JP2017054973A - Processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing device capable of suppressing a steep rise in processing cost for a workpiece.SOLUTION: A laser processing device 1 comprises: a chuck table 10 holding a workpiece W on a holding surface 10a; and laser processing means 20 performing laser processing on the workpiece W held on the holding surface 10a of the chuck table 10. The chuck table 10 consists of a plurality of pins 12 which are stood and have holding surfaces 10a formed of respective tips, and a driving part 13 driving the respective pins 12 to the holding surfaces 10a and retraction positions below the holding surfaces 10a, respectively. The laser processing device 1 holds the side of a reverse surface WR of the workpiece W on the holding surfaces 10a with a plurality of pins 12 at positions, corresponding to division predetermination lines L, lowered to retraction positions, and performs laser processing on the workpiece W by the laser processing means 20.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a processing apparatus.

  Semiconductor wafers and optical device wafers are ruptured by using a modified layer formed by irradiating a wafer with a laser beam having a wavelength that is transparent to the wafer while aligning the focal point inside the wafer. In recent years, a processing apparatus that divides into chips has been used (see, for example, Patent Document 1). In this processing apparatus, it is a condition that a material that attenuates the energy of the laser beam (for example, a material for forming various patterns constituting the device) is not formed on the incident surface side of the laser beam. For this reason, the processing apparatus disclosed in Patent Document 1 irradiates a wafer having such a device on the surface thereof with a laser beam from the back side where no device is present, thereby forming a modified layer therein.

  Further, when a MEMS (Micro Electro Mechanical Systems) or the like as a device is formed on a wafer surface, the processing apparatus disclosed in Patent Document 1 chucks a sheet member in order to protect the MEMS as the device. We are investigating a method of placing a wafer on a holding surface of a table so that the surface on which the device is formed is in contact. This sheet member has both air permeability and releasability, and can protect the device rather than placing the device directly on the porous portion of the chuck table, and the adhesive surface of the adhesive tape around the wafer is the holding surface of the chuck table. It can prevent sticking to.

JP 2013-229403 A

  However, the processing apparatus disclosed in Patent Document 1 also includes a brittle MEMS that is damaged only by being brought into contact with the sheet. In this case, there is a problem in that the technique cannot be applied and division is not possible. Further, the processing apparatus disclosed in Patent Document 1 has a large protrusion shape with the device other than MEMS, and the protrusion may not be absorbed by the adhesive layer of the protective tape, and the protrusion-shaped workpiece cannot be processed on the surface side. There is a problem.

  In the processing apparatus disclosed in Patent Document 1, a plurality of chuck tables each having a groove having a shape corresponding to the position of the device are prepared, and the chuck table is variously changed according to the wafer to be processed. For this reason, the processing apparatus disclosed in Patent Document 1 has a tendency to increase the processing cost of a workpiece because a plurality of chuck tables are provided or the number of man-hours is required for changing the chuck table.

  This invention is made | formed in view of such a point, and it aims at providing the processing apparatus which can suppress the increase in the processing cost of a to-be-processed object.

  In order to solve the above-described problems and achieve the object, a processing apparatus of the present invention includes a chuck table that holds a workpiece on a holding surface, and a processing that processes the workpiece held on the holding surface of the chuck table. A plurality of chuck tables that are erected to form the holding surface by their tips, and each pin is driven to the holding surface and a retracted position below the holding surface. And a driving unit that holds one surface side of the workpiece with the holding surface in a state where a plurality of pins at predetermined positions are lowered to the retracted position, and the workpiece is processed by the processing means. It is characterized by performing.

  The predetermined position is preferably a position corresponding to a scheduled division line set on the surface of the workpiece.

  The predetermined position is preferably a position corresponding to a device set on the surface of the workpiece.

  Since the processing apparatus of the present invention includes a chuck table that can move the pins up and down, an increase in the processing cost of the workpiece can be suppressed.

FIG. 1 is a perspective view illustrating a schematic configuration example of the laser processing apparatus according to the first embodiment. FIG. 2 is a perspective view illustrating a schematic configuration example of the chuck table of the laser processing apparatus illustrated in FIG. 1. FIG. 3 is an enlarged perspective view showing a portion III in FIG. 4 is a cross-sectional view of the chuck table shown in FIG. FIG. 5 is a perspective view of a wafer to be processed by the laser processing apparatus shown in FIG. FIG. 6 is a diagram showing an example of an image obtained by the imaging means of the laser processing apparatus shown in FIG. FIG. 7 is a cross-sectional view illustrating a state where the laser processing apparatus according to the first embodiment performs laser processing on a workpiece. FIG. 8 is a cross-sectional view illustrating a state in which the laser processing apparatus according to the second embodiment performs laser processing on a workpiece. FIG. 9 is a cross-sectional view illustrating a chuck table of a laser processing apparatus according to a modification of the first and second embodiments.

