JP2008137275A - Mold apparatus and method for manufacturing molded article - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To rapidly perform heating and cooling of a cavity and to accelerate molding cycle. <P>SOLUTION: A sliding space 21 partitioned from a cavity K is formed in a mold body of a movable mold 20, and heat insulating plates 40a and 40b in the mold are reciprocated in the sliding space 21. The heat insulating plates 40a and 40b in the mold are displaced to a flow path forming position for forming a gap (flow path R) communicated with outside in the circumference of the cavity K, and to a flow path closing position for closing the flow path R by a heat insulating wall with a recessed shape in the circumference of the cavity K. In a temperature elevating process before injecting a molten resin, the heat insulating plates 40a and 40b in the mold is displaced to the flow path closing position to reduce a heating volume and to shorten the heating time of the cavity K. In a rapid cooling process after injecting the molten resin, the heat insulating plates 40a and 40b in the mold are displaced to the flow path forming position and a temperature conditioning medium in a piping 30 for temperature conditioning of the mold is switched to low temperature from high temperature. The cooling volume is remarkably enlarged thereby to shorten the cooling time. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a mold apparatus and a method for manufacturing a molded article, and in particular, a mold apparatus capable of advancing a molding cycle of a molded article by rapidly raising and cooling a cavity, and a molded article It relates to a manufacturing method.

Conventionally, in a molding process of a thermoplastic resin or the like, various methods have been used to cool and solidify a molten resin filled in a cavity of a mold apparatus. For example, a cooling pipe is provided in the mold apparatus and a cooling medium (for example, cold water) having a constant temperature (resin crystallization temperature) is allowed to flow, and the resin heat in the cavity and the heat of the mold body are absorbed and discharged by this cooling medium. Therefore, a cooling method is used (for example, see Patent Document 1).
Various methods are used as a preheating method for raising the temperature of the cavity before filling with the molten resin. For example, a method of preheating using heat generated by an electric heater embedded in a mold apparatus is used. Further, a method is used in which a pipe is provided in the same manner as the cooling medium, a heating medium is flown in the pipe, and the heat of the heating medium is transmitted to the cavity through the mold body to raise the temperature of the cavity.
Further, a method of adjusting the mold temperature by switching a high-temperature heating medium and a low-temperature cooling medium to flow in a pipe serving as a fluid passage is used (for example, Patent Document 2). reference).

JP 2006-82267 A JP 2005-238456 A

However, in the cooling method using the cooling pipe, it is not preferable to increase the number of cooling pipes from the viewpoint of securing the strength of the mold. Therefore, the supply amount (flow rate) of the cooling medium cannot be increased so much, and it takes time to absorb and discharge heat. Therefore, there is a problem that the molding cycle cannot be accelerated. Further, since the flow rate and temperature of the cooling medium are normally constant, the temperature decrease gradient after approaching the target temperature to some extent becomes gradual, and a desired temperature decrease gradient cannot be obtained.
In order to speed up the molding cycle, it is desirable to shorten the time required for the temperature rise (residual heat) of the cavity performed after the molded product is released and before the next molten resin is filled. However, it is difficult to significantly increase the output of the electric heater, the heat capacity of the heating medium, the flow rate, and the temperature, and the overall size of the mold is larger than the size of the cavity. It has been difficult to shorten the time required for temperature increase.

  In view of the above problems, the object of the present invention is to reduce the cooling time of the cavity after filling with the molten resin and shorten the temperature rising time of the cavity after mold release, thereby enabling a mold cycle to be accelerated. To provide a mold device.

  According to the mold apparatus of the present invention, the object is to form a predetermined cavity between the first mold and the first mold by being clamped to the first mold. A mold, and the second mold includes a slide space that is formed on the outer peripheral side of the cavity in the second mold and is partitioned from the cavity, and a slide mold that moves forward and backward in the slide space. The slide mold is configured to be displaceable into a flow path forming position where a gap is formed on the cavity side in the slide space and a flow path closed position closing the gap, and the gap Is solved by being configured to be usable as a first temperature control flow path that communicates with the outside and allows the flow and discharge of the temperature control medium from the outside.

