JPH10229090A - Grain arranging method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To allow a force for holding grains at predetermined positions and force for separating/removing unwanted grains to be applied simultaneously once and arrange only required grains in predetermined holes. SOLUTION: One substrate 10 has grain filling and arranging holes 11, another substrate 20 has parallel electrodes 21 for generating a moving electric field for moving the grains and the electrodes have an insulation layer to avoid direct contact. The grains between the substrates 10, 20 move by the moving electric field generated by voltages applied one by one to the electrodes 21 to pass over holes 11 and enter the holes 11 by the assist of the gravitation, negative voltage, electrostatic force or magnetic force to fill and arrange them therein.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a particle arranging apparatus, more particularly, for example, in a case where a solder ball is joined to a pad adjacent to a semiconductor element, has a hole in which the solder ball enters in the same arrangement as the pad. The present invention relates to a device for supplying and arranging solder balls to a jig.

[0002]

2. Description of the Related Art Methods for transporting and arranging particles include a method using compressed air or fluid, a method using a magnetic field, a method using vibration, a method using an electrostatic field, and the like. The method using an electrostatic field has excellent features such as a wider range of transportable particles and lower energy consumption than other methods.

[0003]

However, all of the conventional particle conveying apparatuses may not be arranged at a required place due to particle aggregation or adhesion, or extra particles may be arranged. Further, there is a problem that particles having a small specific gravity or minute particles such as metal plating resin particles may be scattered.

The present invention has been made in view of the above-mentioned circumstances, and a force for preserving particles in a predetermined position and a force for separating and eliminating unnecessary particles can be simultaneously applied. The purpose of the present invention is to provide a particle arrangement device that passes through a predetermined hole.

[0005]

According to the first aspect of the present invention, a moving electric field is formed by applying a voltage to each of the electrodes formed in parallel in a predetermined order, and fine particles are formed by the force of the moving electric field. Moving, dropping the particles into the opening formed at the predetermined position during the movement, thereby arranging the particles at the predetermined position. It is intended to realize an accurate particle arrangement at high speed.

According to a second aspect of the present invention, an opening is formed at a predetermined position for arranging the fine particles at a predetermined position, and the first substrate sucking the fine particles from a back surface; An insulating second substrate is disposed opposite (parallel) with a predetermined gap on the substrate, and a plurality of electrodes for generating an electric field are disposed on the back surface, and a voltage is sequentially applied to the electrodes. Moving the microparticles in the gap between the two substrates by a moving electric field generated thereby, and holding the particles in the apertures by a suction force acting on the apertures of the first substrate. In addition, a moving electric field is generated by the parallel electrodes, the number of mechanical parts is small, and the apparatus can be miniaturized.

According to a third aspect of the present invention, fine particles mounted on a substrate having holes provided at predetermined positions on the electrodes formed in parallel so as to penetrate the electrodes are applied to each of the electrodes. A moving electric field is formed by applying a voltage in the order described above, the fine particles are moved by the force of the moving electric field, and the particles are dropped into the openings formed at the predetermined positions during the movement, so that the particles are at the predetermined position. Are arranged,
Thus, the structure is simplified by providing the particle arrangement holes on the electrodes.

According to a fourth aspect of the present invention, in the third aspect of the present invention, a counter substrate having a parallel electrode formed thereon is provided so as to face the substrate having the holes. By providing electrodes, more detailed control of the particle behavior is made possible.

According to a fifth aspect of the present invention, in the fourth aspect of the invention, the parallel electrodes on the counter substrate are formed in a direction perpendicular to the parallel electrodes of the substrate having the through holes. Thus, the electrodes are formed in a matrix,
This enables two-dimensional particle movement control to prevent scattering and improve the packing ratio.

According to a sixth aspect of the present invention, in the fourth aspect of the present invention, the parallel electrodes on the opposing substrate are formed in the same direction as the parallel electrodes of the substrate having the through holes, and overlap at the same pitch. It is characterized by being opposed by position, so that the upper and lower electrodes are at the same potential at the same time, so that the particles can be moved more reliably than in the case of only one side, furthermore, adding vertical movement, This is to prevent aggregation of particles.

According to a seventh aspect of the present invention, in the fourth aspect, the pitch of the parallel electrodes on the substrate facing each other is the same as the pitch of the parallel electrodes of the substrate having the through hole, and
/ 2 pitch shifted,
Accordingly, the electrodes are arranged in a staggered structure, the electrode pitch in the moving direction is small, and smooth particle movement is possible.

