JP2017093215A - Piezoelectric drive device and method of manufacturing the same, motor, robot, and pump - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric drive device that can be miniaturized.SOLUTION: A piezoelectric drive device includes: a first piezoelectric vibration body that has a first substrate, a first piezoelectric element provided on a first surface of the first substrate, and a first wiring layer electrically connected with the first piezoelectric element; a second piezoelectric vibration body that has a second substrate, a second piezoelectric element provided on a first surface of the second substrate, and a second wiring layer electrically connected with the second piezoelectric element; and a terminal for electrically connecting between external wiring and the first and second wiring layers. The first piezoelectric vibration body and the second piezoelectric vibration body are bonded so that the first surface of the first substrate and the first surface of the second substrate are opposed to each other. The terminal is connected with a lateral face of the first wiring layer and a lateral face of the second wiring layer, and provided so as to be protruded outward from a lateral face of the first substrate and a lateral face of the second substrate.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a piezoelectric drive device and a manufacturing method thereof, a motor, a robot, and a pump.

  Ultrasonic motors that drive a driven body by vibrating a piezoelectric body do not require magnets or coils, and are used in various fields. For example, Patent Documents 1 and 2 describe a piezoelectric drive device in which piezoelectric vibrators are stacked in the thickness direction of a substrate.

JP-A-8-237971 Japanese Patent No. 4813708

  However, in the piezoelectric driving device as described above, for example, a jumper wire such as a wire is used for electrical connection between the piezoelectric vibrating body and a driving circuit for driving the piezoelectric vibrating body. For this reason, in the piezoelectric driving device as described above, a space for routing the jumper wire is required, which may increase the size of the device.

  One of the objects according to some aspects of the present invention is to provide a piezoelectric drive device that can be miniaturized. Another object of some aspects of the present invention is to provide a method of manufacturing a piezoelectric drive device that can be miniaturized. Another object of some embodiments of the present invention is to provide a motor, a robot, or a pump including the piezoelectric driving device described above.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
One aspect of the piezoelectric drive device according to the present invention is:
A first piezoelectric vibrator having a first substrate, a first piezoelectric element provided on a first surface of the first substrate, a first wiring layer electrically connected to the first piezoelectric element;
A second substrate, a second piezoelectric element provided on the first surface of the second substrate, a second piezoelectric vibrator having a second wiring layer electrically connected to the second piezoelectric element,
A terminal for electrically connecting an external wiring to the first wiring layer and the second wiring layer;
Including
The first piezoelectric vibrating body and the second piezoelectric vibrating body are bonded so that the first surface of the first substrate and the first surface of the second substrate face each other,
The terminal is connected to the side surface of the first wiring layer and the side surface of the second wiring layer, and is provided so as to protrude outward from the side surface of the first substrate and the side surface of the second substrate. .

In such a piezoelectric drive device, for example, a drive circuit and a flexible substrate can be electrically connected using a flexible substrate as external wiring. Thereby, in such a piezoelectric drive device, the size can be reduced as compared with the case where the drive circuit and the wiring layer are electrically connected using a jumper wire.

In the description according to the present invention, the term “electrically connected” is used, for example, as another specific member (hereinafter “electrically connected” to “specific member (hereinafter referred to as“ A member ”)”. B member "))" and the like. In the description according to the present invention, in the case of this example, the case where the A member and the B member are in direct contact and electrically connected, and the A member and the B member are the other members. The term “electrically connected” is used as a case where the case where the terminals are electrically connected to each other is included.

[Application Example 2]
In application example 1,
The terminal may be an electroless plating layer.

  In such a piezoelectric driving device, the terminals can be easily formed.

[Application Example 3]
In application example 1 or 2,
A first insulating portion provided between the first substrate and the first wiring layer;
A second insulating portion provided between the second substrate and the second wiring layer;
Including
The terminal may be connected to a side surface of the first insulating portion and a side surface of the second insulating portion.

  In such a piezoelectric drive device, the terminal can be prevented from coming into contact with the substrate. Thereby, in such a piezoelectric drive device, it is possible to suppress a leak current from flowing between the substrate of the first piezoelectric vibrating body and the substrate of the second piezoelectric vibrating body via the terminal.

[Application Example 4]
In any one of Application Examples 1 to 3,
The terminal may be provided separately from the first substrate and the second substrate.

  In such a piezoelectric driving device, it is possible to suppress a leakage current from flowing between the substrate of the first piezoelectric vibrating body and the substrate of the second piezoelectric vibrating body via the terminal.

[Application Example 5]
One aspect of a method for manufacturing a piezoelectric drive device according to the present invention is as follows.
Forming a first piezoelectric vibrator having a first substrate, a first piezoelectric element provided on a first surface of the first substrate, and a first wiring layer electrically connected to the first piezoelectric element;
Forming a second piezoelectric vibrator having a second substrate, a second piezoelectric element provided on the first surface of the second substrate, and a second wiring layer electrically connected to the second piezoelectric element;
Bonding the first piezoelectric vibrating body and the second piezoelectric vibrating body such that the first surface of the first substrate and the first surface of the second substrate face each other;
Forming a terminal connected to the side surface of the first wiring layer and the side surface of the second wiring layer and protruding outward from the side surface of the first substrate and the side surface of the second substrate;
including.

  With such a method of manufacturing a piezoelectric drive device, a piezoelectric drive device that can be miniaturized can be manufactured.

[Application Example 6]
In application example 5,
In the step of forming the terminal,
The terminal may be formed by an electroless plating method.

  In such a method for manufacturing a piezoelectric driving device, the terminals can be easily formed.

[Application Example 7]
In application example 5 or 6,
In the step of forming the first piezoelectric vibrating body,
Forming the first piezoelectric vibrator so as to have a first insulating portion;
In the step of forming the second piezoelectric vibrating body,
Forming the second piezoelectric vibrator so as to have a second insulating portion;
In the step of forming the terminal,
The terminal may be formed so as to be connected to a side surface of the first insulating portion and a side surface of the second insulating portion.

  In such a method for manufacturing a piezoelectric driving device, a piezoelectric driving device that can suppress leakage current flowing between the substrate of the first piezoelectric vibrating body and the substrate of the second piezoelectric vibrating body via a terminal is manufactured. can do.

[Application Example 8]
In any one of Application Examples 5 to 7,
In the step of forming the terminal,
The terminal may be formed so as to be separated from the first substrate and the second substrate.

  In such a method for manufacturing a piezoelectric driving device, a piezoelectric driving device that can suppress leakage current flowing between the substrate of the first piezoelectric vibrating body and the substrate of the second piezoelectric vibrating body via a terminal is manufactured. can do.

[Application Example 9]
One aspect of the motor according to the present invention is:
The piezoelectric drive device according to any one of Application Examples 1 to 4, and
A rotor rotated by the piezoelectric drive device;
including.

  Such a motor can include a piezoelectric drive according to the present invention.

[Application Example 10]
One aspect of the robot according to the present invention is:
A plurality of link parts;
A joint part connecting a plurality of the link parts;
The piezoelectric drive device according to any one of Application Examples 1 to 4, in which a plurality of the link portions are rotated at the joint portions,
including.

  Such a robot can include the piezoelectric driving device according to the present invention.

