JP2017030216A - Scribing wheel - Google Patents

Scribing wheel Download PDF

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JP2017030216A
JP2017030216A JP2015151697A JP2015151697A JP2017030216A JP 2017030216 A JP2017030216 A JP 2017030216A JP 2015151697 A JP2015151697 A JP 2015151697A JP 2015151697 A JP2015151697 A JP 2015151697A JP 2017030216 A JP2017030216 A JP 2017030216A
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scribing wheel
scribing
ridge line
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diamond
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JP6572660B2 (en
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弘義 林
Hiroyoshi Hayashi
弘義 林
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2015151697A priority Critical patent/JP6572660B2/en
Priority to CN201610553088.9A priority patent/CN106396359B/en
Priority to TW105122678A priority patent/TWI603930B/en
Priority to KR1020160096916A priority patent/KR20170015242A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/105—Details of cutting or scoring means, e.g. tips
    • C03B33/107—Wheel design, e.g. materials, construction, shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • B26F3/002—Precutting and tensioning or breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/32—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist
    • B28D1/327—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist for cutting or shearing easily splittable working materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a scribing wheel which has good "hitching" characteristics and can cause vertical cracks immediately from a position at which scribing starts, for a brittle material substrate having high hardness.SOLUTION: An inclined surface formed of single crystal diamond or polycrystalline diamond of which a cross section is a V shape is formed on the outer periphery of a scribing wheel, and arithmetic average roughness Ra of the inclined surface is set at 0.01 μm or less. A recess 15 at a pitch P of 0.5 μm or more and less than 12 μm is formed on the whole periphery of inclined surfaces 14a and 14b at a predetermined distance from the ridge line 13. Thereby, in the scribing wheel which uses diamond as a base material, "hitching" characteristics can be enhanced.SELECTED DRAWING: Figure 2

Description

本発明は、高硬度の脆性材料基板をスクライブするために好適なスクライビングホイールに関するものである。   The present invention relates to a scribing wheel suitable for scribing a brittle material substrate having high hardness.

従来、液晶表示パネルや太陽電池等の製造工程では、脆性材料基板の分断工程が設けられている。分断工程では、超硬合金や多結晶焼結ダイヤモンド（ＰＣＤ）等から成るスクライビングホイールに脆性材料基板の材質や厚み等の諸条件に見合った荷重を付加しながら、スクライビングホイールを脆性材料基板の表面上を転動させてスクライブラインを形成し、スクライブラインから脆性材料基板の厚さ方向に伸びる垂直クラックを形成する。そして脆性材料基板のスクライブラインに沿って所定の力を加えることによって脆性材料基板を分断し、夫々のパネルやガラス板を製造している。   Conventionally, in a manufacturing process of a liquid crystal display panel, a solar cell, or the like, a brittle material substrate dividing process is provided. In the cutting process, the scribing wheel is applied to the surface of the brittle material substrate while applying a load corresponding to various conditions such as the material and thickness of the brittle material substrate to the scribing wheel made of cemented carbide or polycrystalline sintered diamond (PCD). A scribe line is formed by rolling up, and a vertical crack extending from the scribe line in the thickness direction of the brittle material substrate is formed. Then, by applying a predetermined force along the scribe line of the brittle material substrate, the brittle material substrate is divided to manufacture respective panels and glass plates.

ガラス素材メーカにおいて、基板の材料における改良、熱処理加工における各種改良が行われてきた結果、従来の刃先（ノーマル刃先） を備えたスクライビングホイール（以下、ノーマルホイールともいう）を用いてスクライブした場合に、「かかりが悪い」状態、すなわちスクライビングホイールの転動直後に刃先が基板表面で滑り、スクライブラインが形成されないという現象が見られるようになってきた。   As a result of various improvements in substrate materials and heat treatment processing at glass material manufacturers, when scribing using a scribing wheel (hereinafter also referred to as a normal wheel) equipped with a conventional cutting edge (normal cutting edge) The phenomenon that the cutting edge slips on the substrate surface immediately after the scribing wheel rolls and a scribe line is not formed has been observed.

