JP2017069234A - Manufacturing method and manufacturing device of electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device capable of manufacturing an electronic apparatus having excellent durability.SOLUTION: A manufacturing method of an electronic apparatus, includes: a decompressing step for decompressing the inside of a chamber 1; a superimposing step for superimposing a first base material 10 and a second base material 20 fixed with sealing portions on at least one side, while disposing the sealing portion between the first base material 10 and the second base material 20 and disposing a sealed articled 13 in a closed space formed by the first base material 10, the second base material 20, and the sealing portion 12; an affixing step for pressing the sealing portion 13 through the first base material 10 and the second base material 20 by using a press portion 3 in the chamber, and affixing the first base material 10 and the second base material 20 by the sealing portion 13 to a base material assembly; a pressure increasing step for increasing pressure in the chamber 1 to be larger than pressure in the chamber 1 in the affixing step; and a press portion separating step for separating the press portion 3 from the base material assembly.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device manufacturing method and a manufacturing apparatus.

  Electronic devices such as a dye-sensitized solar cell and an organic EL element are configured such that opposing substrates are assembled through a sealing portion, and an electrolyte is contained in a closed space formed by the opposing substrate and the sealing portion. The objects to be sealed such as are arranged.

  As a method for manufacturing such an electronic device, for example, the one described in Patent Document 1 below is known. In the following Patent Document 1, in a chamber, a first base material and a second base material each having a sealing part fixed to at least one are sealed between the first base material and the second base material under reduced pressure. Are placed in a closed space formed by the first base material, the second base material, and the sealing portion, and then the first base material and The sealing part is pressed through the second base material, and the base material assembly is manufactured by bonding the first base material and the second base material by the sealing part, and then the pressing part is removed from the base material assembly. A method of manufacturing an electronic device by separating the devices is disclosed.

JP2015-32393A

  However, the method for manufacturing an electronic device described in Patent Document 1 has the following problems.

  That is, the method for manufacturing an electronic device described in Patent Document 1 has room for improvement in terms of durability of the obtained electronic device.

  This invention is made | formed in view of the said situation, and it aims at providing the manufacturing method and manufacturing apparatus of an electronic device which can manufacture the electronic device which has the outstanding durability.

  The inventor examined the cause of the above problem in the method of manufacturing the electronic device described in Patent Document 1. As a result, the present inventor considered the following. That is, in the method of manufacturing an electronic device described in Patent Document 1, the press part is used, the sealing part is pressed via the first base material and the second base material, and the first base material and the second base material are pressed by the sealing part. A base material assembly is manufactured by laminating the base material, and then the press portion is separated from the base material assembly. At this time, if the pressure in the closed space in the substrate assembly is the same as or higher than the pressure in the chamber, the substrate assembly is firmly fixed after the press portion is separated from the substrate assembly. The present inventor thought that electrolyte leakage may occur when the sealing portion is not sufficiently bonded to the first base material or the second base material because it is not pressed. . Therefore, after the bonding of the first base material and the second base material is completed, if the pressure in the chamber is made higher than the pressure in the chamber when the sealing portion is pressed, the press Even if the portion is separated from the base material assembly, the stress applied to the interface between the first base material and the sealing portion and the interface between the second base material and the sealing portion can be reduced. The present inventor thought that leakage of water or intrusion of moisture from the outside could be sufficiently suppressed. Thus, the present inventor has completed the present invention.

  That is, the present invention provides a first base material, a second base material facing the first base material, an object to be sealed disposed between the first base material and the second base material, An electronic device manufacturing method for manufacturing an electronic device that includes a sealing portion that connects the first base material and the second base material and surrounds the object to be sealed, wherein the pressure in the space in the chamber is reduced. After the step and the pressure-reducing step, the first base material and the second base material in which the sealing portion is fixed to at least one of the first base material and the second base material in the chamber. The superposition | polymerization which arrange | positions in the state which has arrange | positioned the said sealing part in the state and has arrange | positioned the said to-be-sealed object in the closed space formed by the said 1st base material, the said 2nd base material, and the said sealing part. After the step and the superposition step, a press part is used in the chamber via the first base material and the second base material. A bonding step of pressing the sealing portion and bonding the first base material and the second base material by the sealing portion to obtain a base material assembly; and after the bonding step, A pressure increasing step for increasing the pressure in the laminating step in comparison with the pressure in the chamber, and a press for obtaining the electronic device by separating the press portion from the substrate assembly after the pressure increasing step. An electronic device manufacturing method including a part separation step.

  According to this method for manufacturing an electronic device, after the first base material and the second base material are bonded together to obtain the base material assembly, the pressure in the chamber is increased more than the pressure in the chamber in the bonding process. I am letting. For this reason, even after the press portion is separated from the base material assembly, the base material assembly is pressed inward by the pressure in the chamber. As a result, even if the press part is separated from the base material assembly, the stress applied to the interface between the first base material and the sealing part and the interface between the second base material and the sealing part can be reduced. In the obtained electronic device, leakage of an object to be sealed or entry of moisture from the outside can be sufficiently suppressed. Therefore, according to the method for manufacturing an electronic device of the present invention, an electronic device having excellent durability can be manufactured.