[Application Example 11]
One aspect of the pump according to the present invention is:
The piezoelectric drive device according to any one of Application Examples 1 to 4, and
A tube that transports the liquid;
A plurality of fingers for closing the tube by driving the piezoelectric driving device;
including.

  Such a pump can include a piezoelectric drive according to the present invention.

The top view which shows typically the piezoelectric drive device which concerns on this embodiment. 1 is a cross-sectional view schematically showing a piezoelectric drive device according to an embodiment. The figure which shows typically the piezoelectric drive device which concerns on this embodiment. The top view which shows typically the 1st piezoelectric vibrating body of the piezoelectric drive device which concerns on this embodiment. The top view which shows typically the 1st piezoelectric vibrating body of the piezoelectric drive device which concerns on this embodiment. FIG. 3 is a cross-sectional view schematically showing a first piezoelectric vibrating body of the piezoelectric driving device according to the embodiment. 1 is a cross-sectional view schematically showing a piezoelectric drive device according to an embodiment. 1 is a cross-sectional view schematically showing a piezoelectric drive device according to an embodiment. The figure which shows the equivalent circuit for demonstrating the piezoelectric drive device which concerns on this embodiment. The figure for demonstrating the electrical connection method of the terminal and drive circuit of the piezoelectric drive device which concern on this embodiment. The figure for demonstrating operation | movement of the piezoelectric drive device which concerns on this embodiment. The flowchart for demonstrating the manufacturing method of the piezoelectric drive device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric drive device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric drive device which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the piezoelectric drive device which concerns on this embodiment. Sectional drawing which shows typically the piezoelectric drive device which concerns on the modification of this embodiment. The figure for demonstrating the robot which concerns on this embodiment. The figure for demonstrating the wrist part of the robot which concerns on this embodiment. The figure for demonstrating the pump which concerns on this embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. Piezoelectric Drive Device First, a piezoelectric drive device according to the present embodiment will be described with reference to the drawings. FIG. 1 is a plan view schematically showing a piezoelectric driving device 100 according to this embodiment. 2 is a cross-sectional view taken along the line II-II of FIG. 1 schematically showing the piezoelectric driving device 100 according to the present embodiment. FIG. 3 is a diagram schematically showing the piezoelectric driving device 100 according to the present embodiment as seen from the direction of arrow III in FIG.

  As shown in FIGS. 1 to 3, the piezoelectric driving device 100 includes a first piezoelectric vibrating body 101 and a second piezoelectric vibrating body 102 joined to the first piezoelectric vibrating body 101. 2 and 3, the piezoelectric vibrators 101 and 102 are shown in a simplified manner.

Here, FIG. 4 is a plan view schematically showing the first piezoelectric vibrating body 101. FIG. 5 is a plan view schematically showing the first piezoelectric vibrating body 101. 6 is a cross-sectional view taken along the line VI-VI in FIGS. 4 and 5 schematically showing the first piezoelectric vibrating body 101. FIG. The first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 basically have the same configuration. Therefore, hereinafter, the first piezoelectric vibrating body 101 will be described with reference to FIGS. 4 to 6. The description of the first piezoelectric vibrating body 101 can be basically applied to the second piezoelectric vibrating body 102.

  As shown in FIGS. 4 to 6, the first piezoelectric vibrating body 101 includes a substrate 10, a contact portion 20, a piezoelectric element 30, insulating layers 40, 42, 43, and wiring layers 50, 52. . For convenience, illustration of members other than the substrate 10, the contact portion 20, and the piezoelectric element 30 is omitted in FIG. In FIG. 5, members other than the substrate 10 and the wiring layer 52 are not shown.

  As shown in FIG. 6, the substrate 10 includes a first surface 10a, a second surface 10b opposite to the first surface 10a, and a third surface 10c that connects the first surface 10a and the second surface 10b. ,have. A piezoelectric element 30 is provided on the first surface 10a. The third surface 10 c is a side surface of the substrate 10.

  The substrate 10 includes, for example, a silicon substrate 11a and a base layer 11b provided on the silicon substrate 11a. The foundation layer 11b is an insulating layer. For example, the base layer 11b is composed of a laminate of a silicon oxide layer provided on the silicon substrate 11a and a zirconium oxide layer provided on the silicon oxide layer.

  As illustrated in FIG. 4, the substrate 10 includes a vibrating body portion 12, a support portion 14, a first connection portion 16, and a second connection portion 18. The planar shape (the shape seen from the thickness direction of the substrate 10) of the vibrating body portion 12 is substantially rectangular. A piezoelectric element 30 is provided on the vibrating body portion 12, and the vibrating body portion 12 can vibrate by deformation of the piezoelectric element 30. The support portion 14 supports the vibrating body portion 12 via the connection portions 16 and 18. In the illustrated example, the connection parts 16 and 18 extend from the center part in the longitudinal direction of the vibrating body part 12 in a direction orthogonal to the longitudinal direction and are connected to the support part 14.

The contact portion 20 is provided on the vibrating body portion 12. In the example shown in the drawing, the vibrating body 12 is provided with a recess 12a, and the contact portion 20 is fitted into the recess 12a and bonded (for example, bonded). The contact portion 20 is a member that contacts the driven member and transmits the movement of the vibrating body portion 12 to the driven member. The material of the contact portion 20 is, for example, ceramics (specifically, alumina (Al ₂ O ₃ )), zirconia (ZrO ₂ ), silicon nitride (Si ₃ N), or the like.

  The piezoelectric element 30 is provided on the substrate 10. The piezoelectric element 30 is provided on the first surface 10 a of the substrate 10. The piezoelectric element 30 is provided on the vibrating body portion 12. The piezoelectric element 30 includes a first electrode 32, a piezoelectric layer 34, and a second electrode 36.

  The first electrode 32 is provided on the vibrating body portion 12. In the illustrated example, the planar shape of the first electrode 32 is a rectangle. The first electrode 32 may be configured by an iridium layer provided on the vibrating body portion 12 and a platinum layer provided on the iridium layer. The thickness of the iridium layer is, for example, not less than 5 nm and not more than 100 nm. The thickness of the platinum layer is, for example, not less than 50 nm and not more than 300 nm. The first electrode 32 is a metal layer made of Ti, Pt, Ta, Ir, Sr, In, Sn, Au, Al, Fe, Cr, Ni, Cu, or a mixture or stack of two or more of these. It may be a thing. The first electrode 32 is one electrode for applying a voltage to the piezoelectric layer 34.

The piezoelectric layer 34 is provided on the first electrode 32. In the illustrated example, the planar shape of the piezoelectric layer 34 is a rectangle. The thickness of the piezoelectric layer 34 is, for example, not less than 50 nm and not more than 20 μm, and preferably not less than 1 μm and not more than 7 μm. Thus, the piezoelectric element 30 is a thin film piezoelectric element. If the thickness of the piezoelectric layer 34 is smaller than 50 nm, the output of the piezoelectric driving device 100 may be small. Specifically, when the voltage applied to the piezoelectric layer 34 is increased in order to increase the output, the piezoelectric layer 34 may cause dielectric breakdown. If the thickness of the piezoelectric layer 34 is greater than 20 μm, the piezoelectric layer 34 may crack.