  Embodiments for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

Embodiment 1
A laser processing apparatus as a processing apparatus according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is a perspective view illustrating a schematic configuration example of the laser processing apparatus according to the first embodiment, and FIG. 2 is a perspective view illustrating a schematic configuration example of a chuck table of the laser processing apparatus illustrated in FIG. 3 is an enlarged perspective view showing a portion III in FIG. 2, FIG. 4 is a sectional view of the chuck table shown in FIG. 2, and FIG. 5 is shown in FIG. FIG. 6 is a perspective view of a wafer to be processed by the laser processing apparatus, and FIG. 6 is a view showing an example of an image obtained by the imaging means of the laser processing apparatus shown in FIG.

  The laser processing apparatus 1 irradiates a laser beam LB (shown in FIG. 7) along a planned division line L of the workpiece W to divide the workpiece W into individual devices D. In the first embodiment, the workpiece W divided into individual devices D by the laser processing apparatus 1 is a disk-shaped semiconductor wafer or light whose base material is silicon, sapphire, gallium, or the like, as shown in FIG. It is a device wafer. In the workpiece W, a device D is formed in an area partitioned by a plurality of division lines L formed in a lattice pattern on the surface WS. The workpiece W is manufactured to each device D by being divided by being irradiated with the laser beam LB along the division line L.

  As shown in FIG. 1, the laser processing apparatus 1 includes a chuck table 10 that holds a workpiece W on a holding surface 10a, a laser processing means 20 as a processing means, and a chuck table 10 and a laser processing means 20. An X-axis moving unit 30 that relatively moves in the axial direction, a Y-axis moving unit 40 that relatively moves the chuck table 10 and the laser processing unit 20 in the Y-axis direction, an imaging unit 50, and a control unit 100 are provided. .

  The laser processing means 20 irradiates the surface of the workpiece W held on the holding surface 10a of the chuck table 10 with a laser beam LB to ablate the workpiece W (corresponding to processing). The laser beam LB is a laser beam having a wavelength that is absorptive with respect to the workpiece W. The laser processing means 20 is attached to the tip of the support column 4 connected to the wall portion 3 erected from the apparatus main body 2 of the laser processing apparatus 1. The laser processing means 20 includes an oscillator (not shown) that oscillates the laser beam LB and a condenser (not shown) that condenses the laser beam LB oscillated by the oscillator. In the oscillator, the frequency of the oscillating laser beam LB is appropriately adjusted according to the type of workpiece W, the processing form, and the like. As the oscillator, for example, a YAG laser oscillator or a YVO laser oscillator can be used. The condenser includes a total reflection mirror that changes the traveling direction of the laser beam LB oscillated by the oscillator, a condenser lens that collects the laser beam LB, and the like.

  The X-axis moving unit 30 is a processing feed unit that moves the chuck table 10 in the X-axis direction to process and feed the chuck table 10 in the X-axis direction parallel to both the width direction and the horizontal direction of the apparatus main body 2. is there. The Y-axis moving means 40 is an index feeding means for indexing and feeding the chuck table 10 by moving the chuck table 10 in the Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction. The X-axis moving means 30 and the Y-axis moving means 40 are known ball screws 31 and 41 that are rotatably provided around the axis, and known pulse motors 32 and 42 that rotate the ball screws 31 and 41 around the axis. In addition, known guide rails 33 and 43 that support the chuck table 10 so as to be movable in the X-axis direction or the Y-axis direction are provided. The laser processing apparatus 1 also includes a rotational drive source 60 (shown in FIG. 2) that rotates the chuck table 10 about a central axis parallel to the Z-axis direction orthogonal to both the X-axis direction and the Y-axis direction. .

  The image pickup means 50 picks up an image of the workpiece W held on the chuck table 10 and is arranged at a position parallel to the laser processing means 20 in the X-axis direction. In the first embodiment, the imaging unit 50 is attached to the tip of the support column 4. The imaging means 50 is configured by a CCD camera that images the workpiece W held on the chuck table 10.