  In the method for manufacturing the electronic device, it is preferable that the pressure in the chamber in the press part separating step is an atmospheric pressure.

  In this case, after the first base material and the second base material are bonded together to obtain the base material assembly, the base material assembly remains in the chamber even after the press portion is separated from the base material assembly. Therefore, it is pressed inward with a particularly large pressure. As a result, even when the press part is separated from the base material assembly, the stress applied to the interface between the first base material and the sealing part and the interface between the second base material and the sealing part can be particularly reduced. In the obtained electronic device, leakage of the object to be sealed or intrusion of moisture from the outside can be particularly sufficiently suppressed. Therefore, according to the method for manufacturing an electronic device of the present invention, an electronic device having particularly excellent durability can be manufactured.

  The electronic device manufacturing method is particularly effective in the bonding step when the sealing portion is pressed while heating and the first base material and the second base material are bonded together by the sealing portion. is there.

  This is because when the sealing portion is pressed while heating, the heat of the pressing portion is transmitted to the closed space formed by the first base material, the second base material, and the sealing portion, and the closed space is heated. As a result, the pressure in the closed space formed by the first base material, the second base material, and the sealing portion is likely to be higher than the pressure in the chamber when the sealing portion is pressed.

  The present invention also includes a first base material, a second base material facing the first base material, an object to be sealed disposed between the first base material and the second base material, An electronic device manufacturing apparatus that manufactures an electronic device including a sealing portion that connects a base material and the second base material and surrounds the object to be sealed, the chamber being provided in the chamber A first base material support part for supporting the first base material, and a position facing the first base material support part in the chamber, and supporting the second base material on the first base material side. A second base material supporting part, and a press part that presses the sealing part disposed between the first base material and the second base material via the first base material and the second base material. A first moving mechanism capable of moving the press portion relative to the first base material support portion, and the first base material support portion to the second base material support. A second moving mechanism that can be moved relative to the part, a pressure measuring device that measures the pressure in the chamber, a pressure adjusting means that adjusts the pressure in the chamber, and the pressure measuring device. A control device that controls at least the first moving mechanism, the second moving mechanism, and the pressure adjusting means based on the measured pressure in the chamber, and the control device uses the pressure adjusting means to control the chamber. The internal space is depressurized, and after the pressure in the chamber measured by the pressure measuring device reaches the pressure for bonding the first base material and the second base material, the second moving mechanism The first base material support part is moved relatively toward the second base material support part, and the first base material support part is formed by the first base material and the second base material being the sealing part. Overlaid via Then, the first moving mechanism moves the press part relatively toward the first base material support part to press the sealing part, and the press part causes the first base material and the first base material to be pressed. (2) After the bonding with the base material is completed, the pressure in the chamber is increased by the pressure adjusting means, and the pressure in the chamber measured by the pressure measuring device reaches a predetermined pressure. At least the first movement mechanism, the first movement mechanism, and the like so that the pressing section is moved away from the base material assembly by relatively moving the pressing section in a direction away from the first base material support section by one moving mechanism. 2 is an electronic device manufacturing apparatus that controls the moving mechanism and the pressure adjusting means.

  According to the electronic device manufacturing apparatus, the control device controls at least the first moving mechanism, the second moving mechanism, and the pressure adjusting means based on the pressure in the chamber measured by the pressure measuring device. That is, after a 1st base material and a 2nd base material are bonded together and the base material assembly is obtained by the control apparatus, the pressure in a chamber is increased rather than the pressure in the chamber in a bonding process. For this reason, even after the press part is separated from the base material assembly, the base material assembly is pressed inward by the pressure in the chamber. As a result, even if the press part is separated from the base material assembly, the stress applied to the interface between the first base material and the sealing part and the interface between the second base material and the sealing part can be reduced. In the obtained electronic device, leakage of an object to be sealed or entry of moisture from the outside can be sufficiently suppressed. Therefore, according to the electronic device manufacturing apparatus of the present invention, an electronic device having excellent durability can be manufactured.

  In the electronic apparatus manufacturing apparatus, the pressure adjusting means is, for example, a first pipe connected to the chamber, a suction pump connected to the first pipe and exhausting gas in the chamber, and the first A first valve provided in the pipe; a second pipe connected to the chamber; a gas supply source connected to the second pipe for supplying gas into the chamber; and a second provided in the second pipe. And a valve.

  In this case, if the suction pump is operated with the first valve opened and the second valve closed, the gas in the chamber is discharged from the chamber through the first pipe, and the pressure in the chamber is reduced. On the other hand, when the gas is supplied from the gas supply source with the first valve closed and the second valve opened, the gas is supplied into the chamber through the second pipe. For this reason, the pressure in the chamber can be increased. Thus, the pressure in the chamber can be adjusted by the pressure adjusting means.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and manufacturing apparatus of an electronic device which can manufacture the electronic device which has the outstanding durability are provided.

