JP2017065031A - Device and method for cooling resin molded article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for cooling a resin molded article, which is capable of suppressing deformation of the resin molded article at the time of cooling.SOLUTION: A cooling device 20 of resin molded articles includes: a mold 26 that is formed to be capable of closing the mold and capable of housing a hollow resin molded article 22 in a cavity 24 in a closely fitted state under a mold closing state; a cooling unit 28 that cools the resin molded article 22 by sending a cooled fluid L1 between an outer face 22A of the resin molded article 22 housed in the cavity 24 and a mold face 25 that forms the cavity 24; and a pressure applying unit 30 that applies an inner pressure to the resin molded article 22 by sending a fluid L2 inside the resin molded article 22 housed in the cavity 24.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin molded product cooling apparatus and a resin molded product cooling method.

After the resin molded product molded in the mold is cooled in the mold until it is semi-cured (primary cooling), the resin molded product is transferred from the mold to the cooling device and cooled (secondary cooling). A technique for curing to a state has been conventionally known (for example, Patent Document 1).
In Patent Document 1, while a semi-cured hollow resin molded product (tank) is held by a plurality of shape holding members, the resin molded product is cooled with a coolant from the outside, and the resin molded product is cooled with air from the inside. Cooling with.

JP 2004-202728 A

  By the way, in patent document 1, the shape of the resin molded product is hold | maintained by hold | maintaining each site | part of a resin molded product using a some shape holding member. However, there is a possibility that deformation occurs due to thermal contraction at a portion that is not held by the shape holding member of the resin molded product.

  The present invention relates to a resin molded product cooling apparatus and a resin molded product cooling method capable of suppressing deformation of a resin molded product during cooling.

  The apparatus for cooling a resin molded product according to claim 1 of the present invention is such that the mold can be closed, and in the mold closed state, the mold can be accommodated in a state in which a hollow resin molded product is in close contact with the cavity, and the cavity Cooling means for cooling the resin molded product by sending a cooled first fluid between the outer surface of the resin molded product housed in the mold and the mold surface forming the cavity, and housed in the cavity Pressure applying means for supplying a second fluid into the resin molded product to apply an internal pressure to the resin molded product.

  In the cooling device for a resin molded product according to claim 1, for example, a semi-cured hollow resin molded product formed of a thermoplastic resin is accommodated in close contact with the cavity of the mold, and the resin molding is performed by the cooling means. By sending the cooled first fluid between the outer surface of the product and the mold surface that forms the cavity, the resin molded product can be cooled from the outside. In the cooling device, when the resin molded product is cooled by the cooling unit, the second fluid is sent to the inside of the resin molded product by the pressure applying unit, thereby applying an internal pressure against the heat shrinkage to the resin molded product. It is possible to maintain the product in close contact with the cavity of the mold. In other words, the cooling device can suppress deformation of the resin molded product during cooling of the resin molded product.

  The resin molded product cooling device according to claim 2 of the present invention is the resin molded product cooling device according to claim 1, wherein the pressure applying means includes a cooling section for cooling the second fluid, The second fluid cooled is sent into the resin molded product to cool the resin molded product from the inside.

  In the cooling device for a resin molded product according to claim 2, since the resin molded product is cooled from the inside by the cooled second fluid sent from the pressure applying means, the cooling time of the resin molded product can be shortened. .

  The resin molded product cooling device according to claim 3 of the present invention is the resin molded product cooling device according to claim 1 or 2, wherein the first fluid is a liquid, and the mold is An upper mold provided with an upper mold recess that forms the upper part of the cavity, and a lower mold provided with a lower mold recess that forms the lower part of the cavity, and the cooling means includes the lower mold Provided in a mold, opened in the lower mold recess, and a delivery path for sending the first fluid to the cavity; and provided in the upper mold; opened in the upper mold recess; A discharge passage for discharging from the cavity.

  In the cooling device for a resin molded product according to the third aspect, the first fluid cooled from the delivery path opened in the lower mold recess is sent to the cavity. The first fluid sent to the hollow portion flows between the outer surface of the resin molded product and the mold surface of the hollow portion, and is discharged from the discharge path opened in the upper mold recess. As described above, in the cooling device, since the cooled liquid flows from the opening of the lower mold recess of the delivery path toward the opening of the upper mold recess of the discharge path, the outer surface of the resin molded product and the mold surface of the cavity are formed. It is possible to suppress heat from staying between.