  As shown in FIGS. 2 and 4, the chuck table 10 includes a frame body 11 supported by the rotational drive source 60, a plurality of pins 12 provided in the frame body 11, and a drive unit 13 that drives the pins 12. Consists of The frame 11 is made of a metal such as stainless steel, for example. The frame body 11 includes a disk portion 14 that is fixed in a disk shape and is fixed to the rotation drive source 60 coaxially with the rotation drive source 60, and a frame portion 15 that is erected from the outer edge of the disk portion 14. The upper surface 15a of the frame portion 15 is formed flat and parallel to the horizontal direction.

  A plurality of pins 12 are provided in a standing manner in the frame 11, and a holding surface 10 a is formed by an end surface 12 a that is the tip of each pin 12. The pin 12 is formed in a cylindrical shape having an outer diameter of 0.2 mm or more and 5.0 mm or less. The pin 12 is formed of ceramics. Furthermore, the pin 12 may be formed of porous porous ceramics. The pin 12 is disposed on the disk portion 14 of the frame body 11 and inside the frame portion 15. The pins 12 are arranged such that the center line is parallel to the Z-axis direction and the outer peripheral surfaces are in contact with each other as shown in FIG. That is, a large number of pins 12 are arranged inside the frame body 11. Further, the end surface 12a on the upper surface 15a side of the frame body 11 of the pin 12 is formed flat and parallel to the horizontal direction. When the end surface 12a of the pin 12 is positioned on the same plane as the upper surface 15a of the frame 11, the holding surface 10a is configured.

  The drive unit 13 drives each pin 12 to a holding surface 10a and a retracted position below the holding surface 10a. The drive unit 13 is in one-to-one correspondence with the pins 12. The drive unit 13 moves the corresponding pin 12 into a holding position where the end surface 12a is positioned on the same plane as the upper surface 15a of the frame 11, that is, the holding surface 10a, and a retracted position where the end surface 12a is positioned below the holding surface 10a. The pin 12 is moved up and down in the Z-axis direction. The drive unit 13 is a so-called actuator including a cylinder 16 fixed on the disk portion 14 of the frame body 11 and a piston 17 provided so as to be movable in the Z-axis direction with respect to the cylinder 16. The pin 17 is fixed to the upper end of the piston 17. The piston 17 protrudes upward when it extends from the cylinder 16. The drive unit 13 positions the pin 12 in the holding position when the piston 17 extends upward from the cylinder 16, and positions the pin 12 in the retracted position when the piston 17 contracts into the cylinder 16.

  When the outer diameter of the pin 12 is about 0.2 mm, the drive unit 13 encloses the piston 17 by enclosing the working fluid in the cylinder 16 and heating or non-heating the working fluid with an optical fiber. A so-called micro cylinder that extends and contracts from the cylinder 16 can be used. In the first embodiment, the drive unit 13 expands and contracts the piston 17 within a range of 1 mm or more and 5 mm or less. That is, in the first embodiment, the driving unit 13 moves the pin 12 up and down in the Z-axis direction within a range of 1 mm or more and 5 mm or less, and moves the pin 12 between the holding position and the retreat position.

  Further, the chuck table 10 is connected to a vacuum suction source 70, and a vacuum suction path 71 for suction by the vacuum suction source 70 is formed. The vacuum suction path 71 is a hole that opens on the outer peripheral side of the outermost drive unit 13 on the upper surface of the disk portion 14 and is provided in the frame 11 or the like. The chuck table 10 sucks and holds the workpiece W by sucking the workpiece W placed on the holding surface 10 a by the suction force from the vacuum suction source 70. In the chuck table 10, the space formed in the pin 12 or the like positioned at the retracted position, and the pin 12 itself holds the workpiece W by suction when the pin 12 is formed in porous ceramics.

  The control unit 100 controls the above-described components to cause the laser processing apparatus 1 to perform a laser processing operation on the workpiece W. The control means 100 controls the operation of each drive unit 13 of the chuck table 10, that is, expands and contracts the piston 17. The control means 100 includes a computer system. The control means 100 includes an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a read only memory (ROM) or a random access memory (RAM), and an input / output interface device. And have.