特許文献１には、高浸透効果を有するスクライビングホイールが開示されている。このスクライビングホイールは、断面Ｖ字形の円周稜線に沿って円周方向に交互に形成された多数の切り欠きと突起を有している。このスクライビングホイールを用いると、ガラス基板の表面から垂直方向にガラス基板の板厚に対して相対的に深い垂直クラックを形成することができる。   Patent Document 1 discloses a scribing wheel having a high penetration effect. This scribing wheel has a large number of notches and protrusions alternately formed in the circumferential direction along a circumferential ridge line having a V-shaped cross section. When this scribing wheel is used, it is possible to form a vertical crack that is relatively deep with respect to the thickness of the glass substrate in the vertical direction from the surface of the glass substrate.

このような高浸透刃先のスクライビングホイールは、ノーマル刃先のスクライビングホイールよりも「かかりの良い」刃先として知られている。   Such highly penetrating cutting edge scribing wheels are known as “faster” cutting edges than normal cutting edge scribing wheels.

特許第３０７４１４３号公報Japanese Patent No. 3074143

しかるにガラス基板より硬質なセラミック等高硬度の脆性材料基板をスクライブする場合には、超硬合金やＰＣＤ製のスクライビングホイールでは、炭化タングステン又はダイヤモンド粒子とコバルト等の結合材で構成されるため、刃先が欠けたり摩耗したりして長い距離クラックを形成することができないことがある。従って硬質な脆性材料基板をスクライブする場合には、超硬合金や焼結ダイヤモンドよりも硬質で、且つ均質な材料の単結晶等のダイヤモンド製スクライビングホイールが好ましい。ダイヤモンド素材のスクライビングホイールでは、刃先は鏡面状となり、傾斜面の表面粗さが小さくなる。そのためさらに基板上で滑りやすく、「かかり」が悪くなり、スクライブ開始直後から垂直クラックを発生させることが難しくなると考えられる。   However, when scribing a high-hardness brittle material substrate such as a ceramic harder than a glass substrate, the scribing wheel made of cemented carbide or PCD is composed of a binder such as tungsten carbide or diamond particles and cobalt, so the cutting edge May not be able to form long distance cracks due to chipping or wear. Therefore, when scribing a hard brittle material substrate, a diamond scribing wheel made of a single crystal of a hard material that is harder and more homogeneous than cemented carbide or sintered diamond is preferable. In a diamond material scribing wheel, the cutting edge is mirror-like and the surface roughness of the inclined surface is reduced. For this reason, it is considered that it is more slippery on the substrate, the “hanging” becomes worse, and it becomes difficult to generate a vertical crack immediately after the start of scribing.

本発明はこのようなダイヤモンド素材のスクライビングホイールの問題点に鑑みてなされたものであって、脆性材料基板をダイヤモンド素材のスクライビングホイールを用いてスクライブする場合であっても、「かかり」が良く、垂直クラックを発生させ易いスクライビングホイールを提供することを目的とする。   The present invention has been made in view of the problems of such a diamond material scribing wheel, and even when scribing a brittle material substrate using a diamond material scribing wheel, "hanging" is good, An object of the present invention is to provide a scribing wheel that easily generates vertical cracks.

この課題を解決するために、本発明のスクライビングホイールは、円板の周囲にダイヤモンドにより構成された稜線と一対の傾斜面から成る断面Ｖ字形の刃先を有し、前記一対の傾斜面の算術平均粗さを０．０１μｍ以下とし、前記刃先の傾斜面の稜線から所定間隔隔てた位置に０．５μｍ以上、１２μｍ未満のピッチの窪みを全周に設けたものである。   In order to solve this problem, a scribing wheel of the present invention has a cutting edge having a V-shaped cross section composed of a ridge line made of diamond and a pair of inclined surfaces around a disk, and an arithmetic average of the pair of inclined surfaces. The roughness is 0.01 μm or less, and depressions with a pitch of 0.5 μm or more and less than 12 μm are provided on the entire circumference at a position spaced from the ridge line of the inclined surface of the cutting edge.

