JP2016219386A - Manufacturing method for electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic device by pressing a terminal without adverse effect on the quality of the terminal.SOLUTION: The manufacturing method manufactures using a first alignment plate 31 provided with a first hole 32 through which a terminal 13 passes, and a second alignment plate 33 provided with a second hole 34 through which the terminal 13 passes. In a first step, the first alignment plate 31 and the second alignment plate 33 are arranged such that the first hole 32 and the second hole 34 communicate, and the terminal 13 is inserted into the communicating first hole 32 and the second hole 34. In a third step, with the terminal 13 inserted into the first hole 32 and the second hole 34, the first alignment plate 31 and the second alignment plate 33 are moved in respective directions opposite to each other, thereby holding the terminal 13 with the first alignment plate 31 and the second alignment plate 33. In a fourth step, with a hold part 15 of the terminal 13 supported by the first alignment plate 31 and the second alignment plate 33, the terminal 13 is press-fitted into a through-hole 22.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a method for manufacturing an electronic device that electrically and mechanically connects two electronic components by pressing a terminal of one electronic component against the other electronic component.

  Conventionally, as an example of the above manufacturing method, there is a manufacturing method disclosed in Patent Document 1. In this manufacturing method, a plurality of flanged terminals (hereinafter referred to as terminals) extending from the housing of the press-fit connector are arranged on the through holes of the printed circuit board in a state where the flanges of the terminals are aligned on the pressing surface against which the flanges are pressed. A jig for press-fitting is used.

JP 2004-192976 A

  However, in the manufacturing method disclosed in Patent Document 1, it is difficult to secure a necessary area when arranging the terminals on the jig as the interval between the press-fit terminals becomes narrow, and the wear of each terminal and the jig, etc. As a result, the strength of the jig deteriorates, making it difficult to place each terminal at an appropriate position in the jig. In order to avoid this, it is difficult to place the jig in the jig even when a change in terminal orientation, a case of configuring a three-dimensional terminal, or the like is assumed.

  In addition, in this way, when each terminal cannot be disposed at an appropriate position with respect to the jig, each terminal is bent when each terminal is disposed on the jig or when each terminal is press-fitted into the press-fitting destination. It may adversely affect the quality.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device manufacturing method capable of pressing and connecting a terminal without adversely affecting the quality of the terminal.

In order to achieve the above object, the present invention provides:
Terminals (13, 13a to 13e, 13g1, 13g2, 13h) including projecting portions (15, 15h) projecting from the periphery and elastically deformable elastic portions (16) for electrical connection are provided. First electronic components (10, 10a to 10g),
A second electronic component (20, 20c, 20d1, 20d2, 20e, 20g) that is electrically and mechanically connected to the first electronic component by pressing the elastic portion; ,
A first alignment plate (31, 31a to 31g) provided with a first hole (32, 32f) through which a terminal passes and a second alignment plate (34, 34f) provided with a second hole (34, 34f) through which a terminal passes ( 33, 33a-33g), and
An insertion step in which the first alignment plate and the second alignment plate are arranged so that the first hole portion and the second hole portion communicate with each other, and a terminal is inserted into the communicated first hole portion and second hole portion;
The first alignment plate with the terminal inserted into the first hole and the second alignment plate with the terminal inserted into the second hole are moved in opposite directions in the orthogonal direction perpendicular to the terminal insertion direction. The terminals inserted in the first hole and the second hole in a state where the protruding portion is disposed between the elastic portion and the first and second alignment plates are connected to the first alignment plate and the second alignment plate. A holding step for holding with the alignment plate;
A pressing step of pressing the elastic portion and the second electronic component together in a state where the protruding portion of the terminal held by the first alignment plate and the second alignment plate is supported by the first alignment plate and the second alignment plate; It is characterized by having.

  As described above, the present invention manufactures an electronic device using the first alignment plate provided with the first hole portion through which the terminal passes and the second alignment plate provided with the second hole portion through which the terminal passes. Is the method. First, the present invention inserts a terminal into the first hole and the second hole. In the present invention, the first alignment plate and the second alignment plate are moved in the opposite directions, so that the terminals inserted in the first hole portion and the second hole portion are connected to the first alignment plate and the second alignment plate. And hold on. The present invention also provides the elastic portion and the second electronic component in such a state that the protruding portion of the terminal held by the first alignment plate and the second alignment plate is supported by the first alignment plate and the second alignment plate. And press each other. For this reason, in this invention, irrespective of the protrusion direction of a protrusion part, a protrusion part can be supported by a 1st alignment board and a 2nd alignment board, and a terminal and a 2nd electronic component can be pressed and connected. Therefore, the present invention can press and connect the terminal and the second electronic component without adversely affecting the quality of the terminal.

  The reference numerals in parentheses described in the claims and in this section indicate the correspondence with the specific means described in the embodiments described later as one aspect, and the technical scope of the invention is as follows. It is not limited.

It is sectional drawing which shows schematic structure of the electronic device in embodiment. It is a top view which shows schematic structure of the connector in embodiment. It is a top view which shows schematic structure of the terminal of the connector in embodiment. It is a top view which shows schematic structure of the terminal of the connector in embodiment. It is an enlarged view which shows schematic structure of the terminal of the connector in embodiment. It is sectional drawing which shows schematic structure of the manufacturing process in embodiment. It is sectional drawing which shows schematic structure of the manufacturing process in embodiment. It is a top view which shows schematic structure of the manufacturing process in embodiment. It is sectional drawing which shows schematic structure of the manufacturing process in embodiment. It is sectional drawing which shows schematic structure of the manufacturing process in embodiment. It is a top view which shows schematic structure of the manufacturing process in embodiment. It is sectional drawing which shows schematic structure of the manufacturing process in embodiment. It is a top view which shows schematic structure of the manufacturing process in embodiment. It is an expanded sectional view showing a schematic structure of a manufacturing process in an embodiment. It is a top view which shows schematic structure of the manufacturing process in embodiment. 10 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 1. FIG. 10 is a cross-sectional view illustrating a schematic configuration of a manufacturing process in Modification 2. FIG. 12 is a cross-sectional view illustrating a schematic configuration of a manufacturing process in Modification 3. FIG. 12 is a plan view showing a schematic configuration of a first alignment plate in Modification 3. FIG. 12 is a plan view showing a schematic configuration of a first alignment plate in Modification 3. FIG. FIG. 10 is a plan view illustrating a schematic configuration of a terminal in Modification 4; 10 is a cross-sectional view showing a schematic configuration of a manufacturing process in Modification 4. FIG. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 5. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 6. 12 is a cross-sectional view showing a schematic configuration of a manufacturing process in Modification 7. FIG. It is drawing which shows schematic structure of the 1st electronic component in the modification 8, and a 2nd electronic component. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 8. 10 is a diagram illustrating a schematic configuration of an electronic device according to Modification 9; 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 9. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 9. 14 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification Example 10. FIG. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 10. 14 is a cross-sectional view illustrating a schematic configuration of an electronic device according to Modification 11. FIG. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 12. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 13. 10 is a view showing a schematic configuration of a manufacturing process in Modification 14. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 15. 11 is a drawing showing a schematic configuration of a manufacturing process in Modification 16. 12 is a drawing showing a schematic configuration of a manufacturing process in Modification 17. 10 is a drawing showing a schematic configuration of a manufacturing process in Modification 18.

