JP2017017676A - Piezoelectric device and base - Google Patents

Abstract

PROBLEM TO BE SOLVED: To fix a quartz crystal piece to electrically conductive adhesive at an end portion on a short side of the quartz crystal piece and at a substantially central portion of the short side, and reduce the inclination of a holding of the crystal quartz piece in a piezoelectric device having such one-point holding that a wire of wire bonding is connected by a portion of the quartz crystal piece which strikes the back of a fixing position by the electrically conductive adhesive.SOLUTION: A first wiring electrode 23 is provided to a portion containing a portion corresponding to the center in a direction along a short side 21b at an end portion on the short side 21b side of a base 21. In addition, the first wiring electrode 23 is sized and shaped in plane so as to planarly contain an area (a main area of electrically conductive adhesive agent) 31b in which at least a portion of the electrically conductive adhesive 31 in contact with the quartz crystal piece is projected onto the base side.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a crystal resonator as a piezoelectric device, a crystal oscillator, and a base suitable for use in manufacturing the crystal resonator.

  In various electronic devices such as mobile phones and personal computers, crystal resonators and crystal oscillators are frequently used for frequency selection and control.

  As an example of the crystal resonator, there is one disclosed in Patent Document 1, for example. This quartz crystal resonator has a rectangular crystal piece in plan view having excitation electrodes and extraction electrodes on both main surfaces, and the first and second crystal elements mounted with the crystal piece and connected to the extraction electrode. And a base having a wiring electrode. And this crystal | crystallization piece is being fixed to the base by adhere | attaching and fixing the extraction electrode of the one surface to the 1st wiring electrode of a base with a conductive adhesive. The fixing position by the conductive adhesive is an end portion on the side of one side (specifically, one short side) of the crystal piece and a portion corresponding to the approximate center of this side. In addition, the lead electrode provided on the other surface of the crystal piece and the second wiring electrode of the base are connected by wire bonding. Moreover, the bonding and wire bonding are performed so that the fixing position by the conductive adhesive and the bonding position on the crystal piece side by wire bonding overlap in the thickness direction of the crystal piece.

  In this crystal resonator disclosed in Patent Document 1, the crystal piece is fixed to the base of the short side of the short side, that is, the crystal piece is fixed to the base at one location. Inclination hardly occurs and workability is improved (for example, paragraph 8 of Patent Document 1). In addition, since one of the electrical connections between the crystal piece and the base is performed by wire bonding, it is considered that the influence of stress on the crystal piece from the fixed portion of the crystal is reduced.

JP 2010-147625 A

  By the way, although wire bonding is performed on the extraction electrode formed on the crystal surface, since the crystal is brittle, it is important to perform the wire bonding stably with a weak force. In order to realize this, it is important that the inclination of the crystal piece is small and the variation in the height of the crystal piece (that is, the variation in the height of the bonding surface) is suppressed. Therefore, in order to further reduce the inclination and height variation of the crystal piece when the crystal piece is fixed at one point by the conductive adhesive, further ingenuity is required.

  An object of each invention of this application is to solve the above-described problems.

  In order to achieve this object, according to the piezoelectric device of the first invention of this application, a crystal piece having a rectangular planar shape, excitation electrodes provided on both main surfaces of the crystal piece, and the excitation electrodes An extraction electrode drawn out to the vicinity of one side of the crystal piece; a base on which the crystal piece is mounted and having a rectangular planar shape; and first and second electrodes provided on the base and connected to the extraction electrode 2 wiring electrodes.

  However, the crystal piece is connected and fixed to the first wiring electrode by a conductive adhesive at the end of the one side of the one surface, and the other side of the crystal piece. The lead electrode on the surface and the second wiring electrode are connected by wire bonding, and the fixing position by the conductive adhesive and the bonding position on the crystal piece side by the wire bonding are the crystal piece. The fixing and wire bonding are performed so as to overlap each other in the thickness direction (including the case where they substantially overlap).

