JPH05139525A - Separator for electronic parts - Google Patents

Abstract

PURPOSE:To provide a device having the capability of separating fine and brittle electronic parts in stacked state without causing any damage thereto, and taking out the parts in constant arrayed posture. CONSTITUTION:This separator device is constituted of a table 3 carrying flat parts 1 and freely movable back and forth, an adsorbing plate 5 freely movable vertically, and a drive mechanism 2 for both the table 3 and the plate 5. In this case, a gate 4 is provided at the travel route of the table 3 in such a way as adjacent to the adsorbing plate 5, and the bottom of the plate 5 is covered with a flat plate of an insulator. In addition, the exposed section of the plate 5 is fitted with an adsorbing means to adsorb the parts 1. According to this construction, when the table 3 is caused to advance and the parts 4 are passing the gate 4, the superposed state of the parts 1 is eliminated, and the parts 1 introduced to a position below the plate 5 is adsorbed and taken out.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a device for separating and aligning overlapping microelectronic components.

[0002]

2. Description of the Related Art A method for handling electronic components by electrostatic attraction is disclosed in Japanese Patent Laid-Open No. 193813/1990. In this method, a supply box provided with a height and horizontal position adjusting mechanism is provided below the charged rotating body, and electronic components are electrostatically adsorbed on the circumferential surface of the rotating body and taken out from the supply box. A groove having a width slightly larger than the width dimension of the component is provided on the circumferential surface, and the component is fitted and positioned in the groove by electrostatic attraction.

Further, Japanese Patent Laid-Open No. 2-250786 discloses a thin wire handling device in which a fine wire is attracted and transferred by static electricity to a hand having a concave contact surface with a wire.

[0004]

[Problems to be Solved by the Invention]
In the method disclosed in Japanese Patent Publication No. 3, since the positions of the parts in the supply box are random, when the parts are brought into contact with the circumferential surface of the rotating body, the parts are separated from the rotating body and other parts and the supply box. Parts that are sandwiched between and are fragile in material or shape are easily damaged. Further, since the method disclosed in JP-A-2-250786 is intended for linear parts, it cannot be applied to flat parts. An object of the present invention is to provide a device for taking out minute and fragile electronic components in a piled state in a separated and aligned state without damaging the components.

[0005]

A separating device comprising a table on which flat plate-shaped parts are stacked and which can be moved back and forth, a suction plate which can be moved up and down, and a drive mechanism for them, and a traveling path of the table. The gate is provided on the upper side so as to be adjacent to the suction plate, and the bottom surface of the suction plate is covered with a flat plate of an insulating material, and a suction means is provided for adhering a component to a portion not covered with the flat plate.

[0006]

According to the present invention, when the table on which the parts are loaded advances, the overlap of the parts is automatically eliminated when the table passes under the gate, and among the parts that have passed through the gate,
The parts that entered the lower part of the suction surface are attached by the suction means,
When the suction plate is moved up, only the components in a fixed posture are taken out by removing the components other than the components attached in a fixed direction.

[0007]

FIG. 1 is a diagram showing an embodiment of the present invention. The target component is a microelectronic component having a width, length, and thickness of several mm or less. For example, the core of the composite type magnetic head shown in FIG. The core is a minute and fragile part having both a width w and a height h of about 1 mm and a thickness t of about 0.2 mm. The parts handled in the examples are parts with w> h and a straight outer periphery.

A table 1 on which a component 1 is loaded and which can be moved in the front-rear direction by a feeding mechanism 2 is centered, a gate 4 and a suction plate 5 are provided in front of the movement path thereof, and a component 1 is provided on both sides of the table 3 and behind the movement path. Scraper 6
a, 6b, 6c are provided. The suction plate 5 is vertically movable by a drive mechanism 7, and scrapers 6a, 6b, 6c are provided.
Are movable in the front-rear direction by drive mechanisms 8a, 8b, 8c, respectively.

2 and 3 show the construction of the suction plate 5. The suction plate 5 shown in FIG. 2A has a laminated structure of a mask 51, an insulating film 52, an electrode 53, and an insulator 54 from the bottom side. The mask 51 is an insulating material and is a comb-shaped plate shown in FIG. 2B or a linear plate shown in FIG. Adsorption plate 5
The part of the bottom end of the surface not covered with the mask 51, that is, the part where the insulating film 52 is exposed is the adsorption surface 55 to which the component 1 is attached by static electricity.

In the case of the comb-shaped mask, the width dimension W and the depth dimension H of each suction surface 55 are set to match the width w and the height h of the component 1, respectively, so that only one component 1 fits on each suction surface 55. .. In the case of a linear mask, the depth dimension H of the suction surface 55 is matched with the height h of the component 1. In any case,
The thickness of the mask 51 is the same as or slightly smaller than the thickness t of the component 1.

In FIG. 3, the electrode is divided into a plus electrode 53a and a minus electrode 53b, and a distance of about 0.1 to 0.3 mm is provided between them. Gap between these electrodes 5
6 is within the range of the suction surface 55, and the component 1 is attached to the suction surface 55.
The path of the line of electric force when adhered flows from the plus electrode to the minus electrode via the component 1, so that a stronger adsorption force can be obtained.

FIG. 4 shows a method of generating static electricity on the adsorption surface without using the electrodes. The adsorption plate 5 starts from that shown in FIG.
With the configuration excluding 3, a DC voltage is applied to the conductive brush 9 to bring the brush 9 into contact with the entire surface of the suction surface 55 to supply power.

