unit 37a of the blower effect unit 37 by the harness 68, and is provided with a blower power supply terminal 229a and a blower ground terminal 229b. The blower power supply terminal 229a of the blower connector 227 is connected to the blower power supply terminal 190a of the upstream connector 213 via the blower power supply wiring path 228a, and the blower ground terminal 229b is upstream of the blower ground wiring path 228b. The blast ground terminal 190b of the connector 213 is connected.

  FIG. 14 shows a specific wiring pattern of the fifth LED substrate 45 for each wiring layer. In the fifth LED board 45, LEDs 223 to 226 and protective resistors 220 and 221 are provided on the front wiring layer 211a (FIG. 14A) on the front side, and an upstream connector is provided on the rear wiring layer 211b (FIG. 14B) on the back side. 213, a downstream connector 214, a blower connector 227, and the like are arranged.

  For example, the upstream connector 213 is arranged so that the terminal arrangement is vertically arranged on the lower end side of the back wiring layer 211b, and the downstream connector 214 is arranged so that the terminal arrangement is vertically arranged on one side of the upper end portion of the back wiring layer 211b, for example. For example, the blower connector 227 is arranged on one side of the upper end portion of the back wiring layer 211b so that the terminal arrangement is in the vertical direction.

  Each terminal of the connectors 213, 214, and 227 has, for example, a rectangular shape and is formed in an elongated shape in a direction orthogonal to the arrangement direction. For example, the blower power supply wiring path 228a and the blower ground wiring path 228b are connected to the blower power supply terminal 190a and the blower ground terminal 190b on the lower end side of the upstream connector 213 from the outside of the terminal arrangement direction (here, the vertical direction). The blower power supply terminal 229a and the blower ground terminal 229b of the blower connector 227 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). .

  In the fifth LED board 45, for example, the rear wiring layer 211b, which is substantially entirely different from the LEDs 223 to 226, for example, about the blowing power supply wiring path 228a, the blowing ground wiring path 228b, and the through-pass wiring path 215 for LED power supply. For the LED driver power supply, signal and clock through-pass wiring paths 216 to 218, for example, except for a predetermined range near both ends thereof, that is, in the vicinity of the connection portions to the connectors 213 and 214, The substantially whole is provided in the same front wiring layer 211a side as LED223-226.

  That is, the blower power supply wiring path 228a is disposed on the back wiring layer 211b along the right edge 212b of the substrate body 212, and the blower ground wiring path 228b is disposed on the back wiring layer 211b of the left edge 212a of the substrate body 212. Are arranged along. Further, the through-pass wiring path 215 for LED power supply is disposed along the wiring path 228a for blowing power, for example, on the back wiring layer 211b. The LED power supply wiring paths 231 and 232 branched from the LED power supply through-pass wiring path 215 are connected to, for example, the anode electrodes of the LEDs 223 and 225 through the via 96.

  Further, the LED driver power supply, signal and clock through-pass wiring paths 216 to 218 are arranged vertically on the front wiring layer 211a, for example, on the right edge 212b side, and the upstream end side thereof is connected to the back wiring via the via 96, respectively. The LED driver power supply terminal 90 of the upstream connector 213 is connected to the LED driver power supply terminal 90, the signal terminal 91, and the clock terminal 92 on the layer 211b side, and the downstream end side is connected to the LED driver power supply terminal of the downstream connector 214 on the back wiring layer 211b side via the via 96, respectively. 90, a signal terminal 91, and a clock terminal 92, respectively.

  One or more solid ground patterns 233 are provided on the front wiring layer 211a. The solid ground pattern 233 constitutes a ground through-pass wiring path (ground wiring path) 219 together with the solid ground pattern 234 on the back wiring layer 211b side. For example, the connector 213 is connected via the via 96, the solid ground pattern 234, and the like. , 214 are connected to ground terminals 93a, 93b.

  The LEDs 223 to 226 are arranged in a line at a substantially constant interval in the longitudinal direction (vertical direction) of the front wiring layer 211a, for example. The upper LEDs 223 and 224 and the protective resistors 220 disposed on the lower side thereof are connected in series by the inter-LED wiring path 235 and the cathode side wiring path 236, and are disposed on the lower LEDs 225 and 226 and the lower side thereof. The protective resistor 221 is connected in series by the inter-LED wiring path 237 and the cathode side wiring path 238. As shown in FIGS. 14 and 15, the protective resistor 220 extends from the front wiring layer (second wiring layer) 211a to the back wiring layer (first wiring layer) 211b side with the vias 96m to 96o interposed therebetween. The LED drive wiring paths 239a to 239c are connected to the LED connection terminals 191a to 191c of the upstream connector 213, and the protective resistor 221 is connected to the rear wiring layer (the second wiring layer) 211a with the vias 96p to 96r interposed therebetween. The first wiring layer 211b is connected to the LED connection terminals 192a to 192c of the upstream connector 213 by LED drive wiring paths 240a to 240c extending over the 211b side.