However, the first wiring electrode is provided at an end portion on one side of the base, and at least a portion of the fixing conductive adhesive that is in contact with the crystal piece is on the base side. The projected area (hereinafter, also referred to as “main area of the conductive adhesive”) has a size and a planar shape including the plane. The surface of the first wiring electrode is as flat as possible.
In carrying out the first invention, preferably, the first wiring electrode includes an end portion on one side of the base, which still corresponds to the center in the direction along the one side. It is good to provide in the part.
In the implementation of the first invention, more preferably, the first wiring electrode has a size and a planar shape that planarly covers the entire application region of the conductive adhesive for fixing. Is good.

  According to the first invention and its preferred embodiment, the conductive adhesive for fixing the crystal piece is located on the first wiring electrode having a plane area larger than the plane area of the main region. If there is a step on the surface where the conductive adhesive is applied, if the crystal piece is pulled to the lower step or the crystal piece is pushed from above until the adhesive is cured after mounting the crystal piece, the crystal piece It causes a variation in the inclination and height of the. However, in the present invention, since at least the main region of the conductive adhesive does not protrude from the first wiring electrode and over the base, it is provided only on the surface having the same height. Variation in inclination and height can be reduced.

In carrying out the first invention of this application, the first wiring electrode and the second wiring electrode described above are formed in the following forms (a) to (d), and (a) to (d). Therefore, it is preferable to adopt one form or a combination of plural forms according to the purpose.
(A) The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and the first wiring electrode is the second wiring A form extending in the direction opposite to the electrode side and extending to a region beyond the end along the one side of the crystal piece (a specific example is shown in FIGS. 1A and 1B). 1 wiring electrode 23).
(B) The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and the second wiring electrode is near a corner of the base And the edge on the center side of the base is in the direction perpendicular to the one side and is located at the center position of the bonding region by the conductive adhesive for fixing or the center side of the base from the center. A form provided in size and arrangement (a specific example is the second wiring electrode 25 in FIGS. 1A and 1B).
(C) The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and the first wiring electrode is formed on the crystal piece. A form provided in a region not exceeding an end portion along one side (specific examples are the first wiring electrode 23X in FIG. 6 and the first wiring electrode 23y in FIG. 7).
(D) The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and the second wiring electrode is near a corner of the base The embodiment is provided in a region that does not overlap with the crystal piece (specific examples are the first wiring electrode 25X in FIG. 6 and the first wiring electrode 25y in FIG. 7).
When either one or both of the above forms (a) and (b) are adopted, the first wiring electrode and / or the second wiring electrode also act as a member that reduces the inclination of the crystal piece. Therefore, in the unlikely event that the crystal piece tilts, the correction can be assisted.
Further, when one or both of the forms (c) and (d) are adopted, the first wiring electrode and the second wiring electrode are electrically conductive as referred to in the first invention. It has a plane area of the minimum requirement of a size and a planar shape that covers the entire area where the adhesive is applied. That is, the first wiring electrode and the second wiring electrode are present only in the necessary region below the crystal piece, and are not present below the edge of the crystal piece. For this reason, when the inclination of the quartz crystal piece is prevented with the minimum required component of the first invention of a size and a planar shape that covers the entire area where the conductive adhesive is applied, it is slightly in contact with the bottom surface of the base. Even if a slight inclination remains, the edge of the crystal piece can be prevented from coming into contact with the first wiring electrode or the second wiring electrode, and stress on the crystal piece due to such unnecessary contact can be prevented. The influence can be eliminated. Therefore, the forms (c) and (d) are useful for piezoelectric devices that are easily affected by such stress.

  In addition, as the conductive adhesive used in the first invention and its preferred examples, various types such as silicone type, epoxy type and polyimide type can be used. However, in practicing the present invention, it is preferable to use a conductive adhesive that is rich in elasticity, typically a silicone-based conductive adhesive. In this case, since the buffering effect between the crystal piece and the base is increased as compared with the case where an epoxy or polyimide conductive adhesive is used, the influence of the stress from the base can be further reduced.

  According to the piezoelectric device of the second invention of this application, the piezoelectric device includes any one of the piezoelectric devices of the first invention and preferred examples thereof, and a crystal oscillation circuit mounted on a base together with a crystal piece. And According to the second aspect of the invention, it is possible to realize a crystal oscillator in which there is no characteristic deterioration due to the tilt of the crystal piece.

