JP6934086B2 - Pachinko machine - Google Patents

Description

The present invention relates to gaming machines such as pachinko machines and slot machines.

Various gaming machines such as pachinko machines are equipped with a large number of boards such as an LED board on which LEDs are mounted, a relay board, and a control board (Patent Document 1).

International Publication No. WO2013 / 136758A1

An object of the present invention is to provide a gaming machine capable of realizing more suitable board wiring.

According to the present invention, in a gaming machine having a plurality of substrates, the plurality of substrates include at least a first substrate and a second substrate, and the first substrate includes a first upstream connector, a first downstream connector, and the first. A first power supply system wiring path connected to the first upstream power supply terminal of the upstream connector and the first downstream power supply terminal of the first downstream connector, and a first circuit unit supplied with power from the first power supply system wiring path are provided. The second board includes a second connector, a second power supply system wiring path connected to the second power supply terminal of the second connector, and a second circuit unit connected to the second power supply system wiring path. The first downstream connector of the first board and the second connector of the second board are connected to each other, the number of the first upstream power supply terminals is a plurality, the number of the first downstream power supply terminals and the first downstream power supply terminal are provided. The number of the two power supply terminals is the same as the number of the first upstream power supply terminals, and one end side of the first power supply system wiring path is connected to the plurality of first upstream power supply terminals of the first power supply system wiring path. The other end side is connected to the first downstream power supply terminal, and the width of the first power supply system wiring path from the first upstream power supply terminal to the first downstream power supply terminal is wider than that of the second power supply system wiring path. The first circuit unit is connected to the first power supply system wiring path on the upstream side of the first downstream power supply terminal, and a predetermined board among the plurality of boards is a first wiring layer and a second. A plurality of wiring layers including a wiring layer are provided, and an electronic component in which a plurality of terminals are arranged in a predetermined direction on the first wiring layer and a plurality of electronic components connected to the plurality of terminals and arranged substantially in parallel with each other. A wiring path is provided, and a plurality of interlayer conductive portions for separately conducting the plurality of wiring paths on the second wiring layer side at positions different from the terminals are provided, and the plurality of interlayer conductive portions are provided with two or more interlayers. Divided into two or more interlayer conductive portions including a conductive portion, the two or more interlayer conductive portions of each interlayer conductive portion group are arranged in a row in an oblique direction with respect to the arrangement direction of the plurality of terminals. , The interlayer conductive portions are arranged substantially in parallel.

According to the present invention, more suitable board wiring can be realized .

It is an overall front view of the pachinko machine which concerns on 1st Embodiment of this invention. It is a back view of the front door of the pachinko machine and the front view of the inner frame. It is a figure which shows the arrangement of the LED board and the like in the front door of the pachinko machine. It is a wiring diagram of the left wiring path in the front door of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the pachinko machine. It is a figure which shows the heat radiating part provided in the connection part between the LED of the pachinko machine and a wiring path. It is a front view and the side sectional view of the LED driver mounting part in the 1st LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 2nd LED board of the pachinko machine. It is a front view and the bottom sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the pachinko machine. It is a wiring diagram of the right wiring path in the front door of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 4th LED board of the pachinko machine. It is a figure which shows each via arrangement of the vicinity of the downstream connector (a1) (a2) and the vicinity of an LED driver (b1) (b2) in the 4th LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 5th LED board of the pachinko machine. It is a figure which shows the via arrangement etc. in the vicinity of the upstream connector in the 5th LED board of the pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 6th LED board of the pachinko machine. It is a front view and the side sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine which concerns on 2nd Embodiment of this invention. It is a front view and the side sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine which concerns on 3rd Embodiment of this invention. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED substrate of the pachinko machine which concerns on 4th Embodiment of this invention. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED substrate of the pachinko machine which concerns on 5th Embodiment of this invention. It is explanatory drawing which shows the connection state of LED and protection resistance of the pachinko machine, and the relationship of the voltage across them. It is a figure which shows the heat radiating part provided in the connection part between the LED of the pachinko machine which concerns on 6th Embodiment of this invention, and a wiring path. It is a figure which shows the wiring pattern in the vicinity of the downstream connector (a) and the vicinity of the LED driver (b) in the fourth LED substrate of the pachinko machine according to the seventh embodiment of the present invention. It is a figure which shows the wiring pattern in the vicinity of the upstream connector in the 5th LED board of the pachinko machine which concerns on 8th Embodiment of this invention. It is a figure which shows the wiring pattern in the vicinity of the upstream connector in the 5th LED board of the pachinko machine which concerns on 9th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 16 illustrate a first embodiment in which the present invention is applied to a pachinko machine. In FIGS. 1 and 2, the gaming machine main body 1 has a rectangular outer frame 2 and an inner frame 4 pivotally attached to the front side of the outer frame 2 on one left and right side, for example, a hinge 3 on the left side. I have.

On the front side of the inner frame 4, a game board mounting frame 6 and the like for mounting the game board 5 are arranged on the upper side thereof, and a launching means 7, a lower speaker 10 and the like are arranged on the lower side, and the front side thereof. The front door 8 covering the above is pivotally attached to the hinge 9 on the same side as the hinge 3 so as to be openable and closable.

As shown in FIG. 2, the launching means 7 includes a sheet metal support plate 11, a launch rail 12 mounted on the front surface of the support plate 11, and a game ball mounted on the front surface of the support plate 11 for launching. A ball holding portion 13 held on the launch rail 12, a striking mallet 15 swingably supported around the drive shaft 14 in the front-rear direction on the front surface of the support plate 11, and a striking mallet mounted on the back side of the support plate 11 and striking mallet. The firing driving means 16 such as a rotary solenoid that drives the 15 in the striking direction via the driving shaft 14 is provided, and when the firing handle 17 on the front door 8 side is operated, the firing driving means 16 is provided according to the amount of operation. The striking mallet 15 is continuously driven in the striking direction (clockwise). As a result, the game balls supplied one by one on the launch rail 12 are launched toward the game area 5a of the game board 5 along the launch rail 12.

The game board 5 is mounted on the game board mounting frame 6 from, for example, from the front side, and is detachably fixed to the game board mounting frame 6 by one or a plurality of fixtures 18, and a game ball fired by the launching means 7 is attached to the front side thereof. The guide rail 21 for guiding the guide rail 21 is mounted in an annular shape, and in the game area 5a inside the guide rail 21, the central display unit 22, the ordinary symbol starting means 23, the special symbol starting means 24, the large winning means 25, and the ordinary winning are won. Various game parts such as means 26 are arranged.

In addition to the liquid crystal display type image display means 27, the central display unit 22 is provided with a normal symbol display means 28, a special symbol display means 29, a normal hold quantity display means 30, and the like. The image display means 27 constitutes an effect symbol display means 31, a special reserved number display means 32, and the like.

The ordinary symbol display means 28 is composed of two light emitting bodies (for example, LEDs) corresponding to two types of ordinary symbols, for example, “○” and “×”, and the ordinary symbol starting means 23 including a passing gate or the like is used as a game. The two light emitting bodies blink alternately for a predetermined time on condition that the ball is detected, and the hit judgment random value acquired at the time of detecting the game ball by the normal symbol starting means 23 matches the predetermined hit judgment value. In some cases, the light emitting body on the "○" side corresponding to the hit mode emits light, and in other cases, the light emitting body on the "x" side corresponding to the hit mode emits light, and the blinking ends. It has become.

It should be noted that the ordinary random number information such as the hit determination random number value acquired when the game ball is detected by the ordinary symbol starting means 23 is stored up to a predetermined upper limit reserved number, for example, four, and the symbol by the ordinary symbol display means 28. Every time the fluctuation starts, it is digested sequentially. The number of stored ordinary random number information (hereinafter referred to as the number of ordinary reserved numbers) is notified to the player by, for example, the number of emitted lights by the ordinary reserved number display means 30 having the same number of light emitters as the upper limit reserved number.

The special symbol starting means 24 is for starting the symbol variation by the special symbol displaying means 29, and includes, for example, two upper and lower starting winning means 24a and 24b, which are arranged below the central display unit 22. The upper start winning means 24a is a non-opening / closing type winning means having no opening / closing means or the like. The lower start winning means 24b can be switched between a closed state in which the game ball cannot enter (or is difficult to enter) and an open state in which the game ball can enter (or is easier to enter than the closed state) by the opening / closing means 33. In the winning means of the formula, when the stop symbol after the change of the normal symbol display means 28 becomes a winning mode and a normal profit state occurs, the normal symbol display means 28 is opened from the closed state to the open state for a predetermined time.

The special symbol display means 29 is composed of one or a plurality of, for example, a display means such as a 7-segment type capable of variablely displaying one special symbol, and the special symbol starting means 24 detects a game ball. That is, the special symbol is fluctuated for a predetermined time on condition that the game ball enters any of the upper and lower two starting winning means 24a and 24b, and the jackpot determination acquired at the time of entering the starting winning means 24a and 24b is performed. When the random number value matches a predetermined jackpot determination value, it stops in a predetermined jackpot mode (specific mode), and in other cases, it stops in, for example, an off mode.

The special random number information such as the jackpot determination random number value acquired when the game ball is detected by the special symbol starting means 24 is stored up to a predetermined upper limit reserved number, for example, four, and the symbol by the special symbol display means 29. Every time the fluctuation starts, it is digested sequentially. The storage number of the special random number information (hereinafter referred to as the special hold number) is notified to the player by the special hold number display means 32, for example, by the display number of the hold display image X.

The effect symbol display means 31 variablely displays the effect symbol in parallel with the variable display of the special symbol by, for example, the special symbol display means 29, and displays one or more, for example, three effect symbols in the left-right direction. It is configured so that it can be variablely displayed on the display screen 27a of the image display means 27 together with the effect image of When the ball wins, for example, the effect symbol is moved to the left so that the effect symbol starts to change according to one of a plurality of types of variation patterns at the same time as the special symbol starts to change, and finally stops at the same time as the special symbol stops changing. , Right, middle, etc. are stopped in a predetermined order.

The large winning means 25 is an opening / closing type winning means provided with an opening / closing plate 25a that can switch between an open state in which the game ball can enter and a closed state in which the game ball cannot enter. When the special symbol becomes a big hit mode and a special profit state occurs, the opening / closing plate 25a opens to the front side according to a predetermined opening pattern, and the game ball that has fallen on it is made to win a prize inside. ..

The front door 8 includes, for example, a resin door base 35 in which a window hole 34 corresponding to the front side of the game area 5a is formed. In the door base 35, for example, a pair of left and right upper first speakers 36a and 36b and a ventilation effect means 37 are arranged near the upper side of the window hole 34, and a pair of left and right upper second speakers 38a near the lower side of the window hole 34. , 38b are arranged. The blower effect means (movable effect means) 37 is for performing a blower effect to send wind toward the player sitting in front of the gaming machine main body 1, and is used by a sirocco fan or the like operated by a motor (drive means). The air blowing means 37a is provided, and is arranged adjacent to the upper first speaker 36b on the right side on the upper right end side of the door base 35 so that the air blowing port 37b faces diagonally forward and downward, for example.

Further, on the front side of the door base 35, as shown in FIG. 3, a plurality of (six in this case) LED substrates 41 to 46 are arranged around the window hole 34. That is, the first LED substrate 41 is arranged in the lower left portion of the window hole 34, the second LED substrate 42 is arranged in the upper left portion of the window hole 34, and the third LED substrate 43 is arranged substantially in the center in the left-right direction on the upper side of the window hole 34. A fourth LED substrate 44 is arranged at the lower right of the window hole 34, a fifth LED substrate 45 is arranged above the fourth LED substrate 44, and a sixth LED substrate 46 is arranged near the ventilation effect means 37 at the upper right portion of the window hole 34.

The first LED board 41 and the second LED board 42 are arranged between the upper second speaker 38a on the left side and the upper first speaker 36a along the window hole 34, and the third LED board 43 is the left and right upper first speakers. It is arranged between 36a and 36b. Further, the 4th LED board 44 and the 5th LED board 45 are arranged between the upper second speaker 38b on the right side and the blowing effect means 37 along the window hole 34, and the 6th LED board 46 is, for example, the blowing effect means. It is arranged on the outer periphery of the air outlet 37b of 37.

As shown in FIG. 1, on the lower front side of the door base 35, for example, an upper plate 47 for storing a game ball for supplying to the launching means 7 is arranged at a position on the left side, and the upper plate 47 is further arranged. On the lower side, a lower plate 48 for storing surplus balls and the like when the upper plate 47 is full is arranged on the left end side, and a launch handle 17 is arranged on the right end side, respectively.