  As shown in FIG. 15B, the LED drive wiring paths 239a to 239c and 240a to 240c are arranged, for example, in the terminal arrangement direction (vertical direction here) from the LED connection terminals 191a to 191c and 192a to 192c of the upstream connector 213. They are drawn out in parallel to the orthogonal direction and connected to vias (interlayer conductive portions) 96m to 96r, respectively, and these vias 96m to 96r constitute vias 96m to 96o constituting the first via group (interlayer conductive portion group). And the vias 96p to 96r constituting the second via group (interlayer conductive portion group) are substantially parallel to each other and oblique to the terminal arrangement direction (the vertical direction in this case) of the upstream connector 213, respectively. Are arranged in two columns.

  Here, the diameters of the vias 96m to 96r are based on the pitch of the LED drive wiring paths 239a to 239c and 240a to 240c in the vicinity of the upstream connector 213 (here, the same as the pitch of the LED connection terminals 191a to 191c and 192a to 192c). In this way, by arranging a plurality of via groups obliquely with respect to the terminal arrangement direction of the upstream connector 213 and substantially parallel to each other, the vias 96m to 96r can be prevented from interfering with each other and high space efficiency can be achieved. It is possible to arrange with.

  On the front wiring layer 211a side, as shown in FIG. 15A, the LED drive wiring paths 239a to 239c are led out from the vias 96m to 96o, for example, upward in parallel with each other, and the LED drive wiring paths 240a to 240c. Are drawn from the vias 96p to 96r, for example, in a downward direction substantially parallel to each other. Thus, the lead-out directions of the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are different between the first via group and the second via group.

  The LED power supply wiring paths 231 and 232, the inter-LED wiring paths 235 and 237, and the cathode side wiring paths 236 and 238 are provided with heat radiation portions 105a and 105b similar to the first LED substrate 41 and the like. Further, in the fifth LED board 45, the blower power supply wiring path 228a and the blower ground wiring path 228b are wider than the digital signal wiring paths such as the signal and clock through-pass wiring paths 217 and 218 for driving the LED. Is formed.

[Sixth LED board 46]
As shown in FIG. 3, the sixth LED substrate 46 includes, for example, a substantially donut-shaped substrate body 242 having wiring layers on both front and rear surfaces. As shown in FIG. 11, the board main body 242 is provided with an upstream connector 243, LED drivers 244, LEDs 245 to 248, protective resistors 249 and 250, and the like. The upstream connector 243 is connected to the downstream connector 214 on the fifth LED substrate 45 side by the harness 67, and has the same terminal configuration as the downstream connector 214.

  FIG. 16 shows a specific wiring pattern of the sixth LED substrate 46 for each wiring layer. In the sixth LED board 46, the LEDs 245 to 248 are arranged on the front wiring layer 241a (FIG. 16A) on the front side, and the upstream connector 243, the LED driver 244 are arranged on the rear wiring layer 241b (FIG. 16B) on the back side. Protection resistors 249, 250, etc. are arranged respectively.

  The upstream connector 243 is disposed, for example, on the lower side of the back wiring layer 241 b so that the terminal arrangement is substantially in the circumferential direction of the substrate body 242. The LED driver 244 is disposed at a position away from the upstream connector 243 in the back wiring layer 241b. For example, protective resistors 249 and 250 connected to the RGB terminals of the LED driver 244 are disposed on both sides thereof. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 244 of the upstream connector 243 are connected by the wiring paths 251 to 253 for the LED driver power supply, the signal, and the clock. The LED driver power supply, signal, and clock wiring paths 251 to 253 are, for example, substantially all provided on the back wiring layer 241b side.

  The LEDs 245 to 248 are arranged, for example, at a substantially constant interval in the circumferential direction of the front wiring layer 241a. For example, the LEDs 245 and 246 and the LEDs 247 and 248 are connected by an inter-LED wiring path 254, respectively. The LEDs 245 to 248 are full-color light emitting types that incorporate red, green, and blue LED elements. For example, on both the anode side and the cathode side, an R electrode corresponding to red, a G electrode corresponding to green, and a blue color are used. Corresponding B electrodes are provided side by side so that, for example, the R electrode is in the center. Further, the anode electrodes of the LEDs 246 and 247 are connected to the LED power terminal 89 of the upstream connector 243 via the via 96 and the LED power wiring line 255 extending over the back wiring layer 241b. The cathode electrode is connected to the protective resistors 249 and 250 via a cathode side wiring path 256 that straddles the back wiring layer 241b side with the via 96 interposed therebetween. The inter-LED wiring path 254, the LED power supply wiring path 255, and the cathode-side wiring path 256 are provided with heat radiation portions 105a and 105b similar to the first LED substrate 41 and the like.