  Also, according to the base invention as the third invention of this application, the first wiring to which the conductive adhesive for fixing and electrically connecting the end portion of one main surface of the crystal piece to the base is applied. In the base having a rectangular planar shape, which includes an electrode and a second wiring electrode to which a wire bonding wire is connected from the end of the other surface of the crystal piece, the first wiring electrode is a part of the base. And a planned region (conducting adhesive of the conductive adhesive) that is provided at an end of one side and is a region projected at least on the base side when the conductive adhesive is applied. It is characterized in that it has a size and a planar shape including a plan area as a main area).

In carrying out the invention of the base, more preferably, the first wiring electrode is an end of one side of the base as described in the preferred embodiment of the first invention. It is good to provide in the part which hits the center of the direction along this one edge | side. Further, the first wiring electrode is preferably of a size and a planar shape that covers the entire area where the fixing conductive adhesive is to be applied in a planar manner.
Further, in carrying out the invention of this base, it is preferable to adopt one form or a combination form of the forms (a) to (d) described in the first invention.
According to these base inventions and preferred embodiments thereof, it is easy to manufacture a piezoelectric device having a one-point holding structure using both a conductive adhesive and wire bonding.

According to the invention of the piezoelectric device of this application, it is possible to obtain a piezoelectric device having a one-point holding structure in which a conductive adhesive and wire bonding are used in combination, and having a small inclination and height variation of a crystal piece.
Further, according to the base invention of this application, the above-described piezoelectric device invention can be easily implemented.

FIG. 2A is a plan view of the piezoelectric vibrator 10 according to the embodiment, and FIG. (A) is a principal part top view explaining the relationship between the 1st wiring electrode and the application | coating area | region of a conductive adhesive, (B) is principal part sectional drawing, (C) is a cross section explaining another adhesion | attachment state. FIG. It is a top view explaining a crystal piece, and is a figure explaining the relationship between a crystal piece, an excitation electrode, and an extraction electrode. (A) is a plan view for explaining the invention of the base, and (B) is a sectional view thereof. (A) is a plan view illustrating another example of the piezoelectric device and the base (example of mounting an oscillation circuit member), (B) is a cross-sectional view thereof, and (C) is a cross-section illustrating still another example of the piezoelectric device and the base. FIG. (A) is a plan view of a piezoelectric vibrator adopting another embodiment of the first wiring electrode and the second wiring electrode, and (B) is a plan view focusing on these wiring electrodes. (A) is a plan view of a piezoelectric vibrator that employs still another embodiment of the first wiring electrode and the second wiring electrode, and (B) is a plan view focusing on these wiring electrodes. (A) is a plan view of a piezoelectric vibrator 10 that employs another embodiment of the base, and (B) is a cross-sectional view of the piezoelectric vibrator. It is the figure which showed an example of the sheet-like base member.

  Embodiments of the invention of this application will be described below with reference to the drawings. Each figure used for explanation is only shown to such an extent that these inventions can be understood. Moreover, in each figure used for description, about the same component, it attaches | subjects and shows the same number, The description may be abbreviate | omitted. The shapes, dimensions, materials, and the like described in the following examples are only suitable examples within the scope of the present invention. Therefore, the present invention is not limited only to the following examples.

1. Embodiment of Piezoelectric Device FIG. 1A is a plan view illustrating a piezoelectric device 10 according to an embodiment of the first invention. 1B is a cross-sectional view of the piezoelectric device 10 taken along the line P-P in FIG. However, in this figure, the illustration of the lid provided in the piezoelectric device is omitted. The same in the following figures.
The piezoelectric device 10 according to the embodiment includes a crystal piece 11 having a rectangular planar shape, excitation electrodes 13 provided on both main surfaces of the crystal piece 11, and the vicinity of one side 11 a of the crystal piece 11 from each excitation electrode 13. Lead electrodes 15a and 15b led out to the base, a base 21 having a rectangular crystal plate 11 mounted thereon, and a first and a second provided on the base 21 and connected to the lead electrodes 15a and 15b. Wiring electrodes 23, 25. In this embodiment, the base 21 has a recess 21a, and the crystal piece 11 is mounted in the recess 21a. In this case, the base 21 is formed of a ceramic package.

