JP6687372B2 - Amusement machine - Google Patents

Description

  The present invention relates to gaming machines such as pachinko machines and slot machines.

In various game machines such as pachinko machines, a large number of boards such as an LED board on which LEDs are mounted, a relay board, and a control board are mounted. In addition, many of these boards are equipped with heat-generating components such as LEDs and LED drivers for driving them.
In a board on which such a heat-generating component is mounted, it is necessary to appropriately radiate heat from the heat-generating component in order to prevent malfunction or the like due to overheating. For example, in the invention described in Patent Document 1, a heat dissipation pattern corresponding to the LED chip is provided on the back side of the LED substrate, and the heat dissipation pattern and the LED chip are connected by a heat transfer passage portion in the plate thickness direction, thereby the LED chip The heat generated in 1 is radiated from the heat radiation pattern through the heat transfer passage portion.

International Publication No. WO2013 / 136758A1

The invention described in Patent Document 1 has a problem that it is difficult to obtain sufficient heat dissipation efficiency because heat is dissipated by the heat dissipation pattern arranged on the back side of the substrate with respect to the LED chip.
Further, the heat radiation pattern to which the LED chip is heat-transfer connected is electrically independent, and this heat radiation pattern serves as an antenna to facilitate picking up noise, and therefore, for example, an LED driver having a control function, and other control elements. There is also a problem that it is difficult to adopt it as a heat radiation means of.
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a gaming machine that can effectively dissipate heat from a heat-generating component and that can eliminate the adverse effects of noise as much as possible.

The present invention provides a gaming machine having a substrate 42 mounted with heat generating component 121, the first surface 111b of the substrate body 112 that constitutes the substrate 42, and the heat generating components 121, connected to said pyrogenic component 121 And another wiring path including unspecified wiring paths 128a to 128d are arranged around the floating island-shaped first conductor pattern 134, and the heat-generating component 121 is provided on the first conductor pattern 134 and on the specific wiring. The ground wiring path 135 is provided on the second surface 111a of the substrate main body 112 at a position separated from the paths 128a to 128d , and the first conductor pattern 134 and the ground wiring path 135 are connected to the board of the substrate main body 112 . It is electrically connected by the interlayer conduction portion 96 provided in the thickness direction .

  According to the present invention, it is possible to effectively dissipate heat from the heat-generating component and to eliminate the adverse effect of noise as much as possible.

1 is an overall front view of a pachinko machine according to a first embodiment of the present invention. It is the back view of the front door of the same pachinko machine, and the front view of an inner frame. It is a figure which shows arrangement | positioning of an LED board etc. in the front door of the same pachinko machine. It is a wiring diagram of the left wiring path in the front door of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the same pachinko machine. It is a figure which shows the heat dissipation part provided in the connection part of LED and wiring path of the same pachinko machine. It is a front view and a side sectional view of an LED driver mounting portion in a first LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 2nd LED board of the same pachinko machine. It is a front view and a bottom cross-sectional view of an LED driver mounting portion of a second LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the same pachinko machine. It is a wiring diagram of the right wiring path in the front door of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 4th LED board of the same pachinko machine. It is a figure which shows each via arrangement | positioning etc. of the downstream side connector vicinity (a1) (a2) and LED driver vicinity (b1) (b2) in the 4th LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 5th LED board of the same pachinko machine. It is a figure which shows the via arrangement | sequence etc. of the upstream connector vicinity in the 5th LED board of the same pachinko machine. It is a figure which shows the wiring pattern of each wiring layer in the 6th LED board of the same pachinko machine. It is the front view and side sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine concerning a 2nd embodiment of the present invention. It is the front view and side sectional view of the LED driver mounting part in the 2nd LED board of the pachinko machine concerning a 3rd embodiment of the present invention. It is a figure which shows the wiring pattern of each wiring layer in the 3rd LED board of the pachinko machine which concerns on the 4th Embodiment of this invention. It is a figure which shows the wiring pattern of each wiring layer in the 1st LED board of the pachinko machine which concerns on the 5th Embodiment of this invention. It is explanatory drawing which shows the connection state of LED and protection resistance of the same pachinko machine, and the relationship of the voltage between them. It is a figure which shows the heat dissipation part provided in the connection part of LED and wiring path of the pachinko machine concerning the 6th Embodiment of this invention. It is a figure which shows the wiring pattern of the downstream connector vicinity (a) and LED driver vicinity (b) in the 4th LED board | substrate of the pachinko machine which concerns on the 7th Embodiment of this invention. It is a figure which shows the wiring pattern near the upstream side connector in the 5th LED board of the pachinko machine which concerns on the 8th Embodiment of this invention. It is a figure which shows the wiring pattern near the upstream side connector in the 5th LED board of the pachinko machine which concerns on the 9th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 to 16 illustrate a first embodiment in which the present invention is applied to a pachinko machine. 1 and 2, the gaming machine main body 1 has a rectangular outer frame 2 and an inner frame 4 pivotally attached to the front side of the outer frame 2 by a hinge 3 on the left and right sides, for example, the left side. I have it.

  On the front side of the inner frame 4, a game board mounting frame 6 and the like for mounting the game board 5 on the upper side thereof, a launching means 7, a lower speaker 10 and the like are arranged on the lower side thereof, and the front side thereof. A front door 8 for covering the above is hinged so as to be openable and closable by a hinge 9 on the same side as the hinge 3.

  As shown in FIG. 2, the launch means 7 includes a support plate 11 made of sheet metal, a launch rail 12 mounted on the front surface of the support plate 11, and a game ball for launch mounted on the front surface of the support plate 11. A ball holding portion 13 held on the firing rail 12, a hammer mallet 15 supported on the front surface of the support plate 11 so as to be swingable around a drive shaft 14 in the front-rear direction, and a hammer mallet mounted on the back side of the support plate 11 and hammered. And a firing drive means 16 such as a rotary solenoid for driving 15 in the striking direction via the drive shaft 14, and when the firing handle 17 on the front door 8 side is operated, the firing drive means 16 according to the operation amount. The striking mallet 15 is thus continuously driven in the striking direction (clockwise). Thereby, the game balls supplied one by one on the launch rail 12 are launched toward the game area 5a of the game board 5 along the launch rail 12.

  The game board 5 is attached to the game board mounting frame 6 from the front side, for example, and is detachably fixed by one or a plurality of fixing tools 18. The front side of the game board 5 is shot by the launching means 7. While the guide rail 21 for guiding the is mounted in a ring, in the game area 5a inside the guide rail 21, the central display unit 22, the normal symbol starting means 23, the special symbol starting means 24, the big winning means 25, the normal winning Various game parts such as means 26 are arranged.

  The central display unit 22 is provided with a liquid crystal type image display means 27, a normal symbol display means 28, a special symbol display means 29, a normally reserved number display means 30 and the like. The image display means 27 constitutes an effect symbol display means 31, a special reserved number display means 32, and the like.

  The normal symbol display means 28 is composed of, for example, two light emitting bodies (for example, LEDs) corresponding to two kinds of normal symbols such as "○" and "x", and the normal symbol starting means 23 including a passage gate is a game. On condition that the sphere is detected, these two light-emitting bodies blink alternately for a predetermined time, and the hit determination random number value obtained when the game sphere is detected by the normal pattern starting means 23 matches the predetermined hit determination value. In such a case, the blinking ends so that the light emitting body on the “◯” side corresponding to the hitting mode emits light, and the light emitting body on the “x” side corresponding to the detaching mode lights up in other cases. It has become.

  The normal random number information such as the hit determination random number value acquired when the game ball is detected by the normal symbol starting means 23 is stored with a predetermined upper limit holding number, for example, 4 as a limit, and the symbol by the normal symbol display means 28. It is sequentially digested each time fluctuation starts. The stored number of ordinary random number information (hereinafter referred to as ordinary retained number) is notified to the player by, for example, the normally retained number display means 30 having the same number of light emitting members as the upper limit retained number.

  The special symbol starting means 24 is for starting the symbol variation by the special symbol displaying means 29, and is provided with, for example, two starting prize winning means 24a and 24b, which are arranged below the central display unit 22. The upper start winning means 24a is a non-opening / closing type winning means having no opening / closing means. The lower start winning means 24b can be opened / closed by the opening / closing means 33 so that the game ball can be switched between a closed state in which the game ball cannot be entered (or difficult to enter) and an open state in which the game ball can be entered (or easier to enter than the closed state). In the winning means of the formula, when the stop symbol after the change of the normal symbol display means 28 becomes the hit mode and the ordinary profit state occurs, the closed state is opened for a predetermined time.

  The special symbol display means 29 is composed of one or a plurality, for example, a display means such as a 7-segment type capable of variably displaying one special symbol, and the special symbol starting means 24 detects a game ball, That is, the special symbol is variably displayed for a predetermined time on condition that the game ball enters one of the upper and lower two starting winning means 24a, 24b, and the jackpot determination obtained at the time of entering the starting winning means 24a, 24b. When the random number value matches a predetermined jackpot determination value, the jackpot is stopped in a predetermined jackpot manner (specific manner), and in other cases, for example, it is stopped in a miss manner.

  The special random number information such as the jackpot determination random number value acquired when the game ball is detected by the special symbol starting means 24 is stored with a predetermined upper limit holding number, for example, 4 as a limit, and the symbol by the special symbol display means 29. It is sequentially digested each time fluctuation starts. The number of stored special random number information (hereinafter referred to as the special reserved number) is notified to the player by the special reserved number display means 32, for example, by the display number of the reserved display image X.

  The effect symbol display means 31, for example, variably displays effect symbols in parallel with the variable display of the special symbols by the special symbol display means 29, and one or a plurality of, for example, three effect symbols in the left-right direction, for example, various types. The display screen 27a of the image display means 27 can be variably displayed together with the effect image of, and when the special symbol starting means 24 detects a game ball, that is, the game is placed in one of the upper and lower two starting winning means 24a, 24b. When the ball wins, for example, the variation of the special design is started at the same time as the variation of the special symbol is started, and the variation of the special symbol is stopped at the same time as the final stop, so that the production symbol is left. , Right, middle, etc. are stopped in a predetermined order.

  The big winning means 25 is an opening-and-closing type winning means having an opening and closing plate 25a which can be switched between an open state in which a game ball can enter and a closed state in which a game ball cannot enter, and after the special symbol display means 29 has changed. When the special symbol is a big hit mode and a special profit state occurs, the opening / closing plate 25a is opened to the front side according to a predetermined opening pattern, and the game ball dropped on it is prized inside. .

  The front door 8 includes a door base 35 made of, for example, resin in which a window hole 34 corresponding to the front side of the game area 5a is formed. In the door base 35, for example, a pair of left and right upper first speakers 36a and 36b and a blowing effect means 37 are arranged near the upper side of the window hole 34, and a pair of left and right upper second speakers 38a near the lower side of the window hole 34. , 38b are arranged. The blowing effect means (movable effecting means) 37 is for performing an effect of blowing air toward a player sitting in front of the gaming machine main body 1, and is a sirocco fan or the like operated by a motor (driving means). An air blowing unit 37a is provided, and is arranged adjacent to the right upper first speaker 36b on the upper right end side of the door base 35 so that, for example, the air blowing port 37b faces forward and obliquely downward.

  Further, on the front side of the door base 35, as shown in FIG. 3, a plurality of (here, six) LED boards 41 to 46 are arranged around the window hole 34. That is, the first LED board 41 is arranged in the lower left part of the window hole 34, the second LED board 42 is arranged in the upper left part of the window hole 34, and the third LED board 43 is arranged in the substantially horizontal center of the upper side of the window hole 34, A fourth LED board 44 is arranged in the lower right part of the window hole 34, a fifth LED board 45 is arranged in the upper part thereof, and a sixth LED board 46 is arranged in the upper right part of the window hole 34 in the vicinity of the blowing effect means 37.

  The first LED board 41 and the second LED board 42 are arranged along the window hole 34 between the left upper second speaker 38a and the upper first speaker 36a, and the third LED board 43 is left and right upper first speaker. It is arranged between 36a and 36b. Further, the fourth LED board 44 and the fifth LED board 45 are arranged along the window hole 34 between the upper second speaker 38b on the right side and the blowing effect producing means 37, and the sixth LED board 46 is, for example, the blowing effect producing means. It is arranged on the outer circumference of the blower port 37b of 37.

  As shown in FIG. 1, on the lower front side of the door base 35, for example, at a position on the left side, an upper plate 47 for storing game balls for supplying to the launching means 7 is arranged, and further, of the upper plate 47. On the lower side, a lower plate 48 for storing surplus balls and the like when the upper plate 47 is full is arranged on the left end side, and the firing handle 17 is arranged on the right end side.