It is a partial cut surface end view showing one embodiment of the electronic device manufacturing apparatus of the present invention. It is a cut surface end view which shows the 2nd base material support part in FIG. It is a partial cut surface end view which shows 1 process of the manufacturing method of the electronic device using the manufacturing apparatus of the electronic device of FIG. It is a partial cut surface end view which shows 1 process of the manufacturing method of the electronic device using the manufacturing apparatus of the electronic device of FIG. It is a partial cut surface end view which shows 1 process of the manufacturing method of the electronic device using the manufacturing apparatus of the electronic device of FIG. It is a partial cut surface end view which shows 1 process of the manufacturing method of the electronic device using the manufacturing apparatus of the electronic device of FIG. It is a partial cut surface end view which shows 1 process of the manufacturing method of the electronic device using the manufacturing apparatus of the electronic device of FIG. It is a figure which shows the time chart of the pressure in a chamber, and the position of a 1st base material support part.

  Hereinafter, embodiments of the present invention will be described in detail.

  First, an embodiment of an electronic device manufacturing apparatus according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a partially cut end view showing a first embodiment of the electronic device manufacturing apparatus of the present invention, and FIG. 2 is a cut end view showing the second base material support portion in FIG.

  As shown in FIG. 1, an electronic device manufacturing apparatus 100 includes a chamber 1, and the chamber 1 includes a main body 1a having an opening and a lid 1b provided to close the opening of the main body 1a. ing. In addition, as a material which comprises the chamber 1, aluminum, aluminum alloy, carbon steel, SUS etc. are used, for example.

  A gas flow port 1c for flowing gas is formed in the chamber 1, and a pressure adjusting means 2 for adjusting the pressure in the chamber 1 is connected to the gas flow port 1c.

  In the present embodiment, the pressure adjusting means 2 includes a first pipe 2a connected to the gas flow port 1c, a suction pump 2b connected to the first pipe 2a and exhausting the gas in the chamber 1, and the first pipe 2a. A first valve V1 installed in the first pipe 2a, a second pipe 2c connected between the first valve V1 and the gas flow port 1c in the first pipe 2a, a second valve V2 provided in the second pipe 2c, A gas supply source 2d that is connected to the second pipe 2c and supplies gas into the chamber 1 through the second pipe 2c. According to the pressure adjusting means 2, the pressure in the space in the chamber 1 is adjusted as follows. That is, when the suction pump 2b is operated with the first valve V1 first opened and the second valve V2 closed, the gas in the chamber 1 passes through the first piping 2a through the gas flow port 1c of the chamber 1 and the chamber. 1 and the pressure in the chamber 1 is reduced. On the other hand, when the gas is supplied from the gas supply source 2d through the second pipe 2c with the first valve V1 closed and the second valve V2 open, the gas passes through the second pipe 2c and passes through the gas distribution port 1c into the chamber 1. To be supplied. For this reason, the pressure in the chamber 1 can be increased. Thus, the pressure in the chamber 1 can be adjusted by the pressure adjusting means 2. The second pipe 2c may be directly connected to the gas circulation port 1c, or may be connected to a portion of the chamber 1 other than the gas circulation port 1c. The gas supply source 2d may be a gas supply device having a gas cylinder filled with nitrogen gas, air, or the like, or the atmosphere.

  Further, in FIG. 1, a pressure measuring device 70 for measuring the pressure in the chamber 1 is connected to the first pipe 2a. The pressure measuring device 70 may be provided at any location as long as the pressure in the chamber 1 can be measured. For example, the pressure measuring device 70 may be provided in the chamber 1.

  A first base material support portion 11 that supports the first base material 10 is provided in the main body portion 1 a of the chamber 1, and the first base material 10 is located at a position facing the first base material support portion 11. The 2nd base material support part 21 which supports the 2nd base material 20 by the side is arrange | positioned. Further, a press part 3 having two annular pressurizing surfaces 3 a is fixed to the lid part 1 b of the chamber 1 at a position facing the second base material support part 21. In the present embodiment, the press unit 3 also serves as a heating unit. In addition, as a material which comprises the 1st base material support part 11, aluminum, aluminum alloy, steel, SUS etc. are used, for example, As a material which comprises the press part 3, aluminum, aluminum alloy, carbon steel, copper, for example SUS or the like is used.

  The electronic device manufacturing apparatus 100 includes a first moving mechanism 30 that moves the first base material support portion 11 with respect to the press portion 3. The first moving mechanism 30 supports the first base material support part 11 on the lower surface of the first base material support part 11, passes through the main body part 1a of the chamber 1 and extends along the direction of arrow A in FIG. It has the raising / lowering shaft 31 which raises / lowers the material support part 11, and the drive part 32 which is arrange | positioned on the outer side of the chamber 1 and raises / lowers the raising / lowering shaft 31. The drive unit 32 has a motor 33, and a timer 90 is electrically connected to the motor 33. As shown in FIG. 8, the motor 33 is driven by the timer 90 to raise the elevating shaft 31 at time t2, stops after the first base material support portion 11 reaches the press position at time t3, and time t5 In this case, the elevating shaft 31 is driven to be lowered, and the motor 33 is stopped at time t6. In the present embodiment, the first moving mechanism 30 can also move the first base material support portion 11 with respect to the second base material support portion 21 and also serves as a second movement mechanism.

