JP2017051946A - Electrified powder guide device - Google Patents

Electrified powder guide device Download PDF

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Publication number
JP2017051946A
JP2017051946A JP2016166712A JP2016166712A JP2017051946A JP 2017051946 A JP2017051946 A JP 2017051946A JP 2016166712 A JP2016166712 A JP 2016166712A JP 2016166712 A JP2016166712 A JP 2016166712A JP 2017051946 A JP2017051946 A JP 2017051946A
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conductive element
charged powder
guide device
coated
powder guide
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リン ペイチン
Rin Peichin
リン ペイチン
リウ デジョン
Dezhong Liu
リウ デジョン
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Achrolux Inc
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Achrolux Inc
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/02Processes for applying liquids or other fluent materials performed by spraying
    • B05D1/04Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
    • B05D1/06Applying particulate materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electrostatic Spraying Apparatus (AREA)
  • Coating Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electrified powder guide device capable of uniformly forming a powder layer.SOLUTION: An electrified powder guide device of the present invention includes a body for placing a coating object member and a conductive element provided in a position corresponding to a place for placing the coating object member of the body, and increases powder of sticking to a side surface of the coating object member by finely adjusting the direction of an electric field by the conductive element so that a rise movement route of electrified powder becomes a circular arc shape, and a thickness in respective outer surfaces of the coating object member of the powder substantially coincides, to thereby, attain a desire of a uniformity degree of a suitable powder layer.SELECTED DRAWING: Figure 3

Description

本発明は、ワーク上に均等な粉体層を形成する装置に関し、特に、粉体ガイド装置に関する。   The present invention relates to an apparatus for forming a uniform powder layer on a workpiece, and more particularly to a powder guide apparatus.

電子産業の発展に伴い、電子製品は、構造上においては軽量化および小型化が進み、機能においては高性能、高機能、および高速化の開発が進みつつある。   Along with the development of the electronic industry, electronic products are becoming lighter and smaller in size, and functions are being developed with higher performance, higher functionality, and higher speed.

従来のLEDの製造工程においては、ディスペンサーやスプレーなどの手段により蛍光体が形成される。一般に用いられる塗布方法においては、被塗布部材の各部分に塗布する量を制御することが困難なので、各部分の蛍光体の量は揃えられておらず、すなわち蛍光体の厚みにバラツキがある状況に傾きやすい。   In the conventional LED manufacturing process, the phosphor is formed by means such as a dispenser or spray. In a generally used coating method, it is difficult to control the amount applied to each part of the member to be coated, so the amount of phosphor in each part is not uniform, that is, the thickness of the phosphor varies. Easy to lean on.

また、飛散プレートによるスプレー法を行う場合、図1のように、複数の微細孔(図示せず)を有する飛散プレート10と、前記飛散プレート10の下に設けられている供給部11と、複数の発光ダイオード素子13を保持するチャック部12と、を含み、前記飛散プレート10上に粉体8が載置されている供給装置1が用いられる。   Moreover, when performing the spray method by a scattering plate, as shown in FIG. 1, the scattering plate 10 which has several fine holes (not shown), the supply part 11 provided under the said scattering plate 10, and several And a chuck unit 12 that holds the light emitting diode element 13, and the supply device 1 in which the powder 8 is placed on the scattering plate 10 is used.

供給装置1を使用する際、前記チャック部12を前記飛散プレート10の上に配置し、前記供給部11の側面から供給されるガスにより飛散プレート10の下方に風圧Aが提供され、前記風圧Aが前記飛散プレート10の微細孔を通過して、前記粉体8を前記チャック部12まで飛散させて前記チャック部12に付着させる。   When the supply device 1 is used, the chuck portion 12 is disposed on the scattering plate 10, and the wind pressure A is provided below the scattering plate 10 by the gas supplied from the side surface of the supply portion 11. Passes through the fine holes of the scattering plate 10 and scatters the powder 8 to the chuck portion 12 to adhere to the chuck portion 12.

しかしながら、前記供給装置1では、前記風圧Aは、前記飛散プレート10の下面全体に吹き付け、直接に前記粉体8に当てるが、前記微細孔を通過した風の方向を制御することはできないので、前記風圧Aが前記飛散プレート10を通過すれば、例えば乱流などランダムな流れが生じやすくなり、前記粉体8を均等に飛散させることはできず、前記チャック部12に均等に散布することはできない。このため、粉体8は発光ダイオード素子13に均等に付着することができず、好適な均一度に達することができない。例えば、図2のように、前記発光ダイオード素子13の側面13cに付着した粉体8は僅かであり、前記発光ダイオード13の側面13cにおける前記粉体8の厚さtは、前記発光ダイオード13の上面13aにおける前記粉体8の厚さdと比べて極めて薄くなっている。   However, in the supply device 1, the wind pressure A is sprayed on the entire lower surface of the scattering plate 10 and directly hits the powder 8, but the direction of the wind that has passed through the fine holes cannot be controlled. If the wind pressure A passes through the scattering plate 10, random flow such as turbulent flow is likely to occur, and the powder 8 cannot be evenly scattered, and evenly sprayed on the chuck portion 12. Can not. For this reason, the powder 8 cannot adhere evenly to the light emitting diode elements 13 and cannot reach a suitable uniformity. For example, as shown in FIG. 2, the powder 8 attached to the side surface 13 c of the light emitting diode element 13 is very small, and the thickness t of the powder 8 on the side surface 13 c of the light emitting diode 13 is the same as that of the light emitting diode 13. It is extremely thin compared to the thickness d of the powder 8 on the upper surface 13a.

