JP2017091626A - Method for manufacturing display panel and display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing an organic EL display panel capable of repairing a defective pixel even when it is difficult to irradiate the defective pixel with a laser.SOLUTION: A method for manufacturing an organic EL display panel 2 including a plurality of semiconductor elements 13 includes the steps of: forming a lower electrode 16 per pixel on the flattening film 14 formed above the semiconductor element 13; forming an organic layer 20 including a light-emitting layer on the lower electrode 16; forming an upper electrode 22 on the organic layer 20; detecting a lower electrode 16 containing a defect; and forming a recess 24 for connecting the lower electrode 16 and the upper electrode 22 on the flattening film 14 or the lower electrode 16.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a display panel manufacturing method and a display panel.

  2. Description of the Related Art Conventionally, a display panel including an organic electroluminescence (hereinafter referred to as organic EL) element in which an organic layer including a light emitting layer is interposed between an anode (anode) and a cathode (cathode) is known. In a display panel including an organic EL element, a conductive foreign matter is mixed in the organic EL element of the display panel in a manufacturing process, and the anode and the cathode are short-circuited, or a light emitting layer formed between the anode and the cathode Defects may cause defects such as a short circuit between the anode and the cathode. In this case, a defective pixel including a defect may have a defect such as a dark spot state that is not always lit, a bright spot state that is always lit, or an unstable lighting state. When such a malfunction occurs, there is a technique for repairing (eliminating) the short circuit so as not to affect the operation of the organic EL element (see, for example, Patent Documents 1 to 4).

  In the techniques disclosed in Patent Documents 1 to 4, a defective pixel is irradiated with a laser, and, for example, the defective pixel is formed by increasing or destroying an anode, a cathode, or a light emitting layer formed between the anode and the cathode. It is repaired.

JP 2004-227852 A Japanese Patent Laid-Open No. 2003-177881 JP 2005-276600 A JP 2008-235177 A

  However, in the method of repairing by irradiating a laser as described above, if there is a defect at a deep position from the substrate surface such as a semiconductor element or a lower electrode, the laser does not reach the defective part, and the defective pixel can be repaired by the laser. It can be difficult.

  In view of the above problems, an object of the present invention is to provide a display panel manufacturing method and a display panel that can repair defective pixels even when it is difficult to irradiate a laser.

  In order to solve the above-described problem, a method for manufacturing a display panel according to one embodiment of the present invention is a method for manufacturing a display panel including a pixel having an organic electroluminescence element, and the display panel includes a plurality of semiconductor elements. A step of forming a lower electrode for each pixel on a planarizing film formed above the semiconductor element, and a step of forming an organic layer including a light emitting layer on the lower electrode; Forming an upper electrode on the organic layer; detecting the semiconductor element or the lower electrode including a defect; and connecting the lower electrode and the upper electrode to the planarization film or the lower electrode. Forming a recess for the purpose.

  In order to solve the above-described problem, a display panel according to an embodiment of the present invention is a display panel including a pixel having an organic electroluminescence element, and includes a plurality of semiconductor elements formed on a substrate, A planarization film formed above a plurality of semiconductor elements; a lower electrode formed for each pixel on the planarization film; and an organic layer including a light emitting layer formed on the lower electrode; An upper electrode formed on the organic layer; and a recess formed on the planarization film or the lower electrode for connecting the lower electrode and the upper electrode. At least one of the lower electrodes includes a defect, and the recess is formed in the lower electrode including the defect.

  In order to solve the above-described problem, a display panel according to an embodiment of the present invention is a display panel including a pixel having an organic electroluminescence element, and includes a plurality of semiconductor elements formed on a substrate, A planarization film formed above a plurality of semiconductor elements; a lower electrode formed for each pixel on the planarization film; and an organic layer including a light emitting layer formed on the lower electrode; An upper electrode formed on the organic layer; and a recess formed on the planarizing film or the lower electrode for connecting the lower electrode and the upper electrode. At least one of them includes a defect, and the recess is formed in the planarizing film or the lower electrode above the semiconductor element including the defect.

  According to the display panel manufacturing method of the present invention, it is possible to provide a display panel manufacturing method and a display panel capable of repairing defective pixels even when it is difficult to irradiate a laser.

Schematic cross section of display panel with defects in lower electrode FIG. 3 is a schematic cross-sectional view showing the configuration of the display panel according to the first embodiment. 6 is a flowchart showing a manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross section showing the manufacturing process of the display panel according to the first embodiment. Schematic cross-section of a display panel containing defects in a semiconductor element Schematic cross section showing the configuration of the display panel according to the second embodiment. 10 is a flowchart showing a manufacturing process of a display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. FIG. 6 is a schematic cross-sectional view showing the manufacturing process of the display panel according to the second embodiment. Schematic cross section showing the configuration of a display panel according to another embodiment Schematic cross section showing the configuration of a display panel according to another embodiment Schematic configuration diagram of a thin flat panel system with an organic EL display panel

  A method for manufacturing an organic electroluminescent element according to the present invention is a method for manufacturing a display panel including a pixel having an organic electroluminescent element. The display panel includes a plurality of semiconductor elements, and is disposed above the semiconductor elements. Forming a lower electrode for each of the pixels on the planarized film, forming an organic layer including a light emitting layer on the lower electrode, and forming an upper electrode on the organic layer; A step of detecting the semiconductor element or the lower electrode including a defect, and a step of forming a recess for connecting the lower electrode and the upper electrode in the planarizing film or the lower electrode. Including.