  The electronic device manufacturing apparatus 100 includes an airtight holding member 40 that hermetically connects the main body 1a of the chamber 1 and the drive unit 32. As the airtight holding member 40, for example, a bellows or the like is used.

  The 1st base material support part 11 has the 1st base material support surface 11a which supports the 1st base material 10, and the guide part installation surface 11b formed in the both sides of the 1st base material support surface 11a. . Four rod-shaped guide portions 50 extend from the guide portion installation surface 11b along the direction of arrow A in FIG. As shown in FIG. 1, the guide part 50 is provided between the first base material support part 11 and the second base material support part 21, and the first base material support part 11 and the second base material support part 21. A distance adjusting member 60 capable of adjusting the distance between the two is provided. In this embodiment, a spring member is provided as the distance adjustment member 60.

  As shown in FIG. 2, the second base material support portion 21 is provided so as to cover the annular second base material support frame 21a and the inner opening of the second base material support frame 21a. It has the 2nd base material fixing | fixed part 21b for fixing. A through hole 21c for inserting the guide portion 50 is formed in the second base material support frame 21a. In addition, as a material which comprises the 2nd base material support frame 21a, aluminum, aluminum alloy, steel, SUS etc. are used, for example, as a material which comprises the 2nd base material fixing | fixed part 21b, a polyethylene terephthalate resin (PET) is used, for example. ), Polyimide resin or the like is used.

As shown in FIG. 1, the electronic device manufacturing apparatus 100 is electrically connected to the timer 90, the press unit 3, the pressure measuring device 70, and the pressure adjusting unit 2, and is based on the pressure measured by the pressure measuring device 70. The control unit 80 further controls the first moving mechanism 30 through the timer 90 and controls the press unit 3 and the pressure adjusting means 2. As shown in FIG. 8, the control device 80 depressurizes the space in the chamber 1 by the pressure adjusting means 2 at time t1, and the pressure in the chamber 1 measured by the pressure measuring device 70 is the first base material at time t2. 10 and the second base material 20 are bonded to each other, and after reaching the pressure (P _press ), the first moving mechanism 30 moves the first base material support part 11 toward the second base material support part 21, After the first base material support part 11 reaches the position (press position) where the first base material 10 and the second base material 20 are overlapped via the sealing parts 12 and 22, at time t3, the first base material support part 11 The first base material support portion 11 is moved toward the press portion 3 by the moving mechanism 30 to press the sealing portions 12 and 22, and the first base material 10 and the second base material 20 are bonded together by the press portion 3. At time t4 after the base material assembly is obtained Increasing the pressure in the chamber 1 by the pressure regulating means 2, after the pressure in the chamber 1 measured by the pressure measuring device 70 reaches a predetermined pressure (for example, P _0), the first moving mechanism 30 at time t5 The first base material support portion 11 is moved away from the press portion 3 to move the press portion 3 away from the base material assembly, and the first moving mechanism 30 is stopped at time t6 through the first timer 90 so as to stop. While controlling the moving mechanism 30, the press part 3 and the pressure adjustment means 2 are controlled.

  Next, an electronic device manufacturing method using the above-described electronic device manufacturing apparatus 100 will be described with reference to FIGS. 3 to 7 taking as an example the case of manufacturing a dye-sensitized solar cell module as an electronic device. . 3 to 7 are partial cross-sectional end views showing a series of steps of an electronic device manufacturing method using the electronic device manufacturing apparatus of FIG.

  First, a first base 10 is prepared in which two annular sealing portions 12 are fixed apart from each other. For example, a working electrode is used as the first base material 10. Here, as the working electrode, one in which the porous oxide semiconductor layer 10b is arranged on one conductive substrate 10a is used. As the conductive substrate 10a, for example, a substrate in which a transparent conductive layer is formed on a transparent substrate is used. In the 1st base material 10, the sealing part 12 is fixed so that the porous oxide semiconductor layer 10b may be arrange | positioned inside the sealing part 12. FIG.

  Then, as shown in FIG. 3, the lid portion 1 b of the chamber 1 is removed, and the first base material 10 is placed on the first base material support surface 11 a of the first base material support portion 11 in the main body portion 1 a of the chamber 1. It arrange | positions and the 1st base material 10 is supported. Thereafter, an electrolyte as the object to be sealed 13 is disposed on the porous oxide semiconductor layer 10 b of the first base material 10. Here, any of a liquid electrolyte, a solid electrolyte, and a pseudo solid electrolyte can be used as the electrolyte.

  On the other hand, what fixed the cyclic | annular sealing part 22 to each of the two 2nd base materials 20 is prepared. Moreover, as shown in FIG. 2, the 2nd base material support part 21 is prepared. Then, the second base material 20 provided with the two sealing portions 22 is fixed to the second base material fixing portion 21 b of the second base material support portion 21. As the 2nd base material fixing | fixed part 21b, an adhesive sheet etc. can be used, for example.

