JP2017091808A - Method for producing oxide superconducting wire rod and method for producing superconducting coil - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a superconducting wire rod capable of suppressing the defect of joining in a stabilization material, and a method for producing a superconducting coil.SOLUTION: A superconducting laminated body 15 with a constitution where an intermediate layer 12, an oxide superconducting layer 13 and a protective layer 14 are laminated in this order on either face of a tape-like base material 11 is prepared, the first joining material layer 16 is formed so as to cover at least a part of the outer face of the superconducting laminated layer 15, the superconducting laminated body 15 formed with the first joining material layer 16 is covered with a stabilization material 18 formed with the second joining layer 17 in such a manner that the second joining material layer 17 faces the first joining material layer 16, thereafter, heating is performed to a temperature at which the first joining material layer 16 and the second joining material layer 17 are melted, and the superconducting laminated body 15 and the stabilization material 18 are joined via the first joining material layer 16 and the second joining material layer 17.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing an oxide superconducting wire and a method for manufacturing a superconducting coil.

In recent years, a Bi-based superconductor represented by the general formula Bi ₂ Sr ₂ CaCu ₂ O _{8 + δ} (Bi2212) or Bi ₂ Sr ₂ Ca ₂ Cu ₃ O _{10 + δ} (Bi2223), or the general formula REBa ₂ Cu ₃ O _7-X Development of a superconducting wire using a rare earth-based superconductor represented by (RE123) is underway. In addition, the rare earth element RE is not limited to Y, but the rare earth element is often called a Y element.

  As one of the structures of rare earth-based superconducting wires, an oxide superconducting layer is laminated on a base material made of metal tape or the like through an intermediate layer, and then a protective layer such as Ag for protecting the oxide superconducting layer is formed. Furthermore, a structure in which a stabilizing material such as Cu is formed is known (for example, see Patent Document 1). The stabilizing material is provided as a current path (path) for bypassing an overcurrent generated when the oxide superconducting layer transitions from the superconducting state to the normal conducting state for some reason (when quenching). When a tape-shaped substrate made of a material having high strength such as Ni alloy is used, it has high tensile strength in the longitudinal direction.

Japanese Patent No. 5755589

  When the stabilizer is joined to the periphery of the laminate including the oxide superconducting layer by soldering or the like, there is a risk of poor joining. If a bonding failure occurs, there is a risk of deterioration of characteristics and a decrease in yield, so improvement is desired.

  This invention is made | formed in view of the said situation, and makes it a subject to provide the manufacturing method of the oxide superconducting wire which can suppress the joining defect of a stabilizer, and the manufacturing method of a superconducting coil.

  In order to solve the above problems, the present invention provides a step of preparing a superconducting laminate having a configuration in which an intermediate layer, an oxide superconducting layer, and a protective layer are laminated in this order on one surface of a tape-shaped substrate; A step of forming a first bonding material layer so as to cover at least a part of the outer surface of the superconducting laminate, a step of forming a second bonding material layer on the surface of the stabilizing material, The second bonding material layer is formed so that two bonding material layers face the first bonding material layer and the stabilizing material covers at least a part of the outer surface of the superconducting laminate. A step of placing the stabilized material on the superconducting laminate on which the first bonding material layer is formed, and heating to a temperature at which the first bonding material layer and the second bonding material layer are in a molten state. And the superconducting laminate and the stabilizing material through the first bonding material layer and the second bonding material layer. To have, and bonding the provide a method of manufacturing an oxide superconducting wire according to claim.

The first bonding material layer is formed so as to cover both end portions in the width direction on the substrate back surface side, and the stabilizing material covers the both end portions in the width direction on the substrate back surface side. It is also possible to cover the stabilizing material on which the two bonding material layers are formed on the superconducting laminate on which the first bonding material layer is formed.
In the back surface of the base material, it is also possible to include a step of covering a recess formed between the back surface of the base material and both end portions in the width direction of the stabilizing material with a third bonding material layer.

The first bonding material layer and the second bonding material layer may contain at least one kind of metal.
The first bonding material layer and the second bonding material layer may include at least one kind of zinc, indium, gallium, tin, bismuth, and lead.
It is also possible to form the first bonding material layer on the superconducting laminate by one or more selected from sputtering of bonding material, plating of bonding material, and molten bonding material.