また、飛散プレート10の微細孔は、寸法が極めて小さく、使用する際に粉体8に詰まされやすく、これにより前記風圧Aが前記飛散プレート10の一部の領域しか通過することはできない。このため、粉体8は前記チャック部12に均等に付着することができず、好適な均一度に達することができない。   Further, the micropores of the scattering plate 10 are extremely small in size and are easily clogged with the powder 8 during use, so that the wind pressure A can only pass through a partial region of the scattering plate 10. For this reason, the powder 8 cannot adhere evenly to the chuck portion 12 and cannot reach a suitable uniformity.

よって、従来の種々の問題を克服することは、解決すべき課題となっている。   Therefore, overcoming various conventional problems is a problem to be solved.

上記従来技術の問題点を鑑みに、本発明は、被塗布部材を載置する本体と、前記本体の前記被塗布部材を載置する箇所に対応する位置に設けられている導電素子と、を含む帯電粉体ガイド装置を提供する。   In view of the problems of the above-described conventional technology, the present invention includes a main body on which a member to be coated is placed, and a conductive element provided at a position corresponding to a position on the main body where the member to be coated is placed. A charged powder guide device is provided.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子は前記本体内に埋設されている。   In one embodiment of the charged powder guide device, the conductive element is embedded in the main body.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子上に設けられ、前記被塗布部材を結合させる結合部材をさらに含む。   In one embodiment of the charged powder guide device, the charging powder guide device further includes a coupling member provided on the conductive element and coupling the member to be coated.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子は金属ブロックまたは電界を誘導可能なブロックである。   In one embodiment of the charged powder guide device, the conductive element is a metal block or a block capable of inducing an electric field.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子は、前記本体と前記被塗布部材が反対側に位置するように前記本体に設けられている。   In one embodiment of the charged powder guide device, the conductive element is provided on the main body so that the main body and the member to be coated are located on opposite sides.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子は、前記被塗布部材を載置する箇所に対応する位置に設けられている貫通穴を有する。また、一実施形態において、前記帯電粉体ガイド装置は、前記導電素子の前記被塗布部材の反対側に設けられている絶縁層をさらに含み、前記貫通穴は前記絶縁層を貫通して延在する。   In one embodiment of the charged powder guide device, the conductive element has a through hole provided at a position corresponding to a place where the member to be coated is placed. In one embodiment, the charged powder guide device further includes an insulating layer provided on the opposite side of the member to be coated of the conductive element, and the through hole extends through the insulating layer. To do.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子の前記被塗布部材の反対側に設けられている導電層をさらに含む。また、前記導電層と前記導電素子とが一体に形成される。   In one embodiment of the charged powder guide device, the conductive powder guide device further includes a conductive layer provided on the opposite side of the member to be coated of the conductive element. The conductive layer and the conductive element are integrally formed.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子と前記導電層において、互いに連通する貫通穴が前記被塗布部材を載置する箇所に対応する位置に設けられている。   In one embodiment of the charged powder guide device, in the conductive element and the conductive layer, a through hole communicating with each other is provided at a position corresponding to a place where the member to be coated is placed.

導電層を備える別の実施形態において、前記導電素子が前記本体内に埋設されており、前記帯電粉体ガイド装置は、前記帯電粉体に電気的に反発する極性を有し、前記導電素子の周囲に位置するように前記本体内に埋設されるスペーサをさらに含む。また、前記帯電粉体ガイド装置は、前記導電素子に設けられ、前記被塗布部材を結合させる結合部材と、前記本体または前記導電層に設けられ、前記結合部材を前記導電素子に位を決めする位置決め部とをさらに含んでもよい。   In another embodiment including a conductive layer, the conductive element is embedded in the main body, and the charged powder guide device has a polarity electrically repelling the charged powder, It further includes a spacer embedded in the main body so as to be located in the periphery. The charged powder guide device is provided on the conductive element, and is provided on the main body or the conductive layer for coupling the member to be coated, and determines the position of the coupling member on the conductive element. And a positioning unit.

前記帯電粉体ガイド装置の一実施形態において、前記導電素子の幅と前記被塗布部材の幅との比は0.7〜1.5である。   In one embodiment of the charged powder guide device, a ratio of the width of the conductive element to the width of the member to be coated is 0.7 to 1.5.