  Hereinafter, a plurality of embodiments (embodiments and modifications) for carrying out the invention will be described with reference to the drawings. In each embodiment, portions corresponding to the matters described in the preceding embodiment may be denoted by the same reference numerals and redundant description may be omitted. In each embodiment, when only a part of the configuration is described, the other configurations described above can be applied to other portions of the configuration.

  The present embodiment relates to a method for manufacturing the electronic device shown in FIG. As shown in FIG. 1, the electronic device includes a connector 10 corresponding to a first electronic component, a circuit board 20 corresponding to a second electronic component, and an alignment member 30.

  As shown in FIGS. 1, 2, 3, 4, and 5, the connector 10 includes a connector housing 11 and a press-fit terminal 13 (hereinafter referred to as a terminal) provided so as to protrude from the connector housing 11. Configured. In the present embodiment, a connector 10 including a plurality of terminals 13 is employed. In the present embodiment, as an example, a plurality of terminals 13 provided in multiple stages in the Z direction of the connector housing 11 and provided in the Y direction are employed. That is, in the present embodiment, as an example, the connector 10 is employed in which the terminals 13 protrude from a plurality of locations in the Z direction of the connector housing 11 and the terminals 13 protrude from a plurality of locations in the Y direction. In other words, in this embodiment, the connector 10 having a three-dimensional structure and a bent structure terminal 13 is employed.

  The terminal 13 is a terminal for electrical connection, protrudes substantially perpendicularly from the terminal protrusion 12 of the connector housing 11, and has a bent shape at the tip. As shown in FIG. 1, the terminal 13 includes a root portion protruding in the X direction from the terminal protruding portion 12 and a tip portion protruding in the Z direction from the tip of this portion. In addition, the terminal 13 includes a connecting portion that connects the root portion and the tip portion.

  Further, as shown in FIG. 5 and the like, the terminal 13 is provided with a grip portion 15 and an elastic portion 16 in a part of the base 14. The grip part 15 and the elastic part 16 can be formed by press working or the like.

  The gripping part 15 and the elastic part 16 are provided, for example, at the tip of the base body 14 opposite to the terminal protruding part 12. The elastic portion 16 is a portion that can be elastically deformed, and is a portion that is press-fitted into the through hole 22 of the circuit board 20 and is electrically and mechanically connected to the circuit board 20. The grip portion 15 is a portion that is pushed by the alignment member 30 when the elastic portion 16 is press-fitted into the through hole 22. The grip 15 is provided so as to be orthogonal to the base 14. The gripping part 15 corresponds to a protruding part. Therefore, the terminal 13 is disposed between the elastic portion 16 and the first alignment plate 31 and the second alignment plate 33 in a state where the terminal 13 is inserted into a first hole portion 32 and a second hole portion 34 described later. It can be said that it has the holding part 15 which is a site | part protruded rather than the periphery. Note that the press-fit terminals 13 such as the gripping portion 15 and the elastic portion 16 are well-known techniques, and thus detailed description thereof is omitted.

  The circuit board 20 includes a base 21 made of an insulating material such as resin or ceramics, and a through hole 22 penetrating in the thickness direction of the base 21. Further, the circuit board 20 has wiring formed on the surface and inside of the base material 21. Further, the through hole 22 corresponds to a through hole, and a plating layer which is a part of the wiring is formed on the surface.

  The circuit board 20 is electrically and mechanically connected to the connector 10 by pressing the elastic portion 16 of the terminal 13 into the through hole 22. Thus, the circuit board 20 is electrically and mechanically connected to the connector 10 by pressing the terminal 13. The circuit board 20 may be mounted with circuit elements. Thus, the circuit board 20 is a well-known technique.

  The alignment member 30 includes a first alignment plate 31 and a second alignment plate 33 as shown in FIGS. Both the alignment plates 31 and 33 are made of, for example, resin as a main component. Both alignment plates 31 and 33 are preferably made of a non-conductive resin material that is as hard as possible and hardly warps.

  The first alignment plate 31 includes a plate-shaped portion, and is provided with a first hole portion 32 through which the terminal 13 passes. That is, the first alignment plate 31 is provided with the first hole portion 32 penetrating in the thickness direction of the first alignment plate 31. The first hole portion 32 has an opening area that is sufficiently larger than the diameter of the terminal 13. That is, the first hole portion 32 has an opening area larger than the cross-sectional area of the grip portion 15 of the terminal 13. Therefore, the terminal 13 can be inserted into the first hole 32 without contacting the first alignment plate 31. Further, the first alignment plate 31 can be moved in the orthogonal direction perpendicular to the insertion direction of the terminal 13 in a state where the terminal 13 is inserted into the first hole portion 32. As an example, the first hole portion 32 has an elliptical shape, but is not limited thereto. The first hole 32 may be circular or square.

  The second alignment plate 33 includes a flat plate-shaped portion, and is provided with a second hole portion 34 through which the terminal 13 passes. Since the second alignment plate 33 is the same as the first alignment plate 31, the description thereof is omitted.

  This alignment member 30 is also a member to which an insertion load is applied when the terminals 13 are press-fitted into the through holes 22. That is, the alignment member 30 is a member for suppressing the insertion load from being applied to the terminal 13.

  Here, a method for manufacturing an electronic device will be described with reference to FIGS. This manufacturing method is a method for manufacturing an electronic device including the connector 10 and the circuit board 20 as described above, and is a manufacturing method for manufacturing using the first alignment plate 31 and the second alignment plate 33 as described above. is there.

  First, in the first step, as shown in FIGS. 6, 7, and 8, the first alignment plate 31 and the second alignment plate 33 are arranged so that the first hole portion 32 and the second hole portion 34 communicate with each other. Deploy. In the first step, the terminal 13 is inserted into the first hole portion 32 and the second hole portion 34 that communicate with each other. That is, in the first step, the terminal 13 is moved to the first hole portion 32 and the second hole portion 34 by relatively moving the connector 10 and the two alignment plates 31 and 33 in the opposite direction in the Z direction. insert. At this time, the terminal 13 is inserted into the first hole portion 32 and the second hole portion 34 so that the first alignment plate 31 and the second alignment plate 33 are positioned below the grip portion 15. Here, the elastic part 16 side is the upper side and the opposite side is the lower side with the gripping part 15 as a reference. Thus, the first step corresponds to the insertion step.

  The first step may be a step of preparing the two alignment plates 31 and 33 and the connector 10 in which the terminals 13 are inserted into the first hole portion 32 and the second hole portion 34 that communicate with each other. . That is, the two alignment plates 31 and 33 may be temporarily inserted in advance by a connector manufacturer or the like that manufactures the connector 10.