  Further, on the front side of the door base 35, an upper decorative cover 49 that substantially covers the periphery of the window hole 34 from the front side, and a lower decorative cover 50 that substantially covers the upper plate 47, the lower plate 48 and the like from the front side are mounted. At least a portion of the upper decorative cover 49 corresponding to the front side of the first to sixth LED boards 41 to 46 is a light emitting lens portion having a light transmitting property. On the lower decorative cover 50, for example, a player-operable effect button 51 is arranged substantially in the center of the front side of the upper plate 47 in the left-right direction, and a ball lending operation section 52 is arranged on the side thereof.

  As shown in FIG. 2, a glass unit 53 that substantially closes the window hole 34 from the rear side is detachably attached to the back side of the door base 35, and a ball feeding means 54 and a lower plate guide are provided below the glass unit 53. The means 55, the front door relay board 56, and the like are arranged. The ball feeding means 54 supplies the game balls in the upper plate 47 one by one onto the launch rail 12, is arranged corresponding to the front side of the launch means 7, and operates in synchronization with the launch operation by the launch means 7. It is supposed to do. The lower plate guide means 55 guides to the lower plate 48 surplus balls when the upper plate 47 is full, and foul balls that have been returned by the launching means 7 without reaching the game area 5a. And is arranged adjacent to the ball feeding means 54 on the hinge 9 side thereof. Further, the front door relay board 56, the effect control board and the like arranged on the back side of the game board 5, the first to sixth LED boards 41 to 46 on the front door 8 side, the speakers 10, 36a, 36b, 38a, 38b, and the air blower. It relays between various production means such as the production means 37, and is arranged, for example, between the door base 35 and the lower plate guide means 55 on the rear side.

  Subsequently, among the various game parts provided on the front door 8, particularly, the wiring for the first to sixth LED boards 41 to 46, the upper first speakers 36a and 36b, the upper second speakers 38a and 38b, and the air blow performance means 37. The details will be described.

  First, an outline of the wiring path on the front door 8 will be described. As shown in FIG. 3 and the like, the wiring paths of the first to sixth LED boards 41 to 46 are branched left and right from the front door relay board 56 arranged on the lower side of the front door 8 along the window hole 34. The first to third LED boards 41 to 43 form a left wiring path 57 on the left side of the window hole 34, and the fourth to sixth LED boards 44 to 46 form a right wiring path 58 on the right side of the window hole 34. . Further, the drive wiring paths of the upper first speakers 36a and 36b are provided on the left wiring path 57, and the drive wiring paths of the blowing effect producing means 37 are provided on the right wiring path 58. The upper second speakers 38a and 38b are independent of the left and right wiring paths 57 and 58, and are connected, for example, from the front door relay board 56 via harnesses 59a and 59b.

  The first to third LED boards (first to third boards) 41 to 43 forming the left wiring path 57 are connected in series via the harnesses 61 and 62, and the first LED board 41 on the most upstream side thereof is , And is connected to the front door relay board 56 via the harness 60. In the left wiring path 57, a through path wiring path (predetermined wiring path) is provided in the first LED board 41 and the second LED board 42, and the LED arranged on the third LED board 43 and the LED are driven downstream of the through path wiring path. And a circuit section including an LED driver for connecting the same. Further, the first LED board 41 and the second LED board 42 are also provided with a circuit section including an LED and an LED driver for driving the LED, and are respectively connected to the through path wiring paths. Further, a part of the drive wiring paths of the upper first speakers (predetermined effect means) 36a, 36b are provided on the first to third LED boards 41 to 43, and the third LED board 43 on the most downstream side and the upper first speaker 36a. , 36b are connected via harnesses 63, 64, respectively.

  The fourth to sixth LED boards 44 to 46 forming the right wiring path 58 are connected in series via the harnesses 66 and 67, and the fourth LED board 44 on the most upstream side is connected to the front door via the harness 65. It is connected to the relay board 56. In the right wiring path 58, a through path wiring path (predetermined wiring path) is provided in the fourth LED board (first board) 44 and the fifth LED board (second board) 45, and a sixth LED board is provided downstream of the through path wiring path. A circuit unit including an LED (third LED) arranged on the (third substrate) 46 and an LED driver (third LED driver) for driving the LED is connected. The fourth LED substrate (first substrate) 44 is also provided with a circuit unit including an LED (first LED) and an LED driver (first LED driver) that drives the LED (first LED), and is connected to the through path wiring path. The fifth LED substrate (second substrate) 45 is also provided with an LED (second LED), and this LED is driven by the LED driver (first LED driver) on the fourth LED substrate (first substrate) 44. Further, a part of the drive wiring path of the air blow effect producing means (predetermined effect producing means) 37 is provided on the fourth and fifth LED boards 44, 45, and the fifth LED board 45 and the air blowing means 37a of the air blow effect producing means 37 are harness 68. Connected through. In the present embodiment, parts other than the LEDs, LED drivers, protective resistors, connectors, etc. are omitted on the first to sixth LED boards 41 to 46. Hereinafter, the configurations of the first to sixth LED boards 41 to 46 will be described in detail.

[First LED board 41]
The first LED substrate (first substrate) 41 includes a substrate body 72 having wiring layers on both front and rear surfaces, as shown in FIG. In the substrate body 72, the right edge 72a is formed in a substantially arc shape along the lower left portion of the window hole 34, and the left edge 72b is formed in a substantially vertical direction, so that the substrate main body 72 moves from the upper side to the lower side. The width is gradually widened, and a cutout portion 72c corresponding to the arrangement position of the left upper second speaker 38a is formed in the lower left portion.

  Then, as shown in FIG. 4, on the first LED board 41, an upstream connector (board connecting connector) 73, a downstream connector (board connecting connector) 74, and an LED for connecting the connectors 73, 74 to each other. Power supply, LED driver power supply, signal, clock, and ground through-pass wiring paths (predetermined wiring paths) 75 to 79, and LED driver power supply, signal, clock, and ground through-path wiring paths 76 to 79 For example, two LED drivers 80 and 81 that are branched from each other are connected, and protection resistors 82 and 83 that are connected in series between the RGB terminals of the LED drivers 80 and 81 and the through path wiring path 75 for LED power supply, LEDs 84 to 87 and speaker drive wiring paths 88a to 88d that connect between the connectors 73 and 74 are provided. A circuit portion including the LED drivers 80 and 81, the LEDs 84 to 87, the protection resistors 82 and 83, etc. connected to the through path wiring paths 75 to 79 is an example of the first circuit portion.

  The upstream connector 73 is connected to the front door relay board 56 via the harness 60, and for example, two LED power supply terminals 89a and 89b to which the through path wiring path 75 for LED power supply is connected and an LED driver power supply. For example, one LED driver power supply terminal 90 to which the through-path wiring path 76 is connected, for example, one signal terminal 91 to which a signal through-path wiring path (digital signal wiring path) 77 is connected, and a through-path wiring path for a clock. For example, one clock terminal 92 to which the (digital signal wiring path) 78 is connected, three ground terminals 93a to 93c to which the through path wiring path 79 for ground is connected, and speaker driving wiring paths 88a to 88d are connected. Speaker terminals 94a to 94d, and a total of 12 terminals, for example, 6 terminals each arranged in 2 rows. It is. Then, two terminals on each end of the two rows in the terminal arrangement direction, that is, a total of four terminals are speaker terminals 94a to 94d. In this way, by connecting the LED power supply through-pass wiring path 75 to the two LED power supply terminals 89a and 89b and connecting the ground through-path wiring path 79 to the three ground terminals 93a to 93c, the harness side connector It reduces the electrical resistance generated at the contact area.

  Regarding the eight terminals of the connectors 73 and 74 other than the speaker terminals 94a to 94d, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order on one side, and the other side. The ground terminal 93b, the signal terminal 91, the clock terminal 92, and the ground terminal 93c are arranged in that order in the side row. Of course, the arrangement of the terminals in the connectors 73 and 74 is arbitrary.

  FIG. 5 shows a specific wiring pattern of the first LED substrate 41 for each wiring layer. In the first LED substrate 41, LEDs 84 to 87 are provided on the front wiring layer (second wiring layer) 71a on the front side, and upstream connectors 73, downstream connectors 74 are provided on the rear wiring layer (first wiring layer) 71b on the back surface. LED drivers 80, 81, protection resistors 82, 83, etc. are arranged respectively.

  The front wiring layer 71a and the back wiring layer 71b are covered with the insulating film 106 (see FIG. 7) almost entirely, but in FIG. The lower wiring path and the like are shown by solid lines. The same applies to FIGS. 8, 10, 12, 14, and 16 described later.

  The upstream connector 73 is arranged, for example, on the lower end side of the back wiring layer 71b (FIG. 5B) so that the terminal arrangement is in the left-right direction, and the downstream connector 74 is, for example, on the upper end side of the back wiring layer 71b. Are arranged so that they are in the vertical direction. Each terminal of the connectors 73 and 74 is, for example, rectangular and is formed in an elongated shape in a direction orthogonal to the arrangement direction. Then, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream connector 73 from the outside in the terminal arrangement direction (here, the left-right direction), and the upstream side. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 73 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, speaker drive wiring paths 88a and 88b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction), and the downstream side. For example, speaker drive wiring paths 88c and 88d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 74 from the outside in the terminal arrangement direction (here, the vertical direction).

  As described above, the speaker drive wiring paths 88a to 88d are connected to the outermost terminals 94a to 94d of the plurality of terminals of the connectors 73 and 74 in the arrangement direction from the outside in the terminal arrangement direction. Although the speaker drive wiring paths 88a to 88d are formed wide, it is easy to avoid interference with other wiring paths. Further, since the speaker terminals 94a to 94d are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the speaker drive wiring paths 88a to 88d are connected by connecting the long side of the speaker terminals 94a to 94d. It is possible to secure a larger cross-sectional area of the portion and keep the resistance low.

  The LEDs 84 to 87 are arranged in a row at substantially regular intervals along the longitudinal direction of the front wiring layer 71a (FIG. 5A), for example. The LEDs 84 and 85 driven by the LED driver 80 are vertically arranged, for example, on the upper side of the front wiring layer 71a, and are connected in series by the inter-LED wiring path 95. The LEDs 86 and 87 driven by the LED driver 81 are diagonally arranged along the right edge 72a of the substrate body 72 on the lower side of the front wiring layer 71a, and are connected in series by the inter-LED wiring path 95. There is. The LEDs 84 to 87 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have an R electrode corresponding to red and a G electrode corresponding to green (second electrode). An electrode) and a B electrode (third electrode) corresponding to blue are provided side by side so that the R electrode (first electrode) is located at the center, for example.

  In addition to the speaker drive wiring paths 88a to 88d, the first LED substrate 41 also includes, for example, both ends of the through path wiring paths 75 to 78 for LED power supply, LED driver power supply, signal and clock, that is, connectors. Except for a predetermined range in the vicinity of the connecting portions to 73 and 74, almost all of them are provided on the same front wiring layer (second wiring layer) 71a side as the LEDs 84 to 87.

  That is, the speaker drive wiring paths 88a and 88b are arranged on the front wiring layer 71a along, for example, the right edge portion 72a, and the rear wiring layer 71b side is provided on both end portions side thereof via the vias (interlayer conductive portions) 96. The connectors 73 and 74 are connected to speaker terminals 94a and 94b. Further, the speaker drive wiring paths 88c, 88d are arranged on the front wiring layer 71a along, for example, the left edge portion 72b, and the speaker in the connectors 73, 74 on the rear wiring layer 71b side via the vias 96 at both end portions thereof. It is connected to the terminals 94c and 94d. The via 96 of the present embodiment is assumed to be a through-hole type via having a through hole plated.

  Further, the LED power supply, LED driver power supply, signal, and clock through-path wiring paths 75 to 78 are provided on the front wiring layer 71a along the right side of the upper side LEDs 84 and 85 and the left side of the lower side LEDs 86 and 87, for example. Are arranged so as to vertically cross the center in the width direction, and the LED power supply terminals 89a and 89b, the LED driver power supply terminal 90, and the signal in the connectors 73 and 74 on the rear wiring layer 71b side are provided at both ends thereof via the vias 96. It is connected to the terminal 91 and the clock terminal 92.

  The LED power supply wiring path 97 branched from the LED power supply through path wiring path 75 is connected to, for example, the anode electrodes of the LEDs 84 and 87, and the LED power supply wiring path 98 branched from the LED driver power supply through path wiring path 76 is formed. , A signal wiring path 99 connected to the power supply terminals of the LED drivers 80 and 81 and branched from the signal through path wiring path 77 is connected to the signal terminals of the LED drivers 80 and 81 and branched from the clock through path wiring path 78. The clock wiring path 100 is connected to the clock terminals of the LED drivers 80 and 81.