  The crystal piece 11 is an end portion on one side 11a side of one surface of the crystal piece 11 and corresponds to a substantially center in the direction along the one side 11a, and the first wiring electrode is formed by the conductive adhesive 31. 23 is fixedly connected. Specifically, the crystal piece 11 is held at one point by the conductive adhesive 31 at the end portion on the short side 11a side of the crystal piece 11 and at a substantially central portion of this side along the short side 11a. is there. In order to facilitate the understanding of the relationship between the crystal piece 11, the excitation electrode 13, and the extraction electrodes 15a and 15b, the crystal piece 11 alone including the crystal piece 11, the excitation electrode 13 and the extraction electrodes 15a and 15b is shown in FIG. A plan view is shown. For example, a silicone-based adhesive is used as the conductive adhesive 31. Each of the excitation electrode 13 and the extraction electrodes 15a and 15b can be composed of, for example, a laminated film of a chromium film and a gold film from the crystal piece side.

The lead electrode 15b on the other surface of the crystal piece 11 and the second wiring electrode 25 are connected by a wire bonding wire 33. Then, the fixing position by the conductive adhesive 31 and the bonding position on the crystal piece side by the wire bonding wire 33 are overlapped in the thickness direction of the crystal piece 11 (direction along the line segment R in FIG. 1B). (In general, the case where they overlap each other) Fixing with a conductive adhesive and wire bonding are performed.
The wire bonding method is not particularly limited, and a ball bonding method, a wedge bonding method, or the like can be used.

  Further, the first wiring electrode 23 is in the recess 21a of the base 21 and is in the direction along the one side 21b at the end of one side 21b (see FIG. 1A) of the base 21. It is provided in the part including the part which hits the center. More specifically, a portion of the first wiring electrode 23 to which the conductive adhesive 31 is applied becomes a portion corresponding to the above-described substantially center of the short side of the base 21 in the recess 21 a of the base 21. Further, the first wiring electrode 23 is provided on the base 21 so as to extend from the substantially central portion in the direction opposite to the second wiring electrode 25. The extent of the extension is provided, for example, below the edge of the crystal piece 11 or extended to a region beyond the edge of the crystal piece 11. In this embodiment, the edge of the base 21 is provided beyond the edge of the crystal piece 11. When a part of the first wiring electrode 23 extends in the direction opposite to the second wiring electrode 25, the extended part functions as a receiver when the crystal piece 11 is tilted in the opposite direction. Therefore, the inclination can be reduced, which is preferable.

  Further, as shown in FIGS. 1 and 2, the first wiring electrode 23 includes a region 31b (conductive adhesive) obtained by projecting at least a portion of the conductive adhesive 31 in contact with the crystal piece 11 onto the base 21 side. The main region 31b) is of a size and a planar shape including the planar region. Even if the first wiring electrode 23 has a size and arrangement including only the main region 31b of the conductive adhesive, the object of the present invention can be achieved, but the entire application region 31a of the conductive adhesive can be reduced. It is more preferable to have a size and a planar shape including in a plane. In this embodiment, an example is shown.

On the other hand, the second wiring electrode 25 is provided in the recess 21 a of the base 21, at the end on the side 21 b side of the base 21 and in the vicinity of the corner of the recess 21 a of the base 21. Moreover, the bonding of the conductive adhesive 31 in the direction in which the edge 25a on the center side of the base of the second wiring electrode 25 is orthogonal to the one side 21b, that is, the direction along the long side of the base 21 in this example. The area 31a or 31b is provided in the same size as the center position O, or with a size and arrangement projecting from the area 31a or 31b toward the center of the base 21. More specifically, the edge 25a on the center side of the base of the second wiring electrode 25 has a dimension d in the longer side direction of the base 21 and on the center side of the base 21 than the center position O of the adhesion region by the conductive adhesive 31 The second wiring electrode 25 is provided on the base 21 so as to protrude only (see FIG. 1A). In addition, when the overhanging position is the same as the center position O of the adhesion region, the dimension d is zero. This dimension d is preferably the dimension to the end of the main region 31b of the conductive adhesive up to the end of the base center side, more preferably the dimension to the end of the entire conductive adhesive application region 31a to the center side of the base. Is good.
The end of the second wiring electrode 25 on the corner 21 side of the base 21 may be in contact with or away from the wall portion of the base 21, and the position of the end on the corner side is connected to the wire. It is good to decide arbitrarily suitably in consideration of ease of operation. The first and second wiring electrodes 23 and 25 can be formed of a film made of any suitable material, for example, an electroless plating film of nickel and gold.
Each of the first wiring electrode 23 and the second wiring electrode 25 described above is connected to an external mounting terminal (not shown) provided on the outer bottom surface of the base 21 by a via wiring (not shown) as is well known. It is.

