JP2017024289A - Expansion/contraction control system for flexible substrate, expansion/contraction control method, alignment method, and electronic device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an expansion/contraction control system for a flexible substrate which can form a fine pattern on a moving flexible substrate having flexibility, and to provide an expansion/contraction control method, an alignment method, and an electronic device manufacturing method.SOLUTION: In an expansion/contraction control method for a flexible substrate, a moire fringe is generated by superimposing a reference moire mark MMR, not causing a dimensional change due to the delivery of a film substrate 8 having flexibility, on a first moire mark MM1 continuously delivered synchronously with the delivery of the film substrate 8, the distortion of the first moire mark is obtained based on the generated moire fringe, and the expansion/contraction of the continuously delivered film substrate 8 is controlled based on the obtained distortion of the first moire mark.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a flexible substrate expansion / contraction control system, an expansion / contraction control method, an alignment method, and an electronic device manufacturing method.

In the manufacturing process of a semiconductor device, there is a process of laminating a fine pattern on a wafer substrate, and an alignment technique between the wafer substrate and the fine pattern is necessary. As the alignment technique, a method is widely used in which alignment marks are provided on each of the wafer substrate and the layer having a fine pattern, and alignment is performed so as to eliminate alignment errors by measuring the relative positions between the alignment marks. Has been.
When superimposing a fine pattern on a wafer substrate with a batch method with high accuracy, it is possible to superimpose with high accuracy when a material having no change in pattern dimensions is used. For example, in a nanoimprint batch-type apparatus that superimposes a fine pattern on a wafer substrate, when high-precision alignment with an overlay accuracy of several tens to several hundreds of nanometers is required, a moire fringe is used instead of a normal alignment mark. A technique is known in which a minute alignment error is magnified and measured by using (Patent Document 1).

  In addition, a roll-to-roll method is known in which a film wound on a roll is continuously flowed in a connected state and a predetermined treatment is performed on the film. In an apparatus capable of performing the roll-to-roll system, when a fine pattern is superimposed on a moving film, alignment is performed to measure an alignment error (overlapping deviation) between the film and the layer having the pattern. Each mark is patterned. The alignment mark thus patterned is picked up by an image sensor, and the alignment is controlled so as to eliminate the alignment error by measuring the relative position between the alignment marks from the picked-up image (Patent Document 2).

  In this way, when measuring the relative position between alignment marks by roll-to-roll method and continuously overlaying a predetermined pattern, the overlay accuracy of the flexible film base material is higher than that of the wafer substrate. Although it is lowered, it is sufficiently practical in a process that allows the overlay accuracy to be ± 10 μm or more.

JP 2010-267682 A JP 2003-72037 A

In recent years, with the miniaturization of a pattern formed on a substrate, a method of aligning with an overlay accuracy of 1 μm or less is desired even in a roll-to-roll continuous process. For this purpose, it is necessary to solve the following two problems.
The first problem is that the resolution at the time of position measurement decreases due to the traveling of a flexible substrate such as a film. In a roll-to-roll continuous process, a film forming a pattern is running. For this reason, in order to optically measure the alignment error on the traveling substrate, the optical device is required to have a measurement resolution smaller than the dimension of the pattern formed on the stationary substrate. Therefore, even with the highest level optical devices that are currently in practical use, the overlay accuracy in a roll-to-roll continuous process is limited to ± 10 μm, which is much larger than the overlay accuracy on a stationary substrate. It is inferior to.

  The second problem is that when a misalignment of the alignment mark is detected, it is not known whether this is a patterning phase misalignment or a change in pattern dimensions due to expansion / contraction of the substrate. The alignment error is a value obtained by reading a shift in relative position between the substrate and each layer stacked on the substrate. However, since the substrate has flexibility, a dimensional change due to expansion / contraction of the substrate may occur even after patterning due to a variation in tension in a continuous roll-to-roll process. In addition, when heat treatment such as drying is performed after patterning, the dimensions may change greatly even if the tension is the same. For this reason, the alignment mark formed on the substrate may not have a design pattern size when photographed. Even if the alignment mark technique using moire fringes useful in the batch type nanoimprint apparatus disclosed in Patent Document 1 is used for an alignment mark on a substrate running in a roll-to-roll system, the first The problem may be solved, but this second problem cannot be solved. In other words, when taking a reference alignment mark, it is unclear whether the alignment error has a phase shift or whether the pattern dimension has changed due to expansion / contraction of the substrate. There is a problem that it cannot be measured.

  Therefore, in the roll-to-roll continuous process, there is a problem that even if the techniques disclosed in Patent Document 1 and Patent Document 2 are used in combination, alignment cannot be performed with an overlay accuracy of 1 μm or less.

  An object of the present invention is to provide a flexible substrate expansion / contraction control system, an expansion / contraction control method, an alignment method, and an electronic device that can form a fine pattern with high alignment accuracy on a flexible flexible substrate. It is to provide a device manufacturing method.

  In order to achieve the above object, a flexible substrate expansion / contraction control method according to an aspect of the present invention provides a flexible substrate with a first mark that is continuously delivered in synchronization with the delivery of the flexible substrate. The first mark is generated by superimposing the second marks having no dimensional change due to the transmission of the first mark, the distortion of the first mark is acquired based on the generated interference pattern, and based on the acquired distortion, The flexible substrate is controlled to extend and contract.

  In order to achieve the above object, an alignment method according to an aspect of the present invention includes aligning a laminated pattern to be laminated on the flexible substrate using the flexible substrate expansion and contraction control method according to the above aspect. It is characterized by.

  In order to achieve the above object, an electronic device manufacturing method according to an aspect of the present invention is characterized in that an electronic device having the stacked pattern is manufactured using the alignment method according to the above aspect.

  In order to achieve the above object, a flexible substrate expansion / contraction control system according to an aspect of the present invention provides a flexible substrate with a first mark that is continuously delivered in synchronization with the delivery of the flexible substrate. A strain acquisition unit that acquires the strain of the first mark based on the first interference fringes generated by superimposing the second marks that do not change in size due to the transmission of the first mark, and continuously transmits based on the acquired strain And a substrate expansion / contraction control unit that controls expansion / contraction of the flexible substrate.

  According to the present invention, a fine pattern can be formed with high alignment accuracy on a flexible substrate that is flexible and traveling.

1 is a schematic diagram showing a schematic configuration of a flexible substrate expansion / contraction control system 100 according to a first embodiment of the present invention. It is a schematic diagram which shows the vicinity of the 1st pattern formation part 22 provided in the expansion-contraction control system 100 of the flexible substrate by the 1st Embodiment of this invention. It is a figure which shows schematic structure of the 1st optical system imaging device 11 provided in the expansion-contraction control system 100 of the flexible substrate by the 1st Embodiment of this invention. It is a figure which shows schematic structure of the 1st reference board 7a etc. with which the expansion-contraction control system 100 of the flexible substrate by the 1st Embodiment of this invention was equipped. It is a figure explaining the calculation of the image processing and correction amount in the expansion-contraction control system 100 of the flexible substrate by the 1st Embodiment of this invention. It is a flowchart which shows an example of the flow of the expansion-contraction control process in the expansion-contraction control method of the flexible substrate by the 1st Embodiment of this invention. It is a schematic diagram which shows schematic structure of the expansion-contraction control system 300 of the flexible substrate by the 2nd Embodiment of this invention. It is a schematic diagram which shows the vicinity of the 1st pattern formation part 42 provided in the expansion-contraction control system 200 of the flexible substrate by the 2nd Embodiment of this invention. It is a schematic diagram which shows schematic structure of the expansion-contraction control system 500 of the flexible substrate by the 3rd Embodiment of this invention. It is a schematic diagram which shows the vicinity of the 2nd pattern formation part 43 provided in the expansion-contraction control system 500 of the flexible substrate by the 3rd Embodiment of this invention. It is the schematic diagram which shows the state which looked at the 1st reference board 17b provided in the expansion-contraction control system 500 of the flexible substrate by the 3rd Embodiment of this invention from the formation surface side of the reference | standard moiré marks MMR1 and MMR2. It is a figure explaining the moire mark etc. which were formed on the film board | substrate 8 in the expansion-contraction control system 500 of the flexible substrate of the 3rd Embodiment of this invention. It is a figure explaining the moire fringe which expresses in the expansion-contraction control system 500 of the flexible substrate of the 3rd Embodiment of this invention. It is a figure explaining the calculation of the image processing and correction amount in the expansion-contraction control system 500 of the flexible substrate by the 3rd Embodiment of this invention.

[First Embodiment]
A flexible substrate expansion / contraction control system, expansion / contraction control method, alignment method, and electronic device manufacturing method according to a first embodiment of the present invention will be described with reference to FIGS. First, a schematic configuration of the flexible substrate expansion / contraction control system according to the present embodiment will be described with reference to FIGS.

  FIG. 1 is a diagram schematically illustrating a flexible substrate expansion / contraction control system 100 (hereinafter, the flexible substrate expansion / contraction control system may be abbreviated as “extraction / contraction control system”) 100 according to the present embodiment. The flexible substrate expansion / contraction control system 100 includes an electronic device manufacturing apparatus 2 that manufactures an electronic device on a flexible substrate, and a substrate expansion / contraction control apparatus that controls expansion / contraction of the flexible substrate conveyed to the electronic device manufacturing apparatus 2. 1. In addition, the electronic device manufacturing apparatus 2 in this embodiment is a manufacturing apparatus that employs a roll-to-roll method. The electronic device according to the present embodiment is an electronic device formed by laminating a plurality of electrode layers having a predetermined pattern, an insulating layer having a predetermined pattern, a semiconductor layer having a predetermined pattern, and the like. Examples of such an electronic device include a logic circuit semiconductor device, a sensor circuit semiconductor device, a memory device, and a display device.

  As shown in FIG. 1, the electronic device manufacturing apparatus 2 in the present embodiment feeds out a flexible substrate 8 (hereinafter referred to as “film substrate”) having a long shape and flexibility. A roll 20 and a take-up roll 21 for winding the film substrate 8 to be conveyed are provided. The electronic device manufacturing apparatus 2 conveys the film substrate 8 from the supply roll 20 toward the take-up roll 21 by a roll-to-roll method. In the substrate transport path between the feeding roll 20 and the take-up roll 21, a first pattern forming portion 22 that forms the first pattern of the first layer on the film substrate 8, and a film on which the first pattern is formed A second pattern forming unit 23 for forming a second pattern of the second layer on the substrate 8 and a third pattern for forming the third pattern of the third layer on the film substrate 8 on which the first and second patterns are formed. Three pattern forming portions 24 are provided. The 1st pattern formation part 22, the 2nd pattern formation part 23, and the 3rd pattern formation part 24 are arrange | positioned from the supply roll 20 side in this order. Although the electronic device manufacturing apparatus 2 in the present embodiment has three pattern forming units, the first to third pattern forming units 22, 23, and 24, the number of pattern forming units is not limited to this. The electronic device manufacturing apparatus 2 can have as many pattern forming portions as the number of stacked layers formed on the film substrate 8.

  The first pattern forming unit 22 forms a predetermined pattern on the film substrate 8 by, for example, an imprint method or a direct gravure method. The 1st pattern formation part 22 has a pair of drive roll 22a and drive roll 22b which were mutually opposingly arranged. Each of the drive roll 22a and the drive roll 22b has a cylindrical shape. Each of the drive roll 22a and the drive roll 22b is configured to rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 22a and the drive roll 22b rotate in opposite directions. The drive roll 22a and the drive roll 22b are rotating in the direction of transporting the film substrate 8 from the feed roll 20 side toward the second pattern forming unit 23 side. The film substrate 8 sandwiched between the drive roll 22a and the drive roll 22b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side. When the film substrate 8 passes between the drive roll 22a and the drive roll 22b while being in contact with the drive roll 22a, a pattern obtained by inverting the pattern formed on the drive roll 22a is the first pattern on the film substrate 8 Formed. Although details will be described later, when the first pattern is formed on the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also formed on the film substrate 8.

  The second pattern forming unit 23 forms a predetermined pattern on the film substrate 8 by, for example, an imprint method or a direct gravure method. The 2nd pattern formation part 23 has a pair of drive roll 23a and drive roll 23b which were mutually opposingly arranged. Each of the drive roll 23a and the drive roll 23b has a cylindrical shape. Each of the drive roll 23a and the drive roll 23b is configured to rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 23a and the drive roll 23b are rotating in opposite directions. The drive roll 23a and the drive roll 23b rotate in the direction in which the film substrate 8 is conveyed from the first pattern forming unit 22 side toward the third pattern forming unit 24 side. The film substrate 8 sandwiched between the drive roll 23a and the drive roll 23b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side. When the film substrate 8 passes between the drive roll 23a and the drive roll 23b while being in contact with the drive roll 23a, a pattern obtained by inverting the pattern formed on the drive roll 23a is formed on the film substrate 8 as a second pattern. Formed. Although details will be described later, when the second pattern is formed on the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also formed on the film substrate 8.

  The third pattern forming unit 24 forms a predetermined pattern on the film substrate 8 by, for example, an imprint method or a direct gravure method. The third pattern forming unit 24 has a pair of drive rolls 24a and drive rolls 24b arranged to face each other. Each of the drive roll 24a and the drive roll 24b has a cylindrical shape. Each of the drive roll 24a and the drive roll 24b rotates at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 24a and the drive roll 24b rotate in opposite directions. The drive roll 24a and the drive roll 24b rotate in the direction in which the film substrate 8 is conveyed from the second pattern forming unit 23 side toward the take-up roll 21 side. The film substrate 8 sandwiched between the drive roll 24a and the drive roll 24b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side. When the film substrate 8 passes between the drive roll 24a and the drive roll 24b while being in contact with the drive roll 24a, a pattern obtained by inverting the pattern formed on the drive roll 24a is formed on the film substrate 8 as a third pattern. Formed. Although details will be described later, when the third pattern is formed on the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also formed on the film substrate 8.

  A first substrate expansion / contraction adjustment unit 25 that adjusts expansion / contraction of the film substrate 8 conveyed to the first pattern formation unit 22 is disposed in the substrate conveyance path between the feeding roll 20 and the first pattern formation unit 22. Yes. A second substrate expansion / contraction adjustment unit 26 that adjusts expansion / contraction of the film substrate 8 conveyed to the second pattern formation unit 23 is provided in the substrate conveyance path between the first pattern formation unit 22 and the second pattern formation unit 23. Has been placed. A third substrate expansion / contraction adjustment unit 27 that adjusts expansion / contraction of the film substrate 8 conveyed to the third pattern formation unit 24 is provided in the substrate conveyance path between the second pattern formation unit 23 and the third pattern formation unit 24. Has been placed. The electronic device manufacturing apparatus 2 has the same number of substrate expansion / contraction adjustment units as the number of pattern formation units, for example.