  Next, in the second step, as shown in FIGS. 9 and 10, the connector 10 with the terminals 13 inserted into the two alignment plates 31 and 33 is set on the manufacturing jig 100. The manufacturing jig 100 is a device for fixing the height (position in the Z direction) of the two alignment plates 31 and 33 and moving the two alignment plates 31 and 33. The manufacturing jig 100 includes a pedestal 110 on which the connector housing 11 is placed, a column 120 that supports the two alignment plates 31 and 33, a first pressing portion 130 that presses and moves the first alignment plate 31, and a second. And a second pressing portion 140 that is moved by pressing the alignment plate 33. The 1st press part 130 and the 2nd press part 140 are comprised so that it can move to a mutually reverse direction in a Y direction. Further, as shown in FIG. 10, the first pressing portion 130 may be provided with a recess in which the moved second alignment plate 33 is disposed at a position facing the second alignment plate 33. That is, it can be said that the recess is a part for allowing the second alignment plate 33 to move.

  Next, in the third step, as shown in FIGS. 10, 11, 12, 13, and 14, the first alignment plate 31 in which the terminals 13 are inserted into the first holes 32, and the second holes The second alignment plate 33 in which the terminals 13 are inserted is moved to 34. More specifically, in the third step, the first alignment plate 31 and the second alignment plate 33 are moved in directions opposite to each other in an orthogonal direction (Y direction) orthogonal to the insertion direction of the terminals 13. At this time, in the third step, as shown in FIGS. 10 and 11, the first pressing portion 130 and the second pressing portion 140 are moved in the opposite directions in the Y direction, and the first pressing portion 130 performs the first operation. While moving the alignment plate 31, the second pressing plate 140 moves the second alignment plate 33. In the third step, it can be said that the first alignment plate 31 and the second alignment plate 33 are slid in opposite directions.

  In the third step, by moving the first alignment plate 31 and the second alignment plate 33 in this way, the first hole portion 32 and the second hole portion 34 are shown in FIGS. The terminals 13 inserted into the first alignment plate 31 and the second alignment plate 33 are held by the first alignment plate 31 and the second alignment plate 33. In other words, in the second step, the terminals 13 are gripped by the first alignment plate 31 and the second alignment plate 33 in this way. In the second step, it can be said that the terminals 13 are sandwiched between the first alignment plate 31 and the second alignment plate 33. As a result, the terminal 13 is held at three places indicated by dotted circles as shown in FIG. The first alignment plate 31 and the second alignment plate 33 hold the terminals 13 by contacting the terminals 13 at these three locations. For this reason, in this manufacturing method, even when the size of the grip portion 15 varies, the terminal 13 can be easily held. Thus, the third step corresponds to a holding step. Further, the first alignment plate 31 and the second alignment plate 33 hold the terminals 13 so that the terminals 13 whose positions are not aligned by an external force or the like can be aligned.

  In addition, the holding | grip part 15 may be provided with the inclination part 151, as shown in FIG. That is, the length of the gripping portion 15 is shortened from the upper side to the lower side. Here, the length is a length in the direction in which the first alignment plate 31 moves when holding the terminal 13 in the grip portion 15. Since the terminal 13 is provided with the inclined portion 151, the first alignment plate 31 can be prevented from being caught on the side wall of the grip portion 15 when the first alignment plate 31 moves. In addition, the terminal 13 can be effective even if the inclined portion 151 is provided only on the side wall on the side where the first alignment plate 31 contacts.

  Next, in the fourth step, as shown in FIG. 15, in the third step, the terminals 13 and the circuit board 20 are held with the terminals 13 held by the first alignment plate 31 and the second alignment plate 33. Press each other. That is, in the fourth step, the circuit board 20 is pressed against the terminal 13 held by the first alignment plate 31 and the second alignment plate 33, and the elastic portion 16 is press-fitted into the through hole 22. At this time, in the terminal 13, the elastic portion 16 is press-fitted into the through hole 22 in a state where the grip portion 15 is supported by the first alignment plate 31 and the second alignment plate 33.

  As described above, in the fourth step, the terminals 13 that are not positioned due to an external force or the like can be press-fitted into the through holes 22 while being aligned by the first alignment plate 31 and the second alignment plate 33. An insertion load when the elastic portion 16 is press-fitted into the through hole 22 is applied to the two alignment plates 31 and 33 holding the terminal 13.

  In the fourth step, the terminals 13 are press-fit connected to the circuit board 20 in this way. In addition, this 4th process is performed using the holding jig 200, for example. In the holding jig 200, a concave portion 220 in which the tip portion of the terminal 13 can be arranged is formed in the base 210. As described above, the fourth step corresponds to a pressing step. Note that the fourth step can be said to be a pressing step, a connecting step, a press-fitting step, and the like.

  As described above, this manufacturing method includes the first alignment plate 31 provided with the first hole portion 32 through which the terminal 13 passes and the second alignment plate 33 provided with the second hole portion 34 through which the terminal 13 passes. A manufacturing method for manufacturing an electronic device. First, in the manufacturing method, the terminal 13 is inserted into the first hole portion 32 and the second hole portion 34. And this manufacturing method moves the 1st alignment plate 31 and the 2nd alignment plate 33 in the state in which the terminal 13 was inserted in the 1st hole 32 and the 2nd hole 34, and the 1st hole part The terminal 13 inserted into the second hole portion 34 is held by the first alignment plate 31 and the second alignment plate 33. In the manufacturing method, the first alignment plate 31 and the second alignment plate 33 are moved in directions opposite to each other in the orthogonal direction orthogonal to the insertion direction of the terminal 13. For this reason, this manufacturing method can suppress that the terminal 13 becomes difficult to arrange | position to an appropriate position. Therefore, this manufacturing method can press and connect the terminal 13 and the circuit board 20 without adversely affecting the quality of the terminal 13. In other words, this manufacturing method can electrically and mechanically connect the connector 10 and the circuit board 20 by pressing the elastic portion 16 into the through hole 22 without adversely affecting the quality of the terminal 13.

  As described above, this manufacturing method uses the first alignment plate 31 provided with the first hole portion 32 through which the terminal 13 passes and the second alignment plate 33 provided with the second hole portion 34 through which the terminal 13 passes. This is a manufacturing method for manufacturing an electronic device. First, in the manufacturing method, the terminal 13 is inserted into the first hole portion 32 and the second hole portion 34. In the manufacturing method, the first alignment plate 31 and the second alignment plate 33 are moved in the opposite directions, so that the terminals 13 inserted into the first hole portion 32 and the second hole portion 34 are aligned in the first alignment direction. The plate 31 and the second alignment plate 33 are held. Further, in this manufacturing method, the grip portion 15 in the terminal 13 held by the first alignment plate 31 and the second alignment plate 33 is supported by the first alignment plate 31 and the second alignment plate 33 in this manner. The elastic part 16 and the circuit board 20 are pressed against each other. For this reason, in this manufacturing method, regardless of the protruding direction of the gripping part 15, the gripping part 15 can be supported by the first alignment plate 31 and the second alignment plate 33, and the terminal 13 and the circuit board 20 can be pressed and connected. . Therefore, this manufacturing method can press and connect the terminal 13 and the circuit board 20 without adversely affecting the quality of the terminal 13.