  According to this aspect, even when there is a defect in a deep position from the substrate surface such as a semiconductor element or a lower electrode and it is difficult to repair by a laser, the defective pixel is repaired by short-circuiting the lower electrode and the upper electrode. Can do.

  Further, at least one of the lower electrodes formed for each pixel includes a defect, and in the step of forming the recess, the recess may be formed in the lower electrode including the defect.

  According to this aspect, when the lower electrode has a defect, by forming a recess in the lower electrode, a portion of the recess is exposed where the organic layer is not formed and the lower electrode is exposed. As a result, the upper electrode and the lower electrode formed above the lower electrode can be short-circuited, so that defective pixels can be repaired.

  Further, in the step of forming the recess, the recess may be formed by pressing a protrusion against the lower electrode.

  According to this aspect, the concave portion can be easily formed by pressing the protrusion against the lower electrode.

  Further, at least one of the plurality of semiconductor elements includes a defect, and in the step of forming the recess, the recess is formed in the planarization film or the lower electrode above the semiconductor element including the defect. May be.

  According to this aspect, by forming the recess in the planarizing film, the lower electrode formed on the recess is also formed in a concave shape along the shape of the recess. A part of the lower electrode formed in a concave shape has a portion where the organic layer is not formed and the lower electrode is exposed. As a result, the upper electrode and the lower electrode formed above the lower electrode can be short-circuited, so that defective pixels can be repaired.

  Further, in the step of forming the recess, the recess may be formed by pressing a protrusion against the planarizing film or the lower electrode.

  According to this aspect, the depression can be easily formed by pressing the protrusion against the planarizing film or the lower electrode.

  The organic electroluminescent element according to the present invention is a display panel including a pixel having an organic electroluminescent element, and is formed on a plurality of semiconductor elements formed on a substrate and above the plurality of semiconductor elements. A planarization film; a lower electrode formed for each pixel on the planarization film; an organic layer including a light emitting layer formed on the lower electrode; and an upper part formed on the organic layer. An electrode and a recess formed on the planarizing film or the lower electrode and connecting the lower electrode and the upper electrode, and at least one of the lower electrodes formed for each pixel has a defect. The recess is formed in the lower electrode including a defect.

  According to this aspect, a portion where the organic layer is not formed and the lower electrode is exposed is formed in a part of the recess formed in the lower electrode. Thereby, since the upper electrode and the lower electrode formed above the lower electrode are short-circuited, the defective pixel can be repaired.

  The organic electroluminescent element according to the present invention is a display panel including a pixel having an organic electroluminescent element, and is formed on a plurality of semiconductor elements formed on a substrate and above the plurality of semiconductor elements. A planarization film; a lower electrode formed for each pixel on the planarization film; an organic layer including a light emitting layer formed on the lower electrode; and an upper part formed on the organic layer. An electrode and a recess formed on the planarization film or the lower electrode and connecting the lower electrode and the upper electrode, wherein at least one of the plurality of semiconductor elements includes a defect, A recess is formed in the planarizing film or the lower electrode above the semiconductor element including a defect.

  According to this aspect, the lower electrode formed on the concave portion is formed in a concave shape along the shape of the concave portion by the concave portion formed in the planarizing film. A part of the lower electrode formed in a concave shape has a portion where the organic layer is not formed and the lower electrode is exposed. Thereby, since the upper electrode and the lower electrode formed above the lower electrode are short-circuited, the defective pixel can be repaired.

  A display panel manufacturing method and a display panel according to embodiments of the present invention will be described below with reference to the drawings. Each of the embodiments described below shows a specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements. In the following description, the same or corresponding elements are denoted by the same reference symbols throughout all the drawings, and redundant description thereof is omitted.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings. In the present embodiment, a display panel manufacturing method and a display panel according to the present embodiment will be described by taking an organic EL display panel including an organic EL element including a defect in a lower electrode as an example.

  First, the problem of the present invention will be described more specifically. FIG. 1 is a schematic cross-sectional view of an organic EL display panel 1 having a defect in a lower electrode.

  As shown in FIG. 1, the organic EL display panel 1 includes a semiconductor layer 12, a planarizing film 14, a lower electrode 16, an organic layer 20, and an upper electrode 22 on a substrate 10. A plurality of semiconductor elements 13 are formed in the semiconductor layer 12. The lower electrode 16 is connected to at least one of the plurality of semiconductor elements 13.

  A partition wall 18 is formed on the planarizing film 14, and each region surrounded by the partition wall 18 becomes a pixel. Here, the lower electrode 16 formed under the organic layer 20 is usually separated by a partition wall 18 for each pixel. However, the organic EL display panel 2 has a short defect portion 16a in which the lower electrodes 16 of adjacent pixels are electrically connected to each other due to a patterning failure or the like when the lower electrode 16 is formed.