Further, on the front side of the door base 35, an upper decorative cover 49 that substantially covers the periphery of the window hole 34 from the front side, and a lower decorative cover 50 that substantially covers the upper plate 47, the lower plate 48, and the like from the front side are attached. In the upper decorative cover 49, at least a portion corresponding to the front side of the first to sixth LED substrates 41 to 46 is a light emitting lens portion having translucency. On the lower decorative cover 50, for example, an effect button 51 that can be operated by a player is arranged substantially in the center of the front side of the upper plate 47 in the left-right direction, and a ball lending operation unit 52 is arranged on each side of the effect button 51.

As shown in FIG. 2, a glass unit 53 that substantially closes the window hole 34 from the rear side is detachably mounted on the back side of the door base 35, and the ball feeding means 54 and the lower plate guide are mounted on the lower side thereof. Means 55, front door relay board 56, and the like are arranged. The ball feeding means 54 supplies the game balls in the upper plate 47 one by one onto the launch rail 12, is arranged corresponding to the front side of the launch means 7, and operates in synchronization with the launch operation by the launch means 7. It is designed to do. The lower plate guiding means 55 guides the surplus ball when the upper plate 47 is full and the foul ball that has been launched by the launching means 7 but returned without reaching the game area 5a to the lower plate 48. For example, it is arranged adjacent to the ball feeding means 54 on the hinge 9 side thereof. Further, the front door relay board 56 includes an effect control board or the like arranged on the back side of the game board 5, first to sixth LED boards 41 to 46 on the front door 8 side, speakers 10, 36a, 36b, 38a, 38b, and air blower. It relays between various production means such as the production means 37, and is arranged between the door base 35 and the lower plate guiding means 55 on the rear side, for example.

Next, among the various game parts provided on the front door 8, wiring related to the first to sixth LED boards 41 to 46, the upper first speakers 36a and 36b, the upper second speakers 38a and 38b, and the ventilation effect means 37. This will be described in detail.

First, the wiring path on the front door 8 will be outlined. As shown in FIG. 3 and the like, the wiring paths of the first to sixth LED boards 41 to 46 are branched to the left and right along the window hole 34 from the front door relay board 56 arranged on the lower side of the front door 8. The first to third LED boards 41 to 43 form the left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 form the right wiring path 58 on the right side of the window hole 34. .. Further, the drive wiring paths of the upper first speakers 36a and 36b are provided on the left wiring path 57, and the drive wiring paths of the ventilation effect means 37 are provided on the right wiring path 58. The upper second speakers 38a and 38b are independent of the left and right wiring paths 57 and 58, and are connected to, for example, the front door relay board 56 via harnesses 59a and 59b.

The first to third LED boards (first to third boards) 41 to 43 constituting the left wiring path 57 are connected in series via harnesses 61 and 62, and the first LED board 41 on the most upstream side thereof is connected in series. , Is connected to the front door relay board 56 via the harness 60. In the left wiring path 57, a through-pass wiring path (predetermined wiring path) is provided on the first LED board 41 and the second LED board 42, and the LED arranged on the third LED board 43 and the LED are driven on the downstream side of the through-pass wiring path. The circuit part including the LED driver is connected. Further, the first LED board 41 and the second LED board 42 are also provided with a circuit unit including an LED and an LED driver for driving the LED, and are each connected to a through-pass wiring path. Further, a part of the drive wiring paths of the upper first speakers (predetermined effect means) 36a and 36b are provided on the first to third LED boards 41 to 43, and the third LED board 43 on the most downstream side and the upper first speaker 36a are provided. , 36b are connected via harnesses 63 and 64, respectively.

The fourth to sixth LED boards 44 to 46 constituting the right wiring path 58 are connected in series via harnesses 66 and 67, and the fourth LED board 44 on the most upstream side thereof is connected to the front door via the harness 65. It is connected to the relay board 56. In the right wiring path 58, a through-pass wiring path (predetermined wiring path) is provided on the fourth LED substrate (first substrate) 44 and the fifth LED substrate (second substrate) 45, and a sixth LED substrate is provided on the downstream side of the through-pass wiring path. A circuit unit including an LED (third LED) arranged on the (third substrate) 46 and an LED driver (third LED driver) for driving the LED (third LED) is connected. The fourth LED substrate (first substrate) 44 is also provided with a circuit unit including an LED (first LED) and an LED driver (first LED driver) for driving the LED (first LED), and is connected to a through-pass wiring path. An LED (second LED) is also provided on the fifth LED board (second board) 45, and this LED is driven by an LED driver (first LED driver) on the fourth LED board (first board) 44. Further, a part of the drive wiring path of the blower effect means (predetermined effect means) 37 is provided on the fourth and fifth LED boards 44 and 45, and the fifth LED board 45 and the blower means 37a of the blower effect means 37 are connected to the harness 68. It is connected via. In this embodiment, parts other than the LED, the LED driver, the protective resistor, the connector, and the like are omitted on the first to sixth LED substrates 41 to 46. Hereinafter, the configurations of the first to sixth LED substrates 41 to 46 will be described in detail.

[First LED board 41]
As shown in FIG. 3 and the like, the first LED substrate (first substrate) 41 includes a substrate main body 72 having wiring layers on both front and rear surfaces. The right edge portion 72a of the substrate body 72 is formed in a substantially arc shape along the lower left portion of the window hole 34, and the left edge portion 72b is formed substantially in the vertical direction, so that the substrate body 72 is formed from the upper side to the lower side. The width is gradually widened, and a notch 72c corresponding to the arrangement position of the upper second speaker 38a on the left side is formed in the lower left.

Then, as shown in FIG. 4, the first LED board 41 has an upstream connector (board connection connector) 73, a downstream connector (board connection connector) 74, and an LED connecting between the connectors 73 and 74. Through-pass wiring paths (predetermined wiring paths) 75 to 79 for power supply, LED driver power supply, signal, clock and ground, and through-pass wiring paths 76 to 79 for LED driver power supply, signal, clock and ground. For example, two LED drivers 80 and 81 branched from the connector, and protection resistors 82 and 83 connected in series between the RGB terminals of the LED drivers 80 and 81 and the through-pass wiring path 75 for the LED power supply. LEDs 84 to 87 and speaker drive wiring paths 88a to 88d for connecting the connectors 73 and 74 are provided. An example of the first circuit unit is a circuit unit including LED drivers 80, 81, LEDs 84 to 87, protection resistors 82, 83, etc., which are connected to the through-pass wiring paths 75 to 79.

The upstream connector 73 is connected to the front door relay board 56 via the harness 60, and is connected to, for example, two LED power supply terminals 89a and 89b and an LED driver power supply to which the through-pass wiring path 75 for the LED power supply is connected. For example, one LED driver power supply terminal 90 to which the through-pass wiring path 76 is connected, and for example one signal terminal 91 to which the through-pass wiring path (digital signal wiring path) 77 for signals is connected, and the through-pass wiring path for clock. For example, one clock terminal 92 to which (digital signal wiring path) 78 is connected, for example, three ground terminals 93a to 93c to which a through-pass wiring path 79 for ground is connected, and speaker drive wiring paths 88a to 88d are connected. The speaker terminals 94a to 94d are provided, and a total of 12 terminals thereof are arranged in two rows of, for example, six each. The speaker terminals 94a to 94d are a total of four terminals, two on each end side in the terminal arrangement direction of the two rows. In this way, by connecting the through-pass wiring path 75 for the LED power supply to the two LED power supply terminals 89a and 89b and connecting the through-pass wiring path 79 for the ground to the three ground terminals 93a to 93c, the harness side connector The electrical resistance generated at the contact part with is reduced.

Regarding the eight terminals other than the speaker terminals 94a to 94d in the connectors 73 and 74, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order in one row, and the other. The ground terminal 93b, the signal terminal 91, the clock terminal 92, and the ground terminal 93c are arranged in this order in the side row. Of course, the arrangement of the terminals on the connectors 73 and 74 is arbitrary.

FIG. 5 shows a specific wiring pattern of the first LED substrate 41 for each wiring layer. In the first LED substrate 41, LEDs 84 to 87 and the like are on the front wiring layer (second wiring layer) 71a on the front side, and the upstream connector 73 and the downstream connector 74 are on the back wiring layer (first wiring layer) 71b on the back side. LED drivers 80, 81, protection resistors 82, 83, etc. are arranged respectively.

Although substantially the entire surface of the front wiring layer 71a and the back wiring layer 71b is covered with the insulating film 106 (see FIG. 7), in FIG. 5, the insulating film 106 is ignored and the insulating film 106 is covered. The lower wiring path, etc. are shown by solid lines. The same applies to FIGS. 8, 10, 12, 14, 14 and 16, which will be described later.

The upstream connector 73 is arranged, for example, on the lower end side of the rear wiring layer 71b (FIG. 5B) so that the terminal arrangement is in the left-right direction, and the downstream connector 74 is arranged on the upper end side of the rear wiring layer 71b, for example. Are arranged so as to be in the vertical direction. Each terminal of the connectors 73 and 74 is, for example, rectangular, and is formed in an elongated shape in a direction orthogonal to the arrangement direction thereof. Then, for example, the speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 73 from the outside in the terminal arrangement direction (here, the left-right direction), and are upstream. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 73 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream connector 74 from the outside in the terminal arrangement direction (here, the vertical direction), and are downstream. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction).

As described above, the speaker drive wiring paths 88a to 88d are connected to the outermost terminals 94a to 94d in the arrangement direction of the plurality of terminals of the connectors 73 and 74 from the outside in the terminal arrangement direction. Although the speaker drive wiring paths 88a to 88d are formed to be wide, it is easy to avoid interference with other wiring paths. Further, since the speaker terminals 94a to 94d are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the speaker drive wiring paths 88a to 88d are connected by connecting them to the long side side of the speaker terminals 94a to 94d. It is possible to secure a larger cross-sectional area of the portion and suppress the resistance low.

The LEDs 84 to 87 are arranged in a row at substantially constant intervals along the longitudinal direction of, for example, the front wiring layer 71a (FIG. 5A). The LEDs 84 and 85 driven by the LED driver 80 are arranged vertically on the upper side of the front wiring layer 71a, for example, and are connected in series by the wiring path 95 between the LEDs. Further, the LEDs 86 and 87 driven by the LED driver 81 are arranged diagonally along the right edge portion 72a of the substrate main body 72 on the lower side of the front wiring layer 71a, for example, and are connected in series by the wiring path 95 between the LEDs. There is. The LEDs 84 to 87 are full-color light emitting types incorporating red, green, and blue LED elements. For example, on both the anode side and the cathode side, an R electrode corresponding to red and a G electrode corresponding to green (second). The electrode) and the B electrode (third electrode) corresponding to blue are provided side by side so that, for example, the R electrode (first electrode) is in the center.

Further, in the first LED substrate 41, in addition to the speaker drive wiring paths 88a to 88d, the through-pass wiring paths 75 to 78 for the LED power supply, the LED driver power supply, the signal, and the clock are, for example, both ends thereof, that is, the connector. Except for a predetermined range in the vicinity of the connection portions to the 73 and 74, substantially all of them are provided on the same front wiring layer (second wiring layer) 71a side as the LEDs 84 to 87.

That is, the speaker drive wiring paths 88a and 88b are arranged on the front wiring layer 71a along, for example, the right edge portion 72a, and are on the rear wiring layer 71b side via vias (interlayer conductive portions) 96 on both end portions. It is connected to the speaker terminals 94a and 94b of the connectors 73 and 74. Further, the speaker drive wiring paths 88c and 88d are arranged on the front wiring layer 71a along, for example, the left edge portion 72b, and the speakers at the connectors 73 and 74 on the rear wiring layer 71b side via the vias 96 on both ends thereof. It is connected to terminals 94c and 94d. The via 96 of the present embodiment is, for example, a through-hole type via in which a through hole is plated.

Further, the through-pass wiring paths 75 to 78 for the LED power supply, the LED driver power supply, the signal, and the clock are, for example, the front wiring layer 71a along the right side of the upper LED 84, 85 and the left side of the lower LED 86, 87. The LED power supply terminals 89a and 89b, the LED driver power supply terminal 90, and the signal in the connectors 73 and 74 on the rear wiring layer 71b side are arranged at both ends thereof so as to vertically traverse the substantially center in the width direction. It is connected to the terminal 91 and the clock terminal 92.

Then, the LED power supply wiring path 97 branched from the through-pass wiring path 75 for the LED power supply is connected to, for example, the anode electrodes of the LEDs 84 and 87, and the LED power supply wiring path 98 branched from the through-pass wiring path 76 for the LED driver power supply is formed. , The signal wiring path 99 connected to the power supply terminals of the LED drivers 80 and 81 and branched from the through-pass wiring path 77 for signals is connected to the signal terminals of the LED drivers 80 and 81 and branched from the through-pass wiring path 78 for clocks. The clock wiring path 100 is connected to the clock terminals of the LED drivers 80 and 81.

