JP2009021404A - Cooling device for electronic component, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling device capable of making the surface pressure applied between a cooling tube and an electronic component uniform more easily than before, and to provide a manufacturing method thereof. <P>SOLUTION: A cooling unit 3 and a case 2 are so prepared that the linear expansion coefficient of the cooling unit 3 in the lamination direction of the cooling tube and the electronic component is larger than that of the case 2, and the electronic component 10 is arranged between a pair of cooling tubes 21 and thus the cooling unit 3 is assembled under a temperature atmosphere lower than the use environment temperature of the electronic component 10, e.g. -40°C, and then the cooling unit 3 is received in the case 2. Thereby, at a temperature higher than the temperature upon the assembling, i.e. at the use environment temperature of the electronic component 10 and upon the heat production of the electronic component 10, the cooling unit is pressed by the case due to the expansion of the cooling unit in the lamination direction of the cooling tube and the electronic component. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component cooling apparatus and a method for manufacturing the same.

  There is a cooling device that cools an electronic component from both sides by sandwiching an electronic component that generates heat from both sides with a cooling tube through which a refrigerant flows (see, for example, Patent Documents 1 and 2).

In such a cooling device, it is required to reduce the contact thermal resistance between the cooling tube and the electronic component. Therefore, conventionally, as described in Patent Document 2, a cooling tube and an electronic component are sandwiched between a pair of plates, and the cooling tube and the electronic component are pressed using the pair of plates and bolts. A method has been proposed in which a cooling spring and an electronic component are pressed against each other by using a leaf spring to bring them into close contact with each other.
JP 2002-26215 A Japanese Patent Laying-Open No. 2005-45186 (FIGS. 8-9, 5 and 9)

  However, as in the conventional method described above, by using the tightening torque of the bolt and the elastic force of the leaf spring to press the cooling tube and the electronic component together, the cooling tube and the electronic component are Therefore, it is necessary to work and devise in order to make the surface pressure between them uniform, and it takes time to manufacture the cooling device.

  That is, in the method of pressing the cooling tube and the electronic component using a pair of plates and bolts, it is necessary to adjust the tightening of the bolt so that the surface pressure between the cooling tube and the electronic component is uniform. It becomes.

  Further, in the method of pressing the cooling tube and the electronic component using the leaf spring, as described in Patent Document 2, the cooling tube and the electronic component may be pressed through a flat plate. In the contact surface between the cooling tube and the electronic component, a surface pressure distribution is generated in which the pressure in the region where the portion where the leaf spring is in contact with the plate is higher than in other regions. For this reason, a device for making the surface pressure distribution uniform is required.

  An object of this invention is to provide the cooling device which can make the surface pressure applied between a cooling tube and an electronic component uniform more easily than the past, and its manufacturing method in view of the said point.

  In order to achieve the above object, according to the present invention, the product of the linear expansion coefficient and the longitudinal elastic modulus of the cooling unit (3) in the stacking direction of the cooling tube and the electronic component is the linear expansion coefficient and the longitudinal elasticity of the case (2). A cooling unit (3) and a case (2) made of a material having a predetermined linear expansion coefficient and longitudinal elastic modulus so as to have a relationship of greater than the product with the coefficient are prepared, and the electronic component (10) An electronic component is placed between the pair of cooling tubes (21) and the cooling unit (3) is assembled in a temperature atmosphere lower than the operating environment temperature, and then the cooling unit (3) is accommodated in the case (2). The cooling unit (3) is sandwiched between the cases (2) at the usage environment temperature of the electronic component (10).

  The cooling device manufactured in this way has a temperature higher than the temperature at the time of assembly, that is, at the usage environment temperature of the electronic component (10) and the heat generation of the electronic component (10). When the cooling unit expands in the stacking direction, the cooling unit is pressurized by the case, so that the electronic component and the cooling tube can be brought into close contact with each other.

