JP2018116978A - Manufacturing method of semiconductor device and terminal fixture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the failure that a tip part of each of a plurality of press-fit terminals is difficult to insert into a hole part of a control substrate.SOLUTION: A manufacturing method of a semiconductor device comprises preparation steps (steps S100 and S102) of preparing an assemble component having a housing, a semiconductor chip arranged in an opening of the housing, and a plurality of press-fit terminals that includes a tip terminal and a root part, and in which the root part is connected to the housing; a terminal fixing step (step S104) of fixing the tip part after the preparation steps, in a state where the opening of the housing is opened by attaching a terminal fixture having a plurality of tip fixture holes for fitting each tip part of the plurality of press-fit terminals to the assembly component; a potting step (step S106) of charging a thermoset resin into the opening of the housing after the terminal fixing step; a heating step (step S108) of hardening the thermoset resin after the potting step by heating the assembly component; and a jig detachment step (step S112) of detaching the terminal fixture after the thermoset resin heated in the heating step has cooled.SELECTED DRAWING: Figure 12

Description

  The present invention relates to a semiconductor device manufacturing method and a terminal fixing jig.

  Conventionally, for example, as described in International Publication No. 2014/132803, a power semiconductor device including a plurality of press-fit terminals extending above a housing is known. The housing includes a resin side wall, and a plurality of press-fit terminals extend from the side wall to the top of the housing. A semiconductor chip is mounted in the housing. The inside of the housing is sealed with a thermosetting resin.

International Publication No. 2014/132803

  After filling the casing with the thermosetting resin, heat treatment is performed to cure the thermosetting resin. After the heat treatment, the thermosetting resin is cooled. The case is distorted by the change in temperature of the case in the process from the heat treatment to the cooling. If the press-fit terminal cannot maintain the initial position and mounting angle due to distortion of the housing, the tip of the press-fit terminal will be displaced.

  A control board prepared separately as a connected device is attached to this type of power semiconductor device. The control board is provided with an insertion hole for inserting the tip end portion of the press-fit terminal. By inserting a press-fit terminal into this insertion hole, electrical connection is made between the control board and the semiconductor device without soldering, and both are integrated. By adopting the press-fit terminal, higher positional accuracy than before is required in the control board mounting operation. As a result, the problem that the control board cannot be connected due to the position of the tip end of the press-fit terminal greatly deviating from the design position has become apparent.

  The present invention has been made to solve the above-described problems, and a method of manufacturing a semiconductor device capable of suppressing defects in which the tip portions of a plurality of press-fit terminals are difficult to be inserted into holes of a control board. And it aims at providing a terminal fixture.

A method for manufacturing a semiconductor device according to the present invention includes:
A housing having a bottom portion and a resin side wall portion, a semiconductor chip disposed in an opening formed by the bottom portion and the side wall portion, and a tip portion and a root portion, and the root portion is connected to the side wall portion A preparatory step of preparing an assembly including a plurality of press-fit terminals,
After the preparation step, the opening of the housing is opened by attaching a terminal fixing jig having a plurality of tip fixing holes for fitting the tip portions of the plurality of press-fit terminals to the assembly. And a terminal fixing step for fixing the tip portion,
After the terminal fixing step, a potting step of filling the opening of the housing with a thermosetting resin,
A heating step of curing the thermosetting resin by heating the assembly after the potting step;
After the thermosetting resin heated in the heating step is cooled, a jig removing step for removing the terminal fixing jig,
Is provided.

Another method of manufacturing a semiconductor device according to the present invention is as follows.
A housing having a bottom portion and a resin side wall portion, a semiconductor chip disposed in an opening formed by the bottom portion and the side wall portion, and a tip portion and a root portion, and the root portion is connected to the side wall portion A preparatory step of preparing an assembly including a plurality of press-fit terminals,
After the preparation step, a potting step of filling the opening of the housing with a thermosetting resin;
A terminal fixing step of fixing the tip portion by attaching a terminal fixing jig having a plurality of tip fixing holes for fitting the tip portions of the plurality of press-fit terminals to the assembly after the potting step; ,
A heating step of curing the thermosetting resin by heating the assembly after the terminal fixing step;
After the thermosetting resin heated in the heating step is cooled, a jig removing step for removing the terminal fixing jig,
Is provided.