  For example, a solid ground pattern 257 is provided on the front wiring layer 241a. The solid ground pattern 257 constitutes a ground wiring path 259 together with the solid ground pattern 258 on the back wiring layer 241b side, and the ground terminals 93a, 93a of the upstream connector 243 via the via 96, the solid ground pattern 258, etc., for example. 93b and the ground terminal of the LED driver 244.

  A part of the solid ground pattern (first conductor pattern) 258 is disposed between the LED driver 244 and the substrate body 242. Of the vias 96 that connect the solid ground pattern 258 and the solid ground pattern (ground wiring path, second conductor pattern) 257 on the front wiring layer 241a side, the vias arranged in the arrangement region of the LED driver 244. 96 is arranged, for example, in the vicinity of one edge of the LED driver 244 in accordance with the arrangement of the solid ground pattern 257 on the front wiring layer 241a side, for example.

  In the right wiring path 58 described above, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through-path wiring path of the power supply system is that of the upstream connector rather than the downstream connector. There are more. For example, the total number of LED power terminals 89a and 89b and LED driver power terminals 90 in the connector 173 for connecting the front door relay board 56 and the fourth LED board 44 is three, whereas the fourth and fifth LEDs The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 174 and 213 for connecting the substrates 44 and 45 is two.

  Accordingly, it is possible to increase the space efficiency of the wiring because it is not necessary to use a connector larger than necessary in the downstream LED board while securing a necessary voltage for each LED board.

  FIG. 17 illustrates the second embodiment of the present invention. A part of the first embodiment is modified to provide a conductor part on the back surface of the LED driver, and the conductor part and the solid ground pattern are connected by solder. An example is shown.

  The LED driver 120 of the second LED substrate 42 (see FIG. 8) will be described as an example. The LED driver (heat-generating component) 120 of this embodiment includes a copper foil and other conductors 261 on the back surface thereof. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Of course, the shape of the conductor part 261 is arbitrary, and the conductor part 261 may be provided on substantially the entire back surface of the LED driver 120.

  Further, at the position where the LED driver 120 is disposed on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262 in which a part of the solid ground pattern 134 is exposed from the insulating film 106 is, for example, a conductor portion on the LED driver 120 side. 261 corresponding to H.261. In the solid ground pattern 134, the vias 96 are intensively arranged in the central region in the arrangement region of the LED driver 120. In this embodiment, the conductor is exposed so as to include the arrangement region of the vias 96. A portion 262 is provided.

  The conductor part 261 on the LED driver 120 side and the conductor exposed part 262 on the back wiring layer 111b side which are opposed to each other are connected by, for example, solder (conduction connecting means) 263. Thereby, since heat conduction from the LED driver 120 to the solid ground pattern 134 is promoted as compared with the first embodiment, heat generated in the LED driver 120 can be radiated more efficiently.

  The same configuration can be adopted for the LED drivers arranged on the other LED boards 41, 43, etc. in addition to the other LED drivers 121 of the second LED board 42.

  FIG. 18 illustrates a third embodiment of the present invention. A part of the second embodiment is modified so that a plurality of vias (interlayer conductive portions) provided in the LED driver arrangement region are replaced with the LED driver. An example is shown in which it is arranged not in the central area in the arrangement area but in the peripheral area in the arrangement area.

  In the second LED substrate 42 of the second embodiment, as shown in FIG. 17, a part of the solid ground pattern 134 is disposed between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer are arranged. Vias 96 that connect to the solid ground pattern 135 on the 111a side are concentrated in the central area in the arrangement area of the LED driver 120. In this embodiment, as shown in FIG. 96 are arranged substantially equally in the peripheral area outside the central area in the arrangement area, not in the central area in the arrangement area of the LED driver 120.

  Moreover, the LED driver 120 of this embodiment is equipped with the copper foil and other conductor parts 261 on the back surface similarly to 2nd Embodiment. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Further, at the position where the LED driver 120 is disposed on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262 in which a part of the solid ground pattern 134 is exposed from the insulating film 106 is, for example, a conductor portion on the LED driver 120 side. 261 corresponding to H.261. In addition, the conductor exposed part 262 of this embodiment is provided in the range which does not reach the via | veer 96 provided in the peripheral region in the arrangement | positioning area | region of the LED driver 120. FIG.