  Next, the effect of the piezoelectric device 10 of embodiment is demonstrated with reference to FIG. 2 (A) and (B). FIG. 2A is a plan view mainly showing the relationship between the first wiring electrode 23, the second wiring electrode 25, the adhesive regions 31 a and 31 b of the conductive adhesive, and the crystal piece 11. FIG. 2B is a cross-sectional view of this portion taken along line QQ in FIG. In order to clarify the first and second wiring electrodes 23 and 25, the first and second wiring electrodes 23 and 25 are hatched in the plan view of FIG.

In the piezoelectric device 10 of this embodiment, the main region 31 b of the conductive adhesive is included in a plane in the region of the first wiring electrode 23. In addition, the entire application region 31 a of the conductive adhesive is also included in a plane in the region of the first wiring electrode 23. Accordingly, since the conductive adhesive 31 is provided only on the first wiring electrode 23, the crystal piece 11 placed on the conductive adhesive and pushed by the bonding jig or the like is not easily tilted. The problem that the crystal piece 11 tilts can be improved. Further, the end portion 25 a on the center side of the base 21 of the second wiring electrode 25 protrudes from the center O of the adhesion region 31 toward the center side of the base 21. This portion serves to limit the tilting condition of the crystal piece 11, and this also makes the crystal piece 11 difficult to tilt. Further, since the first wiring electrode 23 extends to the base wall even on the opposite side of the first wiring electrode 23 from the second wiring electrode 25, the inclination can be limited by this.
The main region of the conductive adhesive is not limited to the portion formed in the convex adhesive region 31a shown in FIG. For example, as shown in FIG. 2 (C), when the conductive adhesive comes out of the original application position, the conductive adhesive is placed below the portion of the conductive adhesive that contacts the crystal piece. Even when there is not, the region 31c in which the portion of the conductive adhesive contacting the crystal piece is projected downward is included in the main region of the conductive adhesive in the present invention.

2. Embodiment of Base FIG. 4A is a plan view for explaining a base 21 of the embodiment, and FIG. 4B is a cross-sectional view taken along the line P-P of FIG. 4A.
The base 21 of the embodiment has a recess 21a for mounting a crystal piece. Further, a first wiring electrode 23 to which a conductive adhesive (not shown) is fixed and electrically connected to the base at one end of one main surface of the crystal piece (not shown), and the crystal piece A second wiring electrode 25 to which a wire bonding wire (not shown) is connected from an end of the other surface (not shown).
And the 1st wiring electrode 23 is in the recessed part 21a of the base 21, Comprising: In the part including the part which hits the center of the direction along this one side 21b of the edge part of the one side 21b side of the base 21, It is provided. In addition, at least the planned area 31x where the conductive adhesive contacts the crystal piece in the planned application area 31x of the conductive adhesive has a size and a planar shape that planarly includes. Preferably, a size and a planar shape that include the conductive adhesive application planned region 31x in a plane are preferable. In this case, the latter structure is adopted.

  Further, the second wiring electrode 25 is provided in the recess 21 a of the base 21, at an end on the side 21 b side of the base 21 and in the vicinity of the corner of the recess 21 a of the base 21. In addition, the second wiring electrode 25 has a center position O ′ of the planned adhesion region 31x or 31y of the conductive adhesive in the direction in which the edge 25a on the center side of the base is orthogonal to the one side 21b. It is provided in the concave portion 21 a of the base 21 in such a size and arrangement as to protrude more toward the center side of the base 21. The dimension d ′ of how much the edge 25a on the center side of the base of the second wiring electrode 25 protrudes from the center position O ′ of the conductive adhesive planned region is preferably the base center of the conductive planned region 31x. The dimension to the side end, more preferably the dimension to the center side end of the base of the entire application region 31x of the conductive adhesive is good.

