JP2017010972A - Plasma processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plasma processing device capable of reducing a processing variation and an increase in pattern defects caused due to an AlF deposit on a surface of a processing chamber and a peeled AlF deposit, the AlF deposit being formed by performing etching including an Al material.SOLUTION: A plasma processing device including a processing chamber 120 and a sample stage 111 and performing plasma etching of an Al-containing film layer that is formed on a wafer includes: first inner wall members (101, 102) made of quartz, which are in contact with plasma; and a second inner wall member 103 disposed at a position that is not in contact with plasma and containing Al or Y.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a plasma processing apparatus.

  With the recent high integration and high speed of semiconductor integrated circuits, further miniaturization of gate electrodes is required. According to the international semiconductor roadmap 2013, the gate dimension of high-speed logic devices will reach the 10 nm level in the next few years, and the processing dimension accuracy of the Å level (3σ = 1 nm or less) is required. Slight variations in gate electrode dimensions cause large fluctuations in source / drain current and standby leakage current values, so stabilization of the processing shape such as gate electrode dimension (CD: Critical Dimension) accuracy is important for improving yield. It is a necessary requirement.

One factor that affects the processing shape (CD accuracy, shape anisotropy, material selection ratio, etc.) is the deposition of etching reaction products on the surface of the processing chamber. It has been elucidated by gas phase measurement in plasma that even if plasma is generated under the same conditions depending on the presence or absence of deposits, radical consumption and radical recombination probability on the surface of the processing chamber change significantly. For example, Non-Patent Document 1 discloses that the amount of Cl radicals in the Cl ₂ plasma varies several times depending on the presence or absence of SiCl _x deposits on the surface of the processing chamber. If the radical density in the plasma changes, the machining shape also changes. Further, there are various kinds of reaction products at the time of processing depending on materials and gas types used for transistors. In recent years, in order to improve transistor characteristics, a transition from a conventional Poly-Si / SiO ₂ structure to a High-K / MetalGate structure and a transition from a planar transistor to a three-dimensional transistor structure are progressing. For this reason, the types of materials used for transistors (for example, metallization of gates, use of high-K gate insulating film materials, III-V channel, etc.) are diversified, and hardly volatilize deposited on the processing chamber surface. The types of functional materials are also diversifying.

  Another important factor for improving the yield is suppression of pattern defects. One cause of pattern defects in the etching processing apparatus is the deposition of reaction products on the surface of the processing chamber. Deposits on the surface of the processing chamber that grows as the mass production process continues are peeled off at some point and dropped onto the wafer. The fallen deposit acts as a mask that hinders etching of the lower layer of the wafer, so that a pattern defect is generated and the yield of the product is reduced. Such a substance that inhibits etching is called foreign matter. As the gate dimension is reduced, the allowable particle size and the number of foreign particles are decreasing year by year, and the mass production process is becoming more severe.

  In summary, in order to improve the yield of mass production, an etching apparatus that achieves both stabilization of the processing shape and reduction of foreign matters is required. These problems are closely related to deposits on the surface of the processing chamber as described above. Until now, in the etching process of an aluminum material used for wiring, there has been a problem that AlF as a reaction product is deposited on the surface of the processing chamber, resulting in a variation in processing shape and generation of foreign matter. If the CD fluctuation value and the number of occurrences of foreign matter exceed a certain threshold, mass production processing must be stopped and maintenance must be performed. This causes a decrease in MTBC (Mean Time Between Clean).

In order to avoid this problem, conventionally, studies on the removal of aluminum fluoride from the surface of the processing chamber and studies on the reduction of foreign matter and metal contamination have been carried out in both processes and hardware. Patent Document 1 relating to dry cleaning (process) shows a method for reducing foreign matters by attaching a fluorocarbon film after cleaning the aluminum component using a mixed gas of BCl ₃ and Cl ₂ . . Patent Document 2 relating to hardware discloses a technique for reducing metal contamination by suppressing the scattering of metal elements by using a silica-based film or an aluminum alloy for components constituting the processing chamber. In addition, a technique for applying an yttrium-based material having plasma resistance to a surface material of a plasma processing apparatus has been disclosed.

