JP2016541117A5 - - Google Patents

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Publication number
JP2016541117A5
JP2016541117A5 JP2016533589A JP2016533589A JP2016541117A5 JP 2016541117 A5 JP2016541117 A5 JP 2016541117A5 JP 2016533589 A JP2016533589 A JP 2016533589A JP 2016533589 A JP2016533589 A JP 2016533589A JP 2016541117 A5 JP2016541117 A5 JP 2016541117A5
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JP
Japan
Prior art keywords
substrate carrier
substrate
end portion
intermediate portion
main portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2016533589A
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English (en)
Japanese (ja)
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JP2016541117A (ja
JP6321172B2 (ja
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Publication date
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Priority claimed from PCT/EP2013/074604 external-priority patent/WO2015074725A1/en
Publication of JP2016541117A publication Critical patent/JP2016541117A/ja
Publication of JP2016541117A5 publication Critical patent/JP2016541117A5/ja
Application granted granted Critical
Publication of JP6321172B2 publication Critical patent/JP6321172B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016533589A 2013-11-25 2013-11-25 熱エネルギー伝達低減のための基板キャリア Expired - Fee Related JP6321172B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/074604 WO2015074725A1 (en) 2013-11-25 2013-11-25 Substrate carrier for a reduced transmission of thermal energy

Publications (3)

Publication Number Publication Date
JP2016541117A JP2016541117A (ja) 2016-12-28
JP2016541117A5 true JP2016541117A5 (enExample) 2017-02-09
JP6321172B2 JP6321172B2 (ja) 2018-05-09

Family

ID=49681012

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016533589A Expired - Fee Related JP6321172B2 (ja) 2013-11-25 2013-11-25 熱エネルギー伝達低減のための基板キャリア

Country Status (7)

Country Link
US (1) US20160276142A1 (enExample)
EP (1) EP3075004A1 (enExample)
JP (1) JP6321172B2 (enExample)
KR (1) KR20160089507A (enExample)
CN (1) CN105745744B (enExample)
TW (1) TWI653697B (enExample)
WO (1) WO2015074725A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102607248B1 (ko) * 2018-06-25 2023-11-30 어플라이드 머티어리얼스, 인코포레이티드 기판을 위한 캐리어 및 기판을 운반하기 위한 방법
WO2021243325A1 (en) * 2020-05-29 2021-12-02 Persimmon Technologies Corporation Robot for high-temperature applications
DE102021003330B3 (de) * 2021-06-28 2022-09-01 Singulus Technologies Aktiengesellschaft Substratträger
DE102021003326B3 (de) * 2021-06-28 2022-09-08 Singulus Technologies Aktiengesellschaft Substratträger

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03106357U (enExample) * 1990-02-19 1991-11-01
US6183026B1 (en) * 1999-04-07 2001-02-06 Gasonics International Corporation End effector
JP2004235439A (ja) * 2003-01-30 2004-08-19 Shin Etsu Handotai Co Ltd サセプタ及び気相成長装置
JP2007150336A (ja) * 2007-01-09 2007-06-14 Nsk Ltd 基板搬送装置
US8042697B2 (en) * 2008-06-30 2011-10-25 Memc Electronic Materials, Inc. Low thermal mass semiconductor wafer support
FR2935769B1 (fr) * 2008-09-10 2016-08-12 Renault Sas Articulation elastique de suspension de vehicule automobile et structure de vehicule automobile comportant une telle articulation
JP4895061B2 (ja) * 2010-04-26 2012-03-14 アキム株式会社 部品搬送キャリア
EP2423350B1 (en) 2010-08-27 2013-07-31 Applied Materials, Inc. Carrier for a substrate and a method for assembling the same
JP5881956B2 (ja) * 2011-02-28 2016-03-09 株式会社日立国際電気 基板処理装置、半導体装置の製造方法およびウェーハホルダ
JP5667012B2 (ja) * 2011-08-26 2015-02-12 東京エレクトロン株式会社 リング状シールド部材、その構成部品及びリング状シールド部材を備えた基板載置台
JP5522181B2 (ja) * 2012-01-26 2014-06-18 株式会社安川電機 搬送ロボット

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