また、前記帯電粉体ガイド装置の一実施形態において、前記導電素子の周囲に位置するように前記本体に設けられているスペーサをさらに含む。   The charged powder guide apparatus may further include a spacer provided on the main body so as to be positioned around the conductive element.

上記のように、本発明の帯電粉体ガイド装置によれば、前記帯電粉体の上昇移動ルートが円弧形状になるように、前記導電素子により前記電界の方向が微調整され、従来と比べて、前記被塗布部材の側面に付着する粉体を増加させ、前記被塗布部材の各外表面における前記粉体の厚みがほぼ一致になり、好適な粉体層の均一度の要望が達成される。   As described above, according to the charged powder guide device of the present invention, the direction of the electric field is finely adjusted by the conductive element so that the ascending movement route of the charged powder becomes an arc shape. The powder adhering to the side surface of the member to be coated is increased, and the thickness of the powder on each outer surface of the member to be coated is substantially the same, so that the demand for suitable uniformity of the powder layer is achieved. .

従来の供給装置を示す断面図である。It is sectional drawing which shows the conventional supply apparatus. 図1の局所拡大図である。It is a local enlarged view of FIG. 本発明に係る帯電粉体ガイド装置を備える静電沈着装置を示す断面図である。It is sectional drawing which shows an electrostatic deposition apparatus provided with the charged powder guide apparatus which concerns on this invention. 図3に示す帯電粉体ガイド装置の局所拡大図である。It is a local enlarged view of the charged powder guide apparatus shown in FIG. 本発明に係る帯電粉体ガイド装置の一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。It is sectional drawing which shows different embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。It is sectional drawing which shows different embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。It is sectional drawing which shows different embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。It is sectional drawing which shows different embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。It is sectional drawing which shows different embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の他の実施形態を示す断面図である。It is sectional drawing which shows other embodiment of the charged powder guide apparatus which concerns on this invention. 本発明に係る帯電粉体ガイド装置の他の実施形態を示す断面図である。It is sectional drawing which shows other embodiment of the charged powder guide apparatus which concerns on this invention.

本発明の実施形態について、特定の実施形態を用いて次のように説明する。また、当分野を熟知する者であれば、本明細書の開示内容により本発明の他の利点および効果を明かせるだろう。   Embodiments of the present invention are described as follows using specific embodiments. In addition, those skilled in the art will appreciate other advantages and benefits of the present invention based on the disclosure herein.

なお、本明細書に添付の図面に示されている構造や、スケール、サイズなどは、単にこの分野における技術の熟練者に容易に理解されるために本明細書の開示内容に合わせたものであり、本発明を制限するものではないので、実際の応用に異なる場合があり、本発明が奏する効果および達成する目的に影響しない限り、いかなる構造上の修飾、スケール関係の変更またはサイズの調整を行うことができ、これらも本発明の技術的内容の範囲に含まれることに留意すべきである。また、本明細書に記載されている「上」や、「第一」、「第二」、「一」などの用語は、単に説明の便宜上用いられる用語であり、本発明を限定するものではなく、技術的内容を実質的に変更しない限り、その相対関係の変更や調整も本発明の範囲に含まれるものと見なされる。   Note that the structure, scale, size, and the like shown in the drawings attached to this specification are merely adapted to the disclosure of this specification so that they can be easily understood by those skilled in the art. Yes, it does not limit the present invention and may vary in actual application, so any structural modifications, scale changes or size adjustments may be made as long as they do not affect the effect and purpose of the present invention. It should be noted that these can be performed and are within the scope of the technical content of the present invention. In addition, terms such as “above”, “first”, “second”, “one” and the like described in this specification are simply used for convenience of explanation, and do not limit the present invention. In addition, unless the technical contents are substantially changed, changes and adjustments of the relative relationship are considered to be included in the scope of the present invention.

本発明の以下の実施形態において、発振源を、パルスの伝導、流体の動力、音波、または超音波など帯電粉体を振動させうるいかなる作用力を発生するものとし、被塗布部材をLED素子とするが、これに限定されない。   In the following embodiments of the present invention, the oscillation source is assumed to generate any acting force that can vibrate charged powder such as pulse conduction, fluid power, sound wave, or ultrasonic wave, and the member to be coated is an LED element. However, it is not limited to this.

また、本発明は、風圧により帯電粉体を沈着箇所に運搬するのではなく、発振源により静止の帯電粉体や積載部に載置されている帯電粉体を飛散させ、積載部上の同極性の電界により、飛散した帯電粉体を沈着箇所に付着させて均等な粉体層を形成し、好ましくは、振動による飛散の高度を考量して帯電粉体をより均等な粉体層を形成させるものである。   In addition, the present invention does not transport the charged powder to the deposition site by wind pressure, but scatters the stationary charged powder or the charged powder placed on the stacking section by the oscillation source, and the same on the stacking section. Polarized electric field causes scattered charged powder to adhere to the deposition site to form a uniform powder layer, and preferably forms a more uniform powder layer of charged powder by taking into account the degree of scattering caused by vibration It is something to be made.

