JP2016221603A - Manufacturing method for functional precision component and functional precision component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method which enables the efficient manufacture of a functional precision component where a functional material is formed only in a recess of an uneven microstructure over a range of 10 nm-1 mm provided in a base body surface by using a chemical machining process basically using only water with no use of a polishing agent or abrasive grains, and a functional precision component manufactured by the manufacturing method.SOLUTION: A manufacturing method for a functional precision component where a functional material is formed only in a recess 3 of an uneven microstructure over a range of 10 nm-1 mm provided in a base body 1 surface comprises a stop layer forming step for forming a stop layer 4 with a predetermined thickness unprocessable by a machining process comprising Water-CARE over the whole surface of the base body by using a machining process, a functional material stacking step for forming a functional material 5 processable by the machining process by stacking on the stop layer, and a machining process for removing the functional material outside the recess by the machining process.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a functional precision component and a functional precision component, and more particularly, to a method for manufacturing a functional precision component having a sub-μm order microstructure formed on the surface and a functional precision component. .

  Conventionally, various methods for flattening or polishing the surface of a workpiece are provided. Typically, there is CMP (Chemical Mechanical Polishing), and recently, the present inventor has proposed CARE (CAtalyst-Referred Etching).

CMP increases the mechanical polishing (surface removal) effect due to the relative movement of the polishing agent and the object to be polished by the surface chemical action of the polishing agent (abrasive grains) itself or the action of chemical components contained in the polishing liquid. This is a technique for obtaining a smooth polished surface. Generally, an object to be polished is held by a member called a carrier, pressed against a flat plate (lap) with a polishing cloth or polishing pad, and a slurry containing various chemical components and hard fine abrasive grains is allowed to flow together. Polishing is performed by making the relative movement. By changing the surface of the object to be polished by the chemical component, the processing speed can be improved as compared with the case of polishing with a single abrasive. In addition, the fine scratches on the surface remaining when polishing with a single abrasive and the work-affected layer remaining in the vicinity of the surface are extremely reduced, and an ideal smooth surface can be obtained. Here, fine particles of cerium oxide mainly containing cerium oxide (CeO ₂ ) or lanthanum are used as the polishing agent for CMP.

On the other hand, as described in Patent Document 1, CARE is a solid oxide in which one or two or more elements are bonded via oxygen, or a multicomponent solid oxide composed of a plurality of oxides. A processing method in which an object is a workpiece and the surface of the workpiece is flattened or processed into an arbitrary curved surface, in which water molecules are dissociated to form a solid oxide and back bonds of oxygen elements and other elements A catalytic substance that assists in the production of decomposition products by hydrolysis as a processing reference surface, and in the presence of water, the workpiece and the processing reference surface are placed in close contact or in close proximity, The potential of the machining reference surface is set to a range that includes a natural potential and H ₂ and O ₂ are not generated, and the workpiece and the machining reference surface are moved relative to each other to remove the decomposition products from the workpiece surface. , A processing method that uses no abrasives or abrasive grains It is. Since this processing method basically uses only water, it is called Water-CARE.

  In the field of regenerative medicine typified by iPS cells and the field of microchemical engineering, the demand for products such as cell templates for partially culturing cells on glass slides and microreactors that serve as chemical reaction fields is expected to increase. Much research and development is still in progress regarding manufacturing technology. As an absolute condition for the spread of these products, firstly, production at a low cost is mentioned, and in addition, since the liquid phase reaction is an important function, it is required to control wettability. This is because there are cases in which a plurality of types of cells are cultured in one cell template, and in the case of a microreactor, it is necessary to transport the liquid only in the flow path. In the world of μm order, the influence of the surface tension of the liquid becomes relatively large, so it is difficult to control the liquid only with physical unevenness, control of wettability, specifically water repellency on the convex part and hydrophilic on the concave part It is necessary to make sex.

