JP2017092151A - Cooler module and method of manufacturing cooler module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooler module capable of preventing adhesion between a cooling pipe and a heating element in contact therewith from degrading, by suppressing waviness of the cooling pipe due to a compressive load in the lamination direction.SOLUTION: A middle plate 303 of a plate member 30 presses a specific middle pipe component 2Xc while being joined thereto on one side in the pipe lamination direction DRst. Consequently, rolling deformation of a specific cooling pipe 2X due to a compressive load pressing the specific middle pipe component 2Xc is prevented, by joint of the middle plate 303 and specific middle pipe component 2Xc. As a result, when sandwiching an electronic component 4 by cooling pipes 2, clearance between the specific cooling pipe 2X and a specific electronic component 4X can be reduced, and thermal conductivity between the specific cooling pipe 2X and the specific electronic component 4X can be improved.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cooler module for cooling a heating element and a method for manufacturing the cooler module.

  Patent document 1 is disclosing the power converter device, The power converter device contains the semiconductor module which comprises a power converter circuit, and the cooling tube which forms the flow path of the refrigerant | coolant which cools the semiconductor module. The power conversion device includes a semiconductor stacked unit and a guide unit. The semiconductor laminated unit is a unit in which cooling tubes having a flat shape and semiconductor modules are alternately laminated, and both ends of each cooling tube are communicated with a pair of header parts constituting a refrigerant supply side and a discharge side. is there. The guide unit is formed by forming a pair of guide surfaces arranged with a gap in a predetermined width direction facing the front and back surfaces formed by the side edges along the longitudinal direction of each cooling tube in the semiconductor laminated unit. Is a unit.

  Furthermore, the guide unit includes a pinching plate and a plate portion that generate a load that pressurizes the semiconductor stacking unit in the stacking direction of the cooling tubes. The pinching plate is opposed to the plate portion with the semiconductor multilayer unit interposed therebetween, and is held in a state where a load in the stacking direction is applied to the semiconductor multilayer unit. Thereby, a semiconductor module is pinched | interposed between cooling tubes, and a cooling tube and a semiconductor module contact | adhere so that heat exchange is mutually possible.

  In this power conversion device, the cooling tube and the guide unit correspond to a cooler module.

JP-A-2005-45186

  In a cooler module in which cooling tubes as cooling tubes and heating elements such as semiconductor modules are alternately stacked in the stacking direction, as disclosed in Patent Document 1, a plurality of stacked cooling tubes On the other hand, it is necessary to apply a compressive load with a plate member such as a pinching plate. This is because the cooling pipe and the heating element are in close contact with each other by the action of the compressive load.

  However, as a result of detailed studies by the inventors, when a compression load is applied to the plurality of cooling pipes by the plate member, the cooling pipes that are in contact with the plate member undulate in the stacking direction among the plurality of cooling pipes. As a result, a new problem has been discovered. When the cooling pipe is deformed in this way, the adhesion between the cooling pipe and the heating element in contact with the cooling pipe is deteriorated, so that the heat exchange performance between the cooling pipe and the heating element is impaired. It will be.

  In view of the above points, the present invention prevents the deterioration of adhesion between the cooling pipe and the heating element in contact with the cooling pipe by suppressing the undulation of the cooling pipe due to the compressive load in the stacking direction. It is an object of the present invention to provide a cooler module that can be used and a method of manufacturing the cooler module.

In order to achieve the above object, the invention according to claim 1 is a cooler module that cools a plurality of heating elements by exchanging heat between the plurality of heating elements (4) and a cooling medium,
The first pipe constituent part (2a) extending in the longitudinal direction (DRtb) and extending from the intermediate pipe constituent part (2c) and the intermediate pipe constituent part and disposed on one side with respect to the intermediate pipe constituent part in the longitudinal direction A plurality of heating elements extending in the longitudinal direction and having a second pipe constituent part (2b) arranged on the other side of the intermediate pipe constituent part in the longitudinal direction, and in the stacking direction (DRst) intersecting the longitudinal direction And a plurality of cooling pipes (2) that are alternately laminated and sandwich the plurality of heating elements at the intermediate pipe constituting part,
Among the plurality of cooling pipes, a specific first pipe that is disposed on one side in the stacking direction with respect to the specific cooling pipe (2X) positioned at one end in the stacking direction and is a first pipe constituent part of the specific cooling pipe The first plate part (301) to which the constituent part (2Xa) is joined and the second plate part (302) to which the specific second pipe constituent part (2Xb), which is the second pipe constituent part of the specific cooling pipe, is joined. A plate member (30) having an intermediate plate portion (303) connecting between the first plate portion and the second plate portion;
Each of the intermediate pipe constituent parts of the plurality of cooling pipes has a flat cross-sectional shape with the laminating direction as a short direction, and among the plurality of heat generating elements, the heat generating element that contacts the intermediate pipe constituent part and the intermediate pipe constituent part Heat exchange with the cooling medium flowing through the
The specific intermediate pipe component (2Xc) that is the intermediate pipe component of the specific cooling pipe is in contact with the specific heating element (4X) adjacent to the specific intermediate pipe component among the plurality of heating elements,
The intermediate plate portion presses the specific intermediate tube component in a state of being bonded to the side opposite to the specific heating element side of the specific intermediate tube component in the stacking direction.

  As described above, the intermediate plate portion of the plate member presses the specific intermediate tube component in a state of being bonded to the side opposite to the specific heating element side of the specific intermediate tube component in the stacking direction. The undulating deformation of the specific cooling pipe due to the compressive load that presses the pipe constituent part is prevented by joining the intermediate plate part and the specific intermediate pipe constituent part. As a result, when the heating element is sandwiched between the cooling pipes, the specific cooling pipe and the specific heating element The clearance between the specific cooling pipe and the specific heating element can be improved.

The invention according to claim 8 is a method of manufacturing a cooler module that cools a plurality of heating elements by exchanging heat between the plurality of heating elements (4) and a cooling medium,
An intermediate tube component (2c) that extends in the longitudinal direction (DRtb) and has a flat cross-sectional shape, and a first tube component that extends from the intermediate tube component and is disposed on one side of the intermediate tube component in the longitudinal direction (2a) and a plurality of cooling pipes for flowing a cooling medium (2a) and a second pipe constituent part (2b) that extends from the intermediate pipe constituent part and is arranged on the other side of the intermediate pipe constituent part in the longitudinal direction ( 2) and
Preparing a plate member (30) having a first plate portion (301), a second plate portion (302), and an intermediate plate portion (303) connecting between the first plate portion and the second plate portion;
After preparing the above, laminating a plurality of cooling pipes at intervals between the intermediate pipe components in the laminating direction (DRst) that intersects the longitudinal direction and along the short direction of the flat cross-sectional shape;
After laminating, joining a plurality of cooling tubes to each other at the first tube component and the second tube component;
After the preparation, the first pipe component (2Xa) of the specific cooling pipe (2X) located at one end in the stacking direction among the plurality of cooling pipes is joined to the first plate part, and the specific cooling pipe The specific pipe is fixed to the plate member by joining the second pipe constituent part (2Xb) to the second plate part and joining the intermediate pipe constituent part (2Xc) of the specific cooling pipe to the intermediate plate part. And
After joining the plurality of cooling pipes to each other, inserting a plurality of heating elements between the intermediate pipe constituent parts,
After the fixing and the insertion, the plurality of cooling pipes are brought into close contact with the plurality of heating elements by compressing the plurality of cooling pipes in the stacking direction with a plate member.