  Further, the front surface wiring layer 71a is provided with solid ground patterns 101 at a plurality of locations including between the through path wiring paths 75 to 78 including digital signal wiring paths and the speaker drive wiring paths 88a to 88d. Each of the solid ground patterns 101 constitutes a through-pass wiring path (ground wiring path) 79 for ground together with the solid ground pattern 102 on the back wiring layer 71b side. For example, vias 96, the solid ground pattern 102, etc. It is connected to the ground terminals 93a to 93c of the connectors 73 and 74. Note that, for example, the solid ground pattern 101a among the plurality of solid ground patterns 101 is arranged in a floating island shape below the LED 85 between the speaker drive wiring paths 88c and 88d and the through path wiring paths 75 to 78.

  The LED drivers 80 and 81 are arranged, for example, at a predetermined distance in the up-down direction at approximately the center of the back wiring layer 71b, and the signal and clock through-path wiring paths (digital signal wiring paths) on the front wiring layer 71a side. It is arranged at a position corresponding to 77 and 78. Further, a solid ground pattern 101a on the front wiring layer 71a side is provided corresponding to the arrangement range of the LED drivers 80 and 81. That is, on the front wiring layer 71a side, through-path wiring paths 77, 78 for signals and clocks and speaker driving wiring paths 88c, 88d are arranged with the solid ground pattern 101a interposed therebetween, and the LEDs on the rear wiring layer 71b side are arranged. The drivers 80 and 81 are arranged at positions corresponding to the signal and clock through-path wiring paths 77 and 78 which are separated from the speaker drive wiring paths 88c and 88d, and the solid ground pattern 101a is the LED drivers 80 and 81. It corresponds to the arrangement range of.

  In this way, the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78, which may be noise sources, are collectively arranged at the positions corresponding to each other in the back wiring layer 71b and the front wiring layer 71a, and the speaker drive weak against noise is driven. By arranging the wiring paths 88c and 88d away from the digital signal wiring paths 77 and 78 and arranging the solid ground pattern 101a therebetween, the LED drivers 80 and 81 and the digital signal wiring paths 77 and 78 can be connected to the speaker. The adverse effect of noise on the drive wiring paths 88c and 88d can be eliminated as much as possible.

  The protection resistors 82 and 83 are arranged, for example, in the vicinity of the LED drivers 80 and 81 in the back wiring layer 71b, one end side of which is connected to the RGB terminals of the LED drivers 80 and 81 via the LED drive wiring path 103 and the other end thereof. The cathodes of the LEDs 85 and 86 are connected to the cathode electrodes of the LEDs 85 and 86, respectively, via the cathode-side wiring path 104 that extends over the rear wiring layer 71b with the via 96 interposed therebetween.

  The rear wiring layer 71b is provided with a plurality of solid ground patterns 102 around the LED drivers 80 and 81 and the protection resistors 82 and 83. The solid ground patterns 102 are connected to each other via, for example, a plurality of vias 96, the solid ground pattern 101 on the front wiring layer 71a side, and the ground terminals 93a to 93c of the connectors 73 and 74 and the LED drivers 80 and 81. Is connected to the ground terminal of.

  In the first LED substrate 41, the speaker drive wiring paths 88a to 88d are digital signals such as signal and clock through path wiring paths 77 and 78 for driving the LEDs 84 to 87, a signal wiring path 99, and a clock wiring path 100. It is formed wider than the signal wiring path.

  In addition, the first LED substrate 41 adopts the following configuration in order to improve the heat radiation efficiency of the LEDs 84 to 87 and the LED drivers 80 and 81 as an example of the heat generating component. First, regarding the LEDs 84 to 87, the heat dissipation portions 105a and 105b having a width wider than that of the other portions in the wiring path are provided in the wiring path (that is, the copper foil pattern) connected to the electrodes, and the heat dissipation portions 105a and 105b are provided. The LEDs 84 to 87 are radiated through the heat.

  That is, as shown in FIG. 6, in the inter-LED wiring path 95 and the cathode-side wiring path 104, for example, except for the central R wiring path (first wiring path) 95R, 104R, the G wiring path (second wiring) on both sides thereof is formed. Path) 95G, 104G and B wiring path (third wiring path) 95B, 104B are provided with a heat dissipation portion 105a. The heat dissipation portion 105a is provided, for example, in a connection portion with the G and B electrodes AG, AB, KG, and KB, and is widened on the side opposite to the R wiring paths 95R and 104R, that is, outside in the electrode arrangement direction. Thus, for example, it is formed in a rectangular shape. Further, in the LED power supply wiring path 97, for example, a rectangular heat dissipation portion 105b that widens on both sides in the width direction is provided at a connection portion of the LEDs 84 and 87 with the electrodes AG, AR, and AB. Thereby, the heat generated in the LEDs 84 and 87 can be efficiently radiated through the heat radiating portions 105a and 105b, and the malfunction of the LEDs due to overheating can be prevented.

  Regarding the LED drivers 80 and 81, a part of the solid ground pattern (first conductor pattern) 102 is arranged between the LED drivers 80 and 81, and the LED drivers 80 and 81 are connected via the solid ground pattern 102. It is designed to radiate heat. In this embodiment, as shown in FIG. 7, a part of the solid ground pattern 102 is arranged below the LED drivers 80 and 81, and the LED drivers 80 and 81 cover the solid ground pattern 102. It is fixed to the substrate main body 72 in a state where the back surface is substantially abutted. As a result, the heat generated by the LED drivers 80 and 81 can be efficiently radiated through the solid ground pattern 102 having a large area, and the malfunction of the LED drivers due to overheating can be prevented.

[Second LED board 42]
The second LED substrate (second substrate) 42 includes a substrate body 112 having wiring layers on both front and rear surfaces, as shown in FIG. In the substrate body 112, the right edge 112a is formed in a substantially arc shape along the upper left portion of the window hole 34, and the left edge 112b is formed in a substantially vertical direction, so that the lower edge is directed to the upper edge. It is gradually widening.

  As shown in FIG. 4, the board main body 112 has an upstream side connector (board connecting connector) 113, a downstream side connector (board connecting connector) 114, and an LED power source for connecting the connectors 113 and 114. , LED driver power supply, signal, clock, and ground through path wiring lines (predetermined wiring path) 115 to 119, and LED driver power supply, signal, clock, and ground through path wiring paths 116 to 119 For example, two LED drivers 120 and 121 that are branched and connected, and protection resistors 122 and 123 and an LED 124 that are connected in series between the RGB terminals of the LED drivers 120 and 121 and the through-pass wiring path 115 for LED power supply. ~ 127 and the speaker drive wiring path 1 for connecting between the connectors 113 and 114 And 8a~128d is provided. The circuit unit including the LED drivers 120 and 121, the LEDs 124 to 127, the protection resistors 122 and 123, etc., which are connected to the through path wiring paths 115 to 119, is an example of the second circuit unit.

  The upstream connector 113 is connected to the downstream connector 74 on the first LED board 41 side by the harness 61, and has the same terminal configuration as the downstream connector 74. One of the downstream side connectors 114 has a terminal configuration different from that of the upstream side connector 113. For example, one LED power supply terminal 89 to which the through path wiring line 115 for LED power supply is connected, and a through path wiring line for LED driver power supply. For example, one LED driver power supply terminal 90 to which 116 is connected, one signal terminal 91 to which a signal through-pass wiring path (digital signal wiring path) 117 is connected, and a clock through-path wiring path (digital signal wiring) Path 118 connected to one clock terminal 92, two ground terminals 93a and 93b connected to a ground through-path wiring path 119, and speaker terminal 94a connected to speaker drive wiring paths 128a to 128d. To 94d, and 10 terminals in total, for example, 5 rows each in 2 rows It is arranged. Then, two terminals on each end of the two rows in the terminal arrangement direction, that is, a total of four terminals are speaker terminals 94a to 94d.

  As described above, in the second LED substrate 42, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 113, that is, the LED power supply, the LED driver power supply, and the through path wiring paths 115, 116, and 119 for the ground (here, in total). 6) is larger than the number of terminals (here, 4 in total) corresponding to the same wiring paths 115, 116, 119 in the downstream side connector 114.

  Regarding the six terminals other than the speaker terminals 94a to 94d in the downstream connector 114, for example, the LED power supply terminal 89, the ground terminal 93a, and the LED driver power supply terminal 90 are arranged in that order in one row, and the other side. A signal terminal 91, a clock terminal 92, and a ground terminal 93b are arranged in that order in a row. Of course, the arrangement of each terminal in the connector 114 is arbitrary.

  FIG. 8 shows a specific wiring pattern of the second LED substrate 42 for each wiring layer. In the second LED substrate 42, the LEDs 124 to 127 are provided on the front wiring layer 111a (FIG. 8A) on the front side, and the upstream connector 113 and the downstream connector are provided on the rear wiring layer 111b (FIG. 8B) on the back side. 114, LED drivers 120 and 121, protection resistors 122 and 123, etc. are respectively arranged.

  The upstream side connector 113 is arranged, for example, on the lower end side of the back surface wiring layer 111b so that the terminal arrangement is in the left and right direction, and the downstream side connector 114 is, for example, on the upper side side of the back surface wiring layer 111b, so that the terminal arrangement is also in the left and right direction. It is arranged. Each terminal of the connectors 113 and 114 has, for example, a rectangular shape, and is formed in an elongated shape in a direction orthogonal to the arrangement direction (here, the left-right direction). Then, for example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the upstream side connector 113 from the outside in the terminal arrangement direction (here, the left and right direction), and the upstream side. For example, speaker drive wiring paths 128c and 128d for the upper first speaker 36b are connected to the speaker terminals 94c and 94d on the other end side of the side connector 113 from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, for example, speaker drive wiring paths 128a and 128b for the upper first speaker 36a are connected to the speaker terminals 94a and 94b on one end side of the downstream side connector 114 from the outer side in the terminal arrangement direction (here, left and right direction), and the downstream side. Speaker drive wiring paths 128c and 128d for the upper first speaker 36b, for example, are connected to the speaker terminals 94c and 94d on the other end side of the side connector 114 from the outside in the terminal arrangement direction (here, the left-right direction).

  In the second LED substrate 42, for example, the through-pass wiring path 115 for the LED power supply is substantially the same as the LEDs 124 to 127 except for a predetermined range near both ends thereof, that is, the connection portions to the connectors 113 and 114. Although provided on the wiring layer 111a side, the speaker drive wiring paths 128a to 128d and the LED driver power supply, signal, and clock through-path wiring paths 116 to 118 are connected to the front wiring layer 111a via the via 96. Substantially all of them are provided on the back wiring layer 111b side, except for a part of bypasses to be avoided on the side.

  That is, the speaker drive wiring paths 128a and 128b are arranged along the right edge portion 112a on the back surface wiring layer 111b, and the speaker driving wiring paths 128c and 128d are arranged along the left edge portion 112b on the back surface wiring layer 111b. There is. Further, the through path wiring paths 116 to 118 are vertically arranged on the back surface wiring layer 111b, for example, between the speaker driving wiring paths 128a and 128b and the speaker driving wiring paths 128c and 128d, and the upper and lower ends thereof are respectively the connector 113. , 114.

  The LED driver power supply wiring path 131 branched from the LED driver power supply through path wiring path 116 is connected to the power supply terminals of the LED drivers 120 and 121, and the signal wiring path 132 branched from the signal through path wiring path 117 is formed. A clock wiring path 133 connected to the signal terminals of the LED drivers 120 and 121 and branched from the through path wiring path 118 for clock is connected to the clock terminals of the LED drivers 120 and 121.

  Here, the LED driver 120 and the corresponding protection resistor 122 are arranged, for example, above the downstream connector 114 in the back wiring layer 111b, and the LED driver 121 and the protection resistor 123 corresponding thereto are provided, for example, in the back wiring layer 111b. Are arranged between the speaker drive wiring paths 128c and 128d and the through path wiring paths 116 to 118.

  The LED power supply wiring path 131, the signal wiring path 132, and the clock wiring path 133 corresponding to the LED driver 120 are provided substantially upward from the downstream connector 114 or the vicinity thereof, that is, in the substantially extending direction of the through path wiring paths 116 to 118. ing. In this way, the downstream connector 114 of the second LED board 42 is arranged in the middle of the wiring path connecting the upstream connector 113 and the LED driver 120, so that the downstream connector is provided on the lowermost side of the second LED board 42. As compared with the case where 114 is arranged, there is an advantage that the wiring path of the second LED substrate 42 is simplified.

  Further, the back wiring layer 111b is provided with, for example, a plurality of solid ground patterns 134. Each of the solid ground patterns 134 constitutes a ground through-pass wiring path (ground wiring path) 119 together with the solid ground pattern 135 on the front surface wiring layer 111a side. For example, via the via 96, the solid ground pattern 135, etc. It is connected to the ground terminals 93a to 93c of the upstream connector 113, the ground terminals 93a and 93b of the downstream connector 114, and the ground terminals of the LED drivers 120 and 121.