  Then, as shown in FIG. 4, the second base material support portion 21 is inserted into the main body portion 1 a of the chamber 1 and penetrates through the guide portion 50. Specifically, the guide portion 50 is passed through the through hole 21c of the second base material support frame 21a of the second base material support portion 21. At this time, since the guide member 50 is provided with a spring member as the distance adjusting member 60, the first base material supporting portion 11 and the second base material supporting portion 21 are moved after the distance adjusting member 60 is slightly contracted. It is kept in a separated state. At this time, the first base material 10 and the second base material 20 are held in a separated state. At this time, the position of the first base material support part 11 is defined as an “initial position”.

  Next, as shown in FIG. 5, a lid 1 b is attached to the main body 1 a of the chamber 1. At this time, the press part 3 is fixed to the cover part 1b. Here, the shape of the pressing surface 3 a of the press part 3 is an annular pattern similar to that of the sealing part 12 and the sealing part 22. Further, the number of the pressing surfaces 3 a is adjusted to the number of the first base material 10 or the second base material 20.

  Then, based on the pressure measured by the pressure measuring device 70 so that the pressure in the chamber 1 and the position of the first base material support portion 11 change according to the time chart shown in FIG. While controlling the 1st moving mechanism 30 through the timer 90, the press part 3 and the pressure adjustment means 2 are controlled.

Specifically, first, the time of attaching the lid portion 1b on the main body 1a of the chamber 1 and t0, the pressure at this time is P _0. The pressure P _{0 at} this time is atmospheric pressure in the present embodiment. Then, as shown in FIG. 8, at time t <b> 1 after a lapse of a fixed time from time t <b> 0, the pressure adjusting means 2 is controlled by the control device 80 to discharge gas from the chamber 1 and depressurize the space in the chamber 1. (Decompression step). Specifically, the control device 80 opens the first valve V1 and closes the second valve V2. In this state, the suction pump 2b is operated, and the gas in the chamber 1 is passed through the gas flow port 1c of the chamber 1. Then, the pressure is discharged from the chamber 1 through the first pipe 2a, and the pressure in the chamber 1 is reduced. Thus, the space in the chamber 1 is decompressed.

If the pressure in the space in the chamber 1 measured by the pressure measuring device 70 is reduced to the pressure (P _press ) at which the first base material 10 and the second base material 20 are to be bonded at time t2, The timer 90 is operated by the control device 80. Then, by the timer 90, the motor 33 is driven to raise the elevating shaft 31. Then, the first base material support part 11 is moved toward the press part 3. Specifically, the elevating shaft 31 is moved in the direction of arrow A in FIG. At this time, the first base material 10 and the second base material 20 are kept in a separated state by the distance adjusting member 60. Eventually, the second base material support portion 21 comes into contact with the press portion 3 (see FIG. 6). At this time, the movement of the second base material support part 21 is stopped, but since the guide part 50 penetrates the second base material support part 21, the movement of the first base material support part 11 is still possible. . For this reason, when the 1st base material support part 11 is further moved toward the press part 3 by the 1st moving mechanism 30, the 1st base material support part 11 and the 2nd base material support part 21 are carried out by the distance adjustment member 60. The first base material support part 11 is brought closer to the second base material support part 21. Eventually, as shown in FIG. 7, the first base material 10 and the second base material 20 sandwich the sealing portions 12 and 22 therebetween, and the first base material 10 and the second base material 20 are sealed. It overlaps in the state which has arrange | positioned the to-be-sealed thing 13 in the closed space formed by the parts 12 and 22 (superposition | polymerization process).

After the first base material 10 and the second base material 20 are overlapped in this way, when the first base material support part 11 is further moved toward the press part 3 by the first moving mechanism 30, The sealing portions 12 and 22 are pressed while being heated through the first base material 10 and the second base material 20 by the pressing surface 3a. At this time, if this time is set to t3, the 1st base material support part 11 has reached the press position (refer to Drawing 8). In addition, the press part 3 is operated with the control apparatus 80 before the time t1, for example, and it is made to heat | fever-generate to the temperature which the sealing parts 12 and 22 fuse | melt. Thereafter, the sealing portions 12 and 22 are pressed until time t4, and the first base material 10 and the second base material 20 are bonded together by the sealing portion 12. In this way, a base material assembly is obtained (bonding process). From time t3 to time t4, the pressure adjusting means 2 is controlled by the control device 80, and the pressure in the chamber 1 measured by the pressure measuring device 70 is kept constant at P _press .

  And after bonding of the 1st base material 10 and the 2nd base material 20, as shown in FIG. 8, the pressure adjustment means 2 is controlled by the control apparatus 80 at the time t4, and the inside of the chamber 1 is shown. Is increased more than the pressure in the chamber 1 in the laminating step (pressure increasing step). Specifically, the control device 80 closes the first valve V1 and opens the second valve V2. In this state, gas is supplied from the gas supply source 2d through the second pipe 2c, and the gas is supplied to the second pipe. The gas is introduced into the chamber 1 through the gas flow port 1c through 2c. In this way, the pressure in the chamber 1 is increased.