  The conductor part 261 on the LED driver 120 side and the conductor exposed part 262 on the back wiring layer 111b side which are opposed to each other are connected by, for example, solder (conduction connecting means) 263. As described above, when the plurality of vias (interlayer conductive portions) 96 provided in the arrangement area of the LED driver 120 are arranged in the peripheral area in the arrangement area of the LED driver, as in the second embodiment. Although it may be inferior in terms of heat dissipation effect compared to the case where it is arranged in the central region, it is considered to be superior in terms of eliminating the adverse effect on the LED driver 120 due to noise picked up by the solid ground pattern 134.

  Further, since the via 96 is not applied in the connection region by the solder 263, the LED driver 120 is more firmly fixed as compared with the case where the via 96 is applied in the connection region by the solder 263 as in the second embodiment. it can. In that sense, this embodiment is more effective for large exothermic parts.

  The vias 96 may be arranged not only in the peripheral area in the arrangement area of the LED driver 120 but also in the central area inside thereof, and the arrangement density of the vias 96 may be higher in the peripheral area than in the central area. . In this case, for example, a part of the via 96 may be placed in a connection region by the solder (conducting connection means) 263. Further, in this embodiment, the example in which the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side are connected by solder (conduction connecting means) 263 is shown, but as in the first embodiment It is not necessary to perform connection by the conductive connection means.

  FIG. 19 illustrates the fourth embodiment of the present invention. The first embodiment is partially modified so that the substrate body of the LED substrate includes three or more intermediate layers in addition to the front and rear surface layers. The wiring layer is provided, and the drive wiring path and the ground wiring path for the speaker (predetermined presentation means) are provided in the intermediate layer.

  FIG. 19 shows a specific wiring pattern for the third LED substrate 43 of this embodiment for each wiring layer. The third LED substrate 43 of the present embodiment includes, for example, one intermediate layer 141c in addition to the front wiring layer 141a on the front side and the back wiring layer 141b on the back side.

  Like the front wiring layer 141a of the first embodiment, the front wiring layer 141a includes the LEDs 147 to 150 and the LED power wiring wiring 162, the inter-LED wiring wiring 161, the cathode wiring wiring 163, and the solid ground pattern. 159 etc. are arranged, but the speaker drive wiring paths 154a to 154d are not provided. Similarly to the second embodiment, the rear wiring layer 141b has an upstream connector 143, speaker connectors 144 and 145, LED driver 146, protective resistors 151 and 152, LED driver power supply, signal and clock wiring. Paths 155 to 157, a solid ground pattern 158, and the like are arranged.

  Further, speaker drive wiring paths 154a to 154d and a solid ground pattern 264 are provided in the intermediate layer 141c. The speaker drive wiring paths 154a and 154b have one end side thereof connected to the speaker terminals 94a and 94b of the upstream connector 143 on the back wiring layer 141b side via the via 96 or the like, and the other end side connected to the back wiring layer 141b via the via 96 or the like. Are connected to speaker terminals 153a and 153b of the speaker connector 144, respectively. The speaker drive wiring paths 154c and 154d are connected to the speaker terminals 94c and 94d of the upstream connector 143 on the rear wiring layer 141b side via the via 96 or the like, and the other end side is connected to the rear wiring via the via 96 or the like. The layer 141b is connected to speaker terminals 153c and 153d of the speaker connector 145, respectively.

  The solid ground pattern 264 of the intermediate layer 141c constitutes the ground wiring path 160 together with the solid ground pattern 159 on the front wiring layer 141a side, the solid ground pattern 158 on the back wiring layer 141b side, and the like. It is connected to the ground terminals 93a, 93b, etc. of the upstream connector 143 via the ground patterns 158, 159, etc.

  As described above, the drive wiring path and the ground wiring path of the speaker (predetermined presentation means) are provided in the intermediate layer, not the surface layer on which the LED driver 146 and other wiring paths are arranged, and the drive wiring provided in the intermediate layer By sandwiching the road with a solid ground pattern provided on the surface layers on both sides, the adverse effects of noise can be eliminated as much as possible. In addition, by providing a driving wiring path formed wider than the LED wiring path in the intermediate layer, the space of the surface layer can be used more effectively and the substrate can be downsized. When two or more intermediate layers are provided, for example, a drive wiring path is provided in one of the intermediate layers, and a solid ground pattern is provided on both sides of the intermediate layer (both the intermediate layer or the intermediate layer and one surface layer). It is desirable to provide it.