Further, the front wiring layer 71a is provided with solid ground patterns 101 at a plurality of locations including between the through-pass wiring paths 75 to 78 including the digital signal wiring path and the speaker drive wiring paths 88a to 88d. Each of these solid ground patterns 101 constitutes a through-pass wiring path (ground wiring path) 79 for the ground together with the solid ground pattern 102 and the like on the back surface wiring layer 71b side. For example, via a via 96, a solid ground pattern 102, and the like. It is connected to the ground terminals 93a to 93c of the connectors 73 and 74. Of the plurality of solid ground patterns 101, for example, the solid ground pattern 101a is arranged in a floating island shape under the LED 85 between the speaker drive wiring paths 88c and 88d and the through-pass wiring paths 75 to 78.

For example, the LED drivers 80 and 81 are arranged at a predetermined distance in the vertical direction in the substantially center of the rear wiring layer 71b, and are through-pass wiring paths (digital signal wiring paths) for signals and clocks on the front wiring layer 71a side. It is arranged at a position corresponding to 77 and 78. Further, a solid ground pattern 101a on the front wiring layer 71a side is provided corresponding to the arrangement range of the LED drivers 80 and 81. That is, on the front wiring layer 71a side, through-pass wiring paths 77 and 78 for signals and clocks and speaker drive wiring paths 88c and 88d are arranged with the solid ground pattern 101a in between, and the LED on the rear wiring layer 71b side. The drivers 80 and 81 are arranged at positions corresponding to the through-pass wiring paths 77 and 78 for signals and clocks, which are separated from the speaker drive wiring paths 88c and 88d, and the solid ground pattern 101a is the LED drivers 80 and 81. It corresponds to the arrangement range of.

In this way, the LED drivers 80, 81 and the digital signal wiring paths 77, 78, which can be noise sources, are collectively arranged at positions corresponding to each other in the rear wiring layer 71b and the front wiring layer 71a, and the speaker drive is vulnerable to noise. By arranging the wiring paths 88c and 88d away from the digital signal wiring paths 77 and 78 and the like and arranging the solid ground pattern 101a between them, the speakers are arranged from the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78. The adverse effect of noise on the drive wiring paths 88c and 88d can be eliminated as much as possible.

The protection resistors 82 and 83 are arranged, for example, in the vicinity of the LED drivers 80 and 81 in the rear wiring layer 71b, and one end side thereof is connected to the RGB terminals of the LED drivers 80 and 81 via the LED drive wiring path 103 and the other end. The side is connected to the cathode electrodes of the LEDs 85 and 86, respectively, via a cathode side wiring path 104 whose side straddles the rear wiring layer 71b side with the via 96 in between.

The rear wiring layer 71b is provided with a plurality of solid ground patterns 102 around the LED drivers 80 and 81 and the protection resistors 82 and 83. These solid ground patterns 102 are connected to each other via, for example, a plurality of vias 96, a solid ground pattern 101 on the front wiring layer 71a side, and the ground terminals 93a to 93c of the connectors 73 and 74 and the LED drivers 80 and 81. It is connected to the ground terminal of.

In the first LED substrate 41, the speaker drive wiring paths 88a to 88d are digital such as signal wiring paths 77 and 78 for driving LEDs 84 to 87, through-pass wiring paths 77 and 78 for clocks, signal wiring paths 99, and clock wiring paths 100. It is formed wider than the signal wiring path.

Further, in the first LED substrate 41, the following configurations are adopted in order to improve the heat dissipation efficiency of the LEDs 84 to 87 and the LED drivers 80 and 81 as examples of heat-generating components. First, for LEDs 84 to 87, heat radiating portions 105a and 105b wider than other parts in the wiring path are provided in the wiring path (that is, copper foil pattern) connected to the electrodes, and the heat radiating sections 105a and 105b are provided. The heat of the LEDs 84 to 87 is dissipated through the heat.

That is, as shown in FIG. 6, in the wiring path 95 between the LEDs and the wiring path 104 on the cathode side, for example, except for the central R wiring path (first wiring path) 95R and 104R, the G wiring path (second wiring) on both sides thereof. The heat radiating portion 105a is provided in the 95G, 104G and the B wiring paths (third wiring path) 95B, 104B. The heat radiating portion 105a is provided at, for example, a connection portion between the electrodes AG, AB, KG, and KB of G and B, and widens to the side opposite to the R wiring paths 95R and 104R, that is, to the outside in the electrode alignment direction. For example, it is formed in a rectangular shape. Further, in the LED power supply wiring path 97, for example, a rectangular heat radiating portion 105b that widens on both sides in the width direction is provided at the connection portion of the LEDs 84 and 87 with the electrodes AG, AR, and AB. As a result, the heat generated by the LEDs 84 and 87 can be efficiently dissipated via the heat radiating units 105a and 105b, and malfunctions due to overheating of the LEDs can be prevented.

Further, regarding the LED drivers 80 and 81, a part of the solid ground pattern (first conductor pattern) 102 is arranged between the LED drivers 80 and 81 and the substrate main body 72, and the LED drivers 80 and 81 are connected to the LED drivers 80 and 81 via the solid ground pattern 102. It is designed to dissipate heat. In the present embodiment, as shown in FIG. 7, a part of the solid ground pattern 102 is arranged under the LED drivers 80 and 81, and the LED drivers 80 and 81 have an insulating film 106 covering the solid ground pattern 102. It is fixed to the substrate body 72 with the back surface substantially in contact with the substrate. As a result, the heat generated by the LED drivers 80 and 81 can be efficiently dissipated through the solid ground pattern 102 having a large area, and malfunctions due to overheating of the LED drivers can be prevented.

[Second LED board 42]
As shown in FIG. 3 and the like, the second LED substrate (second substrate) 42 includes a substrate main body 112 having wiring layers on both front and rear surfaces. In the substrate main body 112, the right edge portion 112a is formed in a substantially arc shape along the upper left portion of the window hole 34, and the left edge portion 112b is formed in a substantially vertical direction, so that the right edge portion 112a is formed from the lower side to the upper side. It is gradually widening.

Then, as shown in FIG. 4, the board main body 112 has an LED power supply that connects the upstream side connector (board connection connector) 113, the downstream side connector (board connection connector) 114, and the connectors 113 and 114. Through-pass wiring paths (predetermined wiring paths) 115 to 119 for LED driver power supply, signal, clock and ground, and through-pass wiring paths 116 to 119 for LED driver power supply, signal, clock and ground. For example, two LED drivers 120 and 121 that are branched and connected, and protection resistors 122, 123 and LED 124 that are connected in series between the RGB terminals of the LED drivers 120 and 121 and the through-pass wiring path 115 for the LED power supply. ~ 127 and speaker drive wiring paths 128a to 128d for connecting the connectors 113 and 114 are provided. An example of the second circuit unit is a circuit unit including LED drivers 120, 121, LEDs 124 to 127, protection resistors 122, 123, etc., which are connected to the through-pass wiring paths 115 to 119.

The upstream connector 113 is connected to the downstream connector 74 on the first LED board 41 side by the harness 61, and has the same terminal configuration as the downstream connector 74. On the other hand, the downstream connector 114 has a different terminal configuration from the upstream connector 113, and for example, one LED power supply terminal 89 to which the through-pass wiring path 115 for the LED power supply is connected and the through-pass wiring path for the LED driver power supply. For example, one LED driver power supply terminal 90 to which 116 is connected, one signal terminal 91 to which a through-pass wiring path (digital signal wiring path) 117 for signals is connected, and a through-pass wiring path (digital signal wiring) for clocks. Road) For example, one clock terminal 92 to which 118 is connected, two ground terminals 93a and 93b to which a through-pass wiring path 119 for ground is connected, and speaker terminals 94a to which speaker drive wiring lines 128a to 128d are connected. ~ 94d, and a total of 10 terminals thereof are arranged in two rows, for example, five each. The speaker terminals 94a to 94d are a total of four terminals, two on each end side in the terminal arrangement direction of the two rows.

As described above, in the second LED board 42, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 113, that is, the through-pass wiring paths 115, 116, 119 for the LED power supply, the LED driver power supply, and the ground (total here). 6) is larger than the number of terminals corresponding to the same wiring paths 115, 116, 119 in the downstream connector 114 (4 in total here).

Regarding the six terminals other than the speaker terminals 94a to 94d in the downstream connector 114, for example, the LED power supply terminal 89, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order in one row, and the other side. The signal terminal 91, the clock terminal 92, and the ground terminal 93b are arranged in this order in the row. Of course, the arrangement of the terminals on the connector 114 is arbitrary.

FIG. 8 shows a specific wiring pattern of the second LED substrate 42 for each wiring layer. In the second LED substrate 42, LEDs 124 to 127 and the like are on the front wiring layer 111a (FIG. 8 (a)) on the front side, and the upstream connector 113 and the downstream connector are on the rear wiring layer 111b (FIG. 8 (b)) on the back side. 114, LED drivers 120, 121, protection resistors 122, 123, etc. are arranged respectively.

The upstream connector 113 is arranged so that the terminal arrangement is in the left-right direction on the lower end side of the rear wiring layer 111b, for example, and the downstream connector 114 is arranged so that the terminal arrangement is also in the left-right direction on the upper side of the rear wiring layer 111b, for example. Have been placed. Each terminal of the connectors 113 and 114 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (here, the left-right direction). Then, for example, the speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 113 from the outside in the terminal arrangement direction (here, the left-right direction), and are upstream. Speaker drive wiring paths 128c, 128d for the upper first speaker 36b are connected to the speaker terminals 94c, 94d on the other end side of the side connector 113 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream connector 114 from the outside in the terminal arrangement direction (here, the left-right direction), and are downstream. Speaker drive wiring paths 128c, 128d for the upper first speaker 36b are connected to the speaker terminals 94c, 94d on the other end side of the side connector 114 from the outside in the terminal arrangement direction (here, the left-right direction).

In the second LED substrate 42, for example, the through-pass wiring path 115 for the LED power supply has substantially the same front surface as the LEDs 124 to 127 except for a predetermined range on both ends thereof, that is, in the vicinity of the connection portion to the connectors 113 and 114. Although it is provided on the wiring layer 111a side, in addition to the speaker drive wiring paths 128a to 128d, the through-pass wiring paths 116 to 118 for the LED driver power supply, the signal, and the clock are provided on the front wiring layer 111a via the via 96. Except for some bypass portions to be avoided on the side, substantially all of them are provided on the rear wiring layer 111b side.

That is, the speaker drive wiring paths 128a and 128b are arranged along the right edge portion 112a on the rear wiring layer 111b, and the speaker drive wiring paths 128c and 128d are arranged along the left edge portion 112b on the rear wiring layer 111b. There is. Further, the through-pass wiring paths 116 to 118 are arranged in the vertical direction between, for example, the speaker drive wiring paths 128a and 128b and the speaker drive wiring paths 128c and 128d on the rear wiring layer 111b, and the upper and lower ends thereof are respectively connectors 113. , 114.

Then, the LED driver power supply wiring path 131 branched from the through-pass wiring path 116 for the LED driver power supply is connected to the power supply terminals of the LED drivers 120 and 121, and the signal wiring path 132 branched from the through-pass wiring path 117 for the signal is formed. The clock wiring path 133, which is connected to the signal terminals of the LED drivers 120 and 121 and branched from the through-pass wiring path 118 for the clock, is connected to the clock terminals of the LED drivers 120 and 121.

Here, the LED driver 120 and the corresponding protection resistor 122 are arranged above the downstream connector 114 in, for example, the rear wiring layer 111b, and the LED driver 121 and the corresponding protection resistor 123 are, for example, the rear wiring layer 111b. It is arranged between the speaker drive wiring paths 128c and 128d in the above and the through-pass wiring paths 116 to 118.

The LED power supply wiring path 131, the signal wiring path 132, and the clock wiring path 133 corresponding to the LED driver 120 are provided substantially upward from the downstream connector 114 or its vicinity, that is, in a substantially extension direction of the through-pass wiring paths 116 to 118. ing. As described above, since the downstream connector 114 of the second LED board 42 is arranged in the middle of the wiring path connecting the upstream connector 113 and the LED driver 120, the downstream connector is on the lowermost side of the second LED board 42. There is an advantage that the wiring path of the second LED substrate 42 is simplified as compared with the case where the 114 is arranged.

