JP6736206B2 - Amusement machine - Google Patents

Description

The present invention relates to gaming machines such as pachinko machines and slot machines.

Various game machines such as pachinko machines are provided with various effect means such as image display means for image effect, LEDs for light emission effect, speaker for sound effect, and movable body for movable body effect. ing. Each of these effect means is connected to, for example, an effect control board, and is operated under the control of this effect control board (Patent Document 1).

JP, 2007-313165, A

In the conventional gaming machine, since each production means and the production control board were connected by independent harnesses, etc., it is necessary to route a large number of harnesses on the back side of the gaming machine. It was necessary to secure a space for passing through.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a gaming machine capable of simplifying wiring to a production means and reducing a space for wiring. ..

The present invention is a gaming machine provided with an LED board 41 on which LEDs 84 to 87 are mounted and predetermined effect means 36a and 36b different from the LEDs 84 to 87, and is connected to the downstream side of the LED board 41 and the predetermined. A predetermined substrate 43 to which the rendering means 36a and 36b are connected is provided, and drive wiring paths 88a to 88d and 154a to 154d for driving the predetermined rendering means 36a and 36b are provided on the LED substrate 41 and the predetermined substrate 43, The LEDs 84 to 87 are provided on the first surface side of the LED board 41, and the first connector 73 for connecting to the upstream board and the downstream board are connected to the second surface side of the LED board 41. a second connector 74 for their first, and an LED driver 80, 81 is provided which is disposed between the second connector 73 and 74, the driving wiring lines 88a~88d on the LED substrate 41, the first The first end portion and the second end portion arranged on the second surface side and the intermediate portion arranged on the first surface side are connected by an interlayer conduction portion 96, and the first end portion and the second end portion of the drive wiring paths 88a to 88d are connected. One end is connected to the first connector 73, the second end is connected to the second connector 74, and the middle part of the drive wiring paths 88a to 88d is the back side of the arrangement area of the LED drivers 80 and 81. It is the one that is placed avoiding .

According to the present invention, it is possible to simplify the wiring to the rendering means and reduce the space for wiring.

It is the whole pachinko machine front view concerning the 1st embodiment of the present invention. It is the back view of the front door of the same pachinko machine, and the front view of an inner frame. It is a figure which shows arrangement|positioning of an LED board etc. in the front door of the same pachinko machine. It is a wiring diagram of the left wiring path in the front door of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the same pachinko machine. It is a figure which shows the heat dissipation part provided in the connection part of LED and wiring path of the same pachinko machine. It is a front view and a side sectional view of an LED driver mounting portion in a first LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 2nd LED board of the same pachinko machine. It is a front view and a bottom cross-sectional view of an LED driver mounting portion of a second LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the same pachinko machine. It is a wiring diagram of the right wiring path in the front door of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 4th LED board of the same pachinko machine. It is a figure which shows each via arrangement|positioning etc. of the downstream side connector vicinity (a1) (a2) and LED driver vicinity (b1) (b2) in the 4th LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 5th LED board of the same pachinko machine. It is a figure which shows the via arrangement|sequence etc. of the upstream side connector vicinity in the 5th LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 6th LED board of the same pachinko machine. It is the front view and side sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine concerning a 2nd embodiment of the present invention. It is a front view and a side sectional view of an LED driver mounting part in a 2nd LED board of a pachinko machine concerning a 3rd embodiment of the present invention. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the pachinko machine which concerns on the 4th Embodiment of this invention. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the pachinko machine which concerns on the 5th Embodiment of this invention. It is explanatory drawing which shows the connection state of LED and protection resistance of the same pachinko machine, and the relationship of the voltage between both ends. It is a figure which shows the heat dissipation part provided in the connection part of LED and wiring path of the pachinko machine concerning the 6th Embodiment of this invention. It is a figure which shows the wiring pattern of the downstream side connector vicinity (a) and LED driver vicinity (b) in the 4th LED board of the pachinko machine which concerns on the 7th Embodiment of this invention. It is a figure which shows the wiring pattern near the upstream side connector in the 5th LED board of the pachinko machine which concerns on the 8th Embodiment of this invention. It is a figure which shows the wiring pattern near the upstream side connector in the 5th LED board of the pachinko machine which concerns on the 9th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 16 illustrate a first embodiment in which the present invention is applied to a pachinko machine. In FIG. 1 and FIG. 2, the gaming machine main body 1 has a rectangular outer frame 2 and an inner frame 4 pivotally attached to the front side of the outer frame 2 by one hinge on the left and right sides, for example, a left hinge 3. I have it.

On the front side of the inner frame 4, a game board mounting frame 6 and the like for mounting the game board 5 on the upper side thereof, the launching means 7, the lower speaker 10 and the like are arranged on the lower side, respectively, and the front side thereof. A front door 8 for covering the above is hinged to be openable and closable by a hinge 9 on the same side as the hinge 3.

As shown in FIG. 2, the launching means 7 includes a support plate 11 made of sheet metal, a launch rail 12 mounted on the front surface of the support plate 11, and a game ball for launching mounted on the front surface of the support plate 11. A ball holding portion 13 held on the launch rail 12, a hammer mallet 15 supported on the front surface of the support plate 11 so as to be swingable around a drive shaft 14 in the front-rear direction, and a hammer mallet mounted on the back side of the support plate 11 and hammered. And a firing drive means 16 such as a rotary solenoid for driving 15 in the striking direction via the drive shaft 14, and when the firing handle 17 on the front door 8 side is operated, the firing drive means 16 is operated according to the operation amount. Thus, the hammer 16 is continuously driven in the striking direction (clockwise). As a result, the game balls supplied one by one on the launch rail 12 are launched toward the game area 5a of the game board 5 along the launch rail 12.

The game board 5 is attached to the game board mounting frame 6 from the front side, for example, and is detachably fixed by one or a plurality of fixtures 18. The front side of the game board 5 is shot by the launching means 7. While the guide rail 21 for guiding the is mounted in a ring shape, in the game area 5a inside the guide rail 21, the central display unit 22, the normal symbol starting means 23, the special symbol starting means 24, the big winning means 25, the normal winning Various game parts such as means 26 are arranged.

The central display unit 22 is provided with a liquid crystal type image display means 27, a normal symbol display means 28, a special symbol display means 29, a normally reserved number display means 30, and the like. The image display means 27 constitutes an effect symbol display means 31, a special reserved number display means 32, and the like.

The normal symbol display means 28 is composed of, for example, two light emitting bodies (for example, LEDs) corresponding to two kinds of normal symbols such as "○" and "x", and the normal symbol starting means 23 including a passage gate is a game. On condition that the sphere is detected, these two light-emitting bodies blink alternately for a predetermined time, and the hit determination random number value obtained when the game sphere is detected by the normal pattern starting means 23 matches the predetermined hit determination value. In the case, the blinking ends so that the "○" side light emitting body corresponding to the hitting mode emits light, and otherwise the "x" side light emitting body corresponding to the detachment mode emits light. It has become.

The normal random number information such as the hit determination random number value acquired when the game ball is detected by the normal symbol starting means 23 is stored with a predetermined upper limit holding number, for example, 4 as a limit, and the symbol by the normal symbol display means 28. It is sequentially digested each time fluctuation starts. The stored number of ordinary random number information (hereinafter referred to as the ordinary retained number) is notified to the player by, for example, the normally retained number display means 30 including the same number of light emitting elements as the upper limit retained number, for example, by the emitted number.

The special symbol starting means 24 is for starting the symbol fluctuation by the special symbol display means 29, and is provided with, for example, two upper and lower starting winning means 24a and 24b, and is arranged below the central display unit 22. The upper start winning means 24a is a non-opening/closing type winning means having no opening/closing means. The lower start winning means 24b can be opened/closed by the opening/closing means 33 so that the game ball can be switched between a closed state in which a game ball cannot be entered (or difficult to enter) and an open state in which a game ball can be entered (or easier to enter than a closed state). In the formula-based winning means, when the stop symbol after the change of the normal symbol display means 28 becomes a hit mode and the ordinary profit state occurs, the closed state is opened for a predetermined time.

The special symbol display means 29 is composed of one or a plurality, for example, a display means such as a 7-segment type capable of variably displaying one special symbol, and the special symbol starting means 24 detects a game ball, That is, a special symbol is variably displayed for a predetermined time on condition that the game ball enters one of the upper and lower two starting winning means 24a, 24b, and the jackpot determination obtained at the time of entering the starting winning means 24a, 24b. When the random number value matches the predetermined jackpot determination value, the jackpot is stopped in a predetermined jackpot manner (specific manner), and in other cases, for example, it is stopped in a miss manner.

The special random number information such as the jackpot determination random number value acquired when the game ball is detected by the special symbol starting means 24 is stored with a predetermined upper limit holding number, for example, 4 as a limit, and the symbol by the special symbol display means 29. It is sequentially digested each time fluctuation starts. The number of stored special random number information (hereinafter, special reserved number) is notified to the player by the special reserved number display means 32, for example, according to the number of displayed reserved display images X.

The effect symbol display means 31, for example, variably displays effect symbols in parallel with the variable display of the special symbols by the special symbol display means 29, and one or more, for example, three effect symbols in the left-right direction, for example, various types. The display screen 27a of the image display means 27 can be variably displayed together with the effect image of, and when the special symbol starting means 24 detects a game ball, that is, the game is placed in one of the upper and lower two starting winning means 24a, 24b. If the ball wins, for example, at the same time as the start of the fluctuation of the special symbol, the fluctuation of the effect symbol is started in accordance with any of a plurality of kinds of fluctuation patterns, and at the same time as the stop of the fluctuation of the special symbol is finally stopped, the effect symbol is left. , Right, middle, etc. are stopped in a predetermined order.

The big winning means 25 is an opening-and-closing type winning means having an opening/closing plate 25a capable of switching between an open state in which a game ball can enter and a closed state in which a game ball cannot enter, and after the special symbol display means 29 has changed. When the special symbol is a big hit mode and a special profit state occurs, the opening/closing plate 25a is opened to the front side in accordance with a predetermined opening pattern, and the game ball dropped on it is prized inside. ..

The front door 8 is provided with a door base 35 made of, for example, resin in which a window hole 34 corresponding to the front side of the game area 5a is formed. In the door base 35, for example, a pair of left and right upper first speakers 36a, 36b and a blowing effect means 37 are arranged near the upper side of the window hole 34, and a pair of left and right upper second speakers 38a near the lower side of the window hole 34. , 38b are arranged. The blowing effect means (movable effecting means) 37 is for performing an effect of blowing air toward the player sitting in front of the gaming machine body 1, and is a sirocco fan or the like operated by a motor (driving means). The air blower 37a is provided, and is arranged on the upper right end side of the door base 35 adjacent to the right upper first speaker 36b, for example, so that the air blow port 37b is directed obliquely downward and forward.

On the front side of the door base 35, as shown in FIG. 3, a plurality of (here, six) LED boards 41 to 46 are arranged around the window hole 34. That is, the first LED board 41 is arranged in the lower left part of the window hole 34, the second LED board 42 is arranged in the upper left part of the window hole 34, and the third LED board 43 is arranged substantially in the center of the upper side of the window hole 34 in the left-right direction. A fourth LED board 44 is arranged in the lower right part of the window hole 34, a fifth LED board 45 is arranged in the upper part thereof, and a sixth LED board 46 is arranged in the upper right part of the window hole 34 in the vicinity of the blowing effect producing means 37.

The first LED board 41 and the second LED board 42 are arranged along the window 34 between the left upper second speaker 38a and the upper first speaker 36a, and the third LED board 43 is left and right upper first speaker. It is arranged between 36a and 36b. Further, the fourth LED board 44 and the fifth LED board 45 are arranged along the window hole 34 between the upper second speaker 38b on the right side and the blowing effect producing means 37, and the sixth LED board 46 is, for example, the blowing effect producing means. It is arranged on the outer circumference of the blower port 37b of 37.

As shown in FIG. 1, on the lower front side of the door base 35, for example, at a position on the left side, an upper plate 47 for storing game balls for supplying to the launching means 7 is arranged, and further, the upper plate 47 of the upper plate 47. On the lower side, a lower plate 48 for storing surplus balls and the like when the upper plate 47 is full is arranged on the left end side, and the firing handle 17 is arranged on the right end side.