  The present invention further includes a step of manufacturing an oxide superconducting wire by the method of manufacturing the oxide superconducting wire, and a step of manufacturing a superconducting coil using the oxide superconducting wire. A manufacturing method is provided.

  The present invention suppresses bonding failure of the stabilizing material to the superconducting laminate by joining the superconducting laminate and the stabilizing material via the first joining material layer and the second joining material layer. Can do.

It is sectional drawing which shows an example of a superconducting wire. It is sectional drawing which shows an example of the superconducting laminated body in which the joining material layer was formed. It is sectional drawing which shows an example of the stabilizer which formed the bonding material layer.

  Hereinafter, based on a preferred embodiment, the present invention will be described with reference to the drawings.

  In FIG. 1, sectional drawing of an example of the superconducting wire of this embodiment is shown. This sectional view schematically shows the structure of a cross section perpendicular to the longitudinal direction of the superconducting wire. Superconducting wire 10 includes a superconducting laminate 15, a stabilizing material 18 provided around the superconducting laminate, and bonding material layers 16 and 17 that join the superconducting laminate 15 and the stabilizing material 18.

  FIG. 2 shows a cross-sectional view of an example of the superconducting laminate 15. The superconducting laminate 15 has a configuration in which an intermediate layer 12, an oxide superconducting layer 13, and a protective layer 14 are laminated in this order on a tape-like substrate 11 and one surface 11a of the substrate 11. The direction in which the layers such as the substrate 11, the intermediate layer 12, the oxide superconducting layer 13, and the protective layer 14 are laminated is the thickness direction. The width direction is a direction perpendicular to the longitudinal direction and the thickness direction.

  The base material 11 is a tape-shaped metal base material, and has main surfaces (one surface 11a and a back surface 11b opposite to the surface) on both sides in the thickness direction. Specific examples of the metal constituting the substrate 11 include nickel alloys typified by Hastelloy (registered trademark), stainless steel, and oriented Ni—W alloys in which a texture is introduced into the nickel alloy. What is necessary is just to adjust the thickness of the base material 11 suitably according to the objective, for example, it is the range of 10-500 micrometers. A metal thin film such as Ag or Cu may be formed on the back surface 11b, the side surface 11c, or both of the base material 11 by sputtering or the like in order to improve the bondability.

  The intermediate layer 12 is provided between the base material 11 and the oxide superconducting layer 13. The intermediate layer 12 may have a multilayer structure, and may include, for example, a diffusion prevention layer, a bed layer, an alignment layer, a cap layer, and the like in the order from the substrate 11 side to the oxide superconducting layer 13 side. These layers are not necessarily provided one by one, and some layers may be omitted, or two or more of the same kind of layers may be laminated repeatedly.

The diffusion preventing layer has a function of suppressing a part of the components of the base material 11 from diffusing and mixing as impurities into the oxide superconducting layer 13 side. The diffusion preventing layer is made of, for example, Si ₃ N ₄ , Al ₂ O ₃ , GZO (Gd ₂ Zr ₂ O ₇ ) or the like. The thickness of the diffusion preventing layer is, for example, 10 to 400 nm.

The bed layer is used to reduce the reaction at the interface between the substrate 11 and the oxide superconducting layer 13 and to improve the orientation of the layer formed on the bed layer. Examples of the material of the bed layer include Y ₂ O ₃ , Er ₂ O ₃ , CeO ₂ , Dy ₂ O ₃ , Eu ₂ O ₃ , Ho ₂ O ₃ , and La ₂ O ₃ . The thickness of the bed layer is, for example, 10 to 100 nm.

The orientation layer is formed from a biaxially oriented material in order to control the crystal orientation of the cap layer thereon. Examples of the material of the alignment layer include Gd ₂ Zr ₂ O ₇ , MgO, ZrO ₂ —Y ₂ O ₃ (YSZ), SrTiO ₃ , CeO ₂ , Y ₂ O ₃ , Al ₂ O ₃ , Gd ₂ O ₃ , Examples thereof include metal oxides such as Zr ₂ O ₃ , Ho ₂ O ₃ , and Nd ₂ O ₃ . This alignment layer is preferably formed by an IBAD (Ion-Beam-Assisted Deposition) method.

The cap layer is formed on the surface of the above-described alignment layer, and is made of a material that allows crystal grains to self-align in the in-plane direction. The material of the cap layer, for _{example, CeO 2, Y 2 O 3} , Al 2 O 3, Gd 2 O 3, ZrO 2, YSZ, Ho 2 O 3, Nd 2 O 3, LaMnO 3 , and the like. Examples of the thickness of the cap layer include a range of 50 to 5000 nm.