As described above, the mold apparatus of the present invention includes the slide space formed by being partitioned from the cavity on the outer peripheral side of the cavity, and the slide mold that moves forward and backward in the slide space. The slide mold can be displaced to a flow path forming position where a gap is formed on the cavity side of the slide space, and the temperature control medium can be introduced and discharged from the outside into the gap. Can be used as. On the other hand, the slide type can be displaced to a flow path closing position that closes the gap.
As described above, in the present invention, the first temperature control channel that is temporarily communicated to the outside can be formed on the outer peripheral side of the cavity by the forward and backward movement of the slide mold, and the low temperature can be temporarily set on the outer peripheral side of the cavity. A large amount of temperature control medium can be allowed to flow. Therefore, it can cool rapidly and can speed up a molding cycle. Further, when cooling with the temperature control medium is not performed, the flow path can be used by being closed by a slide mold.

Further, in the present invention, the second mold has a second temperature control flow path that is disposed between the mold surface of the cavity and the slide space and allows the temperature control medium to flow in and out from the outside. It is preferable to do so.
Thus, in addition to the first temperature control channel formed by the slide space and the slide mold, when the second temperature control channel is formed on the cavity side of the first temperature control channel, By causing a low temperature control medium to flow into the two temperature control channels, both the temperature control medium flowing into the first temperature control channel and the temperature control medium flowing into the second temperature control channel both. The cavity can be cooled. Therefore, the cavity temperature can be lowered more rapidly, and the molding cycle can be further accelerated.

In the present invention, the slide space is formed so as to surround the cavity, and the slide mold is configured to have a lower thermal conductivity than the mold of the second mold, so that the flow path closed position It is preferable that the heat radiation from the cavity side to the outside can be reduced.
If comprised in this way, a cavity can be enclosed with a slide type | mold with low heat conductivity by closing slide space with a slide type | mold. Therefore, the slide mold can function as an in-mold heat insulating plate as necessary. And since the 2nd temperature control flow path is arrange | positioned inside the space enclosed with the heat insulation board (slide type) in a metal mold | die, when a high temperature control medium is poured into the 2nd temperature control flow path, , It becomes difficult for heat to flow out to the outside. That is, the heating volume can be reduced by surrounding the cavity with a slide mold. Therefore, the cavity temperature can be rapidly increased without increasing the flow rate or temperature of the temperature control medium.
In the present invention, it is preferable that the second temperature control flow path is configured to be able to switch between a high temperature control medium and a low temperature control medium. If it does in this way, cooling and heating can be performed by one temperature control channel.

  In addition, according to the method for manufacturing a molded product of the present invention, the above-described problem is a cavity forming step in which a first cavity and a second mold are clamped to form a predetermined cavity, and the second mold has the above-described problem. A temperature raising step of raising the temperature of the slide mold in a state where the slide mold that moves forward and backward in the slide space defined by the cavity is moved toward the cavity in the slide space; and a molten resin in the cavity A filling step of filling and moving the slide mold in a direction away from the cavity form a gap communicating with the outside on the cavity side of the slide space, and a low temperature first temperature is formed in the gap from the outside. A rapid cooling step for rapidly cooling the cavity by flowing a preparation medium; a mold release step for releasing the molded product that has been solidified by opening the first mold and the second mold; It is solved by carrying out.

  As described above, in the method of manufacturing a molded article according to the present invention, in the temperature raising step, the slide mold is moved to the cavity side so as to surround the cavity, and the temperature of the cavity is raised in that state. The heating volume is reduced and the cavity temperature can be rapidly increased. Also, in the rapid cooling process, the slide mold is moved away from the cavity to form a gap temporarily communicating with the outside on the cavity side of the slide space, and a low temperature is formed in this gap (first temperature control flow path). By allowing a large amount of the first temperature control medium to flow in, the cavity can be rapidly cooled. Therefore, heating and cooling can be performed rapidly, and the molding cycle can be accelerated.