Further, for example, a plurality of solid ground patterns 134 are provided on the back surface wiring layer 111b. Each of these solid ground patterns 134 constitutes a through-pass wiring path (ground wiring path) 119 for the ground together with the solid ground pattern 135 and the like on the front wiring layer 111a side, for example, via via 96, the solid ground pattern 135, and the like. It is connected to the ground terminals 93a to 93c of the upstream connector 113, the ground terminals 93a and 93b of the downstream connector 114, and the ground terminals of the LED drivers 120 and 121.

As shown in FIG. 9 and the like, a part of the solid ground pattern (first conductor pattern) 134 is arranged between the LED driver 120 and the substrate main body 112, and the solid ground pattern 134 and the front wiring layer 111a side. One or more vias (interlayer conductive portions) 96 for connecting the solid ground pattern (ground wiring path, second conductor pattern) 135 of the LED driver 120 are provided both inside and outside the arrangement area of the LED driver 120, for example. ing. It is desirable that the vias 96 outside the arrangement area of the LED driver 120 are provided at one or a plurality of locations including the vicinity of the arrangement area. Further, the vias 96 corresponding to the arrangement area of the LED driver 120 are centrally arranged in the central area in the arrangement area of the LED driver 120, as shown in FIG. 9 and the like. By arranging the via 96 in the arrangement region of the LED driver 120 in this way, heat conduction to the solid ground pattern 135 on the front wiring layer 111a side is promoted, and heat dissipation can be expected from the inner surface of the via 96 as well. Moreover, by arranging the via 96 centrally in the central region of the LED driver 120 having the highest temperature, the heat generated by the LED driver 120 can be dissipated more efficiently. The vias 96 are arranged not only in the central region in the arrangement region of the LED driver 120 but also outside the central region (peripheral region) in the same arrangement region, and the vias 96 are located in the central region rather than in the peripheral region. The placement density of the LEDs may be increased. Further, the via 96 connecting the solid ground pattern (first conductor pattern) 134 and the front wiring layer 111a side may be provided only in the arrangement area of the LED driver 120.

Further, the solid ground pattern 134a among the plurality of solid ground patterns 134 of the rear wiring layer 111b is provided at a position corresponding to the LED driver 121. A part of the solid ground pattern (first conductor pattern) 134a is arranged between the LED driver 121 and the board main body 112, and wiring including a through-pass wiring path (clock wiring path) 118 for clock around the solid ground pattern (first conductor pattern) 134a. The road group is formed in a floating island shape surrounded by wiring paths such as speaker drive wiring paths 128c and 128d and through-pass wiring paths 116 to 118, and the front wiring layer 111a is formed by one or a plurality of vias (interlayer conductive portions) 96. It is electrically connected to the solid ground pattern (ground wiring path, second conductor pattern) 135 on the side. As a result, heat can be effectively dissipated from the LED driver 121 via the solid ground pattern 134a, and the adverse effect of noise picked up by the solid ground pattern 134a can be eliminated as much as possible.

Further, one or more vias 96 for connecting the solid ground pattern 134a on the rear wiring layer 111b side and the solid ground pattern 135 on the front wiring layer 111a side are provided both inside and outside the arrangement area of the LED driver 121. It is provided. The via 96 corresponding to the arrangement area of the LED driver 121 is arranged in the vicinity of one edge of the LED driver 121, for example, in accordance with the arrangement of the solid ground pattern 135 on the front wiring layer 111a side. By providing the via 96 in the arrangement area of the LED driver 121, the heat generated by the LED driver 121 can be dissipated more efficiently. Further, by providing the via 96 not only outside the arrangement area of the LED driver 121 but also inside the arrangement area, the adverse effect due to the noise picked up by the solid ground pattern 134a can be more effectively eliminated. The via 96 for connecting the solid ground pattern 134a to the solid ground pattern 135 may be provided only in the arrangement area of the LED driver 121, for example.

The LEDs 124 and 125 driven by the LED driver 120 are arranged on the left and right on the upper side of the front wiring layer 111a, for example, and are connected in series by the wiring path 136 between the LEDs. Further, the LEDs 126 and 127 driven by the LED driver 121 are arranged vertically on the lower side of the front wiring layer 111a, for example, and are connected in series by the wiring path 136 between the LEDs. The LEDs 124 to 127 are full-color light emitting types incorporating red, green, and blue LED elements. For example, on both the anode side and the cathode side, the R electrode corresponding to red and the G electrode corresponding to green are colored blue. Corresponding B electrodes are provided side by side so that, for example, the R electrode is at the center.

In the second LED board 42, the speaker drive wiring paths 128a to 128d are digital signal wirings such as signal and clock through-pass wiring paths 117 and 118 for driving the LED, signal wiring paths 132, and clock wiring paths 133. It is formed wider than the road.

Further, the through-pass wiring path 115 for the LED power supply is arranged so as to vertically traverse the substantially center of the front wiring layer 111a, and both ends thereof are connected to the connectors 113 and 114 on the rear wiring layer 111b side via vias 96 and the like. There is. Then, the LED power supply wiring path 137 branched from the LED power supply through-pass wiring path 115 is connected to, for example, the anode electrodes of the LEDs 125 and 127, and the cathode electrodes of the LEDs 124 and 126 sandwich the via 96 and the rear wiring layer 111b. It is connected to the protection resistors 122 and 123 via the cathode side wiring path 138 that straddles the side. The LED inter-LED wiring path 136, the LED power supply wiring path 137, and the cathode side wiring path 138 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41.

[Third LED board 43]
As shown in FIG. 3 and the like, the third LED substrate (third substrate) 43 includes, for example, a horizontally long substantially rectangular substrate main body 142 having wiring layers on both front and rear sides. Then, as shown in FIG. 4, the board main body 142 has an upstream connector (board connection connector) 143, a pair of speaker connectors (directing means connection connector) 144, 145, an LED driver 146, LEDs 147 to 150, and a protective resistor. 151, 152 and the like are provided.

The upstream connector 143 is connected to the downstream connector 114 on the second LED board 42 side by the harness 62, and has the same terminal configuration as the downstream connector 114. The speaker connectors 144 and 145 are connected to the upper first speakers 36a and 36b by harnesses 63 and 64. The speaker connector 144 has speaker terminals 153a and 153b, and the speaker connector 145 has speaker terminals 153c. 153d are provided respectively. The speaker terminals 153a and 153b of the speaker connector 144 are connected to the speaker terminals 94a and 94b of the upstream connector 143 via the speaker drive wiring paths 154a and 154b, and the speaker terminals 153c and 153d of the speaker connector 145 are speaker-driven. It is connected to the speaker terminals 94c and 94d of the upstream connector 143 via the wiring paths 154c and 154d.

FIG. 10 shows a specific wiring pattern of the third LED substrate 43 for each wiring layer. In the third LED substrate 43, LEDs 147 to 150 and the like are on the front wiring layer (second wiring layer) 141a (FIG. 10 (a)) on the front side, and the rear wiring layer (first wiring layer) 141b on the back side (FIG. 10 (a)). An upstream connector 143, a speaker connector 144, 145, an LED driver 146, a protection resistor 151, 152, etc. are arranged in b)), respectively.

The upstream side connector 143 is arranged so that the terminal arrangement is in the left-right direction on the left and right end sides of the rear wiring layer 141b, for example, and the speaker connectors 144 and 145 have the terminal arrangements in the vertical direction on the left and right end sides of the back wiring layer 141b, for example. It is arranged so as to be. Each of the terminals of the speaker connectors 144 and 145 is, for example, rectangular like the upstream connector 143, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (here, the vertical direction).

Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 143 from the outside in the terminal arrangement direction (here, the left and right direction), and the speaker terminals 94c on the other end side of the upstream connector 143. , 94d are connected to the speaker drive wiring paths 154c and 154d from the outside in the terminal arrangement direction (here, the left-right direction). Further, the speaker drive wiring paths 154a and 154b are connected to the speaker terminals 153a and 153b of the speaker connector 144 from the outside in the terminal arrangement direction (here, the vertical direction), and the speaker drive is connected to the speaker terminals 153c and 153d of the speaker connector 145. The wiring paths 154c and 154d are connected from the outside in the terminal arrangement direction (here, the vertical direction). The speaker drive wiring paths 154a to 154d are substantially entirely the same as the front wiring layer (second wiring layer) of the LEDs 147 to 150, except for a predetermined range on both ends thereof, that is, in the vicinity of the connection portion to each connector 143 to 145. ) It is provided on the 141a side.

The LED driver 146 is arranged, for example, substantially in the center of the rear wiring layer 141b, and protection resistors 151 and 152 connected to the RGB terminals of the LED driver 146 are arranged on both the left and right sides thereof. Then, the LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 146 of the upstream connector 143 are connected by the wiring paths 155 to 157 for the LED driver power supply, the signal, and the clock. .. The LED driver power supply, signal, and clock wiring paths 155 to 157 are almost entirely rear wiring except for a part of the bypass portion that is avoided on the front wiring layer 141a side via the via 96, for example. It is provided on the layer 141b side.

The rear wiring layer 141b is provided with one or more solid ground patterns 158. The solid ground pattern 158 constitutes the ground wiring path 160 together with the solid ground pattern 159 and the like on the front wiring layer 141a side, and the ground terminals 93a and 93b of the upstream connector 143 via, for example, the via 96 and the solid ground pattern 159 and the like. And is connected to the ground terminal of the LED driver 146.

A part of the solid ground pattern (first conductor pattern) 158 is arranged between the LED driver 146 and the substrate main body 142. Further, among the vias 96 connecting the solid ground pattern 158 and the solid ground pattern (ground wiring path, second conductor pattern) 159 on the front wiring layer 141a side, the vias arranged in the arrangement area of the LED driver 146. 96 are centrally arranged in the central area in the arrangement area of the LED driver 146, for example.

The LEDs 147 to 150 are arranged in a zigzag shape, for example, in the longitudinal direction of the front wiring layer 141a. They are connected in series by road 161. The LEDs 147 to 150 are full-color light emitting types with built-in red, green, and blue LED elements. For example, the R electrode corresponding to red and the G electrode corresponding to green are blue on both the anode side and the cathode side. Corresponding B electrodes are provided side by side so that, for example, the R electrode is at the center. Further, the anode electrodes of the LEDs 148 and 149 are connected to the LED power supply terminal 89 of the upstream connector 143 via the wiring path 162 for the LED power supply straddling the rear wiring layer 141b side via the via 96, and the anode electrodes of the LEDs 148 and 149 are connected to the LED power supply terminals 89 of the LEDs 147 and 150. The cathode electrode is connected to the protection resistors 151 and 152 via the cathode side wiring path 163 that straddles the rear wiring layer 111b side with the via 96 interposed therebetween. Further, the wiring paths 161 between the LEDs, the wiring paths 162 for the LED power supply, and the wiring paths 163 on the cathode side are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like.

In the third LED substrate 43, the speaker drive wiring paths 154a to 154d are formed to be wider than the digital signal wiring paths such as the signal and clock wiring paths 156 and 157 for driving the LED.

In the first to third LED boards 41 to 43 described above, through-pass wiring paths are provided straddling the first to third LED boards 41 to 43, but the current value is larger as the LED board on the upstream side is located. Therefore, the through-pass wiring path of the power supply system on the upstream LED substrate is formed wider than the through-pass wiring path of the power supply system on the downstream LED substrate. For example, the through-pass wiring paths 75 and 76 for the LED power supply and the LED driver power supply on the first LED board 41 are wider than the through-pass wiring paths 115 and 116 for the LED power supply and the LED driver power supply on the second LED board 42. It is formed.

Further, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through-pass wiring path of the power supply system is larger in the upstream connector than in the downstream connector. For example, the total number of LED power supply terminals 89a and 89b and LED driver power supply terminals 90 in the connectors 74 and 113 for connecting the first and second LED boards 41 and 42 is three, whereas the total number of the second and second LED power supply terminals 90 is three. The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 114 and 143 for connecting the three LED boards 42 and 43 is two.

As a result, while ensuring the required voltage for each LED board, it is not necessary to use an unnecessarily thick power supply system wiring path or an unnecessarily large connector on the downstream LED board, thus improving the space efficiency of wiring. It is possible.

[4th LED board 44]
As shown in FIG. 3, the fourth LED substrate 44 includes, for example, a vertically long substantially rectangular substrate body 172 having wiring layers on both front and rear sides. As shown in FIG. 11, the board body 172 is used for an LED power supply that connects the upstream side connector (board connection connector) 173, the downstream side connector (board connection connector) 174, and the connectors 173 and 174. , LED driver power supply, signal, clock and ground through-pass wiring paths (predetermined wiring paths) 175 to 179, and LED driver power supply, signal, clock and ground through-pass wiring paths 176 to 179. For example, one LED driver 180 connected in series, protection resistors 181, 182 and LEDs 183 to 186 connected in series between the LED driver 180 and the through-pass wiring path 175 for the LED power supply, and the LED driver 180. For example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c for connecting between two sets of six RGB terminals and the downstream connector 174, and a blower power supply wiring for connecting between two sets of six LED drive wiring paths 187a to 187c and 188a to 188c. A path 189a and a wiring path 189b for a ventilation ground are provided.