  The first substrate expansion / contraction adjustment unit 25 includes an expansion / contraction adjustment roll 25a for adjusting expansion / contraction of the film substrate 8, and a carry-in side guide roll for guiding the film substrate 8 continuously sent from the feeding roll 20 side to the expansion / contraction adjustment roll 25a. 25b and a carry-out side guide roll 25c for guiding the film substrate 8 continuously fed from the expansion / contraction adjustment roll 25a to the first pattern forming unit 22. The expansion / contraction adjustment roll 25a, the carry-in side guide roll 25b, and the carry-out side guide roll 25c each have a cylindrical shape. The expansion / contraction adjustment roll 25a, the carry-in side guide roll 25b, and the carry-out side guide roll 25c each rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The expansion / contraction adjustment roll 25a, the carry-in side guide roll 25b, and the carry-out side guide roll 25c rotate in opposite directions. The carry-in side guide roll 25b and the carry-out side guide roll 25c rotate in the same direction. The expansion / contraction adjustment roll 25a, the carry-in side guide roll 25b, and the carry-out side guide roll 25c are each rotated in the direction of transporting the film substrate 8 from the feed roll 20 side toward the first pattern forming unit 22 side. The film substrate 8 is continuously conveyed toward the first pattern forming unit 22 while being in close contact with a part of each surface of the carry-in side guide roll 25b, the expansion / contraction adjustment roll 25a, and the carry-out side guide roll 25c.

  The expansion / contraction adjustment roll 25a is configured to apply a horizontal load in a direction away from the carry-in side guide roll 25b and the carry-out side guide roll 25c so that the film substrate 8 is stretched. The expansion / contraction adjusting roll 25a increases the tension of the film substrate 8 by half of the increase in the horizontal load by increasing the horizontal load or decreases the tension of the film substrate 8 by decreasing the horizontal load by decreasing the horizontal load. It is a roll that can be reduced by half. Thereby, the 1st board | substrate expansion-contraction adjustment part 25 will carry out to the 1st pattern formation part 22 in the state which contracted the film board | substrate 8 relatively, when a horizontal load was made relatively small. On the other hand, when the expansion / contraction adjustment roll 25a relatively increases the horizontal load, the tension applied to the film substrate 8 increases. Thereby, the 1st board | substrate expansion-contraction adjustment part 25 carries out to the 1st pattern formation part 22 in the state which extended the film board | substrate 8 relatively. As such a stretching adjustment roll, for example, an air cylinder type dancer roll can be used. Thus, the 1st board | substrate expansion-contraction adjustment part 25 is comprised so that the expansion / contraction of the film board | substrate 8 may be adjusted by changing the position of the expansion / contraction adjustment roll 25a with respect to the carrying-in side guide roll 25b and the carrying-out side guide roll 25c. . The first substrate expansion / contraction adjustment unit 25 is configured to change the position of the expansion / contraction adjustment roll 25a based on a control signal from the control unit 10 described later.

  The second substrate expansion / contraction adjustment unit 26 includes an expansion / contraction adjustment roll 26a for adjusting expansion / contraction of the film substrate 8 and a carry-in for guiding the film substrate 8 continuously sent from the first pattern forming unit 22 side to the expansion / contraction adjustment roll 26a. A side guide roll 26b and a carry-out side guide roll 26c for guiding the film substrate 8 continuously fed from the expansion / contraction adjustment roll 25a to the second pattern forming unit 23 are provided. The expansion / contraction adjustment roll 26a, the carry-in side guide roll 26b, and the carry-out side guide roll 26c each have a cylindrical shape. The expansion / contraction adjustment roll 26a, the carry-in side guide roll 26b, and the carry-out side guide roll 26c each rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The expansion / contraction adjustment roll 26a, the carry-in side guide roll 26b, and the carry-out side guide roll 26c rotate in opposite directions. The carry-in side guide roll 26b and the carry-out side guide roll 26c rotate in the same direction. The expansion / contraction adjustment roll 26a, the carry-in side guide roll 26b, and the carry-out side guide roll 26c are rotated in the direction in which the film substrate 8 is conveyed from the first pattern forming unit 22 side toward the second pattern forming unit 23 side. The film substrate 8 is continuously conveyed toward the second pattern forming unit 23 while being in close contact with a part of each surface of the carry-in side guide roll 26b, the expansion / contraction adjustment roll 26a, and the carry-out side guide roll 26c.

  The expansion / contraction adjustment roll 26a is configured to apply a horizontal load in a direction away from the carry-in side guide roll 26b and the carry-out side guide roll 26c so that the film substrate 8 is stretched. The expansion / contraction adjustment roll 26a increases the tension of the film substrate 8 by half the increase in the horizontal load by increasing the horizontal load, or decreases the tension of the film substrate 8 by decreasing the horizontal load by decreasing the horizontal load. It is a roll that can be reduced by half. Accordingly, when the horizontal load is relatively reduced, the second substrate expansion / contraction adjustment unit 26 carries the film substrate 8 to the second pattern forming unit 23 in a relatively contracted state. On the other hand, when the expansion / contraction adjustment roll 26a relatively increases the horizontal load, the tension applied to the film substrate 8 increases. As a result, the second substrate expansion / contraction adjusting unit 26 is carried out to the second pattern forming unit 23 with the film substrate 8 relatively stretched. As such a stretching adjustment roll, for example, an air cylinder type dancer roll can be used. Thus, the 2nd board | substrate expansion-contraction adjustment part 26 is comprised so that the expansion / contraction of the film board | substrate 8 may be adjusted by changing the position of the expansion / contraction adjustment roll 26a with respect to the carrying-in side guide roll 26b and the carrying-out side guide roll 26c. . The second substrate expansion / contraction adjustment unit 26 is configured to change the position of the expansion / contraction adjustment roll 26a based on a control signal from the control unit 10 described later.

  The third substrate expansion / contraction adjustment unit 27 includes an expansion / contraction adjustment roll 27a for adjusting expansion / contraction of the film substrate 8 and a carry-in for guiding the film substrate 8 continuously sent from the second pattern forming unit 23 side to the expansion / contraction adjustment roll 27a. A side guide roll 27b and a carry-out side guide roll 27c for guiding the film substrate 8 continuously fed from the expansion / contraction adjustment roll 27a to the third pattern forming unit 24 are provided. The expansion / contraction adjustment roll 27a, the carry-in side guide roll 27b, and the carry-out side guide roll 27c each have a cylindrical shape. The expansion / contraction adjustment roll 27a, the carry-in side guide roll 27b, and the carry-out side guide roll 27c each rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The expansion / contraction adjustment roll 27a, the carry-in side guide roll 27b, and the carry-out side guide roll 27c rotate in opposite directions. The carry-in side guide roll 27b and the carry-out side guide roll 27c rotate in the same direction. The expansion / contraction adjustment roll 27a, the carry-in side guide roll 27b, and the carry-out side guide roll 27c are each rotated in the direction of transporting the film substrate 8 from the second pattern forming unit 23 side toward the third pattern forming unit 24 side. The film substrate 8 is continuously conveyed toward the third pattern forming unit 24 while being in close contact with a part of each surface of the carry-in side guide roll 27b, the expansion / contraction adjustment roll 27a, and the carry-out side guide roll 27c.

  The expansion / contraction adjustment roll 27a is configured to apply a horizontal load in a direction away from the carry-in side guide roll 27b and the carry-out side guide roll 27c so that the film substrate 8 is stretched. The expansion / contraction adjustment roll 27a increases the tension of the film substrate 8 by half of the increase in the horizontal load by increasing the horizontal load, or reduces the tension of the film substrate 8 by the decrease in the horizontal load by decreasing the horizontal load. It is a roll that can be reduced by half. Thereby, if the horizontal load is relatively reduced, the third substrate expansion / contraction adjusting unit 27 carries the film substrate 8 to the third pattern forming unit 24 in a relatively contracted state. On the other hand, when the expansion / contraction adjustment roll 27a relatively increases the horizontal load, the tension applied to the film substrate 8 increases. As a result, the third substrate expansion / contraction adjustment unit 27 is carried out to the third pattern forming unit 24 in a state where the film substrate 8 is relatively stretched. As such a stretching adjustment roll, for example, an air cylinder type dancer roll can be used. In this way, the expansion / contraction adjustment unit 27 is configured to adjust the expansion / contraction of the film substrate 8 by changing the position of the expansion / contraction adjustment roll 27a with respect to the carry-in side guide roll 27b and the carry-out side guide roll 27c. The expansion / contraction adjustment unit 27 is configured to change the position of the expansion / contraction adjustment roll 27a based on a control signal from the control unit 10 described later.

  A first guide roll 28 a that guides the film substrate 8 unwound from the supply roll 20 to the first substrate expansion / contraction adjustment unit 25 in the substrate conveyance path between the supply roll 20 and the first substrate expansion / contraction adjustment unit 25. Is arranged. In the substrate transport path between the first pattern forming unit 22 and the second substrate expansion / contraction adjustment unit 26, the film substrate 8 carried out from the first pattern formation unit 22 is driven to the second substrate expansion / contraction adjustment unit 26. A driving roll 28b and a second guide roll 28c for guiding the film substrate 8 driven by the driving roll 28b to the second substrate expansion / contraction adjusting unit 26 are arranged in this order. In the substrate transport path between the second pattern forming unit 23 and the third substrate expansion / contraction adjustment unit 27, the film substrate 8 carried out from the second pattern formation unit 23 is driven to the third substrate expansion / contraction adjustment unit 27. The drive roll 28d and the third guide roll 28e for guiding the film substrate 8 driven by the drive roll 28d to the third substrate expansion / contraction adjustment unit 27 are arranged in this order. The guide rolls are appropriately arranged in the substrate transport path depending on the route through which the film substrate 8 is transported between the feed roll 20 and the take-up roll 21.

  The conveyance path through which the film substrate 8 is conveyed is divided into six sections by gripping the film substrate 8 by the first drive rolls 22a and 22b, the second drive rolls 23a and 23b, and the third drive rolls 24a and 24b. Yes. The electronic device manufacturing apparatus 2 can control the elongation of the film substrate 8 independently for each section. In the section from the feed roll 20 to the first drive rolls 22a and 22b, the elongation of the film substrate 8 is controlled by the thrust of the first substrate expansion / contraction adjustment unit 25. In the section from the first drive rolls 22a, 22b to the drive roll 28b, the elongation of the film substrate 8 is controlled by the rotational speed of the drive roll 28b with respect to the first drive rolls 22a, 22b. In the section from the drive roll 28b to the second drive rolls 23a and 23b, the elongation of the film substrate 8 is controlled by the thrust of the second substrate expansion / contraction adjustment unit 26. In the section from the second drive rolls 23a, 23b to the drive roll 28d, the elongation of the film substrate 8 is controlled by the rotational speed of the drive roll 28d with respect to the second drive rolls 23a, 23b. In the section from the drive roll 28d to the third drive rolls 24a and 24b, the elongation of the film substrate 8 is controlled by the thrust of the third substrate expansion / contraction adjustment unit 27. In the section from the third drive rolls 24a, 24b to the take-up roll 21, the elongation of the film substrate 8 is controlled by the rotational speed of the take-up roll 21 with respect to the third drive rolls 24a, 24b.

  In the electronic device manufacturing apparatus 2, the elongation of the film substrate 8 is individually controlled in each section described above. If the film substrate 8 flows into the next section in a state where the elongation is different, the elongation in the next section is averaged and gradually changes, which becomes a disturbance when adjusting expansion and contraction. However, in the electronic device manufacturing apparatus 2, the first to third substrate expansion / contraction adjustment units 25, 26, 27 follow the expansion adjustment rolls 25 a, 26 a, 27 a sequentially in accordance with the change in the elongation of the film substrate 8. To do. For this reason, the electronic device manufacturing apparatus 2 can suppress the influence of the previous section and adjust the expansion and contraction of the film substrate 8 to a predetermined amount even when the elongation of the film substrate 8 is different in each section.

  Although illustration is omitted, the electronic device manufacturing apparatus 2 dries the cleaning apparatus for cleaning the film substrate 8 and the material constituting the pattern formed on the film substrate 8 after cleaning and after the formation of the first to third patterns. In addition, various apparatuses such as a drying apparatus that solidifies may be included as necessary.

  As shown in FIG. 1, the substrate expansion / contraction control device 1 is generated based on the control unit 10 that controls the first to third substrate expansion / contraction adjustment units 25, 26, and 27 and the moire marks formed on the film substrate 8. The first optical system imaging device 11, the second optical system imaging device 12, and the third optical system imaging device 13 that image the moire fringes (an example of the first interference fringes). The flexible substrate expansion / contraction control system 100 includes three first reference plates 7a on a moire mark (an example of a first mark that is continuously sent in synchronization with the sending of the film substrate 8) formed on the film substrate 8. , 7b, 7c are superimposed on the reference moire marks (an example of a second mark having no dimensional change due to the feeding of the film substrate 8) to generate moire fringes.

  The first optical system imaging device 11 and the first reference plate 7 a are arranged on the sending side of the first pattern forming unit 22. Although details will be described later, the first optical imaging device 11 includes a moire mark (an example of the first mark) formed on the film substrate 8 by the first pattern forming unit 22 together with the first pattern, and the first reference plate 7a. The moiré fringes based on the interference with the reference moiré mark (an example of the second mark) formed in the image are picked up, and image data obtained by picking up the moiré fringes is output to the control unit 10. The first optical system imaging device 11 captures an image of a moire fringe generated by superimposing the light source 11b irradiating light on the film substrate 8 and the first reference plate 7a and the film substrate 8 and the first reference plate 7a. 11a.

  The second optical system imaging device 12 and the first reference plate 7 b are disposed on the sending side of the second pattern forming unit 23. Although the details will be described later, the second optical system imaging device 12 includes a moire mark (an example of a first mark) formed on the film substrate 8 by the second pattern forming unit 23 together with the second pattern, and the first reference plate 7b. A moire fringe based on interference with a formed reference moire mark (an example of a second mark) is imaged, and image data obtained by imaging the moire fringe is output to the control unit 10. The second optical image pickup device 12 picks up an image of moiré fringes and the like generated by superimposing the light source 12b for irradiating the film substrate 8 and the first reference plate 7b with the film substrate 8 and the first reference plate 7b. Part 12a.