3. Other Embodiments 3-1. Embodiment Including Oscillator Circuit FIGS. 5A to 5C are diagrams for explaining another embodiment. 5A is a plan view schematically showing the oscillator 40 according to the embodiment, and FIG. 5B is a cross-sectional view taken along the line P-P in FIG. 5A. FIG. 5C is a cross-sectional view schematically showing a so-called H-shaped oscillator 50 in which a crystal piece and an oscillation circuit component, for example, an oscillation circuit IC chip are housed in separate rooms.
As the base sealing method, any method such as a so-called direct seam sealing method, a seam sealing method with a ring, a sealing method using a eutectic alloy material using gold tin or the like can be adopted. The bases 21x and 21z shown in FIG. 5 are examples in which a ring 21y for seam welding is provided on the bank around the recess 21a.

3-2. Other Examples of First Wiring Electrode and Second Wiring Electrode In the above-described embodiment, as shown in FIG. 1, the first wiring electrode 23 extends from the position below the crystal blank 11 to the edge of the crystal blank 11. In this example, the second wiring electrode 25 is provided to extend to the lower side of the crystal piece 11. However, if the tilt of the crystal piece can be suppressed with the minimum necessary configuration of the present invention in which the first wiring electrode includes the region where the conductive adhesive is to be applied, the first wiring electrode and the second wiring electrode are quartz. It is preferable to have the minimum necessary planar shape so as not to contact the piece unnecessarily. The embodiment in this section is an example.

FIGS. 6A and 6B illustrate the example. In particular, FIG. 6A is a plan view of the piezoelectric device 60 of this embodiment, and FIG. 6B is a plan view focusing on the first wiring electrode 23x and the second wiring electrode 25x. It is.
In the piezoelectric device 60 of this embodiment, the first wiring electrode 23 x is provided in an end portion along one side 11 a of the crystal piece 11, that is, in a region not exceeding the long side of the crystal piece 11. The second wiring electrode 25x is provided in the vicinity of the corner of the base 21 so as not to overlap with the crystal piece 11, that is, below the crystal piece 11 and not to overlap with the crystal piece 11. is there. However, the lead-out direction of the first wiring electrode 23x is the first side 21b side of the base 21, and the lead-out portion of the first wiring electrode 23x is used as the first wiring electrode 23x. The position is closer to one side in the direction along the first side 11a (short side). Further, in this example, the second wiring electrode 25x is provided along the first side 11a (short side) of the crystal piece 11. Here, the above-described region where the first wiring electrode 23X does not exceed the long side of the crystal piece 11 is a region wider than the entire region 31a of the conductive adhesive and does not reach the long side of the crystal piece. Preferably, it is a region that is wider than the entire region 31a of the conductive adhesive and that does not reach the long side of the crystal piece as much as possible (that is, as narrow as possible). This is because it is easier to prevent the crystal piece from unnecessarily contacting the first wiring electrode.

FIG. 7 is an explanatory diagram of still another example. In particular, FIG. 7A is a plan view of the piezoelectric device 70 of this embodiment, and FIG. 7B focuses on the first wiring electrode 23y and the second wiring electrode 25y. FIG.
The difference between the piezoelectric device 70 and the piezoelectric device 60 is that the second wiring electrode 25y is provided along the long side of the crystal piece 11, and the lead-out portion of the first wiring electrode 23y is connected to the first wiring. This is the point at the center of the electrode 23y in the direction along the first side 11a (short side) of the crystal piece 11.

3-3. Other Embodiments Related to Base In the above-described embodiment, for example, as shown in FIG. 1, the base 21 has the concave portion 21 a containing the crystal piece 11 and the surrounding bank portion, and the piezoelectric device is located on the bank portion. An example of sealing with a lid member is shown. However, each invention of this application may use a base having another structure. The embodiment in this section is an example.
FIG. 8 is a diagram for explaining the above, and in particular, FIG. 8A is a plan view of a piezoelectric device 80 according to an embodiment using a base having another structure, and FIG. 8B is a P-P line in FIG. FIG.