  As described above, in the method for manufacturing a cooler module, the first pipe constituent part of the specific cooling pipe is joined to the first plate part, the second pipe constituent part of the specific cooling pipe is joined to the second plate part, and The specific cooling pipe is fixed to the plate member by joining the intermediate pipe constituting part of the specific cooling pipe to the intermediate plate part. At the same time, a plurality of heating elements are inserted between the intermediate tube components. Further, after the insertion and the fixing of the specific cooling pipe to the plate member, the plurality of cooling pipes are compressed in the stacking direction by the plate member, thereby bringing the plurality of cooling pipes into close contact with the plurality of heating elements. As a result, after the close contact, the clearance between the specific cooling pipe and the heating element adjacent to the intermediate pipe component of the specific cooling pipe can be reduced in the same manner as described above. It is possible to improve the heat transfer between.

  In addition, each code | symbol in the bracket | parenthesis described in a claim and this column is an example which shows a corresponding relationship with the specific content as described in embodiment mentioned later.

It is the figure which showed the whole structure of the cooler module 1 in 1st Embodiment. It is the figure which looked at the cooler module 1 of FIG. 1 from the one side of the pipe lamination direction DRst. It is the front view of the plate member 30 single-piece | unit which extracted and showed only the plate member 30 from FIG. It is IV arrow line view in FIG. It is sectional drawing which showed a part of supply header 11 of the cooler module 1 in 1st Embodiment. It is a flowchart which shows the manufacturing process of the cooler module 1 in 1st Embodiment. It is the figure which showed the cooler 10a before the electronic component 4 is clamped between the semi-finished products of the cooler 10, ie, the cooling pipe 2, in the assembly process of the cooler module 1 of 1st Embodiment. FIG. 8 is a partial cross-sectional view corresponding to the VIII-VIII cross-sectional view of FIG. 2 in the cooler 10a before the electronic component 4 of FIG. FIG. 2 is a diagram in which a broken line TFw is added to describe the problem to be solved by the cooler module 1 of the first embodiment in the cross-sectional view in which the vicinity of the specific supply header configuration part 2Xa of FIG. 1 is enlarged and illustrated. It is sectional drawing which showed the connection part which connects between the some cooling pipes 2 in 2nd Embodiment, Comprising: It is the figure which showed the characteristic part different from 1st Embodiment. It is the figure which showed the characteristic of the 1st modification with respect to 1st Embodiment, Comprising: It is a figure equivalent to FIG. 4 of 1st Embodiment. It is the figure which showed the characteristic of the 2nd modification with respect to 1st Embodiment, Comprising: It is a figure corresponded in FIG. 4 of 1st Embodiment.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
FIG. 1 is a diagram showing an overall configuration of a cooler module 1 in the present embodiment. FIG. 2 is a view of the cooler module 1 viewed from one side in the tube stacking direction DRst. The cooler module 1 shown in FIG. 1 and FIG. 2 is a stacked heat exchanger that cools a heat exchange object by heat-exchanging the refrigerant circulating inside and the heat exchange object. Specifically, the heat exchange object, that is, the object to be cooled is a plurality of electronic parts 4 formed in a plate shape, and the cooler module 1 cools the electronic parts 4 from both sides. As the cooling medium, that is, the refrigerant of the cooler module 1, for example, water mixed with an ethylene glycol antifreeze, that is, cooling water is used. Note that the tube stacking direction DRst, the tube longitudinal direction DRtb, and the tube width direction DRw in FIG. 2 are all directions that intersect with each other, strictly speaking, directions that are orthogonal to each other.

  Specifically, the electronic component 4 is a heating element that houses a power element for controlling high power and generates heat when energized. The electronic component 4 is formed in a flat rectangular parallelepiped shape. In the electronic component 4, the power electrode extends from one long side outer peripheral surface, and the control electrode extends from the other long side outer peripheral surface.

  Specifically, the electronic component 4 is a semiconductor module including a semiconductor switch element and a diode. The plurality of electronic components 4 that are the semiconductor modules and the cooler module 1 that cools the plurality of electronic components 4 constitute a power conversion device for a motor for driving a car. The power conversion device is a circuit that converts DC power into AC power and outputs the AC power to a traveling motor.

  As shown in FIG. 1, the cooler module 1 includes a cooler 10 and a case 40. The cooler 10 includes a main body 20 and a plate member 30.

  The main body 20 is accommodated in the case 40. The main body 20 is configured by stacking a plurality of cooling pipes 2 in the pipe stacking direction DRst. The plurality of cooling pipes 2 are each formed in a tube shape extending in the pipe longitudinal direction DRtb. That is, the tube longitudinal direction DRtb is the longitudinal direction of the cooling tube 2, and the tube stacking direction DRst is the stacking direction of the cooling tube 2.

  A refrigerant flows through the plurality of cooling pipes 2. And each cooling pipe 2 has the supply header structure part 2a as a 1st pipe structure part in the one side of pipe | tube longitudinal direction DRtb which is the longitudinal direction of the cooling pipe 2. As shown in FIG. At the same time, each cooling pipe 2 has a discharge header constituting part 2b as a second pipe constituting part on the other side in the pipe longitudinal direction DRtb. Further, each of the cooling pipes 2 has an intermediate pipe constituent part 2c that connects between the supply header constituent part 2a and the discharge header constituent part 2b.

  The cross-sectional shape obtained by cutting the intermediate tube constituent portion 2c with a cross section orthogonal to the tube longitudinal direction DRtb has a flat cross-sectional shape with the tube stacking direction DRst as the short direction. And the intermediate pipe | tube structure part 2c forms 2d of intermediate refrigerant flow paths through which a refrigerant | coolant flows inside the intermediate pipe | tube structure part 2c. The intermediate refrigerant flow path 2d is shown in FIG.

  The supply header component 2a shown in FIG. 1 is a part of the cooling pipe 2 that extends from the intermediate tube component 2c and is disposed on one side with respect to the intermediate tube component 2c in the pipe longitudinal direction DRtb. The supply header component 2a is stacked in the pipe stacking direction DRst, thereby configuring the supply header 11 that supplies the refrigerant to the intermediate refrigerant flow path 2d. That is, the supply header 11 includes a plurality of supply header components 2a, and one ends of the plurality of intermediate pipe components 2c are connected to each other.

  The discharge header component 2b is a part of the cooling pipe 2 that extends from the intermediate tube component 2c and is disposed on the other side of the intermediate tube component 2c in the pipe longitudinal direction DRtb. The discharge header component 2b is stacked in the pipe stacking direction DRst, thereby forming the discharge header 12 into which the refrigerant discharged from the intermediate refrigerant flow path 2d flows. That is, the discharge header 12 includes a plurality of discharge header components 2b, and the other ends of the plurality of intermediate pipe components 2c are connected to each other.