Table 2013/084934

  What about cell templates and microreactors? A fine structure is formed on the surface, and it is necessary to partially form a functional surface such as hydrophilicity and water repellency. In order to develop products that meet these objectives, microfabrication technologies such as machining, laser processing, and etching, and methods combining functional thin films have been studied, but mass production technology such as manufacturing at low cost is the biggest bottleneck. Therefore, rapid development is desired. In particular, since the surface microstructure is on the order of sub-μm and the thickness of the functional layer formed on the surface is on the order of nm, it is difficult to precisely control the processing speed with conventional machining and polishing techniques. Not applicable. Furthermore, when using abrasive grains or the like, if particles such as abrasive grains or polishing scraps adhere to the recesses, it is difficult to remove and clean them. In addition, when chemicals are used in the processing process and the cleaning process, the residue may be a problem.

  Therefore, in view of the above-described situation, the present invention intends to solve the problem by providing a chemical processing process that uses only water and does not use any abrasive or abrasive grains, and is provided on the surface of the substrate. Another object of the present invention is to provide a manufacturing method capable of efficiently manufacturing a functional precision component in which a functional material is formed only in a recess having an uneven microstructure having a range of 10 nm to 1 mm, and a functional precision component manufactured thereby. .

In order to solve the above-mentioned problems, the present invention is a method for producing a functional precision component in which a functional material is formed only in the concave portion of the concave-convex microstructure having a range of 10 nm to 1 mm provided on the substrate surface. Using a catalytic substance that aids in the generation of decomposition products by hydrolysis by cutting back bonds between oxygen elements and other elements that dissociate from the molecules and adsorbing back bonds of the other elements, the workpiece is processed in the presence of water. The catalyst material is placed in contact with or in close proximity to each other, the potential of the catalyst material is within a range that includes a natural potential and H ₂ and O ₂ are not generated, and the workpiece and the catalyst material are moved relative to each other. A stopper layer forming step of forming a stopper layer having a predetermined thickness that cannot be processed by the processing process on the entire surface of the substrate using a processing process for removing the decomposition product from the surface of the workpiece; above And a functional material laminating step for laminating and forming functional materials that can be processed by the processing process, and a processing step for removing the functional material outside the recesses by the processing process. did.

  Here, the functional material laminating step is a step of forming a functional layer on the stopper layer by laminating a functional material that can be processed by the processing process to a thickness that does not block the recess structure, It is preferable that a functional layer having a predetermined thickness is provided only on the inner surface of the concave portion of the substrate.

It is also preferable that the functional material is SiO ₂ and that the material of the stopper layer is carbon. Furthermore, the substrate is more preferably a cycloolefin polymer (COP) resin.

  Further, the present invention is a method characterized in that the functional material is formed only in the concave portion of the concave and convex fine structure in the range of 10 nm to 1 mm provided on the surface of the base body, which is manufactured by the above-described manufacturing method of the functional precision component. High precision parts.

The functional precision component manufacturing method and the functional precision component according to the present invention as described above are functional precision components in which a functional material is formed only in the concave portion of the concave-convex microstructure in the range of 10 nm to 1 mm provided on the surface of the substrate. A method of manufacturing a part, which uses a catalytic substance that dissociates water molecules and adsorbs by cutting back bonds between oxygen elements and other elements constituting the workpiece and helps to generate decomposition products by hydrolysis. In the presence of water, the workpiece and the catalytic material are arranged in contact with or in close proximity to each other, and the potential of the catalytic material is set within a range that includes natural potential and does not generate H ₂ and O ₂ . A stopper layer having a predetermined thickness that cannot be processed by the processing process is formed on the entire surface of the substrate by using a processing process in which the decomposition product is removed from the surface of the workpiece by relatively moving the catalyst material and the catalyst material. stopper A layer forming step, a functional material laminating step of laminating and forming a functional material that can be processed by the processing process on the stopper layer, a processing step of removing the functional material outside the recess by the processing process, and more Therefore, the following effects are produced. Since it is a chemical processing process (Water-CARE) that basically uses only water and does not use any abrasive grains, it is not necessary to introduce a work-affected layer. It is possible to accurately remove only the outside functional material and to manufacture a functional precision part having the functional material only in the recess, and particles and chemical components such as abrasive grains and slurry may remain in the recess. Therefore, the cleaning process can be performed easily and at low cost.