After the pressure in the chamber 1 is increased, if the pressure reaches the pressure P ₀ , that is, the atmospheric pressure at time t5, the motor 33 of the drive mechanism 30 is driven by the timer 90 at time t5, and the first The base material support part 11 descends. Specifically, the elevating shaft 31 is moved in the direction opposite to the arrow A direction in FIG. At this time, the base material assembly is also lowered as the first base material support portion 11 is lowered. And as shown in FIG. 8, the 1st base material support part 11 returns to an initial position at the time t6. Thus, the press part 3 is separated from the base material assembly, and the manufacture of the electronic device 100 is completed (press part separation step).

  According to the electronic device manufacturing method using the electronic device manufacturing apparatus 100, after the first base material 10 and the second base material 20 are bonded together to obtain the base material assembly, the pressure in the chamber 1 is changed. The pressure in the chamber 1 in the bonding process is increased. For this reason, even after the press unit 3 is separated from the base material assembly, the base material assembly is pressed inward by the pressure in the chamber 1. As a result, even if the press part 3 is separated from the base material assembly, the interface between the first base material 10 and the sealing parts 12 and 22 and the interface between the second base material 20 and the sealing parts 12 and 22 are obtained. Such stress can be reduced, and in the obtained electronic device 100, leakage of the electrolyte as the sealed object 13 or entry of moisture from the outside can be sufficiently suppressed. Therefore, according to the electronic device manufacturing method, the electronic device 100 having excellent durability can be manufactured.

  Moreover, in the manufacturing method of the electronic device of this embodiment, the pressure in the chamber 1 is kept constant in the bonding process. For this reason, it is suppressed that a repeated stress is added between the sealing parts 12 and 22 and the 1st base material 10 or the 2nd base material 20 by the fluctuation | variation of the pressure in the chamber 1, and the sealing parts 12 and 22 and the 1st The adhesiveness between the first base material 10 and the adhesiveness between the sealing portions 12 and 22 and the second base material 20 can be more sufficiently improved. For this reason, the obtained electronic device 100 can have more excellent durability.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the operation of the electronic device manufacturing apparatus is described by taking as an example the case of manufacturing a base assembly in which the sealing portions 12 and 22 are fixed to the first base 10 and the second base 20, respectively. As described above, the electronic device manufacturing apparatus of the present invention is applicable to the case of manufacturing a base material assembly in which a sealing portion is fixed to one of the first base material 10 and the second base material 20. It is.

  Moreover, in the said embodiment, although the press part 3 is fixed to the cover part 1b, the 1st base material support part 11 is moved toward the press part 3 with the 1st moving mechanism 30, The material support part 11 may be fixed to the chamber 1, and the press part 3 may be moved toward the first base material support part 11 by a moving mechanism. Even in this case, the first base material support portion 11 is relatively moved toward the press portion 3.

  Moreover, in the said embodiment, although the press part 3 is controlled by the control apparatus 80, the press part 3 does not need to be controlled by the control apparatus 80. FIG.

  Further, in the above-described embodiment, the first moving mechanism 30 is controlled through the timer 90 based on the pressure measured by the pressure measuring device 70 by the control device 80, and the press unit 3 and the pressure adjusting means 2 are controlled. Although the electronic device manufacturing method of the present invention is implemented, the electronic device manufacturing method of the present invention does not use the control device 80, and the first movement through the timer 90 based on the pressure measured by the pressure measuring device 70. It can also be implemented by manually operating the mechanism 30 and manually operating the press unit 3 and the pressure adjusting means 2.

  In the electronic device manufacturing method of the present embodiment, the pressure in the chamber 1 is kept constant in the bonding step, but the pressure in the chamber 1 does not necessarily have to be kept constant. That is, as long as the pressure fluctuation in the chamber 1 is small, the space in the chamber 1 does not need to be further depressurized.

Further, in the above embodiment, the pressure in the chamber 1 is increased to the pressure P ₀ , that is, the atmospheric pressure by the pressure increasing process, but the pressure in the chamber 1 in the pressure increasing process is increased in the chamber 1 in the bonding process. Any pressure larger than the pressure and smaller than the atmospheric pressure may be used.

  Moreover, in the said embodiment, the sealing parts 12 and 22 are pressed while heating, and the 1st base material 10 and the 2nd base material 20 are bonded together, but the sealing parts 12 and 22 are epoxy resins. In the case where an ultraviolet curable resin such as acrylic resin is included, the first substrate 10 and the second substrate 20 may be bonded together by pressing the sealing portions 12 and 22 while irradiating ultraviolet rays. it can. Alternatively, when the sealing portions 12 and 22 include a room temperature curable resin such as butyl rubber, the first base material 10 and the second base material 20 are bonded together by simply pressing the sealing portions 12 and 22. be able to.

  Furthermore, in the said embodiment, although the 2nd base material 20 is supported by the 2nd base material support part 21, when the press part 3 supports the 2nd base material 20, the 2nd base material support part 21 is It may be omitted. In this case, the press part 3 also serves as the second base material support part 21.

