JP2017056474A - Undercut processing mechanism and processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an undercut processing mechanism capable of preventing a processing defect of an undercut part, and a processing device.SOLUTION: The present invention relates to an undercut processing mechanism 1 which is attached for use to a processing device processing a workpiece 91 having an undercut part 93 and can form the undercut part 93, the undercut processing mechanism comprising: a movable die 11 which can move and forms the undercut part 93 in processing; moving means 21 of moving the movable die 11 off from the undercut part 93 after the processing; and a die plate 61 supporting the movable die 11 such that the movable die 11 does not move during the processing.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an undercut processing mechanism and a processing apparatus capable of forming an undercut portion on a workpiece.

  When the workpiece is removed from the die after processing the protrusions, recesses, and turn-ups on the workpiece, the protrusions, recesses, turn-ups, etc. interfere with each other and cannot be removed from the die as they are There is. These convex portions, concave portions, folded portions, and the like are called undercuts.

  In a processing apparatus for processing a product having an undercut portion, many undercut processing mechanisms have been developed in a manner corresponding to the form of the undercut portion. For example, Patent Document 1 describes an undercut processing mechanism (divided punch) capable of forming an undercut portion having a shape in which the outer periphery of a blank material narrowed down to a U cross section is recessed.

  The split punch described in Patent Document 1 is a split punch composed of a main punch that moves up and down and two sub punches that move to the left and right across the main punch. A concave punch is formed on the outer peripheral surface of the sub punch. A pressure receiving surface that forms an undercut portion and that receives a punch different from the divided punch is formed. In this divided punch, after the undercut portion is formed, the main punch is first retracted, and the sub punch is moved to a vacant space, so that the product can be taken out after the undercut portion is formed.

  Further, in this divided punch, the contact portion between the main punch and the sub punch is formed in a wedge shape, thereby preventing the occurrence of a step that causes a processing defect between the main punch and the sub punch.

Japanese Patent Laying-Open No. 2015-89567

  According to the divided punch described in Patent Document 1, a step is hardly generated between the main punch and the sub punch, and processing defects can be suppressed. However, the undercut portion is formed by the main punch and the sub punch having a movable portion. Therefore, when the punch is received, the divided punch (movable part) may wobble and processing defects may occur.

  The objective of this invention is providing the undercut process mechanism and processing apparatus which can prevent the processing defect of an undercut part.

  The present invention is an undercut processing mechanism capable of forming an undercut portion that is attached to and used in a processing apparatus for processing a workpiece having an undercut portion, and is movable to form the undercut portion during processing. A movable die, a moving means for moving the movable die so as to be removed from the undercut portion after processing, and a support means for supporting the movable die so that the movable die does not move during processing. Is an undercut processing mechanism.

  According to the present invention, since the movable die is supported by the support means and does not move during processing, wobbling of the movable die during processing can be prevented and processing defects in the undercut portion can be prevented.

  In the undercut processing mechanism of the present invention, the support means can be fixed to the processing apparatus.

  According to the present invention, by fixing the supporting means to the processing apparatus, the supporting means does not move relative to the processing apparatus, so that the supporting means can firmly support the movable die during processing, and the movable during processing The wobbling of the die can be prevented more reliably.

  The undercut processing mechanism of the present invention further includes movable placing means for placing a workpiece, and the movable die is configured to be movable simultaneously with the placing means described above. .

  According to the present invention, since the placing means and the movable die can be moved simultaneously, the processing time can be shortened.

  Further, in the undercut processing mechanism of the present invention, the placing means is configured to be able to support the movable die so that the movable die does not move at the time of processing, and the movable die includes the placing means at the time of processing. It is supported by the said support means.

  According to the present invention, since the movable die is supported by the mounting means and the supporting means at the time of processing, it becomes possible to support the movable die more firmly and more reliably prevent the movable die from wobbling at the time of processing. can do.

  Moreover, in the undercut processing mechanism of the present invention, the undercut portion has a portion with a different extraction direction, and a plurality of the movable dies are installed according to the extraction direction of the undercut portion. .