  And according to this invention, since a cooling unit will be pressurized with the force by expansion | swelling of cooling unit itself, the surface pressure concerning a cooling tube and an electronic component can be made uniform. In addition, according to the present invention, the greater the amount of heat generated by the electronic component, the greater the adhesion between the electronic component and the cooling tube, so that the adhesion between the two can be improved and high cooling performance is achieved. can get.

  In the present invention, the temperature lower than the use environment temperature of the electronic component (10) is, for example, a temperature lower than −30 ° C. and the electronic component can withstand.

  Moreover, in this invention, it is preferable to interpose a rubber member (30) between an electronic component and a cooling tube, for example. This is because by interposing a flexible rubber member between the electronic component and the cooling tube, when the applied pressure from the case due to expansion of the cooling unit is excessive, the applied pressure can be relaxed.

  Further, in the present invention, for example, between the cooling unit (3) and the case (2) in the stacking direction, members (51, 52) that expand in the stacking direction as the temperature rises, or as the temperature rises A member (53) whose shape changes in the stacking direction may be disposed.

  As a result, the member placed between the cooling unit and the case expands or deforms in the stacking direction, so that the pressure applied to the cooling unit from the case can be increased, and the electronic component and the cooling tube are in close contact during heat generation. The contact resistance can be further improved and the contact thermal resistance can be further reduced.

  In the present invention, for example, after the cooling unit (3) is housed in the case (2), the pressurizing means (2a, 2) provided in the case at a temperature lower than the use environment temperature of the electronic component (10). 61) may be used to pressurize the cooling unit (3) in the stacking direction by applying a compressive force from the case (2) to the cooling unit (3).

  In addition, the code | symbol in the bracket | parenthesis of each means described in the claim and this column is an example which shows a corresponding relationship with the specific means as described in embodiment mentioned later.

(First embodiment)
This embodiment is an example in which the present invention is applied to a cooling device for a semiconductor module that constitutes an HEV (hybrid vehicle) inverter as an electronic component. In FIG. 1, the top view of the cooling device of the electronic component in 1st Embodiment of this invention is shown. FIG. 2 shows a cross-sectional view in the direction of arrows AA in FIG.

  As shown in FIG. 1, an electronic component cooling device 1 according to the present embodiment has a configuration in which an electronic component cooling unit 3 is housed in a case 2. The cooling unit 3 includes an electronic component 10, The cooler 20 cools the electronic component 10.

  The cooler 20 includes a plurality of cooling tubes 21 constituting the refrigerant flow path 2 through which the refrigerant flows, a supply header portion 22 that distributes and supplies the refrigerant to each cooling tube 21, and refrigerant discharged from each cooling tube 21. And a discharge header portion 23 that is distributed.

  The cooling tube 21 provides heat exchange between the electronic component 10 and the refrigerant. The cooling tubes 21 are arranged in parallel to each other, the electronic component 10 is arranged between the adjacent cooling tubes 21, and the electronic component 10 is sandwiched between the pair of cooling tubes 21. That is, the cooling tube 21 is disposed in contact with one main plane of the electronic component 10, and the cooling tube 21 is disposed in contact with the other main plane of the electronic component 10.

  In the present embodiment, in order to simultaneously cool a plurality of electronic components 10, a plurality of electronic components 10 and a plurality of cooling tubes 21 are alternately arranged in the vertical direction in FIG. A plurality of electronic components are also arranged between 21 in the left-right direction in FIG. Cooling tubes 21 are disposed at both ends of the cooler 20 in the stacking direction in which a plurality of electronic components 10 and a plurality of cooling tubes 21 are stacked.

  Further, in the present embodiment, the stacking direction is arranged on both sides of the cooling tube 21 in the stacking direction (vertical direction in FIG. 1) of the cooling tubes 21 (upper and lower sides in FIG. 1 of the cooling tube 21). The projecting pipe parts 24 and 25 that are open and projecting are provided, and the projecting pipe parts 24 and 25 of the adjacent cooling tubes 21 are fitted together to form the supply header part 22 and the discharge header part 23. Yes.

