JP2017047499A - Wire tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire tool that has high abrasive grain holding force and can exhibit superior cutting performance.SOLUTION: A wire tool 100 comprises a metallic core wire 10, and abrasive-grains 30 made to adhere to an outer periphery of the core wire 10 with resin bond 20. The resin bond 20 contains two types of fillers 11 and 12 with different average particle diameters. The fillers 11 and 12 are made of silica and GC respectively, and the resin bond 20 is formed of a phenolic resin being one of a thermosetting resin. Distribution ranges of particle diameters of the fillers 11 and 12 are 10 nm or more to 4 μm or less. The average particle diameter of the fillers 11 is 20 nm, and the average particle diameter of the fillers 12 is 1.2 μm, where a size ratio of the average particle diameter of the fillers 12 to the average particle diameter of the fillers 11 is 60. Average values of aspect ratios of the fillers 11 and 12 are 1.1 and 1.3 respectively. Content (addition amount) of the fillers 11 and 12 in the resin bond 20 is 15 vol%.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a wire tool used when slicing a lump such as silicon for solar cells, semiconductor silicon, a magnetic material, SiC, or other hard and brittle materials.

  As shown in FIG. 5, the conventional wire tool 500 formed by fixing the abrasive grains 30 to the outer periphery of the core wire 10 using a thermosetting resin (resin bond 20) has an abrasive holding power based on the bond physical properties. It has been widely used in the past. However, in recent years, the demand for thinning of wire tools has increased, and in order to satisfy this demand, high cutting performance is required even in wire tools using abrasive grains having a small particle size.

  In order to cope with such a situation, various types of wire tools that have been devised to increase the abrasive grain holding force have been proposed. However, as related to the present invention, for example, described in Patent Document 1 There are “super abrasive wire saws”.

  The “superabrasive wire saw” described in Patent Document 1 fixes a multilayer resin bond layer containing fine superabrasive grains dispersed on the surface of a high-strength core wire, and contains a filler in the resin bond layer. It is a thing.

Japanese Patent Application Laid-Open No. 2000-263452

  In conventional resin bond type wire tools or “superabrasive wire saws” described in Patent Document 1, attempts are made to improve the bond or add a filler in order to increase the abrasive holding power. However, even in recent years, there is actually no wire tool having an abrasive holding force that can sufficiently satisfy the performance required by those skilled in the art.

  Accordingly, the problem to be solved by the present invention is to provide a wire tool that has high abrasive grain retention and exhibits excellent cutting performance.

  The wire tool of the present invention comprises a metal core wire and abrasive grains fixed to the outer periphery of the core wire by a resin bond, and the resin bond contains a plurality of types of fillers having different average particle diameters. And

  By including a plurality of types of fillers having different average particle diameters in the resin bond, a larger amount of filler can be included in the resin bond than in a conventional wire tool having a uniform average particle diameter. Therefore, by containing a large amount of filler in the resin bond, the thermal conductivity of the bond layer is increased and the heat resistance during the cutting operation is improved, so that the abrasive grain retention is increased. At the same time, the filler filling ratio in the resin bond can be increased by the combination of fillers having different average particle diameters, so that the bond layer strength is improved and coupled with an increase in the retention of abrasive grains due to improved heat resistance. Demonstrates cutting performance.

  Here, it is desirable that the particle size distribution range of the filler is 10 nm to 4 μm.

  Moreover, it is desirable that the ratio of the average particle diameter of the filler having a smaller particle diameter and the average particle diameter of the filler having a larger particle diameter is 2 to 60.

  Furthermore, it is desirable that the average aspect ratio (aspect ratio) of the filler is 1.0 to 1.6.

  On the other hand, it is desirable that the content (addition amount) of the filler in the resin bond is 10 vol% to 30 vol%.

  The filler may be one or more of diamond, GC, WA, or silica.

  Furthermore, the resin bond can be formed of a thermosetting resin (for example, a phenol resin, an epoxy resin, or a urethane resin).

  According to the present invention, it is possible to provide a wire tool having high abrasive grain holding power and exhibiting excellent cutting performance.

It is sectional drawing which shows a part of wire tool which is 1st Embodiment of this invention. It is an enlarged view of the part shown by the arrow line A in FIG. It is sectional drawing which shows a part of wire tool which is 2nd Embodiment of this invention. It is sectional drawing which shows a part of wire tool which is 3rd Embodiment of this invention. It is sectional drawing which shows a part of conventional wire tool.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the wire tool 100 according to the first embodiment of the present invention includes a metal core wire 10 and abrasive grains 30 fixed to the outer periphery of the core wire 10 with a resin bond 20. The resin bond 20 contains two types of fillers 11 and 12 having different average particle diameters.

