JP2017059573A - Composite electronic component and circuit board using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a composite electronic component that can save a mounting space.SOLUTION: A composite electronic component comprises a first element, a second element, and an adhesive layer. The first element has: an element body that includes a first principal surface, and a pair of first end surfaces extending in a direction orthogonal to the first principal surface; and a pair of first external electrodes provided on the pair of first end surfaces, respectively. The second element has: a substrate that includes a second principal surface opposed to the first principal surface, a third principal surface opposed to the second principal surface, and a pair of second end surfaces connecting between the second and third principal surfaces; a resistor provided on the third principal surface; and a pair of second external electrodes provided on both end parts of the resistor, respectively, and insulated from the pair of first external electrodes. The adhesive layer adheres the first principal surface and the second principal surface to each other.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a composite electronic component and a circuit board using the same.

  There is known a circuit board on which a plurality of ICs (Integrated Circuits) are mounted and which can realize various functions. Various components other than the IC are mounted on the circuit board. For example, the circuit board is provided with passive elements such as capacitors and resistance elements in the vicinity of each IC in order to improve the quality of signals transmitted and received between the ICs.

  For example, in a small circuit board used for a wearable device, the mounting density is improved by using a small component or an embedded component. However, with the recent miniaturization of circuit boards, it has become increasingly difficult to secure a mounting space for mounting necessary components.

  Specifically, in an ultra-small circuit board, it may be difficult to secure a mounting space for mounting the above passive elements in the vicinity of each IC. Further, in order to secure a mounting space for mounting passive elements, it takes a lot of labor and cost to change the layout and replace components.

  On the other hand, Patent Document 1 discloses a composite electronic component in which a capacitor and a resistance element are combined. In this composite electronic component, a resistance element is directly provided on a capacitor mounted on a circuit board. In this composite electronic component, two functions of a capacitor and a resistance element are realized, so that the mounting space can be saved.

  Moreover, the technique relevant to this application is disclosed by patent document 2. FIG. In the technology according to Patent Document 2, the capacitor can be mounted on the interposer by flip-chip mounting of the capacitor.

Japanese Utility Model Publication No. 1-130525 JP 2013-258240 A

  However, it is technically difficult to directly provide a resistance element on an ultra-small capacitor used for an ultra-small circuit board. Therefore, it is not practical to apply the technique according to Patent Document 1 to an ultra-small circuit board. Further, in the technique of directly providing a resistance element on a capacitor, the performance of the resistance element cannot be evaluated in advance, and much work is required when the performance of the resistance element is poor.

  In addition, the technique according to Patent Document 2 can only obtain the function of a capacitor, and therefore cannot sufficiently obtain the effect of saving the mounting space.

  In view of the circumstances as described above, an object of the present invention is to provide a composite electronic component capable of saving a mounting space and a circuit board using the same.

In order to achieve the above object, a composite electronic component according to an aspect of the present invention includes a first element, a second element, and an adhesive layer.
The first element includes a first main surface, an element body including a pair of first end surfaces extending in a direction orthogonal to the first main surface, and a pair of first external members provided on the pair of first end surfaces, respectively. An electrode.
The second element includes a second main surface facing the first main surface, a third main surface facing the second main surface, and a pair of second connecting the second and third main surfaces. A substrate including two end surfaces; a resistor provided on the third main surface; and a pair of second external electrodes provided at both ends of the resistor and insulated from the pair of first external electrodes. .
The adhesive layer bonds the first main surface and the second main surface.

  This composite electronic component can realize two functions of a first element and a second element that are independent of each other. In other words, by using this composite electronic component, two mounting spaces are originally required, but only one mounting space is required. Thus, according to this composite electronic component, the mounting space can be saved.

At least a part of the pair of first external electrodes may be disposed outside the pair of second end surfaces.
In this configuration, a space is formed between the mounting surface of the circuit board on which the composite electronic component is mounted and the first external electrode of the first element. This space is open on the side opposite to the second end face of the substrate of the second element. Therefore, this composite electronic component can receive at least a part of the solder in this space when the first external electrode of the first element is soldered to the mounting surface. For this reason, the solder that connects the first external electrode of the first element to the mounting surface is difficult to spread along the mounting surface. Thus, according to this composite electronic component, it is possible to further save the mounting space.

The second element may further include a pair of auxiliary electrodes provided on the pair of second end surfaces.
In this configuration, the auxiliary electrode provided on the second end surface of the second element extends into the space between the first external electrode of the first element and the mounting surface. Therefore, when the first external electrode of the first element is soldered to the mounting surface, the solder wets along the auxiliary electrode from the mounting surface. For this reason, solder can be more reliably received in the space between the first external electrode of the first element and the mounting surface.

The pair of first external electrodes may extend from the pair of first end surfaces to a region between the first main surface and the second main surface, respectively.
The pair of auxiliary electrodes may be connected to the pair of first external electrodes, respectively.
In this configuration, the first external electrode of the first element is disposed before the solder has been wetted along the auxiliary electrode. For this reason, the first external electrode of the first element can be more reliably connected to the mounting surface.

The pair of auxiliary electrodes may respectively extend from the pair of second end surfaces to the third main surface.
In this configuration, the auxiliary electrode connected to the first external electrode of the first element and the second external electrode of the second element are both on the third main surface of the substrate of the second element facing the mounting surface. is there. For this reason, it becomes easy to mount the composite electronic component on the mounting surface.

A recess may be formed on the pair of second end surfaces.
The pair of second end faces may be inclined along the thickness direction of the substrate.
In this configuration, since the surface area of the second end surface is increased, the surface area of the auxiliary electrode formed on the second end surface is also increased. Thereby, the joining force by the solder of a 1st external electrode and a mounting surface becomes large.

The second element may further include a protective film that covers at least a part of the resistor.
In this configuration, the resistance of the second element can be electrically and physically protected by the protective film, so that the normal function of the second element can be favorably maintained.