  Then, the functional material laminating step is a step of forming a functional layer on the stopper layer by laminating a functional material that can be processed by the processing process to a thickness that does not block the concave structure, By having a functional layer having a predetermined thickness only on the inner surface of the concave portion of the substrate, the concave portion can be used as a functional concave portion. The present invention is most effective when a stopper layer of nm order is formed on the surface of a fine concavo-convex structure of the order of sub-μm, and a functional material is laminated and formed thereon with a thickness of nm order. This is a case where a functional layer having a thickness on the order of nm is provided only on the inner surface of the recess.

Further, when the functional material is SiO ₂ , the inside of the recess can be made hydrophilic, and when the material of the stopper layer is carbon, the outside of the recess can be made water repellent. Carbon can be deposited thinly and uniformly on the order of nm on the surface of the uneven microstructure on the surface of the substrate, and it is hardly processed by Water-CARE, so it becomes a good stopper layer, and the processing process by the processing process It can be controlled with high accuracy and contributes to process efficiency. Also, the SiO ₂ thin film can be easily formed by vapor deposition, is stable because it is an oxide, and can be easily processed by Water-CARE.

  Furthermore, if the substrate is a cycloolefin polymer (COP) resin, it is possible to form an uneven microstructure on the surface with high efficiency by a shape transfer method, low hygroscopicity, and excellent shape stability. Suitable for parts.

The manufacturing process of the functional precision component by this invention is shown, (a) is sectional drawing of the state in which the stopper layer was formed on the surface of a base | substrate, (b) is sectional drawing of the state in which the functional layer was formed on the stopper layer (C) is sectional drawing of the state which is performing the processing process, (d) has shown sectional drawing of the completion state which removed only the functional layer of the convex part, respectively. The manufacturing process of the functional precision component of another form is shown, (a) is sectional drawing of the state which laminated | stacked the functional material so that a recessed part might be filled up in a functional material lamination process, (b) is a stopper layer of a convex part FIG. 4 is a cross-sectional view of a completed state in which a functional process is performed until the functional material is removed by exposing the functional material. It is explanatory drawing of the base | substrate shaping | molding method of a plane transfer system. It is explanatory drawing of the base transfer method of a roll transfer system. The interference microscope image and AFM image of the surface before and after the flattening processing of quartz glass are shown. A case where a substrate having undulation on the surface is processed by CARE having a processing reference surface of the catalyst is shown, (a) is a cross-sectional view before processing, and (b) is a cross-sectional view in a state where only a ridge portion of the undulation is processed. It is. The case where the substrate on which only the undulation peaks are processed is further processed with CARE having a catalyst processing reference surface, (a) is a sectional view before processing, and (b) is the microstructure of the undulation peaks. It is sectional drawing of the state processed until it lose | disappears. A case where a substrate having a undulation on the surface is processed by CARE based on the workpiece surface is shown, (a) is a cross-sectional view before processing, and (b) is a cross-sectional view in a state where ridges and valleys of the undulation are processed. is there.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The mass production technology for functional precision parts of the present invention is a combination of resin structure transfer technology, thin film formation technology and ultra-precision machining technology. The target irregular fine structure is in the range of 10 nm to 1 mm, more preferably in the range of 100 nm to 100 μm. In this embodiment, as shown in FIG. 1, a fine structure prismatic structure having a 100 μm square and a height of 100 μm is formed on the surface of the substrate 1 at a pitch of 100 μm, the convex part 2 is made water repellent and the concave part 3 is made hydrophilic. A procedure for manufacturing the functional precision component A will be described. Water-CARE (Water-CAtalyst-Referred Etching) is used as an ultraprecision machining technique (machining process).