The piezoelectric device 80 of this embodiment is a flat base 81 on which the crystal piece 11 is placed, and includes the base 81 including the first wiring electrode 23x and the second wiring electrode 25x, and the crystal piece 11 included therein. And a lid member 83 having a recess 83a. In this piezoelectric device 80, the base 81 is sealed with a lid member 83 at the edge thereof (FIG. 8B). The flat base 81 can be made of, for example, ceramics, and the lid member 83 can be made of, for example, a squeezed metal member. Any suitable method may be used for sealing the base 81 with the lid member 83. For example, a method in which a eutectic alloy (not shown) is provided on the edge portion of the base 81 and the lid member 83 is joined by this eutectic alloy can be mentioned. Or the method of connecting the edge part of the base 81 and the cover member 83 with materials, such as an adhesive agent, can be mentioned.
As shown in FIG. 9, the base 81 is typically a sheet-like base on which a crystal piece 11 to be mounted can be placed and which has a divided area 81a on which a large number of crystal pieces 11 are mounted. The member 81s is formed. Specifically, the piezoelectric device 80 is manufactured by assembling a large number of piezoelectric devices using the sheet-like base member 81a, and then separating the sheet-like base 81s into individual devices by dicing or the like.

DESCRIPTION OF SYMBOLS 10: Piezoelectric device of embodiment, 11: Quartz piece, 13: Excitation electrode 15a, 15b: Extraction electrode, 21: Base, 21a: Recessed part 21b: One side, 21x: Base (with seam welding ring)
21y: Ring for seam welding, 21z: Base (H-type structure)
23, 23x, 23y: first wiring electrode 25, 25x, 25y: second wiring electrode 25a: end on the center side of the base of the second wiring electrode,
31: Conductive adhesive, 31a: Whole area of conductive adhesive 31b, 31c: Main area of conductive adhesive 31x: Area where conductive adhesive is to be applied 31y: Area where conductive adhesive is in contact with crystal piece 33: Wire 40: Oscillator according to the embodiment 41: Oscillator circuit member 50: Base of H-type structure 60, 70, 80: Piezoelectric device according to another embodiment 81: Flat base 81a: Separated region ,
81s: a sheet-like base member 83: a lid member having a recess, 83a: a recess O: a center position of an adhesion region O ′: a center of an adhesion planned region

Claims (23)