According to an eighth aspect of the present invention, in the fifth aspect of the present invention, a voltage is sequentially applied from the outside (both ends) to the center of the parallel electrode on the counter substrate separately from the moving electric field during the movement arrangement of the particles. Thus, an electric field that moves from both ends to the center is formed, so that electrostatic force for collecting the particles at the center is activated, thereby preventing the particles from scattering.

According to a ninth aspect of the present invention, in the sixth aspect of the present invention, the voltage is applied in such a manner that particles are moved and arranged by alternately applying voltages to the electrodes of both substrates.
Thus, the electrostatic force is applied so that the particles move while moving up and down by ピ ッ チ pitch at a time, so that the particles are moved smoothly, and the agglomeration of the particles is prevented by the up and down movement to improve the packing ratio. .

According to a tenth aspect of the present invention, in the sixth aspect of the present invention, the opposing electrodes are paired, and an alternating electric field is formed by inverting the polarity of the applied voltage between the paired electrodes. In this method, the particles are moved and arranged by sequentially moving the particles, whereby the particles are vibrated by the alternating power to prevent the particles from aggregating and to improve the packing ratio.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION

[Invention of Claim 1] FIG. 1 is a schematic configuration diagram showing a basic configuration of a particle arrangement device according to the present invention. In the drawing, reference numeral 10 denotes a particle arrangement substrate having through holes 11 in which fine particles are arranged.
Reference numeral 0 denotes a substrate arranged opposite to the particle array substrate 10, and 30 denotes a perforated plate. As shown in the drawing, one of the two substrates 10, 20 has a hole 11 for particle filling array, On the other substrate 20, a parallel electrode 21 for generating a moving electric field for moving particles is formed, and the electrode 21 has an insulating layer so as not to come into direct contact with the particles.

FIG. 2 is a conceptual diagram for explaining a method of generating a moving magnetic field by the parallel electrodes 21 on the substrate 20 shown in FIG. 1. As shown in FIG.
1 is connected to some common electrodes (three common electrodes, in FIG. 2) at an end portion.
By applying a voltage in this order (the other electrodes are turned off while one voltage is being applied), an electric field that moves continuously in the direction of the arrow is formed. The movement of the electric field causes the particles supplied between the substrates 10 and 20 to move. The particles pass through the opening 11 during the movement, and the particles enter the opening 11 and are arranged by filling with the aid of gravity, negative pressure, electrostatic force, magnetic force and the like.

FIG. 3 is a schematic diagram showing a main part of a second embodiment of the present invention. As shown in FIG. 3, parallel electrodes 21 are formed on a polyimide substrate 20 at a pitch of 100 μm. It is formed and divided into three groups as described above, and the ends are connected to the common electrode. A metal mask 10 (nickel, 50 μm thick) provided with a through hole 11 having a diameter of 50 μm at a predetermined position is arranged at intervals of 50 μm or more. The suction is performed by bringing the perforated plate 30 into contact with the back surface of the metal mask 10 (FIG. 3A). Metal mask 10 and substrate 20
Particles 40 (micropearl: Sekisui Fine Chemical Co., Ltd.) having a diameter of 40 μm are arranged between the electrodes, and a voltage of 500 V is sequentially applied to the common electrode for 100 ms. Thereby, the particles 40
Moves in the direction of the arrow, and the particles 40 are filled and arranged in the through holes 11. FIG. 3B shows an example in which a substrate including an insulating plate 31 and an electrode 32 is used instead of the perforated plate 30, and the particles 40 are electrostatically attracted. FIG. 3 (C) shows an arrangement in which an electromagnet 34 is provided via a silicon rubber device 33, and the electromagnet is attracted using the magnetic force of the electromagnet. In addition,
In the case of the example of FIGS. 3B and 3C, an interval of 50 ms is provided when switching the electrode to which the voltage is applied,
During this time, the electrostatic force and the magnetic force work.

FIG. 4 is a block diagram of a principal part for explaining an embodiment of the third aspect of the present invention.
As shown in FIG. 5, parallel electrodes 51 are formed on a polyimide substrate 50 at a pitch of 200 μm, and the conductor line width at this time is 10 μm.
0 μm and a diameter of 50 μm on the electrode 51 at a pitch of 100 μm.
For example, 15 μm through holes 52 are formed. FIG.
(B) is a diagram for explaining the filling arrangement method. Since the parallel electrodes 51 for generating the moving electric field are located below the through holes 52, the electrostatic attraction force of the parallel electrodes 51 drops the particles 40 into the through holes 52. (Effectiveness is further increased by using an electromagnet or a perforated plate).