Further, on the front side of the door base 35, an upper decorative cover 49 that substantially covers the periphery of the window hole 34 from the front side, and a lower decorative cover 50 that substantially covers the upper plate 47, the lower plate 48 and the like from the front side are mounted. In the upper decorative cover 49, at least a portion corresponding to the front side of the first to sixth LED boards 41 to 46 is a light emitting lens portion having a light transmitting property. On the lower decorative cover 50, for example, a production button 51 that can be operated by the player is arranged substantially in the center of the front side of the upper plate 47 in the left-right direction, and a ball lending operation section 52 is arranged on the side thereof.

As shown in FIG. 2, a glass unit 53 that substantially closes the window hole 34 from the rear side is detachably attached to the back side of the door base 35, and a ball feeding means 54 and a lower plate guide are provided below the glass unit 53. The means 55, the front door relay board 56, and the like are arranged. The ball feeding means 54 supplies the game balls in the upper plate 47 one by one onto the launch rail 12, is arranged corresponding to the front side of the launch means 7, and operates in synchronization with the launch operation by the launch means 7. It is supposed to do. The lower plate guide means 55 guides to the lower plate 48 surplus balls when the upper plate 47 is full, and foul balls that have been returned by the launching means 7 without reaching the game area 5a. For example, and is arranged adjacent to the ball feeding means 54 on the hinge 9 side thereof. In addition, the front door relay board 56, the production control board and the like which are arranged on the back side of the game board 5, the first to sixth LED boards 41 to 46 on the front door 8 side, the speakers 10, 36a, 36b, 38a, 38b, and the air blower. It relays between various production means such as the production means 37, and is arranged, for example, between the door base 35 and the lower plate guide means 55 on the rear side.

Subsequently, among various game parts provided on the front door 8, particularly, the wirings for the first to sixth LED boards 41 to 46, the upper first speakers 36a and 36b, the upper second speakers 38a and 38b, and the blowing effect producing means 37. The details will be described.

First, an outline of the wiring path on the front door 8 will be described. As shown in FIG. 3 and the like, the wiring paths of the first to sixth LED boards 41 to 46 branch left and right along the window hole 34 from the front door relay board 56 arranged on the lower side of the front door 8. The first to third LED boards 41 to 43 form the left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 form the right wiring path 58 on the right side of the window hole 34. .. Further, the drive wiring paths for the upper first speakers 36a and 36b are provided on the left wiring path 57, and the drive wiring paths for the blowing effect means 37 are provided on the right wiring path 58. The upper second speakers 38a, 38b are independent of the left and right wiring paths 57, 58, and are connected, for example, from the front door relay board 56 via harnesses 59a, 59b.

The first to third LED boards (first to third boards) 41 to 43 forming the left wiring path 57 are connected in series via the harnesses 61 and 62, and the first LED board 41 on the most upstream side thereof is , And is connected to the front door relay board 56 via the harness 60. In the left wiring path 57, a through path wiring path (predetermined wiring path) is provided in the first LED board 41 and the second LED board 42, and the LED arranged on the third LED board 43 and the LED are driven downstream of the through path wiring path. And a circuit section including an LED driver for connecting. Further, the first LED board 41 and the second LED board 42 are also provided with a circuit section including an LED and an LED driver for driving the LED, and are connected to the through path wiring paths, respectively. Further, a part of the drive wiring paths of the upper first speakers (predetermined effect means) 36a, 36b are provided on the first to third LED boards 41 to 43, and the third LED board 43 on the most downstream side and the upper first speaker 36a. , 36b are connected via harnesses 63, 64, respectively.

The fourth to sixth LED boards 44 to 46 forming the right wiring path 58 are connected in series via the harnesses 66 and 67, and the fourth LED board 44 on the most upstream side is connected to the front door via the harness 65. It is connected to the relay board 56. In the right wiring path 58, a through path wiring path (predetermined wiring path) is provided in the fourth LED board (first board) 44 and the fifth LED board (second board) 45, and a sixth LED board is provided downstream of the through path wiring path. A circuit unit including an LED (third LED) arranged on the (third substrate) 46 and an LED driver (third LED driver) for driving the LED is connected. The fourth LED substrate (first substrate) 44 is also provided with a circuit portion including an LED (first LED) and an LED driver (first LED driver) that drives the LED (first LED), and is connected to the through path wiring path. The fifth LED substrate (second substrate) 45 is also provided with an LED (second LED), and this LED is driven by the LED driver (first LED driver) on the fourth LED substrate (first substrate) 44. Further, a part of the drive wiring path of the air blow effect producing means (predetermined effect producing means) 37 is provided on the fourth and fifth LED boards 44, 45, and the fifth LED board 45 and the air blowing means 37a of the air blow effect producing means 37 are in the harness 68. Connected through. In this embodiment, parts other than the LEDs, LED drivers, protective resistors, connectors, etc. are omitted on the first to sixth LED boards 41 to 46. Hereinafter, the configurations of the first to sixth LED boards 41 to 46 will be described in detail.

[First LED board 41]
The first LED substrate (first substrate) 41 includes a substrate body 72 having wiring layers on both front and rear surfaces, as shown in FIG. In the board body 72, the right edge 72a is formed in a substantially arc shape along the lower left portion of the window hole 34, and the left edge 72b is formed in a substantially vertical direction, so that from the upper side to the lower side. The width is gradually widened, and a cutout 72c corresponding to the arrangement position of the left upper second speaker 38a is formed in the lower left portion.

Then, as shown in FIG. 4, on the first LED board 41, an upstream side connector (board connecting connector) 73, a downstream side connector (board connecting connector) 74, and an LED for connecting the connectors 73, 74 to each other. Through-pass wiring paths (predetermined wiring paths) 75 to 79 for power supply, LED driver power supply, signal, clock, and ground, and through-path wiring paths 76 to 79 for LED driver power supply, signal, clock, and ground. For example, two LED drivers 80 and 81 branched and connected from the LED drivers 80 and 81, and protection resistors 82 and 83 connected in series between the RGB terminals of the LED drivers 80 and 81 and the through path wiring path 75 for the LED power supply, LEDs 84 to 87 and speaker drive wiring paths 88a to 88d that connect between the connectors 73 and 74 are provided. The circuit section including the LED drivers 80, 81, the LEDs 84-87, the protection resistors 82, 83, etc., which are connected to the through-path wiring paths 75-79, is an example of the first circuit section.

The upstream side connector 73 is connected to the front door relay board 56 via the harness 60, and has, for example, two LED power supply terminals 89a and 89b to which a through path wiring path 75 for LED power supply is connected and an LED driver power supply. For example, one LED driver power supply terminal 90 to which the through-path wiring path 76 is connected, for example, one signal terminal 91 to which a signal through-path wiring path (digital signal wiring path) 77 is connected, and a clock through-path wiring path. For example, one clock terminal 92 to which the (digital signal wiring path) 78 is connected, for example, three ground terminals 93a to 93c to which the through path wiring path 79 for ground is connected, and speaker driving wiring paths 88a to 88d are connected. The speaker terminals 94a to 94d are provided, and 12 terminals in total are arranged in two rows, for example, 6 terminals each. The two terminals on each side of the two rows in the terminal arrangement direction, that is, two terminals on each side, that is, a total of four terminals, are speaker terminals 94a to 94d. In this way, by connecting the LED power supply through-pass wiring path 75 to the two LED power supply terminals 89a and 89b and connecting the ground through-path wiring path 79 to the three ground terminals 93a to 93c, the harness side connector It reduces the electrical resistance generated at the contact area.

Regarding the eight terminals other than the speaker terminals 94a to 94d in the connectors 73 and 74, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order on one side, and the other side. The ground terminal 93b, the signal terminal 91, the clock terminal 92, and the ground terminal 93c are arranged in that order in the side row. Of course, the arrangement of the terminals in the connectors 73 and 74 is arbitrary.

FIG. 5 shows a specific wiring pattern of the first LED substrate 41 for each wiring layer. In the first LED substrate 41, the LEDs 84 to 87 and the like are provided on the front wiring layer (second wiring layer) 71a on the front side, and the upstream side connector 73 and the downstream connector 74 are provided on the rear wiring layer (first wiring layer) 71b on the back side. LED drivers 80, 81, protection resistors 82, 83, etc. are arranged respectively.

Note that the front wiring layer 71a and the back wiring layer 71b are covered with the insulating film 106 (see FIG. 7) over substantially the entire surface thereof, but in FIG. The lower wiring path and the like are shown by solid lines. The same applies to FIGS. 8, 10, 12, 14, and 16 described later.

The upstream connector 73 is arranged, for example, on the lower end side of the back wiring layer 71b (FIG. 5B) so that the terminal arrangement is in the left-right direction, and the downstream connector 74 is, for example, on the upper end side of the back wiring layer 71b. Are arranged so that they are in the vertical direction. Each of the terminals of the connectors 73 and 74 has, for example, a rectangular shape, and is formed in an elongated shape orthogonal to the arrangement direction. Then, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream side connector 73 from the outside in the terminal arrangement direction (here, the left-right direction), and the upstream side. Speaker drive wiring paths 88c and 88d for the upper first speaker 36b, for example, are connected to the speaker terminals 94c and 94d on the other end side of the side connector 73 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction), and the downstream side. For example, speaker drive wiring paths 88c and 88d for the first upper speaker 36b are connected to the speaker terminals 94c and 94d on the other end of the side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction).

As described above, the speaker drive wiring paths 88a to 88d are connected to the outermost terminals 94a to 94d of the plurality of terminals of the connectors 73 and 74 in the arrangement direction from the outside in the terminal arrangement direction. Although the speaker drive wiring paths 88a to 88d are formed wide, it is easy to avoid interference with other wiring paths. Further, since the speaker terminals 94a to 94d are formed in an elongated shape orthogonal to the terminal arrangement direction, the speaker drive wiring paths 88a to 88d are connected by connecting them to the long side of the speaker terminals 94a to 94d. It is possible to secure a larger cross-sectional area of the portion and keep the resistance low.

The LEDs 84 to 87 are arranged in a row at substantially regular intervals along the longitudinal direction of the front wiring layer 71a (FIG. 5A), for example. The LEDs 84 and 85 driven by the LED driver 80 are vertically arranged, for example, on the upper side of the front wiring layer 71a, and are connected in series by the inter-LED wiring path 95. The LEDs 86 and 87 driven by the LED driver 81 are arranged obliquely along the right edge 72a of the substrate body 72 on the lower side of the front wiring layer 71a, and are connected in series by the inter-LED wiring path 95. There is. The LEDs 84 to 87 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have an R electrode corresponding to red and a G electrode corresponding to green (second electrode). An electrode) and a B electrode (third electrode) corresponding to blue are provided side by side so that the R electrode (first electrode) is at the center, for example.

In addition to the speaker drive wiring paths 88a to 88d, for the first LED substrate 41, the LED power supply, LED driver power supply, signal and clock through path wirings 75 to 78 are, for example, both ends thereof, that is, connectors. Except for a predetermined range in the vicinity of the connecting portions to 73, 74, almost all of them are provided on the same front wiring layer (second wiring layer) 71a side as the LEDs 84 to 87.

That is, the speaker drive wiring paths 88a, 88b are arranged on the front wiring layer 71a along, for example, the right edge portion 72a, and on the rear wiring layer 71b side via the vias (interlayer conduction portions) 96 on both end sides thereof. The connectors 73 and 74 are connected to the speaker terminals 94a and 94b. Further, the speaker drive wiring paths 88c and 88d are arranged on the front wiring layer 71a along, for example, the left edge portion 72b, and the speakers in the connectors 73 and 74 on the rear wiring layer 71b side via the vias 96 at both end portions thereof. It is connected to the terminals 94c and 94d. The via 96 of this embodiment is assumed to be a through-hole type via having a through hole plated.

Further, the LED power supply, LED driver power supply, signal, and clock through-path wiring paths 75 to 78 are provided on the front wiring layer 71a along the right side of the upper side LEDs 84 and 85 and the left side of the lower side LEDs 86 and 87, for example. Are arranged so as to vertically cross the approximate center in the width direction, and the LED power supply terminals 89a and 89b, the LED driver power supply terminal 90, and the signals in the connectors 73 and 74 on the back wiring layer 71b side are provided at both ends thereof via the vias 96. It is connected to the terminal 91 and the clock terminal 92.