The upstream connector 173 is connected to, for example, two LED power supply terminals 89a and 89b to which the through-pass wiring path 175 for the LED power supply is connected, and for example one LED driver power supply terminal 90 to which the through-pass wiring path 176 for the LED driver power supply is connected. For example, one signal terminal 91 to which the through-pass wiring path 177 for the signal is connected, one clock terminal 92 to which the through-pass wiring path 178 for the clock is connected, and the through-pass wiring path 179 for the ground are connected. For example, three ground terminals 93a to 93c, a blower power supply terminal 190a to which the blower power supply wiring path 189a is connected, and a blower ground terminal 190b to which the blower ground wiring path 189b is connected are provided, and a total of 10 of them are provided. The terminals are arranged in a row, for example. Each one on both ends in the terminal arrangement direction is a blower power supply terminal 190a and a blower ground terminal 190b. Regarding the eight terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the upstream connector 173, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, the signal terminal 91, and the clock. The terminals 92 and the ground terminals 93c are arranged in that order.

The downstream connector 174 includes, for example, one LED power supply terminal 89 to which the through-pass wiring path 175 for the LED power supply is connected, and one LED driver power supply terminal 90 to which the through-pass wiring path 176 for the LED driver power supply is connected. For example, one signal terminal 91 to which the through-pass wiring path 177 for the signal is connected, one clock terminal 92 to which the through-pass wiring path 178 for the clock is connected, and the through-pass wiring path 179 for the ground are connected. For example, two sets of ground terminals 93a and 93b and, for example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c are connected, for example, two sets of six LED connection terminals 191a to 191c and 192a to 192c. A blower power supply terminal 190a to which the power supply wiring path 189a is connected and a blower ground terminal 190b to which the blower ground wiring path 189b is connected are provided, and a total of 14 terminals thereof are arranged in two rows, for example, seven by seven. There is. Then, for example, the two on one end side in the terminal arrangement direction of these two rows are the blower power supply terminal 190a and the blower ground terminal 190b.

As described above, in the fourth LED board 44, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 173, that is, the through-pass wiring paths 175, 176, 179 for the LED power supply, the LED driver power supply, and the ground (total here). 6) is larger than the number of terminals corresponding to the same wiring paths 175, 176, 179 in the downstream connector 174 (here, a total of 4). Regarding the 12 terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the downstream connector 174, for example, the LED power supply terminal 89, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, and the signal terminal are arranged in one row. 91, the clock terminals 92 are arranged in that order, and two sets of six LED connection terminals 191a to 191c and 192a to 192c are arranged in the other row.

FIG. 12 shows a specific wiring pattern of the fourth LED substrate 44 for each wiring layer. In the fourth LED substrate 44, LEDs 183 to 186 are on the front wiring layer 171a (FIG. 12 (a)) on the front side, and the upstream connector 173 and the downstream connector 174 are on the rear wiring layer 171b (FIG. 12 (b)) on the back side. , LED driver 180, protection resistors 181 and 182, etc. are arranged respectively.

The upstream connector 173 is arranged, for example, on the lower end side of the rear wiring layer 171b so that the terminal arrangement is in the left-right direction, and the downstream connector 174 is arranged, for example, on the upper end side of the rear wiring layer 171b so that the terminal arrangement is in the vertical direction. Has been done.

Each terminal of the connectors 173 and 174 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction thereof. The blower power supply terminal 190a and the blower ground terminal 190b on both ends of the upstream connector 173 are connected to the blower power supply wiring path 189a and the blower ground wiring path 189b from the outside in the terminal arrangement direction (here, the left-right direction), respectively. Similarly, in the blower power supply terminal 190a and the blower ground terminal 190b on the lower end side of the downstream connector 174, the blower power supply wiring path 189a and the blower ground wiring path 189b are outside the terminal arrangement direction (here, the vertical direction). Is connected from. As described above, the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b are from the outside in the terminal arrangement direction with respect to the outermost terminals 190a and 190b in the arrangement direction of the plurality of terminals of the connectors 173 and 174. Since they are connected, it is easy to avoid interference with other wiring paths even though the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b are formed in a wide width. Further, since the blower power supply terminal 190a and the blower ground terminal 190b are formed in an elongated shape in the direction orthogonal to the terminal arrangement direction, the blower power supply wiring path 189a and the blower ground wiring path 189b are used as the blower power supply terminal 190a. By connecting to the long side of the blower ground terminal 190b, a larger cross-sectional area of the connecting portion can be secured.

In the fourth LED substrate 44, in addition to the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b, through-pass wiring paths 175 to 178 for the LED power supply, the LED driver power supply, the signal, and the clock are provided via the via 96. Except for some bypass portions that are avoided on the front wiring layer 171a side, substantially all of them are provided on the back wiring layer 171b side. That is, the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b are arranged on the back wiring layer 171b along the left edge portion 172a of the substrate main body 172, and are arranged for the LED power supply, the LED driver power supply, the signal, and the like. The through-pass wiring paths 175 to 178 for the clock are also arranged on the back surface wiring layer 171b along the right edge portion 172b of the substrate main body 172.

Then, the LED driver power supply wiring path 193 branched from the through-pass wiring path 176 for the LED driver power supply is connected to the power supply terminal of the LED driver 180, and the signal wiring path 194 branched from the through-pass wiring path 177 for the signal is the LED driver. A clock wiring path 195 connected to the signal terminal of 180 and branched from the through-pass wiring path 178 for the clock is connected to the clock terminal of the LED driver 180.

Here, the LED driver 180 and the corresponding protection resistors 181, 182 are sandwiched between, for example, the ventilation power supply wiring path 189a, the ventilation ground wiring path 189b, and the through-pass wiring path 175-178, and the rear wiring layer 171b. It is located approximately in the center of.

Further, the back surface wiring layer 171b is provided with one or a plurality of solid ground patterns 196. The solid ground pattern 196 constitutes a through-pass wiring path (ground wiring path) 179 for the ground together with the solid ground pattern 197 and the like on the front wiring layer 171a side. It is connected to the ground terminals 93a to 93c of the connector 173, the ground terminals 93a and 93b of the downstream connector 174, and the ground terminal of the LED driver 180.

A part (or all) of the solid ground pattern 196 of the rear wiring layer 171b is arranged between the LED driver 180 and the board main body 172, and a wiring path group including a through-pass wiring path 178 for a clock around the LED driver 180. That is, it is surrounded by wiring paths such as a ventilation power supply wiring path 189a, a ventilation ground wiring path 189b, and a through-pass wiring path 175 to 178. Further, the solid ground pattern 196 is electrically connected to the ground terminals 93a to 93c of the upstream connector 173 and the ground terminals 93a and 93b of the downstream connector 174 via the via 96, the solid ground pattern 197, and the like. Further, among the vias 96 connecting the solid ground pattern 196 and the solid ground pattern (ground wiring path, second conductor pattern) 197 on the front wiring layer 171a side, the via 96 arranged in the arrangement area of the LED driver 180. However, for example, they are centrally arranged in the central area in the arrangement area of the LED driver 180. As a result, the heat dissipation of the LED driver 180 can be effectively performed through the solid ground pattern 196 and the via 96, and the adverse effect of the noise picked up by the solid ground pattern 196 can be eliminated as much as possible.

The LEDs 183 to 186 driven by the LED driver 180 are arranged in a row at substantially constant intervals in the longitudinal direction (vertical direction) of, for example, the front wiring layer 171a. The upper LEDs 183 and 184 and the lower LEDs 185 and 186 are connected by a wiring path 198 between the LEDs, respectively. The LEDs 183 to 186 are full-color light emitting types with built-in red, green, and blue LED elements. For example, on both the anode side and the cathode side, the R electrode corresponding to red and the G electrode corresponding to green are blue. Corresponding B electrodes are provided side by side so that, for example, the R electrode is at the center.

Further, the anode electrodes of the LEDs 183 and 186 are connected to the through-pass wiring path 175 for the LED power supply via the wiring path 200 for the LED power supply straddling the rear wiring layer 171b side via the via 96, and are the cathodes of the LEDs 184 and 185. The electrodes are connected to the protection resistors 181 and 182 via the cathode side wiring path 201 that straddles the rear wiring layer 171b side with the via 96 in between. The LED power supply wiring path 200 and the cathode side wiring path 201 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like.

Further, for example, in the front wiring layer (second wiring layer) 171a, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c are arranged. The LED drive wiring paths 187a to 187c and 188a to 188c are connected to the RGB terminals 180a to 180f of the LED driver 180 on the rear wiring layer 171b side via vias (interlayer conduction portions) 96a to 96f, respectively, on the upstream end side thereof (FIG. 13 (b2)), the downstream end side is connected to the LED connection terminals 191a to 191c and 192a to 192c of the downstream side connector 174 on the rear wiring layer (first wiring layer) 171b side via vias (interlayer conduction portion) 96g to 96l, respectively. (FIG. 13 (a2)).

As shown in FIG. 13 (a2), the LED drive wiring paths 187a to 187c and 188a to 188c are arranged in, for example, in the terminal arrangement direction (here, in the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the downstream connector 174. It is pulled out in parallel in the orthogonal direction (here, sideways) and connected to each via 96 g to 96 l, and these vias (interlayer conductive portion) 96 g to 96 l are in the terminal arrangement direction (here, the vertical direction) of the downstream connector 174. ), For example, arranged in a row.

Here, the diameters of the vias 96g to 96l are from the pitches of the LED drive wiring paths 187a to 187c and 188a to 188c in the vicinity of the downstream connector 174 (here, the same as the pitches of the LED connection terminals 191a to 191c and 192a to 192c). By arranging the downstream connectors 174 diagonally with respect to the terminal arrangement direction in this way, it is possible to arrange the vias 96 g to 96 liters with high space efficiency while avoiding mutual interference. ..

Further, on the front wiring layer 171a side, as shown in FIG. 13 (a1), among the LED drive wiring paths 187a to 187c and 188a to 188c, the LED drive wiring except for the LED drive wiring path (specific wiring path) 188c on one end side. The paths (predetermined wiring paths) 187a to 187c, 188a, and 188b are drawn out from the vias 96g to 96k in a diagonally downward direction (first direction) substantially in parallel with each other, and further downward (for example, downward (1) through the bending portions 271a to 271e). They are arranged substantially parallel to each other in the second direction). Further, the LED drive wiring path (specific wiring path) 188c on one end side is drawn out from the via 96l, for example, downward (second direction). The refracting portions 271a to 271e are arranged in a substantially straight line, and 96l of vias corresponding to the LED drive wiring path (specific wiring path) 188c are arranged on the straight line.

Here, both the first direction (diagonally downward) and the second direction (downward) are drawn out from the downstream connector 174 of the LED drive wiring paths 187a to 187c and 188a to 188c on the rear wiring layer 171b side (horizontal direction). However, one of the first direction and the second direction may be the same as the same withdrawal direction.

Further, as shown in FIG. 13 (b2), the LED drive wiring paths 187a to 187c and 188a to 188c are parallel to the direction orthogonal to, for example, the terminal arrangement direction (here, the left-right direction) from the RGB terminals 180a to 180f of the LED driver 180. The vias 96a to 96f are connected to the vias 96a to 96f, respectively, and the vias (interlayer conductive portions) 96a to 96f have a zigzag shape along the terminal arrangement direction (here, the left-right direction) of the RGB terminals 180a to 180f in the LED driver 180. Are arranged in. The via 96a and 96b, the via 96c and the via 96d, and the via 96e and the via 96f are examples of the first inclined arrangement portion in the first oblique direction (for example, rising to the right in FIG. 13 (b2)), and the via 96b and the via 96b. The via 96c, the via 96d, and the via 96e are examples of the second inclined arrangement portion in the second oblique direction (for example, downwardly downward in FIG. 13 (b2)).

Here, the diameter of the vias 96a to 96f is from the pitch of the LED drive wiring paths 187a to 187c and 188a to 188c in the vicinity of the RGB terminals 180a to 180f of the LED driver 180 (here, the same as the pitch of the RGB terminals 180a to 180f). By arranging the RGB terminals 180a to 180f in a zigzag shape along the terminal arrangement direction in this way, it is possible to arrange the vias 96a to 96f with high space efficiency while avoiding mutual interference. There is.