  If the short-circuit defective portion 16a exists in the lower electrode 16, the adjacent pixels cannot be lit at their desired brightness because the light emission states of the pixels influence each other. In order to solve this problem, the organic EL display panel 2 according to the present embodiment has the following configuration.

[1-1. Configuration of organic EL element]
Hereinafter, the structure of the organic EL element concerning this Embodiment is demonstrated. FIG. 2 is a schematic cross-sectional view showing the configuration of the organic EL display panel 2 according to the present embodiment.

  As shown in FIG. 2, the organic EL display panel 2 includes an organic function including a planarizing film 14, a lower electrode 16, an organic layer 20, a partition wall 18, and an upper electrode 22 on a substrate 10. It is a device. In the present disclosure, the planarization film 14, the lower electrode 16, the organic layer 30, the upper electrode 22, the thin film sealing layer, the sealing resin layer, and the transparent glass disposed in the region separated by the partition wall 18 are used as pixels. Called. The lower electrode 16, the organic layer 20, and the upper electrode 22 are referred to as an organic EL element.

  The substrate 10 is a substrate made of, for example, sapphire.

  A semiconductor layer 12 is formed on the substrate 10. A plurality of semiconductor elements 13 are formed in the semiconductor layer 12. The semiconductor element 13 is, for example, a driving thin film transistor (TFT).

  A planarizing film 14 is formed on the semiconductor layer 12. For example, the planarization film 14 is made of an insulating organic material. In the planarization film 14, a via 15 in which a conductive material is filled in a through hole penetrating from the upper surface of the planarization film 14 to the semiconductor element 13 is formed above the semiconductor element 13.

  A plurality of lower electrodes 16 are formed on the planarizing film 14 so as to cover the vias 15. Each of the plurality of lower electrodes 16 is connected to at least one of the plurality of semiconductor elements 13 via the via 15.

  The lower electrode 16 is an anode to which holes are supplied, that is, an anode into which current flows from an external circuit. The lower electrode 16 is formed on the planarization film 14 for each pixel. That is, in the organic EL display panel 2, a plurality of lower electrodes 16 are formed on the planarizing film 14. The lower electrode 16 has a structure in which, for example, a reflective electrode made of Al or a silver alloy APC (silver-palladium-copper alloy) is laminated on the planarizing film 14. In this case, the thickness of the reflective electrode is 500 nm or less as an example. The lower electrode 16 may have a two-layer structure made of, for example, ITO (Indium Tin Oxide) and silver alloy APC.

  The organic layer 20 includes a light emitting layer that emits light when a voltage is applied between the lower electrode 16 and the upper electrode 22. The thickness of the light emitting layer is 150 nm or less as an example.

For example, the light emitting layer has a structure in which α-NPD (Bis [N- (1-naphthyl) -N-phenyl] benzidine) is stacked as a lower layer and Alq ₃ (tris- (8-hydroxyquinoline) aluminum) is stacked as an upper layer. ing.

  The organic layer 20 may include a hole injection layer between the light emitting layer and the lower electrode 16 and an electron injection layer between the light emitting layer and the upper electrode 22. In this case, the hole injection layer, the light emitting layer, and the electron injection layer are collectively referred to as the organic layer 20. Further, the organic layer 20 may include a hole transport layer between the hole injection layer and the light emitting layer, and an electron transport layer between the electron injection layer and the light emitting layer. In this case, the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer, and the electron injection layer are collectively referred to as the organic layer 20. At this time, the thickness of the organic layer 20 is 100 nm or more and 200 nm or less as an example.

  The hole injection layer is a layer mainly composed of a hole injecting material. The hole injecting material is a material having a function of injecting holes injected from the lower electrode 16 side into the organic layer 20 stably or assisting generation of holes. For example, PEDOT ( Polyethylenedioxythiophene) and aniline are used.

  The electron injection layer is a layer mainly composed of an electron injecting material. The electron injecting material is a material having a function of injecting electrons injected from the upper electrode 22 into the organic layer 20 stably or assisting the generation of electrons. For example, polyphenylene vinylene (PPV) is used. used.

  The hole transport layer is a layer mainly composed of a material having a hole transport property. The material having a hole transporting property has both the property of having an electron donor property and easily becoming a cation (hole) and the property of transferring the generated hole by a charge transfer reaction between molecules. A material that has suitability for up to 20 charge transport.

  The electron transport layer is a layer mainly composed of an electron transport material. The electron transporting material has both the property of being an electron acceptor and easily becoming an anion, and the property of transferring generated electrons by a charge transfer reaction between molecules, and charge transport from the upper electrode 22 to the organic layer 20. It is a material that has suitability for.