  Furthermore, since the manufacturing method can hold the terminal 13 by moving the first alignment plate 31 and the second alignment plate 33 in the opposite directions, the holding of the terminal 13 can be simplified. In other words, the present manufacturing method can hold the terminal 13 by moving the first alignment plate 31 and the second alignment plate 33 in the opposite directions, so regardless of the shape of the connector 10, that is, the shape of the terminal 13, etc. It is easy to hold the terminal 13. That is, in this manufacturing method, even if it is the connector 10 provided with the terminal 13 of various three-dimensional structures, and the connector 10 provided with the terminal 13 of various bending structures, the terminal 13 is easy to hold | maintain. Therefore, in this manufacturing method, it can suppress manufacturing the jig | tool holding a terminal for every shape of the connector 10. FIG. For this reason, in this manufacturing method, the restriction of the product structure can be expected.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention. Below, the modifications 1-18 of this invention are demonstrated. The above-described embodiment and Modifications 1 to 18 can be implemented independently, but can also be implemented in combination as appropriate. The present invention is not limited to the combinations shown in the embodiments, and can be implemented by various combinations.

(Modification 1)
As illustrated in FIG. 16, the electronic device according to the first modification may include a spacer 40 that is a member for suppressing the movement of the alignment member 30. The spacer 40 is sandwiched between the circuit board 20 and the first alignment plate 31 and presses the alignment member 30 against the terminal 13. Thereby, even if the alignment member 30 is arrange | positioned between the circuit board 20 and the connector housing 11, the electronic device can suppress that the alignment member 30 moves. In addition, the electronic device can achieve the same effect even if a convex portion protruding from the periphery is provided on the side of the circuit board 20 facing the first alignment plate 31. In addition, the modification 1 can have the same effect as the said embodiment.

(Modification 2)
In the second modification, as shown in FIG. 17, an alignment member 30a including a first alignment plate 31a having a first convex portion 35a and a second alignment plate 33a having a second convex portion 36a is used. Furthermore, in the modification 2, the manufacturing jig 100a is used. The manufacturing jig 100a is different from the manufacturing jig 100 in that the first pressing part 130 and the second pressing part 140 are not provided. In FIG. 17, the upper part is a cross-sectional view showing the first process, the middle part is a cross-sectional view showing the third process, and the lower part is a cross-sectional view showing the fourth process.

  The 1st convex part 35a is a site | part pressed when moving the 1st alignment board 31a. On the other hand, the 2nd convex part 36a is a site | part pressed when moving the 2nd alignment board 33a. Modification 2 can achieve the same effects as those of the above embodiment. Furthermore, since the modified example 2 includes the first convex portion 35a and the second convex portion 36a as compared with the above-described embodiment, the pressing area when the first alignment plate 31a and the second alignment plate 33a are moved. It is easy to move the first alignment plate 31a and the second alignment plate 33a.

(Modification 3)
In Modification 3, as shown in FIGS. 18, 19, and 20, an alignment member 30 b including a first alignment plate 31 b and a second alignment plate 33 b having a second convex portion is used. Furthermore, in the third modification, the manufacturing jig 100b having the column 120b that is movable in the orthogonal direction perpendicular to the insertion direction of the terminal 13 is inserted into the first alignment plate 31b and the second alignment plate 33b. Use. In FIG. 18, the upper part is a cross-sectional view showing the first process, the middle part is a cross-sectional view showing the third process, and the lower part is a cross-sectional view showing the fourth process. Since the 2nd convex part of the 2nd alignment board 33b is the same as the 2nd convex part 36a of the 2nd alignment board 33a, illustration is abbreviate | omitted.

  The manufacturing jig 100b includes a column 120b for moving the first alignment plate 31b and a column 120b for moving the second alignment plate 33b. The manufacturing jig 100 b is different from the manufacturing jig 100 in that a column 120 b is provided instead of the first pressing portion 130 and the second pressing portion 140. The support column 120b for moving the first alignment plate 31b and the support column 120b for moving the second alignment plate 33b are movable in directions opposite to each other in the orthogonal direction orthogonal to the insertion direction of the terminal 13. The manufacturing jig 100b moves the first alignment plate 31b and the second alignment plate 33b by moving the support column 120b. Moreover, the support | pillar 120b is provided with the protrusion 121b at the tip.

  As shown in FIG. 19, the first alignment plate 31 b is provided with a first insertion hole 35 b into which the protrusion 121 b of the column 120 b for moving the first alignment plate 31 b is inserted in addition to the first hole portion 32. . The first alignment plate 31b moves together with the support 120b when the support 120b inserted in the first insertion hole 35b moves.

  As shown in FIG. 20, the second alignment plate 33 b is provided with second insertion holes 36 b 1 and 36 b 2 into which the support columns 120 b are inserted in addition to the second holes 34. In one second insertion hole 36b1, the protrusion 121b of the column 120b for moving the second alignment plate 33b is inserted. The other support hole 120b for moving the first alignment plate 31b is inserted into the other second insertion hole 36b2. When the column 120b inserted in the second insertion hole 36b1 moves, the second alignment plate 33b moves together with the column 120b. However, the second alignment plate 33b does not move even when the column 120b inserted in the second insertion hole 36b2 moves. That is, the opening area of the second insertion hole 36b2 is larger than that of the second insertion hole 36b1. Therefore, the second alignment plate 33b does not move even if the support column 120b that moves the first alignment plate 31b moves. Modification 3 can achieve the same effects as the above embodiment.

(Modification 4)
In the fourth modification, as shown in FIG. 21, the connector 10 in which the terminals 13 are partially reduced is used in order to prevent the two alignment plates 31 and 33 from warping during the fourth step. That is, as shown in FIG. 21, the connector 10 has a region A1 where the terminals 13 are not provided. FIG. 21 is a plan view corresponding to FIG. Thus, in the present manufacturing method, it is difficult to apply an insertion load to a portion of the two alignment plates 31 and 33 facing the region A1 in the fourth step. Therefore, this manufacturing method can suppress that the two alignment plates 31 and 33 warp. In addition, as shown in FIG. 21, the connector 10 preferably forms a region A1 near the center of a terminal group in which a plurality of terminals 13 are gathered.

  Furthermore, in the modification 4, as shown in FIG. 22, it is preferable to use a manufacturing jig 100c provided with a warp prevention pin 120c. The manufacturing jig 100c is different from the manufacturing jig 100 in that the manufacturing jig 100c includes a warp prevention pin 120c. In addition, in FIG. 22, illustration of the 1st press part 130 and the 2nd press part 140 is abbreviate | omitted. The warp prevention pin 120c supports a portion of the two alignment plates 31 and 33 that faces the region A1. Thereby, this manufacturing method can further suppress that the two alignment plates 31 and 33 warp. In FIG. 22, the upper part is a cross-sectional view showing the first process, the middle part is a cross-sectional view showing the third process, and the lower part is a cross-sectional view showing the fourth process.

  Modification 4 can achieve the same effects as those of the above embodiment. Furthermore, the modification 4 can suppress that the two alignment plates 31 and 33 warp as mentioned above. In Modification 4, when the manufacturing jig 100c having the warp prevention pin 120c supporting the vicinity of the center of the XY plane of the two alignment plates 31 and 33 is used, the warp can be suppressed without forming the region A1. .