The LED power supply wiring path 97 branched from the LED power supply through path wiring path 75 is connected to, for example, the anode electrodes of the LEDs 84 and 87, and the LED power supply wiring path 98 branched from the LED driver power supply through path wiring path 76 is formed. , A signal wiring path 99 connected to the power supply terminals of the LED drivers 80 and 81 and branched from the signal through path wiring path 77 is connected to the signal terminals of the LED drivers 80 and 81 and branched from the clock through path wiring path 78. The clock wiring path 100 is connected to the clock terminals of the LED drivers 80 and 81.

Further, in the front surface wiring layer 71a, solid ground patterns 101 are provided at a plurality of locations including between the through path wiring paths 75 to 78 including digital signal wiring paths and the speaker driving wiring paths 88a to 88d. Each of the solid ground patterns 101 constitutes a through-pass wiring path (ground wiring path) 79 for ground together with the solid ground pattern 102 on the back wiring layer 71b side. For example, via the via 96, the solid ground pattern 102, etc. It is connected to the ground terminals 93a to 93c of the connectors 73 and 74. Note that, for example, the solid ground pattern 101a among the plurality of solid ground patterns 101 is arranged in a floating island shape below the LED 85 between the speaker drive wiring paths 88c and 88d and the through path wiring paths 75 to 78.

The LED drivers 80 and 81 are arranged, for example, at a predetermined distance in the up-down direction at approximately the center of the back surface wiring layer 71b, and through-path wiring paths (digital signal wiring paths) for signals and clocks on the front wiring layer 71a side. It is arranged at a position corresponding to 77 and 78. Further, a solid ground pattern 101a on the front wiring layer 71a side is provided corresponding to the arrangement range of the LED drivers 80 and 81. That is, on the front wiring layer 71a side, through-path wiring paths 77 and 78 for signals and clocks and speaker driving wiring paths 88c and 88d are arranged with the solid ground pattern 101a interposed therebetween, and the LEDs on the rear wiring layer 71b side are arranged. The drivers 80 and 81 are arranged at positions corresponding to the signal and clock through-path wiring paths 77 and 78, which are separated from the speaker driving wiring paths 88c and 88d, and the solid ground pattern 101a is the LED drivers 80 and 81. It corresponds to the arrangement range of.

In this way, the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78, which may be noise sources, are collectively arranged at the positions corresponding to each other in the back wiring layer 71b and the front wiring layer 71a, and the speaker drive weak against noise is driven. By arranging the wiring paths 88c and 88d away from the digital signal wiring paths 77 and 78 and the solid ground pattern 101a between them, the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78 can be connected to the speaker. The adverse effect of noise on the drive wiring paths 88c and 88d can be eliminated as much as possible.

The protection resistors 82 and 83 are arranged, for example, in the vicinity of the LED drivers 80 and 81 in the back wiring layer 71b, one end side of which is connected to the RGB terminals of the LED drivers 80 and 81 via the LED drive wiring path 103 and the other end thereof. Each side is connected to the cathode electrodes of the LEDs 85 and 86 via a cathode side wiring path 104 that extends across the back wiring layer 71b side with a via 96 interposed therebetween.

The rear wiring layer 71b is provided with a plurality of solid ground patterns 102 around the LED drivers 80 and 81 and the protection resistors 82 and 83. These solid ground patterns 102 are connected to each other through, for example, a plurality of vias 96, the solid ground pattern 101 on the front wiring layer 71a side, and the ground terminals 93a to 93c of the connectors 73 and 74 and the LED drivers 80 and 81. Is connected to the ground terminal of.

In the first LED substrate 41, the speaker drive wiring paths 88a to 88d are digital signals such as signal and clock through path wiring paths 77 and 78 for driving the LEDs 84 to 87, a signal wiring path 99, and a clock wiring path 100. It is formed wider than the signal wiring path.

Further, the first LED substrate 41 adopts the following configuration in order to improve the heat radiation efficiency of the LEDs 84 to 87 and the LED drivers 80 and 81 as an example of the heat generating component. First, regarding the LEDs 84 to 87, the heat dissipation portions 105a and 105b having a width wider than the other portions in the wiring path are provided in the wiring path (that is, the copper foil pattern) connected to the electrodes, and the heat dissipation portions 105a and 105b are provided. The LEDs 84 to 87 are radiated through the heat.

That is, as shown in FIG. 6, in the inter-LED wiring path 95 and the cathode-side wiring path 104, for example, except for the central R wiring path (first wiring path) 95R, 104R, the G wiring path (second wiring) on both sides thereof is formed. Path) 95G, 104G and B wiring path (third wiring path) 95B, 104B are provided with heat radiating portions 105a. The heat dissipation portion 105a is provided, for example, at a connection portion with the G and B electrodes AG, AB, KG, and KB, and is widened on the side opposite to the R wiring paths 95R and 104R, that is, outside in the electrode arrangement direction. Thus, for example, it is formed in a rectangular shape. Further, in the LED power supply wiring path 97, for example, a rectangular heat radiating portion 105b that widens on both sides in the width direction is provided at the connection portion of the LEDs 84 and 87 with the electrodes AG, AR, and AB. As a result, the heat generated by the LEDs 84, 87 can be efficiently radiated through the heat radiating portions 105a, 105b, and the malfunction of the LEDs due to overheating can be prevented.

Further, regarding the LED drivers 80 and 81, a part of the solid ground pattern (first conductor pattern) 102 is arranged between the LED drivers 80 and 81 and the LED drivers 80 and 81 via the solid ground pattern 102. It is designed to radiate heat. In the present embodiment, as shown in FIG. 7, part of the solid ground pattern 102 is arranged below the LED drivers 80 and 81, and the LED drivers 80 and 81 cover the solid ground pattern 102. It is fixed to the substrate main body 72 in a state where the back surface is substantially abutted. Thereby, the heat generated in the LED drivers 80 and 81 can be efficiently radiated through the solid ground pattern 102 having a large area, and the malfunction of the LED driver due to overheating can be prevented.

[Second LED board 42]
The second LED substrate (second substrate) 42 includes a substrate body 112 having wiring layers on both front and rear surfaces, as shown in FIG. In the substrate body 112, the right edge 112a is formed in a substantially arc shape along the upper left portion of the window hole 34, and the left edge 112b is formed in a substantially vertical direction, so that the lower side is directed to the upper side. It is gradually widening.

As shown in FIG. 4, the board main body 112 has an upstream side connector (board connecting connector) 113, a downstream side connector (board connecting connector) 114, and an LED power source for connecting the connectors 113 and 114. , LED driver power supply, signal, clock, and ground through-path wiring paths (predetermined wiring path) 115 to 119, and LED driver power supply, signal, clock, and ground through-path wiring paths 116 to 119 For example, two LED drivers 120 and 121 that are branched and connected, and the protection resistors 122 and 123 and the LED 124 that are connected in series between the RGB terminals of the LED drivers 120 and 121 and the through-pass wiring path 115 for LED power supply. To 127 and speaker drive wiring paths 128a to 128d for connecting the connectors 113 and 114 are provided. The circuit section including the LED drivers 120 and 121, the LEDs 124 to 127, the protection resistors 122 and 123, etc., which are connected to the through path wiring paths 115 to 119, is an example of the second circuit section.

The upstream side connector 113 is connected to the downstream side connector 74 on the side of the first LED board 41 by the harness 61, and has the same terminal configuration as the downstream side connector 74. One of the downstream side connectors 114 has a different terminal configuration from the upstream side connector 113, and for example, one LED power supply terminal 89 to which the through path wiring line 115 for LED power supply is connected, and a through path wiring line for LED driver power supply. For example, one LED driver power supply terminal 90 to which 116 is connected, one signal terminal 91 to which a signal through path wiring line (digital signal wiring path) 117 is connected, and a clock through path wiring line (digital signal wiring) Path 118 is connected to, for example, one clock terminal 92, ground through-path wiring path 119 is connected to, for example, two ground terminals 93a and 93b, and speaker driving wiring paths 128a to 128d are connected to speaker terminals 94a. .About.94d, and 10 terminals in total are arranged in two rows, for example, 5 terminals each. The two terminals on each side of the two rows in the terminal arrangement direction, that is, two terminals on each side, that is, a total of four terminals, are speaker terminals 94a to 94d.

Thus, in the second LED substrate 42, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 113, that is, the LED power supply, the LED driver power supply, and the through path wiring paths 115, 116, and 119 for the ground (here 6) is larger than the number of terminals (here, 4 in total) corresponding to the same wiring paths 115, 116, 119 in the downstream side connector 114.

Regarding the six terminals other than the speaker terminals 94a to 94d in the downstream connector 114, for example, the LED power supply terminal 89, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order in one row, and the other side is arranged. A signal terminal 91, a clock terminal 92, and a ground terminal 93b are arranged in that order in a row. Of course, the arrangement of each terminal in the connector 114 is arbitrary.

FIG. 8 shows a specific wiring pattern of the second LED substrate 42 for each wiring layer. In the second LED substrate 42, the LEDs 124 to 127 and the like are provided on the front wiring layer 111a (FIG. 8A) on the front side, and the upstream connector 113 and the downstream connector are provided on the rear wiring layer 111b (FIG. 8B) on the back side. 114, LED drivers 120 and 121, protection resistors 122 and 123, and the like are arranged, respectively.

The upstream connector 113 is arranged, for example, on the lower end side of the back wiring layer 111b so that the terminal arrangement is in the left-right direction, and the downstream connector 114 is, for example, on the upper side of the back wiring layer 111b, so that the terminal arrangement is also in the left-right direction. It is arranged. Each terminal of the connectors 113 and 114 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (here, the left-right direction). Then, for example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b at one end side of the upstream connector 113 from the outside in the terminal arrangement direction (here, the left-right direction), and the upstream side. For example, speaker drive wiring paths 128c and 128d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 113 from the outside in the terminal arrangement direction (here, the horizontal direction). Similarly, for example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream side connector 114 from the outside in the terminal arrangement direction (here, the left and right direction), and the downstream side. For example, speaker drive wiring paths 128c and 128d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 114 from the outside in the terminal arrangement direction (here, the left-right direction).

In the second LED substrate 42, for example, the through-path wiring path 115 for the LED power supply is substantially the same as the LEDs 124 to 127 except for a predetermined range near both ends thereof, that is, the connection portions to the connectors 113 and 114. Although provided on the wiring layer 111a side, the speaker drive wiring paths 128a to 128d and the LED driver power supply, signal, and clock through-path wiring paths 116 to 118 are connected to the front wiring layer 111a via the via 96. Substantially all of them are provided on the back wiring layer 111b side, except for some bypass portions that are avoided on the side.

That is, the speaker drive wiring paths 128a and 128b are arranged along the right edge portion 112a on the back surface wiring layer 111b, and the speaker driving wiring paths 128c and 128d are arranged along the left edge portion 112b on the back surface wiring layer 111b. There is. Further, the through path wiring paths 116 to 118 are vertically arranged on the back surface wiring layer 111b, for example, between the speaker driving wiring paths 128a and 128b and the speaker driving wiring paths 128c and 128d, and the upper and lower ends thereof are respectively the connector 113. , 114.

The LED driver power supply wiring path 131 branched from the LED driver power supply through path wiring path 116 is connected to the power supply terminals of the LED drivers 120 and 121, and the signal wiring path 132 branched from the signal through path wiring path 117 is formed. A clock wiring path 133 connected to the signal terminals of the LED drivers 120 and 121 and branched from the through path wiring path 118 for clock is connected to the clock terminals of the LED drivers 120 and 121.

Here, the LED driver 120 and the protection resistor 122 corresponding thereto are arranged, for example, above the downstream connector 114 in the back wiring layer 111b, and the LED driver 121 and the protection resistor 123 corresponding thereto are arranged, for example, in the back wiring layer 111b. Are arranged between the speaker drive wiring paths 128c and 128d and the through path wiring paths 116 to 118 in FIG.

The LED power supply wiring path 131, the signal wiring path 132, and the clock wiring path 133 corresponding to the LED driver 120 are provided substantially upward from the downstream connector 114 or its vicinity, that is, in the substantially extending direction of the through-path wiring paths 116 to 118. ing. In this way, the downstream connector 114 of the second LED board 42 is arranged in the middle of the wiring path connecting the upstream connector 113 and the LED driver 120, and thus the downstream connector is provided on the lowermost side of the second LED board 42. Compared with the case where 114 is arranged, there is an advantage that the wiring path of the second LED substrate 42 is simplified.