The terminal fixing jig according to the present invention is a terminal fixing jig for fixing a press-fit terminal,
A plate-like root fitting member provided with a plurality of root holes;
A plate-like tip fitting member that is overlaid on the root fitting member, provided directly above the plurality of root holes, and provided with a plurality of tip fixing holes having a diameter smaller than that of the root hole;
A connecting portion for connecting the root fitting member and the tip fitting member;
Is provided.

  According to the method for manufacturing a semiconductor device according to the present invention, since the front end of the press-fit terminal is fixed during the thermosetting and cooling period of the thermosetting resin, the housing is distorted in the process of heating and cooling. In addition, it is possible to suppress the occurrence of displacement in the tip end portion of the press-fit terminal. Accordingly, it is possible to suppress a defect that makes it difficult to insert the press-fit terminal into the hole of the control board when the control board is attached.

  According to the terminal fixing jig according to the present invention, at least the distal end portion of the press fit terminal can be fixed by covering the press fit terminal with the root fitting member and the tip fitting member. It is possible to fix the tip by attaching a terminal fixing jig over the thermosetting resin thermosetting resin and its cooling period. As a result, even if the housing is distorted during heating and cooling, it is positioned at the tip. The occurrence of deviation can be suppressed. Accordingly, it is possible to suppress a defect that makes it difficult to insert the press-fit terminal into the hole of the control board when the control board is attached.

It is a perspective view which shows the terminal fixing jig concerning Embodiment 1 of this invention. It is a top view which shows the root fitting member of the terminal fixing jig concerning Embodiment 1 of this invention. It is sectional drawing which shows the root insertion member of the terminal fixing jig concerning Embodiment 1 of this invention. It is a top view which shows the front-end | tip insertion member of the terminal fixing jig concerning Embodiment 1 of this invention. It is a top view which shows the semiconductor device with which the terminal fixing jig concerning Embodiment 1 of this invention is used. It is a side view which shows the semiconductor device with which the terminal fixing jig concerning Embodiment 1 of this invention is used. It is a figure for demonstrating the effect of the terminal fixing jig concerning Embodiment 1 of this invention. It is a figure for demonstrating the effect of the terminal fixing jig concerning Embodiment 1 of this invention. It is a side view which shows the terminal fixing jig concerning Embodiment 1 of this invention. It is a figure for demonstrating the effect of the terminal fixing jig concerning Embodiment 1 of this invention. It is a figure for demonstrating the effect of the terminal fixing jig concerning Embodiment 1 of this invention. 4 is a flowchart for explaining a method for manufacturing a semiconductor device according to the first embodiment of the present invention; It is a perspective view which shows the terminal fixing jig concerning Embodiment 2 of this invention. It is a top view which shows the root fitting member of the terminal fixing jig concerning Embodiment 2 of this invention. It is a top view which shows the front-end | tip insertion member of the terminal fixing jig concerning Embodiment 2 of this invention. 7 is a flowchart for explaining a method for manufacturing a semiconductor device according to a second embodiment of the present invention;

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a terminal fixing jig 52 according to the first embodiment of the present invention. The terminal fixing jig 52 includes a plate-like root fitting member 30, a plate-like tip fitting member 40 stacked on the root fitting member 30, the root fitting member 30, and the tip fitting member 40. And four connection pins 50 for connecting the two.

  The terminal fixing jig 52 is used for accurately fixing the press-fit terminal 20 at a fixed position in the manufacturing process of the semiconductor device 10 to be described later with reference to FIGS. 5 and 6. As shown in FIGS. 7 and 8, the press-fit terminal 20 includes a root portion 20a, a tip portion 20c, and a bulge portion 20b between the root portion 20a and the tip portion 20c. In addition, the specific shape of the press-fit terminal which is the target of the terminal fixing jig 52 is not particularly limited, and various known press-fit terminals including a known shape disclosed in International Publication No. 2014/132803 can be used. Can be adopted.