  The resin molded product cooling device according to claim 4 of the present invention is the resin molded product cooling device according to claim 1 or 2, wherein the first fluid is a liquid, and the mold is An upper mold provided with an upper mold recess that forms the upper part of the cavity, and a lower mold provided with a lower mold recess that forms the lower part of the cavity, and the cooling means includes the upper mold Provided in the mold, opened in the upper mold recess, and a delivery path for sending the first fluid to the cavity, and provided in the lower mold, opened in the lower mold recess, and the first fluid A discharge passage for discharging from the cavity.

  In the cooling device for a resin molded product according to claim 4, the first fluid cooled from the delivery path opened in the upper mold recess is sent to the cavity. The first fluid sent to the hollow portion flows down between the outer surface of the resin molded product and the mold surface of the hollow portion, and is discharged from the discharge path opened in the lower mold recess. As described above, in the cooling device, since the cooled liquid flows down from the opening of the upper mold recess of the delivery path toward the opening of the lower mold recess of the discharge path, the resin molded product can be cooled with a simple structure. it can.

  The resin molded product cooling device according to claim 5 of the present invention is the resin molded product cooling device according to claim 3 or 4, wherein the upper mold recess is provided in the upper mold recess. An upper mold groove extending from the opening toward the boundary between the upper mold recess and the lower mold recess is formed, and the lower mold recess extends from the boundary toward the opening provided in the lower mold recess. A lower mold groove is formed.

  In the cooling device for a resin molded product according to claim 5, since the upper mold groove is formed in the upper mold recess and the lower mold groove is formed in the lower mold recess, the flow rate of the first fluid flowing through the cavity is controlled. It becomes possible to increase. The upper mold groove is extended from the opening provided in the upper mold recess toward the boundary between the upper mold recess and the lower mold recess, and the lower mold groove is extended from the boundary toward the opening provided in the lower mold recess. Therefore, the first fluid that has flowed into the cavity can be smoothly discharged from the cavity. Thereby, the cooling time of the semi-cured resin molded product can be further shortened.

  According to a sixth aspect of the present invention, there is provided a method for cooling a resin molded product, wherein a hollow resin molded product formed of a thermoplastic resin is taken out from a mold in a semi-cured state, and the resin is placed in a mold cavity provided in a cooling device. A housing step for housing the molded product in close contact with each other, a second fluid is sent into the resin molded product to apply an internal pressure to the resin molded product, and an outer surface of the resin molded product and the cavity are formed. A cooling step in which the first fluid cooled between the mold surfaces is sent to cool the resin molded product, and a removal step of taking out the cured resin molded product from the mold.

  In the method for cooling a resin molded product according to claim 6, a semi-cured hollow resin molded product formed of a thermoplastic resin is accommodated in close contact with a cavity of a mold of a cooling device, and then resin molded A second fluid is sent to the inside of the product to apply an internal pressure to the resin molded product, and a cooled first fluid is sent between the outer surface of the resin molded product and the mold surface that forms the cavity to send the resin molded product to the outside. Cool from. Here, in the cooling method, when the resin molded product is cooled, an internal pressure against heat shrinkage is applied to the resin molded product, so that the resin molded product can be kept in close contact with the cavity of the mold. That is, in the cooling method, the resin molded product can be prevented from being deformed when the resin molded product is cooled.

  ADVANTAGE OF THE INVENTION According to this invention, the cooling device of the resin molded product which can suppress that a resin molded product deform | transforms at the time of cooling, and the cooling method of a resin molded product can be provided.

It is a sectional side view of the type | mold used with the cooling device of the resin molded product which concerns on one Embodiment of this invention, The mold closed state is shown. It is a sectional side view in the mold open state of the type | mold of FIG. FIG. 2 is a side sectional view of the mold of FIG. 1 in an open state, showing an operation of setting a semi-cured resin molded product in a cavity. FIG. 2 is a side sectional view of the mold of FIG. 1 in a closed state, illustrating an operation of cooling a resin molded product housed in a cavity. It is an enlarged view of the part pointed by the arrow 5 of FIG. 4, and a part is further expanded. It is a sectional side view of the type | mold used with the cooling device of the resin molded product which concerns on other embodiment of this invention, The operation | movement which cools the resin molded product accommodated in the cavity part in the mold closed state is shown.