  The arithmetic processing device of the control means 100 performs arithmetic processing according to a computer program stored in the storage device, and sends a control signal for controlling the laser processing device 1 via the input / output interface device to the laser processing device 1. To the above-described components. Further, the control means 100 is connected to a display means (not shown) constituted by a liquid crystal display device or the like that displays a processing operation state or an image, or an input means used when an operator registers processing content information or the like. . The input means includes at least one of a touch panel provided on the display means, a keyboard, and the like.

  Next, a process in which the laser processing apparatus 1 divides the workpiece W into individual devices D will be described with reference to the drawings. FIG. 7 is a cross-sectional view illustrating a state where the laser processing apparatus according to the first embodiment performs laser processing on a workpiece.

  First, the operator registers the processing content information in the control means 100 of the laser processing apparatus 1, and the operator places the back surface WR on the back side of the surface WS of the workpiece W on the holding surface 10 a of the chuck table 10. When there is an instruction to start the processing operation, the laser processing apparatus 1 starts the processing operation. In this state, all the pins 12 of the chuck table 10 are positioned at the holding position.

  In the processing operation, the control unit 100 drives the vacuum suction source 70 to suck and hold the workpiece W on the chuck table 10. The control unit 100 moves the chuck table 10 below the laser processing unit 20 by the X-axis moving unit 30 and the Y-axis moving unit 40, and the workpiece held on the chuck table 10 below the imaging unit 50. W is positioned, and the image pickup means 50 is caused to pick up an image. The imaging unit 50 outputs the captured image G information shown in FIG. 6 to the control unit 100. Then, the control means 100 performs image processing such as pattern matching on the image G, and calculates the positions in the X-axis direction and the Y-axis direction of all the division planned lines L as indicated by dotted lines in FIG.

  The control unit 100 calculates a plurality of pins 12 positioned below the planned division line L in the Z-axis direction based on the calculated division line L, and drives each of the calculated pins 12. 13 pistons 17 are reduced. As shown in FIG. 7, the control unit 100 retracts the pins 12 located below the planned division line L in the Z-axis direction, that is, a plurality of pins 12 at positions corresponding to the predetermined division line L that is a predetermined position. Lower.

  The control means 100 positions one end of the predetermined division line L directly below the laser processing means 20 by the X-axis moving means 30, the Y-axis moving means 40, and the rotation driving means. Then, as shown in FIG. 7, the control unit 100 applies the chuck table 10 holding the workpiece W while irradiating the laser beam LB from the laser processing unit 20 to the laser processing unit 20 by the X-axis moving unit 30. Then, it is moved along a predetermined division line L at a predetermined processing speed.

  Then, a part of the workpiece W is sublimated and the predetermined division line L is divided by ablation. When the other end of the predetermined division line L reaches just below the laser processing means 20, the control means 100 stops the irradiation of the laser beam LB and stops the movement of the chuck table 10 by the X axis moving means 30. As described above, the control unit 100 irradiates all the planned division lines L with the laser beam LB in order, and divides the division lines L to divide the workpiece W into individual devices D. Thus, in Embodiment 1, the laser processing apparatus 1 holds the holding surface in a state where the pins 12 at positions corresponding to the division lines L set on the surface WS of the workpiece W at a predetermined position are lowered to the retracted position. The back surface WR, which is one surface of the workpiece W, is held at 10a, and the workpiece W is laser processed by the laser processing means 20. That is, in the first embodiment, the predetermined position is a position corresponding to the division line L set on the back surface WR of the workpiece W.

  When the control unit 100 irradiates all the planned division lines L with the laser beam LB, the X-axis moving unit 30 and the Y-axis moving unit 40 move the chuck table 10 away from the lower side of the laser processing unit 20 to move the laser beam LB. The vacuum suction source 70 is stopped at a position separated from the lower side of the processing means 20 to release the suction holding of the workpiece W. The operator removes the divided individual devices D and the like from the chuck table 10 and places the next workpiece W before laser processing on the holding surface 10a of the chuck table 10 so as to cover the same as before. Laser processing of the workpiece W is performed.

  The laser processing apparatus 1 according to the first embodiment includes the chuck table 10 that can move the pin 12 up and down between the holding position and the retracted position in correspondence with the position of the device D, and thus has a plurality of shapes. The holding surface 10a of the chuck table 10 is irradiated with the laser beam LB for ablating the division planned line L without manufacturing the chuck table 10 having different sizes and changing the chuck table 10 according to the shape and position of the device D. Can be suppressed. For this reason, the laser processing apparatus 1 according to the first embodiment does not need to manufacture a plurality of chuck tables 10 and can suppress replacement of the chuck tables 10. Therefore, the laser processing apparatus 1 according to the first embodiment can suppress an increase in the processing cost of the workpiece W.