  First, a base 1 made of a synthetic resin having a concavo-convex microstructure in a range of 10 nm to 1 mm on the surface is prepared. Here, a cycloolefin polymer (COP) resin is used as the material of the substrate 1, but other synthetic resins, glass, or the like can be used depending on the intended use. Next, a stopper layer forming step (see FIG. 1A) for forming a stopper layer 4 having a thickness on the order of nm that cannot be processed by the processing process on the entire surface of the substrate 1, and on the stopper layer 4 A functional material laminating step (see FIG. 1B) for laminating and forming a functional layer 5 made of a functional material that can be processed by the processing process, and the functional material outside the recess 3 is removed by the processing process. A functional precision component A is manufactured through a processing step (see FIG. 1C) (see FIG. 1D).

In the present embodiment, the stopper layer 4 is a carbon thin film having a thickness of about 30 nm, has water repellency, and has a property of being hardly processed by this processing process. On the other hand, the functional layer 5 is a SiO ₂ thin film having a thickness of 150 to 180 nm, has a hydrophilic property, and has a property of being easily processed by this processing process. Then, when the machining process is performed on the surface of the substrate 1 in water using the machining head 6 using the catalyst as a machining reference surface, the SiO ₂ thin film located on the convex portion 2 is removed as the machining progresses. Although the thickness is reduced, when the carbon thin film is exposed, the processing speed rapidly decreases. After the SiO ₂ thin film of the convex portion 2 is completely removed, the present processing process is stopped. At this time, since this processing process functions only in the vicinity in contact with the catalyst, the SiO ₂ thin film positioned in the recess 3 away from the catalyst is not processed at all. Thus, even if it is a submicrometer order recessed part, the functional recessed part 7 by which the inner wall face was covered with the functional layer 5 can be formed by forming a thin film of nm order.

  On the other hand, as shown in FIG. 2, in the functional material laminating step (see FIG. 2A), when the functional material 8 is laminated so as to fill the concave portion 3, the subsequent processing steps ( When the processing is stopped after the processing has progressed to the level of the stopper layer 4 according to FIG. 2 (b)), the convex portion 2 is water-repellent and the concave portion 3 is filled with the functional material 8. Precision component B can be manufactured.

  In order to form the concavo-convex microstructure on the surface of the substrate 1, it is formed by resin injection molding or transfer technology using a mold. These transfer technologies have been reported and proven so far as inexpensive mass-production manufacturing technologies, are being put into practical use as formation of semiconductor microcircuits and nanoimprint lithography, and can be applied to structures on the order of nm. FIG. 3 shows a planar transfer method, in which a base material is placed on a planar mold 9 and a transfer mold 10 on which a fine uneven pattern is formed is pressed from above at a predetermined temperature to form an uneven microstructure on the surface of the substrate 1. Transcript. FIG. 4 shows a roll transfer system, in which a sheet-like continuous substrate 1 is fed between a cylindrical roll 11 and a transfer roll 12 having a fine concavo-convex pattern formed on the outer periphery, and the fine concavo-convex pattern of the cylindrical roll 11 is transferred to the substrate. 1 is repeatedly transferred to the surface of 1. In particular, if a roll transfer system is adopted, it can be expected as a cheaper manufacturing technique.

  The cycloolefin polymer (COP) resin used as the material of the substrate 1 is excellent in dimensional stability even under the minimum water absorption and high humidity among plastics, and has almost no warpage or deformation of the molded product, so that it can be used for precision molding. Excellent transferability due to excellent fluidity. Therefore, COP is used for precision parts such as semiconductor containers, biochips, bioplates, infusion bags, and multilayer films.

The stopper layer 4 does not need to be water-repellent and is formed of a material that cannot be processed or is difficult to process by this processing process. With ordinary mechanical polishing, a thin film having a thickness on the order of nm is removed in an instant, and the protrusion 1 of the substrate 1 is largely removed, making it impossible to maintain a desired uneven microstructure. Since this processing process is based on a processing principle involving water molecules, a water-repellent material cannot be processed and can be preferably used. In addition, this processing process is suitable for processing solid oxide, and a SiO ₂ thin film, which is a typical hydrophilic material, is the functional material most suitable for processing.