The distance between the first external electrode and the plane including the third main surface may be less than 100 μm.
In this configuration, the first external electrode of the first element and the mounting surface are close to each other. Therefore, the first external electrode of the first element can be easily soldered to the mounting surface.

The substrate may be configured as a flexible substrate.
In this composite electronic component, by using a flexible flexible substrate as the substrate of the second element, it is difficult to come off the mounting surface due to thermal stress or impact after mounting. Further, it is possible to prevent damage to the composite electronic component itself during mounting and use.

The first element further includes a first internal electrode connected to one of the pair of external electrodes, and a second internal electrode connected to the other of the pair of external electrodes, the first and first A multilayer ceramic capacitor in which two internal electrodes are alternately arranged in the element body may be used.
In this composite electronic component, two functions of an independent multilayer ceramic capacitor and a resistance element can be realized in one mounting space.

A circuit board according to an embodiment of the present invention includes a mounting surface, a pair of first wirings and a pair of second wirings provided on the mounting surface, and a composite electronic component mounted on the mounting surface. .
The composite electronic component includes a first element, a second element, and an adhesive layer.
The first element is provided on an element body including a first main surface facing the mounting surface, a pair of first end surfaces extending in a direction orthogonal to the first main surface, and the pair of first end surfaces. And a pair of first external electrodes respectively soldered to the pair of first wirings.
The second element includes a second main surface facing the first main surface, a third main surface facing the second main surface, and a pair of connecting the second main surface and the third main surface. A substrate including a second end surface, a resistor provided on the third main surface, a pair of second external electrodes provided at both ends of the resistor and soldered to the pair of second wirings, Have
The adhesive layer bonds the first main surface and the second main surface.

The circuit board may have a configuration in which the pair of first wirings and the pair of second wirings are orthogonal to each other.
With this configuration, a circuit board that can effectively use the mounting space can be obtained.

1 is a front view of a composite electronic component according to a first embodiment of the present invention. It is a perspective view of the multilayer ceramic capacitor and resistance element of the composite electronic component. It is a front view of the said composite electronic component mounted in the circuit board. It is a front view of the composite electronic component which concerns on the modification mounted in the circuit board, and the said multilayer ceramic capacitor. It is sectional drawing along the AA 'line of FIG. 2 of the said multilayer ceramic capacitor. It is a top view of the said resistance element. It is a figure which shows the equivalent circuit of the said multilayer ceramic capacitor, the said resistive element, and the said composite electronic component. It is a fragmentary perspective view of the circuit board which can mount the above-mentioned composite electronic component. It is a figure which shows the example of a connection of the said composite electronic component. 10 is a plan view of a resistance element of a composite electronic component according to Modification 1. FIG. 10 is a front view of a composite electronic component according to Modification 1. FIG. It is a figure which shows the composite electronic component which concerns on the modification 2. 14 is a plan view of a resistance element of a composite electronic component according to Modification 3. FIG. It is a figure which shows the equivalent circuit of the composite electronic component which concerns on the modification 3. It is a front view of the composite electronic component which concerns on the 2nd Embodiment of this invention. It is a front view which shows the modification of a composite electronic component.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In the drawing, an X axis, a Y axis, and a Z axis that are orthogonal to each other are shown as appropriate. The X axis, the Y axis, and the Z axis are common in all drawings.

<First Embodiment>
[Overall configuration of composite electronic component 1]
FIG. 1 is a front view of a composite electronic component 1 according to a first embodiment of the present invention. The composite electronic component 1 is configured by combining two elements.
Specifically, the composite electronic component 1 includes a multilayer ceramic capacitor 10 that is a first element, a resistance element 20 that is a second element, and an adhesive layer 30.
FIG. 2 is a perspective view of the multilayer ceramic capacitor 10 and the resistance element 20.

The multilayer ceramic capacitor 10 includes an element body 11 and external electrodes 12a and 12b.
The element body 11 has a rectangular parallelepiped shape having sides parallel to the X axis, the Y axis, and the Z axis and six surfaces, end faces 11a and 11b facing the X axis direction, and a main body facing downward in the Z axis direction. It has surface 11c.
The external electrodes 12a and 12b cover the end surfaces 11a and 11b of the element body 11, respectively, and extend to four surfaces connected to the end surfaces 11a and 11b. The external electrodes 12a and 12b are separated from each other on the four surfaces. The external electrodes 12a and 12b are not limited to this configuration, and may only cover at least part of the end surfaces 11a and 11b of the element body 11.

The resistance element 20 includes a substrate 21, a resistance film 22, external electrodes 23a and 23b, and auxiliary electrodes 24a and 24b.
The substrate 21 has a flat rectangular parallelepiped shape having sides parallel to the X-axis, Y-axis, and Z-axis and six surfaces, extending along the XY plane, and a main surface 21a facing upward in the Z-axis direction, It has a main surface 21b facing downward in the Z-axis direction and end surfaces 21c and 21d facing in the X-axis direction.
The substrate 21 is formed of an insulating material having heat resistance of about 300 ° C., for example. Examples of the material for forming the substrate 21 include ceramic materials such as zirconia, alumina, silicon carbide, silicon nitride, and aluminum nitride, and heat resistant resins such as polyimide.
The resistance film 22 is configured as a film extending in the Y-axis direction, and is provided at the center of the main surface 21 b of the substrate 21 in the X-axis direction. The resistance film 22 may be a thin film or a thick film. The external electrodes 23a and 23b are respectively provided at both ends of the resistance film 22 in the Y-axis direction.

  The auxiliary electrodes 24a and 24b cover the end surfaces 21c and 21d of the substrate 21, respectively, and extend to the main surfaces 21a and 21b. Thereby, in the auxiliary electrodes 24a and 24b, the cross section parallel to the XZ plane is U-shaped. The auxiliary electrodes 24a and 24b are connected to the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 on the main surface 21a, respectively.