  As shown in FIG. 9 and the like, a part of the solid ground pattern (first conductor pattern) 134 is arranged between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer 111a side. One or more vias (interlayer conduction portions) 96 that connect the solid ground pattern (ground wiring path, second conductor pattern) 135 of the LED driver 120 are provided both inside and outside the arrangement region of the LED driver 120, for example. ing. The via 96 outside the arrangement area of the LED driver 120 is preferably provided at one or a plurality of locations including the vicinity of the arrangement area. Further, the vias 96 corresponding to the arrangement area of the LED driver 120 are centrally arranged in the central area in the arrangement area of the LED driver 120 as shown in FIG. 9 and the like. By arranging the vias 96 in the arrangement region of the LED driver 120 in this manner, heat conduction to the solid ground pattern 135 on the front wiring layer 111a side can be promoted and heat dissipation can be expected from the inner surface of the vias 96. Moreover, by arranging the vias 96 centrally in the central region of the LED driver 120, which has the highest temperature, the heat generated in the LED driver 120 can be radiated more efficiently. In addition, the vias 96 are arranged not only in the central region in the arrangement region of the LED driver 120 but also outside (the peripheral region) of the central region in the arrangement region, and the vias 96 in the central region are larger than those in the peripheral region. The arrangement density may be increased. Further, the via 96 that connects the solid ground pattern (first conductor pattern) 134 and the front wiring layer 111a side may be provided only in the arrangement region of the LED driver 120.

  Further, the solid ground pattern 134a of the plurality of solid ground patterns 134 of the back wiring layer 111b is provided at a position corresponding to the LED driver 121. A part of the solid ground pattern (first conductor pattern) 134a is arranged between the LED driver 121 and the substrate body 112, and a wiring including a through-path wiring path (clock wiring path) 118 for a clock is provided around the solid pattern 134a. The front wiring layer 111a is formed in a floating island shape surrounded by wiring paths, that is, speaker driving wiring paths 128c and 128d, through path wiring paths 116 to 118, and the like, and is formed by one or a plurality of vias (interlayer conductive portions) 96. It is electrically connected to the solid ground pattern (ground wiring path, second conductor pattern) 135 on the side. As a result, it is possible to effectively dissipate heat from the LED driver 121 via the solid ground pattern 134a, and it is possible to eliminate the adverse effect of noise picked up by the solid ground pattern 134a as much as possible.

  Further, one or more vias 96 that connect the solid ground pattern 134a on the rear wiring layer 111b side and the solid ground pattern 135 on the front wiring layer 111a side are provided inside and outside the arrangement area of the LED driver 121, respectively. It is provided. The via 96 corresponding to the arrangement area of the LED driver 121 is arranged, for example, in the vicinity of one edge of the LED driver 121 in accordance with the arrangement of the solid ground pattern 135 on the front wiring layer 111a side. By providing the via 96 in the arrangement area of the LED driver 121, the heat generated in the LED driver 121 can be radiated more efficiently. Further, by providing the via 96 not only outside the arrangement area of the LED driver 121 but also inside the arrangement area, it is possible to more effectively eliminate the adverse effect of noise picked up by the solid ground pattern 134a. The via 96 for connecting the solid ground pattern 134a to the solid ground pattern 135 may be provided only in the arrangement area of the LED driver 121, for example.

  The LEDs 124 and 125 driven by the LED driver 120 are arranged on the left and right sides on the upper side of the front wiring layer 111a, for example, and are connected in series by the inter-LED wiring path 136. The LEDs 126 and 127 driven by the LED driver 121 are vertically arranged, for example, on the lower side of the front wiring layer 111a, and are connected in series by the inter-LED wiring path 136. The LEDs 124 to 127 are full-color light-emitting types that incorporate red, green, and blue LED elements, for example, on both the anode side and the cathode side, an R electrode corresponding to red, a G electrode corresponding to green, and a blue electrode. The corresponding B electrode is provided side by side, for example, with the R electrode at the center.

  In the second LED substrate 42, the speaker drive wiring paths 128a to 128d are digital signal wirings such as signal and clock through-path wiring paths 117 and 118 for driving LEDs, a signal wiring path 132, and a clock wiring path 133. It is wider than the road.

  Further, the through-pass wiring path 115 for the LED power source is arranged so as to vertically cross the substantial center of the front wiring layer 111a, and both ends thereof are connected to the connectors 113 and 114 on the rear wiring layer 111b side via the vias 96 and the like. There is. Then, the LED power supply wiring path 137 branched from the LED power supply through-pass wiring path 115 is connected to, for example, the anode electrodes of the LEDs 125 and 127, and the cathode electrodes of the LEDs 124 and 126 are sandwiched by the via 96 and the rear wiring layer 111b is sandwiched therebetween. It is connected to the protection resistors 122 and 123 via the cathode side wiring path 138 that extends over the side. The inter-LED wiring path 136, the LED power supply wiring path 137, and the cathode side wiring path 138 are provided with heat dissipation portions 105a and 105b similar to those of the first LED board 41.

[Third LED board 43]
As shown in FIG. 3 and the like, the third LED substrate (third substrate) 43 is provided with a substrate body 142 having, for example, a horizontally long rectangular shape having wiring layers on both front and rear surfaces. As shown in FIG. 4, an upstream side connector (board connecting connector) 143, a pair of speaker connectors (production means connecting connectors) 144 and 145, an LED driver 146, LEDs 147 to 150, and a protection resistor are provided on the board body 142. 151, 152 and the like are provided.

  The upstream side connector 143 is connected to the downstream side connector 114 on the second LED substrate 42 side by the harness 62 and has the same terminal configuration as that of the downstream side connector 114. The speaker connectors 144 and 145 are connected to the upper first speakers 36a and 36b by harnesses 63 and 64. The speaker connector 144 has speaker terminals 153a and 153b, and the speaker connector 145 has speaker terminals 153c and 153c. 153d is provided respectively. The speaker terminals 153a and 153b of the speaker connector 144 are connected to the speaker terminals 94a and 94b of the upstream connector 143 via the speaker drive wiring paths 154a and 154b, and the speaker terminals 153c and 153d of the speaker connector 145 are speaker drive terminals. The speaker terminals 94c and 94d of the upstream connector 143 are connected via the wiring paths 154c and 154d.

  FIG. 10 shows a specific wiring pattern of the third LED substrate 43 for each wiring layer. In the third LED substrate 43, the LEDs 147 to 150 and the like are provided on the front wiring layer (second wiring layer) 141a (FIG. 10A) on the front side, and the rear wiring layer (first wiring layer) 141b (FIG. The upstream connector 143, the speaker connectors 144 and 145, the LED driver 146, the protective resistors 151 and 152, etc. are arranged in b)).

  The upstream side connector 143 is arranged, for example, on the left and right ends of the rear surface wiring layer 141b so that the terminal arrangement is in the left and right direction. For the speaker connectors 144 and 145, for example, the terminal arrangement is on the left and right ends of the rear surface wiring layer 141b in the vertical direction. It is arranged to be. Each terminal of the speaker connectors 144 and 145 is, for example, rectangular like the upstream connector 143, and is formed in an elongated shape orthogonal to the arrangement direction (here, the vertical direction).

  Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 94a and 94b on one end side of the upstream side connector 143 from the outside in the terminal arrangement direction (here, left and right direction), and the speaker terminal 94c on the other end side of the upstream side connector 143 is connected. , 94d are connected with speaker drive wiring paths 154c, 154d from the outside in the terminal arrangement direction (here, the left-right direction). Speaker drive wiring paths 154a and 154b are connected to the speaker terminals 153a and 153b of the speaker connector 144 from the outside in the terminal arrangement direction (here, the vertical direction), and speaker drive is performed to the speaker terminals 153c and 153d of the speaker connector 145. The wiring paths 154c and 154d are connected from the outside in the terminal arrangement direction (here, the vertical direction). The speaker drive wiring paths 154a to 154d are substantially the same as the LEDs 147 to 150 in the front wiring layer (second wiring layer) except for a predetermined range near both ends thereof, that is, in the vicinity of the connecting portions to the connectors 143 to 145. ) 141a side is provided.

  The LED driver 146 is arranged, for example, at substantially the center of the back wiring layer 141b, and protection resistors 151, 152 connected to the RGB terminals of the LED driver 146 are arranged on both left and right sides thereof. Then, the LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92 of the upstream connector 143 are connected to the LED driver 146 by the wiring paths 155 to 157 for the LED driver power supply, the signal, and the clock. . It should be noted that the wiring paths 155 to 157 for the LED driver power supply, signals, and clocks are substantially entirely the rear wiring except for some bypass portions that are avoided on the front wiring layer 141a side via the vias 96, for example. It is provided on the layer 141b side.

  The back wiring layer 141b is provided with one or a plurality of solid ground patterns 158. The solid ground pattern 158 constitutes the ground wiring path 160 together with the solid ground pattern 159 and the like on the front wiring layer 141a side. For example, the ground terminals 93a and 93b of the upstream connector 143 are provided via the via 96, the solid ground pattern 159 and the like. And the ground terminal of the LED driver 146.

  A part of the solid ground pattern (first conductor pattern) 158 is arranged between the LED driver 146 and the substrate body 142. Further, of the vias 96 that connect the solid ground pattern 158 and the solid ground pattern (ground wiring path, second conductor pattern) 159 on the front wiring layer 141a side, the vias arranged in the arrangement region of the LED driver 146. 96 are centrally arranged in a central region in the arrangement region of the LED driver 146, for example.

  The LEDs 147 to 150 are arranged, for example, in a zigzag pattern in the longitudinal direction of the front wiring layer 141a, for example, the left LEDs 147 and 148 are connected in series by the inter-LED wiring path 161, and for example, the right LEDs 149 and 150 are inter-LED wiring. They are connected in series by the path 161. The LEDs 147 to 150 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center. Further, the anode electrodes of the LEDs 148 and 149 are connected to the LED power supply terminal 89 of the upstream connector 143 through the LED power supply wiring path 162 that extends to the back wiring layer 141b side via the via 96, and the LEDs 147 and 150 are connected. The cathode electrode is connected to the protective resistors 151 and 152 via the cathode side wiring path 163 which extends across the back wiring layer 111b side with the via 96 interposed therebetween. Further, the inter-LED wiring path 161, the LED power wiring path 162, and the cathode side wiring path 163 are provided with heat dissipation portions 105a and 105b similar to those of the first LED substrate 41 and the like.

  In the third LED substrate 43, the speaker drive wiring paths 154a to 154d are formed wider than the digital signal wiring paths such as the signal and clock wiring paths 156 and 157 for driving the LEDs.

  In the above-described first to third LED boards 41 to 43, the through path wiring path is provided over the first to third LED boards 41 to 43, but the current value is larger on the upstream LED board. Therefore, the power supply system through-pass wiring path in the upstream LED substrate is formed wider than the power supply system through-pass wiring path in the downstream LED substrate. For example, the through-path wiring paths 75 and 76 for the LED power supply and the LED driver power supply in the first LED board 41 are wider than the through-path wiring paths 115 and 116 for the LED power supply and the LED driver power supply in the second LED board 42. Has been formed.

  Further, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through path wiring path of the power supply system is larger in the upstream side connector than in the downstream side connector. For example, while the total number of the LED power supply terminals 89a and 89b and the LED driver power supply terminal 90 in the connectors 74 and 113 for connecting the first and second LED boards 41 and 42 is three, the second and second The total number of the LED power supply terminals 89 and the LED driver power supply terminals 90 in the connectors 114 and 143 for connecting the 3LED boards 42 and 43 is two.

  As a result, it is not necessary to use an unnecessarily thick power supply system wiring path or an unnecessarily large connector in the LED board on the downstream side while securing a necessary voltage for each LED board, thereby improving wiring space efficiency. It is possible.

[Fourth LED board 44]
As shown in FIG. 3, the fourth LED substrate 44 includes a substrate body 172 having wiring layers on both front and rear sides, for example, a vertically long substantially rectangular shape. As shown in FIG. 11, the board main body 172 has an upstream side connector (board connecting connector) 173, a downstream side connector (board connecting connector) 174, and an LED power source for connecting the connectors 173 and 174. , LED driver power supply, signal, clock, and ground through path wiring (predetermined wiring path) 175 to 179, and LED driver power supply, signal, clock, and ground through path wiring paths 176 to 179. Of the LED driver 180, the protection resistors 181, 182 and the LEDs 183 to 186 connected in series between the LED driver 180 and the through path wiring line 175 for the LED power supply. For example, an example in which two sets of six RGB terminals and the downstream connector 174 are connected 2 sets six LED driving wiring path 187a~187c, 188a~188c and, and the blowing power line path 189a connecting the connectors 173, 174 and the blower ground wiring path 189b is provided if.