FIG. 4C shows an arrangement in which an electrode 61 is provided on the opposing plate 60, an interval of 50 ms is provided when switching the electrode to which a voltage is applied, and a voltage is applied only during this time, thereby pulling the particles upward. The effect of preventing the aggregation of the particles by stirring the particles is provided.

[Embodiment 4] FIG. 5 is a view showing the construction of a main part of an embodiment of the invention 4, wherein parallel electrodes 51 are formed on a polyimide substrate 50 at a pitch of 200 μm. At this time, the conductor line width is 100 μm, and fifteen through holes 52 having a diameter of 50 μm are formed on the electrode 51 at a pitch of 100 μm. On the other hand, the counter substrate 60 has a parallel electrode 62 formed of an aluminum thin film on glass.
(A), (B)). However, the pattern of the parallel electrodes 62 is not limited to a straight line.

The invention of claim 5 will be described with reference to the embodiment of FIG. 5 (B). The structure of the substrate 50 having the through holes 52 is such that parallel electrodes 51 are formed on a polyimide at a pitch of 200 μm. The line width is 100 μm, and 10
Fifteen through holes 52 having a diameter of 50 μm are formed at a pitch of 0 μm. In addition, each electrode 51 is divided into three groups, and the ends are connected to the common electrode. The opposing substrate 60 is made of an aluminum thin film on glass at a pitch of 100 μm.
Are formed. Each electrode is divided into three groups, and the ends are connected to a common electrode. 500 for common electrode on through-hole substrate side
The voltage of v is sequentially applied for 100 ms. As a result, the particles move in the direction of arrow A, and the particles are filled and arranged in the through holes. Similarly, by applying a voltage to the opposing substrate 60 to generate a moving electric field, the particles can be controlled in the two-dimensional direction, and the particles are prevented from agglomerating due to the diffusion due to the vertical movement of the particles, thereby improving the filling rate. .

FIG. 6 is a block diagram of a main part for explaining an embodiment of the invention according to claim 6. FIG.
FIG. 6A is a perspective view showing the configuration of the present embodiment. In this embodiment, a substrate 70 having a predetermined through hole 72 formed on one side of a parallel electrode 71 as shown in FIG. (Parallel electrodes 71 are formed at a pitch of 200 μm, the conductor line width at this time is 100 μm, and 15 through-holes 72 having a pitch of 100 μm and a diameter of 50 μm are formed on the electrodes. Each electrode 71 is divided into three groups, and the ends are connected to a common electrode).

FIG. 6C is a conceptual diagram of the filling arrangement, and FIG.
(D) is a cross-sectional configuration diagram. This structure is applied to particles having a large specific gravity such as metal particles, for example, to solder particles having a diameter of 40 μm. When a voltage of 500 V is sequentially applied to the common electrode for 100 ms, the particles 40 move in the direction of the arrow, and the particles 40 are filled and arranged in the through holes 72. As an application of the present invention, a pipe structure is naturally conceivable.

[Embodiment 7] FIG. 7 is a view showing the construction of a main part of an embodiment of the invention according to the embodiment 7. As shown in FIG. The parallel electrodes 81 are formed on the substrate 80 at a pitch of 200 μm. At this time, the conductor line width is 100 μm, and fifteen through holes 82 having a diameter of 50 μm are formed on the electrode 81 at a pitch of 100 μm. On the opposite substrate 90, parallel electrodes 91 are formed on the glass in the same direction as the through-hole substrate 80 at a pitch of 200 μm by an aluminum thin film. Have been. Each of the electrodes 81 and 91 is divided into four groups, and the ends are connected to a common electrode.

[Invention of Claim 8] The invention of claim 8 relates to a method of applying a voltage in the particle array device of claim 5, and will be described with reference to the embodiment shown in FIG. A parallel electrode (aluminum) 62 is formed on a substrate (glass) 60 facing the substrate 50 in a direction perpendicular to the parallel electrode 51 of the through-hole substrate 50. The parallel electrode 62 is divided into two blocks at the center, and a voltage is applied to each block so that the electric field moves from the end toward the center. That is, for each block, as described above, 3
The voltage is applied sequentially in groups. Thereby, it is possible to prevent the particles from being scattered on the through-hole substrate.

[Invention of claim 9] The invention of claim 9 relates to a voltage application method in the particle arrangement device of claim 7, and when described in the embodiment of FIG. 8, the electrodes 81 and 91 are each divided into four groups. And connected to a common electrode. In this case, the electrodes (,) (,) (,)
(,) Belong to the same group (the actual number of electrodes is 50
About 0). By sequentially applying a voltage to the common electrode at intervals of 100 ms, →→→, →→→
Are repeatedly applied in the order of. As a result, smooth particle movement including vertical movement can be realized.