  According to the present invention, even when forming an undercut portion having a part with a different punching direction, wobbling of the movable die during processing can be prevented, and processing failure of the undercut portion can be prevented.

  In the undercut processing mechanism of the present invention, the movable die is formed so as to be in close contact with adjacent movable dies at the time of processing, and the moving direction and movement after processing according to the shape of the undercut portion formed by each. The amount is determined, and the shape is determined in accordance with the moving direction and the moving amount so that the adjacent movable dies do not interfere with each other when moving simultaneously.

  According to the present invention, since a plurality of movable dies can be moved simultaneously without interfering with each other, the processing time can be shortened even when forming an undercut portion having a portion with a different drawing direction.

  Moreover, this invention is a processing apparatus provided with the said undercut process mechanism.

  ADVANTAGE OF THE INVENTION According to this invention, the undercut process mechanism and processing apparatus which can prevent wobbling of the movable die | dye when forming an undercut part and can prevent the processing defect of an undercut part can be provided.

It is a perspective view which shows an example of the workpiece 91 processed with the processing apparatus 81 of 1st Embodiment of this invention. It is sectional drawing of the cutting line AA of FIG. It is sectional drawing of the cutting line BB of FIG. It is principal part sectional drawing at the time of the process of the 1st undercut process mechanism 1 of the processing apparatus 81 of 1st Embodiment of this invention. It is principal part sectional drawing after the lift-up of the 1st undercut process mechanism 1 of FIG. It is principal part sectional drawing at the time of the process of the 2nd undercut process mechanism 101 of the processing apparatus 81 of 1st Embodiment of this invention. It is principal part sectional drawing after the lift-up of the 2nd undercut process mechanism 101 of FIG. It is sectional drawing at the time of the process of the processing apparatus 81 of 1st Embodiment of this invention in the C section of FIG. It is the figure at the time of the process of the processing apparatus 81 seen from D of Fig.8 (a). It is the figure after the lift-up of the processing apparatus 81 seen from D of Fig.8 (a).

  FIG. 1 is a perspective view showing an example of a workpiece 91 processed by the processing apparatus 81 according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. 3 is a cross-sectional view taken along line BB in FIG. FIG. 4 is a cross-sectional view of a main part during processing of the first undercut processing mechanism 1 of the processing apparatus 81 according to the first embodiment of the present invention. FIG. 5 is a cross-sectional view of the main part after the lift-up of the first undercut processing mechanism 1 of FIG. FIG. 6 is a cross-sectional view of a main part at the time of processing of the second undercut processing mechanism 101 of the processing apparatus 81 according to the first embodiment of the present invention. FIG. 7 is a cross-sectional view of the main part after the lift-up of the second undercut processing mechanism 101 of FIG.

  FIG. 8A is a cross-sectional view at the time of processing of the processing apparatus 81 according to the first embodiment of the present invention in the portion C of FIG. FIG. 8B is a schematic diagram showing the interference amount e when the movable dies 11 and 111 of the processing apparatus 81 of FIG. 8A move with the same lift-up amount. FIG. 9 is a diagram at the time of processing of the processing device 81 as viewed from D of FIG. FIG. 10 is a view after the lift-up of the processing device 81 as viewed from D of FIG.

  A processing apparatus 81 according to the first embodiment of the present invention processes a side panel of a car body of an automobile as shown in FIG. 1 as a workpiece 91, and a first undercut portion 93 having a cross-sectional shape shown in FIG. It is a processing apparatus which has an undercut process mechanism which can form the 2nd undercut part 94 of the cross-sectional shape shown in FIG. Note that the first undercut portion 93 and the second undercut portion 94 of the workpiece 91 are continuous.

  The processing apparatus 81 of the present embodiment includes a die plate 61 constituting an undercut processing mechanism on a gantry (not shown), and punches 83 and 84 and driving means (not shown) for the punches 83 and 84 on the die plate 61. The first undercut processing mechanism 1 for forming the first undercut portion 93 and the second undercut processing mechanism 101 for forming the second undercut portion 94 are provided.