As the piezoelectric layer 34, a perovskite oxide piezoelectric material is used. Specifically, the material of the piezoelectric layer 34 is, for example, lead zirconate titanate (Pb (Zr, Ti) O ₃ : PZT), lead zirconate titanate niobate (Pb (Zr, Ti, Nb) O). ₃ : PZTN). The piezoelectric layer 34 can be deformed (stretched) when a voltage is applied by the electrodes 32 and 36.

  The second electrode 36 is provided on the piezoelectric layer 34. In the illustrated example, the planar shape of the second electrode 36 is a rectangle. The second electrode 36 may be configured by an adhesion layer provided on the piezoelectric layer 34 and a conductive layer provided on the adhesion layer. The thickness of the adhesion layer is, for example, 10 nm or more and 100 nm or less. The adhesion layer is, for example, a TiW layer, a Ti layer, a Cr layer, a NiCr layer, or a laminate thereof. The thickness of the conductive layer is, for example, 1 μm or more and 10 μm or less. The conductive layer is, for example, a Cu layer, an Au layer, an Al layer, or a laminate thereof. The second electrode 36 is the other electrode for applying a voltage to the piezoelectric layer 34.

  A plurality of piezoelectric elements 30 are provided as shown in FIG. In the illustrated example, five piezoelectric elements 30 are provided (piezoelectric elements 30a, 30b, 30c, 30d, and 30e). In plan view (as viewed from the thickness direction of the substrate 10), for example, the areas of the piezoelectric elements 30a to 30d are the same, and the piezoelectric element 30e has a larger area than the piezoelectric elements 30a to 30d. The piezoelectric element 30 e is provided along the longitudinal direction of the vibrating body 12 at the central portion in the short direction of the vibrating body 12. The piezoelectric elements 30 a, 30 b, 30 c, and 30 d are provided at the four corners of the vibrating body portion 12. In the illustrated example, in the piezoelectric elements 30a to 30e, the first electrode 32 is provided as one continuous conductive layer.

  As shown in FIG. 6, the insulating layer 40 is provided so as to cover the piezoelectric element 30. The insulating layer 40 includes, for example, an inorganic insulating layer 41a provided on the piezoelectric element 30 and an organic insulating layer 41b provided on the inorganic insulating layer 41a. The material of the inorganic insulating layer 41a is, for example, an inorganic material such as silicon oxide or aluminum oxide. The material of the organic insulating layer 41b is, for example, an organic material such as an epoxy resin, an acrylic resin, a polyimide resin, or a silicone resin. The material of the organic insulating layer 41b may be a photosensitive material.

  The wiring layer 50 is provided on the second electrode 36. The wiring layer 50 is electrically connected to the second electrode 36. In the illustrated example, the wiring layer 50 is provided on the insulating layer 40 and in the contact hole 40 b formed in the insulating layer 40, and is connected to the second electrode 36.

  The wiring layer 50 is a layer containing copper. The wiring layer 50 may be composed of a titanium tungsten layer and a copper layer provided on the titanium tungsten layer. In the illustrated example, the wiring layer 50 is covered with an electroless plating layer 51 formed by electroless plating. The electroless plating layer 51 may be composed of a layer containing nickel and phosphorus (Ni-P layer). Or the electroless-plating layer 51 may be comprised from the Ni-P layer and the gold layer provided on the Ni-P layer. Or the electroless-plating layer 51 may be comprised from the Ni-P layer, the palladium layer provided on the Ni-P layer, and the gold layer provided on the palladium layer.

The insulating layer 42 is provided so as to cover the wiring layer 50. In the illustrated example, the insulating layer 42 is provided so as to cover the wiring layer 50 via the electroless plating layer 51. The material of the insulating layer 42 may be an inorganic material such as silicon oxide or aluminum oxide, or may be an organic material such as an epoxy resin, an acrylic resin, a polyimide resin, or a silicone resin. The material of the insulating layer 42 may be a photosensitive material.

  The insulating layer 43 is provided on the insulating layer 42. The insulating layer 43 has a role of a wall for forming the wiring layer 52 on the insulating layer 42, for example. The material of the insulating layer 43 may be an inorganic material such as silicon oxide or aluminum oxide, or may be an organic material such as an epoxy resin, an acrylic resin, a polyimide resin, or a silicone resin. The material of the insulating layer 43 may be a photosensitive material.

  The wiring layer 52 is provided on the electroless plating layer 51. In the example shown in FIG. 6, the wiring layer 52 is electrically connected to the second electrode 36 via the electroless plating layer 51 and the wiring layer 50. That is, the wiring layer 52 is electrically connected to the piezoelectric element 30. In the illustrated example, the wiring layer 52 is connected to the second electrode 36 through a contact hole 42 b formed in the insulating layer 42. The material of the wiring layer 52 is the same as the material of the wiring layer 50, for example.

  As shown in FIG. 5, the wiring layer 52 includes a first portion 53a, a second portion 53b, a third portion 53c, and a fourth portion 53d. The first portion 53a is electrically connected to the second electrode 36 of the piezoelectric elements 30a and 30d. The first portion 53a extends from the vibrating body portion 12 through the first connection portion 16 to the vicinity of the side of the support portion 14 (side opposite to the contact portion 20) 14a in plan view. The second portion 53b is electrically connected to the second electrode 36 of the piezoelectric element 30e. The second portion 53b extends from the vibrating body portion 12 to the vicinity of the side 14a in the plan view. The third portion 53c is electrically connected to the second electrode 36 of the piezoelectric elements 30b and 30c. The third portion 53c extends from the vibrating body portion 12 through the second connection portion 18 to the vicinity of the side 14a in plan view. The fourth portion 53 d is electrically connected to the first electrode 32. The fourth portion 53d extends from the vibrating body portion 12 to the vicinity of the side 14a in the plan view.

  7 is a cross-sectional view taken along the line VII-VII in FIG. The first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 are stacked in the thickness direction of the substrate 10 as shown in FIG. The piezoelectric vibrating bodies 101 and 102 are joined so that the first surface 10a of the first piezoelectric vibrating body 101 and the first surface 10a of the second piezoelectric vibrating body 102 face each other. Specifically, the wiring layer 52 of the first piezoelectric vibrating body 101 and the wiring layer 52 of the second piezoelectric vibrating body 102 are joined. In the illustrated example, the wiring layer 52 of the first piezoelectric vibrating body 101 and the wiring layer 52 of the second piezoelectric vibrating body 102 are joined via the adhesive 2. The adhesive 2 is, for example, a conductive adhesive. Accordingly, the wiring layer 52 of the first piezoelectric vibrating body 101 and the wiring layer 52 of the second piezoelectric vibrating body 102 can be electrically connected. The distance between the substrate 10 of the first piezoelectric vibrator 101 and the substrate 10 of the second piezoelectric vibrator 102 is, for example, about 20 μm.

  The wiring layer 52 of the first piezoelectric vibrating body 101 and the wiring layer 52 of the second piezoelectric vibrating body 102 may be bonded by metal bonding (Cu—Cu bonding or Au—Au bonding). Thereby, the piezoelectric vibrators 101 and 102 can be firmly joined without using an adhesive.