  The third optical system imaging device 13 and the first reference plate 7 c are arranged on the sending side of the third pattern forming unit 24. Although the details will be described later, the third optical system imaging device 13 includes a moire mark (an example of the first mark) formed on the film substrate 8 by the third pattern forming unit 24 together with the third pattern, and the first reference plate 7c. A moire fringe based on interference with a formed reference moire mark (an example of a second mark) is imaged, and image data obtained by imaging the moire fringe is output to the control unit 10. The third optical system imaging device 13 captures images of moiré fringes and the like generated by superimposing the light source 13b irradiating the film substrate 8 and the first reference plate 7c with the light source 13b and the first reference plate 7c. Part 13a.

  The 1st optical system imaging device 11, the 2nd optical system imaging device 12, and the 3rd optical system imaging device 13 have the same composition, and show the same function. The first reference plate 7a, the first reference plate 7b, and the first reference plate 7c have the same configuration and exhibit the same function. Therefore, the optical system imaging device and the first reference plate in the present embodiment will be described below with reference to FIGS. 2 to 5 by taking the first optical system imaging device 11 and the first reference plate 7a as an example.

  FIG. 2 is an enlarged schematic view showing the vicinity of the first pattern forming unit 22 and the first optical system imaging device 11. FIG. 3 is a diagram illustrating a schematic configuration of the optical imaging device 11. In FIG. 3, the film substrate 8 and the first reference plate 7a are shown together for easy understanding. FIG. 4 is a diagram showing a schematic configuration and the like of the first reference plate 7a. FIG. 4A shows a state in which the first reference plate 7a is viewed from the side on which the reference moire mark MMR is formed. FIG. 4B is a schematic diagram showing a state in which the first reference plate 7 a is superimposed on the film substrate 8.

  As shown in FIG. 2, a first moire mark (an example of a first mark) MM <b> 1 is formed on the film substrate 8 that has passed through the first pattern forming unit 22. The first moire mark MM1 is formed on the element formation surface of the film substrate 8 that contacts the drive roll 22a. Although not shown, a first vernier pattern V1 (see FIG. 4B) and a first pattern (not shown) are also formed on the element formation surface of the film substrate 8 on which the first moire mark MM1 is formed. The The first pattern, the first vernier pattern, and the first moiré mark MM1 are formed on the same surface of the film substrate 8 in the first layer forming step by the first pattern forming unit 22.

  The light source 11 b provided in the first optical system imaging device 11 has a light emitting unit 113. The light emitting unit 113 is disposed to face the film substrate 8 sent out from the first pattern forming unit 22. The light source 11 b is disposed opposite to the back surface of the element formation surface of the film substrate 8. Therefore, the light source 11b emits light from the back side of the film substrate 8 on which the first moire mark MM1 is not formed.

  A first reference plate 7a is disposed between the light source 11b and the film substrate 8. The first reference plate 7 a is arranged with a mark forming surface on which a first reference moire mark (an example of a second mark) MMR (details will be described later) is formed facing the back surface of the element forming surface of the film substrate 8. . The imaging unit 11a provided in the first optical system imaging device 11 is disposed to face the light source 11b with the first reference plate 7a and the film substrate 8 interposed therebetween.

  As illustrated in FIG. 3, the imaging unit 11 a includes a mirror 112 that reflects an image irradiated by the light source 11 b, a camera 110 that captures an image reflected on the mirror 112, and an image captured by the camera 110. A telecentric lens 111 that forms an image on an element (not shown). The telecentric lens 111 can form an image on the image sensor while maintaining the image size regardless of the change in the distance in the optical axis direction. For this reason, the first optical system imaging device 11 is accurate even if the first moire mark MM1 formed on the traveling film substrate 8 and the reference moire mark MMR formed on the first reference plate 7a are separated. Moire fringes can be imaged with dimensions.

The film substrate 8 is formed of a transparent resin (for example, a polyester resin typified by PET or PEN, a PC resin, a PI resin, or a PEEK resin). Although the thickness of the film substrate 8 will not be limited if winding to a roll is possible, For example, 1-500 micrometers is preferable. The first reference plate 7a is made of, for example, glass.
On the other hand, the first moire mark MM1 formed on the film substrate 8 is formed of an ink material (for example, metal ink, pigment ink, paint ink, printing ink) that does not easily transmit and reflect light. Further, the reference moire mark MMR formed on the first reference plate 7a is made of a metal material (for example, Cr, Ni, Al, Au, Ag, Cu) that is difficult to transmit and reflect light. As described above, the film substrate 8 is formed with the first moiré mark MM1 including the ink material that does not easily transmit light and the easily-transmitted blank portion, and the first reference plate 7a transmits the metal material that does not easily transmit light. A reference moiré mark MMR including a blank portion that is easy to perform is formed. Therefore, although a part of the light from the light source 11b is blocked by the first moire mark MM1 and the reference moire mark MMR, the light source 11b can illuminate the mirror 112 with a sufficient amount of light to make the mirror 112 function as a mirror. it can. As a result, the first moire mark MM1, the reference moire mark MMR, and moire fringes, which will be described later, are displayed on the surface of the mirror 112 directed toward the light source 11b. Since the mirror 112 has a flat plate shape, the first moiré mark MM1 and the reference moiré mark MMR are projected to the same size as the actual size.

  The first optical system imaging device 11 includes a reference plate adjustment stage 115 disposed between the light source 11b and the mirror 112. The first reference plate 7a is fixedly disposed on the reference plate adjustment stage 115. The reference plate adjustment stage 115 can adjust the relative position between the first moire mark MM1 formed on the film substrate 8 and the reference moire mark MMR formed on the first reference plate 7a. The reference plate adjustment stage 115 is orthogonal to the transport direction of the film substrate 8 in the transport direction of the film substrate 8 (the direction indicated by the thick arrow shown in FIG. The first reference plate 7a can be moved relative to the film substrate 8 in the direction of rotation and the rotation direction with the optical axis of the light source 11b as the rotation axis. The reference plate adjustment stage 115 is controlled by the control unit 10 (see FIG. 1).

  As shown on the right side in FIGS. 3 and 4A, the first reference plate 7a has a thin plate rectangular shape. A reference moire mark MMR is formed on the first reference plate 7a. The reference moire mark MMR has a plurality of linear patterns formed so as to be arranged substantially parallel to the longitudinal direction of the first reference plate 7a. The plurality of linear patterns have an elongated rectangular shape extending from the region connecting the midpoints of both ends of the first reference plate 7a toward one long side. As shown on the left side in FIG. 4A, the reference moire mark MMR is formed such that the pitch value of the plurality of linear patterns is “P1”. Hereinafter, “P1” may also be used as a reference symbol indicating the pitch of a plurality of linear patterns of the reference moire mark MMR.

  As shown on the right side in FIG. 4B, the first moire mark MM <b> 1 is formed on the film substrate 8 in the first pattern forming unit 22. The first moire mark MM <b> 1 has a plurality of linear patterns formed in parallel with the longitudinal direction of the film substrate 8. The first moire mark MM1 is formed between one long side of the film substrate 8 and a device formation area DA where an electronic device to be manufactured is formed. The plurality of linear patterns constituting the first moire mark MM1 have an elongated rectangular shape extending in a direction orthogonal to one long side of the film substrate 8. As shown on the left side in FIG. 4B, the first moire mark MM1 is designed on the traveling film substrate 8 although the pitch value of the plurality of linear patterns is designed as “P1d + ΔP1d”. The image obtained by capturing the pattern includes “P1 + ΔP1” because it includes a pitch error due to expansion and contraction of the substrate. Hereinafter, “P1 + ΔP1” may also be used as a reference symbol indicating the pitch of a plurality of linear patterns of the first moire mark MM1.

  As shown on the right side in FIG. 4B, the first vernier pattern V1 is formed on the film substrate 8 simultaneously with the formation of the first moire mark MM1. The first vernier pattern V1 has a plurality of rectangular patterns. The rectangular pattern has a long side along the long side of the film substrate 8. The rectangular pattern constituting the first vernier pattern V1 is designed with the same pitch as the moire when the next layer is aligned. The first vernier pattern V1 is formed of the same material as the first moiré mark MM1. For this reason, the first vernier pattern V1 is difficult to transmit and reflect light.

  The difference between the pitch P1 + ΔP1 of the first moire mark MM1 and the pitch P1 of the reference moire mark MMR is “ΔP1”, which is a minute value compared to “P1”. From the overlapping position where one linear pattern constituting the first moiré mark MM1 and one linear pattern of the reference moiré mark MMR overlap, the first moiré mark increases as the traveling direction of the film substrate 8 moves to the right or left. The deviation between the linear pattern of MM1 and the linear pattern of the reference moire mark MMR increases. For example, another linear pattern of the reference moiré mark MMR is arranged at an intermediate position between adjacent linear patterns of the first moiré mark MM1 at a position away from the overlapping position to the right or left by a predetermined distance. . As it goes further to the right or left from this intermediate position, the deviation between the linear pattern of the first moire mark MM1 and the linear pattern of the reference moire mark MMR decreases, and yet another linear pattern of the first moire mark MM1. The pattern and another linear pattern of the reference moire mark MMR overlap. In the vicinity of the overlapping position where the linear pattern of the first moire mark MM1 and the linear pattern of the reference moire mark MMR overlap, the density of the linear pattern becomes sparse. On the other hand, in the vicinity of the position where the linear pattern of the reference moire mark MMR (or the first moire mark MM1) is arranged between the linear patterns of the first moire mark MM1 (or the reference moire mark MMR), The density becomes dense. For this reason, as shown on the right side in FIG. 4B, when the linear pattern constituting the first moiré mark MM1 and the linear pattern of the reference moiré mark MMR are superimposed almost in parallel, the density becomes light and dark at a predetermined cycle. Is generated (see FIG. 5A). Since the first reference plate 7a is fixed to the reference plate adjustment stage 115, for example, when the film substrate 8 is continuously conveyed in the direction of the thick arrow shown on the right side in FIG. Also appears to move in the direction of the thick arrow.

  Although the details will be described later, the flexible substrate expansion / contraction control system 100 according to the present embodiment has the moire fringes MF densely within the imaging region α by the first optical system imaging device 11 as shown in FIG. Take an image with a field of view that contains two or more parts. The expansion / contraction control system 100 calculates the luminance distribution of the moire fringe MF based on the captured moire fringe MF, and calculates the moire fringe pitch Pm from the luminance distribution of the moire fringe MF. The expansion / contraction control system 100 obtains a first pattern strain ε relative to the first reference plate 7a from the calculated moire fringe pitch Pm and moire fringe design pitch Pmd. For this reason, imaging is performed in a field of view in which two or more dense portions of the moire fringes MF enter.

  Returning to FIG. 3, the telecentric lens 111 can image the first moire mark MM1 and the reference moire mark MMR projected on the mirror 112 on the image sensor of the camera 110 without changing their sizes. For this reason, the camera 110 can image the first moire mark MM1, the reference moire mark MMR, the moire fringe MF, and the like that are within the imaging area α shown in FIG. The camera 110 outputs the captured image data to the control unit 10.

  Returning to FIG. 1, the control unit 10 is provided in, for example, a personal computer. The control unit 10 includes an image processing unit 10a that performs image processing on the imaging data transmitted from the first to third optical system imaging devices 11, 12, and 13, respectively. In addition, the control unit 10 includes a correction amount calculation unit 10b that calculates a correction amount for correcting the tension applied to the film substrate 8 based on each moire fringe image generated by image processing by the image processing unit 10a. doing.

FIG. 5 is a diagram illustrating image processing and correction amount calculation in the control unit 10. FIG. 5A shows an example of an image generated by the image processing unit 10 a based on the imaging data received from the first optical system imaging device 11. FIG. 5B shows a moire fringe luminance distribution based on the image shown in FIG.
In FIG. 5B, the vertical axis indicates the level of the luminance of the moire fringes, and the horizontal axis indicates the position on the straight line L2 shown in FIG.

  The image processing unit 10a performs image processing on imaging data transmitted from the camera 110 (see FIG. 3) of the first optical system imaging device 11. As shown in FIG. 5 (a), the image processing unit 10a generates the reference moire mark MMR and the first moire mark MM1 that are superimposed on each other and the marks MMR and MM1 as a result of the image processing. An image on which the moire fringes MF are displayed is generated. Since the linear patterns of the reference moire mark MMR and the first moire mark MM1 hardly transmit the light emitted by the light source 11b (see FIG. 2), the image generated by the image processing unit 10a has a relatively dark color (for example, black). ). Further, in the vicinity of the overlapping position where the linear pattern of the first moiré mark MM1 and the linear pattern of the reference moiré mark MMR overlap, the density of the linear pattern is sparse, so that the relative value in the image generated by the image processing unit 10a. Are expressed in bright colors. On the other hand, in the vicinity of the position where one linear pattern of the reference moiré mark MMR and the first moiré mark MM1 is disposed between the other linear patterns, the density of the linear pattern is high, so that the image processing unit 10a has a high density. Represented in a relatively dark color in the generated image.

  The correction amount calculation unit 10b that has received the image shown in FIG. 5A from the image processing unit 10a calculates the pattern distortion ε of the first moire mark MM1. In order to calculate the pattern distortion ε, the correction amount calculation unit 10b first generates a moire fringe luminance distribution shown in FIG. The correction amount calculation unit 10b generates a moire fringe luminance distribution based on light and darkness on the straight line L2 that is substantially parallel to the straight line L1 and crosses the center of the image of the moire fringe MF. The density of the linear pattern formed by the linear pattern of the first moire mark MM1 and the linear pattern of the reference moire mark MMR gradually changes from the sparse state to the dense state and from the dense state to the state. . For this reason, the moire luminance distribution has a wave shape such as a sine wave as shown in the lower part of FIG.