  The intermediate tube component 2c is in contact with one main plane of the electronic component 4 on one flat surface as one cooling surface of the intermediate tube component 2c. At the same time, the intermediate tube component 2c is disposed so as to be in contact with another main plane of another electronic component 4 on the other flat surface as the other cooling surface of the intermediate tube component 2c. As a result, each of the intermediate pipe constituent portions 2c of the plurality of cooling pipes 2 includes the electronic component 4 that contacts the intermediate pipe constituent portion 2c among the plurality of electronic components 4 and the refrigerant flowing in the intermediate refrigerant flow path 2d. Heat exchange.

  That is, the plurality of cooling tubes 2 are alternately stacked with the plurality of electronic components 4 in the tube stacking direction DRst, and the plurality of electronic components 4 are respectively sandwiched by the intermediate tube constituting portion 2c. And the cooling pipe 2 is further arrange | positioned at the both ends of the pipe lamination direction DRst in the assembly body which laminatedly arranged the some electronic component 4 and the several cooling pipe 2. As shown in FIG. By such a stacking arrangement of the cooling pipes 2, the main body 20 of the cooler 10 exchanges heat between the refrigerant flowing through the intermediate refrigerant flow path 2d of the intermediate pipe constituting part 2c and the electronic parts 4 so that the plurality of electronic parts 4 can be exchanged. Cool from both sides.

  As shown in FIGS. 1 and 2, the plate member 30 is arranged on one side of the tube stacking direction DRst with respect to the main body portion 20. That is, the plate member 30 is disposed on one side in the tube stacking direction DRst with respect to the specific cooling tube 2X included in the plurality of cooling tubes 2. As shown in FIG. 1, the specific cooling pipe 2 </ b> X is a cooling pipe 2 positioned at one end of the plurality of cooling pipes 2 in the pipe stacking direction DRst. In the description of the present embodiment, the supply header component 2a included in the specific cooling pipe 2X is referred to as a specific supply header component 2Xa (that is, the specific first pipe component), and the discharge header component included in the specific cooling pipe 2X. 2b is referred to as a specific discharge header component 2Xb (that is, a specific second pipe component), and the intermediate pipe component 2c included in the specific cooling pipe 2X is referred to as a specific intermediate tube component 2Xc.

  As shown in FIGS. 1 and 2, the plate member 30 is a support member that supports the main body 20 from one side in the tube stacking direction DRst. For this support, the thickness of the plate member 30 in the tube stacking direction DRst is sufficiently larger than the cooling tube 2, for example. Thereby, the bending rigidity of the plate member 30 with respect to the bending of the plate member 30 shown in FIG. 1, that is, the bending rigidity of the plate member 30 with respect to the bending in the tube stacking direction DRst is larger than that of the specific cooling pipe 2X. The plate member 30 is such a thick member.

  The plate member 30 is formed in a substantially long plate shape with the tube stacking direction DRst as the thickness direction, and the tube longitudinal direction DRtb is the longitudinal direction of the plate member 30. The plate member 30 is disposed so as to close the opening 401 of the case 40. The plate member 30 is fixed to the case 40 by a plurality of fastening members 42. The plurality of fastening members 42 are four in the present embodiment.

  Specifically, as shown in FIGS. 3 and 4, the plate member 30 includes a first plate portion 301, a second plate portion 302, and an intermediate plate portion 303. FIG. 3 is a front view of the plate member 30 alone, in which only the plate member 30 is extracted from FIG. FIG. 4 is a view taken along arrow IV in FIG. The plate member 30 is made of a metal having high thermal conductivity such as an aluminum alloy.

  The first plate portion 301 of the plate member 30 is disposed on one side of the plate member 30 with respect to the intermediate plate portion 303 in the tube longitudinal direction DRtb. The second plate portion 302 is disposed on the other side of the plate member 30 with respect to the intermediate plate portion 303 in the tube longitudinal direction DRtb. Each of the first plate portion 301 and the second plate portion 302 is configured to extend from the intermediate plate portion 303. In other words, the intermediate plate portion 303 constitutes a portion of the plate member 30 that connects between the first plate portion 301 and the second plate portion 302.

  Further, the first plate portion 301 is formed with a first medium flow hole 301a through which the refrigerant flows. The first medium flow hole 301a is a through hole that penetrates the first plate portion 301 in the tube stacking direction DRst. Further, the first plate portion 301 has a first plate protruding portion 301b that protrudes to the opposite side of the main body 20 side of the cooler 10, that is, one side in the tube stacking direction DRst. The first plate protrusion 301b constitutes a peripheral portion of the end of one end of the first medium flow hole 301a in the tube stacking direction DRst.

  In addition, the second plate portion 302 is formed with a second medium flow hole 302a through which the refrigerant flows. The second medium flow hole 302a is a through hole that penetrates the second plate portion 302 in the tube stacking direction DRst. The second plate portion 302 has a second plate protruding portion 302b that protrudes to the opposite side of the main body 20 side of the cooler 10, that is, one side in the tube stacking direction DRst. The second plate protrusion 302b forms a peripheral portion of the end of one end of the second medium flow hole 302a in the tube stacking direction DRst.

  The intermediate plate portion 303 has a joint portion 303a protruding to the main body portion 20 side, that is, the other side in the tube stacking direction DRst. The joint 303a has a plate joint surface 303b facing the other side in the tube stacking direction DRst. As shown in FIG. 1, the plate joining surface 303b is in contact with and joined to the specific intermediate pipe constituting portion 2Xc of the specific cooling pipe 2X.

  For example, the plate joining surface 303b abuts over the entire flat surface of the specific intermediate pipe constituting portion 2Xc opposite to the plate joining surface 303b or is joined by brazing or the like. In short, the plate joining surface 303b is surface joined to the flat surface of the specific intermediate pipe constituting portion 2Xc. However, since a plurality of grooves 303c that are recessed from the plate bonding surface 303b are formed in the bonding portion 303a, the plate bonding surface 303b is bonded to the specific intermediate tube constituting portion 2Xc at a place excluding the groove 303c. Yes.

  In addition, the specific intermediate pipe component 2Xc of the specific cooling pipe 2X has a plurality of portions similar to the intermediate pipe component 2c of the other cooling pipe 2 on the opposite side of the intermediate plate 303 in the pipe stacking direction DRst, that is, the other side. The electronic component 4 is in contact with the electronic component 4 adjacent to the specific intermediate tube component 2Xc so as to be able to exchange heat. The electronic component 4 that is adjacent to and in contact with the specific intermediate tube component 2Xc is referred to as a specific electronic component 4X (in other words, a specific heating element 4X) when distinguished from others.

  As described above, the plurality of grooves 303c shown in FIGS. 3 and 4 are formed in the joint portion 303a. For example, the plurality of grooves 303c extend over the entire width of the joint portion 303a in the tube width direction DRw. And are arranged side by side with a predetermined interval in the pipe longitudinal direction DRtb.

  As shown in FIG. 1, the case 40 includes openings 401 and 402. The opening 401 opens on one side in the tube stacking direction DRst. The opening 402 opens to one side in the tube width direction DRw (that is, the front side in the direction perpendicular to the paper surface in FIG. 1). The case 40 of the present embodiment is a metal case having high thermal conductivity such as an aluminum alloy.

  Next, the detail of the structure of the cooling pipe 2 which comprises the cooler module 1 of this embodiment is demonstrated. FIG. 5 is a cross-sectional view showing a part of the supply header 11 of the cooler module 1.