  In the composite electronic component 1, the external electrodes 12 a and 12 b of the multilayer ceramic capacitor 10 are connected to the auxiliary electrodes 24 a and 24 b on the main surface 21 b of the substrate 21, and the external electrodes 23 a and 23 b of the resistance element 20 are the main surface of the substrate 21. 21b is provided. That is, any of the external electrodes 12a, 12b, 23a, and 23b of the composite electronic component 1 can be connected to the mounting surface C1 on the main surface 21b. For this reason, the composite electronic component 1 can be easily mounted on the mounting surface C1.

  Note that each surface of the element body 11 of the multilayer ceramic capacitor 10 and the substrate 21 of the resistor element 20 may be curved, and each side may be chamfered (including round chamfering and 45 ° chamfering). Good.

The adhesive layer 30 is formed of an insulating adhesive and adheres the main surface 11 c of the element body 11 of the multilayer ceramic capacitor 10 and the main surface 21 a of the substrate 21 of the resistance element 20.
It is preferable that the adhesive forming the adhesive layer 30 has a heat resistance that can withstand a temperature applied when the composite electronic component 1 is manufactured and a reflow temperature when the composite electronic component 1 is mounted. As an adhesive that forms the adhesive layer 30, for example, an epoxy-based adhesive can be used.

  Further, the adhesive layer 30 may be formed of solder. In this case, the adhesive layer 30 is provided so that the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 are not conducted. In order to prevent the external electrodes 12a and 12b from conducting, for example, an interval is provided between the adhesive layer 30 and the external electrodes 12a and 12b, or an insulator is provided between the adhesive layer 30 and the external electrodes 12a and 12b. Can be formed.

  In the composite electronic component 1, since the configuration such as the resistance film 22 and the external electrodes 23 a and 23 b is not arranged on the main surface 21 a of the substrate 21 of the resistance element 20, the adhesive layer 30 can be thinned. Further, in the composite electronic component 1, the laminated ceramic capacitor 10 and the resistance element 20 are not arranged in the adhesive layer 30, so that damage is not easily applied even when stress is generated when the adhesive layer 30 is cured. .

  As described above, the multilayer ceramic capacitor 10 and the resistance element 20 are integrated through the adhesive layer 30, thereby constituting an integrated composite electronic component 1. That is, the composite electronic component 1 is configured as a CR composite element in which the multilayer ceramic capacitor 10 and the resistance element 20 are combined.

  Therefore, the composite electronic component 1 can realize the function of the multilayer ceramic capacitor 10 and the function of the resistance element 20. That is, by using the composite electronic component 1, originally two mounting spaces are required, but only one mounting space is required. Thus, according to the composite electronic component 1, a mounting space can be saved.

  In the composite electronic component 1, the resistance of the resistance element 20 is supplemented by the multilayer ceramic capacitor 10 by bonding the resistance element 20 to the multilayer ceramic capacitor 10. Therefore, even when the substrate 21 of the resistance element 20 is thin, sufficient strength can be obtained in the resistance element 20.

Further, in the composite electronic component 1, the multilayer ceramic capacitor 10 and the resistance element 20 are prepared separately and bonded by the adhesive layer 30.
For this reason, the multilayer ceramic capacitor 10 and the resistance element 20 before being bonded by the adhesive layer 30 can be evaluated in advance. Therefore, it is difficult for defects to occur in the performance of the composite electronic component 1 after bonding the multilayer ceramic capacitor 10 and the resistance element 20.
Further, in the composite electronic component 1, the multilayer ceramic capacitor 10 and the resistance element 20 having various performances can be freely combined, so that various needs can be met. Furthermore, in the composite electronic component 1, it is possible to pursue high performance and low cost for each of the multilayer ceramic capacitor 10 and the resistance element 20 independently.

As shown in FIG. 1, the resistance element 20 has a smaller dimension in the X-axis direction than the multilayer ceramic capacitor 10, and the auxiliary electrodes 24 a and 24 b of the resistance element 20 are both X smaller than the external electrodes 12 a and 12 b of the multilayer ceramic capacitor 10. It is arranged on the inner side in the axial direction.
Thus, in the composite electronic component 1, a space 40 in which the resistance element 20 is not disposed is formed below the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 in the Z-axis direction. The space 40 is adjacent to the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the auxiliary electrodes 24a and 24b of the resistance element 20, and extends in the Y-axis direction, and is open to the outside in the X-axis direction.

FIG. 3 is a front view schematically showing a state in which the composite electronic component 1 is mounted on the mounting surface C1 of the circuit board C.
On the mounting surface C1 of the circuit board C, for example, solder H is disposed in advance at positions corresponding to the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the external electrodes 23a and 23b of the resistance element 20.
In order to mount the composite electronic component 1 on the mounting surface C1 of the circuit board C, the circuit board C on which the composite electronic component 1 is disposed on the mounting surface C1 is heated to the melting point of the solder H or higher and then cooled. As a result, the four external electrodes 12a, 12b, 23a, and 23b of the composite electronic component 1 are connected to the mounting surface C1 of the circuit board C via the solder H.

  Hereinafter, the behavior of the solder H when the composite electronic component 1 is mounted on the mounting surface C1 of the circuit board C will be described more specifically.

First, the solder H between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 will be described.
When the circuit board C is heated and the solder H on the mounting surface C1 is melted, the solder H wets upward along the auxiliary electrodes 24a and 24b of the resistance element 20 in the Z-axis direction, and the external electrodes 12a and 12b is reached. Thereafter, when the circuit board C is cooled and the solder H is solidified, a fillet of the solder H having a shape as shown in FIG. 3 is formed.

