JP2017030266A5 - - Google Patents

Claims (10)

A method of manufacturing a microdevice configured by laminating a first substrate and a second substrate,
A temporary bonding step of bonding the two first substrates to each other through a temporary bonding layer;
A laminating step of bonding the second substrate to a surface opposite to the surface of the first substrate, and laminating the first substrate and the second substrate;
A microdevice manufacturing method comprising: a peeling step of peeling the temporary adhesive layer.   The method for manufacturing a microdevice according to claim 1, further comprising a processing step for forming a predetermined structure on the first substrate between the temporary bonding step and the laminating step.   The method of manufacturing a microdevice according to claim 2, wherein the processing step includes at least one of wet etching, dry etching, and mechanical processing.   The method of manufacturing a microdevice according to claim 2, wherein the processing step includes a step of reducing the thickness of the first substrate.   5. The method of manufacturing a micro device according to claim 2, wherein the predetermined structure includes at least one of a through hole, a blocking hole, a groove, and a recess with respect to the first substrate.   6. The method of manufacturing a micro device according to claim 1, wherein in the stacking step, the thickness of the first substrate is not less than 100 μm and not more than 600 μm. The micro device is a laminated substrate for a liquid discharge head,
A supply port for supplying a liquid is formed in the first substrate,
The second substrate has a discharge port for discharging a liquid, a flow path for guiding the liquid supplied from the supply port to the discharge port, and energy generation for generating energy for discharging the liquid from the discharge port. The method for manufacturing a microdevice according to claim 1, further comprising an element. The micro device is a laminated substrate for a liquid discharge head,
The first substrate includes an energy generating element for generating energy for discharging the liquid, and a flow path for guiding the liquid to the energy generating element.
The method for manufacturing a microdevice according to claim 1, wherein the second substrate is provided with a supply port for supplying a liquid to the flow path.   The method of manufacturing a micro device according to claim 8, wherein the energy generating element is formed in advance on a surface of the first substrate that contacts the temporary adhesive layer.   10. The method of manufacturing a microdevice according to claim 1, wherein the two second substrates that are temporarily bonded in the temporary bonding step have different thicknesses or structures.