(Modification 5)
In the modification 5, as shown in FIG. 23, the connector 10a having the terminals 13a in which the orientations of the grip portion 15 and the elastic portion 16 are different is employed. The terminal 13 a is obtained by rotating the grip portion 15 by 90 degrees with respect to the terminal 13.

  FIG. 23 is a plan view showing the connector in the upper stage, the cross-sectional view showing the first process in the middle stage, and the cross-sectional view showing the third process in the lower stage. In the upper stage, the left frame corresponds to FIG. 2, and the right frame corresponds to FIG. In the middle stage, the left frame corresponds to FIG. 6, the center frame corresponds to FIG. 7, and the right frame corresponds to FIG. In the lower stage, the left frame corresponds to FIG. 12, and the right frame corresponds to FIG.

  Modification 5 can achieve the same effects as the above embodiment. That is, as described above, in the present manufacturing method, since the terminal 13a is sandwiched and held between the two alignment plates 31 and 33, even the terminal 13a can be held. Thus, this manufacturing method can widen the tolerance | permissible_range of the arrangement direction of the terminal 13a. In other words, the present manufacturing method can hold the terminal 13a without depending on the orientation of the grip portion 15.

(Modification 6)
In Modification 6, as shown in FIG. 24, a connector 10b in which the second alignment plate 33c is integrated is employed. That is, in Modification 6, the alignment member 30c includes a first alignment plate 31c and a second alignment plate 33c integrated with the connector 10b. The first alignment plate 31 c is the same as the first alignment plate 31.

  FIG. 24 is a plan view showing the connector in the upper stage, a cross-sectional view showing the third process in the middle stage, and a cross-sectional view showing the fourth process in the lower stage. In the upper part, the left frame corresponds to FIG. 2, and the right frame is a left view of the left frame.

  Modification 6 can achieve the same effects as the above embodiment. Furthermore, in the modified example 6, it is possible to prevent the second alignment plate 33c from moving with respect to the connector housing 11 and the circuit board 20.

(Modification 7)
In the modified example 7, as shown in FIG. 25, a second alignment having a first alignment plate 31d having an inclined portion 32d1 having an inclined wall surface facing the through hole and an inclined portion 34d1 having an inclined wall surface facing the through hole. A plate 33d is employed. The first alignment plate 31d and the second alignment plate 33d are stacked.

  In the first alignment plate 31d, an inclined portion 32d1 is formed on the wall surface of the through hole on the moving direction side. The first alignment plate 31d is formed by the inclined portion 32d1 so that the opening area of the through hole becomes wider as the distance from the second alignment plate 33d increases.

  Similarly, in the second alignment plate 33d, an inclined portion 34d1 is formed on the wall surface of the through hole on the moving direction side. The second alignment plate 33d is formed by the inclined portion 34d1 so that the opening area of the through hole becomes narrower as the distance from the first alignment plate 31d increases.

  Further, in the modified example 7, the pressing member 100d is employed as a member for moving the first alignment plate 31d and the second alignment plate 33d. The pressing member 100d includes a member that moves the first alignment plate 31d and a member that moves the second alignment plate 33d. Each pressing member 100d moves in the vertical direction with respect to the first alignment plate 31d and the second alignment plate 33d. Further, the pressing member 100d that moves the first alignment plate 31d moves while being in contact with the inclined portion 32d1. Similarly, the pressing member 100d that moves the second alignment plate 33d moves in the state of the inclined portion 34d1.

  That is, in the modified example 7, the first alignment plate 31d and the second alignment plate 33d are moved in a direction orthogonal to the moving direction of the pressing member 100d. Therefore, it can be said that the first alignment plate 31d and the second alignment plate 33d are formed with the inclined portions 32d1 and 34d1 for moving in the direction orthogonal to the moving direction of the pressing member 100d.

  FIG. 25 is a cross-sectional view showing the third step in the upper stage, and a cross-sectional view showing the fourth step in the lower stage. Modification 7 can achieve the same effects as those of the above embodiment. Furthermore, in the modified example 7, the movement direction on the manufacturing apparatus side is reduced, resulting in cost reduction and constraint relaxation.

  Furthermore, a spacer 37 may be provided between the first alignment plate 31d and the second alignment plate 33d. The spacer 37 is provided on at least one of the first alignment plate 31d and the second alignment plate 33d. Thereby, the first alignment plate 31d and the second alignment plate 33d can reduce friction with each other when moving. In other words, the spacer 37 for reducing mutual friction is provided between the first alignment plate 31d and the second alignment plate 33d.

(Modification 8)
In the modification 8, as shown in FIGS. 26 and 27, as the first electronic component, a housing 10c that includes the terminal 13 and accommodates the circuit board 20c is employed. The housing 10 c is provided with a terminal 13 through a part of the box member 17. The box member 17 has, for example, a bottom surface and four side walls, and a connector portion is provided on one side wall. The box member 17 has an opening in the opposite area on the bottom. Further, the box member 17 is provided with a terminal 13 at the connector portion. For example, the terminal 13 is insert-molded in the box member 17. Reference numeral 17a is a protrusion for supporting the alignment member 30b.

  Moreover, in the modification 8, as shown to FIG. 26, FIG. 27, the circuit board 20c is employ | adopted as a 2nd electronic component. The circuit board 20c is different from the circuit board 20 in that a support 120b for moving the first alignment plate 31b and a through hole 23 into which the support 120b for moving the second alignment plate 33b is inserted are provided. The through hole 23 c is the same as the through hole 22.

  In this modification, the alignment member 30b and the support 120b described in Modification 3 are used. However, in this modification, the insertion direction of the column 120b with respect to the two alignment plates 31b and 33b is opposite to that in Modification 3. Further, in the present modification, the pressing jig 200 is used. The holding jig 200 may include a mechanism for holding the circuit board 20c by suction or the like. That is, the holding jig 200 may convey the circuit board 20c into the housing 10c while holding the circuit board 20c.

  FIG. 26 is a cross-sectional view showing the casing 10c in the upper stage, the middle view is an A view of the upper stage, and the lower stage is a plan view showing the circuit board. FIG. 27 is a plan view showing the first step in the upper stage, a sectional view showing the third process from the second section from above, and a sectional view showing the fourth process in the third stage from the top. The lower stage is a cross-sectional view showing a pressing jig removing process. In the upper part of FIG. 27, the middle frame is a left view A view, and the right frame is a middle view B view. In addition, the broken line surrounding the through hole 22c in FIG. 27 shows the range where the pressing jig 200 presses.

  Thus, in the modification 8, the alignment member 30b and the circuit board 20c are put in the box member 17 from the opening of the housing 10c. And in the modification 8, while moving the 1st alignment board 31b and the 2nd alignment board 33b from opening of the housing | casing 10c, in order to press-fit the elastic part 16 to the through hole 22c, the circuit board 20c is pressed.