  The upper electrode 22 is a cathode to which electrons are supplied, that is, a cathode from which current flows to an external circuit. The upper electrode 22 may be configured by a single layer or may be configured by stacking a plurality of layers. For example, the upper electrode 22 may have a configuration in which an ITO layer that is a transparent metal oxide and a metal layer are laminated. In this case, the ITO layer is formed of a material such as Mg or Ag. The metal layer is formed of a material having a higher refractive index than the ITO layer, for example, a material such as silver (Ag), a silver alloy APC, or magnesium (Mg). Thereby, in the metal layer, since the light emitted from the organic EL display panel 2 is refracted so as to be collected, the strong cavity of the organic EL display panel 2 can be realized. The thickness of the ITO layer is, for example, 30 nm or more and 90 nm or less, the thickness of the metal layer is, for example, 15 nm or more and 30 nm or less, and the thickness of the upper electrode 22 is, for example, 45 nm or more and 120 nm or less.

  The partition wall 18 is a wall for separating the organic layer 20 into a plurality of pixels, and is made of, for example, a photosensitive resin.

  The organic EL display panel 2 further includes a thin film sealing layer (not shown), a sealing resin layer, and transparent glass on the upper electrode 22.

  The thin film sealing layer is made of, for example, silicon nitride and has a function of blocking the organic layer 20 and the upper electrode 22 described above from water vapor and oxygen. By forming the thin film sealing layer, the organic EL display panel 2 can prevent the organic layer 20 itself and the upper electrode 22 from being deteriorated (oxidized) by being exposed to water vapor or oxygen.

  The sealing resin layer is an acrylic or epoxy resin, and has a function of joining the layer formed integrally from the planarization film 14 formed on the substrate to the thin film sealing layer and the transparent glass. Have.

  The transparent glass is a substrate that protects the light emitting surface of the light emitting panel. For example, the transparent glass is a transparent alkali-free glass having a thickness of 0.5 mm.

  The organic EL display panel 2 may further include a color filter that adjusts the colors of red, green, and blue on the lower surface of the transparent glass so as to cover each pixel separated by the partition wall 18. .

  The configuration of the lower electrode 16, the organic layer 20, and the upper electrode 22 described above is a basic configuration of the organic EL display panel 2. With such a configuration, an appropriate voltage is applied between the lower electrode 16 and the upper electrode 22. Then, holes are injected into the organic layer 20 from the lower electrode 16 side and electrons from the upper electrode 22 side, respectively. Due to the energy generated by recombination of the injected holes and electrons in the organic layer 20, the light emitting material of the organic layer 20 is excited and emits light.

  Furthermore, in the organic EL display panel 2 shown in FIG. 2, at least one of the plurality of lower electrodes 16 includes a defect in the manufacturing process. Specifically, it includes a defect that the lower electrodes 16 of adjacent pixels are connected and short-circuited. Due to this short circuit, pixels in which the lower electrode 16 is short-circuited affect each other, causing a problem of light emission such as failure to light at a desired brightness. In order to solve this problem, the organic EL display panel 2 includes a recess 24 in the lower electrode 16 including a defect.

  The recess 24 is a recess formed in a concave shape in the thickness direction of the layer of the lower electrode 16 from the upper surface of the lower electrode 16 including a defect. When the organic layer 20 is formed, the liquid organic layer 20 material is dropped into the recess 24. Therefore, a part of the recess 24 has a region where the organic layer 20 is not applied in the recess 24 and the lower electrode 16 is exposed. Therefore, in the region where the lower electrode 16 is exposed, the upper electrode 22 and the lower electrode 16 formed thereafter are connected. As a result, the lower electrode 16 and the upper electrode 22 are short-circuited, so that no current flows through the organic layer 20 in the pixel including the lower electrode 16 including a defect, which becomes a dark spot. Therefore, pixels having the lower electrode 16 short-circuited affect each other, and it is possible to solve the problem of light emission such as failure to light at a desired brightness.

[1-2. Manufacturing method of organic EL element]
Hereinafter, the manufacturing method of the organic EL display panel 2 will be described with reference to FIGS. FIG. 3 is a flowchart showing manufacturing steps of the organic EL element according to this embodiment. 4 to 13 are schematic cross-sectional views showing the manufacturing process of the organic EL element according to the present embodiment.

  Hereinafter, it demonstrates along the flowchart of FIG.

  First, as shown in FIG. 4, a substrate 10 is prepared. The substrate 10 is a sapphire substrate, for example.

  Next, as shown in FIG. 5, the semiconductor layer 12 including the semiconductor element 13 is formed on the substrate 10 (step S10). The semiconductor element 13 is, for example, a TFT, and the semiconductor element 13 is formed by forming and patterning a semiconductor material in a predetermined position and shape.

  Next, as shown in FIG. 6, a planarizing film 14 made of an insulating organic material is formed on the semiconductor layer 12 (step S10). Thereafter, as shown in FIG. 7, a through-hole penetrating from the surface of the planarization film 14 to the semiconductor element 13 is formed at the position of the plurality of semiconductor elements 13. Further, the through hole is filled with a conductive material. Thereby, the via 15 is completed.

  Subsequently, as shown in FIG. 8, the lower electrode 16 is formed on the planarizing film 14 (step S11). The lower electrode 16 is formed by film formation and patterning. First, Al is deposited to a thickness of 300 nm on the planarizing film 14 by sputtering. Subsequently, the deposited Al is patterned into a predetermined shape by photolithography and wet etching. At this time, Al is patterned into a shape connected to at least one of the plurality of semiconductor elements 13. Thereby, a plurality of lower electrodes 16 are completed.