  8 is a cross-sectional view taken along line VIII-VIII in FIG. As shown in FIG. 8, the insulating layer 40 of the piezoelectric vibrators 101 and 102 has a side surface 40a. The insulating layer 42 of the piezoelectric vibrating bodies 101 and 102 has a side surface 42a connected to the side surface 40a. The wiring layer 52 of the piezoelectric vibrating bodies 101 and 102 has a side surface 52a connected to the side surface 42a. The piezoelectric driving device 100 has terminals 80, 82, 84, 86 as shown in FIGS.

  Here, the substrate 10 of the first piezoelectric vibrating body 101 is the first substrate. The piezoelectric element 30 of the first piezoelectric vibrating body 101 is a first piezoelectric element. The wiring layer 52 of the first piezoelectric vibrating body 101 is a first wiring layer. The insulating layers 40 and 42 of the first piezoelectric vibrating body 101 constitute a first insulating portion 44. The first insulating portion 44 is provided between the first substrate and the first wiring layer.

  The substrate 10 of the second piezoelectric vibrating body 102 is a second substrate. The piezoelectric element 30 of the second piezoelectric vibrating body 102 is the second wiring layer, and the wiring layer 52 of the second piezoelectric vibrating body 102 that is the second piezoelectric element is the second wiring layer. The insulating layers 40 and 42 of the second piezoelectric vibrating body 102 constitute a second insulating portion 46. The second insulating portion 46 is provided between the second substrate and the second wiring layer.

  As shown in FIG. 8, the terminal 80 is connected to the side surface 52 a of the wiring layer 52 of the piezoelectric vibrating bodies 101 and 102. In the illustrated example, the terminal 80 is also connected to a part of the side surface 40 a of the insulating layer 40 and the side surface 42 a of the insulating layer 42 of the piezoelectric vibrating bodies 101 and 102, as shown in FIG. 8. That is, the terminal 80 is provided on a part of the side surface 40a and the side surfaces 42a and 52a. The terminal 80 is provided so as to protrude outward from the side surface 10 c of the substrate 10 of the piezoelectric vibrating bodies 101 and 102. That is, as shown in FIG. 1, the terminal 80 has a portion that does not overlap the piezoelectric vibrating bodies 101 and 102 in a plan view. The terminal 80 protrudes outward from the side 14a of the support portion 14 in plan view. The side 14a is, for example, a side formed by the side surface 10c. The terminal 80 is not in contact with the substrate 10 of the piezoelectric vibrating bodies 101 and 102 but is provided apart. For example, the terminals 82, 84, 86 have the same shape and size as the terminal 80.

  Terminals 80, 82, 84, and 86 are electroless plating layers formed by electroless plating. The terminals 80 to 86 may be composed of a layer containing nickel and phosphorus (Ni-P layer). Or the terminals 80-86 may be comprised from the Ni-P layer and the gold layer provided so that the Ni-P layer might be covered. Or the terminals 80-86 may be comprised from the Ni-P layer, the palladium layer provided so that the Ni-P layer might be covered, and the gold layer provided so that the palladium layer might be covered.

  As shown in FIG. 7, the side surface 52 b other than the side surface 52 a provided with the terminals 80, 82, 84, 86 of the wiring layer 52 is covered with, for example, the insulating layer 43. Therefore, no terminal (electroless plating layer) is formed on the side surface 52 b of the wiring layer 52. Thereby, it can suppress that the material of electroless plating is wasted. Furthermore, since electroless plating is not performed on unnecessary portions, it is possible to suppress the movement of the piezoelectric driving device 100 by the electroless plating layer.

  The terminal 80 is electrically connected to the second electrode 36 of the piezoelectric elements 30a and 30d via, for example, the first portion 53a of the second electrode 52. For example, the terminal 82 is electrically connected to the second electrode 36 of the piezoelectric element 30 e via the second portion 53 b of the second electrode 52. The terminal 84 is electrically connected to the second electrode 36 of the piezoelectric elements 30b and 30c via, for example, the third portion 53c of the second electrode 52. The terminal 86 is electrically connected to the first electrode 32 of the piezoelectric elements 30a, 30b, 30c, 30d, and 30e via, for example, the fourth portion 53d of the second electrode 52. The terminal 86 may have a reference potential as a ground. In the piezoelectric driving device 100, by connecting the terminals 80 to 86 and the driving circuit, it is possible to apply a voltage to the piezoelectric layer 34 of the piezoelectric elements 30 a to 30 e and vibrate the vibrating body portion 12.

In the piezoelectric vibrators 101 and 102 of the piezoelectric driving device 100, as shown in FIG. 8, the first conductive layer 33, the insulating layer 35, the second conductive layer 37, and the insulating layer 40 are provided on the support portion 14 and the connection portions 16 and 18, respectively. , 42, wiring layers 50 and 52, and electroless plating layer 51 are provided. Thereby, for example, in each of the piezoelectric vibrating bodies 101 and 102, a difference in thickness (height) of members provided on the vibrating body portion 12, the support portion 14, and the connection portions 16 and 18 can be reduced. That is, the thickness uniformity can be improved in each of the piezoelectric vibrators 101 and 102. Therefore, when the piezoelectric vibrators 101 and 102 are stacked, it is possible to suppress a gap from being generated between the piezoelectric vibrators 101 and 102. Thereby, the joint strength of the piezoelectric vibrating bodies 101 and 102 can be improved.

  The materials of the first conductive layer 33, the insulating layer 35, and the second conductive layer 37 are the same as the materials of the first electrode 32, the piezoelectric layer 34, and the second electrode 36, respectively. The first conductive layer 33, the insulating layer 35, and the second conductive layer 37 can be formed in the step of forming the first electrode 32, the piezoelectric layer 34, and the second electrode 36, respectively. A voltage is not applied to the piezoelectric layer 34 by the conductive layers 33 and 37. For example, the first conductive layer 33 is electrically separated from the first electrode 32, and the second conductive layer 37 is electrically separated from the second electrode 36. In the example illustrated in FIG. 8, the second conductive layer 37 is electrically connected to the terminal 80, but the second conductive layer 37 may be electrically separated from the terminal 80.

  FIG. 9 is a diagram showing an equivalent circuit for explaining the piezoelectric driving device 100. The piezoelectric elements 30 are divided into three groups. The first group has two piezoelectric elements 30a and 30d. The second group has two piezoelectric elements 30b and 30c. The third group has only one piezoelectric element 30e. As shown in FIG. 9, the first group of piezoelectric elements 30 a and 30 d are connected in parallel to each other and connected to the drive circuit 110. The second group of piezoelectric elements 30 b and 30 c are connected in parallel to each other and connected to the drive circuit 110. The third group of piezoelectric elements 30e are connected to the drive circuit 110 independently.

  The drive circuit 110 has a period between predetermined electrodes of the five piezoelectric elements 30a, 30b, 30c, 30d, and 30e, for example, the first electrode 32 and the second electrode 36 of the piezoelectric elements 30a, 30d, and 30e. An alternating voltage or a pulsating voltage that changes with time is applied. Thereby, the piezoelectric driving device 100 can rotate the rotor (driven member) in contact with the contact portion 20 in a predetermined rotation direction by ultrasonically vibrating the vibrating body portion 12. Here, the “pulsating voltage” means a voltage obtained by adding a DC offset to an AC voltage, and the direction of the voltage (electric field) of the pulsating voltage is one direction from one electrode to the other electrode.

