JP2017011920A - Power conversion device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique that relates to a power conversion device having a power unit in which a semiconductor module and a cooling unit are alternately laminated, and also enhances sealing performance of a metal plate for sealing the opening of the cooling unit.SOLUTION: A power conversion device includes an elastic member that pressurizes a power unit. Each of a pair of adjacent coolers includes a main body, a gasket, and a metal plate. The main body has a flow path therein, and also has an opening on a side surface facing the semiconductor module. The gasket is arranged so as to surround the opening. One surface of the metal plate closes the opening through the gasket. Sealing between the opening and the metal plate is secured by the pressing force of the elastic member. When viewed from the lamination direction, the gasket overlaps with the semiconductor module except for a part thereof. A spacer is inserted to be fitted in a gap which is located between a pair of metal plates on both sides of the semiconductor module and overlaps with a part of the gasket when viewed from the lamination direction so that the gap is filled with the spacer.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a power conversion device including a power unit in which a plurality of card-type semiconductor modules containing semiconductor elements and a plurality of coolers are alternately stacked one by one.

  For example, a power conversion device that supplies power to a large-capacity motor includes a plurality of semiconductor elements that generate a large amount of heat. As one of the structures for efficiently cooling a plurality of semiconductor elements, a power conversion device is a power unit in which a plurality of card-type semiconductor modules and a plurality of coolers that accommodate semiconductor elements are alternately stacked. (For example, Patent Documents 1 and 2). Since this power unit cools the card-type semiconductor module from both sides, the cooling efficiency is high. Furthermore, the power conversion device of Patent Document 2 includes an elastic member that pressurizes the power unit in the stacking direction of the semiconductor module and the cooler in order to increase cooling efficiency.

JP2013-121236A JP 2012-231591 A

  The applicant of the present application has proposed to adopt a cooler composed of a main body having an opening and a metal plate that closes the opening for the power unit (Japanese Patent Application No. 2014-083469, filed on April 15, 2014, Not disclosed at the time of filing this application). The cooler can be made of a resin body, has excellent mass productivity, and is lightweight. The cooler has the following structure. The cooler includes a main body, a metal plate, and a gasket. The main body is provided with a flow path through which a coolant flows, and an opening communicating with the flow path is provided on a side surface facing the semiconductor module. The gasket is arranged on the side surface around the opening so as to surround the opening when viewed from the stacking direction of the semiconductor module and the cooler. One side of the metal plate closes the opening with a gasket interposed therebetween, and the other side faces the semiconductor module. That is, one surface of the metal plate faces the flow path, and the other surface faces the semiconductor module. Note that the metal plate and the semiconductor module may be in direct contact with each other or an insulating plate may be sandwiched therebetween. The power converter includes a power unit in which the above-described cooler and semiconductor module are stacked, and an elastic member that pressurizes the power unit in the stacking direction. In the cooler described above, sealing between the opening and the metal plate is ensured by the pressure applied by the elastic member. Even if the main body of the cooler is made of, for example, a resin having low thermal conductivity, the heat of the semiconductor module is efficiently absorbed by the refrigerant in the cooler through the metal plate.

  In the above power conversion device, a gasket is disposed between the periphery of the opening of the main body and the metal plate, and sealing between the opening and the metal plate is ensured by the pressing force of the elastic member. The metal plate is sandwiched between the main body and the semiconductor module. Here, in order to increase the cooling efficiency of the semiconductor module, the opening is preferably large. When the opening is large, a part of the gasket may not overlap the semiconductor module when viewed from the stacking direction of the semiconductor module and the cooler. In a portion where the gasket and the semiconductor module overlap when viewed from the stacking direction, the reaction force of the gasket applied to the metal plate is received by the semiconductor module. On the other hand, in the region where the semiconductor module and the gasket do not overlap, the metal plate may be bent by the reaction force of the gasket, and the sealing between the opening and the metal plate may be weakened. This specification provides the technique which improves the sealing performance between the opening of a cooler, and a metal plate, without a metal plate bending.

  The power converter disclosed in this specification includes the above-described power unit and an elastic member. Attention is now paid to a pair of coolers adjacent to each other with one semiconductor module interposed therebetween. In the power unit, when viewed from the stacking direction, the gasket overlaps with one semiconductor module except for a part. A spacer is inserted into a gap between a pair of metal plates located on both sides of one semiconductor module in the stacking direction and overlapping a part of the gasket when viewed from the stacking direction. . In a region where the metal plate and the semiconductor module do not overlap in the stacking direction, the spacer receives the reaction force of the gasket applied to the metal plate, and the metal plate is prevented from being bent. With this structure, the sealing property between the opening and the metal plate is enhanced. Details and further improvements of the technology disclosed in this specification will be described in the following “DETAILED DESCRIPTION”.

