JP2016204741A - Method for partially plating magnesium alloy member by peeling system - Google Patents

Method for partially plating magnesium alloy member by peeling system Download PDF

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Publication number
JP2016204741A
JP2016204741A JP2015098598A JP2015098598A JP2016204741A JP 2016204741 A JP2016204741 A JP 2016204741A JP 2015098598 A JP2015098598 A JP 2015098598A JP 2015098598 A JP2015098598 A JP 2015098598A JP 2016204741 A JP2016204741 A JP 2016204741A
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Japan
Prior art keywords
plating
magnesium
magnesium alloy
alloy member
masking
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Pending
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JP2015098598A
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Japanese (ja)
Inventor
加藤 和夫
Kazuo Kato
和夫 加藤
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Kawajun Ind Co Ltd
KAWAJUN INDUSTRY CO Ltd
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Kawajun Ind Co Ltd
KAWAJUN INDUSTRY CO Ltd
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Priority to JP2015098598A priority Critical patent/JP2016204741A/en
Publication of JP2016204741A publication Critical patent/JP2016204741A/en
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Abstract

PROBLEM TO BE SOLVED: To provide a method for partially plating a magnesium alloy member by a peeling system.SOLUTION: A magnesium alloy member is provided with plating and, thereafter, a necessary plated portion is masked with a masking tape or an ink coating. An unnecessary plated portion is peeled and removed by immersing only the plating on the magnesium alloy member in a peeling liquid (hereafter, referred to as a magnesium peeling liquid). Finally, the tape or the ink coating required for masking is peeled and removed, resulting in presence of a magnesium alloy portion and a plated portion on the same member.SELECTED DRAWING: None

Description

本発明は、マグネシウム合金部材への剥離方式による部分めっきに関する。The present invention relates to partial plating by a peeling method on a magnesium alloy member.

マスキングを用いる部分めっきには二つの方式がある。
素材のめっきしたくない部分にめっき用マスキングを施し、他の部分をめっきしていくめっき方式。
最初にめっきを全体に施し、めっきを残したい部分にめっき用マスキングをしてめっきを剥離していく剥離方式。
マグネシウム合金部材の場合は例えば、めっき用マスキングをしてからめっきするにあたり、前処理としてほとんどの処理が高温の強アルカリ性で行なうため、マスキングするためのテープやインク塗料が剥がれてしまい部分めっきができない。
次に全体めっきしてからマスキングをしてめっき剥離していく場合は、めっき剥離液が高温の強アルカリタイプが多くマスキングのためのテープ、インク塗料がやはり持たない。
酸性タイプの剥離液であればマスキングテープ、インク塗料はほとんど耐えることができる。しかしこれではマグネシウムが腐食されてしまい使い物にならない。
There are two methods for partial plating using masking.
A plating method in which masking for plating is applied to parts that do not want to be plated and other parts are plated.
A peeling method in which plating is applied to the entire surface, and then plating is masked on the portion where plating is to be left to peel off the plating.
In the case of a magnesium alloy member, for example, when performing plating after masking for plating, most of the pretreatment is performed with high-temperature strong alkalinity, so that the masking tape or ink paint is peeled off and partial plating cannot be performed. .
Next, when the entire plating is performed and then the masking is performed and the plating is peeled off, the plating stripping solution is often a strong alkali type having a high temperature, and the tape and ink paint for masking are still not provided.
If it is an acidic type stripper, the masking tape and ink paint can withstand almost all. However, magnesium is corroded and is not useful.

マグネシウム合金部材への部分めっき特許文献はほぼ皆無であるので、関連する参考文献として次の文献を示す。Since there is almost no patent literature on partial plating of magnesium alloy members, the following literature is shown as a related reference.

関連技術文献Related technical literature

特許文献Patent Literature

特開2000−297386JP 2000-297386 待開2014−025142Waiting 2014-025142

発明が解決しようとする課題Problems to be solved by the invention

特許文献1ではリサイクルのためにマグネシウム上のすべてのめっきを剥離する方式である。剥離方式はアルカリ性の電解方式を用いている。In patent document 1, it is the system which peels off all the plating on magnesium for recycling. The peeling method uses an alkaline electrolysis method.

特許文献2ではパラフィンを含有するマスキング液を用いためっき、エッチングの形成法である。
パラフィンを含むマスキング液は常に融点以上に保ちインクジェット装置に装填、約120℃に溶融しているマスキング液を基材に印刷、パターンを形成しマスキングの用を足している。
Patent Document 2 discloses a plating and etching method using a masking solution containing paraffin.
The masking liquid containing paraffin is always kept above the melting point and loaded into the ink jet apparatus, and the masking liquid melted at about 120 ° C. is printed on the base material to form a pattern for masking.