図3のように、帯電粉体ガイド装置2は積載部5と発振源6とを合わせて使用するものである。   As shown in FIG. 3, the charged powder guide device 2 uses the stacking unit 5 and the oscillation source 6 together.

前記積載部5は、対向する第一側5aと第二側5bとを有し、前記積載部5の第一側5aには、粉体9が載置されている。   The stacking unit 5 has a first side 5a and a second side 5b facing each other, and powder 9 is mounted on the first side 5a of the stacking unit 5.

本実施形態において、粉体9は複数の粉粒体90と接着材91とを含み、例えば、接着材91は、固体の顆粒状であり、粉粒体90に接着または離間してもよく、あるいは粉粒体90を包み込んでもよい。また、粉粒体90は、例えば、蛍光粉やナノチューブ、量子ドット、カーボンチューブ、グラフェンなどの粉粒体であってもよい。   In the present embodiment, the powder 9 includes a plurality of powder particles 90 and an adhesive material 91. For example, the adhesive material 91 is a solid granule, and may be adhered or separated from the powder material 90, Or you may enclose the granular material 90. FIG. The powder body 90 may be a powder body such as fluorescent powder, nanotube, quantum dot, carbon tube, graphene, or the like.

前記発振源6は、積載部5の第二側5bから離間した場所に位置されており、前記積載部5を発振させて前記第一側5a上の粉粒体90と接着材91とを振動させる。他の実施形態において、発振源6は、積載部5の第二側5bに接触しても良く、例えば、パルス発振装置やカム装置、吐水装置であってもよい。   The oscillation source 6 is located at a location separated from the second side 5b of the stacking unit 5 and oscillates the stacking unit 5 to vibrate the powder particles 90 and the adhesive 91 on the first side 5a. Let In another embodiment, the oscillation source 6 may be in contact with the second side 5b of the stacking unit 5, and may be, for example, a pulse oscillation device, a cam device, or a water discharge device.

前記帯電粉体ガイド装置2は、積載部5の第一側5aの上方から離間した場所に位置されており、帯電粉粒体90と接着材91とを受けとめるものなので、例えばLED素子などの被塗布部材に帯電粉粒体90と接着材91とを沈着させるために、帯電粉体ガイド装置2に被塗布部材23が載置される。   The charged powder guide device 2 is positioned away from the upper side of the first side 5a of the loading unit 5 and receives the charged powder particles 90 and the adhesive 91. In order to deposit the charged powder particles 90 and the adhesive 91 on the applying member, the member 23 to be applied is placed on the charged powder guide device 2.

複数の被塗布部材23に適用する実施形態において、帯電粉体ガイド装置2は、本体20と、被塗布部材23を載置する箇所に対応して本体20に埋設される複数の離間している導電素子21と、本体20に設けられ、被塗布部材23を結合させる結合部材22と、を含む。具体的に、本体20は絶縁体であり、導電素子21は金属ブロックや電界を誘導可能な他のブロックであり、結合部材22は熱剥離型フィルムやテープであってもよいが、これらに限定されない。   In the embodiment applied to the plurality of coated members 23, the charged powder guide device 2 is separated from the main body 20 by a plurality of spaces embedded in the main body 20 corresponding to the places where the coated members 23 are placed. It includes a conductive element 21 and a coupling member 22 that is provided on the main body 20 and couples the member 23 to be coated. Specifically, the main body 20 is an insulator, the conductive element 21 is a metal block or another block capable of inducing an electric field, and the coupling member 22 may be a heat peelable film or tape, but is not limited thereto. Not.

結合部材22によって被塗布部材23が導電素子21に対応する位置に結合された場合に、図3に示す静電沈着装置を作動すると、前記積載部5に直流高圧電が通電されて電界が発生され、粉粒体90と接着材91に電荷(例えばマイナス電荷、図に示す「−」)を帯びさせる。また、帯電粉体ガイド装置2に積載部5と同極性の電界を発生させて、導電素子21に異極性の電界(本実施形態の場合はプラスの電界)を発生させる。そして、発振源6を作動して発振源6による作用力を積載部5に伝達して積載部5を振動させて、第一側5aに載置されている帯電粉粒体90と接着材91とを飛散させる。電界により帯電粉粒体90と接着材91とが第一側5aから離れ、帯電粉体ガイド装置2までに上昇し、接着材91により帯電粉粒体90が被塗布部材23に付着される。   When the member 23 to be coated is coupled to the position corresponding to the conductive element 21 by the coupling member 22, when the electrostatic deposition apparatus shown in FIG. 3 is operated, a DC high voltage is applied to the stacking unit 5 to generate an electric field. Then, the particles 90 and the adhesive 91 are charged with a charge (for example, a negative charge, “−” shown in the figure). Further, an electric field having the same polarity as that of the loading unit 5 is generated in the charged powder guide device 2, and an electric field having a different polarity (a positive electric field in this embodiment) is generated in the conductive element 21. Then, the oscillation source 6 is operated to transmit the acting force of the oscillation source 6 to the stacking unit 5 to vibrate the stacking unit 5, and the charged powder particles 90 and the adhesive 91 placed on the first side 5 a. And scatter. The charged powder particles 90 and the adhesive 91 are separated from the first side 5 a by the electric field and rise to the charged powder guide device 2, and the charged powder particles 90 are attached to the coated member 23 by the adhesive 91.