  The upstream side connector 173 has, for example, two LED power supply terminals 89a and 89b to which the LED power supply through-pass wiring path 175 is connected, and, for example, one LED driver power supply terminal 90 to which the LED driver power-supply through-pass wiring path 176 is connected. , A signal terminal 91 to which a signal through-pass wiring path 177 is connected, a clock terminal 92 to which a clock through-path wiring path 178 is connected, and a ground through-path wiring path 179 are connected. For example, three ground terminals 93a to 93c, a blast power supply terminal 190a to which the blast power supply wiring path 189a is connected, and a blast ground terminal 190b to which the blast ground wiring path 189b is connected are provided. The terminals are arranged in a line, for example. Each one on both ends in the terminal arrangement direction serves as a blower power supply terminal 190a and a blower ground terminal 190b. Regarding the eight terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the upstream connector 173, for example, the LED power supply terminals 89a and 89b, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, the signal terminal 91, and the clock. The terminal 92 and the ground terminal 93c are arranged in that order.

  The downstream side connector 174 has, for example, one LED power supply terminal 89 to which a through path wiring line 175 for LED power supply is connected, and one LED driver power supply terminal 90 to which a through path wiring line 176 for LED driver power supply is connected. , For example, one signal terminal 91 to which the signal through-pass wiring path 177 is connected, one clock terminal 92 to which the clock through-path wiring path 178 is connected, and the ground through-path wiring path 179 are connected. For example, two ground terminals 93a and 93b and, for example, two sets and six LED drive wiring paths 187a to 187c and 188a to 188c are connected, for example, two sets and six LED connection terminals 191a to 191c and 192a to 192c, and air blowing. The blower power supply terminal 190a to which the power supply wiring path 189a is connected, And a blower ground terminal 190b of the ground wiring path 189b is connected, they are arranged in their total of 14 amino terminal, for example, seven by two columns. Then, for example, two terminals on the one end side in the terminal array direction of the two rows are a blower power supply terminal 190a and a blower ground terminal 190b.

  As described above, in the fourth LED substrate 44, the number of terminals corresponding to the power supply system wiring paths in the upstream connector 173, that is, the through paths wiring paths 175, 176, and 179 for LED power supply, LED driver power supply, and ground (here, in total) 6) is larger than the number of terminals (here, 4 in total) corresponding to the same wiring paths 175, 176, 179 in the downstream side connector 174. Regarding the twelve terminals other than the blower power supply terminal 190a and the blower ground terminal 190b in the downstream side connector 174, for example, the LED power supply terminal 89, the ground terminal 93a, the LED driver power supply terminal 90, the ground terminal 93b, and the signal terminal are arranged in one row. 91 and a clock terminal 92 are arranged in that order, and two sets of six LED connection terminals 191a to 191c and 192a to 192c are arranged in the other column.

  FIG. 12 shows a specific wiring pattern of the fourth LED substrate 44 for each wiring layer. In the fourth LED board 44, LEDs 183 to 186 are provided on the front wiring layer 171a (FIG. 12A) on the front side, and upstream connectors 173 and downstream connectors 174 are provided on the rear wiring layer 171b (FIG. 12B) on the back surface. , LED driver 180, protection resistors 181, 182, etc. are arranged respectively.

  The upstream connector 173 is arranged, for example, on the lower end side of the back wiring layer 171b so that the terminal arrangement is in the horizontal direction, and the downstream connector 174 is arranged, for example, on the upper end side of the back wiring layer 171b so that the terminal arrangement is in the vertical direction. Has been done.

  Each terminal of the connectors 173 and 174 has, for example, a rectangular shape, and is formed in an elongated shape orthogonal to the arrangement direction. The blower power supply terminal 190a and the blower ground terminal 190b on both ends of the upstream connector 173 are connected to the blower power supply wiring path 189a and the blower ground wiring path 189b from the outside in the terminal arrangement direction (here, the left-right direction). Similarly, the blower power supply terminal 190a and the blower ground terminal 190b, for example, on the lower end side of the downstream connector 174 are provided with the blower power supply wiring path 189a and the blower ground wiring path 189b outside in the terminal arrangement direction (here, the vertical direction). Is connected from. In this way, the wiring path 189a for the blast power supply and the wiring path 189b for the blast ground are arranged from the outer side in the terminal arrangement direction with respect to the outermost terminals 190a, 190b of the plurality of terminals of the connectors 173, 174 in the arrangement direction. Since they are connected, it is easy to avoid interference with other wiring paths even though the wiring path 189a for blast power supply and the wiring path 189b for blast ground are formed wide. Further, since the blast power supply terminal 190a and the blast ground terminal 190b are formed in an elongated shape in a direction orthogonal to the terminal arrangement direction, the blast power supply wiring path 189a and the blast ground wiring path 189b are connected to the blast power supply terminal 190a, By connecting to the long side of the blast ground terminal 190b, it is possible to secure a larger cross-sectional area of the connection portion.

  In the fourth LED substrate 44, in addition to the wiring path 189 a for the blast power supply and the wiring path 189 b for the blast ground, the through-path wiring paths 175 to 178 for the LED power supply, the LED driver power supply, the signal and the clock are provided via the via 96. Except for some bypasses that are avoided on the front wiring layer 171a side, almost all of them are provided on the back wiring layer 171b side. That is, the air supply path wiring line 189a and the air supply ground wiring path 189b are arranged along the left edge portion 172a of the substrate body 172 on the back surface wiring layer 171b, and are used for LED power supply, LED driver power supply, signal, and The through-path wiring paths 175 to 178 for clocks are also arranged on the rear surface wiring layer 171b along the right edge portion 172b of the substrate body 172.

  The LED driver power supply wiring path 193 branched from the LED driver power supply through path wiring path 176 is connected to the power supply terminal of the LED driver 180, and the signal wiring path 194 branched from the signal through path wiring path 177 is connected to the LED driver. A clock wiring path 195 connected to the signal terminal of 180 and branched from the through path wiring path 178 for clock is connected to the clock terminal of the LED driver 180.

  Here, the LED driver 180 and the protection resistors 181 and 182 corresponding to the LED driver 180 are sandwiched by, for example, the blower power supply wiring path 189a, the blower ground wiring path 189b, and the through-path wiring paths 175 to 178, so that the back wiring layer 171b is formed. It is arranged in the approximate center of.

  Further, one or more solid ground patterns 196 are provided on the back wiring layer 171b. The solid ground pattern 196 constitutes a through path wiring line for ground (ground wiring path) 179 together with the solid ground pattern 197 on the front surface wiring layer 171a side, and for example, the upstream side via the via 96, the solid ground pattern 197, etc. It is connected to the ground terminals 93 a to 93 c of the connector 173, the ground terminals 93 a and 93 b of the downstream connector 174, and the ground terminal of the LED driver 180.

  The solid ground pattern 196 of the back surface wiring layer 171b is partially (or entirely) arranged between the LED driver 180 and the substrate body 172, and a wiring path group including a through path wiring path 178 for clock around the same. That is, it is surrounded by wiring paths such as the ventilation power supply wiring path 189a, the ventilation ground wiring path 189b, and the through path wiring paths 175 to 178. The solid ground pattern 196 is electrically connected to the ground terminals 93a to 93c of the upstream connector 173 and the ground terminals 93a and 93b of the downstream connector 174 via the via 96, the solid ground pattern 197, and the like. Further, among the vias 96 that connect the solid ground pattern 196 and the solid ground pattern (ground wiring path, second conductor pattern) 197 on the front wiring layer 171a side, the vias 96 arranged in the arrangement region of the LED driver 180. However, for example, they are intensively arranged in the central region in the arrangement region of the LED driver 180. As a result, the LED driver 180 can be effectively radiated through the solid ground pattern 196 and the via 96, and the adverse effect of noise picked up by the solid ground pattern 196 can be eliminated as much as possible.

  The LEDs 183 to 186 driven by the LED driver 180 are arranged in a row at substantially constant intervals in the longitudinal direction (vertical direction) of the front wiring layer 171a, for example. The upper LEDs 183 and 184 and the lower LEDs 185 and 186 are connected by an inter-LED wiring path 198, respectively. The LEDs 183 to 186 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center.

  The anode electrodes of the LEDs 183 and 186 are connected to the LED power supply through-path wiring path 175 via the LED power supply wiring path 200 extending over the back wiring layer 171b side via the via 96, and the cathodes of the LEDs 184 and 185 are connected. The electrodes are connected to the protection resistors 181 and 182 via the cathode-side wiring path 201 that extends across the rear wiring layer 171b side with the via 96 interposed therebetween. The LED power supply wiring path 200 and the cathode side wiring path 201 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like.

  Further, for example, two sets of six LED drive wiring paths 187a to 187c and 188a to 188c are arranged in the front wiring layer (second wiring layer) 171a. The LED drive wiring paths 187a to 187c and 188a to 188c are connected at their upstream ends to the RGB terminals 180a to 180f of the LED driver 180 on the back wiring layer 171b side via vias (interlayer conductive portions) 96a to 96f, respectively (FIG. 13 (b2)), the downstream end side is connected to the LED connection terminals 191a to 191c, 192a to 192c of the downstream side connector 174 on the back side wiring layer (first wiring layer) 171b side through vias (interlayer conduction portions) 96g to 96l, respectively. (FIG. 13 (a2)).

  The LED drive wiring paths 187a to 187c and 188a to 188c are, for example, in the terminal arrangement direction (here, the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the downstream connector 174, as shown in FIG. 13 (a2). The vias (interlayer conductive portions) 96g to 96l are drawn out in parallel to a direction orthogonal to each other (here, laterally) and connected to the vias 96g to 96l, respectively. ) Are arranged in a line, for example, so as to be inclined.

  Here, the diameter of the vias 96g to 96l is larger than the pitch of the LED drive wiring paths 187a to 187c, 188a to 188c (here, the same as the pitch of the LED connection terminals 191a to 191c, 192a to 192c) near the downstream connector 174. By arranging the vias 96g to 96l obliquely with respect to the terminal arrangement direction of the downstream side connector 174 in this manner, it is possible to arrange the vias 96g to 96l with high space efficiency while avoiding mutual interference. .

  On the front wiring layer 171a side, as shown in FIG. 13 (a1), among the LED driving wiring paths 187a to 187c and 188a to 188c, the LED driving wirings except the LED driving wiring path (specific wiring path) 188c on one end side are provided. The paths (predetermined wiring paths) 187a to 187c, 188a, and 188b are drawn out from the vias 96g to 96k, for example, obliquely downward (first direction) and substantially parallel to each other, and further downward, for example, via the bending portions 271a to 271e ( They are arranged substantially parallel to each other in the second direction). Further, the LED drive wiring path (specific wiring path) 188c on the one end side is drawn out, for example, downward (second direction) from the via 96l. The refraction portions 271a to 271e are arranged in a substantially straight line, and vias 96l corresponding to the LED drive wiring path (specific wiring path) 188c are arranged on the straight line.

  Here, both the first direction (diagonally downward) and the second direction (downward) are the directions in which the LED drive wiring paths 187a to 187c and 188a to 188c on the rear wiring layer 171b side are pulled out from the downstream connector 174 (sideways). However, one of the first direction and the second direction may be the same as the pull-out direction.

  Further, the LED drive wiring paths 187a to 187c and 188a to 188c are parallel to a direction orthogonal to, for example, the terminal arrangement direction (here, the left-right direction) from the RGB terminals 180a to 180f of the LED driver 180, as shown in FIG. 13 (b2). Are connected to the vias 96a to 96f, respectively, and these vias (interlayer conductive portions) 96a to 96f are in a zigzag shape along the terminal arrangement direction of the RGB terminals 180a to 180f in the LED driver 180 (here, the left and right direction). Are arranged in. The vias 96a and 96b, the vias 96c and 96d, and the vias 96e and 96f are examples of the first inclined array portion in the first oblique direction (for example, rising to the right in FIG. 13B2), and the vias 96b and The via 96c, the via 96d, and the via 96e are each an example of a second inclined array portion in the second oblique direction (for example, rightward downward in FIG. 13B2).

  Here, the diameter of the vias 96a to 96f is larger than the pitch of the LED drive wiring paths 187a to 187c and 188a to 188c near the RGB terminals 180a to 180f of the LED driver 180 (here, the same as the pitch of the RGB terminals 180a to 180f). By arranging the RGB terminals 180a to 180f in a zigzag shape along the terminal arrangement direction in this manner, the vias 96a to 96f can be arranged with high space efficiency while avoiding mutual interference. There is.