FIG. 6 is an explanatory view of the separation method. First, the vertical distance D between the lower surface of the gate 4 and the suction surface 55 and the upper surface of the table 3 is t <D <2 with respect to the thickness t of the component 1.
The gate 4 and the suction plate 5 are provided at the position of t. The suction plate 5 is located behind the gate 4 and adjacent to the end of the gate 4 with respect to the traveling direction of the table 3, and the component 1 supplied onto the table 3 first moves below the gate 4 when the table 3 advances. Passes through and leads to the bottom of the suction plate.

The parts 1 are initially in an overlapped state (FIG. 6 (a)), but when the table 3 advances and the parts 1 pass through the gate 4, the parts 1 disappear. The component 1 that has passed through the gate 4 enters the lower portion of the suction plate 5, but here, the suction plate 5
By setting the thickness of the mask 51 so that the distance between the lower surface of the mask 51 and the upper surface of the table 3 is smaller than the thickness t of the component 1, the component 1 does not enter this portion,
The component 1 only fits under the suction surface 55. When a DC voltage of several hundred to several thousand volts is applied to the electrode 53 in this state, the component 1 adheres to the attraction surface 55 due to the static electricity generated on the attraction surface 55 (FIG. 6B). In order to make the attachment more reliable, the suction plate 5 is moved to a position where the suction surface 55 and the component 1 contact each other.
Should be lowered.

At this point, the posture of the component 1 that has entered the lower portion of the suction surface 55 faces various directions as shown in FIG. 7, but if the suction plate 5 is raised at this point, it will stick out from the suction surface 55. The part 1a that has been removed is scraped off at the end of the gate 4 (FIG. 6C). Therefore, only the component 1 attached in a certain direction remains on the suction surface 55. By the above operation,
The parts 1 are separated from the overlapped state in a state where they are aligned in a certain posture. By transferring the separated component 1 onto a case or pallet or transferring it onto a tape, the suction plate 5 shifts to the next separating operation.

When one separation operation is completed, the table 3 is temporarily retracted, and the parts 1 moved to the rear portion or both sides of the upper surface of the table 3 are scraped by the scrapers 6a, 6b, 6c to the vicinity of the center of the upper surface of the table 3 again. The suction plate 5 moves to the initial position (FIG. 6 (d)). By repeating the above operation, all the parts 1 on the table 3 are separated, taken out in a uniform posture.

Here, when the separated parts 1 may be in contact with each other, a linear mask may be used, and a comb-shaped mask is used when a space is required for each part. Further, the mask shape is not limited to the comb shape and the linear shape, and if the component 1 is a disk shape, the mask shape may be set so that the suction surface has a semicircular shape. The suction means of the component 1 is not limited to static electricity, and each suction surface 55
It is also possible to provide a suction port on the and attach the component 1 by vacuum suction.

According to the present invention, except for the parts taken out by the suction means, the parts move to the rear of the table.
The parts are not sandwiched between the table and the suction plate, and the parts do not collide with each other due to dropping or vibration. Therefore, even minute and fragile parts such as cores can be separated from the piled state without damaging the parts and can be taken out in a row in a certain posture. Further, by providing a large number of suction surfaces on the bottom surface of the suction plate, many parts can be taken out at one time, and separation and alignment can be efficiently performed.

[Brief description of drawings]

FIG. 1 shows a side view and a top view of an embodiment of the present invention.

FIG. 2 Structure of a suction plate used in Examples

FIG. 3 Structure of a suction plate used in Examples

FIG. 4 Structure of a suction plate used in Examples

FIG. 5 is an example of a part targeted by the present invention.

FIG. 6 shows a separation method of the present invention.

FIG. 7 shows how parts are attached to a suction plate.

[Explanation of symbols]

 1 parts 2 table drive mechanism 3 table 4 gate 5 adsorption plate 6 scraper 7 adsorption plate drive mechanism 8 scraper drive mechanism 9 brush 51 mask 52 insulating film 53 electrode 54 insulator 55 adsorption surface 56 gap

Claims (5)

[Claims] 1. A separating device comprising a table on which flat plate-shaped parts are stacked and which can be moved back and forth, a suction plate which can be moved vertically and a drive mechanism for these, and the bottom of the suction plate is made of an insulating material. An electronic component separating apparatus, characterized in that a suction means for adhering a component is provided on a portion covered with a flat plate and the insulating film 52 is exposed. 2. As a suction means, a plus electrode, a minus electrode, or a plus electrode and a minus electrode are arranged on a suction plate so as to face each other with a minute distance therebetween, and a DC voltage is applied to the electrodes so that static electricity is generated on the suction surface. 2. The electronic component separating apparatus according to claim 1, wherein the electronic component separating device is configured to generate a component and attract the component. 3. The electronic component separating apparatus according to claim 1, wherein a suction port is provided in the suction surface as the suction means, and the component is suctioned by vacuum suction. 4. The distance D from the upper surface of the table to the suction surface
And the distance H from the table upper surface to the insulator flat plate lower surface,
For the thickness t of the part, t <D <2t, 0 <H
<Suction plate is installed at the position of t, and the table is moved to the lower part of the suction plate so that the parts flow into the lower part of the suction surface
2. The electronic component separating apparatus according to claim 1, wherein the component is attached to the suction surface by the suction means and is taken out. 5. When a gate is provided on the advancing path of the table so as to be adjacent to the suction plate and the suction plate is moved up, the parts sticking to the suction surface and protruding from the suction surface are scraped off by the gate. The electronic component separating device according to claim 1.