  Furthermore, in the above embodiment, the first moving mechanism 30 also serves as a second moving mechanism that moves the first base material support part 11 relative to the second base material support part 21, but the electronic apparatus The manufacturing apparatus may further include a second moving mechanism separately from the first moving mechanism 30.

  Furthermore, in the above embodiment, the case where a dye-sensitized solar cell module is manufactured as an electronic device has been described as an example. However, the electronic device may be an organic EL element, a liquid crystal display, or an organic thin film solar cell. In this case, the object to be sealed becomes an organic light emitter or liquid crystal instead of the electrolyte.

  Hereinafter, the content of the present invention will be described more specifically with reference to examples and comparative examples, but the present invention is not limited to the following examples.

Example 1
A dye-sensitized solar cell module as an electronic device was manufactured as follows using the electronic device manufacturing apparatus 100 shown in FIG.

  First, a first substrate 10 in which two annular sealing portions 12 were fixed apart from each other was prepared. A working electrode was used as the first substrate 10. Here, the working electrode used was a porous oxide semiconductor layer 10b having a thickness of 10 μm made of titania on the conductive substrate 10a. As the conductive substrate 10a, a transparent conductive substrate having a size of 305 mm × 305 mm × thickness 2.2 mm was used. As the transparent conductive substrate, a substrate in which an FTO film was formed on a transparent glass substrate was used.

  A counter electrode was used as the second substrate 20. As the counter electrode, the one in which a 10 nm thick catalyst layer made of platinum was formed on a 50 μm thick conductive substrate made of titanium foil was used.

  Then, rectangular annular sealing portions 12 and 22 having a thickness of 50 μm and a width of 2000 μm were fixed to each of the first base material 10 and the second base material 20. As the sealing parts 12 and 22, a binel (trade name, manufactured by DuPont) was used.

  Next, as shown in FIG. 3, the first base material support surface 11 a of the first base material support portion 11 in the main body portion 1 a of the chamber 1 with the lid portion 1 b of the chamber 1 removed. The base material 10 was arrange | positioned and the 1st base material 10 was supported. Thereafter, an electrolyte as the object to be sealed 13 was disposed on the porous oxide semiconductor layer 10 b of the first base material 10. As the electrolyte, a liquid electrolyte composed of an iodine-based electrolyte using acetonitrile as a solvent was used.

  On the other hand, as shown in FIG. 2, the second base material support part 21 is prepared, and the second base material 20 provided with the two sealing parts 22 is replaced with the second base material fixing part of the second base material support part 21. 21b was fixed. An adhesive sheet was used as the second base material fixing portion 21b.

  Then, as shown in FIG. 4, the second base material support portion 21 was placed in the main body portion 1 a of the chamber 1 and penetrated through the guide portion 50. Specifically, the guide part 50 was penetrated through the through hole 21 c of the second base material support frame 21 a of the second base material support part 21. At this time, after the distance adjusting member 60 is slightly contracted, the first base material support part 11 and the second base material support part 21 are held in a separated state, and the first base material 10 and the second base material 20 are held. It was kept in a separated state. At this time, the position of the first base material support portion 11 was set as the “initial position”.

  Next, as shown in FIG. 5, a lid 1 b was attached to the main body 1 a of the chamber 1. At this time, the press part 3 was fixed to the cover part 1b. Here, the shape of the pressing surface 3 a of the press part 3 was an annular pattern similar to the sealing part 12 and the sealing part 22. The number of pressure surfaces 3a was two.

And the timer 90, the press part 3, and the pressure adjustment means 2 were controlled by the control apparatus 80, monitoring the pressure measured with the pressure measuring apparatus 70. FIG. Specifically, according to the time chart shown in FIG. 8, the control of the timer 90, the press unit 3 and the pressure adjusting means 2 by the control device 80 was performed. In the time chart of FIG. 8, t1 to t6, P ₀ , P _press, and pressure P ₁ in the chamber 1 when the press unit 3 is separated from the base material assembly are as follows.
t1 = 0 seconds t2 = 30 seconds t3 = 31 seconds t4 = 61 seconds t5 = 121 seconds t6 = 122 seconds P ₀ = atmospheric pressure P _press = 600 Pa
P ₁ = Atmospheric pressure

  At this time, the press part 3 was operated before the time t1 by the control device 80, and the surface temperature was set to 200 ° C. Times t1 to t6 are elapsed times from time t0.

  As described above, a dye-sensitized solar cell module as an electronic device was produced.

(Example 2)
And the press section 3 to prepare a dye-sensitized solar cell module in the same manner as in Example 1 except that the 2000Pa pressure P ₁ in the chamber 1 when disconnecting from the base assembly.

(Comparative Example 1)
The pressure P ₁ in the chamber 1 when disconnecting the press section 3 from the substrate assembly 600 Pa, that is, except that it has the same as P _press to prepare a dye-sensitized solar cell module in the same manner as in Example 1.