  Hereinafter, an embodiment of a resin molded product cooling device and a resin molded product cooling method according to the present invention will be described.

  As shown in FIG. 1, a resin molded product cooling device 20 of the present embodiment (hereinafter simply referred to as “cooling device 20”) is a semi-cured resin molded hollow formed of a thermoplastic resin. This is an apparatus for cooling and curing the product 22. In addition, as the resin molded product 22, a fuel tank for vehicles is mentioned, for example.

  As shown in FIG. 1 and FIG. 2, the cooling device 20 can be closed by a mold. When the mold is closed, the cooling apparatus 20 can be stored in a state in which the resin molded product 22 is in close contact with the cavity 24, and is stored in the cavity 24. A cooling unit 28 that cools the resin molded product 22 from the outside and a pressure applying unit 30 that applies an internal pressure to the resin molded product 22 are provided. The cavity 24 of the present embodiment is an example of the cavity portion in the present invention, the cooling unit 28 of the present embodiment is an example of the cooling means in the present invention, and the pressure applying unit 30 of the present embodiment is the present It is an example of the pressure provision means in invention.

  The mold 26 is a mold, and the shape of the cavity 24 is the same as the outer shape of the resin molded product 22. For this reason, in the mold closed state, the mold surface 25 that forms the cavity 24 of the mold 26 and the outer surface 22A of the resin molded product 22 are in close contact with each other. Here, the “close state” includes a close state in which a fluid L1 described later flows between the outer surface 22A of the resin molded product 22 and the mold surface 25.

  The die 26 includes an upper die 32 provided with an upper die recess 32A that forms the upper portion of the cavity 24, and a lower die 34 provided with a lower die recess 34A that forms the lower portion of the cavity 24. Has been. In addition, arrow UP in a figure has shown the upper direction of the cooling device 20. FIG.

  The upper mold 32 is movable in the apparatus vertical direction with respect to the lower mold 34. Specifically, the lower die 34 is installed on the upper surface of the base plate 62 fixed to the press machine 60 included in the cooling device 20, and is moved in the vertical direction of the apparatus by a lift drive mechanism (not shown) with respect to the base plate 62 of the press machine 60. The upper die 32 is installed on the lower surface of the top plate 64, and the upper die 32 and the lower die 34 are closed when the base plate 62 and the top plate 64 approach each other by the lifting drive mechanism of the press machine 60 ( The state shown in FIG. On the other hand, the upper mold 32 and the lower mold 34 are opened (the state shown in FIG. 2) when the base plate 62 and the top plate 64 are separated by the lifting drive mechanism.

  The cooling unit 28 is a unit that sends the cooled fluid L <b> 1 between the outer surface 22 </ b> A of the resin molded product 22 accommodated in the cavity 24 and the mold surface 25 that forms the cavity 24. The cooling unit 28 is provided in the lower mold 34, is opened in the lower mold recess 34 </ b> A (a plurality of openings in this embodiment), is provided in the delivery path 36 for sending the fluid L <b> 1 to the cavity 24, and the upper mold 32. An opening (a plurality of openings in the present embodiment) is provided in the upper mold recess 32A, and a discharge path 38 for discharging the fluid L1 from the cavity 24 is provided.

  In addition, the cooling unit 28 includes a heat exchanger 40 as an example of a cooling unit that cools the fluid L1, and a pump 42 that applies pressure to the fluid L1 to pump the inside of the delivery path 36. In this embodiment, the fluid L1 discharged from the cavity 24 to the discharge path 38 is once recovered, then cooled again by the heat exchanger 40 and sent to the cavity 24 through the delivery path 36. Is not limited to this configuration, and may be configured not to collect the fluid L1.

  As the fluid L1, either a liquid (for example, cooling water) or a gas (for example, air) may be used, but in the present embodiment, a liquid is used as the fluid L1. In addition, the fluid L1 of the present embodiment is an example of the first fluid in the present invention.