ここで前記スクライビングホイールは、前記傾斜面に沿った前記稜線側端部と稜線との距離Ｌが１μｍ以上、５μｍ以下であるようにしてもよい。   Here, the scribing wheel may be configured such that a distance L between the edge portion on the ridge line side and the ridge line along the inclined surface is 1 μm or more and 5 μm or less.

ここで前記スクライビングホイールは、単結晶ダイヤモンドから成るようにしてもよい。   Here, the scribing wheel may be made of single crystal diamond.

ここで前記スクライビングホイールの窪みの深さは、０．３μｍ以下としてもよい。   Here, the depth of the dent of the scribing wheel may be 0.3 μm or less.

このような特徴を有する本発明によれば、スクライビングホイールの傾斜面に刃先の稜線から所定距離を隔てた両側の傾斜面の全周に、１２μｍ未満の小さいピッチで窪みが形成されている。このため、スクライブ時にかかり性が良好となり、スクライブ開始直後から深いクラックで硬度の高い基板をスクライブすることができるという効果が得られる。   According to the present invention having such a feature, depressions are formed on the inclined surface of the scribing wheel at a small pitch of less than 12 μm on the entire circumference of the inclined surfaces on both sides spaced a predetermined distance from the ridge line of the cutting edge. For this reason, it is possible to obtain good effects when scribing, and it is possible to scribe a substrate having high hardness with a deep crack immediately after the start of scribing.

図１は本発明の実施の形態によるスクライビングホイールの側面図及び正面図である。FIG. 1 is a side view and a front view of a scribing wheel according to an embodiment of the present invention. 図２は本実施の形態のダイヤモンドホイールの刃先部分を拡大して示す側面図及び正面図である。FIG. 2 is an enlarged side view and front view of the cutting edge portion of the diamond wheel of the present embodiment. 図３は本実施の形態のスクライビングホイールの刃先の稜線部分の断面図である。FIG. 3 is a cross-sectional view of the ridge line portion of the cutting edge of the scribing wheel of the present embodiment. 図４は本実施の形態のスクライビングホイールを用いてスクライブする状態を示す拡大断面図である。FIG. 4 is an enlarged cross-sectional view illustrating a scribing state using the scribing wheel of the present embodiment. 図５は本発明の第２の実施の形態によるスクライビングホイールの刃先部分を拡大して示す側面図及び正面図である。FIG. 5 is an enlarged side view and front view of a cutting edge portion of a scribing wheel according to a second embodiment of the present invention. 図６は本発明の第３の実施の形態によるスクライビングホイールの刃先部分を拡大して示す側面図及び正面図である。FIG. 6 is an enlarged side view and front view of a cutting edge portion of a scribing wheel according to a third embodiment of the present invention.

以下、本発明の実施の形態によるスクライビングホイールについて図面を用いて詳細に説明する。本実施の形態において加工の対象となる脆性材料基板は、硬度の高いＳｉＣ基板としているが、これに限定されるものではなく、液晶表示パネル、プラズマディスプレイパネルなどのガラス基板、単結晶シリコン基板、セラミック基板、サファイア基板などの脆性材料基板であってもよい。また、本明細書で用いられている「算術平均粗さＲａ」とは、ＪＩＳＢ０６０１で規定された工業製品の表面粗さを表すパラメーターの一つである。   Hereinafter, scribing wheels according to embodiments of the present invention will be described in detail with reference to the drawings. The brittle material substrate to be processed in the present embodiment is a SiC substrate having high hardness, but is not limited to this, a glass substrate such as a liquid crystal display panel or a plasma display panel, a single crystal silicon substrate, A brittle material substrate such as a ceramic substrate or a sapphire substrate may be used. Further, “arithmetic average roughness Ra” used in the present specification is one of the parameters representing the surface roughness of industrial products defined in JIS B0601.