Next, the solder H between the external electrodes 23a and 23b of the resistance element 20 and the mounting surface C1 will be described.
When the circuit board C is heated and the solder H on the mounting surface C1 is melted and spreads on the external electrodes 23a and 23b, the solder H is filled between the external electrodes 23a and 23b and the circuit board C. . Thereafter, when the circuit board C is cooled, the solder H between the external electrodes 23a and 23b and the circuit board C is solidified.

In the composite electronic component 1, the external electrodes 12 a and 12 b of the multilayer ceramic capacitor 10 are located above the external electrodes 23 a and 23 b of the resistance element 20 in the Z-axis direction, and a bonding area to be bonded to the solder H is large. For this reason, in the external electrodes 12a and 12b of the multilayer ceramic capacitor 10, it is necessary to increase the amount of solder H for connecting to the mounting surface C1 as compared to the external electrodes 23a and 23b of the resistance element 20.
Therefore, the solder H between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 is closer to the mounting surface C1 than the solder H between the external electrodes 23a and 23b of the resistance element 20 and the mounting surface C1. Easily spread along. Therefore, if the spread of the solder H formed between the external electrodes 12a, 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 on the mounting surface C1 can be suppressed, it is very advantageous for saving the mounting space of the composite electronic component 1. .

In this regard, the composite electronic component 1 has a configuration capable of reducing the spread of the solder H formed between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 on the mounting surface C1.
That is, in the composite electronic component 1, by receiving a part of the solder H formed between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 in the space 40 adjacent to the auxiliary electrode 24a, The spread of the solder H along the mounting surface C1 is suppressed. Thereby, since the spread in the mounting surface C1 of the solder H becomes small, the mounting space of the composite electronic component 1 can be reduced.

  Further, according to the composite electronic component 1 having a small mounting space, the multilayer ceramic capacitor 10 and the resistance element 20 which are passive components can be brought closer to the IC. Thereby, in the circuit board C on which the composite electronic component 1 is mounted, attenuation and deterioration of a signal, particularly at a high frequency (for example, a gigahertz (GHz) frequency band) is suppressed, and a circuit loss is reduced. This facilitates impedance matching.

FIG. 4A is a front view schematically showing a state in which the composite electronic component 1 according to the modification of the present embodiment is mounted on the mounting surface C1 of the circuit board C. FIG.
In the composite electronic component 1 according to the modification, unlike the composite electronic component 1 according to this embodiment, the dimension of the resistance element 20 in the X-axis direction is the same as that of the multilayer ceramic capacitor 10. That is, in the composite electronic component 1, there is no space 40 for receiving the solder H between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 of the circuit board C.
For this reason, in the composite electronic component 1 according to the comparative example, the mounting of the solder H formed between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 is greater than in the composite electronic component 1 according to the present embodiment. The spread along the surface C1 becomes large.

  However, the composite electronic component 1 according to the present invention may have the configuration shown in FIG. That is, when the mounting space can be sufficiently saved by combining the multilayer ceramic capacitor 10 and the resistive element 20, the space 40 may not be provided. For example, when the circuit board C is required to be thin, it is more advantageous to prioritize the thinning of the resistance element 20 as shown in the second embodiment to be described later than to provide the space 40. There is.

FIG. 4B is a front view schematically showing a state in which the multilayer ceramic capacitor 10 is mounted on the mounting surface C1 of the circuit board C as a single unit.
Even when the multilayer ceramic capacitor 10 is mounted on the mounting surface C1 as a single unit, it is formed between the external electrodes 12a and 12b and the mounting surface C1 as in the composite electronic component 1 according to the modification shown in FIG. The spread along the mounting surface C1 of the solder H to be performed becomes large.
As described above, in the composite electronic component 1 according to the present embodiment, in addition to the merit that the function of the resistance element 20 is obtained, the merit that the mounting space can be reduced is obtained as compared with the single unit of the multilayer ceramic capacitor 10. It is done.

In the composite electronic component 1, the auxiliary electrodes 24a and 24b have a function of drawing the solder H into the space 40 and a function of guiding the solder H melted on the mounting surface C1 to the external electrodes 12a and 12b.
The auxiliary electrodes 24a and 24b are not limited to the above configuration as long as they can perform these functions.

  For example, the auxiliary electrodes 24a and 24b and the external electrodes 12a and 12b may be separated from each other. However, also in this case, the auxiliary electrodes 24a and 24b and the external electrodes 12a and 12b are close to each other so that the solder H that gets wet along the auxiliary electrodes 24a and 24b can smoothly reach the external electrodes 12a and 12b. It is preferable.

Further, the cross section of the auxiliary electrodes 24a, 24b may not be U-shaped.
As an example, the auxiliary electrodes 24a and 24b may be provided on the end surfaces 21c and 21d in the substrate 21, and may not extend to the main surfaces 21a and 21b. Also in this case, the auxiliary electrodes 24a and 24b are configured to suck up the molten solder H on the mounting surface C1 and to be able to guide the solder H to the external electrodes 12a and 12b. Is preferred.

  Further, in the composite electronic component 1, it is preferable that auxiliary electrodes 24a and 24b are provided in order to obtain the above function, but the solder H melted on the mounting surface C1 can reach the external electrodes 12a and 12b directly. In this case, the auxiliary electrodes 24a and 24b may be omitted. Thereby, the manufacturing cost of the composite electronic component 1 can be reduced. Also in this case, in the composite electronic component 1, as long as the space 40 is provided, the solder H enters the space 40, so that the effect of reducing the spread of the solder H on the mounting surface C <b> 1 can be obtained.