[Invention of claim 10] The invention of claim 10 relates to a method of applying a voltage in the particle arrangement device of claim 6, and will be described with reference to the embodiment of FIG. Is 20 on the polyimide substrate 80.
The parallel electrodes 81 are formed at a pitch of 0 μm, the conductor line width at this time is 100 μm, and fifteen through holes 82 having a pitch of 100 μm and a diameter of 50 μm are formed on the electrodes. The opposing substrate 90 is formed by forming parallel electrodes 91 on the glass in the same direction as the parallel electrodes 81 on the through-hole substrate 80 at a pitch of 200 μm by an aluminum thin film, and is arranged so that the electrode positions on both substrates overlap. When an AC voltage of 500 V is sequentially applied to a pair of upper and lower electrodes (divided into three groups),
The particles 40 move while vibrating due to the alternating electric field, and can prevent aggregation of the particles.

[0028]

According to the first aspect of the present invention, a moving electric field is formed by applying a voltage to each of the electrodes formed in parallel in a predetermined order, and the fine particles are moved by the force of the electric field. The particles are arranged in the predetermined position by dropping the particles into the opening formed in the predetermined position during the movement, so that accurate (positional accuracy) particles can be obtained by the movement of the particle by the electric field and the filling of the particle into the opening. Arrays can be realized at high speed.

According to a second aspect of the present invention, an opening is formed at a predetermined position for arranging fine particles at a predetermined position, and a first substrate sucked from a back surface and a predetermined substrate are formed on the first substrate. It consists of an insulating second substrate in which a plurality of electrodes for generating an electric field are arranged on the back surface in opposition (parallel) with a gap, and an electric field generated by sequentially applying a voltage to the electrodes. The particles are moved in the gap between the two substrates, and at that time, the particles are held in the opening by the suction force acting on the opening of the first substrate, so that the moving electric field is generated by the parallel electrodes. Since the number of mechanical parts is small, the size of the apparatus can be reduced.

According to a third aspect of the present invention, microparticles mounted on a substrate having holes provided so as to penetrate the electrodes at predetermined positions on the electrodes formed in parallel are provided on each of the electrodes with a predetermined size. By applying the electrodes in order, a moving electric field is formed, the microparticles are moved by the force of the electric field, and the particles are dropped at the predetermined position by dropping the particles into the openings formed at the predetermined position during the movement. Since the particles are arranged, the structure is simplified by providing the particle arrangement holes on the electrodes.

According to a fourth aspect of the present invention, in the third aspect of the present invention, the opposing substrate on which the parallel electrodes are formed is provided, so that the particle behavior can be controlled in more detail by providing the parallel electrodes on the opposing substrate. become.

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the electrodes on the opposing substrate are formed in a direction perpendicular to the electrodes of the substrate having the through holes, so that the electrodes are formed in a matrix. In addition, two-dimensional particle movement control becomes possible, which leads to prevention of scattering of particles and improvement of the packing ratio.

According to a sixth aspect of the present invention, in the fourth aspect of the present invention, the electrodes on the opposing substrate are formed in the same direction with respect to the electrodes on the substrate having the through-hole, and are opposed to each other at the same pitch. Therefore, since the upper and lower electrodes have the same potential at the same time, the particles can be moved more reliably than in the case of only one side. In addition, since the particles are moved up and down, the particles are prevented from aggregating. In the case of the embodiment, since it can be realized by one polyimide film, the structure becomes very simple.

According to a seventh aspect of the present invention, in the invention of the fourth aspect, the pitches of the parallel electrodes on the opposing substrates are the same and are shifted by ピ ッ チ pitch, so that the arrangement of the electrodes is staggered. Due to the structure, the electrode pitch in the particle moving direction is small, and smooth particle movement can be realized.

According to an eighth aspect of the present invention, in the fifth aspect of the invention, a voltage is sequentially applied from the outside (both ends) to the center of the parallel electrode on the opposing substrate separately from the moving electric field when the particles are moved and arranged. Thus, an electric field that moves from both ends to the center is formed, so that an electrostatic force that collects the particles at the center works to prevent scattering of the particles.

According to a ninth aspect of the present invention, in the sixth aspect of the present invention, the particles are moved and arranged by applying a voltage alternately to the electrodes of both substrates.
The electrostatic force acts so as to move while moving up and down by two pitches, so that the particles move smoothly, and at the same time, aggregation of the particles is prevented by the up and down movement, and the filling rate is improved.