  The particle size distribution range of the fillers 11 and 12 is 10 nm to 4 μm. The average particle diameter of the filler 11 having the smaller particle diameter is 20 nm, the average particle diameter of the filler 12 having a larger particle diameter is 1.2 μm, and the average particle diameter of the filler 11 and the average particle diameter of the filler 12 are the same. The size ratio is 60, but is not limited to this.

  The average value of the aspect ratio of the filler 11 is 1.1, and the average value of the aspect ratio of the filler 12 is 1.3. Content (addition amount) of the fillers 11 and 12 in the resin bond 20 is 15 vol%.

  In this embodiment, the filler 11 is silica and the filler 12 is GC, but diamond, WA, or the like can also be used. The resin bond 20 is formed of a phenol resin that is one of thermosetting resins.

  In the wire tool 100, a conventional wire tool containing one type of filler having an average particle size uniform in the resin bond by including two types of fillers 11 and 12 having different average particle sizes in the resin bond 20. Compared to the above, since a large amount of fillers 11 and 12 can be contained in the resin bond 20, the abrasive grain holding power is increased and excellent cutting performance is exhibited. Moreover, the heat resistance during the cutting operation is also improved by increasing the abrasive grain holding power.

  Next, based on FIG. 3, FIG. 4, the wire tools 200 and 300 which are the 2nd and 3rd embodiment of this invention are demonstrated. In addition, about the part which is common in the wire tool 100 among the parts which comprise the wire tools 200 and 300, the code | symbol same as the code | symbol in FIG. 1, FIG. 2 is attached | subjected, and description is abbreviate | omitted.

  A wire tool 200 shown in FIG. 3 includes a metal core wire 10 and abrasive grains 30 fixed to the outer periphery of the core wire 10 with a resin bond 20, and the resin bond 20 has two types of fillers 21 having different average particle diameters. , 22 is contained.

  The particle size distribution range of the fillers 21 and 22 is 10 nm to 4 μm. The average particle size of the filler 21 having the smaller particle size is 0.6 μm, the average particle size of the filler 22 having a larger particle size is 1.2 μm, the average particle size of the filler 21 and the average particle of the filler 22 The ratio of size to diameter is 2.

  The average aspect ratio of the fillers 21 and 22 is 1.3. Content (addition amount) of the fillers 21 and 22 in the resin bond 20 is 15 vol%.

  In the present embodiment, the fillers 21 and 22 are GC, but diamond, WA, silica, or the like can also be used. The resin bond 20 is formed of a phenol resin that is one of thermosetting resins.

  In the wire tool 200, by containing two types of fillers 21 and 22 having different average particle sizes in the resin bond 20, a larger amount of fillers 21 and 22 are contained in the resin bond 20 than in the conventional wire tool. As a result, the holding power of the abrasive grains is increased and excellent cutting performance is exhibited. Moreover, the heat resistance during the cutting operation is also improved by increasing the abrasive grain holding power.

  A wire tool 300 shown in FIG. 4 includes a metal core wire 10 and abrasive grains 30 fixed to the outer periphery of the core wire 10 with a resin bond 20, and the resin bond 20 has two types of fillers 31 having different average particle diameters. , 32.

  The particle size distribution range of the fillers 31 and 32 is 10 nm to 4 μm. The average particle size of the filler 31 having the smaller particle size is 0.3 μm, the average particle size of the filler 32 having a larger particle size is 1.2 μm, the average particle size of the filler 31 and the average particle of the filler 32 The size ratio of the diameter is 4.

  The average aspect ratio of the fillers 31 and 32 is 1.3. Content (addition amount) of the fillers 31 and 32 in the resin bond 20 is 15 vol%.

  In the present embodiment, the fillers 31 and 32 are GC, but diamond, WA, silica, or the like can also be used. The resin bond 20 is formed of a phenol resin that is one of thermosetting resins.

  In the wire tool 300, a larger amount of fillers 31 and 32 are contained in the resin bond 20 than in the conventional wire tool by including two types of fillers 31 and 32 having different average particle diameters in the resin bond 20. As a result, the holding power of the abrasive grains is increased and excellent cutting performance is exhibited. Moreover, the heat resistance during the cutting operation is also improved by increasing the abrasive grain holding power.