Further, on the front wiring layer 171a side, as shown in FIG. 13 (b1), the LED drive wiring paths 187a to 187c and 188a to 188c are respectively drawn out from the vias 96a to 96f in an upward direction (first direction) substantially parallel to each other. Further, they are arranged substantially parallel to each other, for example, diagonally upward (second direction) via the refracting portions 272a to 271f. The refracting portions 272a to 272f are arranged substantially linearly. The first direction is the same as the pull-out direction from the LED driver 180 of the LED drive wiring paths 187a to 187c and 188a to 188c on the rear wiring layer 171b side, and the second direction is different from the same pull-out direction. , The first direction and the second direction may be different from the same withdrawal direction.

The LED inter-LED wiring path 198, the LED power supply wiring path 200, and the cathode side wiring path 201 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fourth LED board 44, the ventilation power supply wiring path 189a and the ventilation ground wiring path 189b are signal and clock through-pass wiring paths 177 and 178 for driving LEDs 183 to 186, signal wiring paths 194, and a clock. It is formed wider than a digital signal wiring path such as a wiring path 195.

[Fifth LED board 45]
As shown in FIG. 3, the fifth LED substrate 45 includes, for example, a vertically long substantially rectangular substrate body 212 having wiring layers on both front and rear sides. Then, as shown in FIG. 11, the board main body 212 has an upstream connector (board connection connector) 213, a downstream connector (board connection connector) 214, and an LED power supply for connecting between these connectors 213 and 214. Protection connected in series between the through-pass wiring paths (predetermined wiring paths) 215 to 219 for the LED driver power supply, signal, clock, and ground, and the through-pass wiring paths 215 for the LED power supply and the upstream connector 213. Resistors 220, 221 and LEDs 223 to 226, and a blower connector (connector for connecting the effect means) 227 are provided.

The upstream connector 213 is connected to the downstream connector 174 on the fourth LED board 44 side by the harness 66, and has the same terminal configuration as the downstream connector 174. On the other hand, the downstream connector 214 is different from the terminal configuration of the upstream connector 213, and for example, one LED power supply terminal 89 to which the through-pass wiring path 215 for the LED power supply is connected and the through-pass wiring path for the LED driver power supply. For example, one LED driver power supply terminal 90 to which 216 is connected, one signal terminal 91 to which a through-pass wiring path 217 for a signal is connected, and one clock terminal to which a through-pass wiring path 218 for a clock is connected, for example. 92 and, for example, two ground terminals 93a and 93b to which a through-pass wiring path 219 for the ground is connected are provided, and a total of six terminals thereof are arranged, for example, in a row. Regarding the six terminals of the downstream connector 214, for example, the LED power supply terminal 89, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, the signal terminal 91, and the clock terminal 92 are arranged in that order.

The blower connector 227 is connected to the blower means 37a of the blower effect means 37 by a harness 68, and is provided with a blower power supply terminal 229a and a blower ground terminal 229b. The blower power supply terminal 229a of the blower connector 227 is connected to the blower power supply terminal 190a of the upstream connector 213 via the blower power supply wiring path 228a, and the blower ground terminal 229b is connected to the upstream side via the blower ground wiring path 228b. It is connected to the ventilation ground terminal 190b of the connector 213.

FIG. 14 shows a specific wiring pattern of the fifth LED substrate 45 for each wiring layer. In the fifth LED substrate 45, the LEDs 223 to 226 and the protection resistors 220 and 221 are connected to the front wiring layer 211a (FIG. 14 (a)) on the front side, and the upstream side connector is connected to the rear wiring layer 211b (FIG. 14 (b)) on the back side. 213, downstream connector 214, blower connector 227, etc. are arranged respectively.

The upstream connector 213 is arranged so that the terminal arrangement is vertically oriented, for example, on the lower end side of the rear wiring layer 211b, and the downstream connector 214 is arranged so that the terminal arrangement is vertically oriented, for example, on one side of the upper end portion of the rear wiring layer 211b. The blower connector 227 is arranged, for example, on one side of the upper end portion of the rear wiring layer 211b so that the terminal arrangement is in the vertical direction.

Each terminal of the connectors 213, 214, and 227 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction thereof. Then, for example, the blower power supply terminal 190a and the blower ground terminal 190b on the lower end side of the upstream connector 213 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). The blower power supply terminal 229a and the blower ground terminal 229b of the blower connector 227 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). ..

In the fifth LED substrate 45, for example, with respect to the ventilation power supply wiring path 228a, the ventilation ground wiring path 228b, and the through-pass wiring path 215 for the LED power supply, for example, substantially the entire rear wiring layer 211b is different from the LEDs 223 to 226. Although it is provided on the side, for the through-pass wiring paths 216 to 218 for the LED driver power supply, signal, and clock, for example, except for a predetermined range on both ends thereof, that is, in the vicinity of the connection portion to each connector 213,214. Almost the entire surface is provided on the same front wiring layer 211a side as the LEDs 223 to 226.

That is, the ventilation power supply wiring path 228a is arranged on the back wiring layer 211b along the right edge portion 212b of the board body 212, and the ventilation ground wiring path 228b is arranged on the back wiring layer 211b along the left edge portion 212a of the board body 212. It is arranged along. Further, the through-pass wiring path 215 for the LED power supply is arranged on the rear wiring layer 211b along, for example, the ventilation power supply wiring path 228a. The LED power supply wiring paths 231 and 232 branched from the LED power supply through-pass wiring path 215 are connected to, for example, the anode electrodes of the LEDs 223 and 225 via the via 96.

Further, the through-pass wiring paths 216 to 218 for the LED driver power supply, the signal, and the clock are arranged in the vertical direction on the front wiring layer 211a, for example, on the right edge portion 212b side, and the upstream end side thereof is rear-wired via the via 96, respectively. The layer 211b is connected to the LED driver power supply terminal 90, the signal terminal 91, and the clock terminal 92 of the upstream connector 213, respectively, and the downstream end side passes through the via 96, respectively, and the rear wiring layer 211b is connected to the LED driver power supply terminal of the downstream connector 214. It is connected to 90, a signal terminal 91, and a clock terminal 92, respectively.

The front wiring layer 211a is provided with one or more solid ground patterns 233. The solid ground pattern 233 constitutes a through-pass wiring path (ground wiring path) 219 for the ground together with the solid ground pattern 234 and the like on the rear wiring layer 211b side. , 214 are connected to the ground terminals 93a and 93b.

The LEDs 223 to 226 are arranged in a row at substantially constant intervals in the longitudinal direction (vertical direction) of, for example, the front wiring layer 211a. The upper LEDs 223 and 224 and the protection resistors 220 arranged on the lower side thereof are connected in series by the wiring paths 235 and the cathode side wiring paths 236 between the LEDs, and are arranged on the lower LEDs 225 and 226 and the lower side thereof and the like. The protection resistor 221 is connected in series by a wiring path 237 between LEDs and a wiring path 238 on the cathode side. Then, as shown in FIGS. 14 and 15, the protection resistor 220 straddles the rear wiring layer (first wiring layer) 211b side with vias 96m to 96o from the front wiring layer (second wiring layer) 211a. The LED drive wiring paths 239a to 239c are connected to the LED connection terminals 191a to 191c of the upstream connector 213, and the protection resistor 221 is connected to the front wiring layer (second wiring layer) 211a with vias 96p to 96r in between and the rear wiring layer ( First wiring layer) The LED drive wiring paths 240a to 240c straddling the 211b side are connected to the LED connection terminals 192a to 192c of the upstream side connector 213.

As shown in FIG. 15B, the LED drive wiring paths 239a to 239c and 240a to 240c are arranged in, for example, in the terminal arrangement direction (here, in the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the upstream connector 213. They are drawn out in parallel in the orthogonal direction and are connected to vias (interlayer conductive portions) 96m to 96r, respectively, and these vias 96m to 96r are vias 96m to 96o constituting the first via group (interlayer conduction portion group). And the vias 96p to 96r constituting the second via group (interlayer conduction portion group) are substantially parallel to each other and are oblique to the terminal arrangement direction (here, the vertical direction) of the upstream connector 213, respectively. They are arranged in two columns.

Here, the diameters of the vias 96m to 96r are from the pitches of the LED drive wiring paths 239a to 239c and 240a to 240c in the vicinity of the upstream connector 213 (here, the same as the pitches of the LED connection terminals 191a to 191c and 192a to 192c). By arranging a plurality of via groups diagonally with respect to the terminal arrangement direction of the upstream connector 213 and substantially parallel to each other in this way, the vias 96m to 96r are arranged in a high space efficiency while avoiding mutual interference. It is possible to arrange with.

On the front wiring layer 211a side, as shown in FIG. 15A, the LED drive wiring paths 239a to 239c are drawn out from the vias 96m to 96o, for example, upward in substantially parallel to each other, and the LED drive wiring paths 240a to 240c. However, the vias 96p to 96r are drawn downward, for example, substantially parallel to each other. As described above, the pull-out directions of the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are different between the first via group and the second via group.

The LED power supply wiring paths 231 and 232, the LED-to-LED wiring paths 235 and 237, and the cathode side wiring paths 236 and 238 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fifth LED board 45, the ventilation power supply wiring path 228a and the ventilation ground wiring path 228b are wider than the digital signal wiring paths such as the signal and clock through-pass wiring paths 217 and 218 for driving the LED. Is formed in.

[6th LED board 46]
As shown in FIG. 3, the sixth LED substrate 46 includes, for example, a substantially donut-shaped substrate body 242 having wiring layers on both front and rear sides. As shown in FIG. 11, the substrate main body 242 is provided with an upstream connector 243, an LED driver 244, LEDs 245 to 248, protection resistors 249, 250, and the like. The upstream connector 243 is connected to the downstream connector 214 on the fifth LED board 45 side by a harness 67, and has the same terminal configuration as the downstream connector 214.

FIG. 16 shows a specific wiring pattern of the sixth LED substrate 46 for each wiring layer. In the sixth LED board 46, the LEDs 245 to 248 are on the front wiring layer 241a (FIG. 16A) on the front side, and the upstream connector 243 and the LED driver 244 are on the rear wiring layer 241b (FIG. 16B) on the back side. Protective resistors 249, 250, etc. are arranged respectively.

The upstream side connector 243 is arranged on, for example, the lower side of the back surface wiring layer 241b so that the terminal arrangement is in the substantially circumferential direction of the substrate main body 242. Further, the LED driver 244 is arranged at a position away from the upstream connector 243 in the rear wiring layer 241b, and for example, protection resistors 249 and 250 connected to the RGB terminals of the LED driver 244 are arranged on both sides thereof. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 244 of the upstream connector 243 are connected by the wiring paths 251 to 253 for the LED driver power supply, the signal, and the clock. The LED driver power supply, signal, and clock wiring paths 251 to 253 are provided, for example, substantially entirely on the rear wiring layer 241b side.

The LEDs 245 to 248 are arranged at substantially constant intervals in the circumferential direction of the front wiring layer 241a, for example, and the LEDs 245 and 246 and the LEDs 247 and 248 are connected by the wiring paths 254 between the LEDs, respectively. The LEDs 245 to 248 are full-color light emitting types with built-in red, green, and blue LED elements. For example, on both the anode side and the cathode side, the R electrode corresponding to red and the G electrode corresponding to green are colored blue. Corresponding B electrodes are provided side by side so that, for example, the R electrode is at the center. Further, the anode electrodes of the LEDs 246 and 247 are connected to the LED power supply terminal 89 of the upstream connector 243 via the wiring path 255 for the LED power supply straddling the rear wiring layer 241b side via the via 96, and are connected to the LED power supply terminals 89 of the LEDs 245 and 248. The cathode electrode is connected to the protection resistors 249 and 250 via the cathode side wiring path 256 that straddles the rear wiring layer 241b side with the via 96 interposed therebetween. The LED inter-LED wiring path 254, the LED power supply wiring path 255, and the cathode side wiring path 256 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like.

The front wiring layer 241a is provided with, for example, a solid ground pattern 257. This solid ground pattern 257 constitutes the ground wiring path 259 together with the solid ground pattern 258 and the like on the rear wiring layer 241b side. For example, the ground terminal 93a of the upstream connector 243 via the via 96 and the solid ground pattern 258 and the like. It is connected to the ground terminal of 93b and the LED driver 244.

A part of the solid ground pattern (first conductor pattern) 258 is arranged between the LED driver 244 and the substrate main body 242. Further, among the vias 96 connecting the solid ground pattern 258 and the solid ground pattern (ground wiring path, second conductor pattern) 257 on the front wiring layer 241a side, the vias arranged in the arrangement area of the LED driver 244. 96 is arranged near one edge of the LED driver 244, for example, in accordance with the arrangement of the solid ground pattern 257 on the front wiring layer 241a side, for example.