  In the modification 8, the same effect as the above embodiment can be obtained. Further, the casing 10c as described above usually requires a member for holding the terminal 13 in the region A2 or the like when the elastic portion 16 of the terminal 13 is press-fitted into the through hole 22c of the circuit board 20c. In this case, the cost increases and it is difficult to obtain the position accuracy. However, in the modification 8, it is not necessary to provide the member which hold | maintains the terminal 13 in area | region A2 by employ | adopting the said manufacturing method. Note that the first alignment plate 31b and the second alignment plate 33b remain between the protrusion 17a and the circuit board 20c, but are not fixed to the housing 10c or the circuit board 20c, and thus are deformed due to thermal expansion or the like. However, restraining the terminal 13 can be suppressed.

(Modification 9)
In Modification 9, as shown in FIGS. 28, 29, and 30, a housing 10d that includes a terminal 13 and accommodates two circuit boards 20d1 and 20d2 is employed as the first electronic component. The housing 10 d is provided with a terminal 13 b through a part of the box member 18. The box member 18 has, for example, a bottom surface and four side walls, and a connector portion is provided on one side wall. And the box member 18 has the opposing area | region of the bottom face opened. Further, the box member 18 is provided with a terminal 13b at the connector portion. The terminal 13b is insert-molded in the box member 18, for example. Reference numeral 18a denotes a protrusion for supporting the circuit board 20d1. Reference numeral 18b is a protrusion for supporting the alignment member 30b. Reference numeral 18c is a protrusion for supporting the circuit board 20d2.

  Each terminal 13b is different from the terminal 13 in that elastic portions 161 and 162 are provided at two locations. The elastic part 161 is press-fitted into the through hole 22d1 of the circuit board 20d1. On the other hand, the elastic part 162 is press-fitted into the through hole 22d2 of the circuit board 20d2. Further, the elastic portion 162 is made smaller than the elastic portion 161 so that the pressing jig 200a and the two alignment plates 31e and 33e do not come into contact with each other.

  In this modified example, first, as shown in FIG. 29, the circuit board 20d1 is disposed in the housing 10d, and the elastic portion 161 is press-fitted into the through hole 22d1 of the circuit board 20d1. That is, the first step, the second step, and the third step are performed.

  Here, the alignment member 30e and the holding jig 200a are used. The alignment member 30e includes a first alignment plate 31e and a second alignment plate 33e. As in the second modification, the first alignment plate 31e and the second alignment plate 33e are provided with portions to be pressed when moved. On the other hand, the holding jig 200a is configured to hold the circuit board 20d1 by suction or the like.

  As shown in the second stage from the top in FIG. 29, the holding jig 200a moves the circuit board 20d1 from the opening side of the box member 18 to the bottom side while holding the circuit board 20d1. At this time, the terminal 13b is inserted into the through hole 22d1 of the circuit board 20d1. Further, the holding jig 200a and the circuit board 20d1 can pass through without being caught by the elastic portion 162.

  Next, as shown in the third row from the top in FIG. 29, the first step is performed. At this time, the two alignment plates 31e and 33e can pass through without being caught by the elastic portion 162. The alignment member 30e holds the terminal 13b in a state where the holding jig 200a is disposed between the alignment member 30e and the circuit board 20d1.

  Then, as shown in the lower part of FIG. 29, the third step and the fourth step are performed. The holding jig 200a presses the circuit board 20d1 in a state where the terminals 13b are held by the alignment member 30e on the side opposite to the circuit board 20d1 with respect to itself. At this time, an insertion load from the opening toward the bottom surface is applied to the terminal 13b by the pressing jig 200a pushing the circuit board 20d1 toward the bottom surface side. However, the terminal 13b is held by the first alignment plate 31e and the second alignment plate 33e, and the grip portion 15 is supported by the first alignment plate 31e and the second alignment plate 33e. Therefore, the insertion load is applied to the alignment member 30e. In this manner, the circuit board 20d1 can be disposed in the housing 10d, and the elastic portion 161 can be press-fitted into the through hole 22d1 of the circuit board 20d1.

  29 is a drawing showing the housing 10d, the middle frame is an A view of the left frame, and the right frame is a B view of the left frame. The second row from the top in FIG. 29 is a C view drawing of the left frame and the right frame is a D view drawing of the left frame, as in the upper row. The third row from the top in FIG. 29 is an E view drawing of the left frame, and the right frame is an F view drawing of the left frame, as in the upper row.

  Next, in this modification, as shown in FIG. 30, the circuit board 20d2 is disposed in the housing 10d, and the elastic portion 162 is press-fitted into the through hole 22d2 of the circuit board 20d2. That is, the first step, the second step, and the third step are performed. Further, the connection method between the circuit board 20d2 and the housing 10d is the same as that in the third modification. When the elastic portion 162 is press-fitted into the through hole 22d2 of the circuit board 20d2, the first step is performed after removing the alignment member 30e and the holding jig 200a as shown in the upper part of FIG.

  30 is a drawing showing a process of removing the alignment member 30e and the holding jig 200a, with the middle frame being the A view of the left frame and the right frame being the B view of the left frame. Further, the second stage from the top in FIG. 30 is a drawing showing the first step, the middle frame is a C view drawing of the left frame, and the right frame is a D view drawing of the left frame. The third row from the top in FIG. 30 is a drawing showing the third step, in which the middle frame is an E view drawing of the left frame, and the right frame is an F view drawing of the left frame. And the lower part of FIG. 30 is drawing which shows a 4th process, A right frame is G view drawing of a left frame.

  Thus, in the modified example 9, by repeating the first step, the second step, and the third step, the two circuit boards 20d1 and 20d2 are accommodated in the housing 10d, and the two circuit boards 20d1 and 20d2 are stored. And a terminal 13b can be press-fit connected. The circuit board 20d2 may be assembled to the protrusion 18c of the box member 18 with screws or caulking. Modification 9 can achieve the same effects as those of the above embodiment.

(Modification 10)
In Modification 10, as shown in FIG. 31, a circuit board 10e provided with terminals 13c is employed as the first electronic component. The circuit board 10e is provided with a through-hole, like the circuit board 20. The circuit board 10e is fixed by inserting one end of the terminal 13c into the through hole. Unlike the terminal 13 or the like, the terminal 13c has a linear shape.

  Moreover, in the modification 10, the circuit board 20e provided with the through hole 22 into which the elastic part 16 of the terminal 13c is press-fitted is adopted as the second electronic component. The circuit board 20e is the same as the circuit board 20c.

  And in the modification 10, as shown in FIG. 32, the 1st process, the 3rd process, and the 4th process are performed using the alignment member 30b and the pressing jig 200, and the circuit board 10e is connected to the circuit board 10e as described above. 20e is connected. That is, the elastic portion 16 of the terminal 13c is press-fitted into the through hole of the circuit board 20e. Modification 10 can achieve the same effects as the above embodiment.

(Modification 11)
As shown in Modification 11 in FIG. 33, the terminal 13d may have a bent shape or the like, unlike the terminal 13c. That is, in this manufacturing method, even the terminal 13d can be held. Here, as an example, an example in which the terminal 13d is held by the alignment member 30b is employed. Modification 11 can achieve the same effects as Modification 10.