  Further, the processing device 81 includes drive means (not shown) for moving up and down ejector pins 25, 43, 125, and 143 of the first undercut processing mechanism 1 and the second undercut processing mechanism 101 described later. Above the processing device 81 (die plate 61), a space for mounting, taking out and transporting the workpiece 90 before processing or the workpiece 91 after processing is secured.

  Note that the configuration of the processing device 81 is not limited to this, and a necessary configuration can be appropriately added according to the shape of the workpiece 91, the preceding and following processes, and the like.

  The undercut processing mechanism is fixed to the frame of the first undercut processing mechanism 1 that forms the first undercut portion 93, the second undercut processing mechanism 101 that forms the second undercut portion 94, and the processing device 81. It comprises a die plate 61 to which a first undercut processing mechanism 1 and a second undercut processing mechanism 101 are attached.

  The die plate 61 is a template member serving as a base, and does not move when the movable dies 11 and 111 of the first undercut processing mechanism 1 and the second undercut processing mechanism 101 described later receive the punches 83 and 84, respectively. Further, it becomes a support means for supporting the movable dies 11 and 111. The die plate 61 has inclined pressure receiving surfaces 62 and 63 that are in close contact with the movable dies 11 and 111.

  The pressure receiving surfaces 62 and 63 are formed flat, but are not limited to this, and may be any shape that can support the movable dies 11 and 111 during processing. Further, the inclination angle of the pressure receiving surfaces 62 and 63 may be set to an optimum angle as appropriate according to the shape of the movable dies 11 and 111 and the traveling direction of the punches 83 and 84.

  The first undercut processing mechanism 1 is an undercut processing mechanism that receives the punch 83 to form a first undercut portion 93 on the workpiece 90 and allows the first undercut portion 93 to be removed after processing. The movable die 11 that receives the punch 83 during processing and moves so as to be detached from the first undercut portion 93 after processing, the moving means 21 that moves the movable die 11, and the mounting table 41 on which the workpiece 90 is placed It has.

  The movable die 11 is formed in a shape that allows the front surface portion 12 to receive the punch 83 to form the first undercut portion 93. Further, the back surface portion 13 of the movable die 11 is formed flat so as to be in close contact with the pressure receiving surface 62 formed on the die plate 61 at the time of processing, and the upper surface portion 14 of the movable die 11 is a mounting table 41 described later at the time of processing. The movable die 11 is formed flat in parallel with the direction in which the movable die 11 moves relative to the first undercut portion 93 (the removal direction of the first undercut portion 93) so as to be in close contact with the lower surface 45 of the mounting portion 42. .

  The movable die 11 is formed in a shape that does not interfere with the movable die 111 of the second undercut processing mechanism 101, which will be described later, and will be described later in detail.

  The moving means 21 includes a sliding piece 22 attached to the movable die 11, a holding piece 23 slidably engaged with the sliding piece 22, and a holder for receiving and guiding the sliding piece 22 and the holding piece 23. 24 and an ejector pin 25 that moves the holding piece 23 up and down by the driving means of the processing device 81, and the movable die 11 so that the back surface portion 13 of the movable die 11 is in close contact with the pressure receiving surface 62 of the die plate 61 during processing. After the machining, the movable die 11 is lifted up and moved so as to be disengaged from the first undercut portion 93.

  The sliding piece 22 is a block member having a distal end surface fixed to the lower surface portion 15 of the movable die 11, and has a dovetail groove (not shown) slidably engaged with the holding piece 23 at the proximal end. The surface has an obliquely formed convex portion 52 slidably fitted in a concave groove (not shown) of the holder 24 described later, and is accommodated in the holder 24 during processing.

  The holding piece 23 is a block body having a protrusion 53 slidably engaged with the dovetail groove of the sliding piece 22 on the upper surface, and is accommodated in the holder 24 so as to be slidable up and down. The angle of the upper surface of the holding piece 23 (the angle of the lower surface of the sliding piece 22) is set in the same direction as the removal direction of the first undercut portion 93 with respect to the holding piece 23 when the holding piece 23 is raised. In order to slide, it is parallel to the drawing direction of the first undercut portion 93.