As shown in FIG. 5B, the correction amount calculation unit 10b calculates the moire fringe pitch Pm. The correction amount calculation unit 10b calculates the pattern distortion ε using the following formula (1) from the pitch P1, the moire fringe design pitch Pmd, and the moire fringe pitch Pm of the reference moire mark MMR.
ε = (P1 / Pmd) × (Pmd−Pm) / (Pmd−P1) (1)

  The correction amount calculation unit 10b calculates a correction amount for controlling the tension applied to the film substrate 8 so that the calculated pattern distortion ε becomes zero. The correction amount is, for example, the amount of movement of the arrangement position of the expansion / contraction adjustment roll 25a. The control unit 10 transmits a control signal based on the correction amount calculated by the correction amount calculation unit 10b to the expansion / contraction adjustment rolls 25a, 26a, and 27a, and controls expansion and contraction of the film substrate 8 that is continuously sent out.

  As described above, the correction amount calculation unit 10b causes the first mark (for example, the first moire mark MM1) that is continuously sent in synchronization with the sending of the flexible substrate to undergo a dimensional change due to the sending of the flexible substrate. This corresponds to a strain acquisition unit that acquires a distortion (for example, pattern distortion ε) of the first mark based on interference fringes (for example, moire fringes MF) generated by overlapping non-existing second marks (for example, reference moire marks MMR). The control unit 10 corresponds to a substrate expansion / contraction control unit that controls expansion / contraction of a flexible substrate (for example, the film substrate 8) that is continuously sent and has a long shape and flexibility based on the acquired strain. To do.

  For example, when the pattern distortion ε becomes the minimum value (zero), the difference between the moire fringe pitch Pm captured during traveling and the moire fringe design pitch Pmd becomes minimum (zero). In this case, it means that the moire fringe MF based on the first moire mark MM1 actually formed is an ideal moire fringe. Since the pitch P1 of the reference moire mark MMR is formed as designed, when the pattern distortion ε becomes the minimum value (zero), the first moire mark MM1 is also formed as designed. Therefore, when the tension applied to the film substrate 8 is controlled so that the pattern strain ε becomes the minimum value (zero) and the film substrate 8 is expanded and contracted in a predetermined state, the first pattern is formed on the film substrate 8. The first pattern thus formed is a pattern as designed.

  The first to third optical system imaging devices 11, 12, and 13 have a reference plate adjustment stage. For this reason, even if each of the first to third pattern forming portions 22, 23, 24 changes the formation location of the moire mark formed on the film substrate 8, the substrate expansion / contraction control device 1 does not change the first reference plate 7 a, The reference moire marks can be superimposed on the moire marks formed by the first to third pattern forming portions 22, 23, and 24. For this reason, the substrate expansion / contraction control apparatus 1 can calculate the pattern distortion for each moire mark formed by the first to third pattern forming units 22, 23, and 24. Therefore, the substrate expansion / contraction control device 1 can individually control the first to third substrate expansion / contraction adjustment units 25, 26, and 27.

  A flexible substrate expansion / contraction control method, alignment method, and electronic device manufacturing method according to the present embodiment will be described with reference to FIGS. 1 to 5 and FIG. FIG. 6 is a flowchart showing an example of the flow of expansion / contraction control processing in the flexible substrate expansion / contraction control method according to the present embodiment. Each process included in the flowchart shown in FIG. 6 is executed by the control unit 10. Hereinafter, the expansion / contraction control process based on the imaging data acquired by the first optical system imaging device 11 will be described as an example.

  As shown in FIG. 6, in the expansion / contraction control process, first, in step S1, a moire image is acquired, and the process proceeds to step S3. In step S1, based on a command from the control unit 10, the first optical system imaging device 11 uses the first moire mark MM1 formed on the film substrate 8 and the reference moire mark MMR formed on the first reference plate 7a. The moiré fringes and their surroundings that are manifested by overlapping are imaged. The first optical system imaging device 11 transmits the captured moire fringes and surrounding imaging data to the image processing unit 10 a of the control unit 10. Thereby, the control part 10 acquires a moire fringe as imaging data.

  In step S3, the acquired moire fringes are subjected to image processing, and the process proceeds to step S5. In step S3, the image processing unit 10a performs image processing on the acquired imaging data, and generates an image (see FIG. 5A) on which at least the moire fringes MF are displayed. The image processing unit 10a transmits the generated image to the correction amount calculation unit 10b.

  In step S5, a moire fringe luminance distribution is generated, and the process proceeds to step S7. In step S5, the correction amount calculation unit 10b generates a moire fringe luminance distribution (see the lower stage in FIG. 5B) based on the received image.

  In step S7, the moire fringe pitch Pm is calculated, and the process proceeds to step S9. In step S7, the correction amount calculation unit 10b calculates the moire fringe pitch Pm based on the generated moire fringe luminance distribution.

  In step S9, the pattern distortion is acquired, and the process proceeds to step S11. In step S9, the correction amount calculation unit 10b calculates the pattern distortion ε using the calculated moire pitch Pm, the design moire pitch Pmd, the pitch P1 of the reference moire mark MMR, and the equation (1).

In step S11, the correction value of the tension applied to the flexible substrate is calculated, and the expansion / contraction control processing of the flexible substrate is terminated. In step S11, the correction amount calculation unit 10b calculates a correction amount for controlling the tension applied to the film substrate 8 so that the calculated first pattern distortion ε is zero. The tension correction value ΔT can be expressed by the following equation (2).
ΔT = ε × E × A (2)
Here, “ε” represents the pattern strain calculated using the formula (1), “E” represents the Young's modulus of the flexible substrate (in this example, the film substrate 8), and “A” represents It represents the cross-sectional area of the flexible substrate.

  The correction amount calculation unit 10b calculates, for example, the movement amount of the arrangement position of the expansion / contraction adjustment roll 25a as the correction amount. When the value of the pattern distortion ε is positive, the value of the moire pitch Pm is larger than the value of the design moire pitch Pmd. In this case, the value of the pitch P1 + ΔP1 of the first moire mark MM1 is closer to the value of the pitch P1 of the reference moire mark MMR than the design value. In the present embodiment, since the rotation speed of each roll such as the drive roll 22a is not changed, the film substrate 8 needs to be stretched in order to increase the pitch P1 + ΔP1 of the first moire mark MM1. Therefore, the control unit 10 increases the tension applied to the film substrate 8 so that the expansion / contraction adjustment roll 25a approaches the guide rolls 25b and 25c by the movement amount calculated by the correction amount calculation unit 10b. To control.

  On the other hand, when the value of the pattern distortion ε is negative, the value of the moire pitch Pm is smaller than the value of the design moire pitch Pmd. In this case, the value of the pitch P1 + ΔP1 of the first moire mark MM1 is farther from the value of the pitch P1 of the reference moire mark MMR than the design value. In the present embodiment, since the rotation speed of each roll such as the drive roll 22a is not changed, it is necessary to shrink the film substrate 8 in order to reduce the pitch P1 + ΔP1 of the first moire mark MM1. Therefore, in order to reduce the tension applied to the film substrate 8, the control unit 10 reduces the expansion / contraction adjustment roll 25a away from the guide rolls 25b and 25c by the movement amount calculated by the correction amount calculation unit 10b. To control.

  In the present embodiment, the film substrate 8 is preferably transported at a speed of 0.1 m to 10 m / min. On the other hand, moire fringes are imaged every 100 ms, for example, and pattern distortion is calculated. For this reason, in this embodiment, the expansion / contraction of the film substrate 8 is controlled every time the film substrate 8 is transported by approximately 0.2 mm to 20 mm.

  The electronic device manufacturing apparatus 2 according to the present embodiment forms the first moire mark MM1 on the film substrate 8 when the first pattern of the first pattern is formed, and the second moire mark when the second pattern of the second layer is formed. A third moire mark is formed on the film substrate 8 when the third pattern of the third layer is formed. For this reason, by forming the pitch of the linear pattern of the first moiré mark MM1 on the flexible substrate according to the above-described expansion / contraction control method as designed, the wiring pitch and wiring width in the first pattern are also designed as designed. Formed. Similarly, by forming the pitch of the linear pattern of the second moire mark as designed, the wiring pitch and wiring width in the second pattern are also formed as designed. Similarly, by forming the pitch of the linear pattern of the third moiré mark as designed, the wiring pitch and wiring width in the third pattern are also formed as designed. Therefore, by controlling the expansion and contraction of the film substrate 8 based on the first to third moire marks, the first to third patterns are formed as designed.

After the first to third patterns are formed as designed using the expansion / contraction control of the plastic substrate, the alignment is performed by controlling the phases of the first to third patterns when there is an alignment error of each pattern. Is called. For the phase control, a known compensation method or a compensationless method can be used.
The compensation method is a method in which the phase is controlled by moving the expansion / contraction adjustment roll 25a horizontally and changing the path length of the plastic substrate. For example, when the alignment error of the second mark with respect to the first mark is +10 μm in the direction in which the substrate flows, the expansion / contraction adjustment roll 25a is changed by 5 μm so that the path length is shortened by 10 μm. The compensation-free method (plate cylinder phase correction method) is a method of controlling the phase by instantaneously changing the rotation speed of the plate cylinder. For example, when the alignment error of the second mark with respect to the first mark is +10 μm in the direction in which the substrate flows, the rotational speed is instantaneously decreased by an amount corresponding to −10 μm in the circumference of the second pattern plate. And adjust the phase.
As described above, according to the present embodiment, the first to third patterns are formed as designed by the expansion / contraction control of the plastic substrate, so that errors in the first to third patterns are reduced. Even if phase control is used, the alignment accuracy is improved and a desired laminated pattern can be formed.

As described above, the alignment method according to the present embodiment aligns the laminated pattern to be laminated on the film substrate 8 using the flexible substrate expansion / contraction control method according to the present embodiment. In the alignment method according to the present embodiment, the first to third moire marks and the reference moire mark are used as the alignment marks.
Moreover, a desired laminated pattern can be formed by using the alignment method according to the present embodiment. For this reason, the manufacturing method of the electronic device according to the present embodiment can form a desired stacked pattern using the alignment method according to the present embodiment, and can manufacture an electronic device constituted by the stacked pattern.

As described above, according to the flexible substrate expansion / contraction control system, the expansion / contraction control method, the alignment method, and the electronic device manufacturing method according to the present embodiment, a minute alignment error below the pixel order using moire fringes. Can be magnified and measured. For this reason, in a continuous process using a roll-to-roll system, the minute relative strain of a pattern formed on a flexible substrate is measured using moire fringes, and imaging is performed by knowing the relative strain. It becomes possible to measure a minute alignment error equal to or smaller than the pixel size of the apparatus without being affected by a change in pattern. For this reason, according to the present embodiment, it is possible to realize a highly accurate superposition of a fine pattern on a flexible substrate to be delivered. Accordingly, since a complicated circuit element can be formed over a flexible substrate, electronic devices such as a logic circuit semiconductor device, a sensor circuit semiconductor device, a memory device, and a display device can be formed over the flexible substrate.
Further, according to the present embodiment, even with single layer patterning, by using a reference plate having a reference moire mark, the relative strain of the single layer pattern with respect to the reference plate can be measured. Accuracy can also be improved, contributing to improved overlay accuracy.

[Second Embodiment]
A flexible substrate expansion / contraction control system, expansion / contraction control method, alignment method, and electronic device manufacturing method according to a second embodiment of the present invention will be described with reference to FIGS. In the flexible substrate expansion / contraction control system, the expansion / contraction control method, the alignment method, and the electronic device manufacturing method according to the present embodiment, the pattern formed on the flexible substrate is once blanketed in the offset printing method or the reverse printing method. It is characterized in that the moire mark is also transferred at the time of transfer, and moire fringes are expressed based on the moire mark transferred on the blanket. In the flexible substrate expansion / contraction control system, expansion / contraction control method, alignment method, and electronic device manufacturing method according to the present embodiment, the flexible substrate expansion / contraction control system, expansion / contraction control method, and alignment according to the first embodiment. Components having the same functions and operations as those of the method and the electronic device manufacturing method are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 7 is a diagram schematically illustrating the flexible substrate expansion / contraction control system 300 according to the present embodiment. The flexible substrate expansion / contraction control system 300 includes an electronic device manufacturing apparatus 4 that manufactures an electronic device on a flexible substrate, and a substrate expansion / contraction control apparatus 3 that controls expansion / contraction of the flexible substrate. In addition, the electronic device manufacturing apparatus 4 in this embodiment is a manufacturing apparatus which employ | adopted the roll-to-roll system. In addition, the target electronic device in the present embodiment is the same as the target electronic device in the first embodiment.

  As shown in FIG. 7, the electronic device manufacturing apparatus 4 conveys the film substrate 8 from the feeding roll 20 toward the winding roll 21 in a roll-to-roll manner. In the substrate conveyance path between the feeding roll 20 and the take-up roll 21, a first pattern forming portion 42 that forms a first pattern of the first layer on the film substrate 8, and a film on which the first pattern is formed A second pattern forming portion 43 for forming a second pattern of the second layer on the substrate 8, and a third pattern for forming a third pattern of the third layer on the film substrate 8 on which the first and second patterns are formed. A three-pattern forming unit 44 is provided. The 1st pattern formation part 42, the 2nd pattern formation part 43, and the 3rd pattern formation part 44 are arrange | positioned from the supply roll 20 side in this order. Although the electronic device manufacturing apparatus 4 in the present embodiment has three pattern forming portions, the first to third pattern forming portions 42, 43, and 44, the number of pattern forming portions is not limited thereto. The electronic device manufacturing apparatus 4 can have as many pattern forming portions as the number of stacked layers formed on the film substrate 8. Further, the electronic device manufacturing apparatus 4 dries and / or solidifies the material that forms the pattern formed on the film substrate 8 after cleaning and after the formation of the first to third patterns after cleaning the film substrate 8. You may have various apparatuses as needed, such as a drying apparatus.

  The first pattern forming unit 42 is configured to form a predetermined pattern on the film substrate 8 by, for example, an offset printing method or a reverse printing method. The 1st pattern formation part 42 has the drive roll 42a, the blanket roll 42c arrange | positioned in contact with the drive roll 42a, and the drive roll 42b arrange | positioned facing the blanket roll 42c. Each of the drive roll 42a, the drive roll 42b, and the blanket roll 42c has a cylindrical shape. Each of the drive roll 42a, the drive roll 42b, and the blanket roll 42c is configured to rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 42a, the drive roll 42b, and the blanket roll 42c rotate in opposite directions. The blanket roll 42c and the drive roll 42b rotate from the feeding roll 20 side toward the second pattern forming portion 43 side. The film substrate 8 sandwiched between the blanket roll 42c and the drive roll 42b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side.