(Modification 12)
In Modification 12, as shown in FIG. 34, an alignment member 30f including a first alignment plate 31f and a second alignment plate 33f is used. In the electronic device manufactured by the manufacturing method of Modification 12, the first alignment plate 31f and the second alignment plate 33f do not remain. For this reason, the first alignment plate 31f and the second alignment plate 33f may be configured with metal as a main component.

  The first alignment plate 31f is formed with a first hole 32f that is a recess. Similarly, the second alignment plate 33f is formed with a second hole 34f that is a recess. The first alignment plate 31f and the second alignment plate 33f sandwich the terminal 13 between the first hole portion 32f and the second hole portion 34f. In Modification 12, as shown in FIG. 34, the terminal 13 is held using the first alignment plate 31f and the second alignment plate 33f. Modification 12 can achieve the same effects as the above embodiment.

  34 shows the connector 10 and is the same as FIG. 2 and FIG. Further, the second row from the top in FIG. 34 shows the terminals 13, the first alignment plate 31f, and the second alignment plate 33f. And the 3rd step | paragraph from the top of FIG. 34 is drawing which shows a 1st process. The lower part of FIG. 30 is a drawing showing the third step and the fourth step.

(Modification 13)
In Modification 13, as shown in FIG. 35, the connector 10a is held by the first alignment plate 31f and the second alignment plate 33f. The modification 13 can have the same effect as the above embodiment. Further, the modified example 13 can achieve the same effects as the modified example 5.

(Modification 14)
In the modified example 14, as shown in FIG. 36, the first electronic component can be connected to the holder 11f that can hold the circuit element 10f1 having the rod-like element side terminal 13f1 protruding from the periphery, and the element side terminal 13f1. A structure 10f having a large terminal 13e is employed. Moreover, in the modification 14, the circuit board 20f is employ | adopted as a 2nd electronic component.

  The circuit element 10f1 includes a rod-shaped element-side terminal 13f1 protruding from the periphery, and for example, a capacitor can be used. The circuit element 10f1 is held by the holding portion 11f1 of the holder 11f, and the element side terminal 13f1 is press-fitted into the press-fit portion 16e.

  The holder 11f of the structure 10f is a resinous member, and a holding portion 11f1 that is a depression corresponding to the shape of the circuit element 10f1 is formed. The holder 11f is fixed to the circuit board 20f by inserting a resinous fixing member 11f2 into the through hole of the circuit board 20f.

  As shown in the middle frame of FIG. 36, the terminal 13e has an elastic portion 16 provided at one end thereof fixed to the circuit board 20f, and a press-fit insertion in which the element side terminal 13f1 is press-fitted into the other end. A portion 16e is provided. Further, the terminal 13 e is provided with a gripping part 15 like the terminal 13.

  The circuit board 20f is a circuit board on which the structure 10f is mounted and a through hole 22f into which the elastic portion 16 is press-fitted is provided. Further, the circuit board 20f is provided with a through hole into which the fixing member 11f2 of the holder 11f is inserted.

  And in the modification 14, as shown in the upper frame of FIG. 36, the left frame of a middle stage, and the right frame, a 1st process-a 4th process are performed. In the modification 14, the alignment member 30g including the first alignment plate 31g and the second alignment plate 33g is used. The first alignment plate 31g and the second alignment plate 33g hold the terminal 13e when the terminal 13e is press-fitted into the circuit board 20f. The first alignment plate 31g and the second alignment plate 33g are the same as the first alignment plate 31f and the second alignment plate 33f. The first alignment plate 31g and the second alignment plate 33g are different from the first alignment plate 31f and the second alignment plate 33f in the number of first holes and second holes. Therefore, the description regarding the first alignment plate 31g and the second alignment plate 33g is omitted. Further, in the fourth step, the elastic portion 16 is press-fitted into the through hole 22f by pressing the terminal 13e and the circuit board 20f together.

  Thereafter, in the modified example 14, the fifth step is performed as shown in the lower part of FIG. In the fifth step, the circuit element 10f1 is mounted on the holding portion 11f1. In the fifth step, the element side terminal 13f1 is pressed against the terminal 13e by pressing the terminal 13e and the circuit element 10f1 together. That is, in the fifth step, the element side terminal 13f1 is press-fitted into the press-fit portion 16e of the terminal 13e. As described above, in the modified example 14, after the pressing process, the element side terminal 13f1 and the terminal 13e are electrically and mechanically connected while the circuit element 10f1 is mounted on the holder 11f. The fifth step corresponds to a connection step. The modification 14 can also be said to be a press-fit connection method for odd-shaped electronic components.

  36, the middle frame is a left view A view drawing, and the right frame is a left frame B view drawing. The lower part of FIG. 36 is a C view drawing in which the right frame is the left frame.

  The modification 14 can have the same effect as the above embodiment. Further, in the modified example 14, it is not necessary to worry about the composite positional relationship between the terminal 13e and the circuit board 20f, the circuit board 20f and the fixing member 11f2, the fixing member 11f2 and the terminal 13e, and a plurality of connecting portions having different materials. . In the modified example 14, in a state where the circuit element 10f1 is held by the holding portion 11f1, the element-side terminal 13f1 becomes the position of the press-fit portion 16e and is collectively processed.

(Modification 15)
In the modification 15, as shown in FIG. 37, the structure 10g is employ | adopted as a 1st electronic component. The structure 10g includes a circuit element 10g1 including a rod-shaped element side terminal 13g1 protruding from the periphery, a holder 10g2 holding the circuit element 10g1, a terminal 13g2 connected to the element side terminal 13g1, and including the elastic portion 16. Have As shown in the lower middle frame of FIG. 37, the holder 10g2 is provided with a guide portion 10g3 in which a hole through which the terminal 13g2 can pass is formed. Specifically, the guide portion 10g3 is provided with a hole through which the terminal 13g2 can pass without restraining the terminal 13g2. The guide portion 10g3 may not be provided.

  Moreover, in the modification 15, the circuit board 20g in which the structure 10g is mounted and the through hole 22g in which the elastic part 16 is press-fitted is provided as the second electronic component. The structural body 10g is fixed to the circuit board 20g by inserting the resinous fixing member 10g4 into the through hole 22g1 of the circuit board 20g.

  Thus, the modification 15 has the same components as the modification 14. However, the modification 15 differs in the manufacturing process. In the modified example 15, as shown in the lower part of FIG. 37, the terminal 13g2 is press-fitted into the through hole 22g while the terminal 13g2 of the structure 10g is held by the first alignment plate 31g and the second alignment plate 33g. That is, in the fourth step, the structure 10g is mounted on the circuit board 20g, thereby pressing the terminals 13g2 and the circuit board 20g together and press-fitting the elastic portion 16 into the through hole 22g.

  Modification 15 can achieve the same effects as those of the above embodiment. Since the terminal 13g2 is held by the first alignment plate 31g and the second alignment plate 33g, the position is determined when the structure 10g is mounted on the circuit board 20g. Further, the holding jig 200 may employ a soldering iron or a resistance welding iron. Accordingly, the fourth step can be performed while the element side terminal 13g1 and the terminal 13g2 are connected, and the steps can be integrated.

