JP2013115352A5 - - Google Patents

Download PDF

Info

Publication number
JP2013115352A5
JP2013115352A5 JP2011262320A JP2011262320A JP2013115352A5 JP 2013115352 A5 JP2013115352 A5 JP 2013115352A5 JP 2011262320 A JP2011262320 A JP 2011262320A JP 2011262320 A JP2011262320 A JP 2011262320A JP 2013115352 A5 JP2013115352 A5 JP 2013115352A5
Authority
JP
Japan
Prior art keywords
annular
substrate
holes
electrostatic chuck
green sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011262320A
Other languages
Japanese (ja)
Other versions
JP5785862B2 (en
JP2013115352A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2011262320A priority Critical patent/JP5785862B2/en
Priority claimed from JP2011262320A external-priority patent/JP5785862B2/en
Publication of JP2013115352A publication Critical patent/JP2013115352A/en
Publication of JP2013115352A5 publication Critical patent/JP2013115352A5/ja
Application granted granted Critical
Publication of JP5785862B2 publication Critical patent/JP5785862B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Claims (7)

基板が載置される基板載置面を有する基体と、前記基体に内蔵された電極と、前記基体に内蔵された環状のガス流路と、を有する静電チャックの製造方法であって、
第1のグリーンシートに複数の貫通孔と、隣接する前記貫通孔間に設けられた連結部と、を環状に形成する貫通孔形成工程と、
第2のグリーンシート上に前記第1のグリーンシートを仮接着し、前記複数の貫通孔の一方の側を前記第2のグリーンシートで塞ぐ仮接着工程と、
前記仮接着工程の後に、前記連結部を除去し、前記複数の貫通孔を一体化して環状の貫通孔を形成する連結部除去工程と、
前記第1のグリーンシート上に第3のグリーンシートを仮接着し、前記環状の貫通孔の他方の側を前記第3のグリーンシートで塞いで、前記第1のグリーンシートのみにより環状のガス流路を形成するガス流路形成工程と、
仮接着された各グリーンシートを焼成して前記基体を形成する基体形成工程と、を有することを特徴とする静電チャックの製造方法。
A method of manufacturing an electrostatic chuck having a substrate having a substrate mounting surface on which a substrate is mounted, an electrode built in the substrate, and an annular gas channel built in the substrate,
A through hole forming step of forming a plurality of through holes in the first green sheet and a connecting portion provided between the adjacent through holes in an annular shape;
A temporary bonding step of temporarily bonding the first green sheet on a second green sheet and closing one side of the plurality of through holes with the second green sheet;
After the temporary bonding step, the connecting portion is removed, the connecting portion removing step of forming the annular through hole by integrating the plurality of through holes,
A third green sheet is temporarily bonded onto the first green sheet, the other side of the annular through-hole is closed with the third green sheet, and an annular gas flow is formed only by the first green sheet. A gas flow path forming step for forming a path;
And a substrate forming step of firing each of the temporarily bonded green sheets to form the substrate.
前記貫通孔形成工程では、環状に形成された前記複数の貫通孔の内側に、更に、複数の第2の貫通孔と、隣接する前記第2の貫通孔間に設けられた第2の連結部と、を環状に形成することを特徴とする請求項1記載の静電チャックの製造方法。   In the through hole forming step, a plurality of second through holes and a second connecting portion provided between the adjacent second through holes inside the plurality of through holes formed in an annular shape. The method for manufacturing an electrostatic chuck according to claim 1, wherein: 前記貫通孔形成工程では、前記複数の貫通孔の一部と前記複数の第2の貫通孔の一部とを互いに連通させることを特徴とする請求項2記載の静電チャックの製造方法。   3. The method of manufacturing an electrostatic chuck according to claim 2, wherein in the through hole forming step, a part of the plurality of through holes and a part of the plurality of second through holes are communicated with each other. 基板が載置される基板載置面を有する基体と、前記基体に内蔵された電極と、前記基体に内蔵された環状のガス流路と、を有する静電チャックであって、
前記環状のガス流路は、1枚のグリーンシートのみにより同一平面内に形成された第1の環状のガス流路と、前記第1の環状のガス流路の内側に配置された第2の環状のガス流路と、を有し、
前記第1の環状のガス流路及び前記第2の環状のガス流路は、平面視において、前記基体の半径の半分よりも外周側に設けられていることを特徴とする静電チャック。
An electrostatic chuck having a base having a substrate placement surface on which a substrate is placed, an electrode built in the base, and an annular gas flow path built in the base,
The annular gas channel includes a first annular gas channel formed in the same plane by only one green sheet, and a second gas gas channel disposed inside the first annular gas channel. An annular gas flow path,
The electrostatic chuck according to claim 1, wherein the first annular gas flow path and the second annular gas flow path are provided on an outer peripheral side of a half of the radius of the base body in a plan view.
前記基板載置面の外縁部に、平面視円環状の突起部が設けられている請求項4記載の静電チャック。The electrostatic chuck according to claim 4, wherein a projection having an annular shape in plan view is provided on an outer edge portion of the substrate mounting surface. 前記第1の環状のガス流路と前記第2の環状のガス流路とは、互いに連通していることを特徴とする請求項4又は5記載の静電チャック。 Wherein the first annular gas passage and gas passage of the second annular, claim 4 or 5 The electrostatic chuck according to, characterized in that communicate with each other. 請求項4乃至6の何れか一項記載の静電チャックと、
接着層を介して前記静電チャックを固定するベースプレートと、を有する基板温調固定装置。
An electrostatic chuck according to any one of claims 4 to 6 ,
And a base plate for fixing the electrostatic chuck via an adhesive layer.
JP2011262320A 2011-11-30 2011-11-30 Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device Active JP5785862B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011262320A JP5785862B2 (en) 2011-11-30 2011-11-30 Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011262320A JP5785862B2 (en) 2011-11-30 2011-11-30 Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device