JP 2001-176843 A JP 2002-359233 A

S. J. Ullal, T. W. Kim, V. Vahedi, and E. S. Aydil, J. Vac. Sci. Technol., A 21, 589 (2003).

In the apparatus disclosed in Patent Document 1, aluminum fluoride can be removed, but the ceramic material forming the processing chamber is scraped by high-density BCl ₃ / Cl ₂ cleaning. The particle size and the number of foreign particles generated due to the cutting of the ceramic material have become unacceptable in recent front-end processes. As a countermeasure for this, an operation method is conceivable in which an amount of carbon coating that cannot be easily removed by electric discharge during the process is applied so that the surface of the ceramic material is not exposed. However, since carbon-based coatings tend to be easily removed by oxygen, chlorine, and fluorine-based discharges, an attempt to attach a carbon-based coating amount that can withstand such a process results in a significant increase in processing time. Increases tact time.

  As shown in Patent Document 2, the use of a silica-based material or an aluminum alloy for the parts constituting the processing chamber has the potential to reduce foreign substances caused by AlF. However, the surface material of the processing chamber must be carefully selected in consideration of physicochemical reactions with radicals and ions generated in the plasma and reaction products of the wafer. In this selection, the consumption amount (scrap amount) in the etching process of the processing chamber surface material has become one criterion for determining whether or not the processing chamber surface material is appropriate. One index for determining the amount of scraping of the processing chamber surface material is the plasma density. For example, in the high density part of the plasma, the gas temperature is high and the radical density and ion density are also high, so that the processing chamber surface material tends to be scraped in a larger amount than the low density part. When the surface material of the processing chamber is scraped, a hardly volatile reaction product mainly composed of a part of the surface material is generated, which causes an increase in the amount of accumulation in the processing chamber and the number of foreign substances. A surface material that does not generate such foreign matter must be carefully selected from the viewpoint of process conditions, reaction composition adhesion composition, and etching characteristics. On the other hand, in the region where the plasma density is low, the supply amount of radicals and ions for removing reaction products adhering to the processing chamber surface after wafer etching tends to decrease. For this reason, the peeling film which has a reaction product as a main component on a surface material is formed with the delicate balance of adhesion of a reaction product and the amount of chipping of a processing chamber surface material. If this peeling film continues to grow, it eventually becomes a foreign material that is reflected by the metal turbine blades of the turbo molecular pump that detaches into the chamber and evacuates and then flies to the wafer. Therefore, the formation of a release film on the surface of the processing chamber must be suppressed.

  The present invention has been made paying attention to these problems, and processing fluctuations and patterns caused by AlF deposits on the surface of the processing chamber formed by etching containing Al material and the exfoliation thereof. An object of the present invention is to provide a plasma processing apparatus capable of reducing an increase in defects and capable of performing plasma processing for a long time.

As one embodiment for solving the above-mentioned problem, a processing chamber disposed inside a vacuum vessel and depressurized inside is provided, and a sample stage is disposed in the lower portion of the processing chamber and on which a wafer to be processed is placed, A plasma processing apparatus for etching a film structure having a film layer containing aluminum previously formed on the wafer upper surface with plasma,
A first inner wall member comprising quartz and constituting an inner wall surface of the processing chamber and contacting the plasma;
A second inner wall member disposed below the first inner wall member at a position not in contact with the plasma and configured to contain aluminum or yttrium;
A plasma processing apparatus characterized by comprising:

  According to the present invention, it is possible to reduce processing fluctuations and increase in pattern defects caused by AlF deposits on the surface of a processing chamber formed by performing etching including an Al material and the exfoliation thereof, and increase plasma defects over a long period of time. A plasma processing apparatus capable of processing can be provided.

