JP2017069509A - Manufacturing method for light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for a light-emitting device capable of avoiding the risk that an end material or the like is left on a jig for dicing, while shortening the work time.SOLUTION: A manufacturing method for a light-emitting device includes the steps of: preparing an aggregate substrate including a plurality of aggregations, where more than one aggregations each consisting of a plurality of light-emitting devices are arranged in one direction, and coupling parts placed between the aggregate and an adjacent aggregate; preparing a bed where the friction coefficient of a region in which the coupling part of aggregate substrate is placed is smaller than that of a region where the aggregate is placed; placing the aggregate substrate on the bed, and separating the aggregate substrate into a plurality of aggregations and the coupling parts; and cutting and individualizing the aggregation.SELECTED DRAWING: Figure 5

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  A manufacturing method for obtaining a plurality of light-emitting devices by dividing a collective substrate on which a plurality of light-emitting elements are mounted is known. Such a collective substrate has a product part in which a plurality of light emitting devices are connected, and a non-product part called a scrap in the manufacturing process. Patent Document 1 discloses an aggregate substrate which is an example of such an aggregate substrate. When cutting a collective substrate as in Patent Document 1, the cutting material is flowed using cutting water or blown off the cutting material so that the generated cutting material and contamination do not remain on the jig. The cutting process is performed.

JP-A-2015-37100

  However, in the collective substrate as in Patent Document 1, not all the end materials are flown, and for example, relatively large end materials may remain on the jig. The remaining end materials and the like may cause problems such as adhesion to individual light emitting devices separated by the cutting process or contact with the cutting blade during the cutting process to break the cutting blade. . Therefore, a process for removing the end material on the jig is newly required, which may increase the manufacturing process and the working time.

  Accordingly, an object of the present embodiment is to provide a method for manufacturing a light emitting device that does not require a step of removing offcuts and the like.

  In the light emitting device manufacturing method of the present embodiment, an assembly composed of a plurality of light emitting devices is arranged between a plurality of assemblies in which at least two or more arrays are arranged in one direction and an assembly adjacent to the assembly. And a step of preparing a base in which a friction coefficient of a region where the connecting portion of the collective substrate is placed is smaller than a friction coefficient of a region where the aggregate is placed; The method includes a step of placing the collective substrate on a base, separating the collective substrate into a plurality of collectives and connecting portions, and a step of cutting the collective piece into individual pieces.

  According to the present embodiment, it is possible to avoid the possibility that the end material or the like remains on the jig, and it is possible to provide a method for manufacturing a light emitting device with a short work time.

It is a schematic plan view showing a lead frame of the present embodiment. It is the figure which showed the part enclosed with the broken line of FIG. 1A in detail. It is a schematic plan view which shows the aggregate substrate of this embodiment. It is the figure which showed the part enclosed with the broken line of FIG. 2A in detail. It is a schematic plan view which shows the foundation and mask of this embodiment. It is a schematic plan view which shows the state in which the hardly soluble particle | grains of this embodiment are formed. It is a model perspective view which shows a mode that a collective substrate is mounted on the base of this embodiment.

Hereinafter, the present embodiment will be described with reference to the drawings. However, the embodiments described below are intended to embody the technical idea of the present disclosure, and are not intended to limit the technical scope of the present disclosure. The configuration described in one embodiment is applicable to other embodiments unless otherwise specified. In the following description, terms indicating a specific direction or position (for example, “up”, “down”, “right”, “left” and other terms including these terms) are used as necessary. The use of the terminology is intended to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present disclosure is not limited by the meaning of these terms.
It should also be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

The manufacturing method of the light emitting device 100 according to the present disclosure includes a step of preparing the collective substrate 1, a step of preparing a base 5 having a different friction coefficient depending on a region, and placing the collective substrate 1 on the base 5. A step of separating the plurality of assemblies 2 and the connecting portion 3, and a step of cutting the assembly 2 to obtain a light-emitting device 100 singulated.
Hereafter, each process is demonstrated in detail using drawing.

(Process for preparing the assembly board)
With reference to FIG. 1A-FIG. 2B, the process of preparing the aggregate substrate 1 is demonstrated. Here, a resin molded body having the lead frame 7 and the molded body 8 as constituent elements will be described as an example of the collective substrate 1. The aggregate substrate 1 is not limited to a resin molded body, and for example, an aggregate substrate mainly made of ceramic, glass, or the like can be used. Moreover, although the process of forming an aggregate substrate is shown here, it may be prepared by purchasing an aggregate substrate formed in advance.