  On the front wiring layer 171a side, as shown in FIG. 13 (b1), the LED drive wiring paths 187a to 187c and 188a to 188c are drawn out from the vias 96a to 96f, for example, in an upward direction (first direction) substantially in parallel with each other. Further, they are arranged substantially parallel to each other, for example, obliquely upward (second direction) via the refraction portions 272a to 271f. The refraction parts 272a to 272f are arranged in a substantially linear shape. The first direction is the same as the direction in which the LED drive wiring paths 187a to 187c and 188a to 188c on the rear wiring layer 171b side are pulled out from the LED driver 180, and the second direction is different from the same. The first direction and the second direction may be different from the same drawing direction.

  The inter-LED wiring path 198, the LED power supply wiring path 200, and the cathode side wiring path 201 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fourth LED substrate 44, the wiring path 189a for the blast power supply and the wiring path 189b for the blast ground are through-path wiring paths 177 and 178 for signals and clocks for driving the LEDs 183 to 186, a signal wiring path 194, and a clock. It is formed wider than the digital signal wiring path such as the wiring path 195.

[Fifth LED substrate 45]
As shown in FIG. 3, the fifth LED substrate 45 includes a substrate body 212 having wiring layers on both front and rear sides, for example, a vertically long rectangular shape. As shown in FIG. 11, the board main body 212 has an upstream connector (board connecting connector) 213, a downstream connector (board connecting connector) 214, and an LED power supply for connecting the connectors 213 and 214. Protection connected in series between the LED driver power supply, signal, clock, and ground through path wiring lines (predetermined wiring path) 215 to 219, and the LED power supply through path wiring path 215 and the upstream connector 213. The resistors 220 and 221, the LEDs 223 to 226, and a blower connector (connector for producing means) 227 are provided.

  The upstream connector 213 is connected to the downstream connector 174 on the fourth LED board 44 side by the harness 66 and has the same terminal configuration as the downstream connector 174. One of the downstream side connectors 214 has a terminal configuration different from that of the upstream side connector 213. For example, one LED power source terminal 89 to which the through path wiring line 215 for the LED power source is connected and the through path wiring line for the LED driver power source. For example, one LED driver power supply terminal 90 to which 216 is connected, one signal terminal 91 to which a signal through path wiring line 217 is connected, and one clock terminal to which a clock through path wiring line 218 is connected. 92 and, for example, two ground terminals 93a and 93b to which the through path wiring line 219 for ground is connected, and these six terminals in total are arranged in one row, for example. For the six terminals of the downstream connector 214, for example, an LED power supply terminal 89, a ground terminal 93a, an LED driver power supply terminal 90, a ground terminal 93b, a signal terminal 91, and a clock terminal 92 are arranged in that order.

  The blower connector 227 is connected to the blower means 37a of the blower producing means 37 by the harness 68, and is provided with a blower power supply terminal 229a and a blower ground terminal 229b. The blower power supply terminal 229a of the blower connector 227 is connected to the blower power supply terminal 190a of the upstream side connector 213 via the blower power supply wiring path 228a, and the blower ground terminal 229b is connected to the upstream side via the blower ground wiring path 228b. It is connected to the blast ground terminal 190b of the connector 213.

  FIG. 14 shows a specific wiring pattern of the fifth LED substrate 45 for each wiring layer. In the fifth LED substrate 45, the LEDs 223 to 226 and the protection resistors 220 and 221 are provided on the front wiring layer 211a (FIG. 14A) on the front side, and the upstream wiring connector 211b (FIG. 14B) is provided on the rear wiring layer 211b on the rear side. 213, a downstream side connector 214, a blower connector 227, etc. are arranged respectively.

  The upstream connector 213 is arranged, for example, on the lower end side of the back wiring layer 211b so that the terminal arrangement is in the vertical direction, and the downstream connector 214 is, for example, arranged on the upper end portion side of the back wiring layer 211b in the vertical direction. The blower connector 227 is arranged on one side of the upper end portion of the back surface wiring layer 211b so that the terminal arrangement is in the vertical direction.

  Each terminal of the connectors 213, 214, 227 is, for example, rectangular, and is formed in an elongated shape orthogonal to the arrangement direction. The blower power supply terminal 190a and the blower ground terminal 190b, for example, on the lower end side of the upstream connector 213 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). The blower power supply terminal 229a and the blower ground terminal 229b of the blower connector 227 are connected to the blower power supply wiring path 228a and the blower ground wiring path 228b from the outside in the terminal arrangement direction (here, the vertical direction). .

  In the fifth LED substrate 45, for example, the wiring path 228a for the blast power supply, the wiring path 228b for the blast ground, and the through-path wiring path 215 for the LED power supply are, for example, substantially the entire rear surface wiring layer 211b different from the LEDs 223 to 226. Although provided on the side, the LED driver power supply, signal, and clock through-path wiring paths 216 to 218, for example, except for a predetermined range in the vicinity of both ends thereof, that is, in the vicinity of the connection portion to each connector 213, 214. Almost all of the LEDs are provided on the same front wiring layer 211a side as the LEDs 223 to 226.

  That is, the blast power supply wiring path 228a is arranged on the back wiring layer 211b along the right edge portion 212b of the substrate body 212, and the blast ground wiring path 228b is on the back wiring layer 211b and the left edge portion 212a of the substrate body 212. Are arranged along. Further, the LED power supply through-path wiring path 215 is arranged on the back surface wiring layer 211b, for example, along the blower power supply wiring path 228a. The LED power supply wiring paths 231 and 232 branched from the LED power supply through path wiring path 215 are connected to the anode electrodes of the LEDs 223 and 225, for example, via the vias 96.

  Further, the LED driver power supply, signal, and clock through-path wiring paths 216 to 218 are vertically arranged, for example, on the right edge portion 212b side of the front surface wiring layer 211a, and their upstream end sides are rear wirings via the vias 96, respectively. The LED driver power supply terminal 90, the signal terminal 91, and the clock terminal 92 of the upstream connector 213 are respectively connected on the layer 211b side, and the downstream end side is respectively passed through the via 96, and the LED driver power supply terminal of the downstream connector 214 is connected on the rear wiring layer 211b side. 90, a signal terminal 91, and a clock terminal 92, respectively.

  One or more solid ground patterns 233 are provided on the front wiring layer 211a. The solid ground pattern 233 constitutes a through path wiring path for ground (ground wiring path) 219 together with the solid ground pattern 234 on the back wiring layer 211b side, and for example, the connector 213 via the via 96, the solid ground pattern 234, and the like. , 214 ground terminals 93a, 93b.

  The LEDs 223 to 226 are arranged, for example, in a row at substantially constant intervals in the longitudinal direction (vertical direction) of the front wiring layer 211a. The LEDs 223 and 224 on the upper side and the protection resistors 220 arranged on the lower side and the like are connected in series by an inter-LED wiring line 235 and a cathode side wiring line 236, and are arranged on the lower LEDs 225 and 226 and the lower side and the like. The protection resistor 221 is connected in series by the inter-LED wiring path 237 and the cathode side wiring path 238. As shown in FIGS. 14 and 15, the protection resistor 220 extends from the front wiring layer (second wiring layer) 211a to the rear wiring layer (first wiring layer) 211b with the vias 96m to 96o interposed therebetween. The LED drive wiring paths 239a to 239c are connected to the LED connection terminals 191a to 191c of the upstream side connector 213, and the protection resistor 221 includes the rear wiring layer (the second wiring layer) 211a sandwiching the vias 96p to 96r. The first drive layer) 211b is connected to the LED connection terminals 192a to 192c of the upstream connector 213 by the LED drive wiring paths 240a to 240c.

  The LED drive wiring paths 239a to 239c and 240a to 240c are, for example, in the terminal arrangement direction (here, the vertical direction) from the LED connection terminals 191a to 191c and 192a to 192c of the upstream connector 213, as shown in FIG. 15B. The vias 96m to 96r are drawn out in parallel to the orthogonal direction and connected to vias (interlayer conductive portions) 96m to 96r, respectively, and these vias 96m to 96r constitute the first via group (interlayer conductive portion group) vias 96m to 96o. And the vias 96p to 96r forming the second via group (interlayer conductive portion group) are substantially parallel to each other and oblique to the terminal arrangement direction (here, the vertical direction) of the upstream connector 213. Are arranged in two columns.

  Here, the diameter of the vias 96m to 96r is larger than the pitch of the LED drive wiring paths 239a to 239c and 240a to 240c (here, the same as the pitch of the LED connection terminals 191a to 191c and 192a to 192c) in the vicinity of the upstream connector 213. By arranging the plurality of via groups obliquely with respect to the terminal arrangement direction of the upstream connector 213 and substantially parallel to each other in this way, the vias 96m to 96r are prevented from interfering with each other and high space efficiency is achieved. It is possible to place in.

  Further, on the side of the front wiring layer 211a, as shown in FIG. 15A, the LED drive wiring paths 239a to 239c are drawn out, for example, upward from the vias 96m to 96o substantially parallel to each other, and the LED drive wiring paths 240a to 240c. Are drawn out, for example, downward from the vias 96p to 96r substantially parallel to each other. In this way, the first via group and the second via group are different in the lead-out direction of the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side.

  The LED power supply wiring paths 231 and 232, the LED wiring paths 235 and 237, and the cathode side wiring paths 236 and 238 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like. Further, in the fifth LED board 45, the wiring path 228a for the blast power supply and the wiring path 228b for the blast ground are wider than the digital signal wiring paths such as the through-path wiring paths 217 and 218 for signals for driving the LEDs and the clock. Is formed in.

[Sixth LED board 46]
As shown in FIG. 3, the sixth LED substrate 46 includes, for example, a substantially donut-shaped substrate body 242 having wiring layers on both front and rear surfaces. As shown in FIG. 11, the board main body 242 is provided with an upstream connector 243, an LED driver 244, LEDs 245-248, protection resistors 249, 250, and the like. The upstream connector 243 is connected to the downstream connector 214 on the fifth LED board 45 side by the harness 67, and has the same terminal configuration as that of the downstream connector 214.

  FIG. 16 shows a specific wiring pattern of the sixth LED substrate 46 for each wiring layer. In the sixth LED substrate 46, LEDs 245 to 248 are provided on the front wiring layer 241a (FIG. 16A) on the front side, and upstream connectors 243, LED drivers 244 are provided on the rear wiring layer 241b (FIG. 16B) on the rear surface. Protective resistors 249 and 250 are arranged respectively.

  The upstream connector 243 is arranged, for example, on the lower side of the back surface wiring layer 241b so that the terminal arrangement is substantially in the circumferential direction of the substrate body 242. Further, the LED driver 244 is arranged at a position apart from the upstream connector 243 in the back wiring layer 241b, and, for example, protection resistors 249 and 250 connected to RGB terminals of the LED driver 244 are arranged on both sides thereof. The LED driver power supply terminal 90, the signal terminal 91, the clock terminal 92, and the LED driver 244 of the upstream connector 243 are connected to each other by the LED driver power supply, signal, and clock wiring paths 251 to 253. The LED driver power supply, signal, and clock wiring paths 251 to 253 are, for example, substantially entirely provided on the back wiring layer 241b side.

  The LEDs 245 to 248 are arranged, for example, at substantially constant intervals in the circumferential direction of the front wiring layer 241a, and, for example, the LEDs 245 and 246 and the LEDs 247 and 248 are connected by the inter-LED wiring path 254, respectively. The LEDs 245 to 248 are full-color light-emitting types that incorporate red, green, and blue LED elements. For example, both the anode side and the cathode side have R electrodes corresponding to red, G electrodes corresponding to green, and blue. The corresponding B electrode is provided side by side, for example, with the R electrode at the center. Further, the anode electrodes of the LEDs 246 and 247 are connected to the LED power supply terminal 89 of the upstream connector 243 through the LED power supply wiring path 255 that extends to the rear wiring layer 241b side via the via 96, and are connected to the LEDs 245 and 248. The cathode electrode is connected to the protective resistors 249 and 250 via a cathode side wiring path 256 that extends across the back wiring layer 241b side with the via 96 interposed therebetween. It should be noted that the inter-LED wiring path 254, the LED power supply wiring path 255, and the cathode side wiring path 256 are provided with heat radiating portions 105a and 105b similar to those of the first LED substrate 41 and the like.

  For example, a solid ground pattern 257 is provided on the front wiring layer 241a. This solid ground pattern 257 constitutes a ground wiring path 259 together with the solid ground pattern 258 and the like on the back wiring layer 241b side. For example, the ground terminal 93a of the upstream connector 243, the via 96, the solid ground pattern 258 and the like, 93b and the ground terminal of the LED driver 244.