1 is a schematic overall sectional view of a plasma processing apparatus (microwave ECR etching apparatus) according to a first embodiment of the present invention. It is a typical mass production etching flow (no dummy wafer during metal cleaning) when the etching apparatus according to the first embodiment of the present invention is used. It is an example of the mass production etching flow (with dummy wafer at the time of metal cleaning) at the time of using the etching apparatus which concerns on 1st Example of this invention. It is a graph which shows CD transition (the material of an electrode cover is a parameter) of the product wafer which makes target CD = 18nm at the time of using the etching apparatus which concerns on 1st Example of this invention. It is a graph which shows transition (the material of an electrode cover is a parameter) of the number of foreign materials in product wafer processing. 6 is a graph showing a relationship between an etching rate of an aluminum compound and a plasma density in a metal cleaning process using BCl ₃ / Cl ₂ plasma when the plasma processing apparatus shown in FIG. 1 is used according to the second embodiment of the present invention. In the second embodiment of the present invention, when the plasma processing apparatus shown in FIG. 1 is used, the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less (position below the electrode such as an electrode cover). It is a figure which shows the scraping amount of the various surface materials per one integrated process of the silicon | silicone coating process, the etching process of a product wafer, a metal cleaning process, and a silicon cleaning process. FIG. 2 shows a surface state of a quartz sample arranged at an electrode cover position after continuous processing of 200 sheets in the flow shown in FIG. 2A when the plasma processing apparatus shown in FIG. 1 is used according to the second embodiment of the present invention. It is a figure, the left side shows an optical photograph, and the right side shows a laser microscope image. FIG. 2 is a diagram showing a surface state of an alumina sample after 200 sheets are continuously processed in the flow shown in FIG. 2A when the plasma processing apparatus shown in FIG. 1 is used according to the second embodiment of the present invention, and the left side is an optical photograph. The right side shows a laser microscope image. It is a schematic whole sectional drawing of the plasma processing apparatus (microwave ECR etching apparatus carrying a plasma shielding board) which concerns on the 3rd Example of this invention.

  Hereinafter, the present invention will be described with reference to examples.

  A plasma processing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic overall sectional view of a plasma processing apparatus (microwave ECR etching apparatus). This etching apparatus includes an electrode (sample stage) 111 on which a wafer 110 is placed in a processing container, a gas supply device 132, a top plate 140, a shower plate 101, an inner cylinder 102, an electrode cover 103, and an electromagnet 142. A high frequency power source 150 for generating plasma, an RF bias power source 161, a matching unit 162, and a vacuum exhaust valve 171 for the processing chamber 120. Based on the apparatus configuration shown in this figure, an application configuration of the processing chamber surface material in the etching apparatus according to the present embodiment will be described.

  FIG. 2A shows a typical mass production etching flow when the etching apparatus according to the present embodiment is used. The flow shown in FIG. 2A includes a silicon coating step S201, an Al-containing laminated wafer etching step S202, a metal cleaning step S203, and a silicon cleaning step S204.

In the silicon coating step S201, for example, the Si—O-based film is coated on the shower plate 101, the inner cylinder 102, and the electrode 111, which are processing chamber surface materials, using SiCl ₄ / O ₂ plasma. In the Al-containing laminated wafer etching step S202, the Al-containing laminated wafer placed on the electrode is processed using Cl-based and F-based plasma. In the metal cleaning step S203, the Al-containing laminated wafer is taken out from the electrode and the processing chamber after the etching step S202, and then AlF deposited on the surface of the processing chamber is removed using Cl-based plasma. In the silicon cleaning step S204, the Si—O-based film coated in the silicon coating step S201 is removed from the processing chamber surface. Each process and flow will be described in detail below.

First, the silicon coating step S201 is introduced mainly for the purpose of coating the electrode 111 with a Si—O-based film. By this coating, it is possible to prevent the reaction between the Cl radicals in the plasma and the electrode 111 on which the wafer is not placed in the metal cleaning step S203 for removing metal deposits such as AlF deposited in the processing chamber after the etching step S202. Since the etching rate of the Si—O based film by the Cl based plasma is very slow, even a slight Si—O based film coverage has an effect of protecting the electrode against the plasma during the metal cleaning process. In this example, the electrode 111 was covered with a Si—O-based film using SiCl ₄ / O ₂ plasma.