It is a top view of the power converter device (inverter) of an Example. It is a perspective view of a power unit. It is a partial exploded perspective view of a power unit. It is a schematic diagram which shows the positional relationship of a metal plate, a gasket, and a semiconductor module when it sees from a lamination direction. It is the figure which cut the laminated body of a semiconductor module pinched | interposed between a pair of cooler and them in the cross section corresponding to the VV line | wire of FIG. It is the figure which cut the laminated body of the semiconductor module pinched | interposed between a pair of cooler and them in the cross section corresponding to the VI-VI line of FIG. It is sectional drawing which shows the modification of a semiconductor module and a spacer.

  A power converter according to an embodiment will be described with reference to the drawings. The power converter of the embodiment is an inverter 100 that is mounted on an electric vehicle, converts DC power of a battery into AC power, and supplies the AC power to a traveling motor. Inverter 100 includes a booster circuit that boosts the DC power of the battery and an inverter circuit that converts DC to AC. Since the booster circuit and the inverter circuit are well known, description of the circuit configuration is omitted.

  FIG. 1 shows a plan view of the inverter 100. FIG. 1 is a plan view of the inverter 100 with the upper cover removed, and shows a component layout inside the housing 53.

  The inverter 100 houses a power unit 10, a reactor 55, two capacitors 56, and a control board (not shown) in a housing 53. The reactor 55 is a component of the booster circuit. The two capacitors 56 are connected in parallel to the input side and the output side of the booster circuit, respectively, and smooth the current. A control board (not shown) is disposed on the power unit 10.

  The power unit 10 is a unit in which a plurality of coolers 2a-2d and a plurality of semiconductor modules 3a-3d are alternately stacked one by one. Each of the semiconductor modules 3a to 3d accommodates a power transistor that is a semiconductor element. Although a detailed description of the structure is omitted, two power transistors are accommodated in one semiconductor module. The power unit 10 includes four semiconductor modules 3a to 3d, and a total of eight power transistors are included in the power unit 10. A plurality of power transistors are main components of power conversion, that is, main components of the above-described booster circuit and inverter circuit. A control board not shown in FIG. 1 controls on / off of each power transistor.

  Hereinafter, in order to simplify the description, when any one of the plurality of semiconductor modules 3a to 3d is shown without distinction, it is referred to as a semiconductor module 3. Similarly, when any one of the plurality of coolers 2a-2e is shown without distinction, it is denoted as cooler 2. Although the shapes of the coolers 2d and 2e located at the end in the stacking direction (X direction) are different from those of the other coolers 2a to 2c, the coolers 2a to 2e are collectively referred to as the cooler 2. Differences between the coolers 2d and 2e and the other coolers 2a to 2c will be described later.

  The coordinate system in the figure will be described. The X direction corresponds to the stacking direction of the plurality of coolers 2 and the plurality of semiconductor modules 3. The cooler 2 is long when viewed from the stacking direction (X direction), and the Y direction corresponds to the longitudinal direction of the cooler. For convenience of explanation, the Z direction is the vertical direction.

  The power unit 10 is disposed between the side wall 53b of the housing 53 and the support column 53a. One end of the power unit 10 in the stacking direction is in contact with the side wall 53b, and a leaf spring 54 is inserted between the other end and the column 53a. The leaf spring 54 applies pressure in the stacking direction (X direction in the figure) to the power unit 10. As will be described in detail later, the main body of the cooler 2 has an opening on the side surface facing the semiconductor module 3, and the opening is sealed by a metal plate. Sealing between the opening and the metal plate is ensured by the pressure of the leaf spring 54.

  Spacers 4 a and 4 b are arranged on both sides of the semiconductor module 3 in the Y direction. Although not shown, spacers 4 a and 4 b are arranged on both sides of all the semiconductor modules 3. The spacers 4a and 4b will be described in detail later.

  FIG. 2 is a perspective view of the power unit 10. The semiconductor module 3 includes three power terminals 59a, 59b, and 59c on the upper surface. Inside the semiconductor module 3, two power transistors are connected in series, and the three power terminals 59a, 59b, 59c are respectively a high potential side terminal, a middle point terminal, and a low potential of the power transistors connected in series. Corresponds to the side terminal. Although not shown in the drawing, a gate terminal connected to the gate of the power transistor is provided on the lower surface of the semiconductor module 3.