[Detailed configuration of composite electronic component 1]
FIG. 5 is a cross-sectional view of the multilayer ceramic capacitor 10 of the composite electronic component 1 taken along the line AA ′ in FIG.
The multilayer ceramic capacitor 10 further includes a plurality of internal electrodes 13a and 13b arranged in an element body 11 formed of a dielectric. The internal electrode 13a is connected to the external electrode 12a, and the internal electrode 13b is connected to the external electrode 12b. The internal electrodes 13a and 13b are configured as thin layers extending in the XY plane, and are alternately arranged along the Z-axis direction.
In the multilayer ceramic capacitor 10, the external electrodes 12a and 12b function as terminals, and when a voltage is applied between the external electrodes 12a and 12b, a charge corresponding to the magnitude of the voltage is stored between the internal electrodes 13a and 13b.

  The multilayer ceramic capacitor 10 of the composite electronic component 1 can be used as a bypass capacitor, for example. The capacitance of the multilayer ceramic capacitor 10 can be set to, for example, 1 pF to 1 mF, and further can be set to 1 nF to 500 μF, which is a general capacitance of an IC bypass capacitor.

  The multilayer ceramic capacitor 10 can be manufactured by a general manufacturing method, and may be manufactured by any manufacturing method.

FIG. 6 is a plan view showing the main surface 21 b of the resistance element 20 of the composite electronic component 1.
In the resistance element 20, external electrodes 23a and 23b are connected to both ends of the resistance film 22, and the external electrodes 23a and 23b function as terminals. Thereby, a predetermined electric resistance can be applied between the external electrodes 23a and 23b.

  The resistance element 20 of the composite electronic component 1 can be used as a pull-up resistor or a pull-down resistor, for example. The resistance value of the resistance element 20 can be set to, for example, 0Ω to 100MΩ, and can be set to a general resistance value of 1 kΩ to 100 kΩ as a pull-up resistor or a pull-down resistor of the digital circuit.

The resistance film 22 of the resistance element 20 can be formed by various film forming methods using, for example, a metal such as NiCr or a semiconductor such as TaN. In this case, the resistance film 22 can be processed into a shape that provides a predetermined resistance value, for example, by wet etching or dry etching.
The resistance film 22 can also be formed by a printing method using a resistance film forming paste such as ruthenium oxide or silver palladium. Since it is difficult to obtain sufficient dimensional accuracy by the printing method, it is preferable to trim the resistive film 22.

The resistance element 20 further includes a protective film 25 that covers regions other than the external electrodes 23a and 23b and the auxiliary electrodes 24a and 24b on the main surface 21b.
The protective film 25 electrically and physically protects the resistive film 22 by at least partially covering the resistive film 22. Thereby, in the resistance element 20, a normal function is maintained favorably. The protective film 25 may be omitted as appropriate.

  The protective film 25 can be formed of, for example, an inorganic material such as silicon oxide or an organic material such as polyimide. The protective film 25 made of an inorganic material can be formed by a thin film process such as sputtering. The organic material protective film 25 can be formed by, for example, a wet process such as spin coating.

The resistance element 20 can also be manufactured by a general manufacturing method, and may be manufactured by any manufacturing method.
Hereinafter, an example of a method for manufacturing the resistance element 20 will be described. In the manufacturing method of the resistance element 20, it is preferable that each structure is formed in the state of a large sheet before being separated into pieces. Thereby, the resistive element 20 can be manufactured efficiently.

In the method of manufacturing the resistance element 20, first, the resistance film 22 is provided on the main surface 21 b of the substrate 21. Next, a protective film 25 is provided on the entire main surface 21 b of the substrate 21 so as to cover the resistance film 22. Then, an opening is formed in the protective film 25 by, for example, dry etching. Subsequently, external electrodes 23a and 23b are formed in the openings of the protective film 25 by, for example, plating.
Thus, by forming the external electrodes 23a and 23b after the protective film 25, the plating elongation of the external electrodes 23a and 23b is suppressed. As a result, a short circuit due to the solder H between the external electrodes 23a and 23b when the composite electronic component 1 is mounted is less likely to occur.

Then, after dicing into individual resistance elements 20, auxiliary electrodes 24a and 24b are formed.
The auxiliary electrodes 24a and 24b can be formed, for example, by performing electroless plating after forming a seed layer by a thin film process such as vapor deposition or sputtering. The auxiliary electrodes 24a and 24b can be formed by other methods such as application of a conductive resin.
The auxiliary electrodes 24a and 24b are preferably formed to a thickness of 1 μm or more in order to obtain particularly good wettability.

  Hereinafter, the advantages obtained by providing the resistance film 22 of the resistance element 20 and the external electrodes 23a and 23b on the main surface 21b on the lower side in the Z-axis direction of the substrate 21 will be summarized.

Here, first, it is assumed that the resistance film 22 and the external electrodes 23 a and 23 b are provided on the main surface 21 a on the upper side in the Z-axis direction of the substrate 21.
In this case, it is necessary to provide wiring for connecting the external electrodes 23a and 23b to the mounting surface C1. Thereby, the manufacturing cost of the composite electronic component 1 will increase.
Further, since the resistance film 22 and the external electrodes 23a and 23b are disposed in the adhesive layer 30, the adhesive layer 30 that connects the multilayer ceramic capacitor 10 and the resistive element 20 tends to be thick.
Furthermore, since the resistance film 22 and the external electrodes 23a and 23b are disposed in the adhesive layer 30, the resistance film 22 and the external electrodes 23a and 23b are likely to be damaged due to stress during curing of the adhesive layer 30. .

In this regard, in the resistance element 20 of the composite electronic component 1, the above-described problem is solved by providing the resistance film 22 and the external electrodes 23a and 23b on the main surface 21b on the lower side in the Z-axis direction of the substrate 21. .
That is, the external electrodes 23a and 23b of the resistance element 20 can be directly connected to the mounting surface C1 without providing wiring or the like.
Further, the thickness of the adhesive layer 30 is not limited by the presence of the resistance film 22 and the external electrodes 23a and 23b. For this reason, the adhesive layer 30 can be thinned.
Further, the resistance film 22 and the external electrodes 23 a and 23 b are not easily affected by stress or the like when the adhesive layer 30 is cured. For this reason, the resistance film 22 and the external electrodes 23a and 23b are hardly damaged.