Next, after the stacked Al-containing product wafer is placed on the electrode 111, it is processed using Cl-based or F-based plasma. This is defined as an etching step S202. After the etching, AlF reaction products are deposited on the shower plate 101, the inner cylinder 102, and the electrode cover 103 on the surface of the processing chamber shown in FIG. When the mass production process is continued without cleaning the AlF reaction product, the AlF deposition film on the surface of the process chamber continues to grow as the number of processed sheets increases. This eventually causes process variations and foreign matter. Therefore, after removing the product wafer after etching, the metal cleaning step S203 is performed. As the plasma conditions in this step, Cl-based plasma effective for removing Al-based compounds by changing them to volatile substances (AlCl _x ) is used. In particular, in order to efficiently remove AlF on the surface of the processing chamber without the assistance of ion energy, it is effective to add a gas having a reducing action (for example, boron, carbon, or hydrogen). This makes it possible to remove aluminum fluoride and aluminum oxide mainly by a chemical action. In this example, BCl ₃ / Cl ₂ plasma was used in the metal cleaning step S203.

Next, the silicon cleaning step S204 is used to remove the electrode 111 and the Si—O-based film on the surface of the processing chamber deposited after the silicon coating step S201. As the plasma conditions, F-based plasma that is effective for changing the Si-based compound into a volatile substance (SiF ₄ ) and removing it is used. In this example, NF ₃ plasma was used in the silicon cleaning step S204.

  In order to examine the effect on the number of foreign substances and process variations, continuous processing was performed for about 500 hours using the flow of FIG. 2A. In this continuous processing, quartz was applied to the shower plate 101 and the inner cylinder 102 on the surface of the processing chamber in the region above the electrode 111. A quartz electrode cover or an alumina electrode cover was applied to the electrode cover 103 in the region below the electrode 111. The electrode cover 103 is configured to cover the side wall of the sample stage and the surface of a beam-like member that is connected to the side wall and supports the sample stage. Then, the effect on the number of foreign matters and process variation was examined in the continuous processing of the apparatus configuration to which the quartz electrode cover or the alumina electrode cover was applied. The results are shown below.

  FIG. 3 shows the CD transition of the product wafer with the target CD (Critical Dimension) = 18 nm. As the processing time is increased, the CD continues to decrease after about 80 hours with the quartz electrode cover, while the alumina electrode cover can stably process within 18 ± 1 nm within 500 hours.

  FIG. 4 shows the transition of the number of foreign matters in product wafer processing. The total number of foreign particle systems of 0.04 μm or more is shown. In the electrode cover made of alumina, the number of foreign matters was stabilized to 10 or less throughout, while in the case of the quartz electrode cover, a sudden increase in the number of foreign matters was observed after about 150 hours. For this reason, continuous processing using the quartz electrode cover was interrupted in about 210 hours. Moreover, as a result of analyzing the foreign material which generate | occur | produced in about 210 hours by review SEM, Al and F were detected and the foreign material was estimated to be AlF.

  Further, as a result of removing the quartz electrode cover after the continuous treatment for about 210 hours by maintenance, a film just before peeling was observed. In addition, as a result of XPS analysis of the film surface, AlF was detected. Therefore, it is considered that foreign matter is generated when the AlF deposit peels from the electrode cover. On the other hand, no AlF film on the verge of peeling was observed on the alumina electrode cover. From these, it is confirmed that it is important to apply the electrode cover made of alumina to the electrode cover 103 in the region below the electrode 111 in order to realize low foreign matter and high-precision CD stabilization, that is, extension of MTBC. did.

  In this embodiment, wafer-less metal cleaning was performed in order to reduce NPW (non-product wafer). For this reason, a silicon coating process S201 and a silicon cleaning process S204 for realizing wafer screening are introduced. However, of course, the metal cleaning step S203 can be performed using a dummy wafer. FIG. 2B is an example of a mass production etching flow in the case of using metal cleaning with a wafer. For example, after processing one sheet or one lot in the etching step S202, a dummy wafer may be placed on the electrode 111 and the metal cleaning step S203 may be performed.

In addition to BCl ₃ / Cl ₂ , SiCl ₄ / Cl ₂ , CHF ₃ / Cl ₂ , CF ₄ / Cl can be used as a gas for the metal cleaning process for removing Al compounds and other metals (Ti, Hf, Ta compounds, etc.). ₂ , HBr / Cl ₂ , CH ₄ / Cl _2, HCl / Cl ₂ , HCl, BCl ₃ and CH _x Cl _y may be used.