  20 and 21 illustrate a fifth embodiment of the present invention. A red LED element is selected from red, green, and blue LED elements connected in parallel by partially modifying the first embodiment. An example in which a protective resistor is connected only to is shown.

  FIG. 20 shows a specific wiring pattern for each wiring layer for the first LED substrate 41 of the present embodiment. The first LED board 41 of the present embodiment is different from the first embodiment (FIG. 5) in the wiring pattern. For the LEDs 84 and 85 and the LEDs 86 and 87, only the R wiring path corresponding to the red LED element is protected. Resistors 82 and 83 are arranged, and only the point that no protective resistance is arranged in the G wiring path and the B wiring path corresponding to the green LED element and the blue LED element.

  In the LEDs 84 and 85 and the LEDs 86 and 87, the green LED elements 84G, 85G, 86G and 87G and the blue LED elements 84B, 85B, 86B and 87B shown in FIG. The operating voltages of the elements 84R, 85R, 86R, 87R are lower than that. Further, as shown in FIG. 21, the protective resistor 82 arranged in the R wiring path includes a voltage VFR across the red LED elements 84R and 85R (total value of operating voltage) VFR and a voltage Vr across the protective resistor 82 in the LEDs 84 and 85. Is set to be substantially equal to the voltages at both ends of the green LED elements 84G and 85G and the blue LED elements 84B and 85B (total values of operating voltages) VFG and VFB. The voltages at both ends of the green LED elements 84G and 85G and the blue LED elements 84B and 85B (total values of the operating voltages) VFG and VFB are set to the power supply voltage V or less. Similarly, the resistance value of the protective resistor 83 is set.

  As described above, the protective resistor is connected in series only to the red LED element among the red, green, and blue LED elements connected in parallel, and the sum of the voltage across the red LED element and the voltage across the protective resistor. Is made substantially equal to the voltages at both ends of the green LED element and the blue LED element, it is not necessary to connect protective resistors to the green and blue LED elements, so that the number of protective resistors can be reduced.

  FIG. 22 illustrates the sixth embodiment of the present invention. The first embodiment is partially modified to connect G, R, and B connected to three electrodes G, R, and B provided in the LED. The example which provided the thermal radiation part in all the three wiring paths of B is shown.

  As shown in FIG. 22A, for example, among the inter-LED wiring paths 95 of the first LED substrate 41 (FIG. 5 and the like), the G wiring path 95G and the B wiring path 95B are respectively the G electrode KG on the cathode side of the LED 84, The B electrode KB is connected from the outside in the electrode arrangement direction, and heat dissipating portions 105a and 105a wider than other portions in the wiring paths are provided in the vicinity of the connecting portion. Further, the heat radiation portions 105a and 105a are respectively provided with recesses 265 from the inner side (R wiring path 95R side) in the electrode arrangement direction to the outer side.

  In addition, the R wiring path 95R of the inter-LED wiring path 95 is widened on both sides in the electrode arrangement direction at the connection portion with the R electrode KR on the cathode side of the LED 84, and the widened end side of the heat radiation portions 105a and 105a. A heat radiating portion 105c inserted in the recess 265 is provided.

  As described above, the heat generated in the LED can be generated by providing the heat radiating portions in all the three wiring paths of G, R, and B connected to the three electrodes G, R, and B provided in the LED. Heat can be radiated more efficiently.

  As shown in FIG. 22B, the heat radiation portions 105a and 105a of the G wiring path 95G and the B wiring path 95B are not provided with the recesses 265, and the heat radiation portions 105c of the R wiring path 95R are replaced with the heat radiation portions 105a and 105a. You may form in the width | variety of the grade which does not interfere.

  FIG. 23 illustrates the seventh embodiment of the present invention, and shows an example in which the arrangement of the LED drive wiring paths 187a to 187c, 188a to 188c (FIG. 13 and the like) in the first embodiment is partially changed. Yes.

  In the present embodiment, as shown in FIG. 23A, the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side are, for example, obliquely downward (first direction) from the vias 96g to 96l, respectively. They are drawn out substantially in parallel, and are arranged substantially parallel to each other, for example, downward (second direction) via the refracting portions 271a to 271f. The refraction portions 271a to 271f are arranged in a substantially linear shape. As described above, all of the LED drive wiring paths 187a to 187c and 188a to 188c including the LED drive wiring path (specific wiring path) 188c on one end side may be drawn out from the vias 96g to 96l in the first direction. Good.

