JP2016515163A - レーザ誘起ガスプラズマ加工 - Google Patents
レーザ誘起ガスプラズマ加工 Download PDFInfo
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- JP2016515163A JP2016515163A JP2015557233A JP2015557233A JP2016515163A JP 2016515163 A JP2016515163 A JP 2016515163A JP 2015557233 A JP2015557233 A JP 2015557233A JP 2015557233 A JP2015557233 A JP 2015557233A JP 2016515163 A JP2016515163 A JP 2016515163A
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- 238000012545 processing Methods 0.000 title description 18
- 239000000758 substrate Substances 0.000 claims abstract description 138
- 239000000463 material Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims abstract description 48
- 239000007789 gas Substances 0.000 claims description 148
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- 239000005350 fused silica glass Substances 0.000 claims description 9
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- 239000003570 air Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 230000001902 propagating effect Effects 0.000 claims description 4
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims description 4
- 230000008569 process Effects 0.000 description 17
- 238000005530 etching Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 12
- 230000008020 evaporation Effects 0.000 description 9
- 238000001704 evaporation Methods 0.000 description 9
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- 239000000377 silicon dioxide Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000001020 plasma etching Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
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- 238000007796 conventional method Methods 0.000 description 4
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- 238000002844 melting Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
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- 230000001419 dependent effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
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- 238000013532 laser treatment Methods 0.000 description 2
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- 206010052128 Glare Diseases 0.000 description 1
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- 238000004093 laser heating Methods 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
- H01J37/32449—Gas control, e.g. control of the gas flow
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Surface Treatment Of Glass (AREA)
- ing And Chemical Polishing (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
Description
[0001]本願は、米国特許法第119条(e)の下で、2013年2月13日に出願された米国特許仮出願第61/764,482号の優先権を主張し、その内容は、すべての目的のためにその全体が参照により本明細書に組み込まれる。
[0002]米国政府は、Lawrence Livermore National Laboratoryの活動のための、the U.S. Department of EnergyとLawrence Livermore National Security, LLCとの間の契約第DE−AC52−07NA27344号に従って本発明に権利を有する。
Claims (20)
- 第1の表面及び反対側の第2の表面を有する基板を用意するステップと、
前記第1の表面から所定の距離に位置する合焦点にレーザビームを集束させるステップと、
前記合焦点に又はその近くにガスを供給するステップと、
前記レーザビームによって供給されたエネルギーを使用して前記ガスを分解することによってガスプラズマを発生させるステップと、
前記第1の表面の一部分を前記ガスプラズマにさらすステップと、
前記第1の基板の前記一部分から材料を除去するステップと
を含む方法。 - 前記合焦点が、前記第1の表面の前に位置している、請求項1に記載の方法。
- 前記所定の距離が、3mmと10mmとの間にある、請求項1に記載の方法。
- 前記ガスプラズマが、前記合焦点及び前記第1の表面から離れる方向に伝搬する、請求項1に記載の方法。
- 前記ガスが、空気、窒素、アルゴン、水素、フッ化水素(HF)、又は四フッ化炭素(CF4)のうちの1つを含む、請求項1に記載の方法。
- 前記第1の表面の前記一部分をさらすステップが、
前記基板が前記レーザビームの軸に対してある角度で配設されるように前記基板を移動させるステップと、
前記基板が前記角度で配設されているときに前記基板の前記一部分が前記ガスプラズマに物理的に接触するように、前記基板を移動させるステップと
をさらに含む、請求項1に記載の方法。 - 前記角度が20度未満である、請求項6に記載の方法。
- 前記ガスプラズマの半減期が、10μsと100μsとの間の範囲にある、請求項1に記載の方法。
- レーザビームを発生させるように構成されたレーザ源と、
前記レーザビームの経路に配設され、前記レーザビームを合焦点に集束させるように構成された集束レンズと、
前記合焦点に又はその近くにガスを送り出すように構成されたガス源と、