Further, for example, a plurality of solid ground patterns 134 are provided on the back wiring layer 111b. Each of the solid ground patterns 134 constitutes a through-pass wiring path (ground wiring path) 119 for ground together with the solid ground pattern 135 on the side of the front wiring layer 111a, for example, via the via 96, the solid ground pattern 135, etc. It is connected to the ground terminals 93a to 93c of the upstream connector 113, the ground terminals 93a and 93b of the downstream connector 114, and the ground terminals of the LED drivers 120 and 121.

As shown in FIG. 9 and the like, a part of the solid ground pattern (first conductor pattern) 134 is arranged between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer 111a side. One or more vias (interlayer conductive portions) 96 for connecting to the solid ground pattern (ground wiring path, second conductor pattern) 135 of the LED driver 120 are provided both inside and outside the arrangement area of the LED driver 120, for example. ing. The via 96 outside the arrangement area of the LED driver 120 is preferably provided at one or a plurality of locations including the vicinity of the arrangement area. Further, the vias 96 corresponding to the arrangement area of the LED driver 120 are centrally arranged in the central area in the arrangement area of the LED driver 120 as shown in FIG. 9 and the like. As described above, by disposing the via 96 in the disposition region of the LED driver 120, heat conduction to the solid ground pattern 135 on the front wiring layer 111a side can be promoted, and heat dissipation can be expected from the inner surface of the via 96 as well. Moreover, by arranging the vias 96 centrally in the central region of the LED driver 120, which has the highest temperature, the heat generated in the LED driver 120 can be radiated more efficiently. The vias 96 are arranged not only in the central region in the arrangement region of the LED driver 120 but also outside the central region (peripheral region) in the same arrangement region, and the vias 96 in the central region are larger than those in the peripheral region. The arrangement density may be increased. In addition, the via 96 that connects the solid ground pattern (first conductor pattern) 134 and the front wiring layer 111 a side may be provided only in the arrangement region of the LED driver 120.

Further, the solid ground pattern 134a of the plurality of solid ground patterns 134 of the back surface wiring layer 111b is provided at a position corresponding to the LED driver 121. A part of the solid ground pattern (first conductor pattern) 134a is arranged between the LED driver 121 and the substrate body 112, and a wiring including a through path wiring path (clock wiring path) 118 for a clock is provided around the solid pattern 134a. The front wiring layer 111a is formed in a floating island shape surrounded by wiring paths, that is, speaker driving wiring paths 128c and 128d, through path wiring paths 116 to 118, and the like, and is formed by one or a plurality of vias (interlayer conductive portions) 96. It is electrically connected to the solid ground pattern (ground wiring path, second conductor pattern) 135 on the side. As a result, it is possible to effectively dissipate heat from the LED driver 121 via the solid ground pattern 134a, and it is possible to eliminate the adverse effect of noise picked up by the solid ground pattern 134a as much as possible.

Further, one or more vias 96 that connect the solid ground pattern 134a on the back wiring layer 111b side and the solid ground pattern 135 on the front wiring layer 111a side are provided inside and outside the arrangement area of the LED driver 121, respectively. It is provided. The via 96 corresponding to the arrangement area of the LED driver 121 is arranged, for example, in the vicinity of one edge of the LED driver 121 in accordance with the arrangement of the solid ground pattern 135 on the front wiring layer 111a side. By providing the via 96 in the arrangement area of the LED driver 121, the heat generated in the LED driver 121 can be radiated more efficiently. Further, by providing the via 96 not only outside the arrangement area of the LED driver 121 but also inside the arrangement area, the adverse effect of noise picked up by the solid ground pattern 134a can be more effectively eliminated. The via 96 for connecting the solid ground pattern 134a to the solid ground pattern 135 may be provided only in the arrangement region of the LED driver 121, for example.

The LEDs 124 and 125 driven by the LED driver 120 are arranged, for example, on the left and right on the upper side of the front wiring layer 111a, and are connected in series by the inter-LED wiring path 136. The LEDs 126 and 127 driven by the LED driver 121 are vertically arranged, for example, on the lower side of the front wiring layer 111a, and are connected in series by the inter-LED wiring path 136. The LEDs 124 to 127 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center.

In the second LED substrate 42, the speaker drive wiring paths 128a to 128d are digital signal wirings such as signal and clock through path wiring paths 117 and 118 for driving LEDs, a signal wiring path 132, and a clock wiring path 133. It is wider than the road.

Further, the through-pass wiring path 115 for the LED power supply is arranged so as to vertically cross the center of the front wiring layer 111a, and both ends thereof are connected to the connectors 113 and 114 on the rear wiring layer 111b side via the vias 96 and the like. There is. The LED power supply wiring path 137 branched from the LED power supply through-pass wiring path 115 is connected to, for example, the anode electrodes of the LEDs 125 and 127, and the cathode electrodes of the LEDs 124 and 126 sandwich the via 96 and the back wiring layer 111b. It is connected to the protection resistors 122 and 123 via the cathode side wiring path 138 that extends over the side. The inter-LED wiring path 136, the LED power supply wiring path 137, and the cathode side wiring path 138 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41.

[Third LED board 43]
As shown in FIG. 3 and the like, the third LED substrate (third substrate) 43 is provided with a substrate body 142 that has wiring layers on both front and rear sides and is, for example, a substantially oblong rectangular shape. As shown in FIG. 4, the board main body 142 has an upstream side connector (board connecting connector) 143, a pair of speaker connectors (production means connecting connectors) 144 and 145, an LED driver 146, LEDs 147 to 150, and a protection resistor. 151, 152 and the like are provided.

The upstream connector 143 is connected to the downstream connector 114 on the second LED substrate 42 side by the harness 62, and has the same terminal configuration as that of the downstream connector 114. The speaker connectors 144 and 145 are connected to the upper first speakers 36a and 36b by the harnesses 63 and 64. The speaker connector 144 has speaker terminals 153a and 153b, and the speaker connector 145 has speaker terminals 153c and 153c. 153d is provided respectively. The speaker terminals 153a and 153b of the speaker connector 144 are connected to the speaker terminals 94a and 94b of the upstream connector 143 through the speaker drive wiring paths 154a and 154b, and the speaker terminals 153c and 153d of the speaker connector 145 are speaker drive terminals. It is connected to the speaker terminals 94c and 94d of the upstream connector 143 via the wiring paths 154c and 154d.

FIG. 10 shows a specific wiring pattern of the third LED substrate 43 for each wiring layer. In the third LED substrate 43, the LEDs 147 to 150 and the like are provided on the front wiring layer (second wiring layer) 141a (FIG. 10A) on the front side, and the rear wiring layer (first wiring layer) 141b (FIG. 10( The upstream connector 143, the speaker connectors 144 and 145, the LED driver 146, the protective resistors 151 and 152, etc. are arranged in b)).

The upstream side connector 143 is arranged, for example, on the left and right ends of the rear surface wiring layer 141b so that the terminal arrangement is in the left and right direction. For the speaker connectors 144 and 145, for example, the terminal arrangement is on the left and right ends of the rear surface wiring layer 141b in the vertical direction. It is arranged so that. Each terminal of the speaker connectors 144 and 145 is, for example, rectangular like the upstream connector 143, and is formed in an elongated shape orthogonal to the arrangement direction (here, the vertical direction).

Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 94a and 94b on one end side of the upstream side connector 143 from the outside in the terminal arrangement direction (here, left and right direction), and the speaker terminal 94c on the other end side of the upstream side connector 143 is connected. , 94d are connected with speaker drive wiring paths 154c, 154d from the outside in the terminal arrangement direction (here, the left-right direction). Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 153a and 153b of the speaker connector 144 from the outside in the terminal arrangement direction (here, the vertical direction), and speaker drive is performed to the speaker terminals 153c and 153d of the speaker connector 145. The wiring paths 154c and 154d are connected from the outside in the terminal arrangement direction (here, the vertical direction). The speaker drive wiring paths 154a to 154d have substantially the same front wiring layer (second wiring layer) as the LEDs 147 to 150, except for a predetermined range near both ends thereof, that is, in the vicinity of the connecting portions to the connectors 143 to 145. ) 141a side is provided.

The LED driver 146 is arranged, for example, at substantially the center of the back wiring layer 141b, and protection resistors 151, 152 connected to the RGB terminals of the LED driver 146 are arranged on both left and right sides thereof. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92 of the upstream connector 143 are connected to the LED driver 146 by the wiring paths 155 to 157 for the LED driver power supply, the signal, and the clock. .. It should be noted that the LED driver power supply, signal, and clock wiring paths 155 to 157 are substantially entirely rear surface wiring except for some bypass portions that are avoided to the front wiring layer 141a side via the via 96, for example. It is provided on the layer 141b side.

The back wiring layer 141b is provided with one or a plurality of solid ground patterns 158. The solid ground pattern 158 constitutes the ground wiring path 160 together with the solid ground pattern 159 and the like on the front wiring layer 141a side. For example, the ground terminals 93a and 93b of the upstream connector 143 are provided via the via 96, the solid ground pattern 159 and the like. And a ground terminal of the LED driver 146.

A part of the solid ground pattern (first conductor pattern) 158 is arranged between the LED driver 146 and the substrate body 142. Further, of the vias 96 that connect the solid ground pattern 158 and the solid ground pattern (ground wiring path, second conductor pattern) 159 on the front wiring layer 141a side, the vias arranged in the arrangement region of the LED driver 146. 96 are centrally arranged in a central region in the arrangement region of the LED driver 146, for example.

The LEDs 147 to 150 are arranged, for example, in a zigzag shape in the longitudinal direction of the front wiring layer 141a, for example, the left LEDs 147 and 148 are connected in series by the inter-LED wiring path 161, and for example, the right LEDs 149 and 150 are inter-LED wiring. They are connected in series by the path 161. The LEDs 147 to 150 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center. Further, the anode electrodes of the LEDs 148 and 149 are connected to the LED power supply terminal 89 of the upstream side connector 143 via the LED power supply wiring path 162 extending to the back wiring layer 141b side via the via 96, and the LEDs 147 and 150 are connected. The cathode electrode is connected to the protection resistors 151 and 152 via the cathode side wiring path 163 which extends across the back wiring layer 111b side with the via 96 interposed therebetween. Further, the inter-LED wiring path 161, the LED power wiring path 162, and the cathode side wiring path 163 are provided with heat dissipation portions 105a and 105b similar to those of the first LED substrate 41 and the like.

In the third LED substrate 43, the speaker drive wiring paths 154a to 154d are formed wider than the digital signal wiring paths such as the signal and clock wiring paths 156 and 157 for driving the LEDs.

In the first to third LED boards 41 to 43 described above, the through path wiring path is provided over the first to third LED boards 41 to 43, but the current value is larger in the upstream LED boards. Therefore, the power supply system through-pass wiring path in the upstream LED substrate is formed wider than the power supply system through-pass wiring path in the downstream LED substrate. For example, the through-path wiring paths 75 and 76 for the LED power supply and the LED driver power supply in the first LED board 41 are wider than the through-path wiring paths 115 and 116 for the LED power supply and the LED driver power supply in the second LED board 42. Has been formed.

Further, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through path wiring path of the power supply system is larger in the upstream side connector than in the downstream side connector. For example, while the total number of the LED power supply terminals 89a and 89b and the LED driver power supply terminal 90 in the connectors 74 and 113 for connecting the first and second LED boards 41 and 42 is three, the second and second The total number of the LED power supply terminals 89 and the LED driver power supply terminals 90 in the connectors 114 and 143 for connecting the 3LED boards 42 and 43 is two.

As a result, it is not necessary to use an unnecessarily thick power supply system wiring path or an unnecessarily large connector in the LED board on the downstream side while securing a necessary voltage for each LED board, thereby improving wiring space efficiency. It is possible.