Further, in the present invention, in the temperature raising step, a high-temperature second temperature regulating medium is caused to flow from the outside into a temperature regulating channel disposed between the slide space and the mold surface of the cavity so that the cavity is formed. It is preferable that the cavity is rapidly cooled by raising the temperature and injecting a low temperature third temperature adjustment medium from the outside into the temperature adjustment flow path in the rapid cooling step.
Thus, not only the high-temperature temperature control medium for heating but also the low-temperature temperature control medium for cooling (third temperature control medium) can be switched to flow through the second temperature control flow path. The cavity is cooled by both the first temperature control medium flowing into the first temperature control flow path formed by the slide space and the slide mold and the third temperature control medium flowing into the second temperature control flow path. can do. Therefore, the cavity temperature can be lowered more rapidly, and the molding cycle can be further accelerated.

In the present invention, the slide mold is configured to have a lower thermal conductivity than the mold of the second mold, and the slide mold is moved to the cavity side in the slide space in the temperature raising step. Therefore, it is preferable that the temperature is rapidly increased by blocking heat radiation from the cavity side to the outside by being positioned so as to surround the cavity.
Thus, by surrounding the cavity with a slide mold having a low thermal conductivity, heat hardly flows out of the slide mold. In other words, since the heating volume can be reduced in this way, the cavity temperature can be rapidly increased without increasing the flow rate or temperature of the temperature control medium.

The present invention has the following effects.
According to the present invention, the first temperature control flow path that is temporarily communicated to the outside can be formed on the outer peripheral side of the cavity by the forward and backward movement of the slide mold, and the low temperature can be temporarily set on the outer peripheral side of the cavity. A large amount of conditioning medium can be introduced. Therefore, it can cool rapidly and can speed up a molding cycle.
According to the present invention, the second temperature control channel is formed on the cavity side of the first temperature control channel, and the low temperature control medium is allowed to flow into the second temperature control channel, thereby the first temperature control channel. The cavity can be cooled by both the temperature control medium flowing in a large amount into the control flow path and the temperature control medium flowing in the second temperature control flow path. Therefore, cooling can be performed more rapidly and the molding cycle can be accelerated.
According to the present invention, the heating volume can be reduced by surrounding the cavity with a slide mold having a low thermal conductivity. Therefore, it is possible to rapidly raise the temperature of the cavity by flowing a high-temperature temperature control medium through the second temperature control flow channel disposed inside the slide mold.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. It should be noted that members, arrangements, and the like described below do not limit the present invention, and it goes without saying that various modifications can be made in accordance with the spirit of the present invention.
1 to 7 relate to one embodiment of the present invention, FIG. 1 is a sectional view of a mold apparatus clamped, FIG. 2 is an explanatory view of a slide space formed in a movable mold, and FIG. FIG. 4 is a cross-sectional explanatory view showing a state in which a temperature control flow path is formed in the slide space of the mold apparatus clamped, FIG. 5, FIG. 6 is an explanatory view showing a cavity cooling step using a low-temperature temperature control medium, and FIG. 7 is a cross-sectional explanatory view showing a mold opening step and a molded product ejecting step after completion of molten resin curing.

(Configuration of mold equipment)
FIG. 1 shows a mold apparatus S according to an embodiment of the present invention.
The mold apparatus S of this example includes a fixed mold 10, a movable mold 20 that forms a cavity K having a predetermined shape between the fixed mold 10, and a mold temperature control pipe disposed in the mold of the movable mold 20. 30 and the in-mold heat insulating plate 40 that moves back and forth in the mold of the movable mold 20 are main components.
The fixed mold 10 and the movable mold 20 are disposed between a fixed side mounting plate (not shown) and a movable side mounting plate (not shown) which are known mold clamping means. The fixed mold 10 and the movable mold 20 are formed with cavity surfaces 10A and 20A having a predetermined shape for forming the cavity K facing each other. The fixed mold 10 of the present embodiment corresponds to the first mold of the present invention, and the movable mold 20 of the present embodiment corresponds to the second mold of the present invention.