  The direction of the current is preferably from the second electrode 36 to the first electrode 32 rather than from the first electrode 32 to the second electrode 36. Moreover, the rotor which contacts the contact part 20 can be rotated in a reverse direction by applying an alternating voltage or a pulsating current voltage between the electrodes 32 and 36 of the piezoelectric elements 30b, 30c and 30e.

  FIG. 10 is a diagram for explaining an electrical connection method between the terminal 80 of the piezoelectric driving device 100 and the driving circuit 110. For convenience, in FIG. 10, the piezoelectric vibrators 101 and 102 are shown in a simplified manner.

  As shown in FIG. 10, the terminal 80 electrically connects the flexible substrate (external wiring) 120 and the wiring layer 52 of the piezoelectric vibrating bodies 101 and 102. Specifically, the flexible substrate 120 includes an insulating substrate 122 and a wiring layer 124 provided on the insulating substrate 122, and the terminal 80 electrically connects the wiring layer 52 and the wiring layer 124. The wiring layer 124 is, for example, a gold layer or a copper layer. As with the terminal 80, the terminals 82, 84, and 86 also connect the flexible substrate (external wiring) 120 and the wiring layer 52 of the piezoelectric vibrating bodies 101 and 102. The flexible substrate 120 electrically connects the terminal 80 and the drive circuit 110.

As shown in FIG. 10, the flexible substrate 120 and the piezoelectric vibrating bodies 101 and 102 are bonded together by, for example, an adhesive 3. The adhesive 3 is provided around the terminals 80, 82, 84, 86 and between the flexible substrate 120 and the piezoelectric vibrators 101, 102. The adhesive 3 is insulative, for example.

  FIG. 11 is a diagram for explaining the operation of the vibrating body 12 of the piezoelectric driving device 100. As shown in FIG. 11, the contact portion 20 of the piezoelectric drive device 100 is in contact with the outer periphery of the rotor 4 as a driven member. The drive circuit 110 applies an alternating voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric elements 30a and 30d. Thereby, the piezoelectric elements 30a and 30d expand and contract in the direction of the arrow x. In response to this, the vibrating body portion 12 is bent and vibrated along the short direction of the vibrating body portion 12 in a state where no voltage is applied to the piezoelectric element 30 in the plane of the vibrating body portion 12. ) To deform into a meandering shape (S-shape). Furthermore, the drive circuit 110 applies an alternating voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric element 30e. Thereby, the piezoelectric element 30e expands and contracts in the direction of the arrow y. Thereby, the vibrating body portion 12 vibrates longitudinally in the plane of the vibrating body portion 12 (for example, longitudinal vibration along the longitudinal direction of the vibrating body portion 12 in a state where no voltage is applied to the piezoelectric element 30). Due to the bending vibration and longitudinal vibration of the vibrating body portion 12 as described above, the contact portion 20 moves elliptically as indicated by an arrow z. As a result, the rotor 4 rotates around the center 4a in a predetermined direction R (clockwise direction in the illustrated example).

  When the drive circuit 110 applies an AC voltage or a pulsating voltage between the electrodes 32 and 36 of the piezoelectric elements 30b, 30c, and 30e, the rotor 4 is in a direction opposite to the direction R (counterclockwise direction). Rotate to.

  Moreover, it is preferable that the resonance frequency of the bending vibration and the resonance frequency of the longitudinal vibration of the vibrating body 12 are the same. Thereby, the piezoelectric drive device 100 can rotate the rotor 4 efficiently.

  As shown in FIG. 11, the motor 130 according to the present embodiment includes the piezoelectric driving device (piezoelectric driving device 100 in the illustrated example) according to the present invention and the rotor 4 rotated by the piezoelectric driving device 100.

  The piezoelectric drive device 100 has the following features, for example.

  In the piezoelectric driving device 100, the terminals 80, 82, 84, 86 are connected to the side surface 52 a of the wiring layer 52 of the piezoelectric vibrating bodies 101, 102 and are outside the side surface 10 c of the substrate 10 of the piezoelectric vibrating bodies 101, 102. It is provided so as to protrude. Therefore, in the piezoelectric driving device 100, for example, the driving circuit 110 and the wiring layer 52 can be electrically connected by using the flexible substrate 120 as the external wiring. Thereby, in the piezoelectric drive device 100, compared with the case where the drive circuit 110 and the wiring layer 52 are electrically connected using a jumper wire, size reduction can be achieved. Furthermore, in the piezoelectric driving device 100, the routing of the external wiring can be simplified, and the electrical connection between the driving circuit 110 and the wiring layer 52 can be easily performed. For example, in the case where the drive circuit 110 and the wiring layer 52 are electrically connected using a jumper wire, a space for routing the jumper wire is required when a plurality of piezoelectric vibrators are stacked, and the apparatus is increased in size. There is a case.

In the piezoelectric driving device 100, the terminals 80, 82, 84, 86 are electroless plating layers. Therefore, in the piezoelectric driving device 100, for example, palladium as a catalyst can be selectively attached to the side surface 52 a of the wiring layer 52 to selectively form the terminals 80 to 86. Thereby, in the piezoelectric drive device 100, for example, even if the substrate 10 is in a wafer state, the terminals 80 to 86 can be easily formed. Further, even if the distance between the substrate 10 of the first piezoelectric vibrator 101 and the substrate 10 of the second piezoelectric vibrator 102 is as small as about 20 μm, the terminals 80 to 86 can be easily formed. For example, when the terminals 80 to 86 are formed by sputtering or the like, it is necessary to perform sputtering from a direction orthogonal to the thickness direction of the substrate 10, and the terminals 80 to 86 may not be easily formed.

  Furthermore, the electroless plating layer can be formed simply by immersing in a liquid. Therefore, in the piezoelectric driving device 100, it is possible to prevent the wiring layer 52 from being damaged by forming the terminals 80 to 86. In the piezoelectric driving device 100, the terminals 80 to 86 can be formed at a low cost, for example.

  Furthermore, in the piezoelectric driving device 100, for example, the resistance can be lowered as compared with the case where Ag paste is used as a terminal. For example, the specific resistance of the Ag paste is 2 Ωcm, and the specific resistance of the Ni—P layers of the terminals 80 to 86 that are layers formed by electroless plating is 0.7 Ωcm.

  In the piezoelectric driving device 100, the first insulating portion 44 provided between the substrate 10 and the wiring layer 52 of the first piezoelectric vibrating body 101 and the substrate 10 and the wiring layer 52 of the second piezoelectric vibrating body 102 are interposed. The provided second insulating portion 46 and the terminals 80 to 86 are connected to the side surfaces 40 a and 42 a of the insulating portions 44 and 46. Therefore, in the piezoelectric driving device 100, when the terminals 80 to 86 that are electroless plating layers are isotropically grown from the side surface 52 a of the wiring layer 52, the terminals 80 to 86 are made to be piezoelectric vibrating bodies by the insulating portions 44 and 46. Contact with the substrate 10 of 101, 102 can be suppressed. Thereby, in the piezoelectric drive device 100, it is possible to suppress leakage current from flowing between the substrates 10 of the piezoelectric vibrating bodies 101 and 102 via the terminals 80 to 86.