  The holder 24 is a rectangular tube that is open at both ends, and a concave groove (not shown) into which the convex portion 52 of the sliding piece 22 is slidably fitted is formed obliquely on a pair of inner surfaces facing each other. . The opening of the holder 24 is formed to have a size that fits tightly enough to allow the holding piece 23 to slide so as to guide the holding piece 23 up and down.

  The holder 24 is fitted and fixed to the die plate 61, but is not limited to this, and may be formed integrally with the die plate 61.

  The ejector pin 25 is a round bar whose tip is fixed to the lower surface of the holding piece 23, and is moved up and down by the driving means of the processing device 81 to move the holding piece 23 up and down.

  The moving means 21 configured in this manner is pushed into the ejector pin 25 and the holding piece 23 is lifted, so that the sliding piece 22 is inclined upward along the convex strip 53 of the holding piece 23 and the concave groove of the holder 24. The movable die 11 is moved up so as to be disengaged from the first undercut portion 93 while being lifted up.

  The configuration of the moving means 21, the shapes of the sliding piece 22, the holding piece 23, the holder 24, and the ejector pin 25 are not limited to specific ones, and the movable die 11 is the first undercut portion during processing. 93 may be disposed at a position where it can be formed, and the movable die 11 may be configured to move away from the first undercut portion 93 after processing. For example, an air cylinder, a hydraulic cylinder, a cam mechanism (not shown), or the like can be used as the moving unit 21.

  The mounting table 41 is a plate-like member on which the workpiece 90 is mounted, and an ejector pin 43 is attached to the lower surface. On the edge portion of the mounting table 41, a mounting portion 42 for mounting the workpiece 90 is formed. The mounting unit 42 mounts the workpiece 90, prevents unintended deformation of the workpiece 90 during processing, maintains a predetermined shape, and the lower surface 45 of the mounting unit 42 is the upper surface portion of the movable die 11 during processing. The movable die 11 is supported so as not to move in close contact with 14.

  The ejector pin 43 is a round bar whose tip is fixed to the lower surface of the mounting table 41, and moves up and down by the driving means of the processing device 81 to move the mounting table 41 up and down. The ejector pin 25 of the moving means 21, the ejector pin 43 of the mounting table 41, and the ejector pins 125 and 143 of the second undercut processing mechanism 101, which will be described later, move up and down simultaneously with the same stroke amount by the same driving means.

  The second undercut processing mechanism 101 is an undercut processing mechanism that receives the punch 84, forms a second undercut portion 94 on the workpiece 90, and enables removal of the first undercut portion 94 after processing. The basic configuration is the same as that of the first undercut processing mechanism 1, and includes a movable die 111, a moving means 121, and a mounting table 141.

  The movable die 111 is formed in a shape that allows the front portion 112 to receive the punch 84 and form the second undercut portion 94. Further, the back surface portion 113 of the movable die 111 is formed flat so as to be in close contact with the pressure receiving surface 63 formed on the die plate 61 at the time of processing, and the upper surface portion 114 of the movable die 111 is a mounting table 141 described later at the time of processing. The movable die 111 is formed flat along the direction in which the movable die 111 moves relative to the second undercut portion 94 (the removal direction of the second undercut portion 94) so as to be in close contact with the lower surface 145 of the mounting portion 142. .

  Further, the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101 are in close contact with each other at the side surfaces 16 and 116 facing each other at the time of processing. And when it remove | deviates from the 2nd undercut part 94, it forms in the shape which does not mutually interfere. This will be described with reference to FIGS.