  In the plasma processing apparatus shown in FIG. 1, the shower plate and the inner cylinder above the electrode 111 are made of stone, and the electrode cover 103 in the area below the electrode 111 is made of alumina, so that the target CD value is In addition, an increase in the number of foreign matters was suppressed.

  As described above, according to the present embodiment, it is possible to reduce processing fluctuations and increase in pattern defects caused by the AlF deposit on the surface of the processing chamber formed by performing the etching including the Al material and the exfoliation thereof, and for a long time. It is possible to provide a plasma processing apparatus capable of performing plasma processing over a long period of time.

A plasma processing apparatus according to a second embodiment of the present invention, particularly, a processing surface material in the processing chamber will be described. Note that the matters described in the first embodiment and not described in the present embodiment can be applied to the present embodiment as long as there is no particular circumstance. In the first embodiment, quartz is applied to the shower plate 101 and the inner cylinder 102 on the processing chamber surface in the region above the electrode 111, and an alumina electrode cover is attached to the electrode cover 103 in the region below the electrode 111. It turns out that it is important to apply. In this embodiment, the generalization of the mechanism and further countermeasures for AlF foreign matter generated when a quartz electrode cover is applied to the electrode cover 103 will be described. First, regarding the mechanism of AlF foreign matter generation, the inventors have found that there is a relationship between the density of BCl ₃ / Cl ₂ plasma in the metal cleaning step S203 and whether or not AlF can be removed. This will be described below.

FIG. 5 shows the experimental results of investigating the relationship between the etching rate of the aluminum compound and the plasma density in the metal cleaning process using BCl ₃ / Cl ₂ plasma when the plasma processing apparatus shown in FIG. 1 is used. The plasma density was measured with a Langmuir probe. In the region where the plasma density is 10 ¹⁵ m ⁻³ or more, the cleaning rate of AlF ₃ and Al ₂ O ₃ increases, and it was shown that these can be removed. On the other hand, it was found that these could not be removed in the region where the plasma density was 10 ¹⁵ m ⁻³ or less. It is estimated that the phenomenon having this threshold is influenced not only by the decrease in the Cl radical density in the BCl ₃ / Cl ₂ plasma, but also by the change in the dissociated species of the reducing radical due to the difference in the collision process accompanying the decrease in the electron density. The Further, in the plasma processing apparatus shown in FIG. 1, it is confirmed that the plasma density is approximately 10 ¹⁵ m ⁻³ or more above the electrode 111 and the plasma density is approximately 10 ¹⁵ m ⁻³ or less below the electrode 111. It was done. Since the presence / absence of removal of Al-based deposits varies with the threshold of plasma density of 10 ¹⁵ m ⁻³ , the following guidelines have been obtained regarding the application of Al-based materials as processing chamber surface materials.

When an aluminum-based material (Al ₂ O ₃ or AlF ₃ ) is used as a processing chamber surface material in a region where the plasma density is 10 ¹⁵ m ⁻³ or more, (1) the surface material is significantly consumed, and (2) the surface material. It is not appropriate to use an Al-based material due to the large amount of Al reaction products released into the chamber. Therefore, the shower plate 101 and the inner cylinder 102 on the surface of the processing chamber where the plasma density is 10 ¹⁵ m ⁻³ or more are made of quartz that is highly volatile to halogen radicals (F, Cl, Br, etc.). The choice is appropriate. On the other hand, in the region where the plasma density is 10 ¹⁵ m ⁻³ or less, the AlF deposit is not removed, so that the amount of AlF deposited on the surface of the processing chamber increases as the mass production time of the product wafer increases. There is a concern that this may cause foreign matter. Actually, the adhesion surface state of AlF deposition varies greatly depending on the surface material of the processing chamber, and depending on the surface material, it is greatly influenced by the presence or absence of foreign matter. The inventors investigated in detail the adhesion surface state of this AlF deposition. The results are described below.