  The cooler 2d located at one end in the stacking direction (X direction) is provided with a supply pipe 51 that supplies a refrigerant to each cooler 2 and a discharge pipe 52 that discharges the refrigerant that has passed through each cooler 2. . A refrigerant circulator (not shown) is connected to the supply pipe 51 and the discharge pipe 52. The refrigerant used by the power unit 10 is a liquid, typically water or antifreeze. The structure of the cooler 2 and the refrigerant flow will be described later.

  The semiconductor module 3 is a card type, and a pair of coolers 2 are sandwiched between the semiconductor modules 3. In other words, the card-type semiconductor module 3 is sandwiched between a pair of adjacent coolers 2. Spacers 4 a and 4 b are attached to both sides of each semiconductor module 3 in the Y direction. The role of the spacers 4a and 4b will be described later. An insulating plate 19 is interposed between the semiconductor module 3 and the cooler 2. Although not shown, all the semiconductor modules 3 are provided with power terminals 59a-59c. Insulating plates 19 are interposed between all the semiconductor modules 3 and the coolers.

  FIG. 3 shows a partially exploded perspective view of the power unit 10. FIG. 3 is an exploded perspective view of a pair of adjacent coolers 2a and 2b in the power unit 10 and a semiconductor module 3b sandwiched between them. In addition, although illustration is abbreviate | omitted, the semiconductor module 3c and the cooler 2c are arrange | positioned behind the cooler 2b (negative direction of an X-axis). The structural relationship between the adjacent coolers 2b and 2c and the semiconductor module 3c sandwiched between them is the same as the structural relationship between the coolers 2a and 2b and the semiconductor module 3b. Although not shown, a semiconductor module 3a and a cooler 2d are disposed in front of the cooler 2a (in the positive direction of the X axis). The structural relationship between the adjacent coolers 2d and 2a and the semiconductor module 3a sandwiched between them is the same as the structural relationship between the coolers 2a and 2b and the semiconductor module 3b. The cooler 2d located at one end of the power unit 10 is different from the other coolers in the structure on the side not facing the semiconductor module 3a, but the structure on the side facing the semiconductor module 3a is the cooler 2a, 2b. The same. Similarly, the cooler 2e located at the other end of the power unit 10 is different from the other coolers in the structure not facing the semiconductor module 3d, but the structure facing the semiconductor module 3d is the cooler 2a, Same as 2b. Below, the structure by the side of the semiconductor module 3b of the coolers 2a and 2b is demonstrated. It should be noted that the structure on the semiconductor module 3a side of the cooler 2a and the structure on the semiconductor module 3c side of the cooler 2b are the same.

  The cooler 2b includes a main body 20 made by resin injection molding. The main body 20 is provided with a flow path 201 through which the refrigerant passes. An opening 211 is provided on a side surface 231 of the main body 20 facing the semiconductor module 3b. The opening 211 communicates with the internal flow path 201. A ring-shaped gasket 241 is disposed on the side surface 231 of the main body 20 so as to surround the opening 211. The opening 211 is closed with a metal plate 252 through a gasket 241. In other words, the metal plate 252 is attached to the opening 211 with the gasket 241 interposed therebetween. The metal plate 252 is fixed to the semiconductor module 3b with the insulating plate 19 interposed therebetween before being attached to the main body 20. In other words, one surface of the metal plate 252 closes the opening 211 with the gasket 241 interposed therebetween, and the other surface faces the semiconductor module 3b with the insulating plate 19 interposed therebetween.

  Before describing the structure of the cooler 2b opposite to the semiconductor module 3b, the structural relationship between the cooler 2a and the semiconductor module 3b will be described. The cooler 2a also includes a flow path 201 therein, and an opening 212 is provided on a side surface 232 facing the semiconductor module 3b. The opening 212 communicates with the flow path 201. The opening 212 is sealed with a metal plate 251 with the gasket 242 interposed therebetween. Note that, similarly to the metal plate 252, the metal plate 251 is fixed to the semiconductor module 3b with the insulating plate 19 interposed therebetween before being attached to the main body 20. In other words, one surface of the metal plate 251 closes the opening 212 with the gasket 242 interposed therebetween, and the other surface faces the semiconductor module 3b with the insulating plate 19 interposed therebetween.