  The cooling pipe 2 is configured by laminating metal plates having high thermal conductivity such as an aluminum alloy and joining these plates by a joining technique such as brazing. Specifically, as shown in FIG. 5, the cooling pipe 2 includes a pair of outer shell plates 27 and an intermediate plate 28. The pair of outer shell plates 27 form the outer shell of the cooling pipe 2 and are arranged side by side in the pipe stacking direction DRst. The intermediate plate 28 is disposed between the pair of outer shell plates 27.

  In other words, the intermediate pipe constituting part 2c is composed of a pair of outer shell plates 27 and an intermediate plate 28, and the pair of outer shell plates 27 are extended to the supply header constituting part 2a and the discharge header constituting part 2b, respectively. Yes. The intermediate plate 28 extends from the intermediate pipe component 2c into the supply header component 2a and the discharge header component 2b.

  And the through-hole 28a is formed in the site | part contained in the supply header structure part 2a among the intermediate | middle plates 28 so that the refrigerant | coolant flow FWrf in the supply header 11 may not be prevented. Similarly, in the discharge header component 2 b, a through hole is formed in a portion of the intermediate plate 28 included in the discharge header component 2 b so as not to disturb the refrigerant flow in the discharge header 12.

  As shown in FIGS. 1 and 5, in each of the plurality of cooling pipes 2 including the specific cooling pipe 2X, the pair of outer shell plates 27 are respectively provided with first protruding pipes provided so as to protrude in the pipe stacking direction DRst. The part 21 is provided in the part which comprises the supply header structure part 2a. At the same time, each of the pair of outer shell plates 27 has a second protruding pipe portion 22 provided so as to protrude in the pipe stacking direction DRst at a portion constituting the discharge header constituting portion 2b.

  That is, the supply header component 2a has a pair of first projecting tube portions 21, and the pair of first projecting tube portions 21 protrudes on both sides in the tube stacking direction DRst to the tube stacking direction DRst. It is open. The discharge header component 2b has a pair of second projecting tube portions 22, and the pair of second projecting tube portions 22 also project from both sides of the tube stacking direction DRst to the tube stacking direction DRst. It is open.

  Further, the first projecting pipe portions 21 facing each other between the adjacent cooling pipes 2 of the plurality of cooling pipes 2 are joined in a state of being fitted to each other. Specifically, the first protruding tube portions 21 facing each other are joined by brazing or the like in a state where one of the first protruding tube portions 21 is fitted into the other first protruding tube portion 21. ing. Thereby, each supply header structure part 2a which the several cooling pipe 2 has is connected by the pipe lamination direction DRst, and the supply header 11 is comprised.

  The configuration of the discharge header 12 is the same as this. That is, the second projecting pipe portions 22 facing each other between the adjacent cooling pipes 2 of the plurality of cooling pipes 2 are joined in a state of being fitted to each other. Specifically, the second projecting tube portions 22 facing each other are joined by brazing or the like in a state where one of the second projecting tube portions 22 is fitted into the other second projecting tube portion 22. ing. Thereby, each discharge header constituent part 2b which a plurality of cooling pipes 2 have is connected to pipe stacking direction DRst, and discharge header 12 is constituted.

  Further, in each of the plurality of cooling pipes 2 including the specific cooling pipe 2X, the pair of outer shell plates 27 respectively replace the first diaphragm part 211 as the first easily deformable part with the pair of first protruding pipe parts 21. It is provided around the base portion, that is, at the base end of the first protruding tube portion 21. At the same time, each of the pair of outer shell plates 27 serves as a second diaphragm portion 221 as a second easily deformable portion, around the base portion of the pair of second projecting tube portions 22, that is, the base end of the second projecting tube portion 22. Have.

  That is, the supply header component 2 a has a pair of first diaphragm portions 211, and the pair of first diaphragm portions 211 is a supply header configuration at the base ends of the pair of first projecting pipe portions 21. It is depressed in the tube stacking direction DRst toward the inside of the portion 2a. And the discharge header structure part 2b has the 2nd diaphragm part 221 which comprises a pair, and the pair of 2nd diaphragm part 221 is a discharge header structure by each base end of a pair of 2nd protrusion pipe | tube part 22, respectively. It is depressed in the tube stacking direction DRst toward the inside of the portion 2b. As described above, the first diaphragm portion 211 and the second diaphragm portion 221 are formed so as to be easily deformed by the pressing force applied to the tube stacking direction DRst applied when the cooler module 1 is assembled. Because.

  In the specific cooling pipe 2 </ b> X, the specific supply header component 2 </ b> Xa is fixed to the first plate portion 301 of the plate member 30, and the specific discharge header component 2 </ b> Xb is fixed to the second plate portion 302. Specifically, of the pair of first protruding pipe portions 21 included in the specific supply header component 2Xa, the pipe stacking direction DRst protrudes to the side opposite to the specific electronic component 4X side (that is, one side in the pipe stacking direction DRst). The first protruding pipe portion 21a is joined to the first plate portion 301 in a state of being fitted into the first medium flow hole 301a. At the same time, of the pair of second projecting tube portions 22 included in the specific discharge header component 2Xb, the second projecting tube portion 22a projecting to the one side in the tube stacking direction DRst is fitted into the second medium flow hole 302a. In this state, it is joined to the second plate portion 302.

  Here, the first projecting tube portion 21 a joined to the first plate portion 301 is a projecting tube portion constituting the medium inlet 11 a of the supply header 11, and the second projecting tube portion 21 a joined to the second plate portion 302. The protruding tube portion 22 a is a protruding tube portion that constitutes the medium outlet 12 a of the discharge header 12. Therefore, for the convenience of describing these protruding tube portions 21a and 22a, these protruding tube portions 21a and 22a are denoted by different reference numerals in order to distinguish them from the other protruding tube portions 21 and 22.

  As shown in FIG. 1, the outer shell plate 27 provided at the other end of the main body portion 20 of the cooler 10 in the tube stacking direction DRst does not have the protruding tube portions 21, 22, and the outer shell thereof. The plate 27 is closed. That is, in the cooling pipe 2 positioned at the other end in the pipe stacking direction DRst among the plurality of cooling pipes 2, the protruding pipe portions 21 and 22 are not provided on the other side in the pipe stacking direction DRst.

  As shown in FIG. 5, the cooling pipe 2 has a pair of inner fins 29 that are stacked in the pipe stacking direction DRst across the intermediate plate 28 at a portion that forms the intermediate pipe forming portion 2 c. . The inner fin 29 is disposed between the intermediate plate 28 and each outer shell plate 27 and is formed into a wave shape, for example, to promote heat exchange of the refrigerant. In other words, the intermediate refrigerant flow path 2d is formed between the intermediate plate 28 and each outer shell plate 27 in the intermediate pipe constituting portion 2c, and the inner fins 29 are disposed in the intermediate refrigerant flow path 2d. Yes. The outer shell plate 27, the intermediate plate 28, and the inner fin 29 are brazed to each other to constitute the cooling pipe 2.

  Next, the operation of the cooler module 1 of the present embodiment will be described.