A sprue 11 for injecting molten resin into the cavity K is formed in the fixed mold 10. One end of the sprue 11 can be connected to a nozzle that supplies molten resin. The other end of the sprue 11 is open to the cavity surface 10A.
The movable mold 20 has a concave cavity surface 20A. A mold temperature control pipe 30 is embedded in the movable mold 20 in the vicinity of the cavity surface 20A so as to surround the cavity surface 20A. The movable mold 20 has a slide space 21 formed on the outer peripheral side of the area where the mold temperature control pipe 30 is embedded. In the slide space 21, an in-mold heat insulating plate 40 (40a, 40b) as a slide mold is disposed.

FIG. 2 shows the overall shape of the slide space 21. FIG. 2 shows a cross-sectional configuration of the mold apparatus S at the same cross-sectional position as in FIG. 1, but in this drawing, cross-sectional hatching is omitted, and only the region of the slide space 21 is colored (hatched). . As shown in this figure, the cross-sectional shape of the slide space 21 is substantially H-shaped, and the upper half portion (portion on the fixed mold 10 side) is formed in a concave shape surrounding the cavity K. Further, the lower half portion of the slide space 21 (the portion opposite to the fixed mold 10 side) has a downwardly concave shape.
Of the inner circumferential surface of the slide space 21, the surface on the cavity K side is substantially similar to the cavity surface 20A. With such a shape, the cavity K and the slide space 21 are partitioned by a concave mold body having a predetermined thickness. As described above, the mold temperature control pipe 30 is embedded in this section.

In the slide space 21, an in-mold heat insulating plate 40 a is disposed in a lateral space located substantially at the center of the substantially H-shaped cross section. The in-mold heat insulating plate 40a is disposed substantially parallel to the bottom surface of the cavity surface 20A. In addition, in the slide space 21, an in-mold heat insulating plate 40 b is disposed in vertical spaces on both the left and right sides of the substantially H-shaped cross section. The in-mold heat insulating plate 40b is disposed substantially parallel to the side surface of the cavity surface 20A.
In the mold-clamping state shown in FIG. 1, the in-mold heat insulating plates 40 a and 40 b are at a position that has been moved to the maximum in the drawing space 21, that is, toward the fixed mold 10. In this position, the in-mold heat insulating plates 40a and 40b are in contact with the surface on the cavity K side of the inner surface of the slide space 21, and a gap is formed on the cavity K side of the in-mold heat insulating plates 40a and 40b. Not. The positions of the in-mold heat insulating plates 40a and 40b in FIG. 1 correspond to the flow path closing position of the present invention.

Further, at this position, the lower end surfaces of the in-mold heat insulating plates 40a and 40b are substantially in a straight line, and an upward concave heat insulating wall is formed by the in-mold heat insulating plates 40a and 40b. Since the upper ends of the vertical spaces on both the left and right sides of the slide space 21 extend to the vicinity of the parting surfaces of the fixed mold 10 and the movable mold 20, the cavity K is surrounded by the heat insulating walls to the vicinity of the upper ends thereof.
In this example, the heat insulating plates 40a and 40b in the mold are configured to have lower thermal conductivity than the mold of the movable mold 20. Therefore, if the periphery of the cavity K is surrounded by the in-mold heat insulating plates 40a and 40b, heat radiation from the cavity K side to the outside is reduced as compared with the case where the slide space 21 is not provided. As described above, if the heat radiation to the outside of the heat insulation wall is reduced, the temperature on the cavity K side can be efficiently increased by heating the part on the cavity K side than the heat insulation wall. Can do. That is, the heating volume when heating the cavity K can be reduced by forming the heat insulating walls by the in-mold heat insulating plates 40a and 40b. FIG. 3 shows the reduced heating region by coloring (hatching).