  When the blanket roll 42c rotates while contacting the drive roll 42a, a pattern obtained by inverting the pattern formed on the drive roll 42a is transferred onto the blanket roll 42c. When the film substrate 8 passes between the blanket roll 42c and the drive roll 42b while contacting the blanket roll 42c, a pattern obtained by inverting the pattern transferred on the blanket roll 42c is formed on the film substrate 8 as a first pattern. Re-transferred to form. Therefore, the same pattern as the pattern formed on the drive roll 42a is formed on the film substrate 8 as the first pattern. Although details will be described later, when the pattern of the drive roll 42a is transferred onto the blanket roll 42c, the moiré mark used for the expansion / contraction control of the film substrate 8 and the mark or pattern obtained by inverting the vernier pattern are also transferred to the blanket roll 42c. . Further, when the first pattern is retransferred onto the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also retransferred onto the film substrate 8.

  The second pattern forming unit 43 forms a predetermined pattern on the film substrate 8 by, for example, an offset printing method or a reverse printing method. The 2nd pattern formation part 43 has the drive roll 43a, the blanket roll 43c arrange | positioned in contact with the drive roll 43a, and the drive roll 43b arrange | positioned facing the blanket roll 43c. Each of the drive roll 43a, the drive roll 43b, and the blanket roll 43c has a cylindrical shape. Each of the drive roll 43a, the drive roll 43b, and the blanket roll 43c is configured to rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 43a, the drive roll 43b, and the blanket roll 43c rotate in opposite directions. The blanket roll 43c and the drive roll 43b rotate from the first pattern forming unit 42 side toward the third pattern forming unit 44 side. The film substrate 8 sandwiched between the blanket roll 43c and the drive roll 43b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side.

  As the blanket roll 43c rotates while contacting the drive roll 43a, a pattern obtained by inverting the pattern formed on the drive roll 43a is transferred onto the blanket roll 43c. When the film substrate 8 passes between the blanket roll 43c and the drive roll 43b while being in contact with the blanket roll 43c, a pattern obtained by inverting the pattern transferred onto the blanket roll 43c is formed on the film substrate 8 as a second pattern. Re-transferred to form. Therefore, the same pattern as the pattern formed on the drive roll 43a is formed on the film substrate 8 as the second pattern. Although details will be described later, when the pattern of the driving roll 43a is transferred onto the blanket roll 43c, the moire mark or the mark or pattern obtained by inverting the vernier pattern used for the expansion / contraction control of the film substrate 8 is also transferred to the blanket roll 43c. . Further, when the second pattern is retransferred onto the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also retransferred onto the film substrate 8.

  The third pattern forming unit 44 forms a predetermined pattern on the film substrate 8 by, for example, an offset printing method or a reverse printing method. The third pattern forming unit 44 includes a drive roll 44a, a blanket roll 44c disposed in contact with the drive roll 44a, and a drive roll 44b disposed to face the blanket roll 44c. Each of the drive roll 44a, the drive roll 44b, and the blanket roll 44c has a cylindrical shape. Each of the drive roll 44a, the drive roll 44b, and the blanket roll 44c is configured to rotate at a predetermined position with the central axis of the cylinder as a rotation axis. The drive roll 44a, the drive roll 44b, and the blanket roll 44c rotate in opposite directions. The blanket roll 44c and the drive roll 44b rotate from the second pattern forming unit 43 side toward the take-up roll 21 side. The film substrate 8 sandwiched between the blanket roll 44c and the drive roll 44b is continuously conveyed from the feed roll 20 side toward the take-up roll 21 side.

  When the blanket roll 44c rotates while contacting the drive roll 44a, a pattern obtained by inverting the pattern formed on the drive roll 44a is transferred onto the blanket roll 44c. When the film substrate 8 passes between the blanket roll 44c and the drive roll 44b while contacting the blanket roll 44c, a pattern obtained by inverting the pattern transferred on the blanket roll 44c is formed on the film substrate 8 as a third pattern. Re-transferred to form. Therefore, the same pattern as the pattern formed on the drive roll 44a is formed on the film substrate 8 as the third pattern. Although details will be described later, when the pattern of the drive roll 44a is transferred onto the blanket roll 44c, the moiré mark used for the expansion / contraction control of the film substrate 8 or a mark or pattern obtained by inverting the vernier pattern is also transferred to the blanket roll 44c. . In addition, when the third pattern is retransferred onto the film substrate 8, moire marks and vernier patterns used for expansion / contraction control of the film substrate 8 are also retransferred onto the film substrate 8.

  As shown in FIG. 7, the substrate expansion / contraction control device 3 is generated based on the control unit 30 that controls the first to third substrate expansion / contraction adjustment units 25, 26, and 27 and the moire mark formed on the film substrate 8. The first optical system imaging device 11, the second optical system imaging device 12, the third optical system imaging device 13, the fourth optical system imaging device 31, and the fifth optical that capture the captured moire fringes (an example of the first interference fringes). A system imaging device 32 and a sixth optical system imaging device 33. The flexible substrate expansion / contraction control system 300 generates the moire fringes by individually superimposing the three first reference plates 7 a, 7 b, 7 c on the moire marks formed on the film substrate 8. Further, the flexible substrate expansion / contraction control system 300 overlaps the moire mark formed on the blanket roll 42c with the second reference plate 9a to generate moire fringes, and the moire mark formed on the blanket roll 43c has the second on the moire mark. The reference plate 9b is overlapped to generate moire fringes, and the second reference plate 9c is overlapped with the moire marks formed on the blanket roll 44c to generate moire fringes.

  The fourth optical system imaging device 31, the fifth optical system imaging device 32, and the sixth optical system imaging device 33 have the same configuration and perform the same functions. The second reference plate 9a, the second reference plate 9b, and the second reference plate 9c have the same configuration and perform the same function. Therefore, hereinafter, the optical imaging device and the second reference plate in the present embodiment will be described with reference to FIG. 7 with reference to FIG. 8 taking the fourth optical imaging device 31 and the second reference plate 9a as an example. FIG. 8 is an enlarged schematic view showing the vicinity of the first pattern forming unit 42, the first optical system imaging device 11, and the fourth optical system imaging device 31.

  As shown in FIG. 8, a first moire mark (an example of a first mark) MM1 is formed on the film substrate 8 that has passed through the first pattern forming portion. The first moire mark MM1 is formed on the element formation surface on the surface of the film substrate 8 that contacts the blanket roll 42c. Although not shown, a first vernier pattern and a first pattern are also formed on the element formation surface of the film substrate 8 on which the first moire mark MM1 is formed. The first pattern, the first vernier pattern, and the first moiré mark MM1 are formed on the same surface of the film substrate 8 in the first layer forming step by the first pattern forming unit 22. The vernier pattern in the present embodiment has the same shape as the vernier pattern V1 in the first embodiment.

  The fourth optical system imaging device 31 captures an image of moiré fringes generated by superimposing the first light source 31b and the second light source 31c irradiating the blanket roll 42c with the blanket roll 42c and the second reference plate 9a. Part 31a. Since the imaging unit 31a has the same configuration as the imaging unit 11a provided in the first optical system imaging device 11 in the first embodiment and exhibits the same function, detailed description thereof is omitted.

  The 1st light source 31b and the 2nd light source 31c are arrange | positioned at substantially the same space | interval as the width | variety of the imaging part 31a. The first light source 31b has a first light emitting unit 315b. The second light source 31c has a second light emitting unit 315c. The 1st light source 31b and the 2nd light source 31c are arrange | positioned so that the optical axis of the 1st light emission part 315b and the 2nd light emission part 315c may face the surface of the blanket roll 42c where the optical axis of the imaging part 31a cross | intersects. The first light source 31b and the second light source 31c irradiate the surface of the blanket roll 43c from an oblique direction.

  The imaging unit 31a is arranged so that the optical axis is orthogonal to the central axis of the blanket roll 42c. The imaging unit 31a is arranged farther from the blanket roll 42c than the first and second light sources 31b and 31c. A second reference plate 9a is disposed between the imaging unit 31a and the blanket roll 42c. The second reference plate 9a is disposed between the first light source 31b and the second light source 31c. The second reference plate 9a is arranged with the mark forming surface on which the reference moire mark MMR (details will be described later) is formed facing the pattern transfer surface of the blanket roll 42c. A first pattern, a moire mark, a vernier pattern, and the like are transferred from the drive roll 42a to the pattern transfer surface of the blanket roll 42c.

  The fourth optical system imaging device 31 and the second reference plate 9a are disposed between the contact portion of the drive roll 42a and the blanket roll 42c and the contact portion of the blanket roll 42c and the film substrate 8. Therefore, before the transfer moire mark MT1 transferred to the pattern transfer surface of the blanket roll 42c is retransferred onto the film substrate 8, the reference moire mark MMR and the transfer moire mark MT1 formed on the second reference plate 9a. Is superimposed. The transfer moire mark MT1 serves as a mold for forming a first mark (eg, the first moire mark MM1) on a roll (eg, the blanket roll 42c) that forms a predetermined pattern on a flexible substrate (eg, the film substrate 8). It corresponds to. The transfer moire mark MT1 has the same configuration as the first moire mark MM1 in the first embodiment. That is, the transfer moire mark MT1 is composed of a plurality of linear patterns having a minute pitch difference (for example, ΔP1d) with respect to the pitch of the plurality of linear patterns constituting the reference moire mark MMR. For this reason, when the reference moire mark MMR and the transfer moire mark MT1 are overlaid, moire fringes appear. Therefore, the fourth optical system imaging device 31 can image the moire fringes that are expressed by superimposing the reference moire mark MMR and the transfer moire mark MT1.

  The image processing unit 30 a provided in the control unit 30 performs image processing on the imaging data transmitted from the fourth optical system imaging device 31. As a result of the image processing, the image processing unit 30a displays the reference moire mark MMR and transfer moire mark MT1 superimposed on each other, the moire fringes generated when the marks MMR and MT1 are superimposed, and a vernier pattern. Generated images.

  The correction amount calculation unit 30b calculates the moiré fringe pitch based on the vernier pattern and the moire fringes displayed on the image transmitted from the image processing unit 30a by the same method as the correction amount calculation unit 10b according to the first embodiment. Then, the pattern distortion is calculated using the above equation (1). The pattern distortion calculated by the correction amount calculator 30b is the distortion of the transfer moire mark MT1 transferred onto the blanket roll 43c.

  The correction amount calculation unit 30b calculates a correction amount for controlling the tension applied to the film substrate 8 so that the calculated pattern distortion is minimized. The correction amount is, for example, the thrust of the expansion / contraction adjustment roll 25a. The control unit 30 transmits a control signal based on the correction amount calculated by the correction amount calculation unit 30b to the expansion / contraction adjustment roll 25a, and controls expansion / contraction of the film substrate 8 that is continuously sent out.

  As described above, the expansion / contraction control system 300 according to the present embodiment uses the transfer moire mark MT1 transferred to the blanket rolls 42c, 43c, and 44c in the previous stage of forming the moire mark MMR on the film substrate 8, and thus the film substrate 8 is moved. Can control expansion and contraction. Since the blanket rolls 42c, 43c, and 44c have the surface of the soft resin layer of polydimethylsiloxane (PDMS), for example, they are easily deformed. The expansion / contraction control system 300 according to the present embodiment uses the film substrate 8 to generate distortion that the pattern roll has in production, that is, distortion that occurs when ink is transferred from the drive rolls 42a, 43a, and 44a to the blanket rolls 42c, 43c, and 44c. It can be known before the pattern is formed. Thereby, the expansion / contraction control system 300 further improves the controllability of the alignment accuracy of pattern formation on the film substrate 8. By knowing the “strain” that the pattern roll possesses in production prior to pattern formation on the film substrate 8, the expansion and contraction control accuracy is improved. The expansion / contraction control system 300 operates so that the distortion on the film substrate 8 becomes zero, but the operation amount of the expansion / contraction of the film substrate 8 is corrected based on the distortion of the blanket rolls 42c, 43c, 44c.

  In this way, the expansion / contraction control system 300 is capable of feedforward control that predicts and controls the distortion of the first moire mark MM1 formed on the film substrate 8. Further, the control unit 30 can calculate a correction amount for controlling the tension applied to the film substrate 8 based on the imaging data transmitted from the first optical system imaging device 11. The imaging data transmitted by the first optical system imaging device 11 includes moire fringes MF that appear based on the first moire mark MM1 formed on the film substrate 8. For this reason, the expansion / contraction control system 300 is capable of feedback control for controlling based on the distortion of the first moire mark MM1 actually formed on the film substrate 8.

  Similarly, the fifth optical system imaging device 32 captures the moire fringes formed by superimposing the transfer moire mark formed on the blanket roll 43c and the reference moire mark of the second reference plate 9b, and controls the imaging data. 30 can be transmitted. In addition, the second optical system imaging device 12 captures the moire fringes formed by superimposing the second moire mark formed on the film substrate 8 and the reference moire mark of the first reference plate 7b, and controls the imaging data. It can be transmitted to the unit 30. The control unit 30 calculates the correction amount for controlling the tension applied to the film substrate 8 based on the imaging data received from the fifth optical system imaging device 32, and the imaging data received from the second optical system imaging device 12. Based on this, a correction amount for controlling the tension applied to the film substrate 8 can be calculated.

  Similarly, the sixth optical system imaging device 33 images the moiré fringes formed by superimposing the transfer moiré mark formed on the blanket roll 44c and the reference moiré mark of the second reference plate 9c, and controls the imaging data. 30 can be transmitted. Further, the third optical system imaging device 13 controls the imaging data by imaging the moire fringes that are generated by superimposing the third moire mark formed on the film substrate 8 and the reference moire mark of the first reference plate 7c. It can be transmitted to the unit 30. The control unit 30 calculates the correction amount for controlling the tension applied to the film substrate 8 based on the imaging data received from the sixth optical system imaging device 33, and the imaging data received from the third optical system imaging device 13. Based on this, a correction amount for controlling the tension applied to the film substrate 8 can be calculated.

  Next, the flexible substrate expansion / contraction control method, alignment method, and electronic device manufacturing method according to the present embodiment will be briefly described. The basic processing flow of the flexible substrate expansion / contraction control method according to the present embodiment is the same as that of the flexible substrate expansion / contraction control method according to the first embodiment. In the present embodiment, in the processing from step S1 to step S11 shown in FIG. 6, in addition to the first to third optical system imaging devices 11, 12, and 13, the fourth to sixth optical system imaging devices 31, 32, and 33 are used. The pattern distortion and the correction amount are calculated on the basis of the imaging data transmitted from.