[Fourth LED board 44]
As shown in FIG. 3, the fourth LED substrate 44 includes a substrate body 172 having wiring layers on both front and rear surfaces, for example, a vertically long substantially rectangular shape. As shown in FIG. 11, the board main body 172 has an upstream side connector (board connecting connector) 173, a downstream side connector (board connecting connector) 174, and an LED power source for connecting the connectors 173 and 174. , LED driver power supply, signal, clock and ground through path wiring lines (predetermined wiring path) 175 to 179 and LED driver power supply, signal, clock and ground through path wiring paths 176 to 179. Of the LED driver 180, the LED driver 180 and the protection resistors 181, 182 and the LEDs 183 to 186 connected in series between the LED driver 180 and the through path wiring line 175 for LED power supply. For example, two sets of six RGB terminals and, for example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c, which connect between the downstream side connector 174, and the wiring for the blower power source that connects between the connectors 173 and 174. A path 189a and a blast ground wiring path 189b are provided.

The upstream-side connector 173 has, for example, two LED power supply terminals 89a and 89b to which the LED power supply through-pass wiring path 175 is connected, and one LED driver power supply terminal 90 to which the LED driver power-supply through-pass wiring path 176 is connected. , One signal terminal 91 to which the signal through-pass wiring path 177 is connected, one clock terminal 92 to which the clock through-path wiring path 178 is connected, and the ground through-path wiring path 179 are connected. For example, three ground terminals 93a to 93c, a blast power supply terminal 190a to which the blast power supply wiring path 189a is connected, and a blast ground terminal 190b to which the blast ground wiring path 189b is connected are provided. The terminals are arranged in a line, for example. Each one on both ends in the terminal arrangement direction serves as a blower power supply terminal 190a and a blower ground terminal 190b. Regarding the eight terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the upstream connector 173, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, the signal terminal 91, and the clock. The terminal 92 and the ground terminal 93c are arranged in that order.

The downstream-side connector 174 includes, for example, one LED power supply terminal 89 to which a through-pass wiring path 175 for LED power supply is connected and, for example, one LED-driver power supply terminal 90 to which a through path wiring path 176 for LED driver power supply is connected. , For example, one signal terminal 91 to which the signal through-pass wiring path 177 is connected, one clock terminal 92 to which the clock through-path wiring path 178 is connected, and the ground through-path wiring path 179 are connected. For example, two ground terminals 93a, 93b and, for example, two sets of six LED drive wiring paths 187a to 187c, 188a to 188c are connected, for example, two sets of six LED connection terminals 191a to 191c, 192a to 192c, and a blower. A blower power supply terminal 190a connected to the power supply wiring path 189a and a blower ground terminal 190b connected to the ventilation ground wiring path 189b are provided, and a total of 14 terminals are arranged in two rows, for example, seven terminals each. There is. Then, for example, two terminals on one end side in the terminal arrangement direction of the two rows are a blower power supply terminal 190a and a blower ground terminal 190b.

As described above, in the fourth LED board 44, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 173, that is, the LED power supply, LED driver power supply, and ground through-path wiring paths 175, 176, and 179 (here, in total). 6) is larger than the number of terminals (4 in this case) corresponding to the same wiring paths 175, 176, 179 in the downstream connector 174. Regarding the twelve terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the downstream connector 174, for example, the LED power supply terminal 89, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, and the signal terminal are provided in one row. 91 and a clock terminal 92 are arranged in that order, and two sets of six LED connection terminals 191a to 191c and 192a to 192c are arranged in the other column.

FIG. 12 shows a specific wiring pattern of the fourth LED substrate 44 for each wiring layer. In the fourth LED substrate 44, LEDs 183 to 186 are provided on the front wiring layer 171a (FIG. 12A) on the front side, and upstream connectors 173 and downstream connectors 174 are provided on the rear wiring layer 171b (FIG. 12B) on the rear surface. , LED driver 180, protection resistors 181, 182, etc. are arranged respectively.

The upstream connector 173 is arranged, for example, on the lower end side of the back wiring layer 171b so that the terminal arrangement is in the left-right direction, and the downstream-side connector 174 is arranged, for example, on the upper end side of the back wiring layer 171b, in the vertical direction. Has been done.

Each terminal of the connectors 173 and 174 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction. The blower power supply terminal 190a and the blower ground terminal 190b on both ends of the upstream side connector 173 are connected to the blower power supply wiring path 189a and the blower ground wiring path 189b from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, the blower power supply terminal 190a and the blower ground terminal 190b on the lower end side of the downstream side connector 174 are provided with the blower power supply wiring path 189a and the blower ground wiring path 189b outside in the terminal arrangement direction (here, the vertical direction). Is connected from. In this way, the wiring path 189a for the blast power supply and the wiring path 189b for the blast ground are arranged from the outer side in the terminal arrangement direction with respect to the outermost terminals 190a, 190b in the arrangement direction among the plurality of terminals of the connectors 173, 174. Since they are connected, it is easy to avoid interference with other wiring paths even though the wiring path 189a for blast power supply and the wiring path 189b for blast ground are formed to be wide. Further, since the blast power supply terminal 190a and the blast ground terminal 190b are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the blast power supply wiring path 189a and the blast ground wiring path 189b are connected to the blast power supply terminal 190a, By connecting to the long side of the blast ground terminal 190b, it is possible to secure a larger cross-sectional area of the connection portion.

In the fourth LED substrate 44, in addition to the wiring path 189 a for the blast power supply and the wiring path 189 b for the blast ground, the through-path wiring paths 175 to 178 for the LED power supply, the LED driver power supply, the signal and the clock are provided via the via 96. Except for some bypasses that are avoided on the front wiring layer 171a side, almost all of them are provided on the back wiring layer 171b side. That is, the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b are arranged along the left edge portion 172a of the substrate body 172 on the back wiring layer 171b, and are used for LED power supply, LED driver power supply, signal The through-path wiring paths 175 to 178 for clocks are also arranged on the rear surface wiring layer 171b along the right edge portion 172b of the substrate body 172.

The LED driver power supply wiring path 193 branched from the LED driver power supply through path wiring path 176 is connected to the power supply terminal of the LED driver 180, and the signal wiring path 194 branched from the signal through path wiring path 177 is connected to the LED driver. A clock wiring path 195 connected to the signal terminal of 180 and branched from the through path wiring path 178 for clock is connected to the clock terminal of the LED driver 180.

Here, the LED driver 180 and the protection resistors 181 and 182 corresponding to the LED driver 180 are sandwiched by, for example, the blast power supply wiring path 189a, the blast ground wiring path 189b, and the through-path wiring paths 175 to 178. It is arranged in the approximate center of.

Further, one or more solid ground patterns 196 are provided on the back wiring layer 171b. The solid ground pattern 196 constitutes a through-pass wiring path (ground wiring path) 179 for ground together with the solid ground pattern 197 on the front surface wiring layer 171a side, and for example, the upstream side via the via 96, the solid ground pattern 197, etc. It is connected to the ground terminals 93 a to 93 c of the connector 173, the ground terminals 93 a and 93 b of the downstream connector 174, and the ground terminal of the LED driver 180.

The solid ground pattern 196 of the back wiring layer 171b is partially (or entirely) arranged between the LED driver 180 and the substrate main body 172, and a wiring path group including a through path wiring path 178 for clock around the same. That is, it is surrounded by wiring paths such as the ventilation power supply wiring path 189a, the ventilation ground wiring path 189b, and the through path wiring paths 175 to 178. The solid ground pattern 196 is electrically connected to the ground terminals 93a to 93c of the upstream connector 173 and the ground terminals 93a and 93b of the downstream connector 174 via the via 96, the solid ground pattern 197, and the like. Further, among the vias 96 that connect the solid ground pattern 196 and the solid ground pattern (ground wiring path, second conductor pattern) 197 on the front wiring layer 171a side, the vias 96 arranged in the arrangement region of the LED driver 180. However, for example, the LED drivers 180 are intensively arranged in the central region in the arrangement region. As a result, the LED driver 180 can be effectively radiated through the solid ground pattern 196 and the via 96, and the adverse effect of noise picked up by the solid ground pattern 196 can be eliminated as much as possible.

The LEDs 183 to 186 driven by the LED driver 180 are arranged in a row at substantially constant intervals in the longitudinal direction (vertical direction) of the front wiring layer 171a, for example. The upper LEDs 183 and 184 and the lower LEDs 185 and 186 are connected by an inter-LED wiring path 198, respectively. The LEDs 183 to 186 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center.

Further, the anode electrodes of the LEDs 183 and 186 are connected to the LED power supply through-path wiring path 175 via the LED power supply wiring path 200 extending over the rear wiring layer 171b side via the via 96, and the cathodes of the LEDs 184 and 185 are connected. The electrodes are connected to the protective resistors 181 and 182 via the cathode-side wiring path 201 that extends across the rear wiring layer 171b side with the via 96 interposed therebetween. The LED power supply wiring path 200 and the cathode side wiring path 201 are provided with heat radiating parts 105a and 105b similar to those of the first LED substrate 41 and the like.

Further, for example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c are arranged in the front wiring layer (second wiring layer) 171a. The LED drive wiring paths 187a to 187c and 188a to 188c are connected at their upstream ends to the RGB terminals 180a to 180f of the LED driver 180 on the back wiring layer 171b side via vias (interlayer conduction portions) 96a to 96f, respectively (FIG. 13(b2)), and the downstream ends are connected to the LED connection terminals 191a to 191c, 192a to 192c of the downstream connector 174 on the back wiring layer (first wiring layer) 171b side via vias (interlayer conduction portions) 96g to 96l, respectively. (FIG. 13(a2)).

The LED drive wiring paths 187a to 187c and 188a to 188c are, for example, in the terminal arrangement direction (here, the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the downstream connector 174, as shown in FIG. 13(a2). The vias 96g to 96l are drawn out in parallel in a direction orthogonal to each other (horizontal direction here) and are connected to the vias 96g to 96l, respectively. The vias (interlayer conductive portions) 96g to 96l are arranged in the terminal arrangement direction of the downstream side connector 174 (here, the vertical direction). ) Are arranged in a line, for example, so as to be inclined.

Here, the diameter of the vias 96g to 96l is larger than the pitch of the LED drive wiring paths 187a to 187c, 188a to 188c (here, the same as the pitch of the LED connection terminals 191a to 191c, 192a to 192c) in the vicinity of the downstream connector 174. By arranging the vias 96g to 96l obliquely with respect to the terminal arrangement direction of the downstream side connector 174 in this manner, it is possible to arrange the vias 96g to 96l with high space efficiency while avoiding mutual interference. ..

On the front wiring layer 171a side, as shown in FIG. 13(a1), among the LED drive wiring paths 187a to 187c and 188a to 188c, the LED drive wiring paths (specific wiring path) 188c excluding the LED drive wiring path (specific wiring path) 188c on the one end side. The paths (predetermined wiring paths) 187a to 187c, 188a, and 188b are drawn from the vias 96g to 96k, for example, obliquely downward (first direction) substantially parallel to each other, and further downward, for example, via the bending portions 271a to 271e ( They are arranged substantially parallel to each other in the second direction). Further, the LED drive wiring path (specific wiring path) 188c on the one end side is drawn out, for example, downward (second direction) from the via 96l. The refraction portions 271a to 271e are arranged in a substantially linear shape, and the via 96l corresponding to the LED drive wiring path (specific wiring path) 188c is arranged on the straight line.

Here, both the first direction (diagonally downward) and the second direction (downward) are the directions of pulling out the LED drive wiring paths 187a to 187c, 188a to 188c from the downstream side connector 174 (sideways) on the back wiring layer 171b side. However, one of the first direction and the second direction may be the same as the drawing direction.

Further, the LED drive wiring paths 187a to 187c and 188a to 188c are parallel to a direction orthogonal to, for example, the terminal arrangement direction (here, the left-right direction) from the RGB terminals 180a to 180f of the LED driver 180, as shown in FIG. 13(b2). Are connected to the vias 96a to 96f, respectively, and these vias (interlayer conduction portions) 96a to 96f are in a zigzag shape along the terminal arrangement direction (here, left and right direction) of the RGB terminals 180a to 180f in the LED driver 180. Are arranged in. The vias 96a and 96b, the vias 96c and 96d, and the vias 96e and 96f are examples of the first inclined array portion in the first diagonal direction (for example, rising to the right in FIG. 13(b2)). The via 96c, the via 96d, and the via 96e are each an example of a second inclined array portion in the second oblique direction (for example, to the lower right in FIG. 13B2).