  First, the refrigerant is supplied from the first medium flow hole 301a of the plate member 30 to the supply header 11 through the first protruding pipe portion 21a of the specific cooling pipe 2X. The supplied refrigerant is distributed from the supply header 11 to each of the plurality of intermediate pipe components 2c. That is, the first plate portion 301 having the first medium flow hole 301 a causes the refrigerant to flow out from the first plate portion 301 to the plurality of cooling pipes 2.

  The refrigerant that has flowed out of the first plate portion 301 passes through the plurality of intermediate pipe constituting portions 2c, and is then collected in the discharge header 12. The recovered refrigerant is discharged to the second medium circulation hole 302a of the plate member 30 through the second protruding pipe portion 22a of the specific cooling pipe 2X. That is, the refrigerant flows from the plurality of cooling pipes 2 into the second plate portion 302 having the second medium circulation hole 302a.

  As the refrigerant flows in this manner, each electronic component 4 is cooled by the refrigerant in the two intermediate tube components 2 c that are in close contact with the electronic component 4.

  Next, the assembly of the cooler module 1 of the present embodiment will be described using the flowchart of FIG.

  First, in the first step S101 of FIG. 6, the plurality of cooling pipes 2, the plate member 30, the case 40, and the plurality of electronic components 4 shown in FIG. 1 are separately prepared. The outer shell plate 27, the intermediate plate 28, and the inner fin 29, which are components of the cooling pipe 2 at this time, are coupled to each other by caulking, for example, to form the cooling pipe 2. Has not yet been done.

  After preparing the cooling pipes 2 and the like, a plurality of cooling pipes 2 are stacked in the pipe stacking direction DRst. At this time, for each of the two cooling pipes 2 adjacent to each other among the plurality of cooling pipes 2, the first protruding pipe parts 21 facing each other are fitted to each other, and the second protruding pipe parts 22 facing each other. Fit each other. In the state in which the first projecting tube portions 21 are fitted and the second projecting tube portions 22 are fitted, the intermediate tube constituting portions 2c of the two adjacent cooling tubes 2 are mutually connected. In this case, an interval for inserting the electronic component 4 is increased.

  Moreover, after preparing the cooling pipe 2 etc., the specific cooling pipe 2X and the plate member 30 are assembled in parallel with, for example, laminating a plurality of cooling pipes 2. That is, the first projecting tube portion 21a of the specific supply header component 2Xa is fitted into the first medium flow hole 301a of the plate member 30, and the second projecting tube portion 22a of the specific discharge header component 2Xb is inserted into the first member 30a of the plate member 30. Fit into the two medium flow holes 302a. At this time, the plate joint surface 303b of the plate member 30 is brought into contact with the specific intermediate pipe constituting portion 2Xc of the specific cooling pipe 2X.

  When the assembly of the specific cooling pipe 2X and the plate member 30 and the stacking of the cooling pipes 2 are completed, a plurality of cooling pipes 2 and plate members 30 and the like are formed by a joining technique such as brazing, as shown in FIG. Each component of the cooler 10 is joined and integrated. At the same time, airtightness is ensured at the joint portion of each component. In FIG. 7, the cooler 10a before the electronic component 4 is clamped between the cooling pipes 2 is displayed.

  Specifically, in the joining of the component parts, the supply header 11 is configured by joining the first protruding pipe portions 21 that are fitted to each other. At the same time, the second projecting pipe portions 22 that are fitted to each other are joined together to form the discharge header constituting portion 2b. That is, a plurality of cooling pipes 2 are joined to each other at the supply header component 2a and the discharge header component 2b. For each cooling pipe 2, the pair of outer shell plates 27, the intermediate plate 28, and the pair of inner fins 29 are also joined to each other to complete the cooling pipe 2.

  Further, the specific supply header component 2Xa of the specific cooling pipe 2X is joined to the first plate portion 301 of the plate member 30 as shown in FIG. 8, and similarly, the specific discharge header component 2Xb is connected to the second plate portion 302. Be joined. In addition, the specific intermediate pipe component 2Xc is joined in contact with the intermediate plate 303. The specific cooling pipe 2X is fixed to the plate member 30 by these joining. In the joining of the specific supply header constituting portion 2Xa and the first plate portion 301, the joining is performed at the portion 21b of the first protruding tube portion 21a that is in close contact with the inner wall surface of the first medium flow hole 301a. The same applies to the joining of the specific discharge header constituting portion 2Xb and the second plate portion 302.

  When the first step S101 in FIG. 6 is completed, the main body 20 is accommodated in the case 40 as shown in FIG. 1 in a second step S102 following the first step S101. At this time, the plate member 30 is arranged with respect to the case 40 so as to cover the opening 401 of the case 40 with the plate member 30. In addition, an elastic member 46 such as a spring is disposed between the bottom of the case 40 and the cooler 10 in the tube stacking direction DRst. As a result, the cooler 10 is supported by the bottom of the case 40 via the elastic member 46.

  When the second step S102 of FIG. 6 is completed, in the third step S103 following the second step S102, as shown in FIG. For each tube component 2c, a plurality of electronic components 4 are inserted and arranged between the adjacent two intermediate tube components 2c from the opening 402 side.

  When the third step S103 of FIG. 6 is completed, in a fourth step S104 following the third step S103, as shown in FIGS. 1 and 2, a plurality of fastening members 42, for example, fastening bolts, are attached to the plate member 30. The case 40 is fastened through bolt holes formed at the four corners. At this time, the main body 20 is sandwiched between the plate member 30 and the bottom of the case 40, and the pressing force applied to the plurality of fastening members 42 from a tool such as a driver causes the plate member 30 to be pressed. Via the main body 20.

  This pressing force is a force directed in the tube stacking direction DRst, and compresses the main body 20 of the cooler 10 in the tube stacking direction DRst. Therefore, between the plate member 30 and the specific cooling pipe 2X, the first plate portion 301 presses the specific supply header component 2Xa in the state of being joined to each other in the tube stacking direction DRst, and the second plate portion 302 The specific discharge header component 2Xb is pressed in the tube stacking direction DRst in a state where the specific discharge header component 2Xb is bonded to each other. At the same time, the intermediate plate portion 303 is bonded to the side opposite to the specific electronic component 4X side of the specific intermediate tube component 2Xc in the tube stacking direction DRst (that is, one side of the tube stacking direction DRst). The specific intermediate pipe component 2Xc is pressed.

  Specifically, the pressing force applied to the fastening member 42 is applied to the first diaphragm portion 211 through the first projecting tube portion 21 for each outer shell plate 27 and simultaneously through the second projecting tube portion 22. It is given to the second diaphragm part 221. Therefore, due to the pressing force, the diaphragm portions 211 and 221 for each outer shell plate 27 are moved in the pipe stacking direction DRst toward the inside of the header constituting portions 2a and 2b in the supply header constituting portion 2a and the discharge header constituting portion 2b. Dent. For example, the first diaphragm portion 211 after the depression is as shown in FIG.

  When the pressing force in the tube stacking direction DRst is applied and the diaphragm portions 211 and 221 are depressed, the intermediate tube constituting portion 2c in each of the two adjacent cooling tubes 2 among the plurality of cooling tubes 2 shown in FIG. The mutual interval is reduced. As a result, the intermediate tube components 2c of the two adjacent cooling tubes 2 are in close contact with the electronic components 4 disposed between the intermediate tube components 2c.