  Here, as shown in FIG. 8, when the lower electrode 16 described above is formed, there may be a short-circuit defective portion 16a in which the lower electrodes 16 of adjacent pixels are electrically connected due to a patterning defect or the like. Therefore, after the formation of the lower electrode 16, the lower electrode 16 including a defect is detected (step S12).

  For example, the lower electrode 16 including a defect images a plane of the substrate on which the formation of the lower electrode 16 has been completed by an imaging device with a microscope, and visually detects a portion where the lower electrodes 16 are electrically connected to each other from the captured image. The partial electrode 16 including a defect is not limited to visual observation of imaging, but may be an electrical method such as detecting that a current flows by contacting a probe.

  Next, as shown in FIG. 9, partition walls 18 are formed on the planarizing film 14 and the lower electrode 16. The partition wall 18 is formed by applying a surface-sensitive resin so as to cover the planarizing film 14 exposed between the adjacent lower electrodes 16. At this time, the partition wall 18 is also formed on a part of the lower electrode 16. In addition, since the planarization film 14 is not exposed at the short-circuit defective portion 16a described above, the partition wall 18 is formed on the short-circuit defective portion 16a.

  Subsequently, as shown in FIGS. 10 and 11, a recess 24 is formed on the lower electrode 16 having the short defect location 16a (step S13). The recess 24 is formed by pressing the protrusion 26 against the upper surface of the lower electrode 16. Thereby, the recessed part 24 of the same shape as the shape of the front-end | tip of the protrusion 26 is completed. For example, an application needle for applying these materials when forming the partition wall 18 or the organic layer 20 may be used as the protrusion 26.

  Furthermore, as shown in FIG. 12, the organic layer 20 (20a, 20b, and 20c) is formed on each of the lower electrodes 16 separated into a plurality of pixels by the partition wall 18 (step S14). In the lower electrode 16 in which the recess 24 is formed, the organic layer 20 is formed so that a part of the lower electrode 16 is exposed in the recess 24. Here, an organic layer having a hole injection layer and an electron injection layer in addition to the light emitting layer will be described as an example.

  First, a hole injection layer is formed on the lower electrode 16. As a material constituting the hole injection layer, for example, a PEDOT solution in which PEDOT is dissolved in a solvent made of xylene is generated. The generated PEDOT solution is dropped on the lower electrode 16 and dried to complete the hole injection layer.

Next, a light emitting layer is formed on the hole injection layer. As a material constituting the light emitting layer, for example, α-NPD and Alq ₃ are stacked on the hole injection layer to complete the light emitting layer.

  Next, an electron injection layer is formed on the light emitting layer. As a material constituting the electron injection layer, for example, a PPV solution in which polyphenylene vinylene (PPV) is dissolved in a solvent made of xylene or chloroform is generated. Then, the generated PPV solution is dropped on the light emitting layer and dried to complete the electron injection layer. Thus, the organic layer 20 is completed. The thickness of the organic layer 20 may be changed for each of the organic layers 20a, 20b, and 20c in accordance with the R, G, and B color filters that are arranged.

  As described above, since the material of the liquid organic layer 20 is dropped into the recess 24, the organic layer 20 is applied in the recess 24 in a part of the recess 24, for example, near the edge of the recess 24. A region where the lower electrode 16 is exposed is not formed.

  Subsequently, as shown in FIG. 13, the upper electrode 22 is formed on the organic layer 20 (step S15). For example, after the organic layer 20 is formed, the upper electrode 22 is continuously formed without exposing the substrate on which the organic layer 20 is formed to the atmosphere. Here, the upper electrode 22 having a configuration in which an ITO layer and a metal layer are laminated will be described as an example.

  First, an ITO layer is formed on the organic layer 20. Specifically, ITO is laminated on the electron injection layer constituting the organic layer 20 by a sputtering method. The thickness of the ITO at this time is, for example, 75 nm. At this time, the ITO layer is in an amorphous state.

  Next, a metal layer is formed on the ITO layer. Specifically, a metal constituting the metal layer, for example, Ag is laminated on the ITO layer by sputtering. At this time, the thickness of the metal layer is, for example, 20 nm. Thereby, the upper electrode 22 is completed.

  As described above, a region where the lower electrode 16 is exposed is formed in the recess 24, and the upper electrode 22 and the lower electrode 16 are connected in this region. Thereby, the lower electrode 16 and the upper electrode 22 are short-circuited.

  Further, a thin film sealing layer, a sealing resin layer, a color filter, and transparent glass are sequentially formed on the upper electrode 22.

  The organic EL display panel 2 is completed by the manufacturing process as described above.

  In addition, the formation process of the lower electrode 16, the positive hole injection layer, the organic layer 20, the electron injection layer, and the upper electrode 22 is not limited by this Embodiment.

  In the above-described embodiment, after the formation of the lower electrode 16, the lower electrode 16 including a defect is detected, the partition wall 18 is subsequently formed, and then the recess 24 is formed. After detecting 16, the recess 24 may be formed before the partition wall 18 is formed, and then the partition wall 18 may be formed.