Here, the diameter of the vias 96a to 96f is larger than the pitch of the LED drive wiring paths 187a to 187c and 188a to 188c near the RGB terminals 180a to 180f of the LED driver 180 (here, the same as the pitch of the RGB terminals 180a to 180f). By arranging the RGB terminals 180a to 180f in a zigzag shape along the terminal arrangement direction in this manner, the vias 96a to 96f can be arranged with high space efficiency while avoiding mutual interference. There is.

On the side of the front wiring layer 171a, as shown in FIG. 13(b1), the LED drive wiring paths 187a to 187c and 188a to 188c are drawn out from the vias 96a to 96f, for example, in an upward direction (first direction) substantially parallel to each other. Further, they are arranged substantially parallel to each other, for example, obliquely upward (second direction) via refraction portions 272a to 271f. The refraction portions 272a to 272f are arranged in a substantially linear shape. The first direction is the same as the pulling direction of the LED drive wiring paths 187a to 187c and 188a to 188c on the rear wiring layer 171b side from the LED driver 180, and the second direction is different from the same pulling direction. The first direction and the second direction may be different from the same drawing direction.

The inter-LED wiring path 198, the LED power supply wiring path 200, and the cathode side wiring path 201 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fourth LED substrate 44, the wiring path 189a for the blast power supply and the wiring path 189b for the blast ground are through-path wiring paths 177 and 178 for signals and clocks for driving the LEDs 183 to 186, a signal wiring path 194, and a clock. It is formed wider than the digital signal wiring path such as the wiring path 195.

[Fifth LED substrate 45]
As shown in FIG. 3, the fifth LED board 45 includes a board body 212 having wiring layers on both front and rear surfaces, for example, a vertically long rectangular shape. As shown in FIG. 11, the board main body 212 has an upstream side connector (board connecting connector) 213, a downstream side connector (board connecting connector) 214, and an LED power source for connecting the connectors 213 and 214. Protection connected in series between the LED driver power supply, signal, clock, and ground through-pass wiring paths (predetermined wiring paths) 215 to 219, and the LED power supply through-path wiring path 215 and the upstream connector 213. Resistors 220 and 221, LEDs 223 to 226, and a blower connector (connector for producing means) 227 are provided.

The upstream connector 213 is connected to the downstream connector 174 on the fourth LED board 44 side by the harness 66 and has the same terminal configuration as the downstream connector 174. One of the downstream side connectors 214 has a terminal configuration different from that of the upstream side connector 213. For example, one LED power source terminal 89 to which the through path wiring line 215 for the LED power source is connected and a through path wiring line for the LED driver power source. For example, one LED driver power supply terminal 90 to which 216 is connected, one signal terminal 91 to which a signal through pass wiring path 217 is connected, and one clock terminal to which a clock through path wiring path 218 is connected, for example. 92 and, for example, two ground terminals 93a and 93b to which the through-pass wiring path 219 for ground is connected, and these six terminals in total are arranged in one row, for example. For the six terminals of the downstream connector 214, for example, an LED power supply terminal 89, a ground terminal 93a, an LED driver power supply terminal 90, a ground terminal 93b, a signal terminal 91, and a clock terminal 92 are arranged in that order.

The blower connector 227 is connected to the blower means 37a of the blower producing means 37 by the harness 68, and is provided with a blower power supply terminal 229a and a blower ground terminal 229b. The blower power supply terminal 229a of the blower connector 227 is connected to the blower power supply terminal 190a of the upstream side connector 213 via the blower power supply wiring path 228a, and the blower ground terminal 229b is connected to the upstream side via the blower ground wiring path 228b. It is connected to the blast ground terminal 190b of the connector 213.

FIG. 14 shows a specific wiring pattern of the fifth LED substrate 45 for each wiring layer. In the fifth LED substrate 45, the LEDs 223 to 226 and the protective resistors 220 and 221 are provided on the front wiring layer 211a (FIG. 14A) on the front side, and the rear wiring layer 211b (FIG. 14B) on the rear side is provided with the upstream connector. 213, a downstream side connector 214, a blower connector 227, etc. are arranged respectively.

The upstream connector 213 is arranged, for example, on the lower end side of the back wiring layer 211b so that the terminal arrangement is in the vertical direction, and the downstream connector 214 is, for example, arranged on the upper end portion side of the back wiring layer 211b in the vertical direction. The blower connector 227 is arranged, for example, on one side of the upper end portion of the back surface wiring layer 211b so that the terminal arrangement is in the vertical direction.

Each of the terminals of the connectors 213, 214, 227 is, for example, rectangular and is formed in an elongated shape orthogonal to the arrangement direction. The blower power supply terminal 190a and the blower ground terminal 190b, for example, on the lower end side of the upstream connector 213 are connected to the blower power supply wiring path 228a and the blown ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). The blower power supply terminal 229a and the blower ground terminal 229b of the blower connector 227 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). ..

In the fifth LED substrate 45, for example, with regard to the wiring path 228a for the blast power supply, the wiring path 228b for the blast ground, and the through-path wiring path 215 for the LED power supply, for example, substantially the entire rear wiring layer 211b different from the LEDs 223 to 226 is provided. Although provided on the side, the through paths wiring paths 216 to 218 for the LED driver power supply, the signals, and the clock, except for a predetermined range near both ends thereof, that is, the connection portions to the connectors 213 and 214, for example. Almost all of the LEDs are provided on the same side of the front wiring layer 211a as the LEDs 223 to 226.

That is, the blast power supply wiring path 228a is arranged along the right edge portion 212b of the substrate body 212 on the back wiring layer 211b, and the blast ground wiring path 228b is located on the back wiring layer 211b at the left edge portion 212a of the substrate body 212. Are arranged along. In addition, the through-pass wiring path 215 for the LED power supply is arranged on the back surface wiring layer 211b along, for example, the ventilation power supply wiring path 228a. The LED power supply wiring paths 231 and 232 branched from the LED power supply through-path wiring path 215 are connected to the anode electrodes of the LEDs 223 and 225, for example, via the vias 96.

Further, the LED driver power supply, signal, and clock through-path wiring paths 216 to 218 are arranged in the vertical direction, for example, on the right edge portion 212b side of the front surface wiring layer 211a, and their upstream end sides are rear wirings via the vias 96, respectively. The LED driver power supply terminal 90, the signal terminal 91, and the clock terminal 92 of the upstream connector 213 are respectively connected on the layer 211b side, and the downstream end side is respectively passed through the via 96, and the LED driver power supply terminal of the downstream connector 214 is connected on the rear wiring layer 211b side. 90, a signal terminal 91, and a clock terminal 92, respectively.

One or more solid ground patterns 233 are provided on the front wiring layer 211a. The solid ground pattern 233 constitutes a through path wiring path (ground wiring path) 219 for ground together with the solid ground pattern 234 on the back wiring layer 211b side, and for example, the connector 213 via the via 96, the solid ground pattern 234, and the like. , 214 to the ground terminals 93a and 93b.

The LEDs 223 to 226 are arranged, for example, in a row at substantially regular intervals in the longitudinal direction (vertical direction) of the front wiring layer 211a. The LEDs 223 and 224 on the upper side and the protection resistors 220 arranged on the lower side and the like are connected in series by the inter-LED wiring line 235 and the cathode side wiring line 236, and are arranged on the lower LEDs 225 and 226 and the lower side and the like. The protection resistor 221 is connected in series by the inter-LED wiring path 237 and the cathode side wiring path 238. As shown in FIGS. 14 and 15, the protection resistor 220 extends from the front wiring layer (second wiring layer) 211a to the rear wiring layer (first wiring layer) 211b with the vias 96m to 96o interposed therebetween. The LED drive wiring paths 239a to 239c are connected to the LED connection terminals 191a to 191c of the upstream side connector 213, and the protection resistor 221 includes the rear wiring layer (from the front wiring layer (second wiring layer) 211a via the vias 96p to 96r). It is connected to the LED connection terminals 192a to 192c of the upstream connector 213 by the LED drive wiring paths 240a to 240c extending over the (first wiring layer) 211b side.

The LED drive wiring paths 239a to 239c and 240a to 240c are, for example, in the terminal arrangement direction (here, the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the upstream connector 213, as shown in FIG. 15B. The vias 96m to 96r are drawn out in parallel to the orthogonal direction and connected to vias (interlayer conductive portions) 96m to 96r, respectively, and these vias 96m to 96r constitute the first via group (interlayer conductive portion group) vias 96m to 96o. And the vias 96p to 96r forming the second via group (interlayer conduction portion group) are substantially parallel to each other and oblique to the terminal arrangement direction (here, the vertical direction) of the upstream connector 213. Are arranged in two columns.

Here, the diameters of the vias 96m to 96r are larger than the pitches of the LED drive wiring paths 239a to 239c and 240a to 240c (here, the same as the pitches of the LED connection terminals 191a to 191c and 192a to 192c) near the upstream connector 213. By arranging the plurality of via groups obliquely with respect to the terminal arrangement direction of the upstream side connector 213 and substantially parallel to each other in this way, the vias 96m to 96r are prevented from interfering with each other and high space efficiency is achieved. It is possible to place in.

Further, on the side of the front wiring layer 211a, as shown in FIG. 15A, the LED drive wiring paths 239a to 239c are drawn out, for example, upward from the vias 96m to 96o substantially parallel to each other, and the LED drive wiring paths 240a to 240c. Are drawn out from the vias 96p to 96r, for example, in a downward direction and substantially parallel to each other. In this way, the first via group and the second via group are different from each other in the direction of drawing out the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side.

The LED power supply wiring paths 231 and 232, the inter-LED wiring paths 235 and 237, and the cathode side wiring paths 236 and 238 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fifth LED substrate 45, the wiring path 228a for the blast power supply and the wiring path 228b for the blast ground are wider than the digital signal wiring paths such as the through-path wiring paths 217 and 218 for the signals for driving the LEDs and the clock. Is formed in.

[Sixth LED board 46]
As shown in FIG. 3, the sixth LED substrate 46 includes, for example, a substantially donut-shaped substrate body 242 having wiring layers on both front and rear surfaces. As shown in FIG. 11, the board main body 242 is provided with an upstream connector 243, an LED driver 244, LEDs 245-248, protective resistors 249, 250, and the like. The upstream connector 243 is connected to the downstream connector 214 on the fifth LED board 45 side by the harness 67 and has the same terminal configuration as that of the downstream connector 214.

FIG. 16 shows a specific wiring pattern of the sixth LED substrate 46 for each wiring layer. In the sixth LED substrate 46, LEDs 245 to 248 are provided on the front wiring layer 241a (FIG. 16A) on the front side, and upstream connectors 243, LED drivers 244 are provided on the rear wiring layer 241b (FIG. 16B) on the back surface. Protective resistors 249 and 250 are arranged respectively.

The upstream side connector 243 is arranged, for example, on the lower side of the back surface wiring layer 241b so that the terminal arrangement is substantially in the circumferential direction of the substrate body 242. The LED driver 244 is arranged at a position apart from the upstream connector 243 in the back wiring layer 241b, and, for example, protection resistors 249 and 250 connected to the RGB terminals of the LED driver 244 are arranged on both sides of the LED driver 244. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 244 of the upstream connector 243 are connected to each other by the LED driver power supply, signal, and clock wiring paths 251 to 253. The LED driver power supply, signal, and clock wiring paths 251 to 253 are, for example, substantially entirely provided on the back wiring layer 241b side.

The LEDs 245 to 248 are arranged, for example, at substantially constant intervals in the circumferential direction of the front wiring layer 241a, and for example, the LEDs 245 and 246 and the LEDs 247 and 248 are connected by the inter-LED wiring path 254, respectively. The LEDs 245 to 248 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center. Further, the anode electrodes of the LEDs 246 and 247 are connected to the LED power supply terminal 89 of the upstream connector 243 via the LED power supply wiring path 255 that extends to the rear wiring layer 241b side via the via 96, and are connected to the LEDs 245 and 248. The cathode electrode is connected to the protective resistors 249 and 250 via a cathode side wiring path 256 that extends across the back wiring layer 241b side with the via 96 interposed therebetween. The inter-LED wiring path 254, the LED power supply wiring path 255, and the cathode side wiring path 256 are provided with heat radiating portions 105a and 105b similar to those of the first LED board 41 and the like.