A crystal piece having a rectangular planar shape, excitation electrodes provided on both main surfaces of the crystal piece, an extraction electrode drawn from each excitation electrode to the vicinity of one side of the crystal piece, and the crystal piece A base that is mounted and has a rectangular planar shape, and first and second wiring electrodes that are provided on the base and connected to the extraction electrode,
The crystal piece is connected and fixed to the first wiring electrode by a conductive adhesive at an end portion on one side of one surface, and the lead electrode on the other surface of the crystal piece and the first electrode The wiring electrode 2 is connected by wire bonding, and the fixing position by the conductive adhesive and the bonding position on the crystal piece side by the wire bonding overlap in the thickness direction of the crystal piece. In the piezoelectric device that is fixed and wire bonded,
The first wiring electrode is provided at an end on one side of the base, and at least a region of the conductive adhesive in contact with the crystal piece is projected onto the base side. A piezoelectric device characterized by having a size and a planar shape. The piezoelectric device according to claim 1.
The piezoelectric device is characterized in that the first wiring electrode is provided in a portion including an end portion on one side of the base and a portion corresponding to the center in the direction along the one side. The piezoelectric device according to claim 1 or 2,
The piezoelectric device according to claim 1, wherein a size and a planar shape of the first wiring electrode are of a size and a planar shape including the entire application region of the fixing conductive adhesive in a planar manner. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The first wiring electrode is provided to extend in a direction opposite to the second wiring electrode side to a region beyond an end portion along the one side of the crystal piece. Piezoelectric device. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The second wiring electrode is provided in the vicinity of a corner of the base, and an edge of the base on the center side is in a direction orthogonal to the one side, and is bonded with the conductive adhesive for fixing. The piezoelectric device is provided with a size and an arrangement at a center position of the base or a center side of the base. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The first wiring electrode extends in a direction opposite to the second wiring electrode side and extends to a region beyond the end portion along the one side of the crystal piece,
The second wiring electrode is provided in the vicinity of a corner of the base, and an edge of the base on the center side is in a direction orthogonal to the one side, and is bonded with the conductive adhesive for fixing. The piezoelectric device is provided with a size and an arrangement at a center position of the base or a center side of the base. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The first wiring electrode is provided in a region which does not exceed an end portion along the one side of the crystal piece in a direction opposite to the second wiring electrode side. device. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The piezoelectric device according to claim 1, wherein the second wiring electrode is provided in a region near the corner of the base and not overlapping the crystal piece. The piezoelectric device according to any one of claims 1 to 3,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side of the crystal piece, and
The first wiring electrode is provided in a region not exceeding an end portion along the one side of the crystal piece,
The piezoelectric device according to claim 1, wherein the second wiring electrode is provided in a region near the corner of the base and not overlapping the crystal piece. The piezoelectric device according to any one of claims 1 to 9,
The base has a concave portion enclosing the crystal piece and a surrounding bank portion, and the piezoelectric device is sealed with a lid member at the bank portion. The piezoelectric device according to any one of claims 1 to 10,
The base is a flat plate on which the crystal piece is placed, and the piezoelectric device is sealed with a lid member having a concave portion containing the crystal piece. The piezoelectric device according to any one of claims 1 to 11,
A piezoelectric device, wherein the conductive adhesive is a silicone-based conductive adhesive.   A piezoelectric device comprising the piezoelectric device according to claim 1 and a crystal oscillation circuit mounted on the base together with the crystal piece. A first wiring electrode to which an electric adhesive for fixing and electrically connecting the end of one main surface of the crystal piece to a base is applied; and a wire bonding wire from the end of the other surface of the crystal piece In a base having a rectangular planar shape comprising a second wiring electrode connected to
The first wiring electrode is provided in a portion including an end portion on one side of the base and a portion corresponding to the center in the direction along the one side, and at least the conductive adhesive is applied. A base having a size and a planar shape including a predetermined area where the conductive adhesive is in contact with the crystal piece in the predetermined area. The base of claim 14,
The first wiring electrode is provided at an end on one side of the base and corresponding to the center in the direction along the one side, and the application of the conductive adhesive for fixing is applied A base having a size and a planar shape covering a predetermined area in a plane. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
The first wiring electrode is provided so as to extend in a direction opposite to the second wiring electrode side to a region beyond the end portion along the one side of the crystal piece to be mounted. Characteristic base. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
The second wiring electrode is bonded to a conductive adhesive in a direction in which the edge on the center side of the base is orthogonal to the one side at an end of the one side and a corner of the base. A base having a size and an arrangement that projects from a center position of a planned area or beyond to a center side of the base. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
The first wiring electrode is provided to extend in a direction opposite to the second wiring electrode side to a region beyond the end along the one side of the crystal piece to be mounted;
The second wiring electrode is bonded to a conductive adhesive in a direction in which the edge on the center side of the base is orthogonal to the one side at an end of the one side and a corner of the base. A base having a size and an arrangement that projects from a center position of a planned area or beyond to a center side of the base. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
The base, wherein the first wiring electrode is provided in a region not exceeding an end portion along the one side of the crystal piece to be mounted. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
2. The piezoelectric device according to claim 1, wherein the second wiring electrode is provided in a region in the vicinity of the corner of the base and not overlapping a crystal piece to be mounted. In the base according to claim 14 or 15,
The first wiring electrode and the second wiring electrode are arranged in a direction along the one side, and
The first wiring electrode extends in a direction opposite to the second wiring electrode side to a region beyond the end along the one side of the crystal piece to be mounted;
2. The base according to claim 1, wherein the second wiring electrode is provided in a region near a corner of the base and not overlapping with a crystal piece to be mounted. The base according to any one of claims 14 to 21,
The base has a concave portion that encloses a crystal piece to be mounted and a bank portion around the concave portion, and is subsequently sealed with a member at the bank portion. The base according to any one of claims 14 to 21,
The base is a flat plate on which a crystal piece to be mounted is placed and a sheet-like base having a divided area on which a large number of crystal pieces are mounted.

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