JP2016501446A - エレクトロニクス用の可撓性の熱インターフェース - Google Patents
エレクトロニクス用の可撓性の熱インターフェース Download PDFInfo
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- JP2016501446A JP2016501446A JP2015544162A JP2015544162A JP2016501446A JP 2016501446 A JP2016501446 A JP 2016501446A JP 2015544162 A JP2015544162 A JP 2015544162A JP 2015544162 A JP2015544162 A JP 2015544162A JP 2016501446 A JP2016501446 A JP 2016501446A
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- heat pipe
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- circuit board
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- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims abstract description 27
- 239000012530 fluid Substances 0.000 claims abstract description 16
- 125000006850 spacer group Chemical group 0.000 claims description 7
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- HOBRTVXSIVSXIA-UHFFFAOYSA-N 1,2,3,5-tetrachloro-4-phenylbenzene Chemical compound ClC1=C(Cl)C(Cl)=CC(Cl)=C1C1=CC=CC=C1 HOBRTVXSIVSXIA-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000007790 solid phase Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20627—Liquid coolant without phase change
- H05K7/20636—Liquid coolant without phase change within sub-racks for removing heat from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Aviation & Aerospace Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (20)
- 電子デバイスから熱を除去する平面状ヒートパイプにおいて、
平面状部分と、
電子デバイスに装着された板部分と、
平面状部分及び板部分に連結されると共に、3度の自由度にて撓む可撓性の蛇行状部分とを備え、
平面状部分、板部分及び蛇行状部分の各々は、互いに流体的に連通しかつ作用流体を保持する内部チャンバを含む、平面状ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記蛇行状部分は、複数の要素を含み、該要素の各々は、実質的に90度の角度にて隣接する要素に連結される、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記蛇行状部分は、実質的に90度の角度にて互いに装着された少なくとも5つの要素を含む、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記蛇行状部分はS字形部分である、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記平面状部分は、全体として、U字形の形態を有し、前記蛇行状部分及び板部分は、該U字形の平面状部分内にある、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記平面状部分は、中央開口を有し、前記蛇行状部分は、該開口内に延伸する、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
電子デバイスは、プリント回路板に装着された複数の電子デバイスの1つであり、該ヒートパイプは、板部分と、該板部分及び電子デバイスの各々に対する平面状部分に連結された蛇行状部分とを含む、ヒートパイプ。 - 請求項7に記載のヒートパイプにおいて、
前記デバイスは、ボール、カラム又はランドグリッドアレイ(land grid array)によりプリント回路板に連結される、ヒートパイプ。 - 請求項7に記載のヒートパイプにおいて、
前記プリント回路板は宇宙向けの用途を有する、ヒートパイプ。 - 請求項7に記載のヒートパイプにおいて、
前記平面状部分と前記プリント回路板との間に配置され、かつその間に間隙を規定するスペーサを更に備える、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記電子デバイスは、フィールドプログラマブルゲートアレイである、ヒートパイプ。 - 請求項1に記載のヒートパイプにおいて、
前記チャンバは、全体として四角形の断面形態を含む、ヒートパイプ。 - プリント回路板(PCB)に装着された複数の電子デバイスから熱を除去する平面状ヒートパイプにおいて、
平面状部分と、
別個の板部分が電子デバイスの各々に装着された、複数の板部分と、
別個の蛇行状部分が平面状部分及び板部分に連結された複数の蛇行状部分とを備え、
平面状部分、板部分及び蛇行状部分の全ては、互いに流体的に連通しかつ作用流体を保持する内部チャンバを含み、
前記蛇行状部分の各々は、各要素が実質的に90度の角度にて隣接する要素に連結された、複数の要素を含み、
前記平面状部分とPCBとの間に配置され、その間にて間隙を規定する少なくとも1つのスペーサを備える、ヒートパイプ。 - 請求項13に記載のヒートパイプにおいて、
前記蛇行状部分の各々はS字形部分である、ヒートパイプ。 - 請求項13に記載のヒートパイプにおいて、
前記蛇行状部分の各々は、実質的に90度の角度にて互いに装着された少なくとも5つの要素を含む、ヒートパイプ。 - 請求項13に記載のヒートパイプにおいて、
前記デバイスの各々は、ボール、カラム又はランドグリッドアレイによりプリント回路板に連結される、ヒートパイプ。 - 平面状ヒートパイプと、プリント回路板(PCB)に装着された複数の電子デバイスを有する該プリント回路板(PCB)とを含む電子機器において、前記ヒートパイプは、該電子機器から熱を除去し、該ヒートパイプは、
平面状部分と、
別個の板部分が電子デバイスの各々に装着された複数の板部分と、
別個の蛇行状部分が平面状部分及び板部分に連結された複数の蛇行状部分とを備え、
平面状部分、板部分及び蛇行状部分の全ては、互いに流体的に連通しかつ作用流体を保持する内部チャンバを含み、
前記蛇行状部分の各々は、各要素がある角度にて隣接する要素に連結された複数の要素を含み、
前記平面状部分とPCBとの間に配置され、その間にて間隙を規定する少なくとも1つのスペーサを備える、電子機器。 - 請求項17に記載の機器において、
前記蛇行状部分の各々はS字形部分である、機器。 - 請求項17に記載の機器において、