  Next, the Example of the wire tool which concerns on this invention is described. The wire tool of this example is a novolak type phenolic resin, a resol type phenolic resin, a filler A, a filler B having a particle diameter different from that of the filler A and a slurry formed by mixing abrasive grains with a core wire. It was produced by adhering to the outer periphery of the piano wire, drying and thermosetting. Filler A was GC # 8000 (average particle size: 1.2 μm), and filler B was GC # 10000, GC # 30000, and Aerosil (nanosilica). The wire tool produced in the above process was set in a single wire testing machine, the single crystal silicon block was cut, and the sharpness was evaluated by the processing efficiency (mm / min: depth of cut per unit time). Table 1 shows slurry preparation and the like.

（※１）粒径測定方法は、ＧＣ＃８０００，ＧＣ＃１００００及びＧＣ＃３００００についてはレーザー回折散乱法を用い、アエロジルについては電子顕微鏡による観察にて測定した。
（※２）フィラーＡ（ＧＣ＃８０００）に対する平均粒子径比である。

(* 1) The particle size was measured by the laser diffraction scattering method for GC # 8000, GC # 10000 and GC # 30000, and by observation with an electron microscope for Aerosil.
(* 2) Average particle size ratio with respect to filler A (GC # 8000).

  The aspect ratio of filler A and filler B used in this example (average value of major axis / minor axis ratio by electron microscope observation) is 1.3 for GC # 8000, and 1.3 for GC # 10000. Yes, 1.3 for GC # 30000 and 1.1 for Aerosil. In this embodiment, the aspect ratio is limited to a range of 1.0 to 1.6 by using powder fillers that are not deformed such as needles and flakes.

  The manufacturing method of the wire tool which concerns on a present Example is as follows. After dissolving the novolac type phenol resin with a solvent, the resol type phenol resin, filler A, filler B and abrasive grains were added and stirred to form a slurry. The slurry was impregnated with piano wire, the excess slurry was scraped through a die, dried with a far-infrared heater, wound on a bobbin, and then the phenol resin was thermoset in an oven to produce the desired wire tool. About the specification of this wire tool, it is as follows.

Specification of wire tool Outer diameter of wire tool: φ120μm
Outer diameter of core wire (piano wire diameter): φ100μm
Abrasive grain size: M10 / 20

  The wire tool produced in the above process was set in a single wire testing machine, and a single crystal silicon block was cut for a certain time, and the cutting performance of the wire was evaluated from the depth. Test conditions and evaluation methods are as follows.

Test conditions Single wire testing machine: Diamond wire saw DWS3242 (Maywa Force)
Processing tension: 10N
Line speed: 174mm / min
Wire usage: 10m
Work material: Single crystal silicon 29mm x 12mm x 23mm

Evaluation method Performing a 2.5 minute incision 5 times. Describe the depth of the 5th incision in terms of machining efficiency mm / min, and compare the machining performance with the size. Measure the wire diameter before and after machining, Evaluate wire diameter change

From the test results shown in Table 2 etc., the following was found.
(A) From the test results of sample No. (1) and sample Nos. (2), (3), and (4), it was confirmed that the processing efficiency was increased by using fillers having different average particle diameters.
(B) From the test results of sample Nos. (1), (2), (3), and (4), it was confirmed that when the average particle size ratio of the filler was 2 or more, the processing efficiency was increased.

  The wire tools 100, 200, 300, etc. described above exemplify the wire tools of the present invention, and the wire tools of the present invention are not limited to the wire tools 100, 200, 300, etc. described above.

  The wire tool of the present invention is used in various industries such as electronic and electrical equipment and mechanical equipment as a tool for slicing a lump such as solar cell silicon, semiconductor silicon, magnetic material, SiC, or other hard and brittle materials. Can be widely used in the field.

DESCRIPTION OF SYMBOLS 10 Core wire 11, 12, 21, 22, 31, 32 Filler 20 Resin bond 30 Abrasive grain 100, 200, 300 Wire tool

Claims (7)

  A wire tool comprising a metal core wire and abrasive grains fixed to the outer periphery of the core wire by a resin bond, wherein the resin bond contains a plurality of types of fillers having different average particle diameters.   The wire tool according to claim 1, wherein a particle diameter distribution range of the filler is 10 nm to 4 μm.   The wire tool according to claim 1 or 2, wherein a ratio of an average particle diameter of the filler having a smaller particle diameter and an average particle diameter of the filler having a larger particle diameter is 2 to 60. .   The wire tool according to any one of claims 1 to 3, wherein an average aspect ratio of the filler is 1.0 to 1.6.   The wire tool according to any one of claims 1 to 4, wherein a content (addition amount) of the filler in the resin bond is 10 vol% to 30 vol%.   The wire tool according to any one of claims 1 to 5, wherein the filler is at least one of diamond, GC, WA, and silica.   The wire tool according to any one of claims 1 to 6, wherein the resin bond is formed of a thermosetting resin.

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