The oxide superconducting layer 13 is composed of an oxide superconductor. The oxide superconductor is not particularly limited, for example, the general formula _{REBa 2 Cu 3 O 7-X} (RE123) with rare earth-based oxide superconductor represented the like. Examples of the rare earth element RE include one or more of Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. It is done. Among these, one of Y, Gd, Eu, and Sm, or a combination of two or more of these elements is preferable. The thickness of the superconducting layer is, for example, about 0.5 to 5 μm. This thickness is preferably uniform in the longitudinal direction. The oxygen deficiency _X is, for example, about 0.0 to 0.5.

  The protective layer 14 has functions such as bypassing overcurrent generated at the time of an accident and suppressing a chemical reaction occurring between the oxide superconducting layer 13 and a layer provided on the protective layer 14. Examples of the material of the protective layer 14 include silver (Ag), copper (Cu), gold (Au), an alloy of gold and silver, other silver alloys, copper alloys, and gold alloys. As shown in FIG. 2, the protective layer 14 covers at least the surface of the oxide superconducting layer 13 (the surface on the side opposite to the substrate 11 side in the thickness direction). Furthermore, the protective layer 14 may cover part or all of the region selected from the side surface of the oxide superconducting layer 13, the side surface of the intermediate layer 12, the side surface 11c and the back surface 11b of the substrate 11.

  As shown in FIG. 1, the stabilizer 18 is formed around the superconducting laminate 15, and the outer surface of the layer laminated on the one surface 11 a of the substrate 11 (for example, the protective layer 14 on the oxide superconducting layer 13. And a metal tape having a cross-sectional shape bent in the width direction from the side. Thereby, since the side surface of the oxide superconducting layer 13 can be covered stably, the water resistance of the superconducting wire 10 can be improved. The material used for the stabilizer 18 may vary depending on the use of the superconducting wire 10. For example, when used for superconducting cables, superconducting motors, etc., it is necessary to function as the main part of the bypass that commutates the overcurrent generated at the transition to the normal conducting state. It is done. Examples of the highly conductive metal include metals such as copper, copper alloy, aluminum, and aluminum alloy. Moreover, when using for a superconducting fault current limiter, since it is necessary to instantaneously suppress the overcurrent generated at the time of transition to the normal conducting state, a high resistance metal is preferably used. Examples of the high resistance metal include Ni-based alloys such as Ni-Cr.

  In the case of this embodiment, the stabilizing material 18 is a first portion that covers the outer surface of the layer laminated on the one surface 11a of the substrate 11 (the surface of the protective layer 14 in FIG. 1) in the superconducting laminate 15. 18a, a second portion 18b covering both side surfaces of the superconducting laminate 15, and a third portion 18c covering the side edge of the substrate back surface 11b (or the surface of another layer formed on the surface) including. The metal tape constituting the stabilizing member 18 can have a second portion 18b and a third portion 18c in this order on both sides in the width direction of the first portion 18a. It is preferable to comprise the 3rd part 18c from the both ends of a metal tape so that the both ends of the width direction of the base material back surface 11b may be covered. The third portion 18 c can further extend from both side edges toward the center in the width direction on the back surface 11 b of the substrate 11.

  The stabilizing material 18 is bonded to the superconducting laminate 15 by the bonding material layers 16 and 17. For example, between the first portion 18 a of the stabilizer 18 and the protective layer 14, between the second portion 18 b of the stabilizer 18 and the side surface of the superconducting laminate 15, and the third portion of the stabilizer 18. A bonding material may be provided between 18c and the substrate back surface 11b.

  Examples of the bonding material constituting the bonding material layers 16 and 17 include Sn—Pb, Pb—Sn—Sb, Sn—Pb—Bi, Bi—Sn, Sn—Cu, and Sn—Pb—Cu. , Sn-Ag solder, metals such as Sn, Sn alloy, In, In alloy, Zn, Zn alloy, Ga, Ga alloy. The melting point of the bonding material is, for example, 500 ° C. or lower, and further 300 ° C. or lower.