前記蛇行状部分の各々は、実質的に90度の角度にて互いに装着された少なくとも5つの要素を含む、機器。 - 請求項17に記載の機器において、
前記デバイスの各々は、ボール、カラム又はランドグリッドアレイによりプリント回路板に連結される、機器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/685,397 US9036353B2 (en) | 2012-11-26 | 2012-11-26 | Flexible thermal interface for electronics |
US13/685,397 | 2012-11-26 | ||
PCT/US2013/071526 WO2014082019A1 (en) | 2012-11-26 | 2013-11-22 | Flexible thermal interface for electronics |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016501446A true JP2016501446A (ja) | 2016-01-18 |
JP6178863B2 JP6178863B2 (ja) | 2017-08-09 |
Family
ID=49841802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015544162A Active JP6178863B2 (ja) | 2012-11-26 | 2013-11-22 | エレクトロニクス用の可撓性の熱インターフェース |
Country Status (6)
Country | Link |
---|---|
US (1) | US9036353B2 (ja) |
EP (1) | EP2923537B1 (ja) |
JP (1) | JP6178863B2 (ja) |
KR (1) | KR20150088820A (ja) |
TW (1) | TWI593343B (ja) |
WO (1) | WO2014082019A1 (ja) |
Cited By (1)
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JP2019509455A (ja) * | 2016-03-03 | 2019-04-04 | クールエニーピー,エルエルシー | 自己編成型熱力学的システム |
Families Citing this family (11)
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EP3096593B1 (de) * | 2015-05-19 | 2017-08-23 | Airbus DS GmbH | Geräteträgertafel eines satelliten |
US9733680B1 (en) | 2016-03-16 | 2017-08-15 | Microsoft Technology Licensing, Llc | Thermal management system including an elastically deformable phase change device |
TWI576022B (zh) * | 2016-05-16 | 2017-03-21 | 中華精測科技股份有限公司 | 支撐結構與其製造方法 |
US9992911B1 (en) | 2017-05-17 | 2018-06-05 | Northrop Grumman Systems Corporation | Controllable conductance thermal interface |
US11143460B2 (en) * | 2018-07-11 | 2021-10-12 | Asia Vital Components Co., Ltd. | Vapor chamber structure |
EP3923689B1 (en) * | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Cooling device and its manufacturing method |
EP3955716B1 (en) | 2020-08-13 | 2024-07-31 | Aptiv Technologies AG | Cooling device and method of manufacturing the same |
EP4025024A1 (en) * | 2021-01-04 | 2022-07-06 | Aptiv Technologies Limited | Cooling device and method of manufacturing the same |
GB2611028A (en) | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
US11503701B1 (en) | 2021-10-26 | 2022-11-15 | Eagle Technology, Llc | Electronic device having heat transfer clamp and associated methods |
US11665856B2 (en) | 2021-10-26 | 2023-05-30 | Eagle Technology, Llc | Electronic device having flexible, heat conductive layer and associated methods |
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-
2013
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- 2013-11-22 EP EP13811284.2A patent/EP2923537B1/en active Active
- 2013-11-22 JP JP2015544162A patent/JP6178863B2/ja active Active
- 2013-11-22 WO PCT/US2013/071526 patent/WO2014082019A1/en active Application Filing
- 2013-11-25 TW TW102142821A patent/TWI593343B/zh active
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Also Published As
Publication number | Publication date |
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TW201433253A (zh) | 2014-08-16 |
KR20150088820A (ko) | 2015-08-03 |
EP2923537A1 (en) | 2015-09-30 |
JP6178863B2 (ja) | 2017-08-09 |
TWI593343B (zh) | 2017-07-21 |
US20140146475A1 (en) | 2014-05-29 |
EP2923537B1 (en) | 2021-04-14 |
WO2014082019A1 (en) | 2014-05-30 |
US9036353B2 (en) | 2015-05-19 |
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