7A shows an equivalent circuit of the multilayer ceramic capacitor 10, FIG. 7B shows an equivalent circuit of the resistance element 20, and FIG. 7C shows an equivalent circuit of the composite electronic component 1.
As shown in FIGS. 7A to 7C, the composite electronic component 1 has a circuit configuration in which a multilayer ceramic capacitor 10 and a resistance element 20 are combined.

In the composite electronic component 1, the external electrodes 12 a and 12 b that are terminals of the multilayer ceramic capacitor 10 and the external electrodes 23 a and 23 b that are terminals of the resistance element 20 are insulated from each other. Thereby, in the composite electronic component 1, the functions of the multilayer ceramic capacitor 10 and the resistance element 20 can be obtained independently.
Note that the multilayer ceramic capacitor 10 and the resistance element are appropriately connected by connecting the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the external electrodes 23a and 23b of the resistance element 20 by wiring on the mounting surface of the circuit board C. 20 can be connected in series or in parallel.

[Circuit board C]
FIG. 8A is a perspective view schematically showing an example of a circuit board C on which the composite electronic component 1 can be mounted. The circuit board C is a board including a variety of circuit modules and having a circuit formed on at least one of both main surfaces.
On the mounting surface C1 of the circuit board C, wirings C2a and C2b to which the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 are respectively connected, and wirings C3a and C3b to which the external electrodes 23a and 23b of the resistance element 20 are respectively connected, , Is formed.
Lands L are provided at the ends of the wirings C2a, C2b, C3a, and C3b, and solder H is disposed on the lands L.

FIG. 8B is a perspective view schematically showing an example of the circuit board C on which the composite electronic component 1 is mounted.
When the composite electronic component 1 is mounted on the mounting surface C1 of the circuit board C shown in FIG. 8A, the external electrodes 12a, 12b, 23a, and 23b of the composite electronic component 1 are placed on each land L. In this state, the circuit board C is heated to melt the solder H on each land L. Thereafter, when the solder H is solidified by cooling the circuit board C, the lands L of the circuit board C and the external electrodes 12a, 12b, 23a, 23b of the composite electronic component 1 are connected via the solder H.
Thereby, the circuit board C on which the composite electronic component 1 shown in FIG. 8B is mounted is obtained.

  By using the composite electronic component 1 on the circuit board C, the mounting process on the circuit board C can be simplified as compared with the case where the multilayer ceramic capacitor 10 and the resistance element 20 are mounted. Thereby, the manufacturing cost of the circuit board C can be reduced.

  In the circuit board C, the multilayer ceramic capacitor 10 and the resistive element 20 are connected in series by providing wirings connecting the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the external electrodes 23a and 23b of the resistive element 20. Connection or parallel connection is also possible.

  FIG. 9 is a diagram illustrating a connection example of the composite electronic component 1 on the circuit board C. In the example shown in FIG. 9, the composite electronic component 1 is connected to the wiring connecting the two ICs 1 and 2.

  In the example shown in FIG. 9A, the ICs 1 and 2 are connected by four wirings Vcc, Gnd, Vout1, and Vout2. The multilayer ceramic capacitor 10 of the composite electronic component 1 is connected between the wiring Gnd and the wiring Vout1, and the resistance element 20 of the composite electronic component 1 is connected between the wiring Vcc and the wiring Vout2.

  In the example shown in FIG. 9B, the ICs 1 and 2 are connected by three wirings Gnd, Vout1, and Vout2. The multilayer ceramic capacitor 10 of the composite electronic component 1 is connected between the wiring Gnd and the wiring Vout1, and the resistance element 20 of the composite electronic component 1 is connected between the wiring Gnd and the wiring Vout2. In this configuration, the multilayer ceramic capacitor 10 of the composite electronic component 1 and the resistance element 20 are electrically connected via the wiring Gnd.

[Modification]
(Modification 1)
10 and 11 are diagrams illustrating the composite electronic component 1 according to the first modification.
The composite electronic component 1 according to Modification 1 is configured such that the surface areas of the end faces 21c and 21d of the substrate 21 of the resistance element 20 are increased. As a result, the surface areas of the auxiliary electrodes 24a and 24b provided on the end faces 21c and 21d of the substrate 21 also increase, so that the bonding force by the solder H between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 increases.

FIG. 10 is a plan view showing the main surface 21b of the resistance element 20 of the composite electronic component 1 according to a configuration example of the first modification.
In the configuration example shown in FIG. 10, recesses 26 that are recessed in the X-axis direction are formed on the end faces 21 c and 21 d of the substrate 21. The auxiliary electrodes 24 a and 24 b are provided along the end surfaces 21 c and 21 d including the recess 26. Accordingly, since the auxiliary electrodes 24a and 24b are intricately shaped, the surface areas of the auxiliary electrodes 24a and 24b are increased.

Specifically, in the resistance element 20 shown in FIG. 10A, a semicircular recess 26 is provided in the center of the end surfaces 21c and 21d of the substrate 21 in the Y-axis direction.
The number of the concave portions 26 can be arbitrarily determined. For example, as shown in FIG. 10B, three end portions 21c and 21d may be provided with three concave portions 26, respectively.
Moreover, as shown in FIG.10 (c), the structure of the recessed part 26 in each end surface 21c, 21d may mutually differ. Furthermore, the shape of the concave portion 26 can be arbitrarily determined, and may be, for example, a triangular shape or a rectangular shape.

A method of forming the recess 26 in the substrate 21 of the resistance element 20 can be arbitrarily selected.
For example, when the resistance element 20 is singulated, the recess 26 can be formed by punching with a blade having an uneven shape. Further, the recess 26 can be formed by laser processing the substrate 21.