FIG. 6 shows the silicon coating step S201, the product wafer etching step S202, the metal cleaning step S203, and the silicon cleaning step S204 in the region (position of the electrode cover 103) where the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less. The amount of scraping of various surface materials per consistent treatment was shown. As a result, it was found that alumina (Al ₂ O ₃ ) and AlF ₃ were not shaved at all, and were slightly shaved with quartz and Si was shaved very well. Further, alumina (Al ₂ O ₃ ), a quartz sample, and a Si sample were attached on the electrode cover 103, and 200 sheets were continuously processed in the product etching flow of FIG. 2A.

  Then, various samples were taken out and the surface state was observed with the photograph and the laser microscope. FIG. 7 shows the surface state of the quartz sample after the continuous processing of 200 sheets. From the photograph (left figure) and laser microscope image (right figure), a release film was observed. The composition of this film was confirmed to be AlF by XPS (X-ray Photoelectron Spectroscopy) observation. This AlF release film is easily detached from the quartz sample with a slight air flow. In this way, the release film is easily detached even in the chamber, and the separated matter is reflected by the metal turbine blades of the turbo molecular pump that is evacuated to become foreign matters flying to the wafer. Therefore, in order to reduce foreign matter during mass production processing, the formation of a release film on the surface of the processing chamber must be suppressed as much as possible.

On the other hand, FIG. 8 shows the surface state of the alumina sample after the continuous processing of 200 sheets. In the photograph (left figure) and the laser microscope image (right figure), no AlF release film is observed. However, the XPS observation of the sample confirmed that AlF was deposited. However, the AlF deposit is firmly attached, and does not easily peel as compared with the peeled film confirmed in the quartz sample, and does not cause foreign matter. Moreover, AlF was not observed from the surface of the Si sample. When these were put together, it turned out that generation | occurrence | production of the peeling film of AlF has relation with the etching amount of each sample material. A release film is generated with a material having an etching amount greater than about 0, and no AlF release film is observed when the etching amount is very large or substantially zero. That is, when the etching amount is very large, the AlF deposit is considered to be lifted off. When the etching amount is a value slightly larger than approximately 0, there is a mechanism in which an AlF release film is generated. In addition, it is not realistic to apply a material having a very large etching amount (a large amount of consumption) to the processing chamber surface material from the viewpoint of the member replacement cycle. For this reason, it is realistic to apply a material having an etching amount of approximately 0 as a processing chamber surface material in a region where the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less. In the present product process, it has been described that AlF is deposited in a region where the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less. Ideally, the reaction mechanism of radicals and deposition radicals is the same as the surface of the processing chamber covered by the AlF deposits and the AlF deposits. This is because if the reaction mechanism is different, radical changes and CD fluctuations occur according to the coverage of the deposit. Such variation is referred to as a covering model. In this case, since the AlF deposit cannot be removed in the region where the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less (the etching amount is substantially 0), the product process 1 turn processing (silicon coating by the flow of FIG. 2A) Processing of a region having an etching amount of substantially 0 in the region of BCl ₃ / Cl ₂ plasma density of 10 ¹⁵ m ⁻³ or less in step S201 to silicon cleaning step S204 or defined as an etching step and a metal cleaning step in the flow of FIG. 2B It is desirable to apply as a chamber surface material.

Based on the above, in the region where the BCl ₃ / Cl ₂ plasma density is less than 10 ¹⁵ m ⁻³ where the aluminum compound is difficult to remove (position of the electrode cover 103), the etching amount of the product process is substantially zero from the result of FIG. It is preferable to apply aluminum fluoride or alumina (aluminum oxide) material. In addition, in a region where the BCl ₃ / Cl ₂ plasma density is 10 ¹⁵ m ⁻³ or less, yttrium compounds (Y ₂ O ₃ , YF ₃ , YCl ₃ and a mixture thereof), which can also be used as a processing chamber surface material in a region where the plasma density is 10 ¹⁵ m ⁻³ or less (position of the electrode cover 103). Further, in this example, the case of Al deposit as the hardly volatile material is shown. However, the generation of the release film also occurs in deposits other than the Al material, and the mechanism can be generalized as follows. For example, assuming that there is an etching process of a product wafer in which a hardly volatile reaction product is deposited on the surface of the processing chamber, a cleaning for removing the hardly volatile deposit is constructed. Quartz material is applied to the processing chamber surface material in the region where the cleaning rate of the constructed hardly volatile deposit is approximately 0 or more. Subsequently, in the region where the cleaning rate of the hardly volatile depot is approximately 0, there is a possibility that the film becomes a release film due to competition between the deposition of the hardly volatile depot and the etching of the processing chamber surface material in the product process. Therefore, a surface material whose etching amount in the product process is substantially zero is applied to the processing chamber surface material. Moreover, as a hardly volatile material, AlO, a lanthanoid compound, a III-V group compound, etc. other than AlF are assumed. In addition, the surface material having a hardly volatile depot cleaning rate of about 0 is a material contained in the hardly volatile depot (for example, Y compound for YF depot, Al compound for AlF depot, Ga compound for Ga depot, P compound) If the depot is a P compound), it can be expected to suppress process fluctuations due to the coating model, which is effective for mass production processing for a long time.