The heat insulating plate 40a in the mold is maintained in the slide space 21 in a substantially parallel posture with the bottom surface of the cavity surface 20A, and the vertical direction in FIG. 1 (the direction from the fixed mold 10 side to the movable mold 20 side or vice versa). Direction). That is, in the slide space 21, the height dimension of the lateral space having a substantially H-shaped cross section is set to be larger than the thickness dimension of the in-mold heat insulating plate 40. As will be described later, a support post 23 through which the ejector pin 22 passes is formed at a predetermined position in the lateral space. However, a through hole corresponding to the position of the support post 23 is formed in the in-mold heat insulating plate 40. Is provided. Therefore, the in-mold heat insulating plate 40a can be moved forward and backward in a state where the support 23 penetrates the in-mold heat insulating plate 40a.
Moreover, since the slide pin 41 for operation | movement is attached to the predetermined position (this example both ends) in the heat insulation board 40a in a metal mold | die, by transmitting a driving force to this slide pin 41, a metal mold | die is transmitted. The inner heat insulating plate 40 a can be moved forward and backward in the slide space 21.

In the mold heat insulating plate 40b, in the vertical space on both the left and right sides of the slide space 21, as in the mold heat insulating plate 40a, the vertical direction in FIG. 1 (the direction from the fixed mold 10 side to the movable mold 20 side, (Or in the opposite direction). Further, since the slide pin 41 for operation is attached to the lower end of the heat insulating plate 40b in the mold in the same manner as the heat insulating plate 40a in the mold, by transmitting the driving force to the slide pin 41, The heat insulating plate 40b can be moved back and forth in the slide space 21.
As shown in FIG. 4, when the in-mold heat insulating plates 40 a and 40 b move downward most in the slide space 21, the upper half of the vertical space on both the left and right sides of the slide space 21 is a space in which the interior is not filled. It becomes. And the heat insulating plates 40a and 40b in the mold are concave downward, and the upper end surfaces of the heat insulating plates 40a and 40b in the mold are substantially in a straight line. In this state, a gap is formed between the cavity heat insulating plates 40a, 40b in the mold, that is, between the heat insulating plates 40a, 40b in the mold and the surface of the slide space 21 on the cavity K side. By connecting the lower ends of the vertically oriented spaces on the left and right sides of the slide space 21, a continuous concave space is formed as a whole.

In the slide space 21, a communication path 21 a communicating with the outside of the movable mold 20 is formed. The communication path 21 a is connected to the upper side (fixed mold 10 side) of the vertical space on both the left and right sides of the slide space 21, and opens on the side surface of the movable mold 20.
With such a configuration, when the in-mold heat insulating plates 40a and 40b are moved to the lowest position, the upper half of the slide space 21, that is, the portion surrounding the cavity K becomes a concave gap. 21a communicates with the outside of the movable mold 20. That is, the flow path R surrounding the cavity K is formed in the movable mold 20 by the slide space 21 and the communication path 21a and the in-mold heat insulating plates 40a and 40b. As shown in FIG. 4, a temperature control medium or the like can be flowed into the flow path R from an external flow path connected to one of the left and right communication paths 21a, and from an external flow path connected to the other side. The temperature control medium and the like can be discharged to the outside.
The flow path R corresponds to the first temperature control flow path of the present invention. Further, the positions of the in-mold heat insulating plates 40a and 40b in FIG. 4 correspond to the flow path forming position of the present invention.

In addition, the movable mold 20 is provided with ejector pins 22 for protruding the molded product in the cavity K. One end side of the ejector pin 22 penetrates the movable mold 20 and reaches the cavity surface 20A, and the other end side protrudes to the movable side mounting plate (not shown) side. The ejector pin 22 of this example is disposed so as to penetrate the inside of the support column 23 formed in the slide space 21. Therefore, the ejector pin 22 is not exposed in the slide space 21.
One end of the column 23 is connected to the surface on the cavity K side (fixed mold 10 side) in the slide space 21, and the other end is an opposite surface in the slide space 21, that is, a movable mounting plate (not shown). Connected to the side surface. The column 23 and the ejector pin 22 are formed substantially perpendicular to the bottom surface of the concave cavity surface 20A.