Next, the details of the processing process (Water-CARE) used in the present invention will be described mainly in the case of using a solid oxide as a processing target. Water-CARE uses a catalytic substance as a processing reference surface that dissociates water molecules and adsorbs by cutting back bonds between oxygen and other elements constituting the solid oxide, and helps to generate decomposition products by hydrolysis. In the presence of water, the workpiece and the machining reference surface are arranged in contact with or in close proximity to each other, and the potential of the machining reference surface is set to a range that includes a natural potential and does not generate H ₂ and O ₂ , The workpiece and the machining reference surface are moved relative to each other, and the decomposition product is removed from the workpiece surface for processing.

  Here, it is preferable to use a catalyst material surface containing a transition metal element as the catalyst material and having an electron d orbit of the transition metal element in the vicinity of the Fermi level. In this processing process, since a solution reactive with a metal element is not used, various transition metal elements can be used. Among them, Pt, Ru, Ni, Co, Cr, and Mo including Pt having a large work function can be used. Etc. are preferably used. Further, the catalyst material serving as the processing reference surface may be a metal element alone or an alloy composed of a plurality of metal elements. Practically, it is preferable to use Pt, Ru, Ni, Cr for the processing reference surface. Here, the catalyst material does not need to be a bulk, and may be a thin film formed by vapor deposition, sputtering, electroplating or the like of a metal or a transition metal on the surface of a base material that is inexpensive and has good shape stability. The base material on which the catalyst material is deposited may be a hard elastic material, and for example, a fluorine rubber material can be used. When the catalyst material is conductive, the processing speed can be controlled by controlling the potential of the processing reference surface from the outside. Further, even a compound containing a transition metal element and an insulating catalyst material can be used satisfactorily if the d-orbit of electrons of the transition metal element is a catalyst material in the vicinity of the Fermi level. In this case, the potential of the processing reference plane is a natural potential. Leave as it is.

In addition, it is necessary to use pure water or ultrapure water, which has few impurities and constant characteristics, in order to realize a pure processing environment and to accurately control processing conditions. Generally, pure water has an electrical resistivity of about 1 to 10 MΩ · cm, and ultrapure water has an electrical resistivity of 15 MΩ · cm or more, but there is no boundary between them. Further, in this processing process, it may be preferable to perform processing while using hydrogen water purged with pure water or ultrapure water and adsorbing hydrogen to the catalyst material on the processing reference surface. In addition, it is also preferable to use water in which pure water or ultrapure water is mixed with a complex that aids dissolution of decomposition products. Here, the complex acts to promote the dissolution of the decomposition product and to form a complex ion and maintain it stably in water. Moreover, it is preferable to adjust pH of water (working liquid) in the range of 2-12. Even if the pH is smaller (strongly acidic) or larger (strongly alkaline) than this range, the processing speed is reduced. Since the properties of oxides to be processed are diverse and decomposition products generated in the processing process are various, it is desirable to adjust the pH accordingly. For adjusting the pH, for example, HNO ₃ is added in the acidic region and KOH is added in the alkaline region. Of course, the pH of the processing liquid may be 7 (neutral: water remains), and in that case, it can be applied to various oxide processing in general.

  The processing mechanism of Water-CARE is considered as follows from a phenomenological viewpoint. When a processing reference surface having a catalytic material having at least a d-electron orbit near the Fermi level contacts or comes close to the surface of the solid oxide, that is, the d-electron orbit approaches the surface of the solid oxide. The d electrons act to lower the barrier of reaction against both the dissociation of water molecules and the phenomenon when the oxide backbond becomes loose. Phenomenologically, when the catalyst material approaches the oxide, the bonding force of the back bond between the oxygen element constituting the oxide and the other element weakens, and the water molecules dissociate and the oxygen element of the oxide The back bonds of other elements are cut and adsorbed to produce decomposition products by hydrolysis. And it is a principle that a decomposition product elutes in a processing liquid. Here, the processing reference surface having the catalyst substance is brought into contact with the surface of the solid oxide and rubbed to give a mechanical force to the decomposition product, thereby promoting elution into water. Further, even if the surface of the solid oxide and the processing reference surface do not contact each other, there is an action of promoting the elution of the decomposition product into the water by the flow of water caused by the relative movement of both.

