JP2013115352A5 - - Google Patents
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- JP2013115352A5 JP2013115352A5 JP2011262320A JP2011262320A JP2013115352A5 JP 2013115352 A5 JP2013115352 A5 JP 2013115352A5 JP 2011262320 A JP2011262320 A JP 2011262320A JP 2011262320 A JP2011262320 A JP 2011262320A JP 2013115352 A5 JP2013115352 A5 JP 2013115352A5
- Authority
- JP
- Japan
- Prior art keywords
- annular
- substrate
- holes
- electrostatic chuck
- green sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (7)
第1のグリーンシートに複数の貫通孔と、隣接する前記貫通孔間に設けられた連結部と、を環状に形成する貫通孔形成工程と、
第2のグリーンシート上に前記第1のグリーンシートを仮接着し、前記複数の貫通孔の一方の側を前記第2のグリーンシートで塞ぐ仮接着工程と、
前記仮接着工程の後に、前記連結部を除去し、前記複数の貫通孔を一体化して環状の貫通孔を形成する連結部除去工程と、
前記第1のグリーンシート上に第3のグリーンシートを仮接着し、前記環状の貫通孔の他方の側を前記第3のグリーンシートで塞いで、前記第1のグリーンシートのみにより環状のガス流路を形成するガス流路形成工程と、
仮接着された各グリーンシートを焼成して前記基体を形成する基体形成工程と、を有することを特徴とする静電チャックの製造方法。 A method of manufacturing an electrostatic chuck having a substrate having a substrate mounting surface on which a substrate is mounted, an electrode built in the substrate, and an annular gas channel built in the substrate,
A through hole forming step of forming a plurality of through holes in the first green sheet and a connecting portion provided between the adjacent through holes in an annular shape;
A temporary bonding step of temporarily bonding the first green sheet on a second green sheet and closing one side of the plurality of through holes with the second green sheet;
After the temporary bonding step, the connecting portion is removed, the connecting portion removing step of forming the annular through hole by integrating the plurality of through holes,
A third green sheet is temporarily bonded onto the first green sheet, the other side of the annular through-hole is closed with the third green sheet, and an annular gas flow is formed only by the first green sheet. A gas flow path forming step for forming a path;
And a substrate forming step of firing each of the temporarily bonded green sheets to form the substrate.
前記環状のガス流路は、1枚のグリーンシートのみにより同一平面内に形成された第1の環状のガス流路と、前記第1の環状のガス流路の内側に配置された第2の環状のガス流路と、を有し、
前記第1の環状のガス流路及び前記第2の環状のガス流路は、平面視において、前記基体の半径の半分よりも外周側に設けられていることを特徴とする静電チャック。 An electrostatic chuck having a base having a substrate placement surface on which a substrate is placed, an electrode built in the base, and an annular gas flow path built in the base,
The annular gas channel includes a first annular gas channel formed in the same plane by only one green sheet, and a second gas gas channel disposed inside the first annular gas channel. An annular gas flow path,
The electrostatic chuck according to claim 1, wherein the first annular gas flow path and the second annular gas flow path are provided on an outer peripheral side of a half of the radius of the base body in a plan view.
接着層を介して前記静電チャックを固定するベースプレートと、を有する基板温調固定装置。 An electrostatic chuck according to any one of claims 4 to 6 ,
And a base plate for fixing the electrostatic chuck via an adhesive layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011262320A JP5785862B2 (en) | 2011-11-30 | 2011-11-30 | Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011262320A JP5785862B2 (en) | 2011-11-30 | 2011-11-30 | Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013115352A JP2013115352A (en) | 2013-06-10 |
JP2013115352A5 true JP2013115352A5 (en) | 2014-09-25 |
JP5785862B2 JP5785862B2 (en) | 2015-09-30 |
Family
ID=48710596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011262320A Active JP5785862B2 (en) | 2011-11-30 | 2011-11-30 | Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5785862B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10832931B2 (en) | 2014-05-30 | 2020-11-10 | Applied Materials, Inc. | Electrostatic chuck with embossed top plate and cooling channels |
KR102188779B1 (en) * | 2018-10-15 | 2020-12-08 | 세메스 주식회사 | Apparatus for surpoting substrate and manufacturing mathod threrof |
CN116057684A (en) * | 2020-06-09 | 2023-05-02 | 朗姆研究公司 | Susceptor thermal profile adjustment using multiple heating zones and thermal apertures |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001118915A (en) * | 1999-10-15 | 2001-04-27 | Applied Materials Inc | Multilayer ceramic electrostatic chuck having internal channel |
JP4944600B2 (en) * | 2006-12-28 | 2012-06-06 | 新光電気工業株式会社 | Substrate temperature adjustment fixing device |
JP4418484B2 (en) * | 2007-07-04 | 2010-02-17 | 日本碍子株式会社 | Electrostatic chuck and work cooling method using the same |
JP4929150B2 (en) * | 2007-12-27 | 2012-05-09 | 新光電気工業株式会社 | Electrostatic chuck and substrate temperature control fixing device |
JP4612707B2 (en) * | 2008-05-15 | 2011-01-12 | 日本特殊陶業株式会社 | Electrostatic chuck, electrostatic chuck device, and manufacturing method of electrostatic chuck |
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2011
- 2011-11-30 JP JP2011262320A patent/JP5785862B2/en active Active
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