  Further, in the present embodiment, as shown in FIG. 23 (b), the LED drive wiring path (specific wiring path) 187a on one end side among the LED driving wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side is changed. Except for the LED drive wiring paths (predetermined wiring paths) 187b, 187c, 188a to 188c, the LED driving wiring paths 187b, 187c, and 188a to 188c are respectively drawn from the vias 96b to 96f, for example, upward (in the first direction). For example, they are disposed substantially parallel to each other obliquely upward (second direction). Further, the LED drive wiring path (specific wiring path) 187a on one end side is drawn, for example, obliquely upward (second direction) from the via 96a. The refracting portions 272b to 272f are arranged in a substantially straight line, and a via 96a corresponding to the LED drive wiring path (specific wiring path) 187a is arranged on the straight line. As described above, even when the plurality of vias (interlayer conductive portions) 96a to 96f are arranged in a zigzag shape along the arrangement direction of the plurality of terminals, the predetermined wiring path excluding the specific wiring path on one end side among the plurality of wiring paths. The wiring paths are drawn out substantially parallel to each other in the first direction from the vias and are arranged substantially parallel to each other in the second direction via the refracting portion, and the specific wiring paths are arranged so as to be drawn out from the vias in the second direction. Also good.

  24 and 25 exemplify the eighth and ninth embodiments of the present invention, respectively, and one arrangement mode of LED drive wiring paths 239a to 239c and 240a to 240c in the first embodiment (FIG. 15 and the like) is shown. The example which changed the part is shown.

  In the eighth embodiment, as shown in FIG. 24, the LEDs excluding the LED drive wiring path (specific wiring path) 239a on one end side among the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side. The drive wiring paths (predetermined wiring paths) 239b, 239c, and 240a to 240c are drawn from the vias 96n to 96r, for example, in the lateral direction (first direction) substantially in parallel with each other, and further upward, for example, via the refracting portions 273b to 273f. They are arranged substantially parallel to each other in the (second direction). Further, the LED drive wiring path (specific wiring path) 239a on one end side is drawn, for example, upward (second direction) from the via 96m. The refracting portions 273b to 273f are arranged in a substantially straight line, and a via 96m corresponding to the LED drive wiring path (specific wiring path) 239a is arranged on the straight line. Thus, even when the plurality of via groups are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals, the predetermined wiring path excluding the specific wiring path on one end side among the plurality of wiring paths. May be drawn substantially parallel to each other in the first direction from the via, and arranged substantially parallel to each other in the second direction via the refracting portion, and the specific wiring path may be arranged so as to be drawn from the via in the second direction. . Further, the bent portions corresponding to the plurality of via groups may be arranged linearly.

  Further, in the ninth embodiment, as shown in FIG. 25, the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are substantially parallel to each other, for example, laterally (first direction) from the vias 96m to 96r. They are drawn out in parallel, and are disposed substantially parallel to each other, for example, upward (second direction) via the refracting portions 273a to 273f. The refracting parts 273a to 273c corresponding to the vias 96m to 96o constituting the first via group (interlayer conduction part group) are arranged on a substantially straight line, and also constitute the second via group (interlayer conduction part group). The refraction portions 273d to 273f corresponding to the vias 96p to 96r are also arranged on a substantially straight line. Here, the refracting portions 273a to 273c and the refracting portions 273d to 273f are not arranged on the same straight line, but both the arrangements are substantially parallel to each other.

  As described above, even when the plurality of via groups are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals, the LED driving including the LED driving wiring path (specific wiring path) 239a on one end side is performed. All of the wiring paths 239a to 239c and 240a to 240c may be configured to be drawn out from the vias 96m to 96r in the first direction. In addition, the bent portions corresponding to different via groups may not be arranged on the same straight line. Note that the arrangement of the refraction parts 273a to 273c and the arrangement of the refraction parts 273d to 273f may not be parallel to each other, or the refraction parts 273a to 273f may all be arranged on the same straight line.

  As mentioned above, although embodiment of this invention was explained in full detail, this invention is not limited to this embodiment, A various change is possible in the range which does not deviate from the meaning of this invention. For example, in the embodiment, a through-hole type via is used as an example of an interlayer conductive portion (so-called via), but a via or the like in which a through paste is filled with a conductive paste or the like may be used. Further, the size (diameter) of the interlayer conductive portion such as a through hole may be varied depending on the type of wiring path such as a signal line and a ground line.

  In the first embodiment, as shown in FIG. 13B, when arranging a plurality of vias (interlayer conductive portions) in a zigzag manner along the arrangement direction of the plurality of terminals 180a to 180f, the first inclined arrangement portion is provided. And the second inclined array portion are configured by the same number (two) of vias, but the number of vias between the first inclined array portion and the second inclined array portion may be three or more. The number of vias with the second inclined array portion may not be the same.