  The structure of the cooler 2b opposite to the semiconductor module 3b is the same as the structure of the cooler 2a on the semiconductor module 3b side. The structure of the cooler 2a opposite to the semiconductor module 3b is the same as the structure of the cooler 2b on the semiconductor module 3b side. That is, the opening 212 of the cooler 2b is also sealed with another metal plate with a gasket interposed therebetween. The opening 211 of the cooler 2a is also sealed with another metal plate with a gasket interposed therebetween. The coolers 2a and 2b are provided with openings 211 and 212 on both sides in the stacking direction, and these openings are sealed with a metal plate with a gasket interposed therebetween.

  The metal plates 251 and 252 are not fixed to the main body 20 with screws or the like. As described with reference to FIG. 1, the leaf spring 54 pressurizes the power unit 10 in the stacking direction, and the sealing between the opening 211 (212) and the metal plate 252 (251) is applied by the pressure of the leaf spring 54. Stop is secured. This structure is the same for any cooler. However, openings are not provided on both end surfaces of the power unit 10 in the stacking direction (one side surface of the cooler 2e and one side surface of the cooler 2d).

  On both sides in the Y direction of the main body 20 of the cooler 2b, cylindrical portions 22 protruding in the stacking direction (X direction) are formed. The cylindrical part 22 is connected to the cylindrical part 22 of the adjacent cooler 2a with the ring-shaped gasket 25 interposed therebetween. That is, the adjacent coolers are connected by the cylindrical portion 22. A through hole 221 a (221 b) that penetrates the main body 20 in the stacking direction (X direction) is provided inside the cylindrical portion 22, and the through hole 221 a (221 b) is connected to the flow path 201 inside the main body 20. Communicate. A cooler 2c is arranged behind the cooler 2b, and the connection structure between the coolers 2b and 2c is the same as the connection structure between the coolers 2a and 2b. In the power unit 10, adjacent coolers 2 communicate with each other through two through holes 221a and 221b. In the power unit 10, the refrigerant supplied from the supply pipe 51 (see FIG. 1 and FIG. 2) is distributed to each cooler 2 through one through hole 221a, and flows through the flow path 201 in the Y direction. As described above, the main body 20 of the cooler 2b is long in the Y direction, and the refrigerant flows through the inside of the main body 20 in the long direction.

  The refrigerant absorbs the heat of the adjacent semiconductor module 3 through the metal plates 251 and 252 while passing through the flow path 201. The refrigerant that has absorbed the heat of the semiconductor module 3 is discharged from the discharge pipe 52 (see FIGS. 1 and 2) through the other through-hole 221b. As described above, a refrigerant circulator (not shown) is connected to the power unit 10, and the refrigerant discharged from the discharge pipe 52 is cooled by a radiator or the like and sent to the power unit 10 again.

  A large number of pin fins 26 are provided on the surface of the metal plate 251 (252) facing the main body 20. The metal plate 251 (252) faces the flow path 201 through the opening 212 (211) and directly touches the refrigerant. The heat of the semiconductor module 3b is efficiently absorbed by the refrigerant passing through the flow path 201 through the metal plate 251 (252) and the pin fins 26.

  The other semiconductor modules 3a, 3c, and 3d are also card type like the semiconductor module 3b, and are sandwiched between the pair of coolers 2 from both sides. The semiconductor modules 3a, 3c, and 3d are also effectively cooled by the coolers 2 on both sides. A groove 204 for reducing the weight is provided in the upper part of the main body 20 of the cooler 2.

  Spacers 4a and 4b are attached to both sides of the semiconductor module 3b in the Y direction. The spacers 4a and 4b fill a gap between the metal plates 251 and 252 arranged on both sides in the X direction of the semiconductor module 3b. The spacers 4a and 4b are also made of resin. In FIG. 3, spacers 4a and 4b are drawn at positions away from the semiconductor module 3b, and the spacers 4a and 4b attached to the semiconductor module 3b are drawn with phantom lines.

  The role of the spacers 4a and 4b will be described. FIG. 4 is a schematic diagram showing a positional relationship among the metal plate 251, the gasket 242, the semiconductor module 3b, and the spacers 4a and 4b when viewed from the stacking direction (X direction). In order to facilitate understanding of the figure, the semiconductor module 3b is shown with a right-up hatching, and the spacers 4a and 4b are shown with a right-down hatching. The metal plate 251 is dot-hatched. Furthermore, the alternate long and short dash line indicates the opening 212 of the main body 20 of the cooler 2 a, and the dotted line indicates the gasket 242.