For example, a solid ground pattern 257 is provided on the front wiring layer 241a. This solid ground pattern 257 constitutes a ground wiring path 259 together with the solid ground pattern 258 and the like on the back wiring layer 241b side. For example, via the via 96, the solid ground pattern 258 and the like, the ground terminal 93a of the upstream connector 243, 93b and the ground terminal of the LED driver 244.

A part of the solid ground pattern (first conductor pattern) 258 is arranged between the LED driver 244 and the substrate body 242. Further, of the vias 96 that connect the solid ground pattern 258 and the solid ground pattern (ground wiring path, second conductor pattern) 257 on the front wiring layer 241a side, the vias arranged in the arrangement region of the LED driver 244. 96 is arranged in the vicinity of, for example, one edge of the LED driver 244 in accordance with the arrangement of the solid ground pattern 257 on the front wiring layer 241a side.

In the right wiring path 58 described above, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through path wiring path of the power supply system is larger in the connector on the upstream side than the connector on the downstream side. There are more people. For example, the total number of the LED power supply terminals 89a and 89b and the LED driver power supply terminal 90 in the connector 173 for connecting the front door relay board 56 and the fourth LED board 44 is three, whereas the fourth and fifth LEDs are The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 174 and 213 for connecting the boards 44 and 45 is two.

As a result, it is possible to increase the space efficiency of the wiring because it is not necessary to use an unnecessarily large connector in the LED board on the downstream side while ensuring the required voltage for each LED board.

FIG. 17 illustrates a second embodiment of the present invention. A part of the first embodiment is modified so that a conductor portion is provided on the back surface of the LED driver and the conductor portion and the solid ground pattern are connected by solder. An example is shown.

Explaining the LED driver 120 of the second LED substrate 42 (see FIG. 8) as an example, the LED driver (heat-generating component) 120 of the present embodiment includes a copper foil and other conductor portions 261 on its back surface. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Of course, the shape of the conductor portion 261 is arbitrary, and the conductor portion 261 may be provided on substantially the entire back surface of the LED driver 120.

Further, at the position where the LED driver 120 is arranged on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262, which is a portion of the solid ground pattern 134 exposed from the insulating film 106, is provided, for example, on the LED driver 120 side. It is provided corresponding to H.261. Although the vias 96 are arranged centrally in the area where the LED drivers 120 are arranged in the solid ground pattern 134, the conductors are exposed so as to include the areas where the vias 96 are arranged in the present embodiment. A section 262 is provided.

The conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side that face each other are connected by, for example, solder (conduction connecting means) 263. As a result, heat conduction from the LED driver 120 to the solid ground pattern 134 is promoted as compared with the first embodiment, so that the heat generated in the LED driver 120 can be radiated more efficiently.

In addition to the other LED driver 121 of the second LED substrate 42, the same configuration can be adopted for the LED drivers arranged on the other LED substrates 41, 43 and the like.

FIG. 18 exemplifies the third embodiment of the present invention, and a part of the second embodiment is modified so that a plurality of vias (interlayer conduction portions) provided in the arrangement region of the LED driver are connected to the LED driver. An example is shown in which not the central area in the arrangement area but the peripheral area in the arrangement area is arranged.

In the second LED substrate 42 of the second embodiment, as shown in FIG. 17, a part of the solid ground pattern 134 is arranged between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer. The vias 96 that connect to the solid ground pattern 135 on the 111a side are arranged centrally in the central region within the arrangement region of the LED driver 120. However, in the present embodiment, as shown in FIG. 96 are not arranged in the central area in the arrangement area of the LED driver 120, but are arranged substantially uniformly in the peripheral area outside the central area in the arrangement area.

Further, the LED driver 120 of the present embodiment has a conductor portion 261 such as a copper foil on the back surface thereof, as in the second embodiment. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Further, at the position where the LED driver 120 is arranged on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262, which is a portion of the solid ground pattern 134 exposed from the insulating film 106, is provided, for example, on the LED driver 120 side. It is provided corresponding to H.261. The conductor exposed portion 262 of the present embodiment is provided in a range that does not reach the via 96 provided in the peripheral region in the arrangement region of the LED driver 120.

The conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side that face each other are connected by, for example, solder (conduction connecting means) 263. In this way, when a plurality of vias (interlayer conductive portions) 96 provided in the arrangement area of the LED driver 120 are arranged in the peripheral area in the arrangement area of the LED driver, as in the second embodiment. Although the heat radiation effect may be inferior to the case of arranging in the central region, it is considered to be more excellent in terms of eliminating the adverse effect on the LED driver 120 due to the noise picked up by the solid ground pattern 134.

In addition, since the via 96 is not formed in the connection area formed by the solder 263, the LED driver 120 is more firmly fixed than when the via 96 is formed in the connection area formed by the solder 263 as in the second embodiment. it can. In that sense, the present embodiment is more effective in the case of a large heat generating component.

The vias 96 may be arranged not only in the peripheral region in the arrangement region of the LED drivers 120 but also in the central region inside thereof, and the peripheral region may have a higher arrangement density of the vias 96 than in the central region. .. In this case, for example, a part of the vias 96 may be provided in the connection area of the solder (conductive connection means) 263. Further, in the present embodiment, an example is shown in which the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side are connected by solder (conduction connecting means) 263, but as in the first embodiment. It is not necessary to perform the connection by the conductive connection means.

FIG. 19 illustrates a fourth embodiment of the present invention, which is a partial modification of the first embodiment, in which the substrate body of the LED substrate includes one or more intermediate layers in addition to the front and rear surface layers. In this example, the wiring layer is provided, and the drive wiring path and the ground wiring path for the speaker (predetermined rendering means) are provided in the intermediate layer.

FIG. 19 shows a specific wiring pattern of the third LED substrate 43 of this embodiment for each wiring layer. The third LED substrate 43 of this embodiment includes, for example, one intermediate layer 141c in addition to the front wiring layer 141a on the front side and the rear wiring layer 141b on the back side.

In the front surface wiring layer 141a, similarly to the front surface wiring layer 141a of the first embodiment, the LEDs 147 to 150 and the LED power supply wiring path 162, the inter-LED wiring path 161, the cathode side wiring path 163, and the solid ground pattern are connected. Although 159 and the like are arranged, the speaker drive wiring paths 154a to 154d are not provided. Similar to the second embodiment, the rear surface wiring layer 141b has upstream wiring 143, speaker connectors 144 and 145, LED driver 146, protection resistors 151 and 152, LED driver power supply, signal wiring, and clock wiring. The paths 155 to 157 and the solid ground pattern 158 are arranged respectively.

Further, the intermediate layer 141c is provided with speaker drive wiring paths 154a to 154d and a solid ground pattern 264. The speaker drive wiring paths 154a and 154b have one end side thereof connected to the rear wiring layer 141b side via the via 96 or the like to the speaker terminals 94a and 94b of the upstream connector 143 and the other end side thereof connected to the rear wiring layer 141b via the via 96 or the like. On the side, speaker terminals 153a and 153b of the speaker connector 144 are respectively connected. Further, the speaker drive wiring paths 154c and 154d have one end side thereof connected to the rear wiring layer 141b side through the via 96 or the like to the speaker terminals 94c and 94d of the upstream connector 143, and the other end side thereof connected through the rear surface via the via 96 or the like. On the layer 141b side, the speaker terminals 153c and 153d of the speaker connector 145 are respectively connected.

Further, the solid ground pattern 264 of the intermediate layer 141c constitutes the ground wiring path 160 together with the solid ground pattern 159 on the front wiring layer 141a side, the solid ground pattern 158 on the back wiring layer 141b side, etc. It is connected to the ground terminals 93a, 93b, etc. of the upstream connector 143 via the ground patterns 158, 159, etc.

As described above, the drive wiring path and the ground wiring path of the speaker (predetermined rendering means) are provided in the intermediate layer instead of the surface layer on which the LED driver 146 and other wiring paths are arranged, and the drive wiring provided in the intermediate layer. By sandwiching the road with solid ground patterns provided on the surface layers on both sides of the road, the adverse effect of noise can be eliminated as much as possible. Further, by providing the drive wiring path formed to be wider than the LED wiring path in the intermediate layer, the space of the surface layer can be utilized more effectively, and the substrate can be downsized. When two or more intermediate layers are provided, for example, a drive wiring path is provided on any one of the intermediate layers, and a solid ground pattern is provided on the layers on both sides of the intermediate layer (both the intermediate layer or the intermediate layer and one surface layer). It is desirable to provide it.

20 and 21 illustrate a fifth embodiment of the present invention, which is a partial modification of the first embodiment and includes red LED elements among red, green, and blue LED elements connected in parallel. An example in which a protection resistor is connected only to is shown.

FIG. 20 shows a specific wiring pattern for each wiring layer of the first LED substrate 41 of the present embodiment. The wiring pattern of the first LED substrate 41 of the present embodiment differs from that of the first embodiment (FIG. 5) in that the LEDs 84, 85 and the LEDs 86, 87 are protected only in the R wiring path corresponding to the red LED element. The only difference is that the resistors 82 and 83 are arranged and no protective resistance is arranged in the G wiring path and the B wiring path corresponding to the green LED element and the blue LED element.

In the LEDs 84, 85 and the LEDs 86, 87, the green LED elements 84G, 85G, 86G, 87G and the blue LED elements 84B, 85B, 86B, 87B shown in FIG. The operating voltage of the elements 84R, 85R, 86R, 87R is lower than that. Further, as shown in FIG. 21, the protection resistor 82 arranged in the R wiring path has a voltage (total value of operating voltage) VFR across the red LED elements 84R and 85R in the LEDs 84 and 85 and a voltage Vr across the protection resistor 82. The resistance value is set so that the sum of and becomes substantially equal to the respective voltage across the green LED elements 84G, 85G and the blue LED elements 84B, 85B (total value of operating voltages) VFG, VFB. The voltages (total value of operating voltages) VFG and VFB of the green LED elements 84G and 85G and the blue LED elements 84B and 85B are set to the power supply voltage V or less. A resistance value is similarly set for the protection resistor 83.

As described above, the protective resistor is connected in series only to the red LED element among the red, green, and blue LED elements connected in parallel, and the voltage across the red LED element and the voltage across the protective resistor are summed. Is substantially equal to the voltage across each of the green LED element and the blue LED element, it is not necessary to connect a protection resistor to each of the green and blue LED elements, so that the number of protection resistors can be reduced.

FIG. 22 illustrates a sixth embodiment of the present invention, which is a partial modification of the first embodiment, in which G, R, and B connected to three electrodes of G, R, and B provided in the LED are connected. An example in which a heat dissipation portion is provided in all of the three wiring paths B is shown.

As shown in FIG. 22A, for example, in the inter-LED wiring path 95 of the first LED substrate 41 (FIG. 5 etc.), the G wiring path 95G and the B wiring path 95B are respectively the cathode side G electrode KG of the LED 84, The B electrode KB is connected from the outside in the electrode arrangement direction, and in the vicinity of the connection portion, heat radiation portions 105a, 105a having a width wider than the other portions of the wiring paths are provided. Further, the heat radiating portions 105a and 105a are respectively provided with concave portions 265 from the inside (R wiring path 95R side) in the electrode arrangement direction toward the outside.

Further, in the R wiring path 95R of the inter-LED wiring path 95, at the connection portion with the cathode side R electrode KR of the LED 84, the width is widened on both sides in the electrode arrangement direction, and the widened end sides are the heat radiation portions 105a and 105a. A heat radiating portion 105c inserted in the recess 265 is provided.

As described above, by disposing the heat dissipation portion in all of the three wiring paths of G, R, and B connected to the three electrodes of G, R, and B provided in the LED, the heat generated in the LED is prevented. The heat can be dissipated more efficiently.

As shown in FIG. 22B, the heat dissipation portions 105a and 105a of the G wiring path 95G and the B wiring path 95B are not provided with the recesses 265, and the heat dissipation portion 105c of the R wiring path 95R is replaced with the heat dissipation portions 105a and 105a. It may be formed with a width that does not interfere.

FIG. 23 illustrates a seventh embodiment of the present invention, showing an example in which the arrangement of the LED drive wiring paths 187a to 187c and 188a to 188c (FIG. 13 and the like) in the first embodiment is partially changed. There is.