  In the first embodiment, as shown in FIG. 15, a plurality of via groups (interlayer conductive portion groups) are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals 191a to 191c and 192a to 192c. In doing so, the number of vias in each via group is the same, but the number of vias in each via group may be different. Three or more via groups may be provided.

  In the embodiment, an example in which the air blowing effect means 37 is adopted as an example of the moveable effect means that can perform a predetermined operation by the drive means has been described. In addition to the actuated movable effector operated by a driving means such as a motor, vibration effecting means for vibrating a predetermined part (launching handle 17, effect button 51, etc.) touched by the player may be used.

  In the embodiment, among the first wiring path connected to the first electrode of the LED and the second and third wiring paths respectively connected to the second and third electrodes adjacent to both sides of the first electrode, Although the example which provided the thermal radiation part 105a, 105c in the 2nd, 3rd wiring path at least was shown, the center 1st electrode may be a G electrode or a B electrode. Further, the LED may be a monochromatic light emitting type composed of one LED element.

  In the embodiment, in the fourth to sixth LED substrates (first to third substrates) 44 to 46, the fourth LED substrate (first substrate) 44, the LEDs (first LEDs) 183 to 186 of the fourth LED substrate 44, An LED driver (first LED driver) 180 for driving the LEDs (second LEDs) 223 to 226 of the fifth LED board (second board) 45 is provided, and the sixth LED board (third board) 46 has an LED (third LED). Although the example which provided 245-248 and the LED driver (3rd LED driver) 244 which drives them was shown, the LED (1st LED) 183 of the 4th LED board 44 was provided in the 4th LED board (1st board | substrate) 44. 186, LEDs (second LEDs) 223 to 226 on the fifth LED substrate (second substrate) 45, and LEDs (third LEDs) on the sixth LED substrate (third substrate) 46 The LED driver (first LED driver) 180 for driving 245 to 248 is provided, and the LED driver (first LED driver) 180 of the fourth LED substrate (first substrate) 44 and the sixth LED are provided on the fifth LED substrate (second substrate) 45. You may provide the relay wiring path which connects LED (3rd LED) 245-248 of the board | substrate (3rd board | substrate) 46. FIG.

  In the embodiment, in the first and third LED substrates 41 and 43, LED drivers 80, 81 and 146 are provided on the back wiring layers (first wiring layers) 71b and 141b, and the other front wiring layers (second wiring layers) 71a. 141a are provided with drive wiring paths 88a to 88d and 154a to 154d for driving the speakers 36a and 36b, respectively. However, an LED driver is provided in the first wiring layer, and an air blowing effect means 37 is provided in the second wiring layer. You may provide the drive wiring path regarding movable production | presentation means, such as. In this case, you may provide LED in a 2nd wiring layer. Alternatively, as in the fourth embodiment, an LED driver may be provided in the first wiring layer as the surface layer, and a driving wiring path related to the movable effect means such as the air blowing effect means 37 may be provided in the second wiring layer as the intermediate layer. .

  In the second embodiment, the conductor exposure is performed so as to include the arrangement regions of the vias 96 so as to correspond to the vias 96 intensively arranged in the central region in the arrangement region of the LED driver 120 in the solid ground pattern 134. Although the example in which the portion 262 is provided has been shown, the conductor exposed portion 262 and the conductor portion 261 are provided corresponding to the peripheral region so as not to reach the via 96 disposed in the central region, and they are soldered (conducting connection means) ) 263 may be connected.

  In the embodiment, the wiring paths such as the first to sixth LED substrates 41 to 46 arranged on the front door 8 are branched into the left wiring path 57 on the left side and the right wiring path 58 on the right side below the window hole 34. The first to sixth LED substrates 41 to 46 may be connected in series, for example, in the order of the substrates 41, 42, 43, 46, 45, 44, or vice versa, without branching on the way.

  In the embodiment, the LED board disposed on the front door 8 has been described. However, the LED board disposed on a gaming component such as the central display unit 22 in the gaming board 5 can be similarly implemented. Further, the present invention can be similarly applied to a substrate other than the LED substrate, such as an effect control substrate.