  The gasket 242 is disposed on the side surface of the main body 20 around the opening 212 so as to surround the opening 212 when viewed from the stacking direction (X direction). In order to efficiently cool the semiconductor module 3b, the opening 212 is provided large. The cross-hatched region indicates that a part of the semiconductor module 3b and a part of the spacer 4a (4b) are overlapped when viewed from the stacking direction. A part of the semiconductor module 3b and a part of the spacer 4a (4b) overlap each other because, as shown in FIG. 3, the side surface in the Y direction of the semiconductor module 3b protrudes in a wedge shape. This is because (4b) has a V-shaped groove so as to be fitted to the wedge-shaped protrusion. As shown in FIG. 4, when viewed from the stacking direction (X direction), the ring-shaped gasket 242 surrounding the opening 212 overlaps the semiconductor module 3b except for a part thereof. A portion of the semiconductor module 3b that does not overlap the semiconductor module 3b overlaps the spacer 4a (4b). Note that all of the ring-shaped gasket 242 also overlaps with the metal plate 251.

  FIG. 5 is a view in which a stacked body of a pair of adjacent coolers 2a and 2b and a semiconductor module 3b sandwiched between them is cut along a cross section corresponding to the line V-V in FIG. However, the lower half of the laminate is not shown in FIG. The illustration of the insulating plate 19 (see FIG. 3) sandwiched between the semiconductor module 3b and the metal plate 251 (252) is also omitted. In the cross section of FIG. 5, the gasket 241 (242) and the semiconductor module 3b overlap each other when viewed from the stacking direction (X direction). As described above, the power unit 10 is pressurized in the stacking direction (X direction) by the leaf spring 54 (see FIG. 1), and the opening 212 (211) and the metal plate 251 (252) are applied by the applied pressure. Sealing is ensured. The metal plate 251 (252) receives a reaction force (reaction force against the pressure force of the leaf spring 54) from the gasket 242 (241). On the other hand, the metal plate 251 (252) supports the opposite side of the gasket 242 (241) by the semiconductor module 3b. Therefore, even if the metal plate 251 (252) receives a reaction force from the gasket 242 (241), it does not bend.

  The power terminal 59b is connected to the power transistor 58 inside the semiconductor module 3b. A part of the power terminal 59 b is exposed from the semiconductor module 3 b at a position facing the metal plate 251. Therefore, an insulating plate 19 (see FIG. 3) is disposed between the metal plate 251 and the semiconductor module 3b in order to insulate the power terminal 59b and the like from the metal plate 251. As described above, it should be noted that the illustration of the insulating plate 19 sandwiched between the semiconductor module 3b and the metal plate 251 (252) is omitted in FIG.

  Since the metal plate 252 is also opposed to the other power terminals 59a or 59c, the insulating plate 19 (not shown in FIG. 5) is also disposed between the metal plate 252 and the semiconductor module 3b. Furthermore, the semiconductor module 3b is a device in which the power transistor 58 is sealed with resin, and its body is made of resin. The same applies to the other semiconductor modules 3a, 3c, 3d. In FIG. 5, the code | symbol 26 has shown the pin fin provided in the metal plate 251 (252). Reference numeral 204 denotes a groove for reducing the weight of the main body 20 as described above. Reference numeral 205 denotes a groove for accommodating the gasket 241 (242).

  FIG. 6 is a diagram in which a stacked body of a pair of adjacent coolers 2a and 2b and a semiconductor module 3b sandwiched between them is cut along a cross-section corresponding to the VI-VI line in FIG. In the cross section of FIG. 6, the gasket 242 (241) and the semiconductor module 3 b do not overlap when viewed from the stacking direction (X direction). Instead, a spacer 4a is attached to the end of the semiconductor module 3b in the Y direction, and the spacer 4a overlaps the gasket 242 (241) when viewed from the stacking direction (X direction). The spacer 4a is a gap between the pair of metal plates 251 and 252 located on both sides in the stacking direction (X direction) of the semiconductor module 3b and overlaps with the gaskets 242 and 241 when viewed from the stacking direction (X direction). In addition, it is arranged so as to fill the gap. As described above, the metal plate 251 (252) is pressed against the gasket 242 (241) by the plate spring 54 (see FIG. 1), and the metal plate 251 (252) is caused to react with the reaction force from the gasket 242 (241). Receive. As well shown in the cross section of FIG. 6, the metal plate 251 (252) is supported by the spacer 4a on the opposite side of the gasket 242 (241), and even if it receives a reaction force from the gasket 242 (241). There is no bending.