The mold temperature control pipes 30 are arranged at a predetermined pitch along the cavity surface 20A, and these are connected in series or in parallel to form one or a plurality of flow paths. Since one end of this flow path is connected to the outside of the mold apparatus S, a temperature control medium having a predetermined temperature supplied from the outside flows into the mold temperature control pipe 30. The temperature control medium is circulated through the mold temperature control pipe 30 according to a predetermined flow path and then discharged to the outside.
The mold temperature control pipe 30 is preferably formed of a material having a high thermal conductivity in order to transfer heat from the temperature control medium to the surrounding mold body. Moreover, as a temperature control medium, well-known refrigerant | coolants or heat media, such as cold water, warm water, a vapor | steam, oil, ethylene glycol, can be used, for example.
When the temperature control medium flows into the mold temperature control pipe 30, the mold body around the mold temperature control pipe 30 is cooled or heated by heat transfer from the temperature control medium 30. Therefore, the cavity K is cooled or heated. In this example, since the mold temperature control pipe 30 is arranged without deviation along the cavity surface 20A, the cavity K can be heated or cooled uniformly from the movable mold 20 side.

  Moreover, the mold temperature control pipe 30 of this example is configured so that the temperature control medium flowing into the mold temperature control pipe 30 can be switched. For example, both a heating device that supplies a high-temperature temperature control medium and a cooling device that supplies a low-temperature temperature control medium to the mold temperature control pipe 30 are connected, and the temperature control medium that flows into the pipe by switching a connection valve or the like Are configured to be able to be switched. In addition, a heater and a cooling device are attached to a pipe connected to the mold temperature control pipe 30, and the temperature control medium is changed to switch between the refrigerant and the heat medium by appropriately switching between them. It can also be configured. If it does in this way, both cooling and heating can be performed by one mold temperature control piping 30.

(Method for manufacturing molded products)
Next, the manufacturing method of the molded article by the mold apparatus S having the above configuration will be described.
(1) Cavity formation process First, the mold is clamped by bringing the parting surfaces of the fixed mold 10 and the movable mold 20 into contact with each other. Thereby, the cavity K is formed.
(2) Temperature raising step Next, in the state where the cavity K is formed, an upward driving force (direction from the movable mold 20 side toward the fixed side 10 side) is transmitted to the slide pin 41, and the in-mold heat insulating plate 40a, 40b is moved above the slide space 21, that is, toward the cavity K side. As a result, the in-mold heat insulating plates 40a and 40b reach the upper end of the slide space 21 and come into contact with the cavity K side surface in the slide space 21 without a gap. And as shown in FIG. 1, the upward concave heat insulation wall surrounding the cavity K is formed by the heat insulation plates 40a and 40b in the mold.
In this state, the cavity K is heated to a temperature suitable for filling the molten resin by flowing a high-temperature temperature control medium (corresponding to the second temperature control medium of the present invention) into the mold temperature control pipe 30. To do. Since the heat insulating plates 40a and 40b in the mold have lower thermal conductivity than the mold of the movable mold 20, the heating volume when the cavity K is heated by the heat insulating wall made of the heat insulating plates 40a and 40b in the mold is as follows. As shown in FIG. Therefore, the heat radiation to the outside of the heat supplied by the high-temperature temperature control medium flowing through the mold temperature control pipe 30 is reduced. Thereby, the heating volume portion is rapidly heated, and the preheating of the cavity K is completed in a short time.

(3) Filling Step Next, molten resin is injected into the cavity K from one end of the sprue 11. Since the cavity K is heated in the temperature raising step, the fluidity of the molten resin in the cavity K is ensured. Therefore, the molten resin can be filled in the cavity K without a gap. During filling, the supply of the high-temperature temperature control medium to the mold temperature control pipe 30 may be continued so that the temperature of the cavity K does not decrease. The supply of the conditioning medium may be stopped. This is preferable because it does not take time to switch the temperature control medium supplied to the mold temperature control pipe 30 in the next process (rapid cooling process).
In this step, the pressure holding is completed (resin crystallization) after the filling of the molten resin is completed.