  A first central opening 44 is provided at the center of the tip fitting member 40 in a plan view of the tip fitting member 40 (see FIG. 4). A second central opening 34 is provided at the center of the root insertion member 30 in a plan view of the root insertion member 30 (see FIG. 2). The second central opening 34 provided in the root fitting member 30 is located immediately below the first central opening 44, and the first central opening 44 and the second central opening 34 when the terminal fixing jig 52 is viewed in plan view. Communicate. Six six tip fixing holes 46 are arranged on both edges of the first central opening 44, and six root holes 36 are arranged on both edges of the second central opening 34. One root hole 36 is positioned directly below the tip fixing hole 46, and the tip fixing hole 46 and the root hole 36 communicate with each other when the terminal fixing jig 52 is viewed in plan. The number and arrangement of the tip fixing holes 46 and the base holes 36 and the number and arrangement of the press-fit terminals 20 are examples. A plurality of tip fixing holes 46 and root holes 36 may be formed at equal intervals so as to correspond to various numbers and arrangements of the press-fit terminals 20, and the tip ends according to the number and arrangement of the press-fit terminals 20. The fixing hole 46 and the root hole 36 may be open.

  The connection pin 50 provides a gap H (see FIG. 9) less than the length of the press-fit terminal 20 between the root fitting member 30 and the tip fitting member 40. Since the root fitting member 30 and the tip fitting member 40 are integrated by the connection pin 50, the convenience and workability of handling are improved, and the storage and management are facilitated.

  In a plan view of the tip insertion member 40, the outer shape of the tip insertion member 40 and the outer shape of the root insertion member 30 are the same size.

  FIG. 2 is a plan view showing the root fitting member 30 of the terminal fixing jig 52 according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing the root fitting member 30 of the terminal fixing jig 52 according to the first embodiment of the present invention, and shows a cross section taken along the line AA ′ of FIG. The root fitting member 30 is provided with a plurality of root holes 36. The root hole 36 has the same size as the dimension of the largest root portion 20a in the width of the press-fit terminal 20, and is a square hole as a specific example. A second central opening 34 having a width W1 and a length L1 is provided in the center of the root fitting member 30. The root fitting member 30 has an upper surface facing the tip fitting member 40 and a lower surface opposite to the upper surface. As shown in the cross-sectional view of FIG. 3, terminal pressing projections 38 that sandwich the root portion 20 a of the press-fit terminal 20 are provided on both edges of the root hole 36 on the lower surface of the root fitting member 30. The number and arrangement of the root holes 36 are an example. A plurality of root holes 36 may be formed at equal intervals so as to correspond to various numbers and arrangements of the press fit terminals 20, and the root holes 36 are open according to the number and arrangement of the press fit terminals 20. It may be a form.

  FIG. 4 is a plan view showing the tip fitting member 40 of the terminal fixing jig 52 according to the first embodiment of the present invention. The distal end fitting member 40 is provided with a plurality of distal end fixing holes 46 that are respectively provided immediately above the plurality of root holes 36 and have a diameter smaller than that of the root holes 36. The tip fixing hole 46 has a diameter that is approximately the same as the size of the tip portion 20 c that is the smallest of the widths of the press-fit terminals 20. A first central opening 44 having a width W1 and a length L1 is provided in the center of the tip fitting member 40. The number and arrangement of the tip fixing holes 46 are an example. A plurality of tip fixing holes 46 may be formed at equal intervals so as to correspond to various numbers and arrangements of the press fit terminals 20, and the tip fixing holes 46 are open according to the number and arrangement of the press fit terminals 20. It may be a form.

  The material of the tip insertion member 40 and the root insertion member 30 may be a metal. Since the strength is increased by using a metal as the material, there are advantages in that the fixing accuracy is improved, the deformation is prevented, and the life is improved. As the metal, for example, it is preferable to use stainless steel that is less deformed due to temperature change.

  The first central opening 44 and the second central opening 34 are provided for filling a thermosetting resin 60 in a case 11 of the semiconductor device 10 to be described later. Thereby, the thermosetting resin 60 can be smoothly filled in the housing 11. As long as the filling of the thermosetting resin 60 is not hindered, the first center opening 44 of the tip insertion member 40 may have a plurality of openings, and the second center opening 34 of the root insertion member 30 may have a plurality of openings. It may be an opening. The first central opening 44 of the tip fitting member 40 and the second central opening 34 of the root fitting member 30 are preferably approximately the same size, but either one may be larger than the other.