Further, if the catalyst substance forming the processing reference surface is a conductive material, the processing speed can be controlled by adjusting the potential of the catalyst substance. The oxidation-reduction potential changes the property that the surface of a conductive substance (eg, Pt) “extracts” and “gives” electrons from the oxide side. The electric potential of the conductive material is a parameter for changing to an optimum processing speed in accordance with the accuracy to be finally aimed. However, if the potential of the conductive substance is increased positively, O ₂ is generated, and if it is negatively increased, H ₂ is generated, and bubbles interfere with processing. Therefore, adjustment is made within a range in which H ₂ and O ₂ are not generated. And the potential control range is about 1.6V.

For example, a silicon dioxide (SiO ₂ ) crystal has a structure in which Si is located at the center of a regular tetrahedron and O is bonded to four vertices, and Si is three-dimensionally bonded through O, In the processing, Si—O—Si bonds are broken, and H ₂ O is hydrolyzed to become Si—OH and OH—Si. Thus, silicic acid {[SiO _x (OH) _4-2x ] _n } is generated by hydrolysis. Here, 0 <x <2. Typically, there are orthosilicic acid (H ₄ SiO ₄ ), metasilicic acid (H ₂ SiO ₃ ), metadisilicic acid (H ₂ Si ₂ O ₅ ) and the like. These decomposition products are eluted in water.

  When processing a material other than a solid oxide, a catalyst substance having a function of promoting both oxidation of the material and hydrolysis of the oxide film is used as a processing reference surface. Thereby, materials such as SiC, SiC and GaN can be processed.

Next, FIG. 5 shows a result of processing quartz glass (pure SiO ₂ ) using Pt as a catalyst material for forming the processing reference surface. Quartz glass used a CMP surface as a pre-processed surface, and the processing characteristics were evaluated by observing the surface before and after processing with a phase shift interference microscope (Zygo, NewView) and an atomic force microscope (AFM). Processing pressure: 200 hPa, rotation speed: 10 rpm, solution: ultrapure water, processing time: 1 hour. The processing speed was 831 nm / h. In the phase shift interference microscope image by processing, rms: 0.338 nm before processing becomes rms: 0.147 nm after processing, and the surface roughness is greatly improved. In the AFM image, rms: 1.455 nm before processing was greatly improved to rms: 0.103 nm after processing, and scratches were confirmed on the surface before processing, but such scratches were removed, It was found to have a smooth surface at the atomic level. It can be seen that an SiO ₂ thin film having a thickness of 150 to 180 nm can be removed in about 10 minutes.

  The biggest problem in the present invention is to establish ultra-precision machining technology as the final process. As mentioned above, the microstructure manufacturing technology using resin materials has already been established by mass production technology, and the functional thin film formation technology on the resin also requires some consideration such as peeling resistance during processing and use. Is almost established. The problem is an ultra-precision processing technique that selectively removes only one kind of ultra-thin film having a thickness of about 100 nm formed on a very delicate resin material that is soft and has a fine structure. The reason for making the ultrathin film is that if the film is thick, the film fills the uneven micro structure of the order of sub μm.

Water-CARE was developed to perform ultra-smooth finishing with a surface roughness of about 1 nm PV using only water on a workpiece such as quartz glass without using abrasive grains. A hydrophilic SiO ₂ thin film (same component as synthetic quartz glass) is formed on the outermost surface, and a water-repellent thin film that does not react with Water-CARE (not processed) is selected below it to act as a stopper layer. It is possible to form a fine structure in which a desired wettability is controlled. When a workpiece with a fine structure is processed by a polishing method using ordinary abrasive grains, the chemical components of the abrasive grains and slurry remain in the recesses, which requires a great deal of time and cost in the cleaning process. The occurrence of defects such as scratches is also expected.