  The pressure applying unit 30 is a unit that applies an internal pressure to the resin molded product 22 by sending the fluid L2 into the resin molded product 22 accommodated in the cavity 24. The pressure applying unit 30 is provided in a cylindrical insertion port 43 that protrudes from the bottom of the lower mold recess 34A and is inserted into the opening 22B of the resin molded product 22 accommodated in the cavity 24, and the lower mold 34. A delivery path 44 for communicating with the inside of the resin molded product 22 accommodated in the cavity 24 through the inside of the port 43 and for sending the fluid L2 to the inside of the resin molded product 22 is provided.

  Further, the pressure applying unit 30 protrudes from the bottom of the lower mold recess 34A, and has a cylindrical insertion port 45 inserted into the opening 22C spaced from the opening 22B of the resin molded product 22 accommodated in the cavity 24, and the lower Discharge for discharging the fluid L2 sent from the delivery path 44 from the inside of the resin molded product 22, which is provided in the mold 34 and communicates with the inside of the resin molded product 22 accommodated in the cavity 24 through the inside of the insertion port 45. And a road 48. In this pressure application unit 30, since the insertion port 43 and the insertion port 45 are inserted into the opening 22B and the opening 22C, which are spaced apart from each other, the resin molding product 22 flows into the resin molding 22 from the insertion port 43. The fluid L2 circulates inside the resin molded product 22 and is discharged through the insertion port 45.

  Furthermore, the pressure applying unit 30 includes a heat exchanger 50 as an example of a cooling unit that cools the fluid L2, and a pump 52 that applies pressure to the fluid L2 to pump the inside of the delivery path 44. In the present embodiment, the fluid L2 discharged from the inside of the resin molded product 22 to the discharge path 48 is once recovered, and then cooled again by the heat exchanger 50, and then returned to the inside of the resin molded product 22 through the delivery path 44. Although it is set as the structure sent out, this invention is not limited to this structure, It is good also as a structure which does not collect | recover fluid L2.

  As the fluid L2, either liquid (for example, cooling water) or gas (for example, air, carbon dioxide gas, dry ice, compressed nitrogen gas) may be used. In the present embodiment, gas is used as the fluid L2. Yes. The fluid L2 in the present embodiment is an example of the second fluid in the present invention.

  Further, as shown in FIG. 5, the upper mold recess 32A has an upper mold extending from the opening of the discharge path 38 provided in the upper mold recess 32A toward the boundary PL between the upper mold recess 32A and the lower mold recess 34A. A plurality of grooves 54 are formed. On the other hand, the lower mold recess 34A is formed with a plurality of lower mold grooves 56 extending from the boundary PL toward the opening of the delivery path 36 provided in the lower mold recess 34A. The upper mold groove 54 and the lower mold groove 56 are continuous across the boundary PL between the upper mold recess 32A and the lower mold recess 34A in the mold closed state of the upper mold 32 and the lower mold 34. With this configuration, the fluid L <b> 1 flows smoothly between the lower mold groove 56 and the upper mold groove 54. Here, “boundary PL” refers to the opening edge of the upper mold recess 32A and the opening edge of the lower mold recess 34A that overlap each other.

  Next, the cooling method of the resin molded product of this embodiment is demonstrated.

(Containment process)
First, in an upstream process, a hollow resin molded product 22 is molded with a thermoplastic resin using a mold (not shown). And the cooling function of a shaping | molding die is used, and the resin molded product 22 is cooled to such an extent that an own shape can be hold | maintained at the time of mold release. Thereafter, the semi-cured resin molded product 22 is taken out from the mold and accommodated in a state where the resin molded product 22 is brought into close contact with the cavity 24 of the mold 26 shown in FIG. Specifically, the lower mold 34 is set with the lower mold recess 34A facing the surface on which the openings 22B and 22C of the resin molded product 22 are formed, and then the upper mold 32 is mounted on the apparatus as shown in FIG. The upper die 32 and the lower die 34 are closed by moving downward in the vertical direction. When closing the mold, the opposite side of the surface of the resin molded product 22 where the openings 22B and 22C are formed is accommodated in the upper mold recess 32A of the upper mold 32.