本発明はマグネシウム合金部材と未知のめっき組み合わせを解決すべくなされたものであり、一般的なマスキングテープおよびインク塗料を使用した剥離方式の部分めっき方法を提供するものである。The present invention has been made to solve a combination of a magnesium alloy member and an unknown plating, and provides a peeling type partial plating method using a general masking tape and ink paint.

課題を解決するための手段Means for solving the problem

上記課題を解決するため、一般的なマスキングテープおよびインク塗料が使用可能な本発明のマグネシウム剥離液を使用するめっき剥離方式を特徴とする。In order to solve the above problems, the present invention is characterized by a plating stripping method using the magnesium stripping solution of the present invention in which a general masking tape and ink paint can be used.

テープおよび塗料は一般的にめっきマスキング用として市販されているものがそのまま使用できる。例えばテープはポリプロピレン、ポリエチレン等を基材として片側に粘着剤が塗布されている一般的なめっき用マスキングテープ。例えばインク塗料はピッチ系、タール系の一般的なめっき用レジストインク塗料。Tapes and paints that are commercially available for plating masking can be used as they are. For example, the tape is a general masking tape for plating in which an adhesive is applied on one side with polypropylene or polyethylene as a base material. For example, the ink paint is a general resist ink paint for plating of pitch type or tar type.

剥離できるめっきの種類は例として、銅、ニッケル、亜鉛、等が主なものであるがこれに限定されるものではない。Examples of the types of plating that can be peeled include, but are not limited to, copper, nickel, zinc, and the like.

発明の効果Effect of the invention

本発明によればマグネシウム合金部材に部分めっきが可能となる。According to the present invention, partial plating can be performed on a magnesium alloy member.

特殊な装置やマスキング材を必要とせず、従来の機材が使える。Conventional equipment can be used without the need for special equipment or masking materials.

以下本発明の好適な実施の形態を詳細に説明する。
なお、対象素材はAZ91とAZ31であるがこれに限定されるものではない。
Hereinafter, preferred embodiments of the present invention will be described in detail.
In addition, although target material is AZ91 and AZ31, it is not limited to this.

本発明では密着の良いマグネシウム上のめっきで2種類を想定している。
まず前処理後に亜鉛置換を施し、青化銅めっき更に必要であれば電解ニッケル等のめっき。
もう一つは前処理後に直接、無電解ニッケルを施し、必要であれば更に他のめっきを組み合わせる。
In the present invention, two types of plating on magnesium with good adhesion are assumed.
First, after pre-treatment, zinc substitution is performed, copper bronze plating, and if necessary, electrolytic nickel plating.
The other is to apply electroless nickel directly after pretreatment, and if necessary, combine other plating.

目的のめっき、例えば銅めっき、ニッケルめっき等が施された部材にマスキング用のテープを貼る。またはマスキング用のインク塗料を刷毛で塗る、シルク印刷で塗る等の方法がある。尚、塗布の仕方についてはこれらに限定されるものではない。
またインク塗料は場合によっては100〜150℃で硬化を促進させ時間を短縮させることも可能である。
A masking tape is applied to a member that has been subjected to a target plating, such as copper plating or nickel plating. Alternatively, there are methods such as applying ink paint for masking with a brush or by silk printing. In addition, about the method of application | coating, it is not limited to these.
In some cases, the ink paint can be accelerated at 100 to 150 ° C. to shorten the time.

マグネシウム用剥離液は予め、FRP槽やステンレス槽、等に建浴しておく。
芳香族ニトロ化合物20〜200g/L、青化ナトリウム50〜150g/L、インヒビター5〜10g/L、pH調整剤適量を含有するアルカリ性水溶液。
pHは12以下になるようにする。12以上はピロリン酸の希釈水でおとし、11以下では水酸化ナトリウム希釈水であげる。pH12以上では一般用のマスキングテープ、インク塗料は処理中に剥がれてしまう可能性が高い。
The magnesium stripping solution is preliminarily placed in an FRP tank, a stainless steel tank, or the like.
An alkaline aqueous solution containing 20 to 200 g / L of an aromatic nitro compound, 50 to 150 g / L of sodium cyanide, 5 to 10 g / L of an inhibitor, and an appropriate amount of a pH adjusting agent.
The pH is adjusted to 12 or less. 12 or more is diluted with pyrophosphoric acid diluted water, and 11 or less is diluted with sodium hydroxide diluted water. When the pH is 12 or more, a general masking tape and ink paint are likely to be peeled off during processing.