[1-3. Effect]
As described above, according to the method of manufacturing the organic EL element according to the present embodiment, when the lower electrode 16 has a defect, the recess 24 is formed in the lower electrode 16, so that an organic layer is formed on a part of the recess 24. 20 is not formed, and a portion where the lower electrode 16 is exposed is generated. Thereby, the upper electrode 22 and the lower electrode 16 formed above the lower electrode 16 can be short-circuited. Thereby, a defective pixel can be darkened. Therefore, defective pixels can be repaired even when it is difficult to irradiate a laser.

(Embodiment 2)
Next, a second embodiment will be described. In the first embodiment described above, the organic EL display panel 2 includes a defect in the lower electrode 16, whereas the organic EL display panel according to the present embodiment differs in that the TFT 13 includes a defect. ing.

  FIG. 14 is a schematic cross-sectional view of the organic EL display panel 3 in which a TFT has a defect.

  As shown in FIG. 14, the organic EL display panel 3 is similar to the organic EL display panel 1 described in the first embodiment, on the substrate 10, the semiconductor layer 12, the planarization film 14, the lower electrode 16, A layer 20 and an upper electrode 22 are provided. A plurality of semiconductor elements 33 are formed in the semiconductor layer 12. The lower electrode 16 is connected to at least one of the plurality of semiconductor elements 33. Further, a partition wall 18 is formed on the planarizing film 14, and each region surrounded by the partition wall 18 becomes a pixel.

  Here, in the plurality of semiconductor elements 33, the desired semiconductor element 33 is not formed due to a patterning defect or the like in the manufacturing process, and a semiconductor element 33 a including a defect also exists. Therefore, the pixel in which the semiconductor element 33a including a defect is formed cannot be lit with a desired brightness. In order to solve this problem, the organic EL display panel 4 according to the present embodiment has the following configuration.

[2-1. Configuration of organic EL element]
Hereinafter, the structure of the organic EL element concerning this Embodiment is demonstrated. FIG. 15 is a schematic cross-sectional view showing the configuration of the organic EL display panel 4 according to the present embodiment.

  As shown in FIG. 15, the organic EL display panel 4 includes an organic function including a planarizing film 34, a lower electrode 36, an organic layer 20, a partition wall 18, and an upper electrode 22 on a substrate 10. It is a device. Since these configurations are the same as those of the organic EL display panel 2 shown in the first embodiment, detailed description thereof is omitted. Due to the configuration of the organic EL display panel 4, when an appropriate voltage is applied between the lower electrode 36 and the upper electrode 22, holes are injected from the lower electrode 36 side and electrons are injected from the upper electrode 22 side into the organic layer 20, respectively. Is done. Due to the energy generated by recombination of the injected holes and electrons in the organic layer 20, the light emitting material of the organic layer 20 is excited and emits light.

  Here, in the organic EL display panel 4 shown in FIG. 15, a defect is generated in at least one of the plurality of semiconductor elements 33 in the manufacturing process. This defect is, for example, a patterning defect or a missing member when the gate electrode, the source electrode, and the drain electrode of the semiconductor element 33 are formed by patterning. Thereby, since the semiconductor element 33a does not operate normally, a pixel having the semiconductor element 33a has a light emission defect such that it cannot be lit at a desired brightness.

  In order to solve this problem, the organic EL display panel 4 short-circuits the upper electrode 22 and the lower electrode 16 in the pixel in which the semiconductor element 33a including the defect is formed, and darkens the pixel. In order to darken the pixel, the organic EL display panel 4 includes a recess 37 in the planarization film 34 in the pixel in which the semiconductor element 33a including the defect is disposed.

  The recess 37 is a recess formed in a concave shape in the thickness direction of the layer of the planarization film 34 from the upper surface of the planarization film 34 in the pixel in which the semiconductor element 13 including a defect is formed. The lower electrode 36 formed on the recess 37 is formed in a concave shape along the shape of the recess 37. Further, when the organic layer 20 is formed, the liquid organic layer 20 material is dropped on the lower electrode 36. Therefore, a part of the lower electrode 36 that is formed in a concave shape along the shape of the concave portion 37 has a region where the organic layer 20 is not applied and the lower electrode 36 is exposed. Therefore, in the region where the lower electrode 36 is exposed, the upper electrode 22 and the lower electrode 36 formed thereafter are connected. As a result, the lower electrode 36 and the upper electrode 22 are short-circuited, so that no current flows through the organic layer 20 in the pixel including the lower electrode 36 including a defect, which becomes a dark spot. Therefore, by forming the concave portion 37 in the planarization film 34, it is possible to eliminate the problem of light emission of the pixel in which the semiconductor element 33a including the defect is formed.

[2-2. Manufacturing method of organic EL element]
Hereinafter, a method for manufacturing the organic EL display panel 4 will be described with reference to FIGS. FIG. 16 is a flowchart showing manufacturing steps of the organic EL display panel 4 according to the present embodiment. 17 to 26 are schematic cross-sectional views showing the manufacturing process of the organic EL element according to this embodiment.

  Hereinafter, description will be given along the flowchart of FIG.