First, a metal plate is punched and divided into a region X where a plurality of light emitting devices are formed (a region that will later become an assembly 2) and a connecting portion 3 (a hatched region) that connects the regions X. The formed lead frame 7 is formed. FIG. 1A is a schematic plan view showing such a lead frame 7, and FIG. 1B is a diagram showing in detail a portion surrounded by a broken line in FIG. 1A. At least two regions X in which a plurality of light emitting devices are formed are arranged in one direction. In FIG. 1A, four regions X are formed and three connection portions 3 are formed. As shown in FIG. 1A, the connecting portion 3 of this embodiment has a through hole 9. By providing the through hole 9 in the connecting portion 3, even when the collective substrate 1 is warped, the warping stress of the collective substrate 1 can be relaxed by the connecting portion 3. The proportion of the through-hole 9 in the connecting portion 3 is preferably 30% or more, more preferably 50% or more, and more preferably 70% or more of the plane area of the connecting portion 3 when there is no through-hole 9. More preferably it is. In addition, the shape of the connection part 3 when not considering the through-hole 9 can have not only a rectangular shape as shown in FIG. 1A but various shapes, such as another polygon, a circle, or its combination. Moreover, the flat connection part 3 which is not provided with the through-hole 9 may be sufficient. The lead frame 7 may further include a frame 4 that is formed outside the region X where the plurality of light emitting devices are formed and the connecting portion 3 and connected to each portion. Since the connecting portion 3 and the frame body 4 are non-product portions, they become end materials after being cut from the lead frame 7.
The lead frame 7 may be provided with irregularities on the surface by processing such as etching or pressing. Such unevenness improves the adhesion strength between the lead frame 7 and the molded body 8. Further, a plated layer of Ni, Pd, Au, Ag or the like is applied to the surface of the lead frame 7, but the step of forming the plated layer may be performed before the molded body 8 is formed, or the molded body It may be after forming 8.

  Next, the lead frame 7 is sandwiched using a mold having an upper mold having a convex part and a lower mold. Then, the molded body 8 is transfer-molded in the mold to form the molded body 8 on the lead frame 7. At this time, in the region X where the plurality of light emitting devices are formed, the region sandwiched between the convex portions corresponds to the concave portion of the light emitting device 100, and the region not sandwiched between the convex portions becomes a void, and the molded body 8 is formed in this void. It is formed. FIG. 2A is a schematic plan view showing the aggregate substrate formed as described above, and FIG. 2B is a diagram showing in detail a portion surrounded by a broken line in FIG. 2A. The method for forming the molded body 8 is not limited to transfer molding, and various molding methods such as injection molding and compression molding can be used.

  Next, in the region X where the plurality of light emitting devices are formed, the light emitting element 10 is placed in the plurality of concave portions of the resin molded body. At this time, the light emitting element 10 is mounted using a die bond material, and the electrode of the light emitting element 10 and the lead frame 7 are electrically connected by a wire. However, the light emitting element 10 may be flip-chip mounted via a conductive member such as solder.

  And a translucent member is formed in a recessed part so that the light emitting element 10 may be coat | covered. As a material of the translucent member, for example, a silicone resin, an epoxy resin, an acrylic resin, an unsaturated polyester resin, or a resin containing one or more of these can be used. The translucent member contains light scattering particles such as titanium oxide, silicon oxide, zirconium oxide, zinc oxide, aluminum oxide, and aluminum nitride, and a phosphor that converts the wavelength of light emitted from the light emitting element 10. May be.

  Through the above steps, the assembly 2 composed of the plurality of light emitting devices 100 is arranged between the plurality of assemblies 2 arranged in at least two in one direction and the assembly 2 adjacent to the assembly 2. It is possible to prepare a collective substrate 1 having a connecting portion.

(Process of preparing the foundation)
Next, the process of preparing the base 5 having a different friction coefficient depending on the region will be described. Specifically, a base 5 having a friction coefficient smaller than that of a region where the aggregate 2 is placed is used as the base 5. The base 5 at this time refers to a work table on which a workpiece is placed and a dicing process is performed in a dicing apparatus. The base 5 is preferably provided with suction holes for vacuum suction in order to fix the workpiece. With reference to FIGS. 3 to 4, the step of preparing the base 5 on which the hardly soluble particles 6 are formed using the mask M will be described in detail.