これにより、発振源6が積載部5を振動させ、間接的に帯電粉粒体90と接着材91とを動かして、帯電粉粒体90と接着材91とが振動により飛散され、電界の誘導により被塗布部材23に付着し、つまり、静電力または電界力により積載部5と帯電粉体ガイド装置2との間に上向きの作用力が増加され、かつ積載部5と帯電粉体ガイド装置2との間には、上向きの作用力を干渉する他の外力(例えば従来の風圧)はないので、帯電粉粒体90と接着材91の移動方向(すなわち上向き)を有効に制御することができ、各振動箇所で振動により飛散された帯電粉粒体90と接着材91の飛散高度が一致なので、被塗布部材23に付着する粉粒体90の均一度が確保される。   As a result, the oscillation source 6 vibrates the stacking unit 5 and indirectly moves the charged powder particles 90 and the adhesive 91 so that the charged powder particles 90 and the adhesive 91 are scattered by the vibration, thereby inducing an electric field. Adheres to the member to be coated 23, that is, an upward acting force is increased between the loading portion 5 and the charged powder guide device 2 by electrostatic force or electric field force, and the loading portion 5 and the charged powder guide device 2 Since there is no other external force (for example, conventional wind pressure) that interferes with the upward acting force, the moving direction (that is, upward) of the charged powder particles 90 and the adhesive 91 can be controlled effectively. Since the charged powder particles 90 scattered by vibration at each vibration location and the scattering height of the adhesive 91 coincide with each other, the uniformity of the powder particles 90 attached to the member to be coated 23 is ensured.

また、積載部5と帯電粉体ガイド装置2の電界の極性を一致させるように、積載部5に電荷を供給する給電装置(図示せず)を積載部5の第一側5aに設けてもよく、また、別の実施形態として、外部の給電装置と電気的に接続することなく、積載部5そのものには給電装置が備えられている。   Further, a power supply device (not shown) for supplying electric charges to the stacking unit 5 may be provided on the first side 5a of the stacking unit 5 so that the polarities of the electric fields of the stacking unit 5 and the charged powder guide device 2 are matched. In addition, as another embodiment, the stacking unit 5 itself includes a power feeding device without being electrically connected to an external power feeding device.

他の実施形態において、積載部5にプラスの電界を帯電させてもよく、この場合、帯電粉体ガイド装置2にはプラスの電界、導電素子21にはマイナスの電界を帯電させるまたはグラウンドに接続することになる。   In another embodiment, the loading unit 5 may be charged with a positive electric field. In this case, the charged powder guide device 2 is charged with a positive electric field, and the conductive element 21 is charged with a negative electric field or connected to the ground. Will do.

本発明の帯電粉体ガイド装置2によれば、被塗布部材23を載置する箇所に対応する位置に導電素子21が設けられることにより、電界の方向が調整され、帯電粉粒体90と接着材91の上昇移動ルートが円弧形状Sになり、粉体9を被塗布部材23の側面23cに大量に付着させることができ、図4のように、被塗布部材23の側面23cにおける粉体9の厚さと被塗布部材23の上面23aにおける粉体9の厚さがほぼ一致になり、好適な粉体層の均一度の要望が達成される。   According to the charged powder guide device 2 of the present invention, the conductive element 21 is provided at a position corresponding to the place where the coated member 23 is placed, so that the direction of the electric field is adjusted and the charged powder particles 90 are bonded. The upward movement route of the material 91 has an arcuate shape S, and a large amount of the powder 9 can be attached to the side surface 23c of the member to be coated 23, and the powder 9 on the side surface 23c of the member to be coated 23 as shown in FIG. And the thickness of the powder 9 on the upper surface 23a of the member 23 to be coated are substantially the same, and a desired uniformity of the powder layer is achieved.

また、電界方向の調整に寄与するように、導電素子21の幅rは、概ね被塗布部材23の幅wの0.7〜1.5倍(すなわち、r=0.7w〜1.5w)であるのが好ましい。   Further, the width r of the conductive element 21 is approximately 0.7 to 1.5 times the width w of the member to be coated 23 (that is, r = 0.7 w to 1.5 w) so as to contribute to the adjustment of the electric field direction. Is preferred.