本発明の実施の形態によるスクライビングホイールの形状を説明する。図１（ａ）は本実施の形態によるスクライビングホイールをその中心軸方向から見た正面図であり、図１（ｂ）はそのスクライビングホイールの側面図である。又図２（ａ）は稜線部分を拡大して示す側面図、図２（ｂ）はその正面図である。   The shape of the scribing wheel according to the embodiment of the present invention will be described. FIG. 1A is a front view of the scribing wheel according to the present embodiment as viewed from the central axis direction, and FIG. 1B is a side view of the scribing wheel. 2A is an enlarged side view showing the ridge line portion, and FIG. 2B is a front view thereof.

本実施の形態のスクライビングホイール１０は、単結晶ダイヤモンドで形成された円板状のホイールであり、図１に示すように、中心軸１１の中心にスクライビングホイール１０を軸支するための図示しないピンが貫通される貫通孔１２を有する。このスクライビングホイール１０の外周面は断面がＶ字形となるように切欠かれ、その中心に稜線１３が形成され、左右には図示のように傾斜面１４ａ，１４ｂを有している。傾斜面１４ａ，１４ｂは、収束角度（α）を有するように形成されている。傾斜面１４ａ，１４ｂは、傾斜面の算術平均粗さＲａが０．０１μｍ以下となるように加工されている。   The scribing wheel 10 of the present embodiment is a disc-shaped wheel formed of single crystal diamond, and a pin (not shown) for pivotally supporting the scribing wheel 10 at the center of the central shaft 11 as shown in FIG. Has a through-hole 12 through which is passed. The outer peripheral surface of the scribing wheel 10 is cut out so as to have a V-shaped cross section, a ridge line 13 is formed at the center thereof, and inclined surfaces 14a and 14b are provided on the left and right as illustrated. The inclined surfaces 14a and 14b are formed to have a convergence angle (α). The inclined surfaces 14a and 14b are processed so that the arithmetic average roughness Ra of the inclined surfaces is 0.01 μm or less.

さてこの実施の形態のスクライビングホイールは、図２に示すように刃先の稜線１３を中心に含む傾斜面１４ａ，１４ｂに、稜線１３からわずかに離れた位置に等間隔で一定のピッチＰにより窪み１５が全周に施されたものである。ここで窪み加工は少なくともスクライブ時に基板と接触する部分に形成されていることが好ましい。図３は刃先部分の断面を示す拡大断面図であり、本図に示すように傾斜面に沿った稜線１３と窪み１５の稜線側の端部との距離Ｌは、例えば１μｍ以上、５μｍ以下とする。この窪み１５はほぼ円形の窪み状であり、稜線１３の両側に所定間隔隔てて形成されている。この窪み１５のピッチＰは０．５μｍ以上で、１２μｍ未満、好ましくは８μｍ未満、さらに好ましくは１μｍ以下とする。又窪み１５の深さｄは０．０５μｍ以上０．７μｍ未満、好ましくは０．３μｍ以下とする。   As shown in FIG. 2, the scribing wheel of this embodiment has depressions 15 with a constant pitch P at equal intervals at a position slightly separated from the ridge line 13 on inclined surfaces 14a and 14b including the ridge line 13 of the cutting edge. Is given all around. Here, it is preferable that the dent processing is formed at least in a portion that contacts the substrate during scribing. FIG. 3 is an enlarged cross-sectional view showing a cross-section of the blade edge portion. As shown in this figure, the distance L between the ridge line 13 along the inclined surface and the end of the dent 15 on the ridge line side is, for example, 1 μm or more and 5 μm or less. To do. The recess 15 has a substantially circular recess shape, and is formed on both sides of the ridge line 13 at a predetermined interval. The pitch P of the recesses 15 is 0.5 μm or more and less than 12 μm, preferably less than 8 μm, and more preferably 1 μm or less. The depth d of the recess 15 is 0.05 μm or more and less than 0.7 μm, preferably 0.3 μm or less.