  In the present embodiment, as in the first embodiment, the film substrate 8 is conveyed at a speed of 1 m to 2 m / min, whereas the moire fringes are imaged every 300 ms and the pattern distortion is calculated. It has become so. For this reason, in this embodiment, the expansion / contraction of the film substrate 8 is controlled every time the film substrate 8 is conveyed from about 0.5 cm to 1 cm.

  According to the expansion / contraction control system and the expansion / contraction control method of the flexible substrate according to the present embodiment, a minute alignment error of the pixel order or less can be enlarged and measured using the moire fringes. Further, according to the flexible substrate expansion / contraction control system and expansion / contraction control method according to the present embodiment, the expansion / contraction of the flexible substrate can be feedforward controlled before the moire marks of the respective layers are formed on the flexible substrate. Furthermore, according to the expansion / contraction control system and the expansion / contraction control method of the flexible substrate according to the present embodiment, the expansion / contraction of the flexible substrate can be feedback-controlled based on the formation result of the moiré marks of each layer on the flexible substrate. . Therefore, the expansion / contraction control system 300 according to the present embodiment can control the expansion / contraction of the flexible substrate before and after the formation of the first to third patterns, and can align the pattern of each layer with higher accuracy.

[Third Embodiment]
A flexible substrate expansion / contraction control system, expansion / contraction control method, alignment method, and electronic device manufacturing method according to a third embodiment of the present invention will be described with reference to FIGS. The flexible substrate expansion / contraction control system, the expansion / contraction control method, the alignment method, and the electronic device manufacturing method according to the present embodiment include a moire mark formed in the Nth layer and a moire mark formed in the (N + 1) th layer. It is characterized in that the expansion and contraction of the flexible substrate is controlled by using the moire fringes that are expressed by superimposing. In the flexible substrate expansion / contraction control system, expansion / contraction control method, alignment method, and electronic device manufacturing method according to the present embodiment, the flexible substrate expansion / contraction control system and expansion / contraction control method according to the first and second embodiments. Components having the same functions and operations as those of the alignment method and the electronic device manufacturing method are denoted by the same reference numerals, and description thereof is omitted.

  FIG. 9 is a diagram schematically illustrating a flexible substrate expansion / contraction control system 500 according to the present embodiment. The flexible substrate expansion / contraction control system 500 includes an electronic device manufacturing apparatus 4 that manufactures an electronic device on a flexible substrate, and a substrate expansion / contraction control apparatus that controls expansion / contraction of the flexible substrate conveyed to the electronic device manufacturing apparatus 4. 5. As shown in FIG. 9, the electronic device manufacturing apparatus 4 in the present embodiment has the same configuration as the electronic device manufacturing apparatus 4 in the second embodiment.

  As shown in FIG. 9, the substrate expansion / contraction control device 5 in this embodiment includes a control unit 50 that controls the first to third substrate expansion / contraction adjustment units 25, 26, and 27, and a moire mark formed on the film substrate 8. The first optical system imaging device 11, the second optical system imaging device 12, and the third optical system imaging device 13 that capture images of moire fringes (an example of the first, second and / or third interference fringes) generated based on A fourth optical system imaging device 31, a fifth optical system imaging device 32, a sixth optical system imaging device 33, a seventh optical system imaging device 52, and an eighth optical system imaging device 53. The substrate expansion / contraction control device 5 generates the moire fringes by individually superimposing the first reference plates 7a, 17b, 17c and the third reference plates 6b, 6c on the moire marks formed on the film substrate 8. The expansion / contraction control system 500 also superimposes the second reference plate 9a on the moire mark formed on the blanket roll 42c to generate moire fringes, and the second reference plate 9b is applied to the transfer moire mark formed on the blanket roll 43c. The moire fringes are generated by superimposing, and the second reference plate 9c is superimposed on the transfer moire marks formed on the blanket roll 44c to generate the moire fringes. Further, the substrate expansion / contraction control device 5 superimposes the Nth layer moire mark and the (N + 1) th layer moire mark to generate moire fringes.

  The first optical system imaging device 11, the second optical system imaging device 12, and the third optical system imaging device 13 provided in the substrate expansion / contraction control device 5 are the first optical system imaging device 11 and the second optical system imaging device 11 in the first embodiment. Each of the optical imaging device 12 and the third optical imaging device 13 has the same configuration. However, the second optical system imaging device 12 in the present embodiment has a second moire mark (an example of a third mark) formed on the film substrate 8 and a reference moire mark (fourth) formed on the first reference plate 17b. In addition to the moire fringes (an example of the second interference fringes) that appear in the example of the mark), the first moire marks (an example of the first mark) and the second moire mark formed on the film substrate 8 Moire fringes (an example of third interference fringes) are also imaged. Furthermore, the second optical system imaging device 12 includes a moire mark (an example of a first mark) formed on the film substrate 8 by the first pattern forming unit 42 and a reference moire mark formed on the first reference plate 17b. A moire fringe (an example of the first interference fringe) based on the interference with the (an example of the second mark) is imaged. Further, the third optical system imaging device 13 in the present embodiment has a third moire mark (an example of a third mark) formed on the film substrate 8 and a reference moire mark (fourth) formed on the first reference plate 17c. In addition to the moire fringes (an example of the second interference fringes) expressed in the example of the mark), the second moire marks (an example of the first mark) and the third moire mark formed on the film substrate 8 are expressed. Moire fringes (an example of third interference fringes) are also imaged. Furthermore, the third optical system imaging device 13 includes a moire mark (an example of a first mark) formed on the film substrate 8 by the second pattern forming unit 43 and a reference moire mark formed on the first reference plate 17c. A moire fringe (an example of the first interference fringe) based on the interference with the (an example of the second mark) is imaged.

  In the expansion / contraction control system 500 according to the present embodiment, it is based on interference between the moire mark of the first layer formed on the film substrate 8 and the moire mark of the second layer formed immediately above the first layer. Moire fringes are used for expansion / contraction control of the film substrate 8. For this reason, the moire mark formed by the second pattern forming unit 43 corresponds to the third mark with respect to the moire mark formed by the first pattern forming unit 42, and is formed by the third pattern forming unit 44. The moiré mark corresponds to the first mark. The moire mark formed by the third pattern forming unit 44 corresponds to the third mark for the moire mark formed by the second pattern forming unit 43. When the electronic device manufacturing apparatus 4 further includes a fourth pattern forming unit, the moire mark formed by the third pattern forming unit 44 is different from the moire mark formed by the fourth pattern forming unit. Corresponds to the first mark.

  The seventh optical system image pickup device 52 provided in the substrate expansion / contraction control device 5 picks up the moire fringes expressed by the first moire mark formed on the film substrate 8 and the reference moire mark formed on the third reference plate 6b. The captured image data including the captured moire fringes is transmitted to the control unit 50. Further, the eighth optical imaging device 53 provided in the substrate expansion / contraction control device 5 has a moiré fringe that is manifested by a second moiré mark formed on the film substrate 8 and a reference moiré mark formed on the third reference plate 6c. The image data including the captured moire fringes is transmitted to the control unit 50.

  The seventh optical system imaging device 52 and the eighth optical system imaging device 53 have the same configuration and perform the same function. Moreover, the 3rd reference board 6b and the 3rd reference board 6c have the same structure, and exhibit the same function. Therefore, hereinafter, with respect to the optical imaging device and the third reference plate in the present embodiment, the seventh optical imaging device 52 and the third reference plate 6b are taken as an example with reference to FIG. explain. FIG. 10 is an enlarged schematic view showing the vicinity of the second pattern forming unit 43, the second optical system imaging device 12, the fifth optical system imaging device 32, and the seventh optical system imaging device 52. FIG. 11 shows a state in which the first reference plate 17b is viewed from the side on which the reference moire marks MMR1 and MMR2 are formed. FIG. 12 is a schematic diagram showing a state in which the first moire mark MM1 and the second moire mark MM2 formed on the film substrate 8 are viewed from the moire mark forming surface side. FIG. 13 is a schematic diagram showing a state in which the first reference plate 17b is superimposed on the first moire mark MM1 and the second moire mark MM2 formed on the film substrate 8 as viewed from the moire mark forming surface side. is there.

  As shown in FIG. 10, a second moire mark (an example of a third mark) MM2 is formed on the film substrate 8 that has passed through the second pattern forming portion 43. The second moire mark MM2 is formed on the element formation surface that is on the surface of the film substrate 8 that contacts the blanket roll 43c. Although illustration is omitted, a second vernier pattern and a second pattern are also formed on the element forming surface of the film substrate 8 on which the second moire mark MM2 is formed. The second pattern, the second vernier pattern, and the second moire mark MM2 are formed on the same surface of the film substrate 8 in the second layer forming step by the second pattern forming unit 43. The vernier pattern in the present embodiment has the same shape as the vernier pattern V1 in the first embodiment.

  The fifth optical system imaging device 32 captures an image of moiré fringes generated by superimposing the first light source 32b and the second light source 32c for irradiating the blanket roll 43c with the blanket roll 43c and the second reference plate 9b. Part 32a. Since the imaging unit 32a has the same configuration as the imaging unit 11a provided in the first optical system imaging device 11 in the first embodiment and exhibits the same function, detailed description thereof is omitted.

  The first light source 32b and the second light source 32c are arranged with the same interval as the width of the imaging unit 32a. The first light source 32b has a first light emitting unit 325b. The second light source 32c has a second light emitting unit 325c. The 1st light source 32b and the 2nd light source 32c are arrange | positioned so that the optical axis of the 1st light emission part 325b and the 2nd light emission part 325c may face the surface of the blanket roll 43c where the optical axis of the imaging part 32a cross | intersects. The first light source 32b and the second light source 32c irradiate the surface of the blanket roll 43c from an oblique direction.

  The imaging unit 32a is arranged so that the optical axis is orthogonal to the central axis of the blanket roll 43c. The imaging unit 32a is arranged farther from the blanket roll 43c than the first and second light sources 32b and 32c. A second reference plate 9b is disposed between the imaging unit 32a and the blanket roll 43c. The second reference plate 9b is disposed between the first light source 32b and the second light source 32c. The second reference plate 9b is arranged with the mark forming surface on which the reference moire mark MMR is formed facing the pattern transfer surface of the blanket roll 43c. A second pattern, a moire mark, a vernier pattern, and the like are transferred from the drive roll 43a to the pattern transfer surface of the blanket roll 43c.

  The fifth optical system imaging device 32 and the second reference plate 9b are disposed between the contact portion of the drive roll 43a and the blanket roll 43c and the contact portion of the blanket roll 43c and the film substrate 8. Therefore, before the transfer moire mark MT2 transferred to the pattern transfer surface of the blanket roll 43c is retransferred onto the film substrate 8, the reference moire mark MMR and the transfer moire mark MT2 formed on the second reference plate 9b. Is superimposed. The transfer moire mark MT2 is composed of a plurality of linear patterns having a minute pitch difference (for example, ΔPN) with respect to the pitch of the plurality of linear patterns constituting the reference moire mark MMR. For this reason, when the reference moire mark MMR and the transfer moire mark MT2 are overlaid, moire fringes appear. Therefore, the fifth optical system imaging device 32 can image the moire fringes that are expressed by superimposing the reference moire mark MMR and the transfer moire mark MT2. The plurality of linear patterns constituting the transfer moire mark MT2 have a minute pitch difference (for example, ΔP2d) with respect to the pitch of the plurality of linear patterns constituting the first moire mark MM1.

  The light source 52 b provided in the seventh optical system imaging device 52 has a light emitting unit 521. The light emitting unit 521 is disposed to face the film substrate 8 sent out from the first pattern forming unit 22 (see FIG. 9). The light source 52 b is disposed opposite to the element formation surface of the film substrate 8. Therefore, the light source 52b emits light from the element forming surface side of the film substrate 8 on which the first moire mark MM1 is formed.

  The imaging unit 52 a provided in the seventh optical system imaging device 52 is disposed to face the light source 52 b with the film substrate 8 interposed therebetween. A third reference plate 6b is disposed between the imaging unit 52a and the film substrate 8. The third reference plate 6 b is arranged with the mark forming surface on which the reference moire mark (an example of the second mark) MMR is formed facing the back surface of the element forming surface of the film substrate 8. The configuration of the imaging unit 52a has the same configuration as the imaging unit 11a in the first embodiment, and exhibits the same function. The imaging unit 52a has a telecentric lens. For this reason, unlike the first embodiment, even if the reference moire mark MMR and the first moire mark MM1 of the third reference plate 6b do not face each other, the seventh optical system imaging device 52 operates the film substrate 8 that operates. The first moiré mark MM1 formed on the third reference plate 9b, the reference moiré mark MMR formed on the third reference plate 9b, and the moiré fringes developed by the two moiré marks MM1 and MMR can be imaged with accurate dimensions. The plurality of linear patterns constituting the reference moire mark MMR of the third reference plate 6b have the same configuration as the plurality of linear patterns constituting the transfer moire mark MT2.

  The first reference plate 17b has a reference moire mark (an example of a second mark) MMR1 and a reference moire mark (an example of a fourth mark) MMR2. The first reference plate 17 b is arranged with the mark forming surface on which the reference moire marks MMR 1 and MMR 2 are formed facing the film substrate 8 sent out from the second pattern forming unit 43. The mark forming surface is disposed opposite to the back surface of the element forming surface of the film substrate 8 on which the first and second moire marks MM1, MM2, etc. are formed.

  Unlike the first and second embodiments, the second optical imaging device 12 in the present embodiment differs from the first and second embodiments in that the first moire mark (an example of the first mark) MM1 and the second moiré mark formed by the first pattern forming unit 42. A moire fringe (an example of a third interference fringe) that appears with the second moire mark (an example of a third mark) MM2 formed by the pattern forming unit 43 is imaged. Further, the second optical system imaging device 12 includes a moire fringe (an example of a first interference fringe) that appears at the reference moire mark MMR1 and the first moire mark MM1 of the first reference plate 17b, and the first reference plate 17b. A moire fringe (an example of a second interference fringe) that appears in the reference moire mark MMR2 and the second moire mark MM2 is imaged. The second optical system imaging device 12 images these moire fringes simultaneously.