  A third bonding material layer 19 can be provided in a portion surrounded by the substrate back surface 11 b and the third portion 18 c of the stabilizing material 18. The third bonding material layer 19 can be formed by supplying a metal such as solder similar to that exemplified as the material of the bonding material layers 16 and 17. In addition, the 3rd joining material layer 19 can also be comprised by a welding part. The welded portion may include materials diffused from surrounding members during welding, for example, materials such as the base material 11, the stabilizing material 18, and the bonding material layers 16 and 17. When forming the welded portion, a material such as metal may be supplied from the outside. The outer surface of the third bonding material layer 19 may protrude or dent from the outer surface of the stabilizing material 18, or may be coplanar.

  In FIG. 1, the entire surface of the substrate back surface 11 b is covered with the stabilizing material 18 or the bonding material layers 16, 17, and 19, but a part of the back surface 11 b may be exposed. Further, in FIG. 1, the boundaries of the bonding material layers 16, 17, and 19 are clearly illustrated. The boundary may not be clear. Before forming the bonding material layer 19, the bonding material layer 16 may cover the entire surface of the substrate back surface 11 b and the like (a range including a region where the third bonding material layer 19 is formed).

  As a method of providing the stabilizer 18 and the bonding material layers 16, 17, 19 around the superconducting laminate 15, a step of providing the first bonding material layer 16 on the outer surface of the superconducting laminate 15 as shown in FIG. 2. 3, after the step of providing the second bonding material layer 17 on the inner surface of the stabilizer 18, the step of disposing the stabilizer 18 around the superconductor laminate 15, the outer shape of the superconductor laminate 15. Bending the stabilizing material 18 along (forming), and heating and pressurizing the superconducting laminate 15 and the stabilizing material 18 to melt part or all of the bonding material layers 16 and 17 (remelting, reflow). And a method including a step of solidifying the bonding material by cooling the whole while continuing the pressurization. The order of the step of providing the first bonding material layer 16 on the superconducting laminate 15 and the step of providing the second bonding material layer 17 on the stabilizing material 18 are arbitrary.

  In the step of providing the first bonding material layer 16 on the outer surface of the superconducting laminate 15, the first bonding material layer 16 is formed on the outer surface of the superconducting laminate 15 (for example, the protective layer 14 side, the side surfaces 11c side, and the base material). It is preferably formed so as to cover at least a part of the back surface 11b side). In order to join the stabilizing material 18 to both ends in the width direction of the substrate back surface 11b, it is preferable to form the first bonding material layer 16 so as to cover both ends in the width direction of the substrate back surface 11b. The first bonding material layer 16 may cover the entire outer surface of the superconducting laminate 15. As a method of forming the first bonding material layer 16, a method of sputtering a bonding material, a method of plating a bonding material (electroplating, etc.), a method of using a molten bonding material (hot plating, etc.), two or more of these And the like.

  When the positions of the side surfaces of the superconducting laminate 15 (for example, the end portions of the intermediate layer 12, the oxide superconducting layer 13, and the protective layer 14) are not aligned with the side surface 11c of the substrate 11, the side surfaces of the superconducting laminate 15 By covering the whole with the first bonding material layer 16, even when the side surfaces (both ends in the width direction) of the superconducting laminate 15 are not covered with the protective layer 14, the bonding with the second bonding material layer 17 can be performed. Since it becomes more reliable, it is preferable. As a further aspect, covering the entire circumference of the superconducting laminate 15 with the smooth first bonding material layer 16, on the corners of the cross section (for example, both ends in the width direction of the base material 11 and the protective layer 14). For example, the outer surface of the first bonding material layer 16 may be rounded, and the first bonding material layer 16 may be thicker on both ends than the central portion in the width direction of the superconducting laminate 15.

  In the step of providing the second bonding material layer 17 on the inner surface of the stabilizing material 18, the second bonding material layer 17 is formed on at least one surface of the stabilizing material 18. The same bonding material layer as the second bonding material layer 17 is provided not only on the surface (inner surface) on the side where the stabilizing material 18 faces the superconducting laminate 15 but also on the end or outer surface in the width direction of the stabilizing material 18. May be formed. The range in which the second bonding material layer 17 is formed on the stabilizing material 18 is the entire surface or a part of the inner surface of the stabilizing material 18, and the stabilizing material 18 is covered on the superconducting laminate 15. Further, it is preferable that the second bonding material layer 17 includes a region facing the first bonding material layer 16. It is also preferable to form a smooth or uniform second bonding material layer 17 on the entire inner surface of the stabilizing material 18. As a method of forming the second bonding material layer 17, a method of sputtering a bonding material, a method of plating a bonding material (electroplating, etc.), a method of using a molten bonding material (hot plating, etc.), two or more of these And the like.