The amount of movement of the movable die 11 of the first undercut processing mechanism 1 when it is disengaged from the first undercut portion 93 is L, and the angle of the second undercut portion 94 with respect to the removal direction of the first undercut portion 93 is α. Then, the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101 are lifted up so that the amount of movement in the height direction is the same from the close contact state, The amount of interference e when moved in each pulling direction is expressed by equation (1) (see FIG. 8B).
e = L × sin α (1)

  In this way, the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101 are lifted up and moved so that the amount of movement in the height direction is the same from the close contact state. Then, the side surfaces 16 and 116 that are in close contact with each other are inclined with respect to the height direction, and lifted and moved so that the amount of movement in the height direction is different (see FIGS. 9 and 10).

The height difference after lift-up between the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101 is Δh, and the side surface 16 of the movable die 11 of the first undercut processing mechanism 1 If the inclination angle with respect to the height direction of the side surface 116 of the movable die 111 of the second undercut processing mechanism 101 in close contact with β is β, the horizontal movement amount Δx of the movable dies 11 and 111 is expressed by Expression (2). (See FIG. 10).
Δx = Δh × tan β (2)

Further, a condition in which the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101 do not interfere is expressed by Expression (3).
Δx ≧ e (3)

  The moving distance L of the movable die 11 of the first undercut processing mechanism 1, the angle α of the second undercut portion 94 with respect to the extraction direction of the first undercut portion 93, the movable die 11 of the first undercut processing mechanism 1. And the height difference Δh after the lift-up between the second undercut processing mechanism 101 and the movable die 111 are determined by the shapes of the first undercut portion 93 and the second undercut portion 94. At this time, the movable dies 11, 111 are obtained by obtaining the inclination angle β with respect to the height direction of the side surface 116 of the movable die 111 of the second undercut processing mechanism 101 which is in close contact with the side surface 16 of the movable die 11 of the first undercut processing mechanism 1. The shape that does not interfere with can be determined.

Summarizing formulas (1) to (3), the inclination of the side surface 116 of the movable die 111 of the second undercut processing mechanism 101 in close contact with the side surface 16 of the movable die 11 of the first undercut processing mechanism 1 with respect to the height direction. The angle β can be determined according to the equation (4).
tan β ≧ L / Δh × sin α (4)

  The moving means 121 accommodates a sliding piece 122 attached to the lower surface 115 of the movable die 111, a holding piece 123 slidably engaged with the sliding piece 122, a sliding piece 122 and a holding piece 123. A holder 124 for guiding and an ejector pin 125 for moving the holding piece 123 up and down by the driving means of the processing device 81 are provided, and the back surface portion 113 of the movable die 111 is in close contact with the pressure receiving surface 63 of the die plate 61 during processing. The movable die 111 is moved, and after processing, the movable die 111 is moved while being lifted up so as to be separated from the second undercut portion 94.

  Similar to the moving means 21 of the first undercut processing mechanism 1, the moving means 121 has a convex portion 152 and a dovetail groove (not shown) on the sliding piece 122, a convex strip 153 on the holding piece 123, and a holder 124 has a concave groove (not shown).

  The moving means 121 is arranged so that the sliding piece 122 slides in the same direction as the removal direction of the second undercut portion 94 with respect to the holding piece 123 when the holding piece 123 is raised (sliding angle). The angle of the lower surface of the moving piece 122 is parallel to the drawing direction of the second undercut portion 94, and this is different from the moving means 21 of the first undercut processing mechanism 1. Thereby, the moving direction of the sliding pieces 22 and 122 differs between the first undercut processing mechanism 1 and the second undercut processing mechanism 101, and the moving amount in the height direction when the movable dies 11 and 111 are lifted up is set. There is a difference.

  The moving means 21 and 121 are, for example, air cylinders or hydraulic cylinders, and lifted up to avoid interference between the movable die 11 of the first undercut processing mechanism 1 and the movable die 111 of the second undercut processing mechanism 101. It is also possible to move the movable dies 11 and 111 by independent driving so that there is a difference in the amount of movement in the height direction.