  As described above, in the fourth step S104, the plurality of cooling tubes 2 are brought into close contact with the plurality of electronic components 4 by compressing the main body portion 20 including the plurality of cooling tubes 2 with the plate member 30 in the tube stacking direction DRst. Let

  When the fourth step S104 is completed, the cooler 10 is in a state in which a pressing force is applied to the main body 20 between the elastic member 46 and the plate member 30 from the elastic member 46 in the tube stacking direction DRst. Thus, the assembly of the cooler module 1 is completed.

  As described above, according to the present embodiment, the intermediate plate portion 303 included in the plate member 30 in FIG. 1 is bonded to the side opposite to the specific electronic component 4X side of the specific intermediate tube component 2Xc in the tube stacking direction DRst. In this state, the specific intermediate pipe constituting portion 2Xc is pressed. Here, for example, when the intermediate plate part 303 is not joined to the specific intermediate pipe constituting part 2Xc but merely abutting, the specific cooling pipe is caused by a compressive load that presses the specific intermediate pipe constituting part 2Xc. There is a possibility that 2X is deformed so as to wave in the tube stacking direction DRst as indicated by a broken line TFw in FIG. FIG. 9 is an enlarged cross-sectional view around the specific supply header component 2Xa, but the specific discharge header component 2Xb may be deformed in the same manner as the broken line TFw in FIG.

  In contrast, in the present embodiment, the specific cooling pipe 2X undulates due to the compressive load that presses the specific intermediate pipe component 2Xc by joining the intermediate plate portion 303 and the specific intermediate pipe component 2Xc ( In other words, the warp of the specific cooling pipe 2X) is prevented. As a result, when the electronic component 4 is sandwiched between the cooling pipes 2 as compared with the case where the intermediate plate part 303 is not joined to the specific intermediate pipe constituting part 2Xc but merely abutting, The flatness deterioration of the flat surface of the component 2Xc can be suppressed, and the clearance between the specific cooling pipe 2X and the specific electronic component 4X can be reduced. And it is possible to improve the heat transfer property between the specific cooling pipe 2X and the specific electronic component 4X.

  Further, according to the present embodiment, in the method for manufacturing the cooler module 1, the specific supply header component 2Xa is joined to the first plate 301 by brazing or the like, and the specific discharge header component 2Xb is connected to the second plate 302. The specific intermediate pipe component 2Xc is joined to the intermediate plate part 303 by brazing or the like. The specific cooling pipe 2X is fixed to the plate member 30 by these joining. At the same time, a plurality of electronic components 4 are inserted between the intermediate tube constituent portions 2c of the plurality of cooling tubes 2, respectively. Further, after the insertion and the fixing of the specific cooling pipe 2X to the plate member 30, the plurality of cooling pipes 2 are compressed by the plate member 30 in the pipe stacking direction DRst, so that the plurality of cooling pipes 2 are converted into a plurality of electrons. Adhere to the part 4. Thereby, after the close contact, the clearance between the specific cooling pipe 2X and the specific electronic component 4X can be reduced in the same manner as described above, and the heat transfer property between the specific cooling pipe 2X and the specific electronic component 4X can be reduced. It is possible to improve.

  According to the present embodiment, the intermediate plate portion 303 of the plate member 30 is formed with a plurality of grooves 303c recessed from the plate joining surface 303b, as shown in FIGS. Here, for example, when the specific intermediate pipe component 2Xc is joined to the plate joining surface 303b by brazing or the like without the groove 303c being formed, the flux used for the joining is There is a possibility that the specific intermediate pipe constituting portion 2Xc and the plate joint surface 303b cannot be completely removed and voids are generated on the plate joint surface 303b. On the other hand, in the cooler module 1 of the present embodiment, the groove 303c of the plate joint surface 303b can function as a flux escape path to prevent generation of voids.

  Further, according to the present embodiment, as shown in FIGS. 1 and 5, in each of the plurality of cooling pipes 2, the supply header component 2 a includes a pair of first protruding pipe parts 21 and a pair of first diaphragm parts. 211, and the discharge header constituting part 2b has a pair of second projecting pipe parts 22 and a pair of second diaphragm parts 221. Further, between the adjacent cooling pipes 2, the first protruding pipe parts 21 facing each other are joined in a fitted state, and the second protruding pipe parts 22 facing each other are also fitted together. Are joined together. In addition, the first protruding pipe portion 21a that protrudes to the opposite side of the specific electronic component 4X side in the tube stacking direction DRst in the specific supply header component 2Xa is fitted into the first medium flow hole 301a of the first plate portion 301. In this state, it is joined to the first plate portion 301. In addition, the second projecting tube portion 22a that protrudes to the opposite side of the specific electronic component 4X side in the tube stacking direction DRst in the specific discharge header component 2Xb is fitted into the second medium flow hole 302a of the second plate portion 302. In this state, it is joined to the second plate portion 302.

  Therefore, a plurality of cooling pipes 2 can be easily stacked by joining the first projecting tube portions 21 facing each other and joining the second projecting tube portions 22 facing each other. It is possible to obtain a structure that allows the first diaphragm portion 211 and the second diaphragm portion 221 to allow the electronic component 4 to be sandwiched between the cooling pipes 2.

  Further, according to the present embodiment, the first plate portion 301 of the plate member 30 causes the refrigerant to flow out from the first plate portion 301 to the plurality of cooling tubes 2, and the second plate portion 302 has a plurality of cooling tubes. The refrigerant flows from 2. Accordingly, the function of distributing and supplying the refrigerant to the plurality of cooling pipes 2 and the function of collecting the refrigerant flowing out of the plurality of cooling pipes 2 can be integrated into the plate member 30.

  Further, according to the present embodiment, the bending rigidity of the plate member 30 with respect to the bending in the tube stacking direction DRst is larger than that of the specific cooling tube 2X. Therefore, it is possible to apply a compressive load for sandwiching the plurality of electronic components 4 to the plurality of cooling tubes 2 to the plurality of cooling tubes 2 with a sufficient size by the plate member 30.

  Moreover, according to this embodiment, the cooler module 1 is provided with the case 40 in which the plurality of cooling pipes 2 are accommodated and the plate member 30 is fixed. Therefore, it is possible to protect a plurality of cooling pipes 2 by the case 40. At the same time, the case 40 can be provided with a function of applying a compressive load to the main body 20 of the cooler 10.

(Second Embodiment)
Next, a second embodiment will be described. In the present embodiment, differences from the first embodiment will be mainly described. The same or equivalent parts as those in the first embodiment will be omitted or simplified for explanation.

  FIG. 10 is a cross-sectional view showing a connecting portion for connecting a plurality of cooling pipes 2 in the present embodiment, and is a view showing a characteristic portion different from the first embodiment. As shown in FIG. 10, in this embodiment, a plurality of cooling pipes 2 are connected to each other by bellows pipes 51 and 52. This point is different from the first embodiment. Accordingly, in the present embodiment, the plurality of cooling pipes 2 are arranged between the adjacent two cooling pipes 2 among the plurality of cooling pipes 2 and the protruding pipe parts 21 and 22 and the diaphragm parts that are fitted to each other. 211 and 221 are not provided. Instead, the supply header 11 and the discharge header 12 have bellows pipes 51 and 52, respectively.