(4) Rapid cooling step Next, the temperature control medium supplied to the mold temperature control pipe 30 is switched from a high temperature control medium to a low temperature control medium (corresponding to the third temperature control medium of the present invention). The cavity K is cooled. In parallel with this, a downward driving force (a direction from the fixed side 10 side toward the movable mold 20 side) is transmitted to the slide pin 41 so that the heat insulating plates 40a and 40b in the mold are respectively located at the lowest positions in the slide space 21. Move to the position. As a result, the upper half of the slide space 21, that is, the portion surrounding the cavity K becomes a concave gap, and this gap is communicated to the outside of the movable mold 20 by the communication path 21a to form a large capacity flow path R. The cavity K is cooled by flowing a large amount of low-temperature temperature control medium (corresponding to the first temperature control medium of the present invention) into the flow path R from the external flow path connected to the communication path 21a.
FIG. 5 shows a state in which a low-temperature temperature control medium is caused to flow into the flow path R, and FIG. 6 illustrates a state in which a low-temperature temperature control medium is allowed to flow into the mold temperature control piping 30 in addition to the flow path R. Show. In this step, the cooling volume can be greatly expanded by forming the large-capacity flow path R. In addition, since the low-temperature temperature control medium flows into the mold temperature control pipe 30 and the flow path R in the slide space 21, the cooling volume can be further expanded as shown in FIG. Thereby, the cavity K is rapidly cooled, and the cooling time can be shortened.

(5) Mold Release Step Next, as shown in FIG. 7, the mold apparatus S immediately after the completion of cooling is opened and the molded product is released from the cavity surface 10 </ b> A of the fixed mold 10. Subsequently, the ejector pin 22 projects the molded product and releases it from the movable mold 20. Thereby, mold release of a molded product is completed.
In addition, it is preferable to discharge the large-capacity low-temperature temperature control medium injected into the flow path R for cooling in the previous process to the outside during the mold release process. If it does in this way, in the temperature rising process of the next molding cycle, the in-mold heat insulating plates 40a and 40b can be quickly moved above the slide space 21, that is, toward the cavity K side. Therefore, the molding cycle can be further accelerated.

  As described above, in the mold apparatus S of this example, the slide space 21 partitioned from the cavity K is formed in the mold of the movable mold 20, and the slide pin 41 for operation is provided in the slide space 21. By transmitting the driving force, the in-mold heat insulating plates 40 a and 40 b are reciprocated together with the slide pin 41. The in-mold heat insulating plates 40a, 40b form a concave gap (flow path R) communicating with the outside around the cavity K when moved to one end side (flow path forming position) of the slide space 21. To do. Further, the flow path R is closed in a state where the in-mold heat insulating plates 40a and 40b are moved to the other end side (flow path closed position) of the slide space 21, and a concave heat insulating wall is formed around the cavity K. It is formed.

In the manufacturing method of the molded product of this example, by using such a mold apparatus S, the heat insulating plates 40a and 40b in the mold are flow paths in the temperature rising process for preheating the cavity K before the molten resin is injected. Displace to the closed position to reduce the heating volume. Thereby, the heating time of the cavity K in the temperature raising step can be shortened. Thus, the molding cycle can be accelerated.
Further, in the method of manufacturing a molded product of this example, in the rapid cooling process performed after pouring molten resin into the cavity K, the in-mold heat insulating plates 40a and 40b are displaced to the flow path forming position, and the flow path R and The temperature adjustment medium flowing in the mold temperature adjustment pipe 30 disposed between the cavity K and the cavity K is switched from a high temperature adjustment medium to a low temperature adjustment medium. In this way, since the large capacity flow path R can be used as the temperature control flow path, the cooling volume can be greatly expanded. Moreover, by providing two temperature control flow paths, the mold temperature control piping 30 and the flow path R, the cooling volume can be further greatly expanded. Therefore, the cooling time can be shortened and the molding cycle can be accelerated.