First, as shown in FIG. 3, a dummy collective substrate D is placed on the upper surface of the base 5 of the dicing apparatus. As the dummy collective substrate D used at this time, a collective substrate having substantially the same outer shape as the collective substrate 1 obtained in the previous step is used. For example, as the dummy collective substrate D, the collective substrate 1 that has become defective in the previous process can be used.
The base 5 at this time is a part of the dicing apparatus and refers to a base on which the collective substrate 1 is placed. On the surface of the base 5, a large number of suction holes for vacuum-sucking the base 5 and the collective substrate 1 are provided. The surface on which the aggregate substrate 1 of the base 5 is placed is preferably made of an elastic member. For example, a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, a fluororesin composition Etc.

  Next, the dummy collective substrate D is vacuum-sucked to the base 5 to fix the dummy collective substrate D. At this time, the portion corresponding to the connecting portion 3 of the dummy aggregate substrate D is not attracted to the base 5 or is attracted to the base 5 with an adsorption force weaker than the adsorption force of the portion corresponding to the aggregate 2. Further, the dummy collective substrate D and the base 5 are arranged so that the planned cutting line of the dummy collective substrate D to be cut is parallel to the blade of the dicing apparatus.

And the part (shaded part of FIG. 3) equivalent to the connection part 3 and the frame 4 of the dummy collective board | substrate D is cut | disconnected from the dummy collective board D by the cutting | disconnection by the blade of a dicing apparatus. The cutting process at this time is cut in the same procedure as the cutting process by a normal dicing apparatus. Further, the cutting is performed while the cutting agent is applied to the cutting portions of the base 5 and the dummy collective substrate D. The cutting agent suppresses the wear of the tool by lubricating or cooling the area to be cut, or the cutting material is washed out from the base 5 of the dicing machine, and the cutting material is generated on the base 5 to generate cutting defects. Used to suppress As the cutting agent, water-soluble cutting water such as water or oil-based cutting oil can be used. Moreover, the cutting | disconnection by a dicing apparatus may be performed, spraying air instead of a cutting agent, and a cutting | disconnection may be performed applying a cutting agent and air simultaneously. By using the cutting agent and air at the same time, it is easy to float off the end material and the like, and the cleaning power is improved.
Thus, by cutting while applying the cutting agent, the portion corresponding to the aggregate 2 of the dummy aggregate substrate D remains on the base 5 by vacuum suction, but the portion corresponding to the connecting portion 3 is cut. It is removed from the base 5 by the agent. In addition, when the connection part 3 cannot be removed with a cutting agent, it removes by the removal operation | work with a cutting agent, tweezers, etc. several times. As a result, it is possible to obtain a mask M that exposes only the particle forming region for forming the hardly soluble particles 6 on the upper surface of the base 5.

Next, as shown in FIG. 4, hardly soluble particles 6 are formed in the particle formation region exposed in the previous step. The “slightly soluble particles” at this time refers to particles having properties that are hardly dissolved by a cutting agent such as water. Therefore, it does not have to be completely dissolved in the cutting agent, and includes a case where a part of the particles dissolves in the cutting agent. The hardly soluble particles 6 make it easy to remove the connecting portion 3 placed thereon with a cutting agent or the like, in other words, ease the adhesive force between the base 5 and the connecting portion 3. Therefore, the friction coefficient of the area where the connecting portion 3 of the collective substrate 1 is placed is smaller than the friction coefficient of the area where the aggregate 2 is placed.
At this time, it is preferable to use particles having a Mohs hardness of 1-2, for example, as the hardly soluble particles 6. By using such soft particles, it is possible to suppress the formation of irregularities on the surface of the hardly soluble particles 6 formed in the particle forming region, and the hardly soluble particles 6 can be uniformly formed. Moreover, it is preferable to use the particles having an average particle diameter of about 1 to 50 μm as the hardly soluble particles 6. It is preferable to use particles having a small particle size as the hardly soluble particles 6 because the particles can easily become familiar with the base 5 made of an elastic body.
As the hardly soluble particles 6, for example, talc can be used.

  As a method of forming the poorly soluble particles 6 in the particle forming region, they can be formed by a known method such as screen printing, potting, transfer molding, compression molding or the like. Further, the hardly soluble particles 6 may be formed using a jig such as a cotton swab having a width smaller than the width of the particle forming region. In this way, by using a jig such as a cotton swab, it is possible to reliably form the hardly soluble particles 6 in a portion such as a corner where the hardly soluble particles 6 are hardly formed.

  After forming the hardly soluble particles 6, the base 5 and the mask M may be subjected to a step of cleaning with a cutting agent such as water. Thereby, while being able to make application | coating distribution of the hardly soluble particle | grains 6 formed in the particle | grain formation area uniform, the particle | grains adhering to area | regions other than a particle | grain formation area can be washed away.