[Embodiment 2]
A processing apparatus according to Embodiment 2 will be described with reference to the drawings. FIG. 8 is a cross-sectional view illustrating a state in which the laser processing apparatus according to the second embodiment performs laser processing on a workpiece. In FIG. 8, the same parts as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  The device D of the workpiece W to be processed by the laser processing apparatus 1-2 as the processing apparatus according to the second embodiment has a low mechanical strength or a microelectromechanical system (MEMS) whose surface is uneven. It is.

  As shown in FIG. 8, the laser processing unit 20-2 as the processing unit of the laser processing apparatus 1-2 according to the second embodiment uses a laser beam LP having a wavelength that is transmissive to the workpiece W. Irradiation is performed from the back surface WR side of W along the planned division line L, and a modified layer K serving as a fracture starting point is formed inside the workpiece W. The modified layer K means a region where the density, refractive index, mechanical strength and other physical characteristics are different from those of the surroundings, and includes a melt-treated region, a crack region, and a dielectric breakdown region. , A refractive index change region, a region where these regions are mixed, and the like.

  The imaging unit 50-2 of the laser processing apparatus 1 according to the second embodiment includes an imaging element that detects light in an infrared region that is difficult to be absorbed by the workpiece W, and includes the device D from the back surface WR side of the workpiece W. Take an image.

  In a state where the machining operation of the laser machining apparatus 1-2 according to the second embodiment is started, all the pins 12 of the chuck table 10 are positioned at the retracted position, and the surface WS of the workpiece W is set to the end surface of the pins 12. The outer edge of the workpiece W is placed on the upper surface 15a of the frame portion 15 of the frame 11 so as to face each other. In the processing operation of the laser processing apparatus 1-2 according to the second embodiment, the control unit 100 drives the vacuum suction source 70 to suck and hold the workpiece W on the chuck table 10. The control unit 100 moves the chuck table 10 below the laser processing unit 20-2 by the X-axis moving unit 30 and the Y-axis moving unit 40, and is held on the chuck table 10 below the imaging unit 50-2. Then, the workpiece W is positioned, imaged by the imaging means 50, image processing such as pattern matching is performed, and the positions of all the division lines L in the X-axis direction and the Y-axis direction are calculated.

  The control unit 100 calculates a plurality of pins 12 positioned below the planned division line L in the Z-axis direction based on the calculated division line L, and drives each of the calculated pins 12. 13 pistons 17 are extended. In the second embodiment, as shown in FIG. 8, the control unit 100 retracts the pins 12 positioned below the device D in the Z-axis direction, that is, a plurality of pins 12 at positions corresponding to the device D being a predetermined position. Lower to position.

  As in the first embodiment, the control unit 100 sequentially irradiates all the planned division lines L with the laser beam LP, and forms the modified layer K along the planned division lines L inside the workpiece W. . Thus, in the second embodiment, the laser processing apparatus 1-2 holds the holding surface in a state where the pin 12 at the position corresponding to the device D set on the surface WS of the workpiece W at a predetermined position is lowered to the retracted position. The surface WS side which is one surface of the workpiece W is held at 10a, and the workpiece W is laser processed by the laser processing means 20-2. That is, in the second embodiment, the predetermined position is a position corresponding to the device D set on the surface WS of the workpiece W.

  When the control unit 100 irradiates all the planned division lines L with the laser beam LP, the control unit 100 moves the chuck table 10 away from the lower side of the laser processing unit 20-2 by the X-axis moving unit 30 and the Y-axis moving unit 40. Then, the vacuum suction source 70 is stopped at a position apart from the lower side of the laser processing means 20-2, and the suction holding of the workpiece W is released. The operator removes the workpiece W subjected to laser processing from the chuck table 10 and places the next workpiece W before laser processing on the holding surface 10a of the chuck table 10 so that the workpiece is processed in the same manner as before. Laser processing of the workpiece W is performed. In the next step, the laser-processed workpiece W is fractured starting from the modified layer K and divided into individual devices D.

  According to the laser processing apparatus 1-2 according to the second embodiment, as in the first embodiment, the chuck that can move the pin 12 up and down between the holding position and the retracted position in correspondence with the position of the device D. Since the table 10 is provided, an increase in the processing cost of the workpiece W can be suppressed.