  In the piezoelectric driving device 100, the substrate 10 includes a silicon substrate 11a and a base layer 11b that is an insulating layer provided on the silicon substrate 11a. Therefore, in the piezoelectric driving device 100, even if the terminals 80 to 86 are in contact with the substrate 10, the leakage current is prevented from flowing between the substrates 10 of the piezoelectric vibrating bodies 101 and 102 via the terminals 80 to 86. Can do.

  The substrate 10 may be composed only of a silicon substrate 11a made of high resistance silicon (for example, silicon exceeding 10,000 Ωcm). Even in this case, it is possible to suppress leakage current from flowing between the substrates 10 of the piezoelectric vibrating bodies 101 and 102 via the terminals 80 to 86. However, when high resistance silicon is used, the cost is higher than when a normal silicon substrate is used.

  In the piezoelectric driving device 100, the flexible substrate 120 and the piezoelectric vibrating bodies 101 and 102 are joined by an adhesive 3 that is insulative. Therefore, in the piezoelectric driving device 100, it is possible to suppress a leak current from flowing between the substrates 10 of the piezoelectric vibrating bodies 101 and 102 via the terminals 80 to 86.

  In the piezoelectric driving device 100, the terminals 80 to 86 have a gold layer provided so as to cover the Ni—P layer. Therefore, when the material of the wiring layer 124 of the flexible substrate 120 is gold, the terminals 80 to 86 and the flexible substrate 120 can be joined by metal bonding (Au—Au bonding). Furthermore, in the piezoelectric driving device 100, the flexible substrate 120 and the piezoelectric vibrating bodies 101 and 102 can be firmly bonded by, for example, the Au—Au bond and the adhesive 3. Therefore, in the piezoelectric driving device 100, it is possible to prevent the connection between the flexible substrate 120 and the piezoelectric vibrating bodies 101 and 102 from being broken by the vibration of the vibrating body portion 12. Therefore, the piezoelectric drive device 100 can have high reliability. Moreover, in the piezoelectric drive device 100, quality can be improved.

In the piezoelectric driving device 100, the terminals 80 to 86 have a palladium layer provided between the Ni-P layer and the gold layer. Therefore, in the piezoelectric drive device 100, the diffusion between the Ni-P layer and the gold layer can be suppressed by the palladium layer.

2. Next, a method for manufacturing the piezoelectric drive device 100 according to the present embodiment will be described with reference to the drawings. FIG. 12 is a flowchart for explaining a method of manufacturing the piezoelectric driving device 100 according to this embodiment. 13 to 15 are cross-sectional views schematically showing the manufacturing process of the piezoelectric driving device 100 according to this embodiment. 13 and FIG. 14 show the same cross section as FIG. 7, and FIG. 15 shows the same cross section as FIG.

  The first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 are basically formed by the same manufacturing method. Therefore, a method for manufacturing the first piezoelectric vibrating body 101 will be described below with reference to FIGS. The description of the manufacturing method of the first piezoelectric vibrating body 101 can be basically applied to the manufacturing method of the second piezoelectric vibrating body 102.

  As shown in FIG. 13, the 1st electrode 32 is formed on the vibrating body part 12 of the board | substrate 10 (S1). The first electrode 32 is formed, for example, by sputtering, CVD (Chemical Vapor Deposition), vacuum deposition, or the like, and patterning (patterning by photolithography and etching). In this step, the first conductive layer 33 can be formed on the support portion 14 and the connection portions 16 and 18 of the substrate 10 (see FIG. 8). The substrate 10 is obtained, for example, by forming the base layer 11b on the silicon substrate 11a by sputtering or CVD.

  The substrate 10 may be in a wafer state. That is, although not illustrated, a frame portion may be provided around the substrate 10, and the substrate 10 may be connected to the frame portion via the cut portion. In this case, the board | substrate 10, the frame part, and the to-be-cut part are provided integrally.

  Next, the piezoelectric layer 34 is formed on the first electrode 32 (S2). The piezoelectric layer 34 is formed, for example, by repeating the formation of a precursor layer by a liquid phase method and the crystallization of the precursor layer, followed by patterning. The liquid phase method is a method of forming a thin film material using a raw material liquid containing a constituent material of a thin film (piezoelectric layer), and specifically, a sol-gel method, a MOD (Metal Organic Deposition) method, or the like. . Crystallization is performed by heat treatment at 700 ° C. to 800 ° C. in an oxygen atmosphere. In this step, the insulating layer 35 can be formed on the first conductive layer 33 (see FIG. 8).

  Next, the second electrode 36 is formed on the piezoelectric layer 34 (S3). The second electrode 36 is formed by the same method as the first electrode 32, for example. Although not shown, the patterning of the second electrode 36 and the patterning of the piezoelectric layer 34 may be performed as the same process. In this step, the second conductive layer 37 can be formed on the insulating layer 35 (see FIG. 8).

  Through the above steps, the piezoelectric element 30 can be formed on the vibrating body portion 12 of the substrate 10.

  As shown in FIG. 14, the insulating layer 40 having the inorganic insulating layer 41a and the organic insulating layer 41b is formed so as to cover the piezoelectric element 30 (S4). The inorganic insulating layer 41a and the organic insulating layer 41b are formed by, for example, a spin coat method or a CVD method. Next, the insulating layer 40 is patterned to form contact holes 40b.

Next, the wiring layer 50 is formed on the second electrode 36 and the insulating layer 40 (S5). The wiring layer 50 is formed, for example, by plating (electroplating), film formation by sputtering, patterning, or the like.

  Next, an electroless plating layer 51 is formed so as to cover the wiring layer 50 (S6). The electroless plating layer 51 is formed by an electroless plating method. Specifically, palladium as a catalyst is selectively attached to the surface of the wiring layer 50, and then the electroless plating layer 51 is selectively formed on the surface of the wiring layer 50 by an electroless plating method.

  As shown in FIG. 6, insulating layers 42 and 43 are formed so as to cover the electroless plating layer 51 (S7). Specifically, the insulating layer 43 is formed after the insulating layer 42 is formed. The insulating layers 42 and 43 are formed by, for example, spin coating or CVD. When the material of the insulating layers 42 and 43 is a photosensitive material, the insulating layers 42 and 43 can be patterned by exposure, development, and baking without etching. For example, when the insulating layers 42 and 43 are baked, the wiring layer 50 can be prevented from being oxidized by the electroless plating layer 51. In addition, when the material of the insulating layers 42 and 43 is not a photosensitive material, the insulating layers 42 and 43 are patterned by photolithography and etching.

  Through the above steps, insulating portions 44 and 46 (see FIG. 8) having the insulating layers 40 and 42 can be formed.

  Next, the wiring layer 52 is formed on the electrodes 32 and 36 and the insulating layer 42 (S8). The wiring layer 52 is formed by the same method as the wiring layer 50, for example.

  Through the above steps, the first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 can be formed. When the substrate 10 is in a wafer state, the first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 may be formed on separate wafers.

  As shown in FIG. 7, the first piezoelectric vibrating body 101 so that the first surface 10 a of the substrate 10 of the first piezoelectric vibrating body 101 and the first surface 10 a of the substrate 10 of the second piezoelectric vibrating body 102 face each other. And the second piezoelectric vibrator 102 are joined (S9). Specifically, the wiring layer 52 of the first piezoelectric vibrating body 101 and the wiring layer 52 of the second piezoelectric vibrating body 102 are bonded via the adhesive 2.

