JP2016215197A - 圧電式の噴射システム、及び、圧電式の噴射方法 - Google Patents
圧電式の噴射システム、及び、圧電式の噴射方法 Download PDFInfo
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- JP2016215197A JP2016215197A JP2016102255A JP2016102255A JP2016215197A JP 2016215197 A JP2016215197 A JP 2016215197A JP 2016102255 A JP2016102255 A JP 2016102255A JP 2016102255 A JP2016102255 A JP 2016102255A JP 2016215197 A JP2016215197 A JP 2016215197A
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- Prior art keywords
- voltage
- piezoelectric actuator
- piezoelectric
- jetting
- fluid
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/802—Drive or control circuitry or methods for piezoelectric or electrostrictive devices not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/16—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation by cathodic sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Fuel-Injection Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
1)図8及び図9を参照して説明されたように、噴射用のタペットまたはバルブ要素76をバルブシート100から上昇させる間のみにおいて生じ得る。
2)図10及び図11を参照して説明されたように、噴射用のタペットまたはバルブ要素76を上昇させる間と下降させる間との両方において生じ得る。
3)噴射ディスペンス動作の間に出口に向かって噴射バルブ要素を移動する間のみにおいて生じ得る。
Claims (14)
- 流体を噴射するためのシステムであって、
可動シャフト、出口オリフィス、及び、前記出口オリフィスから前記液体の量を噴射するべく前記可動シャフトに動作可能に結合された圧電式アクチュエータ、を含む噴射ディスペンサと、
前記圧電式アクチュエータに動作可能に結合された電子制御部と、
を備え、
前記電子制御部は、前記出口オリフィスに向かう、及び/または、そこから離れる移動中の前記可動シャフトの振動振幅を低減するべく変化する変化率を伴う電圧を前記圧電式アクチュエータに適用するよう動作する
ことを特徴とするシステム。 - 前記電子制御部は、前記圧電式アクチュエータに、第1電圧と第2電圧とを含むステップ状波形を送り、
前記第2電圧は、前記第1電圧とは異なる
ことを特徴とする請求項1に記載のシステム。 - 前記第2電圧は、前記第1電圧よりも低い
ことを特徴とする請求項2に記載のシステム。 - 前記第2電圧は、0ボルトである
ことを特徴とする請求項3に記載のシステム。 - 前記ステップ状波形は、第3電圧を更に含んでおり
前記第3電圧は、前記第2電圧よりも大きく、前記ステップ状波形内で前記第2電圧に続いている
ことを特徴とする請求項3に記載のシステム。 - 前記電子制御部は、前記電圧の減少する変化率を伴う波形として電圧を適用する
ことを特徴とする請求項1に記載のシステム。 - 前記電子制御部は、前記電圧の増大する変化率を伴う波形として電圧を適用する
ことを特徴とする請求項1に記載のシステム。 - 可動シャフトに動作可能に結合された圧電式アクチュエータと、出口オリフィスを有する流体本体部と、を含むディスペンサから粘性材料を噴射する方法であって、
変化する変化率を伴う電圧を前記圧電式アクチュエータに適用する工程と、
前記圧電式アクチュエータを前記電圧適用下で移動させる工程と、
前記シャフトを前記圧電式アクチュエータで移動させる工程と、
前記移動するシャフトを用いて前記出口オリフィスから前記粘性材料の量を噴射させる工程と、
を備えたことを特徴とする方法。 - 前記電圧を適用する工程は、前記圧電式アクチュエータに第1電圧と第2電圧とを含むステップ状波形を適用する工程を更に含み、
前記第2電圧は、前記第1電圧とは異なる
ことを特徴とする請求項8に記載の方法。 - 前記第2電圧は、前記第1電圧よりも低い
ことを特徴とする請求項9に記載の方法。 - 前記第2電圧は、0ボルトである
ことを特徴とする請求項10に記載の方法。 - 前記ステップ状波形は、第3電圧を更に含んでおり
前記第3電圧は、前記第2電圧よりも大きく、前記ステップ状波形内で前記第2電圧に続いている
ことを特徴とする請求項10に記載の方法。 - 前記電圧を適用する工程は、減少する変化率を伴う電圧を適用する工程を更に含んでいる
ことを特徴とする請求項8に記載の方法。 - 前記電圧を適用する工程は、増大する変化率を伴う電圧を適用する工程を更に含んでいる