   Further, on one end side (lower end side in FIG. 1) of the cooler 20, a refrigerant for introducing a refrigerant into the supply header portion 22 into the cooling tube 21 arranged at one end in the stacking direction among the plurality of cooling tubes 21. An inlet 26 and a refrigerant outlet 27 for discharging the refrigerant from the discharge header portion 23 are provided. A refrigerant inlet pipe 28 and a refrigerant outlet pipe 29 are provided in each of the refrigerant inlet 26 and the refrigerant outlet 27. Is fitted.

  In the present embodiment, as indicated by the arrows in FIG. 1, the refrigerant flows into the cooler 20 from the refrigerant introduction pipe 28, flows through the cooler 20, and then flows out of the refrigerant discharge pipe 29. And after a refrigerant | coolant flows in into the radiator which is not shown in figure and the heat | fever of a refrigerant | coolant is discharge | released with a radiator, the refrigerant | coolant which flowed out from the radiator flows into the cooler 20 again.

  Examples of the refrigerant include water mixed with ethylene glycol antifreeze, natural refrigerants such as water and ammonia, fluorocarbon refrigerants such as fluorinate, chlorofluorocarbon refrigerants such as HCFC123 and HFC134a, and alcohol refrigerants such as methanol and alcohol. A ketone-based refrigerant such as acetone can be used.

  Next, the electronic component 10 and the pair of cooling tubes 21 sandwiching the electronic component 10 will be described in detail.

  As shown in FIG. 2, in order to insulate between the electronic component 10 and the cooling tube 21, a plate-like insulating member 30 made of ceramic is interposed between the electronic component 10 and the cooling tube 21. Yes.

  As shown in FIG. 2, one cooling tube 21 has a flat shape, a pair of outer shell plates 31, 32, an intermediate plate 33 disposed between the pair of outer shell plates 31, 32, A wave-shaped inner fin 34 disposed between the intermediate plate 33 and the outer shell plates 31 and 32 is provided.

  The outer shell plates 31, 32, the intermediate plate 33, and the inner fins 34 are made of aluminum, and the cooling tube 21 is configured by joining them by a joining technique such as brazing.

  The outer shell plates 31 and 32 constituting the outer shell of the cooling tube 21 include a portion constituting a flat tube for contacting the electronic component 10 and taking heat away, a supply header portion 22 and a discharge header portion 23 (FIG. 1). Part). The intermediate plate 33 has a rectangular plate shape and has circular openings corresponding to the supply header portion 22 and the discharge header portion 23 (see FIG. 1) at both ends thereof.

  The electronic component 10 is a semiconductor module including a semiconductor element 41 and a diode 42 that control high power, such as an IGBT. The semiconductor element 41 and the diode 42 are plate-shaped, and are sandwiched between a pair of plate-shaped heat radiating members 43, and the semiconductor element 41, the diode 42, and the heat radiating member are exposed with the outer surface of the heat radiating member 43 exposed. 43 is sealed with a mold resin 44. In the present embodiment, a copper heat radiating member 43 is used.

  The electronic component 10 has a rectangular parallelepiped shape (plate shape) with a flat outer shape. Although not shown, the power electrode extends from one long side outer peripheral surface and is controlled from the other long side outer peripheral surface. The service electrode extends.

  As described above, in the present embodiment, the electronic component cooling unit 3 is configured in which a plurality of electronic components 10 and a plurality of cooling tubes 21 are alternately stacked.

  Further, as shown in FIG. 1, the case 2 accommodates the cooling unit 3 in the state where the cooling unit 3 is held. Under the usage environment temperature of the electronic component 10, the internal dimension L2 of the case 2 in the stacking direction (vertical direction in FIG. 1) of the electronic component 10 and the cooling tube 21 is equal to the external dimension L3 of the cooling unit 3 in the same direction. It has become. Case 2 is made of ADC (aluminum die cast).

  Next, a method for manufacturing the cooling device 1 for an electronic component having the above-described configuration will be described.