FIG. 11 is a front view of the composite electronic component 1 according to a configuration example of the first modification.
In the configuration example shown in FIG. 11, the end surfaces 21c and 21d of the substrate 21 of the resistance element 20 are inclined along the Z-axis direction.
The auxiliary electrodes 24a and 24b are provided along the inclined end surfaces 21c and 21d. Thereby, the surface areas of the auxiliary electrodes 24a and 24b are increased as compared with the case where the auxiliary electrode 24a is provided along the Z-axis direction.

Specifically, in the configuration example shown in FIG. 11A, the end surfaces 21c and 21d of the substrate 21 are inclined so that the substrate 21 becomes narrower from the main surface 21a toward the main surface 21b.
On the contrary, in the configuration example shown in FIG. 11B, the end surfaces 21c and 21d of the substrate 21 are inclined so that the substrate 21 becomes wider from the main surface 21a toward the main surface 21b.

A method of forming the inclined end surfaces 21c and 21d on the substrate 21 of the resistance element 20 can be arbitrarily selected.
For example, when the resistance element 20 is singulated, the inclined end surfaces 21c and 21d are obtained by dicing using a blade having a V-shaped cross section.

(Modification 2)
FIG. 12 is a diagram illustrating the composite electronic component 1 according to a configuration example of the second modification. 12A is a front view of the composite electronic component 1, and FIG. 12B is a plan view showing the main surface 21 b of the resistance element 20 of the composite electronic component 1.
In the composite electronic component 1 according to Modification 2, the dimension of the resistance element 20 in the X-axis direction is equivalent to that of the multilayer ceramic capacitor 10. For this reason, the composite electronic component 1 according to Modification 2 does not have a space 40 continuous in the Y-axis direction as in the composite electronic component 1 according to the present embodiment.

On the other hand, in the resistance element 20 according to the modified example 2, the recesses 26 that are recessed in the X-axis direction are formed on the end surfaces 21c and 21d of the substrate 21.
In the composite electronic component 1 according to the modified example 2, the solder H can be received in the space 40 in the recess 26. That is, even in the composite electronic component 1 according to the modified example 2, the solder H that connects the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 to the mounting surface C1 is received in the space 40 in the recess 26, and the solder H on the mounting surface C1. It is possible to reduce the spread.
It should be noted that the concave portion 26 according to the modified example 2 can employ various configurations as appropriate, similarly to the concave portion 26 according to the modified example 1 shown in FIG.

(Modification 3)
FIG. 13 is a plan view showing the main surface 21b of the resistance element 20 of the composite electronic component 1 according to Modification 3. As shown in FIG.
In the composite electronic component 1 according to the modification 3, two resistance films 22 are provided on the main surface 21b of the substrate 21 of the resistance element 20, and external electrodes 23a and 23b are provided at both ends of each resistance film 22, respectively. Yes.
In the configuration example shown in FIG. 13A, two resistance films 22 are arranged side by side in the X-axis direction on the main surface 21 b of the substrate 21 of the resistance element 20. In the configuration example shown in FIG. 13B, the substrate 21 of the resistance element 20 is further divided for each resistance film 22.

FIG. 14 is a diagram illustrating an equivalent circuit of the composite electronic component 1 according to the third modification.
In the composite electronic component 1 according to the modified example 3, the function equivalent to two of the resistance elements 20 according to the present embodiment can be obtained. Therefore, according to the composite electronic component 1 according to the modified example 3, it is possible to further save the mounting space.
The two pairs of external electrodes 23a and 23b provided in the resistance element 20 of the composite electronic component 1 according to the modification 3 can be connected to different signal lines that connect two ICs, for example. In this case, it is preferable that the difference in resistance value between the two pairs of external electrodes 23a and 23b is within ± 5% of the resistance value between at least one of the two pairs of external electrodes 23a and 23b.

In addition, the composite electronic component 1 which concerns on the modification 3 is not limited to said structure, It can change into various structures.
As an example, the number of resistance films 22 can be arbitrarily determined and may be three or more. Further, the layout of the resistance film 22 can be arbitrarily determined. Further, the manner of dividing the substrate 21 can be arbitrarily determined.

<Second Embodiment>
In the composite electronic component 101 according to the second embodiment of the present invention, the configuration of the resistance element 120 is different from that of the composite electronic component 1 according to the first embodiment. In the following description, among the configurations of the composite electronic component 101, configurations that are the same as those of the composite electronic component 1 according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted as appropriate.

FIG. 15 is a front view schematically showing a state in which the composite electronic component 101 according to the present embodiment is mounted on the mounting surface C1 of the circuit board C.
The resistive element 120 of the composite electronic component 101 uses a substrate 121 that is thinner than the resistive element 20 according to the first embodiment.

In the composite electronic component 101, since the resistance element 120 is thin, the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 of the circuit board C are close to each other. For this reason, soldering to the mounting surface C1 of the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 becomes easy.
In addition, since the resistance element 120 is thin, the composite electronic component 101 is reduced in height. For this reason, the composite electronic component 101 is advantageous in reducing the thickness of the circuit board C.

More specifically, the thickness of the solder H arranged on the mounting surface C1 of the circuit board C is generally less than 100 μm. For this reason, when the composite electronic component 1 is mounted on the mounting surface C1, the distance between the external electrodes 12a and 12b and the mounting surface C1 in order to allow the solder H arranged on the mounting surface C1 to reach the external electrodes 12a and 12b. Is preferably less than 100 μm.
For this reason, in the composite electronic component 101 according to this embodiment, the distance between the external electrodes 12a and 12b and the plane including the main surface 121b of the resistance element 120 is set to less than 100 μm.

  In order to shorten the distance between the external electrodes 12a and 12b and the plane including the main surface 121b of the resistance element 120, it is effective to reduce the thickness of the adhesive layer 30 in addition to using the thin substrate 121 for the resistance element 120. It is.