In the right wiring path 58 described above, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through-pass wiring path of the power supply system is that of the connector on the upstream side of the connector on the downstream side. There are more. For example, the total number of LED power supply terminals 89a and 89b and the LED driver power supply terminal 90 in the connector 173 for connecting the front door relay board 56 and the fourth LED board 44 is three, while the fourth and fifth LEDs The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 174 and 213 for connecting the boards 44 and 45 is two.

As a result, it is possible to improve the space efficiency of wiring because it is not necessary to use a connector larger than necessary for the LED board on the downstream side while securing the required voltage for each LED board.

FIG. 17 illustrates a second embodiment of the present invention, in which the first embodiment is partially modified to provide a conductor portion on the back surface of the LED driver, and the conductor portion and the solid ground pattern are connected by soldering. An example is shown.

Taking the LED driver 120 of the second LED substrate 42 (see FIG. 8) as an example, the LED driver (heat-generating component) 120 of the present embodiment includes a copper foil or other conductor portion 261 on its back surface. The conductor portion 261 is formed, for example, in a rectangular shape corresponding to the center of the back surface of the LED driver 120. Of course, the shape of the conductor portion 261 is arbitrary, and the conductor portion 261 may be provided on substantially the entire back surface of the LED driver 120.

Further, at the arrangement position of the LED driver 120 on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262 in which a part of the solid ground pattern 134 is exposed from the insulating film 106 is, for example, a conductor portion on the LED driver 120 side. It is provided corresponding to 261. In the solid ground pattern 134, the vias 96 are concentratedly arranged in the central region of the LED driver 120, but in the present embodiment, the conductor is exposed so as to include the arrangement region of the vias 96. A portion 262 is provided.

Then, the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side facing each other are connected by, for example, solder (conduction connecting means) 263. As a result, heat conduction from the LED driver 120 to the solid ground pattern 134 is promoted as compared with the first embodiment, so that the heat generated by the LED driver 120 can be dissipated more efficiently.

In addition to the other LED drivers 121 of the second LED board 42, the same configuration can be adopted for the LED drivers arranged on the other LED boards 41, 43 and the like.

FIG. 18 illustrates a third embodiment of the present invention, and by partially modifying the second embodiment, a plurality of vias (interlayer conductive portions) provided in the arrangement area of the LED driver are used in the LED driver. An example of arranging in the peripheral area in the arrangement area instead of the central area in the arrangement area is shown.

In the second LED substrate 42 of the second embodiment, as shown in FIG. 17, a part of the solid ground pattern 134 is arranged between the LED driver 120 and the substrate main body 112, and the solid ground pattern 134 and the front wiring layer are arranged. The vias 96 connecting the solid ground pattern 135 on the 111a side are centrally arranged in the central region in the arrangement region of the LED driver 120, but in the present embodiment, as shown in FIG. 18, these vias are concentrated. 96 are arranged substantially evenly in the peripheral area outside the central area in the arrangement area, not in the central area in the arrangement area of the LED driver 120.

Further, the LED driver 120 of the present embodiment is provided with a copper foil or other conductor portion 261 on the back surface thereof, as in the second embodiment. The conductor portion 261 is formed, for example, in a rectangular shape corresponding to the center of the back surface of the LED driver 120. Further, at the arrangement position of the LED driver 120 on the back wiring layer 111b of the second LED substrate 42, a conductor exposed portion 262 in which a part of the solid ground pattern 134 is exposed from the insulating film 106 is, for example, a conductor portion on the LED driver 120 side. It is provided corresponding to 261. The conductor exposed portion 262 of the present embodiment is provided in a range that does not cover the via 96 provided in the peripheral region in the arrangement region of the LED driver 120.

Then, the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side facing each other are connected by, for example, solder (conduction connecting means) 263. In this way, when the plurality of vias (interlayer conductive portions) 96 provided in the arrangement area of the LED driver 120 are arranged in the peripheral area in the arrangement area of the LED driver, as in the second embodiment. Although it may be inferior in terms of heat dissipation effect as compared with the case where it is arranged in the central region, it is considered to be more excellent in terms of eliminating the adverse effect on the LED driver 120 due to the noise picked up by the solid ground pattern 134.

Further, since the via 96 is not applied in the connecting area formed by the solder 263, the LED driver 120 is fixed more firmly than in the case where the via 96 is applied in the connecting area formed by the solder 263 as in the second embodiment. can. In that sense, the present embodiment is more effective in the case of a large heat-generating component.

The vias 96 may be arranged not only in the peripheral region within the arrangement region of the LED driver 120 but also in the central region inside the vias 96, and the arrangement density of the vias 96 may be higher in the peripheral region than in the central region. .. In this case, for example, a part of the via 96 may be applied in the connecting region by the solder (conduction connecting means) 263. Further, in the present embodiment, an example in which the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side are connected by solder (conduction connecting means) 263 is shown, but as in the first embodiment, It is not necessary to connect the LEDs by the conductive connecting means.

FIG. 19 illustrates a fourth embodiment of the present invention, in which the first embodiment is partially modified to include three or more intermediate layers in addition to the front and rear surface layers in the substrate body of the LED substrate. An example is shown in which the wiring layer of the above is provided, and the drive wiring path and the ground wiring path of the speaker (predetermined effect means) are provided in the intermediate layer.

FIG. 19 shows a specific wiring pattern for the third LED substrate 43 of the present embodiment for each wiring layer. The third LED substrate 43 of the present embodiment includes, for example, one intermediate layer 141c in addition to the front wiring layer 141a on the front side and the back wiring layer 141b on the back side.

Similar to the front wiring layer 141a of the first embodiment, the front wiring layer 141a includes LEDs 147 to 150, an LED power supply wiring path 162 connecting them, an LED inter-LED wiring path 161 and a cathode side wiring path 163, and a solid ground pattern. Although 159 and the like are arranged, the speaker drive wiring paths 154a to 154d are not provided. Similar to the second embodiment, the rear wiring layer 141b has an upstream connector 143, a speaker connector 144, 145, an LED driver 146, a protection resistor 151, 152, an LED driver power supply, a signal, and a clock wiring. Roads 155 to 157, solid ground pattern 158 and the like are arranged respectively.

Further, the intermediate layer 141c is provided with speaker drive wiring paths 154a to 154d and a solid ground pattern 264. In the speaker drive wiring paths 154a and 154b, one end side thereof is connected to the speaker terminals 94a and 94b of the upstream connector 143 on the rear wiring layer 141b side via the via 96 and the like, and the other end side thereof is connected to the rear wiring layer 141b via the via 96 and the like. On the side, they are connected to the speaker terminals 153a and 153b of the speaker connector 144, respectively. Further, in the speaker drive wiring paths 154c and 154d, one end side thereof is connected to the speaker terminals 94c and 94d of the upstream connector 143 on the rear wiring layer 141b side via the via 96 and the like, and the other end side is rearwardly wired via the via 96 and the like. The layer 141b is connected to the speaker terminals 153c and 153d of the speaker connector 145, respectively.

Further, the solid ground pattern 264 of the intermediate layer 141c constitutes the ground wiring path 160 together with the solid ground pattern 159 on the front wiring layer 141a side, the solid ground pattern 158 on the back wiring layer 141b side, and the like. It is connected to the ground terminals 93a, 93b, etc. of the upstream connector 143 via the ground patterns 158, 159, etc.

As described above, the drive wiring path and the ground wiring path of the speaker (predetermined effect means) are provided in the intermediate layer instead of the surface layer on which the LED driver 146 and other wiring paths are arranged, and the drive wiring provided in the intermediate layer. By sandwiching the road with solid ground patterns provided on the surface layers on both sides thereof, the adverse effect of noise can be eliminated as much as possible. Further, by providing the drive wiring path formed wider than the LED wiring path in the intermediate layer, the space of the surface layer can be utilized more effectively and the substrate can be miniaturized. When two or more intermediate layers are provided, for example, a drive wiring path is provided in one of the intermediate layers, and a solid ground pattern is applied to both layers of the intermediate layer (both intermediate layers or an intermediate layer and one surface layer). It is desirable to provide it.

20 and 21 exemplify the fifth embodiment of the present invention, and partially modify the first embodiment, and among the red, green, and blue LED elements connected in parallel, the red LED element. An example in which a protection resistor is connected only to is shown.

FIG. 20 shows a specific wiring pattern for each wiring layer of the first LED substrate 41 of the present embodiment. The first LED substrate 41 of this embodiment differs from the first embodiment (FIG. 5) in its wiring pattern in that it protects LEDs 84, 85 and LEDs 86, 87 only in the R wiring path corresponding to the red LED element. The only point is that resistors 82 and 83 are arranged, and no protective resistor is arranged in the green LED element, the G wiring path corresponding to the blue LED element, and the B wiring path.

In LEDs 84, 85 and LEDs 86, 87, the operating voltages of the green LED elements 84G, 85G, 86G, 87G and the blue LED elements 84B, 85B, 86B, 87B shown in FIG. 21 are substantially the same, whereas the operating voltage of the red LED is substantially the same. The operating voltage of the elements 84R, 85R, 86R, 87R is lower than that. Further, as shown in FIG. 21, the protection resistor 82 arranged in the R wiring path has a voltage across the red LED elements 84R and 85R (total value of operating voltages) VFR of the LEDs 84 and 85 and a voltage Vr across the protection resistor 82. The resistance value is set so that the sum of and is substantially equal to the voltages across the green LED elements 84G and 85G and the blue LED elements 84B and 85B (total values of operating voltages) VFG and VFB. The voltages across the green LED elements 84G and 85G and the blue LED elements 84B and 85B (total values of operating voltages) VFG and VFB are set to the power supply voltage V or less. A resistance value is similarly set for the protection resistor 83.

As described above, the protection resistor is connected in series only to the red LED element among the red, green, and blue LED elements connected in parallel, and the sum of the voltage across the red LED element and the voltage across the protection resistor. By making the voltage across each of the green LED element and the blue LED element substantially equal to each other, it is not necessary to connect a protection resistor to each of the green and blue LED elements, so that the number of protection resistors can be reduced.

FIG. 22 illustrates a sixth embodiment of the present invention, in which the first embodiment is partially modified to connect G, R, and three electrodes G, R, and B provided on the LED. An example is shown in which heat radiating portions are provided in all three wiring paths of B.

As shown in FIG. 22 (a), for example, among the LED-to-LED wiring paths 95 of the first LED substrate 41 (FIG. 5 and the like), the G wiring path 95G and the B wiring path 95B are G electrodes KG on the cathode side of the LED 84, respectively. The B electrode KB is connected from the outside in the electrode arrangement direction, and heat radiating portions 105a and 105a wider than other portions in those wiring paths are provided in the vicinity of the connecting portion. Further, the heat radiating portions 105a and 105a are each provided with recesses 265 from the inside (R wiring path 95R side) in the electrode arrangement direction to the outside.

Further, in the R wiring path 95R of the LED-to-LED wiring paths 95, the connection portion with the R electrode KR on the cathode side of the LED 84 is widened on both sides in the electrode arrangement direction, and the widened end side thereof is a heat radiating portion 105a, 105a. A heat radiating portion 105c inserted in the recess 265 is provided.

As described above, by providing heat radiating portions in all three wiring paths of G, R, and B connected to the three electrodes of G, R, and B provided in the LED, the heat generated in the LED can be generated. Heat can be dissipated more efficiently.

As shown in FIG. 22B, the heat radiating portions 105a and 105a of the G wiring path 95G and the B wiring path 95B are not provided with the recesses 265, and the heat radiating portions 105c of the R wiring path 95R are referred to as the heat radiating portions 105a and 105a. It may be formed to a width that does not interfere with each other.

FIG. 23 illustrates a seventh embodiment of the present invention, and shows an example in which the arrangement modes (FIG. 13 and the like) of the LED drive wiring paths 187a to 187c and 188a to 188c in the first embodiment are partially modified. There is.

In the present embodiment, as shown in FIG. 23A, the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side are located diagonally downward (first direction) from the vias 96g to 96l, respectively. It is drawn out substantially in parallel, and is further arranged substantially parallel to each other, for example, downward (second direction) via the refracting portions 271a to 271f. The refracting portions 271a to 271f are arranged substantially linearly. In this way, even if all of the LED drive wiring paths 187a to 187c and 188a to 188c including the LED drive wiring path (specific wiring path) 188c on one end side are pulled out from the vias 96g to 96l in the first direction. good.