図5A〜5Fは、本発明に係る帯電粉体ガイド装置の異なる実施形態を示す断面図である。   5A to 5F are sectional views showing different embodiments of the charged powder guide device according to the present invention.

図5Aのように、帯電粉体ガイド装置3aは、本体30と、被塗布部材23を載置する箇所に対応して前記本体30に設けられている複数の離間している導電素子21と、導電素子21に設けられ、被塗布部材23を結合させる結合部材22とを含む。具体的に、導電素子21は金属ブロックや電界を誘導可能な他のブロックであり、結合部材22は熱剥離型フィルムやテープであってもよいが、これに限定されない。   As shown in FIG. 5A, the charged powder guide device 3 a includes a main body 30, a plurality of spaced apart conductive elements 21 provided on the main body 30 corresponding to places where the member 23 to be coated is placed, And a coupling member 22 that is provided in the conductive element 21 and couples the member 23 to be coated. Specifically, the conductive element 21 may be a metal block or another block capable of inducing an electric field, and the bonding member 22 may be a heat peelable film or a tape, but is not limited thereto.

本実施形態において、被塗布部材23の結合を安定させるように、各導電素子21には、少なくとも結合部材22を真空吸引する一つの貫通穴32が設けられており、また、本体30には真空吸引装置を含んでいてもよい。   In the present embodiment, each conductive element 21 is provided with at least one through hole 32 for vacuum-suctioning the coupling member 22 so as to stabilize the coupling of the member 23 to be coated. A suction device may be included.

図5Bのように、帯電粉体ガイド装置3bは、本体20と、被塗布部材23を載置する箇所に対応して前記本体20に埋設される複数の離間している導電素子21と、を含み、導電素子21は金属ブロックや電界を誘導可能な他のブロックであってもよいが、これに限定されない。   As shown in FIG. 5B, the charged powder guide device 3b includes a main body 20 and a plurality of spaced-apart conductive elements 21 embedded in the main body 20 corresponding to the place where the member 23 to be coated is placed. In addition, the conductive element 21 may be a metal block or another block capable of inducing an electric field, but is not limited thereto.

本実施形態において、導電素子21には、被塗布部材23を真空吸引する貫通穴32が設けられており、前記貫通穴32には真空吸引装置(図示なし)が連通されている。   In the present embodiment, the conductive element 21 is provided with a through hole 32 for vacuum suction of the coated member 23, and a vacuum suction device (not shown) is communicated with the through hole 32.

図5Cのように、帯電粉体ガイド装置3cは、図5Bの構造に絶縁層31が増設されるものである。具体的に、絶縁層31は、導電素子21の被塗布部材23の反対側に本体20および導電素子21に設けられている。また、被塗布部材23を真空吸引する貫通穴32は、絶縁層31を貫通して延在する。   As shown in FIG. 5C, the charged powder guide device 3c is obtained by adding an insulating layer 31 to the structure of FIG. 5B. Specifically, the insulating layer 31 is provided in the main body 20 and the conductive element 21 on the opposite side of the conductive element 21 to the coated member 23. Further, the through hole 32 for vacuum-suctioning the member to be coated 23 extends through the insulating layer 31.

図5Dのように、帯電粉体ガイド装置3dは、図5Bの構造に導電層33が増設されるものである。具体的に、導電層33は、導電素子21の被塗布部材23の反対側に本体20および導電素子21に設けられている板材である。この場合、導電素子21および導電層33には上記貫通穴32が形成されていない。   As shown in FIG. 5D, the charged powder guide device 3d is obtained by adding a conductive layer 33 to the structure of FIG. 5B. Specifically, the conductive layer 33 is a plate material provided on the main body 20 and the conductive element 21 on the opposite side of the member to be coated 23 of the conductive element 21. In this case, the through hole 32 is not formed in the conductive element 21 and the conductive layer 33.

本実施形態において、導電層33と導電素子21が一体に形成されるので、製造にあたって、導電性の板材から一部を切削してバンプを形成し、このバンプを導電素子21として用いてもよい。   In the present embodiment, since the conductive layer 33 and the conductive element 21 are integrally formed, a bump may be formed by cutting a part from a conductive plate material in manufacturing, and the bump may be used as the conductive element 21. .

また、図5Eのように、帯電粉体ガイド装置3eに上記貫通穴32を形成してもよく、すなわち、導電素子21と導電層33に、被塗布部材23を載置する箇所に対応する位置に互いに連通する貫通穴32を設けてもよい。   Further, as shown in FIG. 5E, the through hole 32 may be formed in the charged powder guide device 3e, that is, a position corresponding to a place where the member 23 to be coated is placed on the conductive element 21 and the conductive layer 33. A through hole 32 communicating with each other may be provided.