  In the present invention, the dendrite base having a concavo-convex microstructure is a soft material, and since it is manufactured by injection molding or a shape transfer method, it is avoided that waviness of the order of μm occurs on the outermost layer or the reference surface. I can't. For this reason, in the conventional CARE, if the surface of the substrate 1 has waviness as shown in FIG. 6A, uniform ultra-precise processing cannot be performed on the surface of the processing head 6. In other words, the undulation peaks of the substrate 1 are selectively processed and the undulation valleys are not processed at all, so that the desired fine structure with controlled wettability can be formed only partially (see FIG. 6B). ). As shown in FIG. 7, there is a limit to the stopper layer 4 for CARE, and when the processing for a long time or mechanical processing is increased, the stopper layer 4 is broken and the essential fine uneven structure disappears. (FIG. 7B).

  In order to overcome this problem, instead of using the catalyst plane of the machining head 6 as a reference, as shown in FIG. 8, an elastic catalyst tool 13 is used to remove the film with reference to the surface of the workpiece having waviness. The “work surface reference CARE” is performed. As a result, a fine-structure prismatic structure having a 100 μm square and a height of 100 μm is formed on a 2 inch (φ50 mm) size resin substrate having a surface waviness of about 10 μm, on which water repellency and hydrophilicity are formed. It is possible to manufacture a functional precision component by forming a thin film and forming a fine structure in which the convex portion is water-repellent and the concave portion is hydrophilic on the entire surface of the workpiece.

  Establishing the workpiece surface reference CARE processing method means that CARE can be developed from a flat surface to a curved surface, and can also be polished. Means that. Ultra high precision (super smooth surface) free-form surface is the ultimate optical component.

  The present invention can basically be applied to mass production of a template for microreactor or cell sheet culture. In addition, since the fine structure of sub-μm order functions as a photonic crystal, it can be applied to inspection equipment such as biomarkers for checking viruses.

A, B Functional precision component 1 Base body 2 Convex part 3 Concave part 4 Stopper layer 5 Functional layer 6 Processing head 7 Functional concave part 8 Functional material 9 Plane type 10 Transfer mold 11 Cylindrical roll 12 Transfer roll 13 Elastic catalyst tool

Claims (6)

A method for producing a functional precision component in which a functional material is formed only in the concave portion of the concave-convex microstructure in the range of 10 nm to 1 mm provided on the surface of the substrate,
A catalytic substance that assists in the generation of decomposition products by hydrolysis by adsorbing by breaking back bonds between oxygen elements and other elements that constitute the workpiece by dissociating water molecules, and in the presence of water, The workpiece and the catalyst material are arranged in contact with or in close proximity to each other, the potential of the catalyst material is within a range that includes a natural potential and H ₂ and O ₂ are not generated, and the workpiece and the catalyst material are moved relative to each other. Using a processing process to remove the decomposition products from the workpiece surface,
A stopper layer forming step for forming a stopper layer having a predetermined thickness that cannot be processed by the processing process on the entire surface of the substrate;
A functional material laminating step for laminating and forming a functional material that can be processed by the processing process on the stopper layer,
A processing step of removing the functional material outside the recess by the processing process;
A manufacturing method for functional precision parts.   The functional material laminating step is a step of forming a functional layer on the stopper layer by laminating a functional material that can be processed by the processing process to a thickness that does not block the recess structure. The method for producing a functional precision component according to claim 1, wherein the functional layer has a predetermined thickness only on the inner surface of the recess. The method for producing a functional precision component according to claim 1, wherein the functional material is SiO ₂ .   The method for producing a functional precision component according to any one of claims 1 to 3, wherein a material of the stopper layer is carbon.   The method for producing a functional precision part according to claim 1, wherein the substrate is a cycloolefin polymer (COP) resin.   The functional material was produced only by the method for producing a functional precision component according to any one of claims 1 to 5, and the functional material was formed only in the concave portion of the concave-convex microstructure in the range of 10 nm to 1 mm provided on the substrate surface. Functional precision parts characterized by that.