  The mounting table 141 is a plate-like member on which the workpiece 90 is mounted, and an ejector pin 143 is attached to the lower surface. A mounting portion 142 for mounting the workpiece 90 is formed at the edge of the mounting table 141. The mounting unit 142 mounts the workpiece 90, prevents unintended deformation of the workpiece 90 during processing and maintains a predetermined shape, and the lower surface 145 of the mounting unit 142 is the upper surface of the movable die 111 during processing. The movable die 111 is supported in close contact with 114. The ejector pin 143 is a round bar whose tip is fixed to the lower surface of the mounting table 141, and moves up and down by the driving means of the processing device 81 to move the mounting table 141 up and down.

  Next, the operation of the processing apparatus 81 of this embodiment will be described. In the processing apparatus 81, after the workpiece 90 is placed, the punches 83 and 84 are driven to form the first undercut portion 93 and the second undercut portion 94 on the workpiece 90, and the ejector pins 25, The movable dies 11 and 111 are moved away from the first undercut portion 93 and the second undercut portion 94 by raising 43, 125, and 143, and the mounting tables 41 and 141 are lifted up, and the workpiece 91 is moved up. Can be taken out.

  At the time of processing, the ejector pins 25, 43, 125, and 143 are lowered to the descending end, the back surface portions 13 and 113 of the movable dies 11 and 111 and the pressure receiving surfaces 62 and 63 of the die plate 61 are in close contact with each other. 111 and the lower surfaces 45 and 145 of the mounting portions 42 and 142 of the mounting tables 41 and 141 are in close contact with each other, and the opposing side surfaces 16 and 116 of the movable dies 11 and 111 are in close contact with each other. In this state, the workpiece 90 is placed and fixed on the mounting tables 41 and 141, and the punches 83 and 84 are driven to form the first undercut portion 93 and the second undercut portion 94 on the workpiece 90. Is done.

  When the first undercut portion 93 and the second undercut portion 94 are formed and the punches 83 and 84 are retracted, the ejector pins 25, 43, 125, and 143 are raised by the driving means of the processing device 81, and the mounting tables 41, 141, and The holding pieces 23 and 123 are lifted up. When the holding pieces 23 and 123 rise, the sliding pieces 22 and 122 slide obliquely upward along the concave grooves of the holders 24 and 124, and the movable dies 11 and 111 move to move the first undercut portion 93 and the first 2 Detach from the undercut portion 94.

  Note that the movable dies 11 and 111 have the back surface portions 13 and 113 that slide with the pressure receiving surfaces 62 and 63 of the die plate 61, and the upper surface portions 14 and 114 that slide with the lower surfaces 45 and 145 of the mounting tables 41 and 141. The side surfaces 16 and 116 to be moved move while sliding.

  When the ejector pins 25, 43, 125, and 143 are raised to the ascending end, the workpiece 91 is taken out by a conveying means (not shown) such as a robot arm. Thereafter, the ejector pins 25, 43, 125, and 143 are lowered to the lower end by the driving means of the processing apparatus 81, and the next workpiece 90 is placed on the mounting tables 41 and 141.

  As described above, according to the processing apparatus 81 of the present embodiment, when the first undercut portion 93 and the second undercut portion 94 are formed, the pressure receiving surfaces 62 and 63 of the die plate 61, the mounting tables 41 and 141, and the like. Since the movable dies 11 and 111 are supported by the lower surfaces 45 and 145 and the side surfaces 16 and 116 of the movable dies 11 and 111 facing each other, the movable dies 11 and 111 are prevented from wobbling. Processing defects in the undercut portion 94 can be prevented.

  In particular, since the die plate 61 is fixed to the processing device 81 so as not to move, the movable dies 11 and 111 can be firmly supported, and the wobbling of the movable dies 11 and 111 during processing can be ensured. Can be prevented. Further, the moving means 21 and 121 do not need to receive the punches 83 and 84, and for example, it is not necessary to constitute a sturdy structure like a conventionally used cam mechanism (not shown).