  In the present embodiment, the cooling device 1 is assembled in a temperature atmosphere that is much lower than the operating environment temperature of the electronic component 10. Here, since the lowest temperature among the usage environment temperatures of the electronic component 10 is generally −30 ° C., the temperature is lower than −30 ° C. and the electronic component 10 can withstand. For example, the cooling device 1 is assembled in an atmosphere of −40 ° C.

  Specifically, a plurality of flat-shaped cooling tubes 21 provided with protruding tube portions 24 and 25 are produced. Then, the protruding tube portion 24 positioned on the other cooling tube 21 side in the adjacent one cooling tube 21 is inserted into the protruding tube portion 25 positioned on the one cooling tube 21 side in the other cooling tube 21. Then, they are fitted together, and the adjacent cooling tubes 21 are joined together. Thus, the cooler 20 is formed by laminating a plurality of cooling tubes 21.

  Next, the cooler 20 thus formed and the electronic component 10 are prepared, and these are assembled, for example, in a temperature atmosphere of −40 ° C. That is, the electronic component 10 is disposed between the pair of cooling tubes 21, and the cooler 20 is disposed in the stacking direction of the cooling tube 21 and the electronic component 10 so as to eliminate the gap between the electronic component 10 and the cooling tube 21. Squeeze. Thereby, the space | interval between the adjacent cooling tubes 21 is narrowed, the cooling tube 21 and the electronic component 10 contact | adhere through the insulating member 30, and the electronic component 10 will be in the state clamped by the cooling tube 21. . At this time, the electronic component 10 and the cooling tube 21 are in thermal contact with each other via the insulating member 30. In this way, the cooling unit 3 is assembled.

  Next, the assembled cooling unit 3 is accommodated in the case 2 in a temperature atmosphere of −40 ° C. Then, this is completed by returning the temperature from −40 ° C. to normal temperature. In this way, the electronic device cooling apparatus 1 is manufactured.

  When the cooling unit 3 is housed inside the case 2, there is a gap for housing the cooling unit 3 inside the case 2 between the cooling unit 3 housed inside the case 2 and the case 2. Although it exists, when the case 2 is returned to room temperature, as will be described later, the cooling unit 3 expands, and as shown in FIG. And the case 2 are in close contact with each other, and the cooling unit 3 is sandwiched by the case 2.

  As described above, in this embodiment, since the assembly of the cooling device 1 is performed at a very low temperature of, for example, −40 ° C., the temperature range in which the electronic component 10 is used is higher than that. Then, the cooling unit 3 and the case 2 expand than when the cooling device 1 is assembled.

  Here, in the present embodiment, the heat dissipation member 43 in the electronic component 10 is made of copper, the cooling tube 21 is made of aluminum, and the case 2 is made of aluminum die cast. An expansion coefficient α, a longitudinal elastic modulus (Young's modulus) E, and thermal stress per 1 ° C. are shown. Thermal stress is a force acting by thermal expansion, and thermal stress per 1 ° C. is generated inside the material when the temperature rises by 1 ° C. with both ends of the material having a predetermined shape constrained. It is stress and corresponds to the product of linear expansion coefficient α and longitudinal elastic modulus (Young's modulus) E. The physical property values in Table 1 are generally known.

表１に示すように、１℃あたりの熱応力は、アルミダイキャストが１．５０ＭＰａであり、銅が１．８２ＭＰａであることから、アルミダイキャスト製のケース２よりも、銅製の放熱部材４３による熱応力が大きい。このため、同じ温度条件下で、温度が上昇したときでは、銅製の放熱部材４３に対して圧縮方向の圧力が働くことがわかる。

As shown in Table 1, since the heat stress per 1 ° C. is 1.50 MPa for aluminum die cast and 1.82 MPa for copper, the heat radiation member 43 made of copper is more than the case 2 made of aluminum die cast. The thermal stress due to is large. For this reason, when the temperature rises under the same temperature condition, it can be seen that pressure in the compression direction acts on the copper heat radiating member 43.