  As shown in FIG. 15, palladium P as a catalyst of the electroless plating method is selectively attached to the side surface 52a of the wiring layer 52 (S10). Palladium P is deposited by, for example, a known method.

  As shown in FIG. 8, terminals 80, 82, 84, 86 are formed on the side surface 52a of the wiring layer 52 (S11). Specifically, terminals 80 to 86 are selectively formed on the portion of the side surface 52a where palladium P is attached. Terminals 80 to 86 are formed by an electroless plating method. When the terminals 80 to 86 have a Ni—P layer, a palladium layer, and a gold layer, the Ni—P layer is formed by, for example, reducing the nickel layer with hypophosphorous acid (reduced electroless plating). Formed by the law). The palladium layer and the gold layer are formed by, for example, a substitutional electroless plating method.

  In the step (S11), the terminals 80 to 86 are connected to the side surface 52a of the wiring layer 52 of the piezoelectric vibrating bodies 101 and 102, and are formed to protrude outward from the side surface 10c of the substrate 10 of the piezoelectric vibrating bodies 101 and 102. Is done. The terminals 80 to 86 are formed so as to be connected to the side surfaces 40a and 42a of the insulating portions 44 and 46. The terminals 80 to 86 are formed so as to be separated from the substrate 10 of the piezoelectric vibrating bodies 101 and 102.

Although not shown, when the substrate 10 is in a wafer state, after the step (S11), the part to be cut is cut by etching or the like to separate the substrate 10 from the frame part (chip it).

  The piezoelectric driving device 100 can be manufactured through the above steps.

  In the method for manufacturing the piezoelectric driving device 100, the terminals 80 to 86 are connected to the side surface 52 a of the wiring layer 52 of the piezoelectric vibrating bodies 101 and 102 and protrude outward from the side surface 10 c of the substrate 10 of the piezoelectric vibrating bodies 101 and 102. Forming (S11). Therefore, in the method for manufacturing the piezoelectric drive device 100, the piezoelectric drive device 100 that can be reduced in size can be manufactured.

3. Modified Example of Piezoelectric Drive Device Next, a piezoelectric drive device according to a modified example of this embodiment will be described with reference to the drawings. FIG. 165 is a cross-sectional view schematically showing a piezoelectric driving device 200 according to a modification of the present embodiment.

  Hereinafter, in the piezoelectric driving device 200 according to the modified example of the present embodiment, members having the same functions as those of the constituent members of the piezoelectric driving device 100 according to the present embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. To do.

  In the above-described piezoelectric driving device 100, as shown in FIG. 10, the first piezoelectric vibrating body 101 and the second piezoelectric vibrating body 102 are included one by one. In contrast, the piezoelectric driving device 200 includes a plurality of first piezoelectric vibrating bodies 101 and a plurality of second piezoelectric vibrating bodies 102 as shown in FIG.

  In the piezoelectric driving device 200, the first piezoelectric vibrating body 101, the second piezoelectric vibrating body 102, and the terminals 80, 82, 84, 86 constitute a bonded body 210. A plurality of joined bodies 210 are provided. In the illustrated example, two joined bodies 210 are provided. A plurality of bonded bodies 210 are stacked in the thickness direction of the substrate 10.

  In the adjacent bonded body 210, the substrate 10 of the first piezoelectric vibrating body 101 of one bonded body 210 and the substrate 10 of the second piezoelectric vibrating body 102 of the other bonded body 210 are bonded by an adhesive 202. . The adhesive 202 is insulative, for example.

  In the piezoelectric driving device 200, a plurality of bonded bodies 210 are stacked in the thickness direction of the substrate 10. Therefore, in the piezoelectric driving device 200, higher output can be achieved as compared with the case where only one bonded body 210 is configured.

  Further, in the piezoelectric driving device 200, even when a plurality of bonded bodies 210 are stacked, the flexible substrate 120 can be used, and the routing of external wiring can be simplified. Therefore, in the piezoelectric driving device 200, the electrical connection between the driving circuit 110 and the wiring layer 52 can be easily performed.

4). Device Using Piezoelectric Drive Device The piezoelectric drive device according to the present invention can apply a large force to a driven body by utilizing resonance, and can be applied to various devices. The piezoelectric drive device according to the present invention is, for example, as a drive device in various devices such as a robot (including an electronic component transfer device (IC handler)), a dosing pump, a calendar feeding device for a clock, and a paper feeding mechanism for a printing device. Can be used. Hereinafter, representative embodiments will be described. Hereinafter, an apparatus including the piezoelectric driving apparatus 100 will be described as the piezoelectric driving apparatus according to the present invention.

4.1. Robot FIG. 17 is a diagram for explaining a robot 2050 using the piezoelectric driving device 100. The robot 2050 includes an arm 2010 (a plurality of link portions 2012 (also referred to as “link members”) and a plurality of joint portions 2020 that connect the link portions 2012 in a rotatable or bendable state. It is also called “arm”.

  Each joint portion 2020 includes a piezoelectric drive device 100, and the joint portion 2020 can be rotated or bent by an arbitrary angle using the piezoelectric drive device 100. A robot hand 2000 is connected to the tip of the arm 2010. The robot hand 2000 includes a pair of grip portions 2003. The robot hand 2000 also has a built-in piezoelectric driving device 100, and the piezoelectric driving device 100 can be used to open and close the gripping unit 2003 to grip an object. Further, the piezoelectric driving device 100 is also provided between the robot hand 2000 and the arm 2010, and the robot hand 2000 can be rotated with respect to the arm 2010 using the piezoelectric driving device 100.

  FIG. 18 is a view for explaining a wrist portion of the robot 2050 shown in FIG. The wrist joint portion 2020 sandwiches the wrist rotating portion 2022, and the wrist link portion 2012 is attached to the wrist rotating portion 2022 so as to be rotatable around the central axis O of the wrist rotating portion 2022. . The wrist rotation unit 2022 includes the piezoelectric driving device 100, and the piezoelectric driving device 100 rotates the wrist link unit 2012 and the robot hand 2000 around the central axis O. The robot hand 2000 is provided with a plurality of gripping units 2003. The proximal end portion of the grip portion 2003 is movable in the robot hand 2000, and the piezoelectric drive device 100 is mounted on the base portion of the grip portion 2003. For this reason, by operating the piezoelectric driving device 100, the gripping portion 2003 can be moved to grip the target. The robot is not limited to a single-arm robot, and the piezoelectric drive device 100 can be applied to a multi-arm robot having two or more arms.

  Here, in the wrist joint 2020 and the robot hand 2000, in addition to the piezoelectric drive device 100, a power line for supplying power to various devices such as a force sensor and a gyro sensor, a signal line for transmitting a signal, and the like And requires a lot of wiring. Therefore, it is very difficult to arrange wiring inside the joint portion 2020 and the robot hand 2000. However, since the piezoelectric drive device 100 can reduce the drive current as compared with a normal electric motor, wiring can be arranged even in a small space such as the joint portion 2020 (particularly, the joint portion at the tip of the arm 2010) or the robot hand 2000. Is possible.