図5Fのように、帯電粉体ガイド装置3fには、導電素子21が本体20内に埋設されており、さらに、帯電粉体に電気的に反発する極性を有し導電素子21の周囲に位置するように本体20内に埋設されるスペーサ40と、導電素子21および本体20に設けられ、被塗布部材23を結合させる結合部材22と、本体20または導電層33に設けられている位置決め部34と、を含む。前記位置決め部34は、記号であってもよく、図5Fに示される凹部または結合部材を導電素子に位置決めするいかなる手段であってもよい。図5Fに示す実施形態では、結合部材22の凸部221が挿入する箇所が位置を決める位置決め部34になる。   As shown in FIG. 5F, in the charged powder guide device 3f, the conductive element 21 is embedded in the main body 20, and has a polarity that electrically repels the charged powder and is positioned around the conductive element 21. The spacer 40 embedded in the main body 20, the conductive element 21 and the main body 20, the coupling member 22 for coupling the member to be coated 23, and the positioning portion 34 provided on the main body 20 or the conductive layer 33. And including. The positioning portion 34 may be a symbol, and may be any means for positioning the recess or the coupling member shown in FIG. 5F on the conductive element. In the embodiment shown in FIG. 5F, the position where the convex portion 221 of the coupling member 22 is inserted becomes the positioning portion 34 that determines the position.

図6Aは、本発明に係る帯電粉体ガイド装置の他の実施形態を示す断面図である。   FIG. 6A is a sectional view showing another embodiment of the charged powder guide device according to the present invention.

図6Aのように、帯電粉体ガイド装置4aは、本体20と、被塗布部材23を載置する箇所に対応して前記本体20に埋設される複数の離間している導電素子21と、導電素子21の周囲に位置するように本体20に設けられているスペーサ40と、を含む。   As shown in FIG. 6A, the charged powder guide device 4a includes a main body 20, a plurality of spaced-apart conductive elements 21 embedded in the main body 20 corresponding to the place where the member 23 to be coated is placed, And a spacer 40 provided on the main body 20 so as to be positioned around the element 21.

本実施形態において、スペーサ40は被塗布部材23の側面を囲み帯電粉体に電気的に反発する極性を有するので、被塗布部材23の側面への粉体の付着に寄与する。具体的に、図6Aのように、粉体はマイナスの極性を帯びており、導電素子21はグラウンドに接続またはプラスの極性を帯びてもよく、スペーサ40もマイナスの極性を帯びているので、スペーサ40に近づくにつれ、粉体が電気的反発力により強引に被塗布部材23の側面に付着される。   In the present embodiment, the spacer 40 surrounds the side surface of the member to be coated 23 and has a polarity that electrically repels the charged powder, thereby contributing to the adhesion of the powder to the side surface of the member to be coated 23. Specifically, as shown in FIG. 6A, the powder has a negative polarity, the conductive element 21 may be connected to the ground or have a positive polarity, and the spacer 40 also has a negative polarity. As the spacer 40 is approached, the powder is forcibly attached to the side surface of the member to be coated 23 by the electric repulsive force.

また、図6Bに示す具体的な実施形態において、帯電粉体が被塗布部材23の側面に付着する具合を調整するように、帯電粉体ガイド装置4bの導電素子21とスペーサ40はともに本体20内に埋設されてもよい。   In the specific embodiment shown in FIG. 6B, both the conductive element 21 and the spacer 40 of the charged powder guide device 4b are adjusted to adjust the degree of the charged powder adhering to the side surface of the coated member 23. It may be embedded inside.

上記実施形態は単に本発明の原理および効果を例示的に説明するものであり、本発明を限定するものではない。この分野における技術の熟練者であれば、本発明の精神および意旨から逸脱しない範囲において、前記実施形態を変更することができる。したがって、本発明の範囲は、請求の範囲に記載されるものである。   The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. A person skilled in the art in this field can change the embodiment without departing from the spirit and spirit of the present invention. Accordingly, the scope of the present invention is as set forth in the appended claims.

1…供給装置、10…飛散プレート、11…供給部、12…チャック部、13…発光ダイオード素子、2,3a,3b,3c,3d,3e,3f,4a,4b…帯電粉体ガイド装置、20,30…本体、21…導電素子、22…結合部材、221…凸部、23…被塗布部材、13a,23a…上面、13c,23c…側面、31…絶縁層、32…貫通穴、33…導電層、34…位置決め部、40…スペーサ、5…積載部、5a…第一側、5b…第二側、6…発振源、8,9…粉体、90…粉粒体、91…接着材、A…風圧、S…円弧形状、d,t…厚さ、w,r…幅   DESCRIPTION OF SYMBOLS 1 ... Supply apparatus, 10 ... Scattering plate, 11 ... Supply part, 12 ... Chuck part, 13 ... Light emitting diode element, 2, 3a, 3b, 3c, 3d, 3e, 3f, 4a, 4b ... Charged powder guide apparatus, DESCRIPTION OF SYMBOLS 20,30 ... Main body, 21 ... Conductive element, 22 ... Coupling member, 221 ... Convex part, 23 ... Coated member, 13a, 23a ... Upper surface, 13c, 23c ... Side surface, 31 ... Insulating layer, 32 ... Through-hole, 33 ... conductive layer 34 ... positioning part 40 ... spacer 5 ... stacking part 5a ... first side 5b ... second side 6 ... oscillation source 8,9 ... powder, 90 ... powder body, 91 ... Adhesive, A ... wind pressure, S ... arc shape, d, t ... thickness, w, r ... width