  In the plasma processing apparatus shown in FIG. 1, a quartz material is used for the processing chamber surface material in the region where the cleaning rate of the hardly volatile depot is approximately 0 or more, and in the region where the cleaning rate of the hardly volatile depot is approximately 0, When a surface material having an etching amount of about 0 in the product process was used, a target CD value was obtained and an increase in the number of foreign matters could be suppressed.

  As described above, according to the present embodiment, it is possible to reduce processing fluctuations and increase in pattern defects caused by the AlF deposit on the surface of the processing chamber formed by performing the etching including the Al material and the exfoliation thereof, and for a long time. It is possible to provide a plasma processing apparatus capable of performing plasma processing over a long period of time.

A plasma processing apparatus according to the third embodiment of the present invention will be described. Note that the matters described in the first embodiment or the second embodiment but not described in the present embodiment can be applied to the present embodiment as long as there are no special circumstances. In Example 2, the processing chamber surface material of the shower plate 101 and the inner cylinder 102 is made of quartz, with the plasma density of BCl ₃ / Cl ₂ plasma in the metal cleaning process for removing the aluminum compound being 10 ¹⁵ m ⁻³ as a boundary. It has been described that the treatment chamber surface material of the cover 103 is preferably made of alumina (aluminum oxide) or aluminum fluoride. In this embodiment, an example will be described in which the boundary for properly using the processing chamber surface material is clarified.

FIG. 9 shows a microwave ECR etching apparatus in which a plasma shielding plate 901 is mounted on the apparatus of the first embodiment. The plasma shielding plate 901 is grounded with a through hole through which radicals, gases and reaction products can be exhausted, and the plasma density can be made substantially zero below the electrode cover 103. In this example, a donut plate-shaped plasma shielding plate having a plurality of openings was disposed so as to surround the upper periphery of the sample stage. By applying the plasma shielding plate 901, the plasma is confined in a region above the shielding plate, so that a region of BCl ₃ / Cl ₂ plasma density of 10 ¹⁵ m ⁻³ or less where the aluminum compound can be removed is located below the plasma shielding plate 901. Can be more clearly defined. Therefore, the shower plate 101 and the inner cylinder 102 on the surface of the processing chamber, which is an area above the plasma shielding plate, are made of quartz, and the electrode cover 103, which is an area below the plasma shielding plate, is made of alumina (aluminum oxide) or fluoride. Apply aluminum material. Further, in the region slightly above the plasma shielding plate, the plasma density is low, and the cleaning rate of the AlF deposit tends to be lower than that of the ECR surface. Therefore, a method of bringing the ECR surface having a high plasma density closer to the plasma shielding plate by increasing the coil current of the electromagnet 142 and controlling the resonance magnetic field is effective. Therefore, the coil current of the BCl ₃ / Cl ₂ plasma is adjusted so that the plasma density in the region above the plasma shielding plate is 10 ¹⁵ m ⁻³ or more.