  FIG. 5 is a plan view showing the semiconductor device 10 in which the terminal fixing jig 52 according to the first embodiment of the present invention is used. FIG. 6 is a side view showing the semiconductor device 10. In the plan view of FIG. 5, in order to explain the internal structure of the semiconductor device 10, the semiconductor device 10 is illustrated through a part of the lid 17. Note that the semiconductor device 10 is similar to the semiconductor device disclosed in, for example, International Publication No. 2014/132803, and has a known structure, so the description will be simplified as appropriate. This type of semiconductor device is sometimes called a power semiconductor device or a power module.

  The semiconductor device 10 includes a housing 11 having an opening 11a, semiconductor chips 21 and 22 disposed in the opening 11a, and a plurality of press-fit terminals 20 electrically connected to the semiconductor chips 21 and 22 and the like. I have. The housing 11 includes a metal base plate 13 that forms the bottom of the housing 11, a resin frame case 12 that is bonded to the surface of the metal base plate 13 and forms a side wall portion of the housing 11, and a frame case And a resin lid 17 that closes the 12 openings 11a. A circuit board 14 is installed on the metal base plate 13. On the circuit board 14, semiconductor chips 21 and 22 such as IGBTs or diodes are mounted. Main terminals 15 are disposed at both ends of the frame-shaped case 12. A plurality of press-fit terminals 20 that protrude above the housing 11 are fixed to the frame-type case 12 in contact with the inside of the frame-type case 12. Although illustration of details is omitted, the main terminal 15 and the press-fit terminal 20 are electrically connected to the semiconductor chips 21 and 22 by wires.

  The housing 11 has an opening constituted by the metal base plate 13 and the frame-type case 12, and this opening is closed by a lid 17. The housing 11 is filled with a thermosetting resin 60 that seals the semiconductor chips 21 and 22.

  FIG. 6 also shows a control board 70 having a plurality of through holes 72. The control board 70 and the semiconductor device 10 are electrically connected by inserting the press fit terminal 20 into the through hole 72.

  7 and 8 are diagrams for explaining the effect of the terminal fixing jig 52 according to the first embodiment of the present invention. 7 and 8 are enlarged views of the vicinity of the press-fit terminal 20, and the connection pins 50 are not shown for convenience. As shown in FIG. 7, when the terminal fixing jig 52 is used, the root portion 20 a of the press-fit terminal 20 is passed through the root hole 36 of the root fitting member 30 and the tip fixing hole 46 of the tip fitting member 40. The front end 20c of the press-fit terminal 20 is fitted. Thereby, the root portion 20 a can be fixed by the root fitting member 30 and the tip portion 20 c can be fixed by the tip fitting member 40. In such a state, the case 11 is filled with the thermosetting resin and the heat treatment after the filling to the cooling are performed. As a result, even if the housing 11 is distorted, the tip end portion 20 c of the press-fit terminal 20 can be fixed by the tip fitting member 40. Furthermore, it is possible to suppress the occurrence of a springback phenomenon in the press-fit terminal 20 when the jig is removed by the root fitting member 30 as much as possible.

  FIG. 8 illustrates a state after thermosetting and cooling after the case 11 is filled with the thermosetting resin. Since the tip end portion 20c and the root portion 20a are fixed by the presence of the terminal fixing jig 52, the position intervals of the plurality of tip portions 20c and the position intervals of the plurality of root portions 20a are maintained. However, since the casing 11 is distorted by heat due to the frame case 12 being made of resin or the like, the press-fit terminal 20 may be subjected to plastic deformation and distortion may remain in the bulging portion 20b as illustrated in FIG. .

  FIG. 9 is a side view showing the terminal fixing jig 52 according to the first embodiment of the present invention. FIGS. 10-11 is a figure for demonstrating the effect of the terminal fixing jig 52 concerning Embodiment 1 of this invention. The connection pin 50 provides a gap H less than the length of the press-fit terminal 20 between the root fitting member 30 and the tip fitting member 40. This gap H needs to be designed to an appropriate size in relation to the length L3 of the press-fit terminal 20. That is, when the root fitting member 30 is placed on the root portion 20a of the press-fit terminal 20, the connection pin 50 is too short and the press-fit terminal 20 is inserted deeply into the tip fixing hole 46 as shown in FIG. As a result, the bulging portion 20b receives pressure from both ends. On the other hand, as shown in FIG. 11, if the connection pin 50 is too long, the tip fitting member 40 cannot fix the tip portion 20 c of the press-fit terminal 20.