  In the above embodiment, two temperature control flow paths, that is, the mold temperature control pipe 30 and the flow path R are used for cooling, but only a high temperature control medium is supplied to the mold temperature control pipe 30. Alternatively, an electric heater or the like may be used instead of the mold temperature control pipe 30. In the mold apparatus S of this example, since the flow rate of the flow path R is large, even if the mold temperature control pipe 30 is not used for cooling purposely, the cooling volume can be increased to some extent. it can. Therefore, the cooling time can be shortened and the molding cycle can be accelerated.

It is sectional drawing of the mold apparatus clamped. It is explanatory drawing of the slide space formed in the movable type | mold. It is explanatory drawing which shows the reduction state of the heating volume by the heat insulation board in a metal mold | die. It is sectional explanatory drawing which shows the state in which the temperature control flow path was formed in the slide space of the mold apparatus clamped. It is explanatory drawing which shows the cooling process of the cavity by a low temperature control medium. It is explanatory drawing which shows the cooling process of the cavity by a low temperature control medium. It is sectional explanatory drawing which shows the mold opening process after molten resin hardening completion, and the extrusion process of a molded article.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Fixed type | mold (1st metal mold | die), 10A ... Cavity surface, 11 ... Sprue 20 ... Movable type | mold (2nd metal mold | die), 20A ... Cavity surface, 21 ... Slide space,
21a ... Communication path, 22 ... Ejector pin, 23 ... Post, 30 ... Mold temperature control piping 40, 40a, 40b ... Insulation plate in the mold (slide type), 41 ... Slide pin K ... Cavity, R ... Flow path, S. Mold equipment

Claims (7)

A first mold and a second mold that is clamped to the first mold to form a predetermined cavity between the first mold and the first mold;
The second mold includes a slide space formed by being partitioned from the cavity on the outer peripheral side of the cavity in the second mold, and a slide mold that moves forward and backward in the slide space,
The slide mold is configured to be displaceable into a flow path forming position where a gap is formed on the cavity side in the slide space and a flow path closed position closing the gap.
The mold apparatus is characterized in that the gap is configured to be usable as a first temperature control flow path that communicates with the outside and allows the temperature control medium to flow in and out from the outside.   The second mold is configured to have a second temperature control flow path that is disposed between the mold surface of the cavity and the slide space and allows the temperature control medium to flow in and out from the outside. The mold apparatus according to claim 1. The slide space is formed to surround the cavity;
Since the slide mold is configured to have a lower thermal conductivity than the mold of the second mold, it is possible to reduce heat radiation from the cavity side to the outside when the slide mold is at the channel closed position. The mold apparatus according to claim 1.   The mold apparatus according to claim 2, wherein the second temperature control channel is configured to be able to switch between a high-temperature temperature control medium and a low-temperature temperature control medium. A cavity forming step of forming a predetermined cavity by clamping the first mold and the second mold;
A temperature raising step for raising the temperature of the cavity in a state in which a slide mold that moves forward and backward in the slide space formed by being partitioned from the cavity by the second mold is moved toward the cavity in the slide space; ,
A filling step of filling the cavity with a molten resin;
By moving the slide mold away from the cavity, a gap communicating with the outside is formed on the cavity side of the slide space, and a low temperature first temperature adjustment medium is caused to flow into the gap from the outside. A rapid cooling step for rapidly cooling the cavity;
A method for producing a molded product, comprising: performing a mold release step of releasing the molded product that has been solidified by opening the first mold and the second mold. In the temperature raising step, a temperature of the cavity is raised by flowing a high-temperature second temperature regulating medium from the outside into a temperature regulating channel disposed between the slide space and the mold surface of the cavity,
The cavities are rapidly cooled in the rapid cooling step by being formed so as to be able to flow by switching so as to allow a low temperature third temperature control medium to flow into the temperature control flow path from the outside. 5. A method for producing a molded product according to 5. The slide mold is configured to have a lower thermal conductivity than the mold of the second mold,
In the temperature raising step, the slide mold is moved to the cavity side in the slide space and positioned so as to surround the cavity, so that heat radiation from the cavity side to the outside is cut off and the temperature is rapidly raised. The method for producing a molded product according to claim 5, wherein:

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