Up to this point, the step of forming the hardly soluble particles 6 has described the method of forming the hardly soluble particles 6 on the base 5 using the dummy substrate D. However, the present invention is not limited thereto, and a plurality of masks M corresponding to the shape and size of the aggregate 2 may be arranged on the base 5 to form the hardly soluble particles 6. This eliminates the need for complicated steps such as preparing the dummy substrate D and cutting unnecessary parts, and thus the mask M can be easily arranged.
Further, the hardly soluble particles 6 may be formed on the base 5 from the beginning. That is, the hardly soluble particles 6 may be embedded or stuck on the surface of the base 5 from the beginning. By doing in this way, since the process using mask M etc. can be omitted, it can be set as a simple manufacturing method.

  Further, as another form of the base 5, a base 5 in which a blasting process is performed on an area where the aggregate 2 is placed may be used. By performing the blasting process on the surface of the base 5 in this way, the surface subjected to the blasting process becomes rough, and the friction coefficient of the surface increases. Thereby, the friction coefficient of the area | region where the connection part 3 is mounted can be made smaller than the friction coefficient of the area | region where the aggregate | assembly 2 is mounted.

(Process of separating the assembly and the connecting part)
Next, the process of separating the assembly 2 and the connecting portion 3 will be described.
First, as shown in FIG. 5, the collective substrate 1 is placed on the base 5. At this time, it arrange | positions so that the connection part 3 of the aggregate substrate 1 and the area | region in which the hardly soluble particle | grains 6 of the base 5 were formed may correspond. “Match” in this case includes not only a perfect match but also a case where it exists within a preset error range.

  Next, the collective substrate 1 is vacuum-adsorbed on the base 5, and cutting for separating the collective substrate 1 into a plurality of aggregates 2 and connecting portions 3 is performed. The cutting at this time is performed by a blade of a dicing apparatus while a cutting agent such as water or air is applied to the cutting portion in the same manner as the mask M cutting process. Since insoluble particles 6 that suppress adsorption are formed between the connecting portion 3 and the base 5, the connecting portion 3 can be easily removed from the base 5 by applying a cutting agent such as water or air. Can do. On the other hand, the assembly 2 composed of the plurality of light emitting devices 100 remains on the base 5 as it is because the base 5 is vacuum-sucked.

(Individualization process)
Next, the assembly 2 remaining on the base 5 is cut into pieces.
By the manufacturing method described above, it is possible to obtain the light emitting device 100 that is separated into pieces.

  Although the embodiments have been described above, these descriptions do not limit the configurations described in the claims.

DESCRIPTION OF SYMBOLS 100 Light-emitting device 10 Light-emitting element 1 Aggregate substrate 2 Aggregate 3 Connecting part 4 Frame body 5 Base 6 Insoluble particle 7 Lead frame 8 Molded body 9 Through hole D Dummy aggregate substrate M Mask X Area where a plurality of light-emitting devices are formed

Claims (10)

A collective substrate comprising: a plurality of aggregates in which at least two aggregates each including a plurality of light emitting devices are arranged in one direction; and a connecting portion disposed between the aggregate and the adjacent aggregate. A preparation process;
Preparing a base having a friction coefficient of a region where the connecting portion of the aggregate substrate is placed smaller than a friction coefficient of a region where the aggregate is placed;
Placing the collective substrate on the base, and separating the collective substrate into the plurality of assemblies and the connecting portion;
Cutting the assembly into pieces,
A method for manufacturing a light emitting device.   The light emitting device manufacturing method according to claim 1, wherein the base is formed with hardly soluble particles in a region where the connecting portion of the collective substrate is placed.   The method for manufacturing the light emitting device according to claim 1, wherein the step of separating the collective substrate is performed while applying a cutting agent and / or air to the collective substrate.   The method for manufacturing a light emitting device according to claim 2, wherein the step of forming the hardly soluble particles is performed using a mask.   The method for manufacturing the light emitting device according to claim 4, further comprising a step of cleaning the mask and the base after forming the hardly soluble particles. 6. The step of separating the plurality of aggregates is performed by adsorbing the base and a region corresponding to the plurality of aggregates on a lower surface of the aggregate substrate. Method for manufacturing the light emitting device.   The method for manufacturing a light emitting device according to claim 1, wherein the aggregate substrate is a resin molded body including a lead frame and a molded body.   The method for manufacturing a light-emitting device according to claim 2, wherein the hardly soluble particle is talc. The method for manufacturing a light emitting device according to claim 1, wherein the connecting portion has a through hole. The method for manufacturing a light emitting device according to any one of claims 1 to 9, wherein a region of the base on which the aggregate substrate is placed is made of an elastic member.

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