  Therefore, in the usage environment temperature range of the electronic component 10 where the temperature is higher than when the cooling device 1 is assembled, the cooling unit 3 tends to expand in the stacking direction of the electronic component 10 and the cooling tube 21 as shown in FIG. However, since the case 2 cannot follow the expansion of the cooling unit 3, the deformation (expansion) of the cooling unit 2 is restrained by the case 2. As a result, a force in the compression direction acts on the cooling unit 3 from the case 2.

  Therefore, the cooling device 1 manufactured by the manufacturing method of the present embodiment is cooled in the stacking direction of the cooling tube 21 and the electronic component 10 in the usage environment temperature range of the electronic component 10 higher than the temperature at the time of assembly. Since the cooling unit 3 is pressurized by the case 2 when the unit 3 expands, the electronic component 10 and the cooling tube 21 can be brought into close contact with each other. And since the cooling unit 3 is pressurized with the force by expansion | swelling of the electronic component 10 itself, the surface pressure applied between the cooling tube 21 and the electronic component 10 can be made uniform. That is, since the site | part which should be crimped | bonded expands, each adhesive force becomes fixed.

  In the present embodiment, when the electronic component 10 generates heat, the electronic component 10 has the highest temperature inside the cooling unit 3, and the case 2 has a higher temperature than the cooling unit 3 in the entire cooling device 1. Therefore, the cooling unit 3 is easier to expand than the case 2. And since the expansion | swelling of the cooling unit 3 becomes large, so that the emitted-heat amount of the electronic component 10 is large, since big adhesive force will act between the electronic component 10 and the cooling tube 21, the adhesiveness between both Since the contact thermal resistance can be reduced, high cooling performance can be obtained.

  In addition, according to the present embodiment, the cooling tube 21 and the electronic component 10 can be pressed without using the bolts and leaf springs described in the background section above, so that the bolts and leaf springs are unnecessary. The number of parts of the cooling device 1 can be reduced and productivity can be improved. Further, the cooling device 1 of the present embodiment does not require bolts or leaf springs and has a simple structure, so that variations in assembly are small, and improvement in quality can be expected.

(Second Embodiment)
FIG. 4 shows a cross-sectional view of an electronic component cooling device according to a second embodiment of the present invention. 4 corresponds to FIG. 2. In FIG. 4, the same components as those in FIG. 2 are denoted by the same reference numerals.

  The cooling device 1 of the present embodiment deforms the insulating member 30 interposed between the electronic component 10 and the cooling tube 21 in the cooling device 1 described in the first embodiment, as shown in FIG. It was changed from hard ceramics to easily deformable rubber.

  Thereby, according to this embodiment, when the applied pressure from the case 2 due to the expansion of the cooling unit 3 is excessive, the applied pressure can be reduced by the rubber insulating member 30 acting as a cushioning material. it can.

  As a result, it is possible to prevent the compressive force acting between the electronic component 10 and the cooling tube 21 from becoming excessive, and to prevent the cooling tube 21 from buckling.

(Third embodiment)
In FIG. 5, the top view of the cooling device of the electronic component in 3rd Embodiment of this invention is shown. In FIG. 5, the same reference numerals as those in FIG.

  In the present embodiment, as shown in FIG. 5, a member 51 made of a material that expands as the temperature rises is changed between the electronic component 10 and the cooling tube 21 with respect to the cooling device 1 shown in FIG. 1 described in the first embodiment. It arrange | positions between the cooling unit 3 and the case 2 in the lamination direction. The member 51 is accommodated in the case 2 in a state where it is in contact with both the cooling unit 3 and the case 2 at the usage environment temperature of the electronic component 10.

  In the present embodiment, the member 51 made of a material that expands as the temperature rises is made of, for example, copper, and in the stacking direction of the electronic component 10 and the cooling tube 21 (vertical direction in FIG. 5) rather than one electronic component 10. A large width is adopted.