  The cooler module 1 of the present embodiment and the cooler module 1 of the first embodiment described above are the same except for the supply header 11 and the discharge header 12. Therefore, the supply header 11 and the discharge header 12 in the cooler module 1 of the present embodiment will be described.

  Note that both the supply header 11 and the discharge header 12 have bellows pipes 51 and 52, and these bellows pipes 51 and 52 have the same mechanical structure as each other. The vicinity of the header 11 is shown, and the display near the discharge header 12 is omitted.

  The supply header 11 included in the cooler module 1 of the present embodiment includes a plurality of first bellows pipes 51 that can expand and contract in the tube stacking direction DRst. The discharge header 12 has a plurality of second bellows pipes 52 that can expand and contract in the tube stacking direction DRst. Although the first bellows pipe 51 and the second bellows pipe 52 are the same as a single body, their names are different from each other because their locations are different. Therefore, the bellows pipe shown in FIG. 10 is the first bellows pipe 51, but in FIG. 10, the reference sign of the second bellows pipe 52 is written together with the reference sign of the first bellows pipe 51.

  As shown in FIG. 10, the 1st bellows pipe 51 is arrange | positioned between each supply header structure part 2a which the two adjacent cooling pipes 2 of the several cooling pipes 2 have, The supply header Each component 2a is connected to each other. Similarly, the second bellows pipe 52 is disposed between the discharge header components 2b of the two adjacent cooling tubes 2 of the plurality of cooling tubes 2, and the discharge header components 2b are connected to each other.

  Specifically, the first bellows pipe 51 and the second bellows pipe 52 are bellows-like pipes that connect two adjacent cooling pipes 2 among the plurality of cooling pipes 2. The bellows pipes 51 and 52 are configured such that the deformed portions 54 and 55 are alternately arranged one by one in the tube stacking direction DRst. The deformed portion 54 of the first bellows pipe 51 is formed to be recessed inward in the radial direction with the axis of the supply header 11 as the center. The deformed portion 55 of the first bellows pipe 51 is formed so as to protrude outward in the radial direction around the axis of the supply header 11. The deformed portions 54 and 55 of the second bellows pipe 52 are different from the deformed portions 54 and 55 of the first bellows pipe 51 only in that the axis of the supply header 11 is replaced with the axis of the discharge header 12. This is the same as the deformed portions 54 and 55 of the bellows pipe 51.

  In the present embodiment configured as described above, when the cooler 10 is compressed by the pressing force in the tube stacking direction DRst, the bellows pipes 51 and 52 are compressed in the tube stacking direction DRst in the supply header 11 and the discharge header 12. The At this time, the space | interval between the intermediate | middle pipe | tube structure parts 2c which each two adjacent cooling pipes 2 among the several cooling pipes 2 have is narrowed compared with before compression. That is, when the bellows pipes 51 and 52 are compressed and deformed, the interval between the two intermediate tube components 2c adjacent to each other with the electronic component 4 interposed therebetween is narrowed. Therefore, the two adjacent intermediate tube components 2c and the electronic component 4 are in close contact with each other, and the electronic component 4 is sandwiched between the two cooling tubes 2 each having the two adjacent intermediate tube components 2c. The

  Thereby, the main body 20 of the cooler 10 illustrated in FIG. 1 is in a state in which a pressing force is applied from the elastic member 46 to the tube stacking direction DRst between the elastic member 46 and the plate member 30.

  In the present embodiment described above, the effects produced from the configuration common to the first embodiment described above can be obtained as in the first embodiment.

  Further, according to the present embodiment, the two cooling pipes 2 adjacent to each other are arranged between the two adjacent cooling pipes 2 in a state where the first bellows pipe 51 and the second bellows pipe 52 are compressed. It is in close contact with the sandwiched electronic component 4. Accordingly, the cooling pipe 2 is not required to be deformed by the header constituent parts 2a and 2b, and is compressed between the two cooling pipes 2 adjacent to each other in the pipe stacking direction DRst by the compression deformation of the bellows pipes 51 and 52. The sandwiched electronic component 4 and the two adjacent cooling pipes 2 can be brought into close contact with each other.

  In the present embodiment, the specific supply header component 2 </ b> Xa illustrated in FIG. 1 may be joined to the first plate portion 301 of the plate member 30 via the first bellows pipe 51. Alternatively, the specific supply header component 2Xa has the first protruding tube portion 21a on the first plate portion 301 side in the same manner as in the first embodiment, and the first protruding tube portion 21a provides the first plate portion 301 with the first protruding tube portion 21a. It may be joined. The same applies to the specific discharge header component 2Xb.

(Other embodiments)
(1) In each of the above-described embodiments, as shown in FIGS. 3 and 4, the plurality of grooves 303c formed in the intermediate plate portion 303 of the plate member 30 has a predetermined mutual interval in the tube longitudinal direction DRtb, for example. Although arranged side by side, the shape of the groove 303c is not limited to this. For example, as shown in FIG. 11 corresponding to FIG. 4 of the first embodiment, the plurality of grooves 303c extend over the entire length of the joint portion 303a in the tube longitudinal direction DRtb, and have a predetermined mutual interval in the tube width direction DRw. May be arranged side by side. Further, as shown in FIG. 12 corresponding to FIG. 4, the grooves 303c of the intermediate plate portion 303 may be formed in a lattice shape. In the case of FIG. 12, the number of grooves 303c is one. As described above, the shape, number, and dimensions of the groove 303c may be determined as appropriate.

  (2) In each of the above-described embodiments, the cooler module 1 cools the electronic component 4 used in an automobile, but the cooler module 1 is not limited to an automobile and is used for an application other than an automobile. There is no problem.

  (3) In each of the above-described embodiments, the cooler module 1 is a device that cools the electronic component 4 as the heat exchange object, but the heat exchange object may not be the electronic component 4. For example, the heat exchange object may be a mechanical structure that is not energized.

  (4) In each of the above-described embodiments, as shown in FIG. 1, one electronic component 4 is arranged for each one of the cooling pipes 2, but for one interval between the cooling pipes 2. A plurality of electronic components 4 may be arranged side by side in the tube longitudinal direction DRtb.

  (5) In each of the above-described embodiments, as shown in FIG. 5, the cooling pipe 2 has the intermediate plate 28, but the cooling pipe 2 that does not have the intermediate plate 28 can also be considered.

  (6) In each of the embodiments described above, the electronic component 4 is sandwiched between the cooling pipes 2 of the cooler 10, whereby the refrigerant in the cooling pipe 2 can exchange heat with the electronic components 4. In this respect, for example, the electronic component 4 may be disposed in a state of being in direct contact with the cooling pipe 2. Alternatively, if necessary, an insulating plate such as ceramic may be interposed between the electronic component 4 and the cooling pipe 2, or thermally conductive grease may be interposed. In short, the contact between the cooling pipe 2 and the electronic component 4 is not limited to direct contact but may be indirect contact.