In the present embodiment, as shown in FIG. 23A, the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side are, for example, diagonally downward (first direction) from the vias 96g to 96l. They are drawn out substantially in parallel, and are further arranged substantially parallel to each other, for example, in the downward direction (second direction) via the refraction portions 271a to 271f. The refraction parts 271a to 271f are arranged in a substantially straight line. In this way, all the LED drive wiring paths 187a to 187c and 188a to 188c including the LED drive wiring path (specific wiring path) 188c on the one end side may be pulled out from the vias 96g to 96l in the first direction. Good.

Further, in the present embodiment, as shown in FIG. 23B, among the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side, the LED drive wiring path (specific wiring path) 187a on one end side is Except for the LED drive wiring paths (predetermined wiring paths) 187b, 187c, 188a to 188c, the LED driving wiring paths 187b, 187c, and 188a to 188c are drawn out from the vias 96b to 96f, for example, in an upward direction (first direction) substantially parallel to each other, and further via the bending portions 272b to 272f. For example, they are arranged diagonally upward (second direction) and substantially parallel to each other. Further, the LED drive wiring path (specific wiring path) 187a on one end side is led out, for example, obliquely upward (second direction) from the via 96a. The refraction portions 272b to 272f are arranged in a substantially linear shape, and the via 96a corresponding to the LED drive wiring path (specific wiring path) 187a is arranged on the straight line. As described above, even when the plurality of vias (interlayer conductive portions) 96a to 96f are arranged in a zigzag pattern along the arrangement direction of the plurality of terminals, a predetermined wiring path other than the specific wiring path on the one end side is selected from the plurality of wiring paths. The wiring paths are drawn out from the vias substantially in parallel to each other in the first direction, and the wiring paths are arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring paths are arranged so as to be drawn out from the vias in the second direction. Good.

24 and 25 illustrate the eighth and ninth embodiments of the present invention, respectively, and show an arrangement mode (FIG. 15 and the like) of the LED drive wiring paths 239a to 239c and 240a to 240c in the first embodiment. An example in which a part is changed is shown.

In the eighth embodiment, as shown in FIG. 24, among the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side, LEDs excluding the LED drive wiring path (specific wiring path) 239a on one end side are used. The drive wiring paths (predetermined wiring paths) 239b, 239c, and 240a to 240c are drawn out from the vias 96n to 96r, for example, in a lateral direction (first direction) substantially parallel to each other, and further upward, for example, via the bending portions 273b to 273f. They are arranged substantially parallel to each other (in the second direction). Further, the LED drive wiring path (specific wiring path) 239a on the one end side is led out, for example, in the upward direction (second direction) from the via 96m. The refraction portions 273b to 273f are arranged in a substantially straight line, and the via 96m corresponding to the LED drive wiring path (specific wiring path) 239a is arranged on the straight line. In this way, even when the plurality of via groups are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals, respectively, among the plurality of wiring paths, the predetermined wiring paths except the specific wiring path on one end side May be drawn out substantially parallel to each other in the first direction from the via and arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring path may be arranged to be drawn out from the via in the second direction. .. Further, the bent portions corresponding to the plurality of via groups may be arranged linearly.

Further, in the ninth embodiment, as shown in FIG. 25, the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are substantially laterally (first direction) from each other via the vias 96m to 96r, respectively. They are drawn out in parallel and are arranged, for example, in an upward direction (second direction) substantially parallel to each other via the refraction portions 273a to 273f. Then, the refraction portions 273a to 273c corresponding to the vias 96m to 96o forming the first via group (interlayer conduction portion group) are arranged in a substantially straight line, and the second via group (interlayer conduction portion group) is formed. The bent portions 273d to 273f corresponding to the vias 96p to 96r are also arranged in a substantially straight line. Here, the refraction portions 273a to 273c and the refraction portions 273d to 273f are not arranged on the same straight line, but both arrangements are substantially parallel to each other.

Thus, even when the plurality of via groups are arranged substantially parallel to each other and obliquely to the arrangement direction of the plurality of terminals, the LED drive wiring path (specific wiring path) 239a on the one end side is included in the LED drive. All of the wiring paths 239a to 239c and 240a to 240c may be configured to be drawn out from the vias 96m to 96r in the first direction. The bent portions corresponding to different via groups may not be arranged on the same straight line. The arrangement of the refraction portions 273a to 273c and the arrangement of the refraction portions 273d to 273f may not be parallel to each other, or the refraction portions 273a to 273f may all be arranged on the same straight line.

Although the embodiment of the present invention has been described above in detail, the present invention is not limited to this embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the embodiment, a through-hole type via is used as an example of the interlayer conductive portion (so-called via), but a via in which a through-hole is filled with a conductive paste or the like may be used. In addition, the size (diameter) of the interlayer conductive portion such as the through hole may be changed depending on the type of wiring path such as the signal line and the ground line.

In the first embodiment, as shown in FIG. 13B, in arranging a plurality of vias (interlayer conduction portions) in a zigzag shape along the arrangement direction of the plurality of terminals 180a to 180f, a first inclined arrangement portion. Although the same number (2) of vias is used for each of the first and second inclined arrangement portions, the number of vias of the first and second inclined arrangement portions may be three or more, and the number of vias for the first and second inclined arrangement portions may be three or more. The number of vias may not be the same as that of the second inclined array portion.

In the first embodiment, as shown in FIG. 15, a plurality of via groups (interlayer conduction part groups) are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals 191a to 191c and 192a to 192c. In doing so, the number of vias in each via group is the same, but the number of vias in each via group may be different. Also, three or more via groups may be provided.

In the embodiment, the example in which the blowing effect means 37 is adopted as an example of the movable effect means capable of performing the predetermined operation by the driving means is shown, but the movable effect means is arranged, for example, on the front side of the game board, the front side of the front door 8 or the like. In addition to actuating the generated movable effect body by a drive means such as a motor, a vibration effect means for vibrating a predetermined portion (the firing handle 17, effect button 51, etc.) touched by the player may be used.

In the embodiment, among the first wiring path connected to the first electrode of the LED and the second and third wiring paths respectively connected to the second and third electrodes adjacent to both sides of the first electrode, Although the example in which the heat dissipation portions 105a and 105c are provided at least in the second and third wiring paths is shown, the central first electrode may be the G electrode or the B electrode. Further, the LED may be a monochromatic light emitting type which is composed of one LED element.

In the embodiment, in the fourth to sixth LED boards (first to third boards) 44 to 46, the fourth LED board (first board) 44 is provided with the LEDs (first LEDs) 183 to 186 of the fourth LED board 44, An LED driver (first LED driver) 180 that drives the LEDs (second LEDs) 223 to 226 of the fifth LED substrate (second substrate) 45 is provided, and an LED (third LED) is provided on the sixth LED substrate (third substrate) 46. Although the example in which 245 to 248 and the LED driver (third LED driver) 244 for driving them are provided is shown, the fourth LED substrate (first substrate) 44 is provided with the LED (first LED) 183 to the fourth LED substrate 44. LED drivers (first LEDs) 186, LEDs (second LEDs) 223 to 226 of the fifth LED substrate (second substrate) 45, and LEDs (third LEDs) 245 to 248 of the sixth LED substrate (third substrate) 46. Driver) 180 is provided, and the LED driver (first LED driver) 180 of the fourth LED substrate (first substrate) 44 and the LED (third LED) of the sixth LED substrate (third substrate) 46 are provided on the fifth LED substrate (second substrate) 45. ) A relay wiring path for connecting 245-248 may be provided.

In the embodiment, in the first and third LED boards 41, 43, the LED drivers 80, 81, 146 are provided on the rear wiring layers (first wiring layers) 71b, 141b, and the other front wiring layers (second wiring layers) 71a. , 141a are provided with drive wiring paths 88a to 88d and 154a to 154d for driving the speakers 36a and 36b, respectively. However, an LED driver is provided on the first wiring layer and a blowing effect means 37 is provided on the second wiring layer. A drive wiring path relating to movable effect means such as the above may be provided. In this case, LEDs may be provided on the second wiring layer. Alternatively, as in the fourth embodiment, an LED driver may be provided in the first wiring layer which is a surface layer, and a drive wiring path relating to movable production means such as the air blowing production means 37 may be provided in the second wiring layer which is an intermediate layer. ..

In the second embodiment, conductor exposure is performed so as to include the arrangement regions of the vias 96 so as to correspond to the vias 96 that are arranged intensively in the central region in the arrangement region of the LED drivers 120 in the solid ground pattern 134. Although the example in which the portion 262 is provided is shown, the conductor exposed portion 262 and the conductor portion 261 are provided so as to correspond to the peripheral region so as not to reach the via 96 arranged in the central region, and these are soldered (conductive connecting means). ) 263.

In the embodiment, the wiring paths of the first to sixth LED boards 41 to 46 arranged on the front door 8 are branched into the left wiring path 57 on the left side and the right wiring path 58 on the right side under the window hole 34. The first to sixth LED boards 41 to 46 may be connected in series in the order of, for example, the boards 41, 42, 43, 46, 45, 44 or vice versa without branching in the middle.

In the embodiment, the LED board arranged on the front door 8 has been described, but the same can be applied to the LED board arranged on the game component such as the central display unit 22 in the game board 5 or the like. In addition, it is possible to carry out in the same manner on a substrate other than the LED substrate, such as a production control substrate.

You may provide the measurement point (henceforth a test point) for verifying the waveform of the signal input into an LED driver on a wiring path. For example, if the wiring path for transmitting the signal to the LED driver is long, the waveform may be disturbed due to the influence of noise etc. on the way, but even if there is some disturbance in the waveform, the LED looks normal. Since it emits light, it is difficult to judge from the light emitting state of the LED whether the input signal to the LED driver is normal. Therefore, for example, by providing a test point on a signal wiring path, a clock wiring path, or the like connected to the LED driver and measuring the waveform of the signal at the test point, is the waveform of the signal input to the LED driver normal? It is possible to accurately verify whether or not. It should be noted that the test point is preferably provided as close to the LED driver as possible. Further, the test point may be provided exclusively for it, but a via such as a through hole may be used as the test point.

Note that, for example, in the case where test points are provided on a plurality of wiring paths that are drawn out substantially in parallel from a plurality of terminals arranged in a predetermined direction, as shown in the embodiment (FIG. 13, FIG. 15, FIG. 23 to FIG. 25, etc.). The vias may be arranged in the same manner (oblique, zigzag, etc.). In addition, in order to distinguish between a via such as a through hole and a test point, or in order to clearly show that it is a through hole used as a test point, a character such as "TP", etc. is provided near the test point on the board. It is desirable to provide a mark.

Further, in the embodiment, an example in which the present invention is applied to a pachinko machine has been shown, but the present invention can be similarly applied to various game machines such as an arrangement ball machine and a slot machine.

36a Upper first speaker (predetermined effect means)
36b Upper first speaker (predetermined effect means)
37 Movable effect means (predetermined effect means)
41-46 LED substrate 63, 64, 68 Harness 84-87 LED
88a-88d Speaker drive wiring path (drive wiring path)
124-127 LED
128a-128d Speaker drive wiring path (drive wiring path)
144, 145 Speaker connector 147-150 LED
154a to 154d Speaker drive wiring path (drive wiring path)
183-186 LED
189a Blower power supply wiring path (drive wiring path)
189b Winding ground wiring path (drive wiring path)
223~226 LED
227 Blower connector 228a Blower power supply wiring path (drive wiring path)
228b Wiring ground wiring path (drive wiring path)
245-248 LED

Claims (1)

An LED board on which an LED is mounted,
In a gaming machine provided with a predetermined effect means different from the LED,
A predetermined board connected to the downstream side of the LED board and to which the predetermined effect means is connected;
A drive wiring path for driving the predetermined effect means is provided on the LED substrate and the predetermined substrate,
The LED is provided on the first surface side of the LED substrate,
On the second surface side of the LED board, a first connector for connecting to an upstream board, a second connector for connecting to a downstream board, and a first connector and a second connector are arranged between the first connector and the second connector. LED driver
In the drive wiring path on the LED substrate, a first end portion and a second end portion arranged on the second surface side and an intermediate portion arranged on the first surface side are connected by an interlayer conduction portion. Cage,
The first end of the drive wiring path is connected to the first connector, and the second end of the drive wiring path is connected to the second connector, respectively.
A game machine characterized in that the middle portion of the drive wiring path is arranged so as to avoid the back side of the arrangement area of the LED driver .

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