According to a tenth aspect of the present invention, in the sixth aspect of the present invention, a pair of electrodes facing each other is formed, and an alternating electric field is formed by inverting the polarity of an applied voltage between the counter electrodes, and the state is changed to a pair of adjacent electrodes. The particles are oscillated by the alternating power because the particles are moved and arranged by moving the particles sequentially. Therefore, the aggregation of the particles is prevented and the filling rate is improved.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram showing a basic configuration of a particle arrangement device.

FIG. 2 is a conceptual diagram for describing a method of generating a moving magnetic field by an electrode on a substrate shown in FIG.

FIG. 3 is a main part configuration diagram for explaining an embodiment of the invention of claim 2;

FIG. 4 is a main part configuration diagram for explaining an embodiment of the invention of claim 3;

FIG. 5 is a main part configuration diagram for explaining an embodiment of the invention of claim 4;

FIG. 6 is a main part configuration diagram for explaining an embodiment of the invention of claim 6;

FIG. 7 is a main part configuration diagram for explaining an embodiment of the invention of claim 7;

FIG. 8 is a main part configuration diagram for explaining an embodiment of the invention of claim 9;

FIG. 9 is a main part configuration diagram for explaining an embodiment of the invention of claim 9;

[Explanation of symbols]

10: particle array substrate, 11: aperture, 20: insulating substrate, 2
DESCRIPTION OF SYMBOLS 1 ... Electrode, 30 ... Perforated plate, 40 ... Particles, 50 ... Substrate, 5
DESCRIPTION OF SYMBOLS 1 ... Electrode, 52 ... Opening, 60 ... Counter substrate, 61 ... Electrode,
62: parallel electrode, 80: substrate, 81: electrode, 82: opening, 90: counter substrate, 91: electrode.

Claims (10)

[Claims] 1. A moving electric field is formed by applying a voltage to each of the electrodes formed in parallel in a predetermined order, and the fine particles are moved by the force of the moving electric field and formed at a predetermined position during the movement. A particle arrangement device for arranging the fine particles at a predetermined position by dropping the fine particles into the opened hole. 2. An opening is formed at a predetermined position for arranging the microparticles at a predetermined position, and a first substrate sucking the microparticles from a back surface, and a predetermined substrate formed on the first substrate. It consists of an insulating second substrate in which a plurality of electrodes for generating an electric field are arranged on the back surface facing each other with a gap therebetween,
Moving the microparticles in the gap between the two substrates by a moving electric field generated by sequentially applying a voltage to the electrodes, and holding the microparticles in the openings by a suction force acting on the first substrate. Characteristic particle arrangement device. 3. A microparticle mounted on a substrate having a hole provided at a predetermined position on an electrode formed in parallel so as to penetrate the electrode, applying a voltage to each of the electrodes in a predetermined order. A moving electric field is formed by applying the electric field, the fine particles are moved by the force of the moving electric field, and the fine particles are dropped into the opening formed at a predetermined position during the movement to move the fine particles into a predetermined position. A particle arrangement device characterized by being arranged at a position. 4. The particle array device according to claim 3, further comprising a counter substrate having a parallel electrode formed opposite to the substrate having the holes. 5. The particle array device according to claim 4, wherein the parallel electrodes on the counter substrate are formed in a direction perpendicular to the parallel electrodes of the substrate having the holes. 6. The parallel electrode according to claim 4, wherein the parallel electrodes on the counter substrate are formed in the same direction with respect to the parallel electrodes of the substrate having the holes, and are opposed to each other at the same pitch. Particle arrangement device. 7. The device according to claim 4, wherein the pitch of the parallel electrodes on the counter substrate is the same as the pitch of the parallel electrodes of the substrate having the holes, and the pitch is shifted by ２ pitch. Particle array device. 8. The method according to claim 5, wherein a voltage is sequentially applied from both outer ends of the parallel electrodes on the counter substrate to the center separately from the moving electric field when the fine particles are moved and arranged. An electric field that moves from the center to the central part. 9. The method according to claim 6, wherein the order of applying the voltage is:
A particle arrangement apparatus characterized in that a voltage is alternately applied to electrodes of both substrates. 10. An alternating electric field according to claim 6, wherein a pair of electrodes facing each other is formed, an alternating electric field is formed by inverting the polarity of an applied voltage between said pair of electrodes, and said alternating electric field state is sequentially moved to an adjacent electrode pair. A particle arrangement device for moving and arranging particles.