図４は本実施の形態によるスクライビングホイールを用いてガラス基板をスクライブするときの刃先部分の断面を示す拡大断面図である。本図に示すようにスクライブする際には刃先の先端がガラス基板２０に食い込んでおり、ガラス２０の面が窪み１５にまで入り込むようにスクライブしている。このように微細な窪み加工を稜線１３の両側に形成することによって、高い硬度のＳｉＣ基板等の基板に対しても一定の摩擦係数を確保することができ、かかり性の改善を図ることができる。又窪み１５は稜線１３には掛かっていないため、このスクライビングホイール１０を用いてスクライブし分断したときの基板の端面強度を向上させることができる。   FIG. 4 is an enlarged cross-sectional view showing a cross-section of the blade edge portion when the glass substrate is scribed using the scribing wheel according to the present embodiment. As shown in this figure, when scribing, the tip of the blade edge bites into the glass substrate 20, and scribing is performed so that the surface of the glass 20 enters the recess 15. By forming minute recesses on both sides of the ridge line 13 in this way, a constant coefficient of friction can be secured even for a substrate such as a SiC substrate having a high hardness, and the workability can be improved. . Moreover, since the dent 15 is not hung on the ridge line 13, it is possible to improve the end face strength of the substrate when the scribing wheel 10 is used for scribing and dividing.

本実施の形態のダイヤモンドで形成されたスクライビングホイールの傾斜面に対する窪み加工は、フェムト秒レーザによる表面加工装置を用いて行うことができる。フェムト秒レーザはフェムト秒単位の、極めて短い時間にパワーを圧縮した光源であり、種々の材料に周期的な構造の溝やパターンを形成することができる。ここでは図２，図３に示すように稜線１３の近傍の傾斜面１４ａ，１４ｂに一定ピッチＰで窪み加工を行う。そしてこのフェムト秒レーザの光源やパルス幅を適宜選択することによって所望のサイズ、ピッチＰ及び深さｄの窪み加工を行うことができる。   The recess processing on the inclined surface of the scribing wheel formed of diamond of the present embodiment can be performed using a surface processing apparatus using a femtosecond laser. A femtosecond laser is a light source whose power is compressed in an extremely short time in units of femtoseconds, and grooves and patterns having a periodic structure can be formed in various materials. Here, as shown in FIGS. 2 and 3, the recesses are formed on the inclined surfaces 14 a and 14 b near the ridge line 13 at a constant pitch P. Then, by appropriately selecting the light source and the pulse width of the femtosecond laser, it is possible to perform the recess processing with a desired size, pitch P and depth d.

尚本実施の形態では、窪み加工は図２，図３では円形としているが、図５に第２の実施の形態のスクライビングホイールを示すように長円形の窪み１６であってもよく、又楕円形の窪みであってもよい。この場合にはスクライブする際に基板に食い込む深さを変化させることができるため、スクライブ荷重の幅を大きくすることができる。   In this embodiment, the recess processing is circular in FIGS. 2 and 3, but may be an oval recess 16 as shown in FIG. 5 in the scribing wheel of the second embodiment. It may be a hollow in shape. In this case, since the depth of biting into the substrate can be changed when scribing, the width of the scribing load can be increased.

又本発明の第１の実施の形態では図３に示すように稜線１３に対して傾斜面１４ａ，１４ｂに対称に窪み１５を配置しているが、図６に第３の実施の形態を示すように、傾斜面１４ａ，１４ｂに互い違いに窪み１５が形成されたものであってもよい。また、傾斜面１４、１４ｂのいずれか一方にのみ窪み１５が形成されたものであってもよい。   Further, in the first embodiment of the present invention, as shown in FIG. 3, the depressions 15 are arranged symmetrically on the inclined surfaces 14a and 14b with respect to the ridge line 13, but FIG. 6 shows the third embodiment. As described above, the recesses 15 may be alternately formed in the inclined surfaces 14a and 14b. Moreover, the hollow 15 may be formed only in any one of the inclined surfaces 14 and 14b.