  First, as in the organic EL display panel 2 shown in the first embodiment, a substrate 10 is prepared as shown in FIG. Subsequently, as shown in FIG. 18, the semiconductor layer 12 including the semiconductor element 33 is formed on the substrate 10 (step S20). At this time, the semiconductor element 33a including a defect may be formed due to a patterning defect or the like.

  Next, as shown in FIG. 19, a planarizing film 34 made of an insulating organic material is formed on the semiconductor layer 12 (step S20). Thereafter, as shown in FIG. 20, a through-hole penetrating from the surface of the planarization film 34 to the semiconductor element 33 is formed at the position of the plurality of semiconductor elements 33. Further, the through hole is filled with a conductive material. Thereby, the via 15 is completed.

  Here, the semiconductor element 33a including a defect is detected (step S21). For example, the semiconductor element 33a including a defect images a plane of the substrate on which the semiconductor element 33 is formed using an imaging device with a microscope, and the semiconductor element 33a including a defect is visually detected due to a patterning defect in the captured image. The semiconductor element 33a including the defect is not limited to visual observation of imaging, and may be an electrical method such as detecting by contacting a probe.

  Subsequently, as shown in FIGS. 21 and 22, a recess 37 is formed on the planarization film 34 of the pixel in which the semiconductor element 33a including the defect is formed (step S22). The recess 37 is formed by pressing the protrusion 26 against the upper surface of the planarization film 34 in the pixel in which the semiconductor element 33a including a defect is formed. Thereby, the recessed part 37 of the shape same as the shape of the front-end | tip of the protrusion 26 is completed. For example, an application needle for applying these materials when forming the partition wall 18 or the organic layer 20 may be used as the protrusion 26.

  Subsequently, as shown in FIG. 23, a lower electrode 36 is formed on the planarizing film 34 (step S23). The lower electrode 36 is formed by film formation and patterning.

  First, Al is deposited to a thickness of 300 nm on the planarizing film 34 and the recess 37 by sputtering. Subsequently, the deposited Al is patterned into a predetermined shape by photolithography and wet etching. Thereby, a plurality of lower electrodes 36 are completed. In the portion where the recess 37 is formed on the planarizing film 34, the lower electrode 36 is formed in a concave shape along the shape of the recess 37.

  Next, as in the organic EL display panel 2 shown in the first embodiment, as shown in FIG. 24, the partition wall 18 is formed on the planarizing film 34 and the lower electrode 36. Further, as shown in FIG. 25, organic layers 20a, 20b, and 20c are formed on each of the lower electrodes 36 separated into a plurality of pixels by the partition wall 18 (step S24). At this time, the material of the liquid organic layer 20 is dropped on the lower electrode 36. Therefore, a region in which the organic layer 20 is not applied and the lower electrode 36 is exposed is formed in a part of the lower electrode 36 formed in a concave shape along the shape of the concave portion 37. The organic layer 20 may have a structure having a hole injection layer and an electron injection layer in addition to the light emitting layer.

  Subsequently, as shown in FIG. 26, the upper electrode 22 is formed on the organic layer 20 (step S25). At this time, in the region where the lower electrode 36 is exposed, the upper electrode 22 and the lower electrode 36 are connected. As a result, the lower electrode 36 and the upper electrode 22 are short-circuited. The upper electrode 22 may have a configuration in which an ITO layer and a metal layer are stacked.

  Further, a thin film sealing layer, a sealing resin layer, a color filter, and transparent glass are sequentially formed on the upper electrode 22.

  The organic EL display panel 4 is completed by the manufacturing process as described above.

  In addition, the formation process of the lower electrode 36, the hole injection layer, the organic layer 20, the electron injection layer, and the upper electrode 22 is not limited by this embodiment.

  In the above-described embodiment, the detection of the semiconductor element 33a including the defect is performed after the planarization film 14 is formed on the semiconductor element 33 and the via 15 is further formed. Immediately after the formation of the planarizing film 34, or immediately after the production of the planarizing film 34 may be performed.

  In the above-described embodiment, the concave portion 37 is formed on the planarizing film 34. However, the concave portion 37 is not limited to the planarizing film 34, and the lower electrode 36 and the upper electrode 22 are short-circuited. It may be formed at any position as long as it can be configured. For example, it may be formed on the lower electrode 36 as in the first embodiment.

[2-3. Effect]
As described above, according to the method for manufacturing the organic EL element according to the present embodiment, the lower electrode 36 formed on the concave portion 37 is also formed in a concave shape along the shape of the concave portion 37. Then, a portion of the lower electrode 36 formed in a concave shape has a portion where the organic layer 20 is not formed and the lower electrode 36 is exposed. Thereby, the upper electrode 22 and the lower electrode 36 formed above the lower electrode 36 can be short-circuited. Therefore, the defective pixel can be darkened. Therefore, defective pixels can be repaired even when it is difficult to irradiate a laser.

(Other embodiments)
In addition, this invention is not limited to embodiment mentioned above, You may perform a various improvement and deformation | transformation within the range which does not deviate from the summary of this invention. 27 and 28 are schematic cross-sectional views showing the configuration of a display panel according to another embodiment.