  A part of the solid ground pattern (first conductor pattern) 258 is arranged between the LED driver 244 and the substrate body 242. Further, of the vias 96 connecting the solid ground pattern 258 and the solid ground pattern (ground wiring path, second conductor pattern) 257 on the front wiring layer 241a side, the vias arranged in the arrangement region of the LED driver 244. 96 is arranged in the vicinity of one edge of the LED driver 244, for example, in accordance with the arrangement of the solid ground pattern 257 on the front wiring layer 241a side.

  In the right wiring path 58 described above, among the plurality of terminals of the connector for connecting the LED boards, the number of terminals corresponding to the through path wiring path of the power supply system is larger in the connector on the upstream side than the connector on the downstream side. There are more people. For example, while the total number of the LED power supply terminals 89a and 89b and the LED driver power supply terminal 90 in the connector 173 for connecting the front door relay board 56 and the fourth LED board 44 is three, the fourth and fifth LEDs are provided. The total number of LED power supply terminals 89 and LED driver power supply terminals 90 in the connectors 174 and 213 for connecting the boards 44 and 45 is two.

  Thus, it is possible to improve the space efficiency of wiring because it is not necessary to use an unnecessarily large connector in the LED board on the downstream side while ensuring the required voltage for each LED board.

  FIG. 17 illustrates a second embodiment of the present invention. A part of the first embodiment is modified so that a conductor portion is provided on the back surface of the LED driver and the conductor portion and the solid ground pattern are connected by solder. An example is shown.

  Explaining the LED driver 120 of the second LED substrate 42 (see FIG. 8) as an example, the LED driver (heat-generating component) 120 of the present embodiment includes a copper foil and other conductor portions 261 on its back surface. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Of course, the shape of the conductor portion 261 is arbitrary, and the conductor portion 261 may be provided on substantially the entire back surface of the LED driver 120.

  Further, at the position where the LED driver 120 is arranged on the back wiring layer 111b of the second LED substrate 42, the conductor exposed portion 262, which is a portion of the solid ground pattern 134 exposed from the insulating film 106, is provided, for example, on the LED driver 120 side. It is provided corresponding to H.261. In the area where the LED drivers 120 are arranged in the solid ground pattern 134, the vias 96 are centrally arranged in the central area, but in the present embodiment, conductors are exposed so as to include the areas where the vias 96 are arranged. A section 262 is provided.

  The conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the rear wiring layer 111b side that face each other are connected by, for example, solder (conduction connecting means) 263. As a result, heat conduction from the LED driver 120 to the solid ground pattern 134 is promoted as compared with the first embodiment, so that the heat generated in the LED driver 120 can be radiated more efficiently.

  In addition to the other LED driver 121 of the second LED board 42, the same configuration can be adopted for the LED drivers arranged on the other LED boards 41, 43 and the like.

  FIG. 18 exemplifies the third embodiment of the present invention, and a part of the second embodiment is modified so that a plurality of vias (interlayer conduction portions) provided in the arrangement region of the LED driver are connected to the LED driver. An example is shown in which not the central area in the arrangement area but the peripheral area in the arrangement area is arranged.

  In the second LED substrate 42 of the second embodiment, as shown in FIG. 17, a part of the solid ground pattern 134 is arranged between the LED driver 120 and the substrate body 112, and the solid ground pattern 134 and the front wiring layer. The vias 96 that connect to the solid ground pattern 135 on the 111a side are arranged centrally in the central region within the arrangement region of the LED driver 120. However, in the present embodiment, as shown in FIG. 96 are not arranged in the central area in the arrangement area of the LED driver 120, but are arranged substantially evenly in the peripheral area outside the central area in the arrangement area.

  Further, the LED driver 120 of the present embodiment has a conductor portion 261 such as copper foil on the back surface thereof, as in the second embodiment. The conductor portion 261 is formed in, for example, a rectangular shape corresponding to the center of the back surface of the LED driver 120. Further, at the position where the LED driver 120 is arranged on the back wiring layer 111b of the second LED substrate 42, the conductor exposed portion 262, which is a portion of the solid ground pattern 134 exposed from the insulating film 106, is provided, for example, on the LED driver 120 side. It is provided corresponding to H.261. In addition, the conductor exposed portion 262 of the present embodiment is provided in a range that does not reach the via 96 provided in the peripheral region in the arrangement region of the LED driver 120.

  The conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the rear wiring layer 111b side that face each other are connected by, for example, solder (conduction connecting means) 263. In this way, when a plurality of vias (interlayer conductive portions) 96 provided in the arrangement area of the LED driver 120 are arranged in the peripheral area in the arrangement area of the LED driver, as in the second embodiment. Although the heat radiation effect may be inferior to the case of arranging in the central region, it is considered to be more excellent in terms of eliminating the adverse effect on the LED driver 120 due to the noise picked up by the solid ground pattern 134.

  In addition, since the via 96 is not formed in the connection area formed by the solder 263, the LED driver 120 is more firmly fixed than when the via 96 is formed in the connection area formed by the solder 263 as in the second embodiment. it can. In that sense, this embodiment is more effective in the case of a large heat generating component.

  The vias 96 may be arranged not only in the peripheral region in the arrangement region of the LED drivers 120 but also in the central region inside thereof, and the peripheral region may have a higher arrangement density of the vias 96 than in the central region. . In this case, for example, a part of the vias 96 may be formed in the connection area of the solder (conductive connection means) 263. Further, in the present embodiment, an example is shown in which the conductor portion 261 on the LED driver 120 side and the conductor exposed portion 262 on the back wiring layer 111b side are connected by solder (conduction connecting means) 263, but as in the first embodiment. It is not necessary to perform the connection by the conductive connection means.

  FIG. 19 illustrates a fourth embodiment of the present invention, in which the first embodiment is partially modified so that the substrate body of the LED substrate includes one or more intermediate layers in addition to the front and rear surface layers. In this example, the wiring layer of (1) is provided, and the drive wiring path and the ground wiring path of the speaker (predetermined rendering means) are provided in the intermediate layer.

  FIG. 19 shows a specific wiring pattern of the third LED substrate 43 of this embodiment for each wiring layer. The third LED substrate 43 of the present embodiment includes, for example, one intermediate layer 141c in addition to the front wiring layer 141a on the front side and the rear wiring layer 141b on the back side.

  Similar to the front surface wiring layer 141a of the first embodiment, the front surface wiring layer 141a includes LEDs 147 to 150 and an LED power supply wiring path 162, an inter-LED wiring path 161, a cathode side wiring path 163, and a solid ground pattern. Although 159 and the like are arranged, the speaker drive wiring paths 154a to 154d are not provided. Similar to the second embodiment, the rear surface wiring layer 141b has upstream wiring 143, speaker connectors 144 and 145, LED driver 146, protection resistors 151 and 152, LED driver power supply, signal wiring, and clock wiring. The paths 155 to 157 and the solid ground pattern 158 are arranged respectively.

  Further, the intermediate layer 141c is provided with speaker drive wiring paths 154a to 154d and a solid ground pattern 264. The speaker drive wiring paths 154a and 154b have one end side thereof on the rear surface wiring layer 141b side via the via 96 or the like, to the speaker terminals 94a, 94b of the upstream connector 143, and the other end side on the rear surface wiring layer 141b via the via 96 or the like. On the side, speaker terminals 153a and 153b of the speaker connector 144 are respectively connected. Further, the speaker drive wiring paths 154c and 154d have one end side thereof connected to the rear wiring layer 141b side through the via 96 or the like to the speaker terminals 94c and 94d of the upstream connector 143, and the other end side thereof connected via the rear surface via the via 96 or the like. On the layer 141b side, the speaker terminals 153c and 153d of the speaker connector 145 are respectively connected.

  Further, the solid ground pattern 264 of the intermediate layer 141c constitutes the ground wiring path 160 together with the solid ground pattern 159 on the front wiring layer 141a side, the solid ground pattern 158 on the rear wiring layer 141b side, for example, via 96, solid wiring. It is connected to the ground terminals 93a, 93b, etc. of the upstream connector 143 via the ground patterns 158, 159, etc.

  As described above, the drive wiring path and the ground wiring path of the speaker (predetermined rendering means) are provided in the intermediate layer instead of the surface layer on which the LED driver 146 and other wiring paths are arranged, and the drive wiring provided in the intermediate layer. By sandwiching the road with solid ground patterns provided on the surface layers on both sides of the road, the adverse effect of noise can be eliminated as much as possible. Further, by providing the drive wiring path formed to be wider than the LED wiring path in the intermediate layer, the space of the surface layer can be more effectively utilized, and the substrate can be downsized. When two or more intermediate layers are provided, for example, a drive wiring path is provided on any one of the intermediate layers, and a solid ground pattern is provided on the layers on both sides of the intermediate layer (both the intermediate layer or the intermediate layer and one surface layer). It is desirable to provide it.

  FIGS. 20 and 21 illustrate a fifth embodiment of the present invention, which is a partial modification of the first embodiment and includes red LED elements among red, green, and blue LED elements connected in parallel. An example in which a protective resistor is connected only to is shown.

  FIG. 20 shows a specific wiring pattern for each wiring layer of the first LED substrate 41 of this embodiment. The wiring pattern of the first LED substrate 41 of the present embodiment is different from that of the first embodiment (FIG. 5) in that the LEDs 84, 85 and the LEDs 86, 87 are protected only in the R wiring path corresponding to the red LED element. The only difference is that the resistors 82 and 83 are arranged and no protective resistance is arranged in the G wiring path and the B wiring path corresponding to the green LED element and the blue LED element.

  In the LEDs 84, 85 and the LEDs 86, 87, the operating voltage of the green LED elements 84G, 85G, 86G, 87G and the blue LED elements 84B, 85B, 86B, 87B shown in FIG. The operating voltage of the elements 84R, 85R, 86R, 87R is lower than that. Further, as shown in FIG. 21, the protection resistor 82 arranged in the R wiring path has a voltage (total value of operating voltage) VFR across the red LED elements 84R and 85R of the LEDs 84 and 85 and a voltage Vr across the protection resistor 82. The resistance value is set so that the sum of and becomes substantially equal to the voltages (total value of operating voltages) VFG and VFB of the green LED elements 84G and 85G and the blue LED elements 84B and 85B, respectively. The voltages (total value of operating voltages) VFG and VFB of the green LED elements 84G and 85G and the blue LED elements 84B and 85B are set to the power supply voltage V or less. A resistance value is similarly set for the protection resistor 83.

  As described above, the protection resistor is connected in series only to the red LED element among the red, green, and blue LED elements connected in parallel, and the voltage across the red LED element and the voltage across the protection resistor are summed. Is substantially equal to the voltage across each of the green LED element and the blue LED element, it is not necessary to connect a protection resistor to each of the green and blue LED elements, so the number of protection resistors can be reduced.

  FIG. 22 illustrates a sixth embodiment of the present invention, which is a partial modification of the first embodiment, in which G, R, and B connected to the three electrodes of G, R, and B provided in the LED are connected. An example in which a heat dissipation portion is provided in all of the three wiring paths B is shown.

  As shown in FIG. 22A, for example, in the inter-LED wiring path 95 of the first LED substrate 41 (FIG. 5 and the like), the G wiring path 95G and the B wiring path 95B are respectively the cathode side G electrode KG of the LED 84, The B electrode KB is connected from the outside in the electrode arrangement direction, and in the vicinity of the connection portion, heat radiation portions 105a, 105a having a width wider than other portions of the wiring paths are provided. Further, the heat dissipation portions 105a and 105a are respectively provided with recesses 265 from the inside (R wiring path 95R side) in the electrode arrangement direction toward the outside.

  Further, in the R wiring path 95R of the inter-LED wiring path 95, at the connecting portion with the R electrode KR on the cathode side of the LED 84, the width is widened on both sides in the electrode arrangement direction, and the widened end sides are the heat radiation portions 105a and 105a. A heat dissipation portion 105c inserted in the recess 265 is provided.

  As described above, by disposing the heat dissipation portion in all of the three wiring paths of G, R, and B connected to the three electrodes of G, R, and B provided in the LED, heat generated in the LED is prevented. The heat can be dissipated more efficiently.

  As shown in FIG. 22B, the recesses 265 are not provided in the heat dissipation portions 105a and 105a of the G wiring path 95G and the B wiring path 95B, and the heat dissipation portion 105c of the R wiring path 95R is replaced with the heat dissipation portions 105a and 105a. It may be formed with a width that does not interfere.

  FIG. 23 illustrates the seventh embodiment of the present invention, showing an example in which the arrangement of the LED drive wiring paths 187a to 187c and 188a to 188c in the first embodiment (FIG. 13 and the like) is partially changed. There is.