  As shown in FIG. 11, the first reference plate 17a has a thin plate rectangular shape. A reference moire mark MMR1 is formed substantially at the center on the first reference plate 17a. The reference moire mark MMR1 has a plurality of linear patterns formed so as to be arranged substantially parallel to the longitudinal direction of the first reference plate 17a. The plurality of linear patterns have an elongated rectangular shape extending from the vicinity of the region connecting the midpoints of both ends of the first reference plate 17a toward one long side. A reference moire mark MMR2 is formed on the first reference plate 17a and between the reference moire mark MMR1 and the other long side of the first reference plate 17a. The reference moire mark MMR2 has a plurality of linear patterns formed so as to be arranged substantially parallel to the longitudinal direction of the first reference plate 17a. The plurality of linear patterns are provided with a predetermined gap with respect to the reference moire mark MMR1, and have an elongated rectangular shape extending from the reference moire mark MMR1 toward the other long side.

  As shown in the lower left side of FIG. 11, the reference moire mark MMR1 is formed such that the pitch value of the plurality of linear patterns is “P1”. Hereinafter, “P1” may also be used as a reference symbol indicating the pitch of a plurality of linear patterns of the reference moire mark MMR1. Further, as shown in the upper left side of FIG. 11, the reference moire mark MMR2 is formed so that the pitch value of the plurality of linear patterns is “P2”. Hereinafter, “P2” may also be used as a reference symbol indicating the pitch of a plurality of linear patterns of the reference moire mark MMR2.

  As shown on the right side in FIG. 12, the first moire mark MM <b> 1 is formed on the film substrate 8 in the first pattern forming unit 42. The first moire mark MM <b> 1 has a plurality of linear patterns formed in parallel with the longitudinal direction of the film substrate 8. The first moire mark MM1 is formed between one long side of the film substrate 8 and a device formation area DA where an electronic device to be manufactured is formed. The plurality of linear patterns constituting the first moire mark MM1 have an elongated rectangular shape extending in a direction orthogonal to one long side of the film substrate 8. The first moire mark MM1 is designed with a pitch value of a plurality of linear patterns of “P1d + ΔP1d”, but includes a pitch error due to expansion / contraction of the film substrate 8, and as shown on the lower left side in FIG. The pitch is “P1 + ΔP1”.

  As shown on the right side in FIG. 12, the second moire mark MM <b> 2 and the second vernier pattern V <b> 2 are formed on the film substrate 8 in the second pattern forming unit 43. The second moiré marks MM2 are formed at two locations with the second vernier pattern V2 interposed therebetween. When laminating n layers on a flexible substrate, the first and nth layer moire marks may be one place, but the second layer to the (n-1) th layer are between adjacent layers. This is because it is preferable to arrange two moire marks in order to form a moire pattern.

A second layer including a second moire mark MM2 that is superimposed on a part of the region where the first moire mark MM1 is formed is formed immediately above the first layer including the first moire mark MM1. That is, a part of one second moiré mark MM2 is formed so as to overlap with the region where the first moiré mark MM1 is formed. That is, the first portion where only the second moire mark MM2 is present, the second portion where the moire fringe MF12 occurs due to the presence of the first moire mark MM1 and the second moire mark MM2, and a portion different from the first portion And it is configured to have three of the third portions where only the first moire mark MM1 exists. The first portion corresponds to a region where the first mark (for example, the first moire mark MM1) is formed and the third mark (for example, the second moire mark MM2) is not formed. The second portion corresponds to a region where a first mark (for example, the first moire mark MM1) and a third mark (for example, the second moire mark MM2) are overlapped. The third portion corresponds to a region where the third mark (for example, the second moire mark MM2) is formed and the first mark (for example, the first moire mark MM1) is not formed. The reference moiré mark MMR2 and the first portion of the reference plate 17b in FIG. 11 are overlapped with the first portion, the blank portion and the second portion of the reference plate 17b, and the reference moiré mark MMR1 and the third portion of the reference plate 17b, respectively. Two moiré fringes MF2 due to two moiré marks MM2 and a reference moiré mark MMR2, moiré fringes MF12 due to the second moiré mark MM1 and the first moiré mark MM2, and moiré fringes MF1 due to the first moiré mark MM1 and the reference moiré mark MMR1 are simultaneously shown. Can be observed.

  The other second moiré mark MM2 is formed substantially in line symmetry with the second moiré mark MM2 with the second vernier pattern V2 as the axis of symmetry. The two second moire marks MM <b> 2 each have a plurality of linear patterns formed side by side in parallel with the longitudinal direction of the film substrate 8. The plurality of linear patterns that respectively constitute the two second moire marks MM <b> 2 have an elongated rectangular shape that extends in a direction orthogonal to one long side of the film substrate 8. The two second moire marks MM2 are designed with a pitch value of a plurality of linear patterns of “P2d + ΔP2d”, but include pitch errors due to expansion and contraction of the film substrate 8, and as shown on the lower left side in FIG. And with a pitch “P2 + ΔP2”.

As shown in the center of FIG. 12, the first vernier pattern V1 is formed on the film substrate 8 simultaneously with the formation of the first moire mark MM1. The first vernier pattern V1 has a plurality of rectangular patterns. The rectangular pattern has a long side along the long side of the film substrate 8. The rectangular pattern constituting the first vernier pattern V1 is designed with the same pitch as the moire when the second layer is aligned.
Similar to the first vernier pattern V1, the second vernier pattern V2 has a plurality of rectangular patterns. The rectangular pattern has a long side along the long side of the film substrate 8. The rectangular pattern constituting the second vernier pattern V2 is designed with the same pitch as the moire when the third layer which is the next layer is aligned.
The first and second vernier patterns V1, V2 are formed of the same material as the first and second moire marks MM1, MM2. The first and second moiré marks MM1, MM2 and the first and second vernier patterns V1, V2 are difficult to transmit and reflect light.

  The difference between the pitch P1 + ΔP1 of the first moire mark MM1 and the pitch P2 + ΔP2 of the second moire mark MM2 is “ΔP1−ΔP2”, which is a minute value compared with “P1” and “P2”. For this reason, the first moire mark MM1 and the second moire mark MM2 are formed so as to overlap with each other as described with reference to “P1” and “P1 + ΔP1” in the first embodiment. As shown in the center in the middle, moire fringes MF12 appear in a region where the first and second moire marks MM1 and MM2 overlap.

  As shown in FIG. 13, when the first reference plate 17b is overlapped with the formation region of the first moire marks MM1 and MM2, a part of the reference moire mark MMR1 formed on the first reference plate 17b becomes the first moire mark. A part of the reference moiré mark MMR2 formed on the first reference plate 17b overlaps a part of the formation area of the MM1, and a part of the formation area of the second moiré mark MM2 overlaps. The difference between the pitch P1 + ΔP1 of the first moire mark MM1 and the pitch P1 of the reference moire mark MMR1 is “ΔP1”, which is a minute value compared to “P1”. Further, the difference between the pitch P2 + ΔP2 of the second moire mark MM2 and the pitch P2 of the reference moire mark MMR2 is “ΔP2”, which is a minute value compared with “P2”. For this reason, as described with reference to “P1” and “P1 + ΔP1” in the first embodiment, the first moire mark MM1 and the reference moire mark MMR1 overlap each other, as shown in FIG. Moire fringes MF1 appear in the region where the marks MM1 and MMR1 overlap. Similarly, when the second moire mark MM2 and the reference moire mark MMR2 overlap, as shown in FIG. 13, a moire fringe MF2 appears in a region where the marks MM2 and MMR2 overlap. The second optical system imaging device 12 captures the moire fringes MF1, MF2, MF12, and the first vernier pattern V1 in a field of view in which two or more moire fringes MF1, MF2, MF12 and the first vernier pattern V1 enter the imaging region α. To do.

  FIG. 14 is a diagram for explaining image processing and correction amount calculation in the control unit 50. FIG. 14A illustrates an example of an image of the imaging region α generated based on the imaging data received by the image processing unit 50a from the second optical system imaging device 12. FIG. 14B shows a vernier luminance distribution and a moire fringe luminance distribution based on the image shown in FIG. In FIG. 14B, the vernier luminance distribution is shown at the first level, the moiré fringe MF12 luminance distribution is shown at the second level, the moiré fringe MF2 luminance distribution is shown at the third level, and the moiré pattern is shown at the fourth level. The stripe MF1 luminance distribution is shown. “Vernier luminance distribution” in FIG. 14B represents the luminance distribution based on the image of the first vernier pattern V1 shown in FIG. 14A, and “Moire fringe MF12 luminance distribution” is shown in FIG. 14 represents a luminance distribution based on the image of the moire fringe MF12 shown. “Moire fringe MF2 luminance distribution” represents a luminance distribution based on the image of the moire fringe MF2 shown in FIG. The luminance distribution based on the image of the moire fringe MF1 shown in FIG. In FIG. 14B, the vertical axis of the first level indicates the level of the luminance of the first vernier pattern V1, and the horizontal axis of the first level indicates the position on the straight line L1 shown in FIG. Yes. In FIG. 14B, the vertical axis from the second stage to the fourth stage indicates the level of luminance of each moire fringe, and the horizontal axis from the second stage to the fourth stage is shown in FIG. The center position of each moire fringe is shown in parallel with the straight line L1 shown in FIG.

  The image processing unit 50 a performs image processing on the imaging data transmitted from the second optical system imaging device 12. As shown in FIG. 14A, the image processing unit 50a, as a result of image processing, the moire fringe MF12 generated when the first moire mark MM1 and the second moire mark MM2 overlap, the first moire mark MM1 and the reference. An image in which the moiré fringes MF1 generated when the moire marks MMR1 overlap, the moire fringes MF2 generated when the second moire marks MM2 and the reference moire mark MMR2 overlap, and the first vernier pattern V1 is generated. Since the reference moiré marks MMR1, MMR2, the first and second moiré marks MM1, MM2, and the first vernier pattern V1 hardly transmit the light emitted from the light source 12b (see FIG. 10), the image generated by the image processing unit 50a. Are represented by a relatively dark color (for example, black). Further, in the vicinity of the overlapping position where the linear pattern of the first moiré mark MM1 and the linear pattern of the second moiré mark MM2 overlap, the density of the linear pattern is sparse, so that in the image generated by the image processing unit 50a. Represented in a relatively bright color. On the other hand, in the vicinity of the position where one linear pattern of the first moiré mark MM1 and the second moiré mark MM2 is disposed between the other linear patterns, the density of the linear pattern is high, and thus the image processing unit 50a. Is represented in a relatively dark color in the generated image. Further, in the vicinity of the overlapping position where the linear pattern of the first moiré mark MM1 and the linear pattern of the reference moiré mark MMR1 overlap, the density of the linear pattern is sparse, so that the relative image in the image generated by the image processing unit 50a. Are expressed in bright colors. On the other hand, in the vicinity of the position where one linear pattern of the first moiré mark MM1 and the reference moiré mark MMR1 is arranged between the other linear patterns, the density of the linear pattern is high, so that the image processing unit 50a has. Represented in a relatively dark color in the generated image. Furthermore, since the density of the linear pattern is sparse in the vicinity of the overlapping position where the linear pattern of the second moiré mark MM2 and the linear pattern of the reference moiré mark MMR2 are overlapped, the relative density in the image generated by the image processing unit 50a is relatively small. Are expressed in bright colors. On the other hand, in the vicinity of the position where one linear pattern of the second moiré mark MM2 and the reference moiré mark MMR2 is arranged between the other linear patterns, the density of the linear pattern is high, so that the image processing unit 50a has a high density. Represented in a relatively dark color in the generated image.

  The correction amount calculation unit 50b that has received the image shown in FIG. 14A from the image processing unit 50a calculates the pattern distortion ε of the second moire mark MM2. In order to calculate the pattern distortion ε, the correction amount calculation unit 50b first generates a graph of the vernier luminance distribution and the moire fringe luminance distribution shown in FIG. The correction amount calculation unit 50b generates a vernier luminance distribution graph based on the brightness on the straight line L1 connecting the short side centers of the images of the first vernier pattern V1. The first vernier pattern V1 is composed of a plurality of rectangular patterns. For this reason, the vernier luminance distribution has a rectangular shape as shown in the first row in FIG. Further, the correction amount calculation unit 50b generates a graph of the moiré fringe MF12 luminance distribution based on light and darkness on a straight line that is substantially parallel to the straight line L1 and crosses the center of the image of the moire fringe MF. The density of the linear pattern formed by the linear pattern of the first moiré mark MM1 and the linear pattern of the second moiré mark MM2 gradually changes from the sparse state to the dense state and from the dense state to the state. To do. For this reason, the moire luminance distribution has a wave shape such as a sine wave as shown in the second row in FIG. Further, the correction amount calculation unit 50b generates a graph of the moire fringe MF2 luminance distribution based on light and darkness on a straight line that is substantially parallel to the straight line L1 and crosses the center of the image of the moire fringe MF2. The density of the linear pattern formed by the linear pattern of the second moire mark MM2 and the linear pattern of the reference moire mark MMR2 gradually changes from the sparse state to the dense state and from the dense state to that state. . For this reason, the moire fringe MF2 luminance distribution has a wave shape such as a sine wave as shown in the third stage in FIG. Further, the correction amount calculating unit 50b generates a graph of the moiré fringe MF1 luminance distribution based on light and darkness on a straight line that is substantially parallel to the straight line L1 and crosses the center of the image of the moire fringe MF1. The density of the linear pattern formed by the linear pattern of the first moire mark MM1 and the linear pattern of the reference moire mark MMR1 gradually changes from the sparse state to the dense state and from the dense state to that state. . For this reason, the moire fringe MF1 luminance distribution has a wave shape like a sine wave as shown in the fourth row in FIG.

  The control unit 50 performs the image processing shown in FIG. 15A in the first embodiment on the image data transmitted from the seventh optical system imaging device 52 and the fifth optical system imaging device 32, and FIG. The moire fringe luminance distribution shown in (b) is generated. Although details will be described later, the substrate expansion / contraction control device 5 calculates a correction amount for correcting expansion / contraction of the film substrate 8, a pattern distortion ε1 based on imaging data transmitted from the fifth optical system imaging device 32, 7 The pattern distortion ε2 based on the imaging data transmitted from the optical imaging device 52 and the alignment error based on the imaging data transmitted from the second optical imaging device 12 are calculated.