第1の表面及び反対側の第2の表面を有する基板であり、前記基板は、前記第1の表面が前記合焦点から第1の距離に位置するように配設されており、前記合焦点が前記集束レンズと前記基板との間に位置している、基板と
を備えるシステムであって、
前記レーザビームの前記経路に沿って前記第1の表面から離れる方向に伝搬するガスプラズマを前記合焦点の近傍に発生させ、
前記基板を移動させて、前記基板の一部分を前記ガスプラズマにさらすのを可能にし、
前記ガスプラズマを使用して前記基板の前記一部分から材料を除去する
ように構成されている、システム。 - 前記レーザ源が、YAGレーザを含む、請求項9に記載のシステム。
- 前記ガスが、空気、窒素、アルゴン、水素、フッ化水素(HF)、又は四フッ化炭素(CF4)のうちの1つを含む、請求項9に記載のシステム。
- 前記基板が、溶融石英、金属、又はセラミックのうちの1つを含む、請求項9に記載のシステム。
- 前記第1の距離が、3mmと10mmとの間にある、請求項9に記載のシステム。
- 前記基板が、前記レーザビームの前記経路に対してある角度で配設されている、請求項9に記載のシステム。
- 前記角度が20度未満である、請求項14に記載のシステム。
- ノズルをさらに備え、前記ノズルは、前記合焦点が前記ノズル内に位置するように前記集束レンズと前記基板との間に配設されている、請求項9に記載のシステム。
- 前記ガス源が、前記ノズルに結合されており、5L/分と20L/分との間の流量を有する前記ガスを供給することができる、請求項16に記載のシステム。
- 前記ガスプラズマの発生後に残された残留ガスを使用して、前記ガスプラズマを前記基板の方に移動させるようにさらに構成されている、請求項17に記載のシステム。
- 第1の表面及び反対側の第2の表面を有する基板を用意するステップと、
前記基板の前記第2の表面から第1の距離に位置する合焦点にレーザビームを集束させるステップであり、前記レーザビームが前記第1の基板に当たった後に前記基板を通過する、集束させるステップと、
前記合焦点に又はその近くにガスを供給するステップと、
前記レーザビームからのエネルギーを使用して前記ガスを分解することによってガスプラズマを発生させるステップであり、前記ガスプラズマが、前記合焦点から離れ、前記基板の前記第2の表面の方に向きを定められる、発生させるステップと、
前記基板を移動させて、前記第2の表面の一部分を前記ガスプラズマにさらすステップと、
前記第2の基板の前記一部分から材料を除去するステップと
を含む方法。 - 前記レーザビームによって発生される前記エネルギーが、25mJと50mJとの間にある、請求項19に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361764482P | 2013-02-13 | 2013-02-13 | |
US61/764,482 | 2013-02-13 | ||
US13/797,495 | 2013-03-12 | ||
US13/797,495 US9790090B2 (en) | 2013-02-13 | 2013-03-12 | Laser-induced gas plasma machining |
PCT/US2014/016323 WO2014127167A1 (en) | 2013-02-13 | 2014-02-13 | Laser-induced gas plasma machining |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018157835A Division JP6625703B2 (ja) | 2013-02-13 | 2018-08-24 | レーザ誘起ガスプラズマ加工 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016515163A true JP2016515163A (ja) | 2016-05-26 |
JP6393279B2 JP6393279B2 (ja) | 2018-09-19 |
Family
ID=51296771
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015557233A Expired - Fee Related JP6393279B2 (ja) | 2013-02-13 | 2014-02-13 | レーザ誘起ガスプラズマ加工 |
JP2018157835A Active JP6625703B2 (ja) | 2013-02-13 | 2018-08-24 | レーザ誘起ガスプラズマ加工 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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JP2018157835A Active JP6625703B2 (ja) | 2013-02-13 | 2018-08-24 | レーザ誘起ガスプラズマ加工 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9790090B2 (ja) |
EP (1) | EP2956270B1 (ja) |
JP (2) | JP6393279B2 (ja) |
WO (1) | WO2014127167A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA2981683A1 (en) | 2015-04-10 | 2016-10-13 | Bae Systems Plc | A detection counter measure method and apparatus |
WO2016162664A1 (en) | 2015-04-10 | 2016-10-13 | Bae Systems Plc | Method and apparatus for computational ghost imaging |
WO2016162668A1 (en) | 2015-04-10 | 2016-10-13 | Bae Systems Plc | Method and apparatus for simulating electromagnetic radiation path modifying devices |
EP3281402B1 (en) | 2015-04-10 | 2021-10-13 | BAE SYSTEMS plc | Long range sensor apparatus and method of providing a long range sensor apparatus |
EP3281405B1 (en) * | 2015-04-10 | 2020-07-29 | BAE SYSTEMS plc | Method and apparatus for holographic image projection |
WO2016162680A1 (en) | 2015-04-10 | 2016-10-13 | Bae Systems Plc | A weapons counter measure method and apparatus |
DE102016200506B4 (de) * | 2016-01-17 | 2024-05-02 | Robert Bosch Gmbh | Ätzvorrichtung und Ätzverfahren |
DE102019006322B3 (de) * | 2019-09-04 | 2020-10-22 | Leibniz-Institut für Oberflächenmodifizierung e.V. | Verfahren zur Behandlung einer Festkörperoberfläche |
CN116375350A (zh) * | 2023-04-18 | 2023-07-04 | 中国工程物理研究院激光聚变研究中心 | 一种高抗激光损伤性能石英表面的制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6370528A (ja) * | 1986-09-12 | 1988-03-30 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | シリコン半導体表面の無マスクの高速エッチング方法 |