  The member 51 made of a material that expands as the temperature rises is accommodated in the case 2 together with the cooling unit 3 when the cooling unit 3 is accommodated in the case 2.

  Thus, even if the member 51 made of a material that expands as the temperature rises is added, the same effect as the above-described embodiments can be obtained, and the member 51 disposed between the cooling unit 3 and the case 2 can be By expanding in the stacking direction, the pressure applied from the case 2 to the cooling unit 3 can be increased compared to the first embodiment, and the adhesion between the electronic component 10 and the cooling tube 21 during heat generation can be further increased. The contact thermal resistance can be further reduced.

(Fourth embodiment)
In FIG. 6, the top view of the cooling device of the electronic component in 4th Embodiment of this invention is shown. In FIG. 6, the same reference numerals as those in FIG.

  In the present embodiment, the member 52 made of a material having a smaller width in the stacking direction of the electronic component 10 and the cooling tube 21 than the cooling device 1 illustrated in FIG. Arranged between the cooling unit 3 and the case 2.

  Here, FIG. 7 shows a front view of the member 52 made of a material that expands as the temperature rises. As the member 52 of a material that expands with a rise in temperature, as shown in FIG. 6, for example, it has a width equivalent to that of the electronic component 10 and expands greatly when it changes from a low temperature to a high temperature as shown in FIG. Is adopted. For example, a material in which the width t2 in the high temperature state changes to at least twice the width t1 in the low temperature state is preferable. Thereby, compared with 3rd Embodiment, the cooling device 1 can be reduced in size.

(Fifth embodiment)
In FIG. 8, the front view of the member arrange | positioned between the cooling unit 3 and the case 2 in the cooling device 1 in 5th Embodiment of this invention is shown.

  In the third and fourth embodiments, the members 51 and 52 that are expanded as the temperature rises are disposed between the cooling unit 3 and the case 2, but instead of the members 51 and 52 that are expanded, As in the present embodiment, a member 53 whose shape changes as the temperature rises may be disposed.

  As shown in FIG. 8, the member 53 whose shape changes as the temperature rises is made of, for example, a shape memory alloy, and in a low temperature state, the thickness of the electronic component and the cooling tube in the stacking direction is t1. In this case, a plate spring that deforms into a bow shape when the temperature becomes high and the size of the electronic component and the cooling tube in the stacking direction is increased to t3 is adopted.

  Thereby, also in this embodiment, the effect similar to 3rd, 4th embodiment is acquired.

  Further, in the method of pressing the cooling tube and the electronic component using the leaf spring described in the background art section above, it is necessary to compress the cooling unit once during assembly. Since the member 53 whose shape changes with the rise is a simple plate material at the time of assembling, the assembling is easy and the productivity is increased.

(6th embodiment)
In FIG. 9, the top view of the cooling device of the electronic component in 6th Embodiment of this invention is shown. In FIG. 9, the same reference numerals as those in FIG.

  In the present embodiment, in the cooling device 1 of the first embodiment, a means for clamping the cooling unit 3 is provided in the case 2.

  As shown in FIG. 9, the case 2 has a pressurizing part 2 a that pressurizes the cooling unit 3 and a part 2 b that accommodates the cooling unit 3, and both are fastened by bolts 61. By tightening the bolt 61, a stress corresponding to the tightening torque of the bolt 61 acts on the cooling unit 3 in the stacking direction of the electronic component 10 and the cooling tube 21.

  As described in the first embodiment, in the manufacture of the cooling device 1, for example, when the cooling unit 3 is stored in the case 2 under a temperature atmosphere of −40 ° C., the cooling device 1 is stored in the case 2. Between the cooling unit 3 and the case 2, there is a gap for storing the cooling unit 3 inside the case 2.

  Therefore, in this embodiment, after the cooling unit 3 is housed in the case 2, the cooling unit 3 is pressurized by tightening the bolt 61 in a temperature atmosphere of −40 ° C., and the cooling tube 21, the case 2, Are brought into close contact with each other, and the cooling unit 3 is held by the case 2. Then, manufacture is completed by returning the cooling device 1 to normal temperature.