In this embodiment, in order to clarify the boundary for selectively using the processing chamber surface material, the plasma shielding plate 901 capable of controlling the plasma density is important by using BCl ₃ / Cl ₂ as an example of the gas used in the metal cleaning process. I explained that. However, the gas used in the metal cleaning process is SiCl ₄ / Cl ₂ or CHF ₃ / Cl ₂ or CF ₄ / Cl ₂ or HBr / Cl ₂ or CH ₄ / Cl ₂ or HCl / Cl ₂ or HCl or BCl ₃ or CH _x. it may be a Cl _y. Since the plasma density in the region below the plasma shielding plate can be zero, the plasma shielding plate is effective.

  In the plasma processing apparatus shown in FIG. 9, quartz material is used for the processing chamber surface material in the region above the plasma shielding plate, and alumina or aluminum fluoride material is used for the processing chamber surface material in the region below the plasma shielding plate. As a result, a target CD value was obtained, and an increase in the number of foreign matters could be suppressed.

  As described above, according to the present embodiment, it is possible to reduce processing fluctuations and increase in pattern defects caused by the AlF deposit on the surface of the processing chamber formed by performing the etching including the Al material and the exfoliation thereof, and for a long time. It is possible to provide a plasma processing apparatus capable of performing plasma processing over a long period of time.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Also, a part of the configuration of a certain embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of a certain embodiment. Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

101: Shower plate, 102: Inner cylinder, 103: Electrode cover, 110: Wafer, 111: Electrode (sample stage), 120: Processing chamber, 132: Gas supply device, 140: Top plate, 142: Electromagnet, 150: High frequency Power source, 161: RF bias power source, 162: Matching unit, 171: Vacuum exhaust valve, S201: Silicon coating process for covering Si-O-based film on shower plate or inner cylinder and electrode as processing chamber surface material, S202: Etching Step, S203: Metal cleaning step, S204: Silicon cleaning step, 901: Plasma shielding plate.

Claims (7)

A processing chamber disposed inside the vacuum chamber and depressurized inside, and a sample stage disposed at the lower portion of the processing chamber and on which the wafer to be processed is placed, the surface including aluminum formed in advance on the upper surface of the wafer A plasma processing apparatus for etching a film structure having a film layer with plasma,
A first inner wall member comprising quartz and constituting an inner wall surface of the processing chamber and contacting the plasma;
A second inner wall member disposed below the first inner wall member at a position not in contact with the plasma and configured to contain aluminum or yttrium;
A plasma processing apparatus comprising: The plasma processing apparatus according to claim 1,
The plasma processing apparatus is characterized in that the plasma is generated using a processing gas containing chlorine or fluorine. The plasma processing apparatus according to claim 1 or 2,
The plasma is generated by the interaction of an electric field and a magnetic field supplied into the processing chamber,
The first inner wall member is disposed so as to surround the plasma at a height at which the plasma is formed,
The plasma processing apparatus, wherein the second inner wall member is disposed at a height below the upper surface of the sample stage. The plasma processing apparatus according to claim 3,
The plasma processing apparatus, wherein the second inner wall member covers a surface of a beam-like member that is connected to a side wall of the sample stage and supports the sample stage. A plasma processing apparatus according to any one of claims 1 to 4,
A member disposed in the processing chamber to suppress the movement of the plasma or confine the plasma in a predetermined range;
The first inner wall member is disposed above the member;
The plasma processing apparatus, wherein the second inner wall member is disposed below the member. A plasma processing apparatus according to any one of claims 1 to 5,
A gas supply device for supplying a metal cleaning gas containing chlorine for removing deposits in the processing chamber formed when the film structure having the film layer containing aluminum is etched by plasma;
Plasma density when the metal cleaning gas is turned into plasma is, in the first inner wall member is disposed area is a 10 ¹⁵ m ^-3 or more, and in the second inner wall member is disposed region 10 ¹⁵ m- ³ or less, The plasma processing apparatus characterized by the above-mentioned. The plasma processing apparatus according to claim 6, wherein
The metal cleaning gas is BCl ₃ / Cl ₂ , SiCl ₄ / Cl ₂ , CHF ₃ / Cl ₂ , CF ₄ / Cl ₂ , HBr / Cl ₂ , CH ₄ / Cl ₂ , HCl / Cl ₂ , HCl, BCl ₃ Or a plasma processing apparatus characterized by being CH _x Cl _y .

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