  Measurement points (hereinafter referred to as test points) for verifying the waveform of a signal input to the LED driver may be provided on the wiring path. For example, if the wiring path for transmitting the signal to the LED driver is long, the waveform may be disturbed due to the influence of noise or the like on the way, but the LED is normally normal even if there is some waveform disturbance Therefore, it is difficult to determine whether the input signal to the LED driver is normal from the light emission state of the LED. Therefore, for example, whether the waveform of the signal input to the LED driver is normal by providing a test point in the signal wiring path, clock wiring path, etc. connected to the LED driver and measuring the waveform of the signal at the test point. It is possible to accurately verify whether or not. The test point is preferably provided as close as possible to the LED driver. In addition, although the test point may be provided exclusively for it, a via such as a through hole may be used as the test point.

  For example, in the case where test points are provided on a plurality of wiring paths drawn substantially in parallel from a plurality of terminals arranged in a predetermined direction, as shown in the embodiments (FIGS. 13, 15, 23 to 25, etc.). The vias may be arranged in the same manner as the arrangement of the vias (diagonal, zigzag, etc.). In addition, in order to distinguish between vias such as through holes and test points, or to clearly indicate that they are through holes used as test points, characters such as “TP” in the vicinity of test points on the board, etc. It is desirable to provide a mark.

  In the embodiment, an example in which the present invention is applied to a pachinko machine has been described. However, the present invention can be similarly applied to various game machines such as an arrange ball machine and a slot machine.

41-44,46 LED board 71a Wiring layer (2nd surface)
71b Wiring layer (first surface)
72 Substrate body 80, 81 LED driver (heat-generating component)
84-87 LED
96 Via (interlayer conduction part)
101 Solid ground pattern (second conductor pattern)
102 Solid ground pattern (first conductor pattern)
111a Wiring layer (second surface)
111b Wiring layer (first surface)
112 Substrate body 120, 121 LED driver (heat-generating component)
124-127 LED
134 Solid ground pattern (first conductor pattern)
135 Solid ground pattern (second conductor pattern)
141a Wiring layer (second surface)
141b Wiring layer (first surface)
142 Substrate body 146 LED driver (heat generating component)
147-150 LED
158 Solid ground pattern (first conductor pattern)
159 Solid ground pattern (second conductor pattern)
171a Wiring layer (second surface)
171b Wiring layer (first surface)
172 Substrate body 180 LED driver (heat generating component)
183 to 186 LED
196 Solid ground pattern (first conductor pattern)
197 Solid ground pattern (second conductor pattern)
241a Wiring layer (second surface)
241b Wiring layer (first surface)
242 Substrate body 244 LED driver (heat generating component)
245-248 LED
257 Solid ground pattern (second conductor pattern)
258 Solid ground pattern (first conductor pattern)

In the invention described in Patent Document 1, since heat is radiated by a heat radiation pattern arranged on the back side of the substrate with respect to the LED chip, there is a problem that it is difficult to obtain sufficient heat radiation efficiency.
In addition, the heat radiation pattern to which the LED chip is heat-transferred is electrically independent, and since this heat radiation pattern serves as an antenna to easily pick up noise, for example, an LED driver having a control function, and other control elements There is also a problem that it is difficult to adopt as a heat dissipation means.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a gaming machine which can be determined promptly by using an heat dissipation of heat generating components effectively.

The present invention includes a board in which a first wiring layer and a second wiring layer are provided in a plate thickness direction, and the board is provided with a heat generating component in the first wiring layer . A heat dissipating part that dissipates heat; the heat dissipating part includes a first conductor pattern provided between the substrate and the exothermic component; a second conductor pattern provided on the second wiring layer side; Ru der those from and the first conductor pattern provided through the substrate and a heat conduction portion for transmitting the heat to the second conductor pattern.

According to the present invention, it can be determined promptly by using an heat dissipation of heat generating components effectively.

Claims (5)

In a gaming machine equipped with a board mounted with heat-generating components,
A gaming machine, characterized in that a first conductor pattern constituting a ground wiring path is provided across an arrangement area of the heat-generating component in the board body of the board and an outer area thereof. Providing the heat-generating component and the first conductor pattern on the first surface side of the substrate body;
The interlayer conductive portion that connects the first conductor pattern and the second surface side of the board body is provided in both the arrangement region of the heat-generating component and the outer region. Game machines. Providing the heat-generating component and the first conductor pattern on the first surface side of the substrate body;
The gaming machine according to claim 1, wherein an interlayer conductive portion that connects the first conductor pattern and the second surface side of the board body is provided only in an arrangement region of the heat-generating component. A second conductor pattern constituting the ground wiring path is provided on the second surface side,
The gaming machine according to claim 2 or 3, wherein the first conductor pattern and the second conductor pattern are connected by the interlayer conductive portion. The board is an LED board on which LEDs are mounted,
The game machine according to any one of claims 1 to 4, wherein the heat generating component is an LED driver that drives the LED.

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