  According to the present embodiment, since the case 2 has sandwiched the cooling unit 3 from the time of assembly in a temperature atmosphere of −40 ° C., the usage environment temperature of the electronic component 10 and the heat generation of the electronic component 10 Higher adhesion can be obtained.

(Other embodiments)
(1) In each of the embodiments described above, regarding the configuration of the cooling unit 3, for example, as shown in FIG. 2, the insulating member 30 is interposed between the electronic component 10 and the cooling tube 21. The insulating member may be omitted if it is not necessary to ensure the insulation between the electronic component and the cooling tube for reasons such as the tube is made of an insulating material.

  The cooling unit 3 may be configured to include components other than the electronic component 10, the cooling tube 21, and the insulating member 30. For example, thermally conductive grease can be interposed between the electronic component 10 and the cooling tube 21.

  (2) In each of the embodiments described above, the linear expansion coefficient α of the heat dissipation member 43 of the electronic component 10 is different from that of the case 2, and the linear expansion coefficient α of the cooling tube 21 is equivalent to that of the case 2. Although the case where the linear expansion coefficient α of the entire 3 is larger than that of the case 2 has been described, the present invention is not limited thereto, and the linear expansion coefficient of the entire cooling unit 3 in the stacking direction of the cooling tube and the electronic component is The material of the heat radiating member 43, the cooling tube 21, and the case 2 of the electronic component 10 may be changed as long as it is larger than the linear expansion coefficient. For example, both the heat dissipation member 43 and the cooling tube 21 of the electronic component 10 may be made of a material having a larger linear expansion coefficient than the case 2.

  (3) In each above-mentioned embodiment, the cooler 2 is the structure by which the supply header part 22 and the discharge | emission header part 23 were formed by fitting the protrusion pipe parts 24 and 25 of the adjacent cooling tube 21 mutually. However, as long as the electronic component 10 is sandwiched between the pair of cooling tubes 21, another configuration may be used.

  For example, the supply header part and the discharge header part may be configured by parts different from the cooling tube, and a plurality of cooling tubes may be fitted to the supply header part and the discharge header part.

  (4) In each of the above-described embodiments, the case where the electronic component 10 is a semiconductor module constituting an inverter for HEV vehicles has been described. For example, a motor-driven inverter for industrial equipment, an air conditioner inverter for building air conditioning, and the like The present invention can also be applied to the cooling of semiconductor modules. The present invention can also be applied to a cooling device that cools semiconductor components such as thyristors, power transistors, power FETs, and IGBTs and other electronic components instead of semiconductor modules.

It is a top view of the cooling device of the electronic component in a 1st embodiment of the present invention. It is an AA arrow direction sectional view in FIG. It is a top view of the cooling device of the electronic component in a 1st embodiment of the present invention. It is sectional drawing of the cooling device of the electronic component in 2nd Embodiment of this invention. It is a top view of the cooling device of the electronic component in 3rd Embodiment of this invention. It is a top view of the cooling device of the electronic component in 4th Embodiment of this invention. It is a front view of the member 52 of the material which expands with the temperature rise in FIG. It is a front view of the member arrange | positioned between the cooling unit 3 and the case 2 in the cooling device 1 in 5th Embodiment of this invention. It is a top view of the cooling device of the electronic component in 6th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Electronic component cooling device, 2 ... Case, 3 ... Electronic component cooling unit,
DESCRIPTION OF SYMBOLS 10 ... Electronic component, 20 ... Cooler, 21 ... Cooling tube.