4.2. Pump FIG. 19 is a diagram for explaining an example of a liquid feed pump 2200 using the piezoelectric driving device 100. The liquid feed pump 2200 includes a reservoir 2211, a tube 2212, a piezoelectric driving device 100, a rotor 2222, a deceleration transmission mechanism 2223, a cam 2202, a plurality of fingers 2213, 2214, 2215, 2216, and a case 2230. 2217, 2218, 2219.

The reservoir 2211 is a storage unit for storing a liquid to be transported. The tube 2212 is a tube for transporting the liquid sent out from the reservoir 2211. The contact portion 20 of the piezoelectric driving device 100 is provided in a state of being pressed against the side surface of the rotor 2222, and the piezoelectric driving device 100 rotates the rotor 2222. The rotational force of the rotor 2222 is transmitted to the cam 2202 via the deceleration transmission mechanism 2223. Fingers 2213 to 2219 are members for closing the tube 2212. When the cam 2202 rotates, the fingers 2213 to 2219 are sequentially pushed outward in the radial direction by the protrusion 2202A of the cam 2202. The fingers 2213 to 2219 close the tube 2212 in order from the upstream side in the transport direction (reservoir 2211 side). Thereby, the liquid in the tube 2212 is transported to the downstream side in order. In this way, it is possible to realize a small liquid feed pump 2200 that can feed a very small amount with high accuracy.

  In addition, arrangement | positioning of each member is not restricted to what was illustrated. Further, a member such as a finger may not be provided, and a ball or the like provided on the rotor 2222 may close the tube 2212. The liquid feed pump 2200 as described above can be used for a medication device that administers a drug solution such as insulin to the human body. Here, since the drive current can be made smaller than that of a normal electric motor by using the piezoelectric drive device 100, the power consumption of the dosing device can be suppressed. Therefore, it is particularly effective when the medication apparatus is battery-driven.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

2, 3 ... Adhesive, 4 ... Rotor, 4a ... Center, 10 ... Substrate, 10a ... First surface, 10b ... Second surface, 10c ... Third surface, 11a ... Silicon substrate, 11b ... Underlayer, 12 ... Vibration Body part, 12a ... concave part, 14 ... support part, 14a ... side, 16 ... first connection part, 18 ... second connection part, 20 ... contact part, 30, 30a, 30b, 30c, 30d, 30e ... piezoelectric element, 32 ... 1st electrode, 33 ... 1st conductive layer, 34 ... Piezoelectric layer, 35 ... Insulating layer, 36 ... 2nd electrode, 37 ... 2nd conductive layer, 40 ... Insulating layer, 40a ... Side surface, 40b ... Contact hole 42 ... Insulating layer, 42a ... Side face, 42b ... Contact hole, 43 ... Insulating layer, 44 ... First insulating part, 46 ... Second insulating part, 50 ... Wiring layer, 51 ... Electroless plating layer, 52 ... Wiring layer 52a, 52b ... side face, 53a ... first part, 53b ... second part, 3c ... third portion, 53d ... fourth portion, 80, 82, 84, 86 ... terminal, 100 ... piezoelectric drive device, 101 ... first piezoelectric vibrator, 102 ... second piezoelectric vibrator, 110 ... drive circuit, 120 DESCRIPTION OF SYMBOLS ... Flexible substrate, 122 ... Insulating substrate, 124 ... Wiring layer, 130 ... Motor, 200 ... Piezoelectric drive device, 202 ... Adhesive, 210 ... Assembly, 2000 ... Robot hand, 2003 ... Holding part, 2010 ... Arm, 2012 ... Link part, 2020 ... joint part, 2050 ... robot, 2200 ... liquid feed pump, 2202 ... cam, 2202A ... projection, 2211 ... reservoir, 2212 ... tube, 2213, 2214, 2215, 2216, 2217, 2218, 2219 ... finger 2222 ... Rotor, 2223 ... Deceleration transmission mechanism, 2230 ... Case

Claims (11)

A first piezoelectric vibrator having a first substrate, a first piezoelectric element provided on a first surface of the first substrate, a first wiring layer electrically connected to the first piezoelectric element;
A second substrate, a second piezoelectric element provided on the first surface of the second substrate, a second piezoelectric vibrator having a second wiring layer electrically connected to the second piezoelectric element,
A terminal for electrically connecting an external wiring to the first wiring layer and the second wiring layer;
Including
The first piezoelectric vibrating body and the second piezoelectric vibrating body are bonded so that the first surface of the first substrate and the first surface of the second substrate face each other,
The terminal is connected to the side surface of the first wiring layer and the side surface of the second wiring layer, and is provided so as to protrude outward from the side surface of the first substrate and the side surface of the second substrate. Piezoelectric drive device. In claim 1,
The piezoelectric drive device, wherein the terminal is an electroless plating layer. In claim 1 or 2,
A first insulating portion provided between the first substrate and the first wiring layer;
A second insulating portion provided between the second substrate and the second wiring layer;
Including
The piezoelectric drive device, wherein the terminal is connected to a side surface of the first insulating portion and a side surface of the second insulating portion. In any one of Claims 1 thru | or 3,
The piezoelectric drive device, wherein the terminal is provided apart from the first substrate and the second substrate. Forming a first piezoelectric vibrator having a first substrate, a first piezoelectric element provided on a first surface of the first substrate, and a first wiring layer electrically connected to the first piezoelectric element;
Forming a second piezoelectric vibrator having a second substrate, a second piezoelectric element provided on the first surface of the second substrate, and a second wiring layer electrically connected to the second piezoelectric element;
Bonding the first piezoelectric vibrating body and the second piezoelectric vibrating body such that the first surface of the first substrate and the first surface of the second substrate face each other;
Forming a terminal connected to the side surface of the first wiring layer and the side surface of the second wiring layer and protruding outward from the side surface of the first substrate and the side surface of the second substrate;
A method for manufacturing a piezoelectric drive device, comprising: In claim 5,
In the step of forming the terminal,
A method of manufacturing a piezoelectric drive device, wherein the terminal is formed by an electroless plating method. In claim 5 or 6,
In the step of forming the first piezoelectric vibrating body,
Forming the first piezoelectric vibrator so as to have a first insulating portion;
In the step of forming the second piezoelectric vibrating body,
Forming the second piezoelectric vibrator so as to have a second insulating portion;
In the step of forming the terminal,
A method of manufacturing a piezoelectric driving device, wherein the terminal is formed so as to be connected to a side surface of the first insulating portion and a side surface of the second insulating portion. In any one of Claims 5 thru | or 7,
In the step of forming the terminal,
A method of manufacturing a piezoelectric driving device, wherein the terminal is formed so as to be separated from the first substrate and the second substrate. A piezoelectric driving device according to any one of claims 1 to 4,
A rotor rotated by the piezoelectric drive device;
Including a motor. A plurality of link parts;
A joint part connecting a plurality of the link parts;
The piezoelectric drive device according to any one of claims 1 to 4, wherein a plurality of the link portions are rotated by the joint portions;
Including robots. A piezoelectric driving device according to any one of claims 1 to 4,
A tube that transports the liquid;
A plurality of fingers for closing the tube by driving the piezoelectric driving device;
Including a pump.

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