(Cooling process)
Next, as shown in FIG. 5, the fluid L <b> 2 cooled inside the resin molded product 22 using the pressure applying unit 30 is sent through the delivery path 44 to apply internal pressure to the resin molded product 22 and resin molding. The product 22 is cooled from the inside, and further, the fluid L1 cooled between the outer surface 22A of the resin molded product 22 and the mold surface 25 forming the cavity 24 using the cooling unit 28 is sent through the delivery path 36, and the resin 22 The molded product 22 is cooled from the outside.
Here, by applying an internal pressure against heat shrinkage during cooling to the resin molded product 22, the state where the resin molded product 22 is in close contact with the cavity 24 of the mold 26 is maintained. That is, it is possible to suppress deformation of the resin molded product 22 when the resin molded product 22 is cooled.

  In the cooling process, the pressure applying unit 30 is used to send the fluid L2 into the resin molded product 22 to apply the internal pressure, and the cooling unit 28 is used to cool the resin molded product 22 from the outside with the fluid L1. About operation | movement, either one may be quick at the same time, but in this embodiment, the operation | movement which provides the internal pressure to the resin molded product 22 using the pressure provision unit 30 previously is implemented.

(Removal process)
After the resin molded product 22 is cured to the product state, the mold 26 (the upper mold 32 and the lower mold 34) is opened to remove the cured resin molded product 22 from the mold 26. Thereby, the resin molded product 22 is completed.

Next, the effect of this embodiment is demonstrated.
In the cooling device 20, the semi-cured resin molded product 22 is accommodated in close contact with the cavity 24 of the mold 26, and is cooled between the outer surface 22 A of the resin molded product 22 and the mold surface 25 of the cavity 24 by the cooling unit 28. The resin molded product 22 can be cooled from the outside by sending the cooled fluid L1. In the cooling device 20, when the resin molded product 22 is cooled by the cooling unit 28, the pressure application unit 30 sends the fluid L <b> 2 to the inside of the resin molded product 22 to apply an internal pressure against the heat shrinkage to the resin molded product 22. The resin molded product 22 can be kept in close contact with the cavity 24 of the mold 26. That is, the cooling device 20 can suppress deformation of the resin molded product 22 when the resin molded product 22 is cooled.

  Moreover, in the cooling device 20, since the resin molded product 22 is cooled from the inside by the cooled fluid L2 sent from the pressure applying unit 30, the cooling time of the resin molded product 22 can be shortened.

  Furthermore, in the cooling device 20, the fluid L <b> 1 cooled from the delivery path 36 opened in the lower mold recess 34 </ b> A is sent to the cavity 24. The fluid L1 sent to the cavity 24 flows between the outer surface 22A of the resin molded product 22 and the mold surface 25 of the cavity 24 and is discharged from the discharge path 38 opened to the upper mold recess 32A. Thus, in the cooling device 20, the cooled liquid (fluid L1) flows from the opening of the lower mold recess 34A of the delivery path 36 toward the opening of the upper mold recess 32A of the discharge path 38. It is possible to suppress the heat from staying between the outer surface 22A and the mold surface 25 of the cavity 24. Thereby, the cooling time of the resin molded product 22 can be shortened more.

  Further, in the cooling device 20, since the upper mold groove 54 is formed in the upper mold recess 32A and the lower mold groove 56 is formed in the lower mold recess 34A, the flow rate of the fluid L1 flowing through the cavity 24 can be increased. It becomes. In addition, since the upper mold groove 54 extends from the opening of the discharge path 38 toward the boundary PL, and the lower mold groove 56 extends from the boundary PL toward the opening of the delivery path 36, the fluid L1 flowing into the cavity 24 is allowed to flow. It becomes possible to discharge smoothly from the cavity 24. Thereby, the cooling time of the semi-cured resin molded product 22 can be further shortened.

  Furthermore, in the cooling device 20, since the fluid L2 is a gas, for example, the fluid L2 can be easily discharged (exhausted) from the inside of the resin molded product 22 after cooling compared to the case where the fluid L2 is a liquid. it can.

  In the above-described embodiment, the pressure application unit 30 includes the heat exchanger 50 as an example of the cooling unit. However, the present invention is not limited to this configuration, and the pressure application unit 30 does not include the heat exchanger 50. It is good also as a structure.