  The present invention is not limited to the above-described embodiment, and can be implemented with various modifications. In each of the above-described embodiments, it is needless to say that elements constituting the embodiment are not necessarily essential unless explicitly stated as essential and clearly considered essential in principle. Yes. Further, in each of the above embodiments, when numerical values such as the number, numerical value, quantity, range, etc. of the constituent elements of the embodiment are mentioned, it is clearly limited to a specific number when clearly indicated as essential and in principle. The number is not limited to the specific number except for the case. In each of the above embodiments, when referring to the material, shape, positional relationship, etc. of the constituent elements, etc., unless otherwise specified, or in principle limited to a specific material, shape, positional relationship, etc. The material, shape, positional relationship, etc. are not limited.

2 Cooling tube 2X Specific cooling tube 2a Supply header component (first tube component)
2b Discharge header component (second pipe component)
2c Intermediate tube component 4 Electronic parts (heating element)
30 Plate member 301 First plate portion 302 Second plate portion 303 Intermediate plate portion

Claims (8)

A cooler module that cools the plurality of heating elements by exchanging heat between the plurality of heating elements (4) and the cooling medium,
An intermediate tube component (2c) extending in the longitudinal direction (DRtb), and a first tube component (2a) extending from the intermediate tube component and disposed on one side of the intermediate tube component in the longitudinal direction; A second pipe constituent part (2b) extending from the intermediate pipe constituent part and disposed on the other side of the intermediate pipe constituent part in the longitudinal direction, and in a stacking direction (DRst) intersecting the longitudinal direction A plurality of cooling pipes (2) stacked alternately with the plurality of heating elements and sandwiching the plurality of heating elements at the intermediate pipe constituting part;
Among the plurality of cooling pipes, the specific cooling pipe (2X) located at one end in the stacking direction is disposed on the one side in the stacking direction, and the first pipe component of the specific cooling pipe A first plate part (301) to which a specific first pipe constituent part (2Xa) is joined and a specific second pipe constituent part (2Xb) which is the second pipe constituent part of the specific cooling pipe are joined to each other. A plate member (30) having a plate portion (302) and an intermediate plate portion (303) connecting between the first plate portion and the second plate portion;
Each of the intermediate pipe constituent parts of the plurality of cooling pipes has a flat cross-sectional shape with the laminating direction as a short direction, and a heating element in contact with the intermediate pipe constituent part among the plurality of heating elements, and the Heat exchange with the cooling medium flowing in the intermediate pipe component,
The specific intermediate pipe component (2Xc) that is the intermediate pipe component of the specific cooling pipe is in contact with the specific heating element (4X) adjacent to the specific intermediate pipe component among the plurality of heating elements,
The cooler module that presses the specific intermediate tube component in a state in which the intermediate plate is bonded to the side of the specific intermediate tube component that is opposite to the specific heating element in the stacking direction. The intermediate plate part has a plate joint surface (303b) joined to the specific intermediate pipe component part,
The cooler module according to claim 1, wherein a groove (303c) recessed from the plate joint surface is formed in the intermediate plate portion. In each of the plurality of cooling pipes including the specific cooling pipe, the first pipe constituent part includes a pair of first protruding pipe parts (21) protruding on both sides in the stacking direction, and the pair of first protruding parts. A pair of first easily deformable portions (211) that are recessed in the stacking direction at each proximal end of the tube portion, and the second tube component portion is a pair of second protrusions protruding on both sides in the stacking direction. A pipe part (22), and a pair of second easily deformable parts (221) recessed in the stacking direction at the base ends of the pair of second projecting pipe parts,
The first projecting pipe parts facing each other between adjacent cooling pipes of the plurality of cooling pipes are joined in a mutually fitted state, and the second projecting pipe parts facing each other are also mutually connected. Joined in a mated state,
A first medium flow hole (301a) through which a cooling medium flows is formed in the first plate part of the plate member, and a second medium flow hole (302a) through which the cooling medium flows is formed in the second plate part. And
Of the pair of first projecting tube portions of the specific first tube component, the first projecting tube portion (21a) projecting to the side opposite to the specific heating element side in the stacking direction is the first medium flow hole. Is joined to the first plate portion in a state of being fitted in,
Of the pair of second projecting tube portions of the specific second tube component, the second projecting tube portion (22a) projecting to the side opposite to the specific heating element side in the stacking direction is the second medium flow hole. The cooler module according to claim 1, wherein the cooler module is joined to the second plate portion in a state of being fitted into the second plate portion. Arranged between the first pipe constituent parts of the two adjacent cooling pipes of the plurality of cooling pipes, the first pipe constituent parts are connected to each other, and can be expanded and contracted in the stacking direction. First bellows pipe (51),
Arranged between the second pipe constituent parts of the two adjacent cooling pipes of the plurality of cooling pipes, and connect the second pipe constituent parts to each other, and can be expanded and contracted in the stacking direction. A second bellows pipe (52),
The two adjacent cooling pipes generate heat that is sandwiched between the two adjacent cooling pipes among the plurality of heating elements in a state where the first bellows pipe and the second bellows pipe are compressed. The cooler module according to claim 1 or 2, which is in close contact with the body. The first plate portion causes the cooling medium to flow out from the first plate portion to the plurality of cooling pipes,
The cooler module according to any one of claims 1 to 4, wherein a cooling medium flows into the second plate portion from the plurality of cooling pipes.   The cooler module according to any one of claims 1 to 5, wherein a bending rigidity of the plate member with respect to bending in the stacking direction is larger than that of the specific cooling pipe.   The cooler module according to any one of claims 1 to 6, further comprising a case (40) that accommodates the plurality of cooling pipes and to which the plate member is fixed. A method of manufacturing a cooler module for cooling a plurality of heating elements by exchanging heat between the plurality of heating elements (4) and a cooling medium,
An intermediate tube component (2c) extending in the longitudinal direction (DRtb) and having a flat cross-sectional shape, and a first tube configuration extending from the intermediate tube component and disposed on one side of the intermediate tube component in the longitudinal direction A plurality of sections (2a) and a second pipe constituent section (2b) extending from the intermediate pipe constituent section and disposed on the other side of the intermediate pipe constituent section in the longitudinal direction. A cooling pipe (2);
Preparing a plate member (30) having a first plate portion (301), a second plate portion (302), and an intermediate plate portion (303) connecting between the first plate portion and the second plate portion; When,
After the preparation, the plurality of cooling pipes are laminated at intervals between the intermediate pipe constituent portions in a laminating direction (DRst) that intersects the longitudinal direction and extends along the short direction of the flat cross-sectional shape. To do
After the stacking, joining a plurality of cooling pipes to each other in the first pipe constituent part and the second pipe constituent part;
After the preparation, the first pipe component (2Xa) of the specific cooling pipe (2X) located at one end in the stacking direction among the plurality of cooling pipes is joined to the first plate part. By joining the second pipe constituent part (2Xb) of the specific cooling pipe to the second plate part and joining the intermediate pipe constituent part (2Xc) of the specific cooling pipe to the intermediate plate part Fixing the specific cooling pipe to the plate member;
After joining the plurality of cooling pipes to each other, respectively inserting the plurality of heating elements between the intermediate pipe constituent parts;
After the fixing and the inserting, the plurality of cooling pipes are compressed in the laminating direction by the plate member to bring the plurality of cooling pipes into close contact with the plurality of heating elements. Method for manufacturing a container module.

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