The substrate 121 may be a ceramic substrate or a resin substrate.
However, the substrate 121 is preferably a flexible substrate such as a polyimide substrate. By using a flexible flexible substrate as the substrate 121, each of the external electrodes 12 a, 12 b, 23 a, and the like of the composite electronic component 101 can be applied even when thermal stress or impact is applied to the composite electronic component 101 after being mounted on the circuit substrate C. 23b becomes difficult to come off from the circuit board C.
Further, it is possible to prevent damage to the composite electronic component 101 itself such as peeling of the adhesive layer 30 due to a difference in thermal expansion coefficient between the multilayer ceramic capacitor 10 and the resistance element 120 during mounting or use.

  In the composite electronic component 101, the resistance element 120 is bonded to the multilayer ceramic capacitor 10, so that the strength of the resistance element 120 is supplemented by the multilayer ceramic capacitor 10. Therefore, even when the substrate 121 of the resistance element 120 is a flexible substrate, sufficient strength can be obtained in the resistance element 120.

In addition, the shape along the XY plane of the substrate 121 of the resistance element 120 can be arbitrarily determined.
For example, as shown in FIG. 16, the dimension of the resistance element 120 in the X-axis direction of the substrate 121 may be smaller than that of the multilayer ceramic capacitor 10. In this case, in the composite electronic component 101 according to this modification, a space 40 is formed below the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 as in the composite electronic component 1 according to the first embodiment.
Therefore, in the configuration example shown in FIG. 16, the mounting of the solder H formed between the external electrodes 12a and 12b of the multilayer ceramic capacitor 10 and the mounting surface C1 as in the composite electronic component 1 according to the first embodiment. An effect of reducing the spread in the plane C1 is obtained.

<Other embodiments>
The embodiment of the present invention has been described above, but the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the gist of the present invention.

  For example, in the above embodiment, an example in which the first element is a multilayer ceramic capacitor has been described. However, the first element is not limited to the multilayer ceramic capacitor, and may be an element having a pair of external electrodes. Examples of such an element include a multilayer ceramic varistor, a multilayer ceramic inductor, and a surface acoustic wave (SAW) filter.

DESCRIPTION OF SYMBOLS 1 ... Composite electronic component 10 ... Multilayer ceramic capacitor (1st element)
DESCRIPTION OF SYMBOLS 11 ... Element body 11a, 11b ... End surface 11c ... Main surface 12a, 12b ... External electrode 20 ... Resistance element (2nd element)
21 ... Substrate 21a, 21b ... Main surface 21c, 21d ... End face 22 ... Resistance film 23a, 23b ... External electrode 24a, 24b ... Auxiliary electrode 25 ... Protective film C ... Circuit board C1 ... Mounting surface

Claims (14)

A first main surface; a first element body including a pair of first end surfaces extending in a direction orthogonal to the first main surface; and a pair of first external electrodes respectively provided on the pair of first end surfaces. One element,
A substrate including a second main surface facing the first main surface, a third main surface facing the second main surface, and a pair of second end surfaces connecting the second and third main surfaces; A second element having a resistor provided on the third main surface and a pair of second external electrodes provided at both ends of the resistor and insulated from the pair of first external electrodes;
An adhesive layer that bonds the first main surface and the second main surface;
A composite electronic component comprising: The composite electronic component according to claim 1,
At least a part of the pair of first external electrodes is disposed outside the pair of second end surfaces, respectively. The composite electronic component according to claim 1 or 2,
The second electronic device further includes a pair of auxiliary electrodes provided on the pair of second end surfaces, respectively. The composite electronic component according to claim 3,
The pair of first external electrodes extend from the pair of first end surfaces to a region between the first main surface and the second main surface, respectively. The composite electronic component according to claim 4,
The pair of auxiliary electrodes are respectively connected to the pair of first external electrodes. A composite electronic component according to any one of claims 3 to 5,
The pair of auxiliary electrodes extend from the pair of second end surfaces to the third main surface, respectively. The composite electronic component according to any one of claims 3 to 6,
A recessed portion is formed in the pair of second end surfaces. The composite electronic component according to any one of claims 3 to 7,
The pair of second end surfaces are inclined along the thickness direction of the substrate. The composite electronic component according to any one of claims 1 to 8,
The second element further includes a protective film covering at least a part of the resistor. The composite electronic component according to any one of claims 1 to 9,
A composite electronic component, wherein a distance between the first external electrode and a plane including the third main surface is less than 100 μm. The composite electronic component according to claim 10,
The substrate is a composite electronic component configured as a flexible substrate. The composite electronic component according to any one of claims 1 to 11,
The first element further includes a first internal electrode connected to one of the pair of external electrodes, and a second internal electrode connected to the other of the pair of external electrodes, the first and first 2. A composite electronic component which is a multilayer ceramic capacitor in which two internal electrodes are alternately arranged in the element body. A mounting surface, a pair of first wiring and a pair of second wiring provided on the mounting surface, and a composite electronic component mounted on the mounting surface;
The composite electronic component is
An element body including a first main surface facing the mounting surface and a pair of first end surfaces extending in a direction orthogonal to the first main surface; and the pair of first end surfaces, respectively, A first element having a pair of first external electrodes each soldered to the wiring;
A substrate including a second main surface facing the first main surface, a third main surface facing the second main surface, and a pair of second end surfaces connecting the second main surface and the third main surface A second element comprising: a resistor provided on the third main surface; and a pair of second external electrodes respectively provided at both ends of the resistor and soldered to the pair of second wirings; ,
A circuit board comprising: an adhesive layer that bonds the first main surface and the second main surface. The circuit board according to claim 13,
A circuit board having a configuration in which the pair of first wirings and the pair of second wirings are orthogonal to each other.

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