剥離液の温度は剥離するめっき金属の種類とめっき厚みによって20〜50℃に設定する。剥離時間は10〜60分程度が目安となる。ただし剥離時間については限定されるものではない。The temperature of the stripping solution is set to 20 to 50 ° C. depending on the type of plating metal to be stripped and the plating thickness. The peeling time is about 10 to 60 minutes. However, the peeling time is not limited.

剥離終えた部材は直ちに十分に水洗し、テープの場合は濡れたまま手ではがし、一旦、アルカリ電解等で洗浄し乾燥する。インク塗料の場合はそのまま乾燥する。The peeled member is immediately washed thoroughly with water. In the case of a tape, it is peeled off by hand while it is wet, and once washed with alkaline electrolysis or the like and dried. In the case of ink paint, it is dried as it is.

インク塗料でマスキングした部材は有機溶媒でインク塗料を剥離する。
シンナー、トルエン、塩素系溶剤等の一般的なもので十分である。
The member masked with the ink paint is peeled off with the organic solvent.
Common ones such as thinner, toluene, chlorinated solvents are sufficient.

必要であれば、めっき剥離後のマグネシウム合金表面の表面調整を行なう。
調整は次の液で行なう。
酢酸200ml/L、硝酸ナトリウム30g/L
常温で10〜60秒
目視で確認しながら処理。
If necessary, the surface of the magnesium alloy surface after plating peeling is adjusted.
Adjust with the following solution.
Acetic acid 200ml / L, Sodium nitrate 30g / L
Processing while checking visually at room temperature for 10-60 seconds.

Claims (6)

マグネシウム合金部材の全体に亜鉛置換、青化銅、電解ニッケルをめっき後、またはマグネシウム合金部材の全体に直接無電解ニッケルめっき後、めっきを残したい部分をマスキングする。マスキング材としてテープまたはインク塗料を使う、または両方の組み合わせでなる。マスキングテープ、インク塗料としては、めっきマスキングに使用する一般的な材料を特徴とする。After the zinc substitution, copper bromide, and electrolytic nickel are plated on the entire magnesium alloy member, or the electroless nickel plating is directly applied to the entire magnesium alloy member, a portion where the plating is to be left is masked. Tape or ink paint is used as a masking material, or a combination of both. The masking tape and ink paint are characterized by general materials used for plating masking. マスキングしためっき部分以外の、露出しためっき面をマグネシウム用剥離液で浸漬処理し、マグネシウム合金部材を侵さずにめっきのみを剥離する。The exposed plating surface other than the masked plating portion is dipped in a magnesium peeling solution, and only the plating is peeled off without attacking the magnesium alloy member. マグネシウム用剥離液は、芳香族ニトロ化合物20〜200g/L、青化ナトリウム50〜150g/L、インヒビター5〜10g/L、pH調整剤適量を含有するアルカリ性水溶液を特徴とする。The stripping solution for magnesium is characterized by an alkaline aqueous solution containing 20 to 200 g / L of an aromatic nitro compound, 50 to 150 g / L of sodium cyanide, 5 to 10 g / L of an inhibitor, and an appropriate amount of a pH adjusting agent. pHが12以下であることが特徴のマグネシウム用剥離液。A stripping solution for magnesium characterized by a pH of 12 or less. マグネシウム用剥離液はマグネシウム合金部材の下地めっきとなる亜鉛、銅、ニッケル、あるいは無電解ニッケルを剥離除去するために供される剥離液。The stripping solution for magnesium is a stripping solution used for stripping and removing zinc, copper, nickel, or electroless nickel, which will be the base plating of the magnesium alloy member. マグネシウム用剥離液で不要なめっき部分を剥離除去したあとに、マグネシウム合金表面に酸化膜、加工変質層などが生じる場合がある。これらを除去する表面調整の処理および処理液。
酢酸200ml/L、硝酸ナトリウム30g/L、の水溶液
常温使用、処理時間10〜60秒程度
からなることを特徴とする。
In some cases, an oxide film, a work-affected layer, or the like is generated on the surface of the magnesium alloy after the unnecessary plating portion is peeled and removed with the stripping solution for magnesium. Surface conditioning treatment and treatment liquid to remove these.
An aqueous solution of 200 ml / L acetic acid and 30 g / L sodium nitrate is used at room temperature and has a treatment time of about 10 to 60 seconds.
JP2015098598A 2015-04-22 2015-04-22 Method for partially plating magnesium alloy member by peeling system Pending JP2016204741A (en)

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