  At the time of bonding, the first bonding material layer 16 provided on the outer surface of the superconducting laminate 15 and the second bonding material layer 17 provided on the inner surface of the stabilizing material 18 are brought into contact with each other, and then the first bonding material. The layer 16 and the second bonding material layer 17 are heated to a temperature at which they are in a molten state. By joining the superconducting laminate 15 and the stabilizing material 18 via the first joining material layer 16 and the second joining material layer 17, the stabilizing material 18 having a cross-sectional shape bent in the width direction is joined. Defects can be suppressed.

  It is preferable that the first bonding material layer 16 and the second bonding material layer 17 are in contact with each other at a smooth surface because a gap between the superconducting laminate 15 and the stabilizing material 18 is less likely to occur. Alternatively, when the bonding material layer is thickened on the corner or side surface of the cross section, the bonding material adheres between the oxide superconducting layer 13 and the stabilizing material 18, and is stabilized from the oxide superconducting layer 13 during a quench or the like. Energization of the material 18 is more reliable. At the time of bonding, it is preferable to remove the oxide film on the surface of the bonding material layers 16 and 17. As a method for removing the oxide film, it is desirable to use flux, perform plasma cleaning, or the like.

  Examples of the bonding material include metals such as zinc, indium, gallium, tin, bismuth, and lead, and alloys containing at least one of these. Further, it is preferable that the first bonding material layer 16 and the second bonding material layer 17 include at least one kind of the same metal (Zn, In, Ga, Sn, Bi, Pb, or the like). The constituent elements of the first bonding material layer 16 and the second bonding material layer 17 (except for inevitable impurities) are preferably the same, and the composition or melting point of each bonding material is the same or close. It is preferable.

  The width of the metal tape prepared as the material for the stabilizer 18 is preferably shorter than the outer periphery of the superconducting laminate 15. Thereby, when the metal tape is molded so as to surround the outer periphery of the superconducting laminate 15, both ends in the width direction of the metal tape do not overlap each other, so that the end portion of the stabilizing material 18 is not easily lifted from the superconducting laminate 15. Become. It is preferable that the gap generated between both end portions in the width direction of the metal tape is sealed by providing a third bonding material layer 19 (joined portion, welded portion, etc.) by soldering or welding.

  The bonding material is not limited to one type or two types, and three or more types can be used. Among these, two or more types may correspond to the first bonding material layer 16, and two or more types may correspond to the second bonding material layer 17.

  As a specific example of forming, after placing the superconducting laminate on a flat metal tape, using a forming roll or the like, the both ends in the width direction of the metal tape are bent toward the side surfaces of the superconducting laminate, respectively. A step of bending both end portions of the metal tape in the width direction toward the back surface of the base material is exemplified. According to forming, a product in which similar cross-sectional shapes are continuous in the longitudinal direction of the superconducting wire can be efficiently manufactured.

  Before placing the superconducting laminate on the metal tape, it is also possible to bend a part or all of a predetermined bending angle at a predetermined position of the metal tape in advance. In this case, before insertion, the second part that should cover the side surface of the superconducting laminate, and the third part that should cover the back surface of the substrate, so that the superconducting laminate can be easily inserted into the bent metal tape. In this case, it is preferable that the bending angle is smaller than the right angle so that the gaps at both ends in the width direction of the metal table are widened.

  The third bonding material layer 19 covering the gaps at both ends in the width direction of the stabilizing material 18 can also be provided after the step of bonding the stabilizing material 18 to the superconducting laminate 15. Further, during the step of bonding the stabilizing material 18 to the superconducting laminate 15, the remelted bonding material layers 16 and 17 are spread along the back surface 11b of the base material 11 or the inner surface of the stabilizing material 18, It is also possible to form the third bonding material layer 19 by closing the gap. The back surface 11b of the base material 11 may be subjected to a surface treatment such as plating so that the bonding material is easily wetted. Moreover, in order to regulate the range in which the bonding material of the bonding material layers 16, 17, and 19 is wetted, the presence / absence and type of surface treatment can be varied for each region.