  As shown in FIG. 9, in this embodiment, no moire mark or vernier pattern is formed on the film substrate 8 in the stage before the first layer is formed. For this reason, the expansion / contraction control system 500 does not include an optical imaging device between the first pattern forming unit 42 and the first substrate expansion / contraction adjustment unit 25. Further, only the first moiré mark is formed as the moiré mark on the film substrate 8 being sent out through the substrate conveyance path between the first pattern forming portion 42 and the second pattern forming portion 43. For this reason, the expansion / contraction control system 500 includes the first reference plate 7a and the first moire mark disposed between the first pattern forming unit 42 and the second substrate expansion / contraction adjustment unit 26. The moiré fringes that appear by superimposing and are imaged.

  Next, the flexible substrate expansion / contraction control method, alignment method, and electronic device manufacturing method according to the present embodiment will be described with reference to FIGS. 9 to 14 again. The flexible substrate expansion / contraction control method processing according to the present embodiment includes the steps of creating a vernier luminance distribution and calculating the vernier pitch Pv in addition to the processing of the flexible substrate expansion / contraction control method according to the first embodiment. It is. In the present embodiment, imaging data transmitted from the fifth optical system imaging device 32 and the seventh optical system imaging device 52 in addition to the second optical system imaging device 12 in the processing from step S1 to step S7 shown in FIG. The pattern distortion is also calculated based on the above. Further, a step of creating a vernier luminance distribution based on the vernier pattern and a calculation step of calculating a vernier pitch based on the created vernier luminance distribution are executed between step S7 and step S11 shown in FIG. In this embodiment, the alignment error is obtained based on the imaging data transmitted from the second optical system imaging device 12 in step S15 shown in FIG. Hereinafter, the flexible substrate expansion / contraction control method according to the present embodiment will be described using the second pattern formed by the second pattern forming unit 43 shown in FIG. 10 as an example.

  In the first layer (corresponding to the Nth layer), the first moiré mark MM1 of the first layer having a periodicity of the pitch P1, and the pitch of the moiré fringes that appear when ideal patterning with zero distortion is achieved. A vernier pattern V 1 having the same pitch is patterned on the film substrate 8.

  A free running portion (for example, between the second substrate expansion / contraction adjusting portion 26 and the second pattern forming portion 43) in front of the second pattern forming portion 43 for forming the second layer (corresponding to the (N + 1) th layer) second pattern. 3, the third reference plate 6 b patterned with the same moire mark having the same pitch as the second moiré mark MM 2 on the second layer and the first moiré mark MM 1 already patterned on the film substrate 8 are overlapped. The seventh optical system imaging device 52 captures the moire fringes MF1 and the vernier pattern V1 in a field of view in which two or more moire fringes MF1 and vernier patterns V1 enter.

  On the blanket roll 43c of the second pattern forming portion 43 of the second layer, the second layer transfer moire mark MT2 having a pitch P1 + ΔP1 having a pitch difference ΔP1 with a pitch difference ΔP1 of the first layer is placed. Pattern.

  The second reference plate 9b on which the reference moiré mark MMR having the same pitch as that of the first moiré mark MM1 is patterned and the second transfer moiré mark MT2 formed on the blanket roll 43c are overlapped with each other. The fifth optical system imaging device 32 images the moire fringe MF2 and the vernier pattern V1 in a field of view in which two or more fringes MF2 and vernier patterns V1 enter.

  The second layer pattern formed on the blanket roll 43c is retransferred onto the film substrate 8, and the second layer second moire mark MM2 is overlaid on the first layer first moire mark MM1.

  Moire fringes MF12 expressed by the first moiré mark MM1 of the first layer and the second moiré mark MM2 of the second layer superimposed on the film substrate 8, the reference moiré marks MMR1 and MMR2 of the first reference plate 17b, and the first In addition, the moiré fringes MF12, MF1, MF2 and the vernier pattern V1 are displayed in the second optical system imaging device 12 in a field of view including two or more moiré fringes MF1 and MF2 expressed by the second moiré marks MM1 and MM2. Take an image with.

  The captured image data of the moire fringes MF1, MF2, MF12 and the vernier pattern V1 is transmitted to the control unit 50. The image processing unit 50a that has received these imaging data generates three images A1, A2, and A3 by performing image processing. The image processing unit 50a generates an image A1 based on the moire fringes MF1 and the vernier pattern V1, generates an image A2 based on the moire fringes MF2 and the vernier pattern V1, and generates the moire fringes MF1, 2, 12 and the vernier pattern V1. Based on this, an image A3 (see FIG. 14A) is generated. The correction amount calculation unit 50b uses the three images A1, A2, and A3 generated by the image processing unit 50a to calculate the moire fringe luminance distributions of the moire fringes MF1, MF2, and MF12 and the vernier luminance distribution of the vernier pattern V1. obtain.

The correction amount calculating unit 50b calculates the vernier pitch Pv from the vernier luminance distribution, and calculates the moiré fringe pitches Pm1, Pm2, and Pm12 of the moiré fringes MF1, MF2, and MF12 from the moiré fringe luminance distribution. Using the vernier pitch Pv and the moire fringe pitch Pm1 and the equation (1), the relative pattern distortion ε1 of the second layer with respect to the first layer in the design is obtained.
Using the vernier pitch Pv and the moire fringe pitch Pm2 and the equation (1), the relative pattern distortion ε2 of the first layer with respect to the designed second layer is obtained.
Using the vernier pitch Pv and the moire fringe pitch Pm12 and the equation (1), the relative pattern distortion ε3 of the first layer with respect to the second layer is obtained.

Using the phase difference Em (see FIG. 14B) between the vernier luminance distribution and the moire fringe luminance distribution based on the image A3 and the following equation (3), the alignment error e of the second layer with respect to the first layer is obtained. .
e = ((P2 + ΔP2) × (1 + ε1) − (P1 + ΔP1) × (1 + ε2)) / ((P2 + ΔP2) × (1 + ε1)) × Em (3)

  The tension applied to the film substrate 8 is changed so that the relative pattern strain ε3 of the second layer relative to the first layer is minimized so that the pattern strain ε1 of the first layer follows the pattern strain ε2 of the second layer. To correct. The alignment of the second layer is performed so that the alignment error e (phase difference Em) of the second layer with respect to the first layer is minimized.

  In the present embodiment, as in the first embodiment, the film substrate 8 is transported at a speed of 0.1 m to 10 m / min, whereas moire fringes are imaged every 100 ms and pattern distortion occurs. It is calculated. For this reason, in this embodiment, the expansion / contraction of the film substrate 8 is controlled every time the film substrate 8 is transported by approximately 0.2 mm to 2 mm.

  In the electronic device manufacturing apparatus 4 according to the present embodiment, the first moire mark MM1 is formed on the film substrate 8 when the first pattern of the first layer is formed, and the second moire mark MM2 is formed when the second pattern of the second layer is formed. Is formed on the film substrate 8 so as to overlap the first moire mark MM1, and at the time of forming the third pattern of the third layer, at least a part of the third moire mark is formed so as to overlap the second moire mark MM2. It is like that. According to the expansion / contraction control system and the expansion / contraction control method of the flexible substrate according to the present embodiment, the tension applied to the flexible substrate is reduced so that the alignment error of the moire mark laminated on the flexible substrate is minimized. It comes to control. As a result, the first to third moire marks can be relatively aligned, so that the first to third patterns are aligned and a desired laminated pattern can be formed.

As described above, the alignment method according to the present embodiment aligns the laminated pattern to be laminated on the film substrate 8 using the flexible substrate expansion / contraction control method according to the present embodiment. In the alignment method according to the present embodiment, the first to third moire marks and the reference moire mark are used as the alignment marks.
Moreover, a desired laminated pattern can be formed by using the alignment method according to the present embodiment. For this reason, the manufacturing method of the electronic device according to the present embodiment can form a desired stacked pattern using the alignment method according to the present embodiment, and can manufacture an electronic device constituted by the stacked pattern.

  As described above, according to the flexible substrate expansion / contraction control system and the expansion / contraction control method according to the present embodiment, it is possible to enlarge and measure a minute alignment error below the pixel order by using moire fringes. Moreover, according to the expansion / contraction control system and the expansion / contraction control method of the flexible substrate according to the present embodiment, it is possible to enlarge and measure the minute relative strain of the pattern of each layer using the moire fringes. When the Nth layer and the (N + 1) th layer are overlapped, the reference is the pattern of the Nth layer. When the pattern of the Nth layer changes on the film substrate flowing between the pattern forming portions, the enlargement ratio of moire fringes changes. However, the flexible substrate expansion / contraction control system according to the present embodiment obtains an accurate alignment error e in which the pattern distortion is corrected by simultaneously measuring the relative distortion of the (N + 1) th layer pattern with respect to the Nth layer pattern. It becomes possible.

  Further, the expansion / contraction control system 500 according to the present embodiment can control the expansion / contraction of the film substrate 8 by using the Nth layer moire mark before the formation of the (N + 1) th layer pattern. For this reason, the expansion / contraction control system 500 is capable of feedforward control that predicts and controls the distortion of the (N + 1) th layer moire mark formed on the film substrate 8. By using the Nth layer moire mark, local tension fluctuations occurring on the film substrate 8, that is, non-periodic tension fluctuations can be detected before forming the (N + 1) th layer pattern. Further, the control unit 50 can calculate a correction amount for controlling the tension applied to the film substrate 8 based on the moire fringes expressed by the Nth layer moire mark and the (N + 1) th layer moire mark. . For this reason, the expansion / contraction control system 500 can perform feedback control that is controlled based on the distortion of the moire marks actually formed on the film substrate 8. By using the moiré marks of the Nth layer and the (N + 1) th layer, periodic tension fluctuations can be detected.

  Therefore, the expansion / contraction control system 500 according to the present embodiment can detect aperiodic and periodic tension fluctuations and control the expansion / contraction of the film substrate 8 before and after the formation of the first to third patterns. Pattern alignment is possible.

1, 3, 5 Substrate expansion / contraction control device 2, 4 Electronic device manufacturing apparatus 6b, 6c Third reference plate 7a, 7b, 7c, 17b, 17c First reference plate 8 Film substrate 9a, 9b, 9c Second reference plate 10, 30, 50 Control part 10a, 30a, 50a Image processing part 10b, 30b, 50b Correction amount calculation part 11 1st optical system imaging device 11a, 12a, 13a, 31a, 32a, 52a, 53b Imaging part 11b, 12b, 13b, 52b, 53b Light source 12 Second optical system imaging device 13 Third optical system imaging device 20 Feeding roll 21 Winding rolls 22, 42 First pattern forming portions 22a, 22b, 23a, 23b, 24a, 24b, 28b, 28d, 42a , 42b, 43a, 43b, 44a, 44b Drive rolls 23, 43 Second pattern forming portion 24, 44 Third pattern forming portion 25 First Plate expansion / contraction adjustment sections 25a, 26a, 27a Expansion adjustment rolls 25b, 26b, 27b Carry-in side guide rolls 25c, 26c, 27c Carry-out side guide rolls 26 Second substrate expansion / contraction adjustment section 27 Third substrate expansion / contraction adjustment section 28a First guide Roll 28c 2nd guide roll 28e 3rd guide roll 31 4th optical system imaging device 31b, 32b 1st light source 31c, 32c 2nd light source 32 5th optical system imaging device 33 6th optical system imaging device 42c, 43c, 44c Blanket Roll 52 Seventh optical system imaging device 53 Eighth optical system imaging device 100, 300, 500 Flexible substrate expansion / contraction control system 110 Camera 111 Telecentric lens 112 Mirror 113, 123 Light emitting unit 115 Reference plate adjustment stages 315b, 325b First Light emitting units 315c, 325c Second light emitting units MF, MF1, MF2 MF3, MF12 moire fringe MM1 first Moire mark MM2 second Moire mark MMR, MMR1, MMR2 reference moiré marks MT1, MT2 transfer Moire mark V1 first vernier pattern V2 second vernier pattern

Claims (11)

A first interference fringe is formed by superimposing a second mark, which is not changed in size due to the delivery of the flexible substrate, on the first mark that is continuously delivered in synchronization with the delivery of the flexible substrate having flexibility. Is generated,
Obtaining the distortion of the first mark based on the generated interference fringes;
A method for controlling expansion and contraction of the flexible substrate, wherein the expansion and contraction of the flexible substrate that is continuously delivered based on the acquired strain is controlled. The expansion / contraction control method for a flexible substrate according to claim 1, wherein the distortion is obtained by performing image processing on the first interference fringes. The expansion / contraction control method for a flexible substrate according to claim 1, wherein the first mark is formed on the flexible substrate. The expansion / contraction control of the flexible substrate according to any one of claims 1 to 3, wherein a portion serving as a mold for forming the first mark is formed on a roll that forms a predetermined pattern on the flexible substrate. Method. 5. The flexible according to claim 1, wherein the first interference fringes are generated on the reference plate on which the second mark is formed such that the second mark faces the first mark. 6. Expansion and contraction control method of conductive substrate. Forming a second layer including a third mark superimposed on a part of a region where the first mark is formed immediately above the first layer including the first mark;
Based on the generated first interference fringe, the first mark is formed by overlapping the second mark on a region where the first mark is formed and the third mark is not formed. Obtaining the strain of the first mark;
Generated by generating a second interference fringe by overlaying a fourth mark that is not changed in size due to the feeding of the flexible substrate in a region where the third mark is formed and the first mark is not formed. Obtaining the distortion of the third mark based on the second interference fringes made,
Obtaining a strain based on a third interference fringe generated in a region where the first mark and the third mark are overlapped;
The expansion / contraction of the flexible substrate is controlled based on the obtained distortion of the first mark, the distortion of the third mark, and the distortion based on the third interference fringe. The expansion / contraction control method of the flexible substrate as described. The alignment method of aligning the lamination | stacking pattern laminated | stacked on the said flexible substrate using the expansion-contraction control method of the flexible substrate as described in any one of Claim 1-6. The alignment method according to claim 7, wherein the first and second marks are used as alignment marks.   The first mark and the third mark are overlapped to generate a third interference fringe, and the first layer and the second layer are aligned based on the third interference fringe. Or the alignment method according to 8. The manufacturing method of an electronic device which manufactures the electronic device which has the said lamination | stacking pattern using the positioning method as described in any one of Claim 7-9. A first mark that is generated by superimposing a second mark that does not change in dimension due to the feeding of the flexible substrate on the first mark that is continuously fed in synchronization with the feeding of the flexible substrate having flexibility. A strain acquisition unit for acquiring strain of the first mark based on interference fringes;
A flexible substrate expansion / contraction control system, comprising: a substrate expansion / contraction control unit that controls expansion / contraction of the flexible substrate that is continuously delivered based on the acquired strain.

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