ことを特徴とする請求項8に記載の方法。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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US201562165242P | 2015-05-22 | 2015-05-22 | |
US62/165,242 | 2015-05-22 | ||
US15/154,021 US10090453B2 (en) | 2015-05-22 | 2016-05-13 | Piezoelectric jetting system and method |
US15/154,021 | 2016-05-13 |
Publications (2)
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JP2016215197A true JP2016215197A (ja) | 2016-12-22 |
JP6932483B2 JP6932483B2 (ja) | 2021-09-08 |
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JP2016102255A Active JP6932483B2 (ja) | 2015-05-22 | 2016-05-23 | 圧電式の噴射システム、及び、圧電式の噴射方法 |
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US (2) | US10090453B2 (ja) |
EP (1) | EP3095521B1 (ja) |
JP (1) | JP6932483B2 (ja) |
KR (1) | KR102559677B1 (ja) |
CN (1) | CN106166531B (ja) |
DE (1) | DE202016008610U1 (ja) |
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US11384860B2 (en) * | 2017-05-08 | 2022-07-12 | Changzhou Mingseal Robot Technology Co., Ltd. | Fluid micro-injection device and flow channel assembly thereof |
CN106964522B (zh) * | 2017-05-11 | 2022-07-01 | 山东大学 | 压电驱动喷射装置 |
CN108855657B (zh) * | 2017-05-12 | 2021-08-13 | 诺信公司 | 喷嘴和包括它的涂胶系统 |
TWI650179B (zh) * | 2017-07-26 | 2019-02-11 | 萬潤科技股份有限公司 | 液材擠出裝置及閉鎖檢測方法 |
DE102017122034A1 (de) | 2017-09-22 | 2019-03-28 | Vermes Microdispensing GmbH | Dosiersystem mit Aktoreinheit und lösbar koppelbarer Fluidikeinheit |
CN108144789B (zh) * | 2018-01-23 | 2024-01-30 | 广州市景泰科技有限公司 | 一种喷射阀 |
DE102018108360A1 (de) | 2018-04-09 | 2019-10-10 | Vermes Microdispensing GmbH | Dosiersystem mit piezokeramischem Aktor |
CN110833969A (zh) * | 2018-08-18 | 2020-02-25 | 罗天珍 | 逆止阀隔断撞针式喷射点胶阀 |
EP4026621A4 (en) * | 2019-09-04 | 2023-10-04 | NOK Corporation | METHOD FOR PRODUCING A SEAL |
CN110794168B (zh) * | 2019-10-29 | 2021-12-24 | 歌尔股份有限公司 | 一种压电喷胶系统的检测方法和装置 |
CN111889680B (zh) * | 2020-06-09 | 2022-08-26 | 哈尔滨工业大学 | 一种基于压电微喷的热熔金属微液滴直接按需打印机构 |
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CN106166531B (zh) | 2020-06-05 |
US20160339467A1 (en) | 2016-11-24 |
JP6932483B2 (ja) | 2021-09-08 |
US10090453B2 (en) | 2018-10-02 |
KR20160137419A (ko) | 2016-11-30 |
DE202016008610U1 (de) | 2019-01-24 |
KR102559677B1 (ko) | 2023-07-27 |
EP3095521A1 (en) | 2016-11-23 |
EP3095521B1 (en) | 2018-03-14 |
CN106166531A (zh) | 2016-11-30 |
US11611033B2 (en) | 2023-03-21 |
US20180375009A1 (en) | 2018-12-27 |
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