(Modification 16)
In the modified example 16, as shown in FIG. 38, the guide portion 10g3 may be sandwiched between the first alignment plate 31g and the second alignment plate 33g. Modification 16 can achieve the same effects as the above embodiment and Modification 15. The right frame in FIG. 38 is a view of the left frame as viewed from the A side.

(Modification 17)
In the modified example 17, as shown in FIG. 39, the terminal 13 is held by the third alignment plate 38 in addition to the first alignment plate 31 and the second alignment plate 33. That is, the alignment member of this modification includes the first alignment plate 31, the second alignment plate 33, and the third alignment plate 38. The third alignment plate 38 is the same as the first alignment plate 31 and the second alignment plate 33, and a third hole 39 is formed.

  In the third step, the third alignment plate 38 is moved in the same direction as the first alignment plate 31 and in the opposite direction to the second alignment plate 33. Moreover, at the time of the 4th process, the holding part 15 is pressed with the 1st alignment board 31 similarly to the said embodiment. Therefore, the alignment member of this modification can hold the terminals 13 at four points. Thereby, in this modification, the gripping stability can be improved as compared with the case where the first alignment plate 31 and the second alignment plate 33 hold the terminals 13. That is, the terminal 13 may be inclined by holding the terminal 13 with the first alignment plate 31 and the second alignment plate 33. However, in the present modification, it is possible to suppress the tilting of the terminal 13 as compared with the case where the terminal 13 is held by the first alignment plate 31 and the second alignment plate 33.

  The modification 17 can have the same effect as the above embodiment. This modification can also be adopted in the above-described embodiment and modification. Moreover, this manufacturing method may hold | maintain the terminal 13 using four or more alignment boards.

(Modification 18)
In Modification 18, as shown in FIG. 40, a terminal 13h including a gripping portion 15h is employed. Further, the alignment member of the present modification includes the first alignment plate 31 and the second alignment plate 33 as in the above embodiment.

  The terminal 13 h has a grip portion 15 h including a portion that contacts the first alignment plate 31 and a portion that contacts the second alignment plate 33. That is, the grip portion 15 h has a thickness on the side in contact with the second alignment plate 33 larger than the thickness on the side in contact with the first alignment plate 31.

  Therefore, this modification can hold the terminal 13h at four points while using two of the first alignment plate 31 and the second alignment plate 33. For this reason, in this modification, the holding stability can be improved as compared with the above embodiment while the terminals 13 are held by the first alignment plate 31 and the second alignment plate 33. That is, in this modification, it can suppress that terminal 13h inclines rather than the said embodiment.

  The modification 17 can have the same effect as the above embodiment. This modification can also be adopted in the above-described embodiment and modification.

  DESCRIPTION OF SYMBOLS 10 Connector, 11 Connector housing, 12 Terminal protrusion part, 13 Press fit terminal, 14 Base | substrate, 15 Gripping part, 16 Elastic part, 20 Circuit board, 21 Base material, 22 Through hole, 30 Alignment member, 31 1st alignment board, 32 1st hole, 33 2nd alignment plate, 34 2nd hole

Claims (7)

Terminals (13, 13a to 13e, 13g1, 13g2, 13h) including projecting portions (15, 15h) projecting from the periphery and elastically deformable elastic portions (16) for electrical connection are provided. First electronic components (10, 10a to 10g),
A second electronic component (20, 20c, 20d1, 20d2, 20e to 20g) electrically and mechanically connected to the first electronic component by pressing the elastic portion; There,
A first alignment plate (31, 31a to 31g) provided with a first hole (32, 32f) through which the terminal passes and a second alignment provided with a second hole (34, 34f) through which the terminal passes. It is a method of manufacturing using a board (33, 33a-33g),
The first alignment plate and the second alignment plate are arranged so that the first hole portion and the second hole portion communicate with each other, and the terminal is connected to the communicated first hole portion and the second hole portion. Inserting step of inserting,
The first alignment plate in which the terminals are inserted into the first hole portions and the second alignment plate in which the terminals are inserted into the second hole portions in an orthogonal direction orthogonal to the insertion direction of the terminals. By moving the projections in opposite directions, the protrusions are disposed between the elastic part, the first alignment plate, and the second alignment plate. A holding step of holding the inserted terminal with the first alignment plate and the second alignment plate;
The elastic portion and the second electronic component in a state where the protruding portion of the terminal held by the first alignment plate and the second alignment plate is supported by the first alignment plate and the second alignment plate. And a pressing step for pressing the two together. A method for manufacturing an electronic device. The first electronic component (10, 10a, 10b) is a connector including the terminal (13, 13a) including the elastic part (16),
The second electronic component (20) is a circuit board provided with a through hole (22) into which the elastic portion is press-fitted,
2. The method of manufacturing an electronic device according to claim 1, wherein, in the pressing step, the elastic portion is press-fitted into the through hole by pressing the terminal and the second electronic component together. The first electronic component (10c, 10d) is a housing that includes the terminal (13, 13b) including the elastic portion (16) and accommodates the second electronic component,
The second electronic components (20c, 20d1, 20d2) are circuit boards provided with through holes (22c, 22d1, 22d2) into which the elastic portions are press-fitted,
2. The method of manufacturing an electronic device according to claim 1, wherein, in the pressing step, the elastic portion is press-fitted into the through hole by pressing the terminal and the second electronic component together. The first electronic component (10e) is a circuit board including the terminals (13c, 13d) including the elastic part (16),
The second electronic component (20e) is a circuit board provided with a through hole (22) into which the elastic portion is press-fitted,
2. The method of manufacturing an electronic device according to claim 1, wherein, in the pressing step, the elastic portion is press-fitted into the through hole by pressing the terminal and the second electronic component together. The first electronic component (10f) includes a holder (10f) capable of holding a circuit element (10f1) having a rod-shaped element side terminal (13f1) protruding from the periphery, and the first electronic component (10f) connectable to the element side terminal A structure having a terminal (13e),
The second electronic component (20f) is a circuit board on which the structure is mounted and a through hole (22f) into which the elastic portion is press-fitted is provided.
2. The method of manufacturing an electronic device according to claim 1, wherein, in the pressing step, the elastic portion is press-fitted into the through hole by pressing the terminal and the second electronic component together.   6. The electronic device according to claim 5, further comprising a connecting step of connecting the element-side terminal and the terminal while mounting the circuit element (10f1) on the holder (10f) after the pressing step. Device manufacturing method. The first electronic component (10g) includes a circuit element (10g1) having a rod-shaped element side terminal (13g1) protruding from the periphery, a holder (10g2) holding the circuit element, and the element side terminal. A structure having the terminal (13g2) connected;
The second electronic component (20g) is a circuit board on which the structure is mounted and a through hole (22g) into which the elastic portion is press-fitted is provided.
2. The pressing step includes mounting the structural body on the circuit board to press the terminals and the second electronic component together, and press-fit the elastic portion into the through hole. The manufacturing method of the electronic device as described in 2.

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