  FIG. 12 is a flowchart for explaining a manufacturing method of the semiconductor device 10 according to the first embodiment of the present invention.

  The preparation process (step S100 and step S102) is a process of preparing an assembly including the housing 11, semiconductor chips 21 and 22 mounted in the housing 11, and a plurality of press-fit terminals 20. The “assembly” here refers to a structure in the semiconductor device 10 shown in FIGS. 5 and 6 at a stage where the lid 17 is removed and the thermosetting resin 60 is not filled.

  The terminal fixing step (step S104) is a step of attaching the terminal fixing jig 52 to the assembly after the preparation step. As described above, the terminal fixing jig 52 includes the tip insertion member 40 and the root insertion member 30. The tip insertion member 40 has a plurality of tip fixing holes 46 for fitting the tip portions 20 c of the plurality of press-fit terminals 20. The root fitting member 30 has a plurality of root holes 36 through which the root portions 20a of the plurality of press-fit terminals 20 are passed. When attaching the terminal fixing jig 52 to the assembly, each of the root portions 20 a is passed through the root hole 36, and each of the distal end portions 20 c is fitted into the distal end fixing hole 46. As a result, the distal end portion 20 c is fixed while the housing 11 is opened through the first central opening 44 and the second central opening 34. In particular, in the first embodiment, since the root hole 36 is formed so as to coincide with the diameter of the root portion 20 a, the tip portion 20 c is fixed by the tip fitting member 40 and the root fitting member 30 fixes the root. The part 20a can also be fixed.

  In the potting process (step S106), the casing 11 is filled with the thermosetting resin 60 after the terminal fixing process. Although there is no limitation in particular in the material of the thermosetting resin 60, For example, you may use what is called a direct potting resin. The direct potting resin is an epoxy resin that has been adjusted so as to increase the thermal expansion coefficient and improve adhesion.

  In the heating process (step S108), the thermosetting resin 60 is cured by heating the assembly after the potting process. After the heating process, the thermosetting resin 60 heated in the heating process is cooled by the heat removal process (step S110).

  In the jig removing step (step S112), the terminal fixing jig 52 is removed after the thermosetting resin 60 heated in the heating step is cooled.

  As described above, according to the terminal fixing jig 52 according to the first embodiment, it is possible to fix the tip portion 20c by covering the press-fit terminal 20 with the root fitting member 30 and the tip fitting member 40. it can. The tip 20c can be fixed by attaching the terminal fixing jig 52 over the thermosetting resin 60 and its cooling period. As a result, even if the casing 11 is distorted during the heating and cooling process. It can suppress that position shift arises in the front-end | tip part 20c. Accordingly, when the control board 70 is attached, it is possible to suppress a defect that makes it difficult for the press-fit terminal 20 to be inserted into the through hole 72 of the control board 70.

Embodiment 2. FIG.
FIG. 13 is a perspective view showing a terminal fixing jig 152 according to the second embodiment of the present invention. FIG. 14 is a plan view showing the root fitting member 130 of the terminal fixing jig 152, and FIG. 15 is a plan view showing the tip fitting member 140 of the terminal fixing jig 152. The terminal fixing jig 152 is different from the terminal fixing jig 52 of the first embodiment in that the first central opening 44 and the second central opening 34 are not provided. In other respects, the first and second embodiments have the same structure.

  FIG. 16 is a flowchart for explaining a manufacturing method of the semiconductor device 10 according to the second embodiment of the present invention. The difference from the flowchart of FIG. 12 in the first embodiment is that the order of the potting process (step S106) and the terminal fixing process (step S104) is reversed. By first filling the housing 11 with the thermosetting resin 60 and then mounting the terminal fixing jig 152, the first central opening 44 and the second central opening 34 become unnecessary.