  In Embodiment 1 described above, when the organic layer 20 is formed, the liquid organic layer 20 material is dropped and dried. However, after the liquid organic layer 20 material is dropped, spin coating is performed. May be. Thereby, as shown in FIG. 27, the material of the liquid organic layer 20 is applied on one side of the recess 44, and there is a region where the lower electrode 16 is exposed on the other side. Therefore, since the area of the region where the lower electrode 16 is exposed can be increased, the upper electrode 22 and the lower electrode 16 formed thereafter can be connected with a wider area.

  In Embodiment 1 described above, after forming the lower electrode 16 and before forming the organic layer 20, the protrusions 26 are pressed against the lower electrode 16 to form the recesses 24. However, the organic layer 20 is formed. After that, the protrusions 26 may be pressed against the lower electrode 16 and the organic layer 20 to form the recesses 54 so that the lower electrode 16 is exposed. In this case, as shown in FIG. 28, the lower electrode 16 can be reliably exposed, so that the upper electrode 22 and the lower electrode 16 formed thereafter can be more reliably connected.

  In the above-described embodiment, the configuration in which the lower electrode is an anode and the upper electrode is a cathode is shown, but the lower electrode may be a cathode and the upper electrode may be an anode. In addition, the planarization film, anode, hole injection layer, light emitting layer, partition wall, electron injection layer, cathode, thin film sealing layer, sealing resin layer, and transparent glass, which are the constitution of the organic EL element, are as described above. Not only the configuration shown in the embodiment but also the material, configuration, and formation method may be changed. For example, a hole transport layer may be provided between the hole injection layer and the light emitting layer, or an electron transport layer may be provided between the electron injection layer and the light emitting layer. Moreover, the structure provided with the color filter which performs color adjustment of red, green, and blue on the lower surface of transparent glass so that each pixel isolate | separated by the partition may be covered.

  In addition, various modifications that are conceivable by those skilled in the art and forms constructed by combining components in different embodiments are also within the scope of the present invention without departing from the spirit of the present invention. included. For example, a thin flat TV system including the organic EL element according to the present invention as shown in FIG. 29 is also included in the present invention.

  The method for producing an organic EL element and the organic EL element according to the present invention are particularly useful in technical fields such as a thin-screen television and a personal computer display that require a large screen and high resolution.

1, 2, 3, 4 Organic EL display panel (display panel)
DESCRIPTION OF SYMBOLS 12 Semiconductor layer 13, 33, 33a Semiconductor element 14, 34 Planarization film 15 Via 16, 36 Lower electrode 16a Short defect location 18 Partition 20, 20a, 20b, 20c Organic layer 22 Upper electrode 24, 37, 44, 54 Recess 26 Protrusion

Claims (7)

A method of manufacturing a display panel including a pixel having an organic electroluminescence element,
The display panel has a plurality of semiconductor elements,
Forming a lower electrode for each pixel on a planarizing film formed above the semiconductor element;
Forming an organic layer including a light emitting layer on the lower electrode;
Forming an upper electrode on the organic layer;
Detecting the semiconductor element or the lower electrode including a defect;
Forming a recess for connecting the lower electrode and the upper electrode to the planarizing film or the lower electrode. A method of manufacturing a display panel. At least one of the lower electrodes formed for each pixel includes a defect;
The method for manufacturing a display panel according to claim 1, wherein in the step of forming the recess, the recess is formed in the lower electrode including a defect. The method for manufacturing a display panel according to claim 2, wherein, in the step of forming the recess, the recess is formed by pressing a protrusion against the lower electrode. At least one of the plurality of semiconductor elements includes a defect;
The method for manufacturing a display panel according to claim 1, wherein in the step of forming the recess, the recess is formed in the planarizing film or the lower electrode above the semiconductor element including a defect. The method for manufacturing a display panel according to claim 4, wherein in the step of forming the recess, the recess is formed by pressing a protrusion against the planarizing film or the lower electrode. A display panel including a pixel having an organic electroluminescence element,
A plurality of semiconductor elements formed on a substrate;
A planarization film formed above the plurality of semiconductor elements;
A lower electrode formed for each pixel on the planarizing film;
An organic layer including a light emitting layer formed on the lower electrode;
An upper electrode formed on the organic layer;
Formed in the planarizing film or the lower electrode, and comprising a recess for connecting the lower electrode and the upper electrode,
At least one of the lower electrodes formed for each pixel includes a defect;
The said recessed part is formed in the said lower electrode containing a defect Display panel. A display panel including a pixel having an organic electroluminescence element,
A plurality of semiconductor elements formed on a substrate;
A planarization film formed above the plurality of semiconductor elements;
A lower electrode formed for each pixel on the planarizing film;
An organic layer including a light emitting layer formed on the lower electrode;
An upper electrode formed on the organic layer;
Formed in the planarizing film or the lower electrode, and comprising a recess for connecting the lower electrode and the upper electrode,
At least one of the plurality of semiconductor elements includes a defect;
The said recessed part is formed in the said planarization film | membrane or the said lower electrode above the said semiconductor element containing a defect. The display panel.

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