  Furthermore, the laser processing apparatus 1-2 according to the second embodiment includes a chuck table that can move the pin 12 up and down between the holding position and the retracted position in accordance with the position of the device D. In operation, the pin 12 at the position corresponding to the device D is lowered to the retracted position. Therefore, the laser processing apparatus 1-2 according to the second embodiment can hold the workpiece W without damaging the device D, and suppress suction leakage even if the surface of the device D is uneven. The workpiece W can be held without being displaced.

  Further, the laser processing apparatus 1-2 according to the second embodiment includes the drive unit 13 configured by a microcylinder as in the first embodiment. In the laser processing apparatus 1-2 according to the second embodiment, the chuck table 10 holds the surface WS of the workpiece W, and in order to form the modified layer K inside the workpiece W, the driving unit 13 includes: What is necessary is just to move the pin 12 up and down within the range of about several tens of μm to several hundreds of μm and move it between the holding position and the retracted position. For this reason, in the laser processing apparatus 1-2 according to the second embodiment, the drive unit 13 may be configured by a piezo element.

[Modification]
A processing apparatus according to a modification of the first and second embodiments will be described with reference to the drawings. FIG. 9 is a cross-sectional view illustrating a chuck table of a laser processing apparatus according to a modification of the first and second embodiments. In FIG. 9, the same parts as those in the first and second embodiments are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 9, the chuck table 10-3 of the laser processing apparatus 1-3 as a processing apparatus according to the modification of the first and second embodiments is open to the end face 12a of each pin 12 and is a vacuum suction source. A suction path 72 connected to 70 is provided. The suction path 72 is provided in each pin 12 and sucks and holds the workpiece W on the end surface 12 a by the vacuum suction source 70. Each suction path 72 is provided with an open / close valve 73 that is opened and closed by the control means 100.

  The laser processing apparatus 1-3 according to the modification performs laser processing on the workpiece W in the same manner as in the first or second embodiment. In the laser processing apparatus 1-3 according to the modified example, in the processing operation, the control unit 100 opens the opening / closing valve 73 provided in the suction path 72 opened on the end surface 12 a of the pin 12 at the holding position, and The on-off valve 73 provided in the suction path 72 opened in the end surface 12a is closed. In the laser processing apparatus 1-3 according to the modified example, the end surface 12a of each pin 12 at the holding position sucks and holds the workpiece W in the processing operation.

  According to the laser processing apparatus 1-3 according to the modified example, the pin 12 can be moved up and down between the holding position and the retracted position corresponding to the position of the device D, as in the first and second embodiments. Since the possible chuck table 10-3 is provided, an increase in the processing cost of the workpiece W can be suppressed. Furthermore, according to the laser processing apparatus 1-3 according to the modified example, since each pin 12 at the holding position sucks and holds the workpiece W in the processing operation, the positional deviation of the workpiece W can be suppressed, and the laser beam It is possible to reliably irradiate the LB and LP to a desired position, that is, the planned division line L.

  In addition, this invention is not limited to the said Embodiment 1, Embodiment 2, and a modification. That is, various modifications can be made without departing from the scope of the present invention. For example, the present invention can be applied to a cutting device, a grinding device, a polishing device, or the like as a processing device.

1, 1-2, 1-3 Laser processing equipment (processing equipment)
10, 10-3 Chuck table 10a Holding surface 12 Pin 13 Drive unit 20, 20-2 Laser processing means (processing means)
W Workpiece WS surface (one surface)
WR Back side (one side)
L Divided line D Device

Claims (3)

A processing apparatus comprising: a chuck table that holds a workpiece on a holding surface; and a processing unit that processes the workpiece held on the holding surface of the chuck table,
The chuck table is
A plurality of pins standing up and forming the holding surface by respective tips; and a driving unit that drives each pin to a retracted position below the holding surface and the holding surface,
A processing apparatus for processing a workpiece by a processing means while holding one surface side of the workpiece with the holding surface in a state where a plurality of pins at predetermined positions are lowered to the retracted position.   The processing apparatus according to claim 1, wherein the predetermined position is a position corresponding to a scheduled division line set on a surface of the workpiece.   The processing apparatus according to claim 1, wherein the predetermined position is a position corresponding to a device set on a surface of the workpiece.

Images