  In the present embodiment, as shown in FIG. 23A, the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side are, for example, diagonally downward (first direction) from the vias 96g to 96l. They are drawn out substantially in parallel, and are further arranged substantially parallel to each other, for example, in the downward direction (second direction) via the refraction portions 271a to 271f. The refraction portions 271a to 271f are arranged in a substantially linear shape. In this way, the LED drive wiring paths 187a to 187c and 188a to 188c, including the LED drive wiring path (specific wiring path) 188c on one end side, may be configured to be pulled out from the vias 96g to 96l in the first direction. Good.

  Further, in the present embodiment, as shown in FIG. 23B, among the LED drive wiring paths 187a to 187c and 188a to 188c on the front wiring layer 171a side, the LED drive wiring path (specific wiring path) 187a on one end side is Except for the LED drive wiring paths (predetermined wiring paths) 187b, 187c, 188a to 188c, the LED driving wiring paths 187b, 187c and 188a to 188c are drawn out from the vias 96b to 96f, for example, in an upward direction (first direction) substantially parallel to each other, and further via the bending portions 272b to 272f. For example, they are arranged obliquely upward (second direction) and substantially parallel to each other. Further, the LED drive wiring path (specific wiring path) 187a on one end side is led out, for example, obliquely upward (second direction) from the via 96a. The refraction portions 272b to 272f are arranged in a substantially linear shape, and the via 96a corresponding to the LED drive wiring path (specific wiring path) 187a is arranged on the straight line. As described above, even when the plurality of vias (interlayer conductive portions) 96a to 96f are arranged in a zigzag pattern along the arrangement direction of the plurality of terminals, a predetermined wiring path other than one end side of the plurality of wiring paths is predetermined. The wiring paths are drawn out from the vias substantially in parallel to each other in the first direction, and the wiring paths are arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring paths are arranged so as to be drawn out from the vias in the second direction. Good.

  24 and 25 illustrate the eighth and ninth embodiments of the present invention, respectively, and show an arrangement mode (FIG. 15 and the like) of the LED drive wiring paths 239a to 239c and 240a to 240c in the first embodiment. An example in which a part is changed is shown.

  In the eighth embodiment, as shown in FIG. 24, among the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side, LEDs excluding the LED drive wiring path (specific wiring path) 239a on one end side are used. The drive wiring paths (predetermined wiring paths) 239b, 239c, and 240a to 240c are drawn out from the vias 96n to 96r, for example, in the lateral direction (first direction) substantially parallel to each other, and further upward, for example, via the bending portions 273b to 273f. They are arranged substantially parallel to each other in the (second direction). Further, the LED drive wiring path (specific wiring path) 239a on the one end side is drawn out, for example, upward (second direction) from the via 96m. The refraction portions 273b to 273f are arranged in a substantially linear shape, and the via 96m corresponding to the LED drive wiring path (specific wiring path) 239a is arranged on the straight line. In this way, even when the plurality of via groups are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals, respectively, among the plurality of wiring paths, the predetermined wiring paths other than the specific wiring path on the one end side are provided. May be drawn out substantially parallel to each other in the first direction from the via and arranged substantially parallel to each other in the second direction via the bending portion, and the specific wiring path may be arranged to be drawn out from the via in the second direction. . Further, the bent portions corresponding to the plurality of via groups may be arranged linearly.

  Further, in the ninth embodiment, as shown in FIG. 25, the LED drive wiring paths 239a to 239c and 240a to 240c on the front wiring layer 211a side are substantially laterally (first direction) from each other via the vias 96m to 96r, respectively. They are drawn out in parallel, and are further arranged, for example, in an upward direction (second direction) substantially parallel to each other via the refraction portions 273a to 273f. Then, the refraction portions 273a to 273c corresponding to the vias 96m to 96o forming the first via group (interlayer conduction portion group) are arranged in a substantially straight line, and the second via group (interlayer conduction portion group) is formed. The bent portions 273d to 273f corresponding to the vias 96p to 96r are also arranged in a substantially straight line. Here, the refraction portions 273a to 273c and the refraction portions 273d to 273f are not arranged on the same straight line, but both arrangements are substantially parallel to each other.

  Thus, even when a plurality of via groups are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals, the LED drive wiring path (specific wiring path) 239a on one end side is included in the LED drive. All of the wiring paths 239a to 239c and 240a to 240c may be configured to be drawn out from the vias 96m to 96r in the first direction. The bent portions corresponding to different via groups may not be arranged on the same straight line. The arrangement of the refraction portions 273a to 273c and the arrangement of the refraction portions 273d to 273f may not be parallel to each other, or the refraction portions 273a to 273f may all be arranged on the same straight line.

  Although the embodiment of the present invention has been described in detail above, the present invention is not limited to this embodiment, and various modifications can be made without departing from the spirit of the present invention. For example, in the embodiment, a through-hole type via is adopted as an example of the interlayer conduction portion (so-called via), but a via in which a through-hole is filled with a conductive paste or the like may be adopted. In addition, the size (diameter) of the interlayer conductive portion such as a through hole may be different depending on the type of wiring path such as the signal line and the ground line.

  In the first embodiment, as shown in FIG. 13B, in arranging a plurality of vias (interlayer conduction portions) in a zigzag shape along the arrangement direction of the plurality of terminals 180a to 180f, a first inclined arrangement portion. Although the same number (2) of vias is used for each of the first and second inclined arrangement portions, the number of vias in the first inclined arrangement portion and the second inclined arrangement portion may be three or more. The number of vias may not be the same as that of the second inclined array portion.

  In the first embodiment, as shown in FIG. 15, a plurality of via groups (interlayer conduction portion groups) are arranged substantially parallel to each other and obliquely with respect to the arrangement direction of the plurality of terminals 191a to 191c and 192a to 192c. In doing so, the number of vias in each via group is the same, but the number of vias in each via group may be different. Also, three or more via groups may be provided.

  In the embodiment, the example in which the blowing effect means 37 is adopted as an example of the movable effect means capable of performing a predetermined operation by the drive means is shown, but the movable effect means is arranged, for example, on the front side of the game board, the front side of the front door 8 or the like. In addition to actuating the generated movable effect body by a drive means such as a motor, a vibration effect means or the like for vibrating a predetermined portion touched by the player (the firing handle 17, the effect button 51, etc.) may be used.

  In the embodiment, among the first wiring path connected to the first electrode of the LED and the second and third wiring paths respectively connected to the second and third electrodes adjacent to both sides of the first electrode, Although the example in which the heat dissipation portions 105a and 105c are provided at least in the second and third wiring paths is shown, the central first electrode may be the G electrode or the B electrode. Further, the LED may be a monochromatic light emitting type including one LED element.

  In the embodiment, in the fourth to sixth LED boards (first to third boards) 44 to 46, the fourth LED board (first board) 44 is provided with the LEDs (first LEDs) 183 to 186 of the fourth LED board 44, An LED driver (first LED driver) 180 for driving the LEDs (second LEDs) 223 to 226 of the fifth LED substrate (second substrate) 45 is provided, and an LED (third LED) is provided on the sixth LED substrate (third substrate) 46. Although the example in which 245 to 248 and the LED driver (third LED driver) 244 for driving them are provided is shown, the fourth LED substrate (first substrate) 44 is provided with the LED (first LED) 183 to the fourth LED substrate 44. 186, LEDs (second LEDs) 223 to 226 of the fifth LED substrate (second substrate) 45, and LEDs (third LED) of the sixth LED substrate (third substrate) 46. An LED driver (first LED driver) 180 that drives 245 to 248 is provided, and an LED driver (first LED driver) 180 and a sixth LED of the fourth LED substrate (first substrate) 44 are provided on the fifth LED substrate (second substrate) 45. A relay wiring path for connecting the LEDs (third LEDs) 245 to 248 of the substrate (third substrate) 46 may be provided.

  In the embodiment, in the first and third LED boards 41, 43, the LED drivers 80, 81, 146 are provided on the rear wiring layers (first wiring layers) 71b, 141b, and the other front wiring layers (second wiring layers) 71a. , 141a are provided with drive wiring paths 88a to 88d and 154a to 154d for driving the speakers 36a and 36b, respectively. However, an LED driver is provided in the first wiring layer and a blowing effect means 37 is provided in the second wiring layer. A drive wiring path relating to movable effect means such as may be provided. In this case, LEDs may be provided on the second wiring layer. Alternatively, as in the fourth embodiment, an LED driver may be provided in the first wiring layer that is a surface layer, and a drive wiring path relating to movable production means such as the air blowing production means 37 may be provided in the second wiring layer that is an intermediate layer. .

  In the second embodiment, conductor exposure is performed so as to include the arrangement regions of the vias 96 so as to correspond to the vias 96 that are concentratedly arranged in the central region in the arrangement region of the LED drivers 120 in the solid ground pattern 134. Although the example in which the portion 262 is provided is shown, the conductor exposed portion 262 and the conductor portion 261 are provided so as to correspond to the peripheral region so as not to reach the via 96 arranged in the central region, and these are soldered (conductive connecting means). ) 263.

  In the embodiment, the wiring paths of the first to sixth LED boards 41 to 46 arranged on the front door 8 are branched into the left wiring path 57 on the left side and the right wiring path 58 on the right side under the window hole 34. The first to sixth LED boards 41 to 46 may be connected in series without branching in the middle, for example, in the order of the boards 41, 42, 43, 46, 45, 44, or in the reverse order.

  In the embodiment, the LED board arranged on the front door 8 has been described, but the same can be applied to the LED board arranged on the game component such as the central display unit 22 in the game board 5 or the like. In addition, it is possible to perform the same on a substrate other than the LED substrate, such as a production control substrate.

  A measurement point (hereinafter referred to as a test point) for verifying the waveform of the signal input to the LED driver may be provided on the wiring path. For example, if the wiring path for transmitting a signal to the LED driver is long, the waveform may be disturbed due to the influence of noise etc. on the way, but even if there is some disturbance in the waveform, the LED looks normal. Since it emits light, it is difficult to judge from the light emitting state of the LED whether or not the input signal to the LED driver is normal. Therefore, for example, by providing a test point on a signal wiring path, a clock wiring path, or the like connected to the LED driver and measuring the waveform of the signal at the test point, is the waveform of the signal input to the LED driver normal? It is possible to accurately verify whether or not. It should be noted that it is desirable to provide the test point as close as possible to the LED driver. Further, the test point may be provided exclusively for it, but a via such as a through hole may be used as the test point.

  Note that, for example, in the case where test points are respectively provided on a plurality of wiring paths that are drawn out substantially in parallel from a plurality of terminals arranged in a predetermined direction, it is shown in the embodiment (FIG. 13, FIG. 15, FIG. 23 to FIG. 25, etc.). The vias may be arranged in the same manner (oblique, zigzag, etc.). In addition, in order to distinguish between a via such as a through hole and a test point, or to clearly indicate that the through hole is used as a test point, a character such as "TP" near the test point on the board, and others It is desirable to provide the mark.

  Further, in the embodiment, an example in which the present invention is applied to a pachinko machine has been shown, but the present invention can be similarly applied to various game machines such as an arrange ball machine and a slot machine.

41-44,46 LED board 71a Wiring layer (2nd surface)
71b Wiring layer (first surface)
72 board body 79 through path wiring path for ground (ground wiring path)
80,81 LED driver (heat generating parts)
84-87 LED
96 vias (interlayer conduction part)
102 solid ground pattern (first conductor pattern)
111a Wiring layer (2nd surface)
111b Wiring layer (first surface)
112 board body 118 through path wiring path for clock 119 through path wiring path for ground (ground wiring path)
120,121 LED driver (heat generating parts)
124-127 LED
134, 134a Solid ground pattern (first conductor pattern)
141a Wiring layer (2nd surface)
141b Wiring layer (first surface)
142 Substrate body 146 LED driver (heat generating component)
147 to 150 LEDs
158 Solid Ground Pattern (First Conductor Pattern)
160 Ground wiring path 171a Wiring layer (2nd surface)
171b Wiring layer (first surface)
172 Substrate body 178 Through path wiring path for clock 179 Through path wiring path for ground (ground wiring path)
180 LED driver (heat generating part)
183-186 LED
196 Solid Ground Pattern (First Conductor Pattern)
241a Wiring layer (second surface)
241b Wiring layer (first surface)
242 Substrate body 244 LED driver (heat-generating component)
245-248 LED
258 solid ground pattern (first conductor pattern)
259 Ground Wireway

Claims (1)

In a gaming machine equipped with a board on which heat-generating components are mounted,
On the first surface of the substrate body that constitutes the substrate, the heat-generating component and a floating island-shaped first conductor pattern around which other wiring routes including a specific wiring route not connected to the heat-generating component are arranged. Provided,
The heat generating component is arranged on the first conductor pattern and at a position separated from the specific wiring path,
A ground wiring path is provided on the second surface of the substrate body,
A game machine characterized in that the first conductor pattern and the ground wiring path are electrically connected by an interlayer conduction portion provided in a plate thickness direction of the substrate body.

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