Publications (3)

Publication Number Publication Date
JP2013115352A JP2013115352A (en) 2013-06-10
JP2013115352A5 true JP2013115352A5 (en) 2014-09-25
JP5785862B2 JP5785862B2 (en) 2015-09-30

Family

ID=48710596

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011262320A Active JP5785862B2 (en) 2011-11-30 2011-11-30 Electrostatic chuck and manufacturing method thereof, substrate temperature control fixing device

Country Status (1)

Country Link
JP (1) JP5785862B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10832931B2 (en) 2014-05-30 2020-11-10 Applied Materials, Inc. Electrostatic chuck with embossed top plate and cooling channels
KR102188779B1 (en) * 2018-10-15 2020-12-08 세메스 주식회사 Apparatus for surpoting substrate and manufacturing mathod threrof
CN116057684A (en) * 2020-06-09 2023-05-02 朗姆研究公司 Susceptor thermal profile adjustment using multiple heating zones and thermal apertures

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118915A (en) * 1999-10-15 2001-04-27 Applied Materials Inc Multilayer ceramic electrostatic chuck having internal channel
JP4944600B2 (en) * 2006-12-28 2012-06-06 新光電気工業株式会社 Substrate temperature adjustment fixing device
JP4418484B2 (en) * 2007-07-04 2010-02-17 日本碍子株式会社 Electrostatic chuck and work cooling method using the same
JP4929150B2 (en) * 2007-12-27 2012-05-09 新光電気工業株式会社 Electrostatic chuck and substrate temperature control fixing device
JP4612707B2 (en) * 2008-05-15 2011-01-12 日本特殊陶業株式会社 Electrostatic chuck, electrostatic chuck device, and manufacturing method of electrostatic chuck

Similar Documents

Publication Publication Date Title
JP2011507284A5 (en)
WO2013078409A3 (en) Polymer microfiltration devices, methods of manufacturing the same and the uses of the microfiltration devices
JP2012028755A5 (en) Separation method and manufacturing method of semiconductor device
WO2008126306A1 (en) Catalyst support
JP2013069807A5 (en)
JP6410484B2 (en) Deposition mask assembly
JP2010502010A5 (en)
JP2011508900A5 (en)
EP1998211A3 (en) Methods of fabricating mems with a shaped substrate and devices formed by same
WO2009072291A1 (en) Electrode-film-frame assembly manufacturing method
JP2014237545A5 (en)
JP2010532504A5 (en)
TW200704791A (en) Device and method of forming film
JP2013115352A5 (en)
JP2013188968A5 (en)
WO2013013128A3 (en) Thermally expanding adhesive sheet and manufacturing method thereof
WO2017200621A3 (en) Assembly processes for three-dimensional microstructures
JP2014192386A5 (en)
SG10201908699SA (en) Pattern coated filter and method
JP2018530451A5 (en)
JP2012195095A5 (en)
JP2010157494A5 (en)
JP2010153977A5 (en) Device and method of manufacturing the same
TWI494861B (en) Chip card combination structure and method thereof
GB0904572D0 (en) A method of forming an internal structure in a hollow component