  In the above-described embodiment, the upper mold groove 54 is formed in the upper mold recess 32A and the lower mold groove 56 is formed in the lower mold recess 34A. However, the present invention is not limited to this configuration, and the upper mold is formed. The groove 54 and the lower mold groove 56 may not be formed.

  Furthermore, in the above-described embodiment, the delivery path 36 is opened in the lower mold recess 34A and the discharge path 38 is opened in the upper mold recess 32A. However, the present invention is not limited to this configuration and is shown in FIG. As in the cooling device 70 according to another embodiment of the present invention, the delivery path 36 may be opened in the upper mold recess 32A, and the discharge path 38 may be opened in the lower mold recess 34A. With this configuration, the fluid L1 cooled from the delivery path 36 opened in the upper mold recess 32A is sent to the cavity 24, and between the outer surface 22A of the resin molded product 22 and the mold surface 25 of the cavity 24. It flows down and is discharged from the discharge path 38 opened in the lower mold recess 34A. Thus, in the cooling device 70, the cooled liquid (fluid L1) flows down from the opening of the upper mold recess 32A of the delivery path 36 toward the opening of the lower mold recess 34A of the discharge path 38, that is, acts on the liquid. Since the liquid is caused to flow down by gravity, the output (capacity) of the pump 42 can be reduced, and the resin molded product 22 can be cooled with a simple structure.

  Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and various modifications other than the above can be implemented without departing from the spirit of the present invention. Of course.

20 Cooling device 22 Resin molded product 22A Outer surface 24 Cavity (cavity)
25 mold surface 26 mold 28 Cooling unit (cooling means)
30 Pressure applying unit (pressure applying means)
32 Upper mold 32A Upper mold recess 34 Lower mold 34A Lower mold recess 36 Delivery path 38 Discharge path 50 Heat exchanger (cooling section)
54 Upper mold groove 56 Lower mold groove 70 Cooling device L1 Fluid (first fluid)
L2 fluid (second fluid)

Claims (6)

The mold can be closed, and in the mold closed state, a mold that can be accommodated in a state where a hollow resin molded product is closely attached to the cavity,
A cooling means for cooling the resin molded product by sending a cooled first fluid between an outer surface of the resin molded product housed in the cavity and a mold surface forming the cavity;
Pressure applying means for sending a second fluid into the resin molded product housed in the cavity and applying an internal pressure to the resin molded product;
A cooling apparatus for resin molded products.   The said pressure provision means is provided with the cooling part which cools the said 2nd fluid, sends the said 2nd fluid cooled inside the said resin molded product, and cools the said resin molded product from the inside. Cooling device for resin molded products. The first fluid is a liquid;
The mold includes an upper mold provided with an upper mold recess that forms an upper part of the cavity, and a lower mold provided with a lower mold recess that forms a lower part of the cavity,
The cooling means is provided in the lower mold and opens in the lower mold recess, a delivery path for sending the first fluid to the cavity, and an upper mold, and opens in the upper mold recess. The resin molded product cooling device according to claim 1, further comprising: a discharge path for discharging the first fluid from the cavity. The first fluid is a liquid;
The mold includes an upper mold provided with an upper mold recess that forms an upper part of the cavity, and a lower mold provided with a lower mold recess that forms a lower part of the cavity,
The cooling means is provided in the upper mold and opens in the upper mold recess, and is provided in a delivery path for sending the first fluid to the cavity, and in the lower mold and opens in the lower mold recess. The resin molded product cooling device according to claim 1, further comprising: a discharge path for discharging the first fluid from the cavity. The upper mold recess is formed with an upper mold groove extending from the opening provided in the upper mold recess toward the boundary between the upper mold recess and the lower mold recess,
The cooling device for a resin molded product according to claim 3 or 4, wherein a lower mold groove extending from the boundary toward the opening provided in the lower mold recess is formed in the lower mold recess. A housing step of taking out a hollow resin molded product formed of a thermoplastic resin from a mold in a semi-cured state and accommodating the resin molded product in a state of being in close contact with a cavity of a mold provided in a cooling device;
A second fluid is sent into the resin molded product to apply internal pressure to the resin molded product, and a cooled first fluid is sent between the outer surface of the resin molded product and the mold surface forming the cavity. Cooling step for cooling the resin molded product,
Taking out the cured resin molded product from the mold; and
For cooling a resin molded product comprising:

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