  Further, according to the machining apparatus 81 of the present embodiment, when the workpiece 91 is taken out after machining, the ejector pins 25, 43, 125, and 143 may be raised in the same direction at the same timing and with the same stroke. The workpiece 91 can be taken out by one operation by the means. Thereby, for example, as compared with the case where each of the movable dies 11 and 111 is driven by a single driving unit, the configuration is simplified, the processing device 81 can be manufactured at low cost, and the processing time can be significantly reduced. it can.

  As mentioned above, although the undercut processing mechanism and processing apparatus of this invention were demonstrated using the processing apparatus 81 of 1st Embodiment, the undercut processing mechanism and processing apparatus of this invention are not limited to the said embodiment. However, the present invention can be modified and used without changing the gist. For example, instead of the die plate 61, the movable dies 11 and 111 may be supported by different block materials using a block member (not shown in the figure) as a support means. At this time, the block member is fixed to the frame of the processing apparatus 81 via a die plate or another template member.

  In the processing apparatus 81 according to the first embodiment, the movable dies 11 and 111 are supported by the die plate 61 as a support means, the mounting tables 41 and 141, and the side surfaces 16 and 161 facing each other at the time of processing. The undercut processing mechanism and the processing apparatus are not limited to this, and it is sufficient that the movable dies 11 and 111 are supported by the support means at least during processing.

  Further, in the undercut processing mechanism and the processing apparatus of the present invention, the workable workpiece is not limited to the shape described in the processing apparatus 81 of the first embodiment. Further, depending on the shape of the undercut portion of the workpiece, only one movable die or three or more movable dies may be used.

  In the processing apparatus 81 of the first embodiment, the movable dies 11 and 111 and the mounting bases 41 and 141 (ejector pins 25, 43, 125, and 143) are simultaneously moved by the same drive source. The mechanism and the processing apparatus are not limited to this, and for example, each movable die and each mounting table may be configured to move independently using an air cylinder, a hydraulic cylinder, or the like as a drive source.

  In the undercut processing mechanism and processing apparatus of the present invention, the mounting table does not have to move up and down. In this case, the mounting table may be formed integrally with the die plate.

  As described above, the preferred embodiments have been described with reference to the drawings. However, those skilled in the art will readily understand various changes and modifications within the obvious scope by looking at the present specification. Therefore, such changes and modifications are interpreted as being within the scope of the invention defined by the claims.

DESCRIPTION OF SYMBOLS 1 1st undercut process mechanism 11, 111 Movable die 21, 121 Moving means 41, 141 Mounting stand 61 Die plate 101 2nd undercut process mechanism 81 Processing apparatus 90 Workpiece 91 Workpiece 93 1st undercut part 94 1st 2 Undercut part

Claims (7)

An undercut processing mechanism capable of forming an undercut portion, which is used by being attached to a processing apparatus for processing a workpiece having an undercut portion,
A movable movable die that forms the undercut portion during processing;
Moving means for moving the movable die away from the undercut portion after processing;
An undercut processing mechanism comprising: support means for supporting the movable die so that the movable die does not move during processing.   The undercut processing mechanism according to claim 1, wherein the support means can be fixed to the processing apparatus. Furthermore, it is provided with movable placing means for placing the workpiece,
The undercut processing mechanism according to claim 1 or 2, wherein the movable die is configured to be movable simultaneously with the placing means. The placing means is configured to be able to support the movable die so that the movable die does not move during processing,
The undercut processing mechanism according to claim 3, wherein the movable die is supported by the placing unit and the supporting unit during processing. The undercut part has a different part in the drawing direction,
The undercut processing mechanism according to any one of claims 1 to 4, wherein a plurality of the movable dies are provided according to a direction in which the undercut portion is pulled out.   The movable dies are formed so as to be in close contact with the adjacent movable dies at the time of processing, and the moving direction and moving amount after processing are determined according to the shape of the undercut portion formed by each, and the adjacent movable dies are 6. The undercut processing mechanism according to claim 5, wherein a shape is determined according to each of the movement direction and the movement amount so that the dies do not interfere with each other when the dies move simultaneously.   A processing apparatus comprising the undercut processing mechanism according to any one of claims 1 to 6.

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