Claims (11)

An electronic component cooling unit (3) sandwiching the electronic component (10) between a pair of cooling tubes (21) through which the refrigerant flows, and the cooling unit (3) in a state of sandwiching the cooling unit (3) A cooling device for an electronic component that cools the electronic component (10) from both sides,
The product of the linear expansion coefficient and the longitudinal elastic modulus of the cooling unit (3) in the stacking direction of the cooling tube and the electronic component is the product of the linear expansion coefficient and the longitudinal elastic modulus of the case (2) in the stacking direction. The cooling unit (3) and the case (2) made of a material having a predetermined linear expansion coefficient and longitudinal elastic modulus so as to have a relationship of greater than
After assembling the cooling unit (3) by disposing the electronic component (10) between a pair of the cooling tubes (21) in a temperature atmosphere lower than the usage environment temperature of the electronic component (10) The cooling unit (3) is accommodated in the case (2), and the cooling unit (3) is held by the case (2) at the use environment temperature of the electronic component (10). A method of manufacturing an electronic component cooling device characterized by the above. 2. The electronic component according to claim 1, wherein the temperature atmosphere lower than a use environment temperature of the electronic component is a temperature atmosphere lower than −30 ° C. and capable of withstanding the electronic component. Manufacturing method of cooling device. The electronic device according to claim 1 or 2, wherein the cooling unit (3) with a rubber member (30) interposed between the electronic component (10) and the cooling tube (21) is prepared. A method of manufacturing a cooling device for parts. When the cooling unit (3) is stored in the case (2), the cooling unit (3) in the stacking direction and the case (2) expand in the stacking direction as the temperature rises. The electronic component cooling apparatus according to any one of claims 1 to 3, wherein the cooling unit (3) is housed in the case (2) in a state in which the members (51, 52) are arranged. Manufacturing method. When the cooling unit (3) is housed in the case (2), the shape is increased in the stacking direction as the temperature rises between the cooling unit (3) and the case (2) in the stacking direction. The electronic component cooling device according to any one of claims 1 to 3, wherein the cooling unit (3) is housed in the case (2) in a state in which the changing member (53) is arranged. Manufacturing method. After the cooling unit (3) is housed in the case (2), the pressure unit (2a, 61) provided in the case is used at a temperature lower than the use environment temperature of the electronic component (10). The compressing force is applied to the cooling unit (3) from the case (2) to pressurize the cooling unit (3) in the stacking direction. The manufacturing method of the cooling device of electronic components as described in one. An electronic component cooling unit (3) sandwiching the electronic component (10) between a pair of cooling tubes (21) through which the refrigerant flows, and the cooling unit (3) in a state of sandwiching the cooling unit (3) An electronic component cooling device for cooling the electronic component (10) from both sides,
In the cooling unit (3) and the case (2), the product of the linear expansion coefficient and the longitudinal elastic modulus of the cooling unit (3) in the stacking direction of the cooling tube and the electronic component is It is made of a material having a predetermined linear expansion coefficient and longitudinal elastic modulus so as to satisfy a relationship larger than the product of the linear expansion coefficient and the longitudinal elastic modulus of the case (2).
The electronic component (10) and the cooling tube (21) are connected to the cooling unit (3) in the stacking direction at the usage environment temperature of the electronic component (10) and when the electronic component (10) generates heat. The heating element cooling device is configured to be pressurized by the case (2) by utilizing the expansion of the heating element. The said cooling unit (3) has the rubber member (30) interposed between the said electronic component (10) and the said cooling tube (21), Cooling of the electronic component of Claim 7 characterized by the above-mentioned. apparatus. A member (51, 52) disposed between the cooling unit (3) and the case (2) in the stacking direction and expanding in the stacking direction as the temperature rises. A method for manufacturing an electronic component cooling device according to 7 or 8. It has a member (53) which is arrange | positioned between the said cooling unit (3) and the said case (2) in the said lamination direction, and a shape changes in the said lamination direction with a rise in temperature. The electronic component cooling apparatus according to 7 or 8. Pressurizing means (2a, 61) for applying a compressive force from the case (2) to the cooling unit (3) to pressurize the cooling unit (3) in the laminating direction includes the case (2). The electronic component cooling device according to claim 7, wherein the electronic component cooling device is provided in the electronic device.

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