Further, in the present embodiment, as shown in FIG. 23B, among the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side, the LED drive wiring path (specific wiring path) 187a on one end side is used. Except for the LED drive wiring paths (predetermined wiring paths) 187b, 187c, 188a to 188c, they are drawn out from the vias 96b to 96f in a substantially parallel manner, for example, upward (first direction), and further via the bending portions 272b to 272f. For example, they are arranged diagonally upward (second direction) substantially parallel to each other. Further, the LED drive wiring path (specific wiring path) 187a on one end side is drawn out from the via 96a, for example, diagonally upward (second direction). The refracting portions 272b to 272f are arranged in a substantially straight line, and vias 96a corresponding to the LED drive wiring path (specific wiring path) 187a are arranged on the straight line. In this way, even when a plurality of vias (interlayer conductive portions) 96a to 96f are arranged in a zigzag shape along the arrangement direction of the plurality of terminals, a predetermined wiring path other than the specific wiring path on one end side is excluded from the plurality of wiring paths. The wiring paths are pulled out from the vias substantially parallel to each other in the first direction and arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring paths are arranged so as to be pulled out from the vias in the second direction. May be good.

24 and 25 illustrate the eighth and ninth embodiments of the present invention, respectively, and show the arrangement modes (FIG. 15 and the like) of the LED drive wiring paths 239a to 239c and 240a to 240c in the first embodiment, respectively. An example of changing the part is shown.

In the eighth embodiment, as shown in FIG. 24, among the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side, the LEDs excluding the LED drive wiring path (specific wiring path) 239a on one end side. The drive wiring paths (predetermined wiring paths) 239b, 239c, 240a to 240c are respectively drawn out from the vias 96n to 96r in a lateral direction (first direction) substantially parallel to each other, and further upward, for example, via the bending portions 273b to 273f. They are arranged substantially parallel to each other in the (second direction). Further, the LED drive wiring path (specific wiring path) 239a on one end side is pulled out from the via 96 m, for example, upward (second direction). The refracting portions 273b to 273f are arranged in a substantially straight line, and vias 96m corresponding to the LED drive wiring path (specific wiring path) 239a are arranged on the straight line. In this way, even when a plurality of via groups are arranged substantially parallel to each other and diagonally with respect to the arrangement direction of the plurality of terminals, a predetermined wiring path other than the specific wiring path on one end side of the plurality of wiring paths is also provided. May be drawn out from the via substantially parallel to each other in the first direction and arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring path may be arranged so as to be pulled out from the via in the second direction. .. Further, the bent portions corresponding to the plurality of via groups may be arranged in a straight line.

Further, in the ninth embodiment, as shown in FIG. 25, the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are substantially laterally oriented (first direction) from the vias 96m to 96r, respectively. It is drawn out in parallel, and is further arranged substantially parallel to each other, for example, upward (second direction) via the refracting portions 273a to 273f. Then, the refracting portions 273a to 273c corresponding to the vias 96m to 96o constituting the first via group (interlayer conduction portion group) are arranged on a substantially straight line, and also constitute a second via group (interlayer conduction portion group). The refracting portions 273d to 273f corresponding to the vias 96p to 96r are also arranged on a substantially straight line. Here, the refracting portions 273a to 273c and the refracting portions 273d to 273f are not arranged on the same straight line, but both arrangements are substantially parallel to each other.

In this way, even when a plurality of via groups are arranged substantially parallel to each other and diagonally with respect to the arrangement direction of the plurality of terminals, the LED drive including the LED drive wiring path (specific wiring path) 239a on one end side is included. All of the wiring paths 239a to 239c and 240a to 240c may be configured to be pulled out from the vias 96m to 96r in the first direction. Further, the bent portions corresponding to different via groups do not have to be arranged on the same straight line. The arrangement of the refracting portions 273a to 273c and the arrangement of the refracting portions 273d to 273f may not be parallel to each other, or the refracting portions 273a to 273f may all be arranged on the same straight line.

Although the embodiment of the present invention has been described in detail above, the present invention is not limited to this embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the embodiment, a through-hole type via is adopted as an example of the interlayer conductive portion (so-called via), but a via or the like in which the through hole is filled with a conductive paste or the like may be adopted. Further, the size (diameter) of the interlayer conductive portion such as a through hole may be different depending on the type of wiring path such as a signal line and a ground line.

In the first embodiment, as shown in FIG. 13B, in arranging the plurality of vias (interlayer conductive portions) in a zigzag shape along the arrangement direction of the plurality of terminals 180a to 180f, the first inclined arrangement portion And the second inclined arrangement portion are each composed of the same number (2) vias, but the number of vias of the first inclined arrangement portion and the second inclined arrangement portion may be 3 or more, and the first inclined arrangement portion and the first inclined arrangement portion and the vias may be formed. The number of vias does not have to be the same as that of the second inclined arrangement portion.

In the first embodiment, as shown in FIG. 15, a plurality of via groups (interlayer conduction portions) are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals 191a to 191c and 192a to 192c. In doing so, the number of vias in each via group was the same, but the number of vias in each via group may be different. Further, three or more via groups may be provided.

In the embodiment, an example in which the blower effect means 37 is adopted as an example of the movable effect means capable of performing a predetermined operation by the drive means is shown, but the movable effect means is arranged, for example, on the front side of the game board, the front side of the front door 8. In addition to the movable effect body operated by a driving means such as a motor, a vibration effect means for vibrating a predetermined portion (launch handle 17, effect button 51, etc.) touched by the player may be used.

In the embodiment, of the first wiring path connected to the first electrode of the LED and the second and third wiring paths connected to the second and third electrodes adjacent to both sides of the first electrode. Although an example in which the heat radiating portions 105a and 105c are provided at least in the second and third wiring paths is shown, the central first electrode may be a G electrode or a B electrode. Further, the LED may be a monochromatic light emitting type composed of one LED element.

In the embodiment, in the fourth to sixth LED boards (first to third boards) 44 to 46, the fourth LED board (first board) 44 is connected to the LEDs (first LED) 183 to 186 of the fourth LED board 44. An LED driver (first LED driver) 180 for driving the LEDs (second LED) 223 to 226 of the fifth LED board (second board) 45 is provided, and the sixth LED board (third board) 46 is provided with an LED (third LED). An example is shown in which 245 to 248 and an LED driver (third LED driver) 244 for driving them are provided. However, the fourth LED board (first board) 44 has the LEDs (first LED) 183 to the fourth LED board 44. An LED driver (first LED) that drives 186, LEDs (second LEDs) 223 to 226 of the fifth LED board (second board) 45, and LEDs (third LEDs) 245 to 248 of the sixth LED board (third board) 46. A driver) 180 is provided, and the LED (third LED) of the LED driver (first LED driver) 180 of the fourth LED board (first board) 44 and the LED (third LED) of the sixth LED board (third board) 46 is provided on the fifth LED board (second board) 45. ) A relay wiring path for connecting to 245 to 248 may be provided.

In the embodiment, in the first and third LED substrates 41 and 43, the LED drivers 80, 81 and 146 are attached to the rear wiring layers (first wiring layers) 71b and 141b, and the other front wiring layers (second wiring layers) 71a are provided. , 141a are provided with drive wiring paths 88a to 88d and 154a to 154d for driving the speakers 36a and 36b, respectively. However, the LED driver is provided in the first wiring layer and the ventilation effect means 37 is provided in the second wiring layer. A drive wiring path related to the movable effect means such as the above may be provided. In this case, the LED may be provided in the second wiring layer. Alternatively, as in the fourth embodiment, the LED driver may be provided in the first wiring layer which is the surface layer, and the drive wiring path for the movable effect means such as the blower effect means 37 may be provided in the second wiring layer which is the intermediate layer. ..

In the second embodiment, the conductor is exposed so as to include the placement area of the vias 96 so as to correspond to the vias 96 that are centrally placed in the central area within the placement area of the LED driver 120 in the solid ground pattern 134. An example in which the portion 262 is provided is shown, but the conductor exposed portion 262 and the conductor portion 261 are provided corresponding to the peripheral region so as not to cover the via 96 arranged in the central region, and they are soldered (conducting connecting means). ) 263 may be connected.

In the embodiment, the wiring paths of the first to sixth LED boards 41 to 46 and the like arranged on the front door 8 are branched into the left wiring path 57 on the left side and the right wiring path 58 on the right side under the window hole 34. , The first to sixth LED substrates 41 to 46 may be connected in series in the order of, for example, the substrates 41, 42, 43, 46, 45, 44, or vice versa, without branching in the middle.

In the embodiment, the LED board arranged on the front door 8 has been described, but the same can be applied to the LED board or the like placed on the game component such as the central display unit 22 on the game board 5. Further, the same can be applied to a substrate other than the LED substrate, for example, an effect control substrate or the like.

A measurement point (hereinafter referred to as a test point) for verifying the waveform of the signal input to the LED driver may be provided on the wiring path. For example, if the wiring path for transmitting a signal to the LED driver is long, the waveform may be disturbed due to the influence of noise etc. on the way, but the LED looks normal even if there is some disturbance in the waveform. It is difficult to judge from the light emitting state of the LED whether or not the input signal to the LED driver is normal. Therefore, for example, by providing a test point in the signal wiring path, the clock wiring path, etc. connected to the LED driver and measuring the waveform of the signal at the test point, is the waveform of the signal input to the LED driver normal? It is possible to accurately verify whether or not it is. It is desirable that the test point is provided as close as possible to the LED driver. Further, although the test point may be provided exclusively for it, a via such as a through hole may be used as a test point.

In addition, for example, when test points are provided in a plurality of wiring paths drawn out substantially in parallel from a plurality of terminals arranged in a predetermined direction, they are shown in the embodiments (FIGS. 13, 15, 23 to 25, etc.). It may be arranged in the same manner as the arrangement of the vias (diagonal, zigzag, etc.). In addition, in order to distinguish between vias such as through holes and test points, or to clearly indicate that they are through holes or the like used as test points, characters such as "TP" or the like in the vicinity of the test points on the substrate, etc. It is desirable to provide a mark of.

Further, in the embodiment, an example in which the present invention is applied to a pachinko machine is shown, but it can be similarly carried out in various gaming machines such as an arrange ball machine and a slot machine.

41-44,46 LED board 72 Board body 80,81 LED driver (heat-generating component)
84-87 LED
102 Solid ground pattern (first conductor pattern)
112 Board body 120, 121 LED driver (heat-generating component)
124-127 LEDs
134 Solid ground pattern (first conductor pattern)
142 Board body 146 LED driver (heat-generating component)
147-150 LEDs
158 solid ground pattern (first conductor pattern)
172 Board body 180 LED driver (heat-generating component)
183 to 186 LEDs
196 Solid ground pattern (1st conductor pattern)
242 Board body 244 LED driver (heat-generating component)
245-248 LED
258 solid ground pattern (first conductor pattern)

Claims (1)

In a gaming machine having multiple boards,
The plurality of substrates include at least a first substrate and a second substrate.
The first board is a first power supply system wiring path connected to a first upstream connector and a first downstream connector, a first upstream power supply terminal of the first upstream connector, and a first downstream power supply terminal of the first downstream connector. And a first circuit unit supplied with power from the first power supply system wiring path.
The second board includes a second connector, a second power supply system wiring path connected to the second power supply terminal of the second connector, and a second circuit unit connected to the second power supply system wiring path. ,
The first downstream connector of the first board and the second connector of the second board are connected to each other.
The number of the first upstream power supply terminals is a plurality.
The number of the first downstream power supply terminals and the number of the second power supply terminals are the same as the number of the first upstream power supply terminals, respectively.
One end side of the first power supply system wiring path is connected to the plurality of first upstream power supply terminals.
The other end of the first power supply system wiring path is connected to the first downstream power supply terminal.
The width of the first power supply system wiring path from the first upstream power supply terminal to the first downstream power supply terminal is wider than that of the second power supply system wiring path.
The first circuit unit is connected to the first power supply system wiring path on the upstream side of the first downstream power supply terminal.
A predetermined substrate among the plurality of substrates includes a plurality of wiring layers including a first wiring layer and a second wiring layer.
The first wiring layer is provided with an electronic component in which a plurality of terminals are arranged in a predetermined direction, and a plurality of wiring paths connected to the plurality of terminals and arranged substantially in parallel.
A plurality of interlayer conductive portions for separately conducting the plurality of wiring paths on the second wiring layer side at positions different from the terminals are provided.
The plurality of interlayer conductive portions are divided into two or more interlayer conductive portions including two or more interlayer conductive portions, and the two or more interlayer conductive portions of each interlayer conductive portion group are arranged with the plurality of terminals. Arrange in a row diagonally with respect to the direction,
A gaming machine characterized in that the interlayer conductive portions are arranged substantially in parallel.

Images