  In order to produce a superconducting coil using the tape-shaped superconducting wire 10, the superconducting wire 10 is wound around the outer peripheral surface of the winding frame to form a coil shape (multilayer winding coil) and then wound. Superconducting wire 10 can be fixed by impregnating resin such as epoxy resin so as to cover wire 10. When the superconducting wire 10 is wound in a coil shape, the thickness direction of the superconducting wire 10 may be mainly the radial direction of the coil. It is not limited whether the base 11 side (back side) or the protective layer 14 side (front side) of the superconducting laminate 15 is on the winding center side of the coil.

  The width direction of the superconducting wire 10 is substantially parallel to the central axis of the coil, and between the loops adjacent to each other in the coil, the front side and the back side (in some cases, the front side or the back side in some cases) face each other. An impregnating resin is filled between the superconducting wires 10 facing each other, and the superconducting wires 10 are bonded to each other. It is also possible to locally change the direction of the superconducting wire 10 in the coil by providing the superconducting wire 10 with twists, bends, connecting portions, and the like.

  In the present embodiment, since the stabilizing material is molded from a single metal tape so as to have a bent cross-sectional shape, durability is high and processing costs can be reduced.

  As mentioned above, although this invention has been demonstrated based on suitable embodiment, this invention is not limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

The superconducting wire may have a void inside the stabilizing material. For example, a space can be provided between the bent cross-sectional stabilizer and the side surface of the superconducting laminate.
The processing of the stabilizing material is not limited to forming, but can be formed into a bent cross-sectional shape by melt extrusion or cutting.
It is also possible to form a metal layer on the outer surface of the stabilizing material by soldering, plating or the like.
The superconducting wire can have an external terminal. The portion having the external terminal may have a different cross-sectional structure from other portions.

DESCRIPTION OF SYMBOLS 10 ... Superconducting wire, 11 ... Base material, 11a ... One side, 11b ... Substrate back surface, 11c ... Side surface, 12 ... Intermediate layer, 13 ... Oxide superconducting layer, 14 ... Protective layer, 15 ... Superconducting laminate, 16 ... 1st joining material layer, 17 ... 2nd joining material layer, 18 ... Stabilizer, 19 ... 3rd joining material layer.

Claims (7)

A superconducting laminate having a structure in which an intermediate layer and an oxide superconducting layer are laminated in this order on one surface of a tape-like base material, and further, a protective layer covering at least the surface of the oxide superconducting layer is provided. A preparation process;
Forming a first bonding material layer so as to cover at least part of the outer surface of the superconducting laminate;
Forming a second bonding material layer on the surface of the stabilizing material;
The second bonding material layer so that the second bonding material layer faces the first bonding material layer and the stabilizing material covers at least a part of the outer surface of the superconducting laminate. Covering the stabilizing material formed with the superconducting laminate in which the first bonding material layer is formed;
Heating the first bonding material layer and the second bonding material layer to a temperature at which the first bonding material layer and the second bonding material layer are in a molten state, and via the first bonding material layer and the second bonding material layer, Bonding the stabilizing material;
A method for producing an oxide superconducting wire characterized by comprising:   The first bonding material layer is formed so as to cover both end portions in the width direction on the substrate back surface side, and the stabilizing material covers the both end portions in the width direction on the substrate back surface side. 2. The method of manufacturing an oxide superconducting wire according to claim 1, wherein the stabilizing material on which the two bonding material layers are formed is placed on the superconducting laminate on which the first bonding material layer is formed.   2. The method according to claim 1, further comprising a step of covering a recess formed between the substrate back surface and both end portions in the width direction of the stabilizing material with a third bonding material layer on the substrate back surface. Or the manufacturing method of the oxide superconducting wire of 2.   The said 1st joining material layer and the said 2nd joining material layer contain at least 1 sort (s) of the same kind of metal, The manufacturing of the oxide superconducting wire of any one of Claims 1-3 characterized by the above-mentioned. Method.   The first bonding material layer and the second bonding material layer each contain at least one kind of zinc, indium, gallium, tin, bismuth, and lead. Manufacturing method of oxide superconducting wire.   2. The first bonding material layer is formed on the superconducting laminate by one or more selected from sputtering of bonding material, plating of bonding material, and molten bonding material. The manufacturing method of the oxide superconducting wire of any one of -5.   It has the process of manufacturing an oxide superconducting wire with the manufacturing method of the oxide superconducting wire of any one of Claims 1-6, and the process of manufacturing a superconducting coil using the said oxide superconducting wire. A method of manufacturing a superconducting coil, which is characterized.

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