本発明にかかる実施の形態のスクライビングホイールは、かかり性が良好であり、高硬度の基板に対しても滑ることなく、スクライブ開始直後から垂直クラックを生じさせることができる。従って高い硬度の基板に対しても内切りスクライブをすることができるという優れた効果が得られる。また、滑りが生じないためスクライビングホイール稜線が均一に摩耗することになり、スクライビングホイールの寿命をさらに長くすることができる。   The scribing wheel according to the embodiment of the present invention has good workability and can generate a vertical crack immediately after the start of scribing without slipping even on a substrate having high hardness. Therefore, it is possible to obtain an excellent effect that internal scribing can be performed even on a substrate having a high hardness. Further, since no slip occurs, the scribe line of the scribing wheel is uniformly worn, and the life of the scribing wheel can be further extended.

尚この実施の形態ではスクライビングホイールの素材を単結晶ダイヤモンドとしているが、多結晶ダイヤモンドを素材として用いてもよい。この場合にもスクライビングホイールの稜線部分に同様の窪み加工を施すことによって同様の効果を有するスクライビングホイールを構成することができる。   In this embodiment, the material for the scribing wheel is single crystal diamond, but polycrystalline diamond may be used as the material. In this case as well, a scribing wheel having the same effect can be configured by applying the same recess processing to the ridge line portion of the scribing wheel.

又、本実施の形態においては、スクライビングホイール全体が単結晶ダイヤモンドからなるものを示したが、例えば、超硬合金等で構成されたホイール本体部に単結晶又は多結晶ダイヤモンドで構成された刃先部分を接着又は成膜等により固定したスクライビングホイールに対しても本発明は適用可能である。このような構成のスクライビングホイールであれば、高価な単結晶ダイヤモンドの使用を減らし、安価なスクライビングホイールを提供することができる。   Further, in the present embodiment, the entire scribing wheel is made of single crystal diamond. For example, the wheel body portion made of cemented carbide or the like has a cutting edge portion made of single crystal or polycrystalline diamond. The present invention is also applicable to a scribing wheel in which is fixed by adhesion or film formation. With such a scribing wheel, it is possible to reduce the use of expensive single crystal diamond and provide an inexpensive scribing wheel.

本発明は高硬度の脆性材料基板をスクライブするスクライブ装置に適用することができる。   The present invention can be applied to a scribing apparatus for scribing a brittle material substrate having high hardness.

１０ スクライビングホイール
１１ 中心軸
１２ 貫通孔
１３ 稜線
１４ａ，１４ｂ 傾斜面
１５，１６ 窪み DESCRIPTION OF SYMBOLS 10 Scribing wheel 11 Center axis 12 Through-hole 13 Ridge line 14a, 14b Inclined surface 15, 16 Indentation

Claims (4)

円板の周囲にダイヤモンドにより構成された稜線と一対の傾斜面から成る断面Ｖ字形の刃先を有し、前記一対の傾斜面の算術平均粗さを０．０１μｍ以下とし、前記刃先の傾斜面の稜線から所定間隔隔てた位置に０．５μｍ以上、１２μｍ未満のピッチの窪みが全周に設けられたスクライビングホイール。   There is a cutting edge having a V-shaped cross section consisting of a ridge line made of diamond and a pair of inclined surfaces around the disk, the arithmetic average roughness of the pair of inclined surfaces is 0.01 μm or less, and the inclined surface of the cutting edge A scribing wheel in which depressions having a pitch of 0.5 μm or more and less than 12 μm are provided on the entire circumference at a position spaced apart from the ridgeline by a predetermined distance. 前記スクライビングホイールは、その傾斜面に沿った前記稜線側端部と稜線との距離Ｌが１μｍ以上、５μｍ以下である請求項１記載のスクライビングホイール。   2. The scribing wheel according to claim 1, wherein a distance L between the edge portion on the ridge line side and the ridge line along the inclined surface of the scribing wheel is 1 μm or more and 5 μm or less. 前記スクライビングホイールは、単結晶ダイヤモンドから成る請求項１又は２記載のスクライビングホイール。   The scribing wheel according to claim 1 or 2, wherein the scribing wheel is made of single crystal diamond. 前記スクライビングホイールの窪みの深さは、０．３μｍ以下である請求項１〜３のいずれか１項記載のスクライビングホイール。   The scribing wheel according to any one of claims 1 to 3, wherein a depth of the recess of the scribing wheel is 0.3 m or less.
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