Claims (14)

被塗布部材を載置する本体と、
前記本体の前記被塗布部材を載置する箇所に対応する位置に設けられている導電素子と、
を含む帯電粉体ガイド装置。
A main body on which the member to be coated is placed;
A conductive element provided at a position corresponding to a place on which the coated member of the main body is placed;
Including a charged powder guide device.
前記導電素子は前記本体内に埋設されている、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, wherein the conductive element is embedded in the main body. 前記導電素子に設けられ、前記被塗布部材を結合させる結合部材をさらに含む、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, further comprising a coupling member that is provided on the conductive element and couples the member to be coated. 前記導電素子は金属ブロックまたは電界を誘導可能なブロックである、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, wherein the conductive element is a metal block or a block capable of inducing an electric field. 前記導電素子は、前記本体と前記被塗布部材が反対側に位置するように前記本体に設けられている、請求項1に記載の帯電粉体ガイド装置。   2. The charged powder guide device according to claim 1, wherein the conductive element is provided on the main body such that the main body and the member to be coated are located on opposite sides. 前記導電素子は、前記被塗布部材を載置する箇所に対応する位置に設けられている貫通穴を有する、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, wherein the conductive element has a through hole provided at a position corresponding to a place where the member to be coated is placed. 前記導電素子の前記被塗布部材の反対側に設けられている絶縁層をさらに含み、前記貫通穴は前記絶縁層を貫通して延在する、請求項6に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 6, further comprising an insulating layer provided on a side of the conductive element opposite to the member to be coated, wherein the through hole extends through the insulating layer. 前記導電素子の前記被塗布部材の反対側に設けられている導電層をさらに含む、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide apparatus according to claim 1, further comprising a conductive layer provided on an opposite side of the member to be coated of the conductive element. 前記導電層と前記導電素子とが一体に形成されている、請求項8に記載の帯電粉体ガイド装置。   The charged powder guide apparatus according to claim 8, wherein the conductive layer and the conductive element are integrally formed. 前記導電素子と前記導電層において、互いを連通する貫通穴が前記被塗布部材を載置する箇所に対応する位置に設けられている、請求項8に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 8, wherein in the conductive element and the conductive layer, a through hole communicating with each other is provided at a position corresponding to a place where the member to be coated is placed. 前記導電素子が前記本体内に埋設され、
前記帯電粉体に電気的に反発する極性を有し、前記導電素子の周囲に位置するように前記本体内に埋設されているスペーサをさらに含む、請求項8に記載の帯電粉体ガイド装置。
The conductive element is embedded in the body;
The charged powder guide device according to claim 8, further comprising a spacer that is electrically repelled by the charged powder and is embedded in the main body so as to be positioned around the conductive element.
前記導電素子に設けられ、前記被塗布部材を結合させる結合部材と、
前記本体または前記導電層に設けられ、前記結合部材を前記導電素子に位置決めする位置決め部と
をさらに含む、請求項11に記載の帯電粉体ガイド装置。
A coupling member provided in the conductive element and coupling the coated member;
The charged powder guide device according to claim 11, further comprising a positioning portion that is provided on the main body or the conductive layer and positions the coupling member on the conductive element.
前記導電素子の幅と前記被塗布部材の幅の比は0.7〜1.5である、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, wherein a ratio of a width of the conductive element to a width of the member to be coated is 0.7 to 1.5. 前記帯電粉体に電気的に反発する極性を有し、前記導電素子の周囲に位置するように前記本体に設けられているスペーサをさらに含む、請求項1に記載の帯電粉体ガイド装置。   The charged powder guide device according to claim 1, further comprising a spacer having a polarity that is electrically repelled by the charged powder and provided on the main body so as to be positioned around the conductive element.
JP2016166712A 2015-09-07 2016-08-29 Electrified powder guide device Pending JP2017051946A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320067A (en) * 1993-05-17 1994-11-22 Nippon Parkerizing Co Ltd Electrostatic powder coating device
WO1999065136A1 (en) * 1998-06-10 1999-12-16 Delsys Pharmaceutical Corporation Chuck apparatus for clamping a planar substrate in an electrostatic coating method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9586216B2 (en) * 2013-10-28 2017-03-07 Achrolux Inc. Charged powder supply device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06320067A (en) * 1993-05-17 1994-11-22 Nippon Parkerizing Co Ltd Electrostatic powder coating device
WO1999065136A1 (en) * 1998-06-10 1999-12-16 Delsys Pharmaceutical Corporation Chuck apparatus for clamping a planar substrate in an electrostatic coating method

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