DESCRIPTION OF SYMBOLS 10 Semiconductor device, 11 Case, 11a Opening, 12 Frame type case, 13 Metal base board, 14 Circuit board, 15 Main terminal, 17 Lid, 20 Press fit terminal, 20a Root part, 20b Swelling part, 20c Tip part, 21 , 22 Semiconductor chip, 30, 130 Root insertion member, 34 Second central opening, 36 Root hole, 38 Protrusion, 40, 140 Tip insertion member, 44 First center opening, 46 Tip fixing hole, 50 Connection pin , 52, 152 Terminal fixing jig, 60 Thermosetting resin, 70 Control board, 72 Through hole

Claims (8)

A housing having a bottom portion and a resin side wall portion, a semiconductor chip disposed in an opening formed by the bottom portion and the side wall portion, and a tip portion and a root portion, and the root portion is connected to the side wall portion A preparatory step of preparing an assembly including a plurality of press-fit terminals,
After the preparation step, the opening of the housing is opened by attaching a terminal fixing jig having a plurality of tip fixing holes for fitting the tip portions of the plurality of press-fit terminals to the assembly. And a terminal fixing step for fixing the tip portion,
After the terminal fixing step, a potting step of filling the opening of the housing with a thermosetting resin,
A heating step of curing the thermosetting resin by heating the assembly after the potting step;
After the thermosetting resin heated in the heating step is cooled, a jig removing step for removing the terminal fixing jig,
A method for manufacturing a semiconductor device comprising: A housing having a bottom portion and a resin side wall portion, a semiconductor chip disposed in an opening formed by the bottom portion and the side wall portion, and a tip portion and a root portion, and the root portion is connected to the side wall portion A preparatory step of preparing an assembly including a plurality of press-fit terminals,
After the preparation step, a potting step of filling the opening of the housing with a thermosetting resin;
A terminal fixing step of fixing the tip portion by attaching a terminal fixing jig having a plurality of tip fixing holes for fitting the tip portions of the plurality of press-fit terminals to the assembly after the potting step; ,
A heating step of curing the thermosetting resin by heating the assembly after the terminal fixing step;
After the thermosetting resin heated in the heating step is cooled, a jig removing step for removing the terminal fixing jig,
A method for manufacturing a semiconductor device comprising: The terminal fixing jig is
A tip fitting member provided with the plurality of tip fixing holes;
A root fitting member provided under the tip fitting member and provided with a plurality of root holes having a diameter larger than the tip fixing hole immediately below the plurality of tip fixing holes;
A connecting portion for connecting the tip fitting member and the root fitting member;
With
3. The method of manufacturing a semiconductor device according to claim 1, wherein, in the terminal fixing step, the tip portion is fixed by the tip fitting member and the root portion is fixed by the root fitting member. The terminal fixing jig is
A tip fitting member provided with the plurality of tip fixing holes;
A root fitting member provided under the tip fitting member and provided with a plurality of root holes having a diameter larger than the tip fixing hole immediately below the plurality of tip fixing holes;
A connecting portion that connects the tip fitting member and the root fitting member while providing a gap less than the length of the press-fit terminal between the root fitting member and the tip fitting member;
The manufacturing method of the semiconductor device of Claim 1 or 2 provided with these. A terminal fixing jig for fixing a press-fit terminal,
A plate-like root fitting member provided with a plurality of root holes;
A plate-like tip fitting member that is overlaid on the root fitting member, provided directly above the plurality of root holes, and provided with a plurality of tip fixing holes having a diameter smaller than that of the root hole;
A connecting portion for connecting the root fitting member and the tip fitting member;
A terminal fixing jig comprising: A first central opening is provided at the center of the tip fitting member in plan view of the tip fitting member;
A second central opening is provided in the root fitting member in a plan view of the root fitting member, the second central opening is located immediately below the first central opening;
The terminal fixing jig according to claim 5, wherein the plurality of tip fixing holes are arranged along an edge of the first central opening, and the plurality of root holes are arranged along an edge of the second central opening.   The terminal fixing jig according to claim 5 or 6, wherein the connection portion provides a gap less than a length of a press-fit terminal between the root fitting member and the tip fitting member. The root fitting member has an upper surface facing the tip fitting member, and a lower surface opposite to the upper surface,
The terminal fixing jig according to claim 5, wherein a terminal pressing projection is provided at an edge of the root hole on the lower surface.

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