  Although not shown, the spacer 4b is attached to the end of the semiconductor module 3b opposite to the spacer 4a, and has the same structure as FIG. The metal plate 251 (252) is pressed against the gasket 242 (241) by the leaf spring 54 (see FIG. 1). The metal plate 251 (252) receives a reaction force from the gasket 242 (241). As understood from FIGS. 5 and 6, the metal plate 251 (252) is supported on the opposite side of the gasket 242 (241) by the semiconductor module 3b or the spacers 4a and 4b, so that the gasket 242 (241) Even if it receives reaction force, it does not bend. Therefore, the sealing performance between the opening 212 (211) and the metal plate 251 (252) is improved.

  The spacers 4a and 4b are made of a resin different from the resin of the housing of the semiconductor module 3b. The spacers 4a and 4b are bonded to the semiconductor module 3b with an adhesive. The spacers 4a and 4b may be formed by attaching the metal plates 251 and 252 to both sides of the semiconductor module 3b and then pouring a thermosetting resin into the gap between the metal plates 251 and 252.

  Spacers 4a, 4b are also attached to both ends of the semiconductor modules 3a, 3c, 3d in the Y direction, filling a gap between a pair of metal plates arranged on both sides of each semiconductor module 3, and the reaction force of the gasket Support.

  A groove 205 is provided around the openings 212 and 211 of the main body 20, and gaskets 241 and 242 are disposed in the groove 205. The groove 205 is not shown in FIGS. Moreover, the groove | channel 207 is provided in the end surface of the cylinder part 22 of the coolers 2a and 2b so that the through-hole 221a (221b) may be enclosed, and the gasket 25 is arrange | positioned in the groove | channel 207. 1-4, illustration of the groove | channel 207 was abbreviate | omitted.

  FIG. 7 shows a cross-sectional view of a modified example of the semiconductor module and the spacer. FIG. 7 is a cross-sectional view corresponding to FIG. Components other than the semiconductor module 103b and the spacer 104 in FIG. 7 are the same as those shown in FIG. The semiconductor module 103 b includes a protruding portion 105 on the end surface in the Y direction, while the spacer 104 includes a recess 106 that faces the protruding portion 105. When the spacer 104 is attached to the semiconductor module 103b, the protrusion 105 and the recess 106 are fitted, and the spacer 104 is more firmly joined to the semiconductor module 103b.

  The power converter of the example was the inverter 100 that converts the DC power of the battery into AC power. The technology disclosed in this specification is also preferably applied to a power conversion device other than an inverter.

  Specific examples of the present invention have been described in detail above, but these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and changes of the specific examples illustrated above. The technical elements described in this specification or the drawings exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. In addition, the technology exemplified in this specification or the drawings can achieve a plurality of objects at the same time, and has technical usefulness by achieving one of the objects.

2, 2a-2d: coolers 3, 3a-3d, 103b: semiconductor modules 4a, 4b, 104: spacer 10: power unit 19: insulating plate 20: main body 22: cylinder part 25: gasket 26: pin fin 51: supply pipe 52 : Discharge pipe 53: Housing 54: Leaf spring 55: Reactor 56: Capacitor 58: Power transistors 59 a, 59 b, 59 c: Power terminal 100: Inverter 201: Channel 211, 212: Openings 241, 242: Gaskets 251, 252: Metal Board

Claims (1)

A stacked power unit in which a plurality of card-type semiconductor modules containing semiconductor elements and a plurality of coolers are alternately stacked;
An elastic member that pressurizes the power unit in the stacking direction of the semiconductor module and the cooler;
With
Each of the pair of coolers adjacent to each other across one semiconductor module
A flow path through which a coolant flows is provided inside, and a main body provided with an opening communicating with the flow path on a side surface facing the one semiconductor module;
A gasket disposed on the side surface so as to surround the opening when viewed from the stacking direction;
A metal plate whose one surface closes the opening across the gasket and whose other surface faces the one semiconductor module;
With
The sealing between the opening and the metal plate is ensured by the pressure of the elastic member,
When viewed from the stacking direction, the gasket is overlapped with the one semiconductor module except for a part,
A spacer for filling the gap is inserted into a gap between a pair of the metal plates located on both sides of the one semiconductor module in the stacking direction and overlapping the part of the gasket when viewed from the stacking direction. Being
The power converter characterized by the above-mentioned.

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