  About the dye-sensitized solar cell module of Examples 1-2 obtained as mentioned above, the cross section which crossed the sealing part and the 2nd base material 20 was observed with the stereomicroscope. As a result, in Example 1, peeling of the 2nd base material from the sealing part did not generate | occur | produce, and the lift of the 2nd base material with respect to the sealing part did not generate | occur | produce. Moreover, in Example 2, although the slight lift of the 2nd base material with respect to the sealing part had generate | occur | produced, peeling of the 2nd base material from the sealing part had not generate | occur | produced. On the other hand, in Comparative Example 1, peeling of the second base material from the sealing portion occurred, and the electrolyte was leaked.

  From the above, it can be seen that the electronic device manufacturing method of the present invention can manufacture an electronic device having excellent durability.

DESCRIPTION OF SYMBOLS 1 ... Chamber 2 ... Pressure adjusting means 2a ... 1st piping 2b ... Suction pump 2c ... 2nd piping 3 ... Press part 10 ... 1st base material 11 ... 1st base material support part 12, 22 ... Sealing part 13 ... Covered Sealed material 20 ... second substrate 21 ... second substrate support 30 ... moving mechanism 31 ... lifting shaft (moving mechanism)
32 ... Drive unit (moving mechanism)
DESCRIPTION OF SYMBOLS 70 ... Pressure measuring apparatus 80 ... Control apparatus 100 ... Manufacturing apparatus of an electronic device V1 ... 1st valve V2 ... 2nd valve

Claims (5)

A first base material; a second base material facing the first base material; an object to be sealed disposed between the first base material and the second base material; the first base material and the first base material; An electronic device manufacturing method for manufacturing an electronic device including a sealing portion that connects a second base material and surrounds the object to be sealed,
A decompression step of decompressing the space in the chamber;
After the depressurization step, the first base material and the second base material in which the sealing portion is fixed to at least one in the chamber are interposed between the first base material and the second base material. A superposition step in which the sealing portion is arranged and the objects to be sealed are overlapped in a closed space formed by the first base material, the second base material, and the sealing portion; and
After the superposition step, a press part is used in the chamber to press the sealing part through the first base material and the second base material, and the first base material and the first base material are pressed by the sealing part. A laminating step of laminating the second base material to obtain a base material assembly;
After the laminating step, a pressure increasing step for increasing the pressure in the chamber more than the pressure in the chamber in the laminating step;
After the said pressure increase process, the manufacturing method of the electronic device including the press part separation | spacing process of obtaining the said electronic device by separating the said press part from the said base material assembly.   The method for manufacturing an electronic device according to claim 1, wherein the pressure in the chamber in the pressure increasing step is set to atmospheric pressure.   The electronic device manufacturing according to claim 1 or 2, wherein, in the bonding step, the first base material and the second base material are bonded together by pressing the sealing portion while heating. Method. A first base material; a second base material facing the first base material; an object to be sealed disposed between the first base material and the second base material; the first base material and the first base material; An electronic device manufacturing apparatus for manufacturing an electronic device including a sealing portion that connects a second base material and surrounds the object to be sealed,
A chamber;
A first base material support part provided in the chamber and supporting the first base material;
A second base material support portion provided at a position facing the first base material support portion in the chamber, and supporting the second base material on the first base material side;
A pressing unit that presses the sealing unit disposed between the first base material and the second base material via the first base material and the second base material;
A first moving mechanism capable of moving the press part relative to the first base material support part;
A second moving mechanism capable of moving the first base material support portion relative to the second base material support portion;
A pressure measuring device for measuring the pressure in the chamber;
Pressure adjusting means for adjusting the pressure in the chamber;
A control device for controlling at least the first moving mechanism, the second moving mechanism, and the pressure adjusting means based on the pressure in the chamber measured by the pressure measuring device;
The control device is
After the pressure in the chamber is reduced by the pressure adjusting means, and the pressure in the chamber measured by the pressure measuring device reaches the pressure when the first base material and the second base material are bonded together , By moving the first base material support part relative to the second base material support part by the second movement mechanism,
After the first base material support portion reaches a position where the first base material and the second base material are overlapped via the sealing portion, the first moving mechanism moves the press portion to the first position. 1 relatively moving toward the base material support part to press the sealing part,
After the first base material and the second base material are bonded to each other by the pressing unit to obtain the base material assembly, the pressure in the chamber is increased by the pressure adjusting means,
After the pressure in the chamber measured by the pressure measuring device reaches a predetermined pressure, the first moving mechanism relatively moves the press portion in a direction away from the first base material support portion. An electronic device manufacturing apparatus that controls at least the first moving mechanism, the second moving mechanism, and the pressure adjusting means so as to separate the press portion from the base material assembly. The pressure adjusting means is
A first pipe connected to the chamber;
A suction pump connected to the first pipe for discharging the gas in the chamber;
A first valve provided in the first pipe;
A second pipe connected to the chamber;
A second valve provided in the second pipe;
The electronic device manufacturing apparatus according to claim 4, further comprising: a gas supply source that is connected to the second pipe and supplies gas into the chamber.

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