JP2009088535A (ja) * | 2007-10-02 | 2009-04-23 | Semes Co Ltd | 基板洗浄方法及び装置 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4505949A (en) * | 1984-04-25 | 1985-03-19 | Texas Instruments Incorporated | Thin film deposition using plasma-generated source gas |
US5104481A (en) * | 1988-09-28 | 1992-04-14 | Lasa Industries, Inc. | Method for fabricating laser generated I.C. masks |
US5043548A (en) * | 1989-02-08 | 1991-08-27 | General Electric Company | Axial flow laser plasma spraying |
GB9423771D0 (en) * | 1994-11-24 | 1995-01-11 | Univ Coventry | Enhanced laser beam welding |
DE19645746A1 (de) * | 1996-11-06 | 1998-05-07 | Aga Ab | Verfahren und Prozeßgas zum Laserschweißen von metallischen Werkstücken |
KR20020044347A (ko) | 2000-12-05 | 2002-06-15 | 최재성 | 건식 표면 클리닝 방법 |
US6635845B2 (en) | 2001-05-19 | 2003-10-21 | Imt Co., Ltd. | Dry surface cleaning apparatus using a laser |
FR2829414B1 (fr) * | 2001-09-13 | 2003-10-31 | Air Liquide | Procede de soudage hybride laser-arc avec ajustage des debits de gaz |
JP3934536B2 (ja) * | 2001-11-30 | 2007-06-20 | 株式会社半導体エネルギー研究所 | レーザ照射装置およびレーザ照射方法、並びに半導体装置の作製方法 |
US20030155328A1 (en) * | 2002-02-15 | 2003-08-21 | Huth Mark C. | Laser micromachining and methods and systems of same |
GB2390319B (en) * | 2002-07-03 | 2005-07-27 | Rolls Royce Plc | Method and apparatus for laser welding |
TW573327B (en) * | 2002-12-27 | 2004-01-21 | Ultratera Corp | Plasma etching method |
US7186947B2 (en) * | 2003-03-31 | 2007-03-06 | Hypertherm, Inc. | Process monitor for laser and plasma materials processing of materials |
US7060933B2 (en) | 2004-06-08 | 2006-06-13 | Igor Troitski | Method and laser system for production of laser-induced images inside and on the surface of transparent material |
KR20060040277A (ko) * | 2004-11-05 | 2006-05-10 | 엘지.필립스 엘시디 주식회사 | 펨토초 레이저를 이용한 기판의 절단방법 |
US20070045252A1 (en) | 2005-08-23 | 2007-03-01 | Klaus Kleine | Laser induced plasma machining with a process gas |
US20070045255A1 (en) * | 2005-08-23 | 2007-03-01 | Klaus Kleine | Laser induced plasma machining with an optimized process gas |
EP1886757B1 (en) * | 2006-08-07 | 2009-07-01 | LVD Company NV | Arrangement and method for the on-line monitoring of the quality of a laser process exerted on a workpiece using a heat detection camera and a tilted mirror |
WO2009125284A1 (en) | 2008-04-09 | 2009-10-15 | Pavel Yurievich Smirnov | Laser-plasma method and system for surface modification |
US9563137B2 (en) | 2009-06-23 | 2017-02-07 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
FI20096012A0 (fi) * | 2009-10-02 | 2009-10-02 | Picodeon Ltd Oy | Menetelmä ja järjestely kiteisten rakenteiden tuottamiseksi |
-
2013
- 2013-03-12 US US13/797,495 patent/US9790090B2/en active Active
-
2014
- 2014-02-13 WO PCT/US2014/016323 patent/WO2014127167A1/en active Application Filing
- 2014-02-13 JP JP2015557233A patent/JP6393279B2/ja not_active Expired - Fee Related
- 2014-02-13 EP EP14751934.2A patent/EP2956270B1/en active Active
-
2018
- 2018-08-24 JP JP2018157835A patent/JP6625703B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6370528A (ja) * | 1986-09-12 | 1988-03-30 | インタ−ナショナル・ビジネス・マシ−ンズ・コ−ポレ−ション | シリコン半導体表面の無マスクの高速エッチング方法 |
JP2009088535A (ja) * | 2007-10-02 | 2009-04-23 | Semes Co Ltd | 基板洗浄方法及び装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2014127167A1 (en) | 2014-08-21 |
EP2956270B1 (en) | 2024-04-17 |
EP2956270A4 (en) | 2016-12-21 |
EP2956270A1 (en) | 2015-12-23 |
US20140224776A1 (en) | 2014-08-14 |
JP2019023156A (ja) | 2019-02-14 |
US9790090B2 (en) | 2017-10-17 |
JP6625703B2 (ja) | 2019-12-25 |
JP6393279B2 (ja) | 2018-09-19 |
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