JP2016204628A5 - - Google Patents
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- Publication number
- JP2016204628A5 JP2016204628A5 JP2016017663A JP2016017663A JP2016204628A5 JP 2016204628 A5 JP2016204628 A5 JP 2016204628A5 JP 2016017663 A JP2016017663 A JP 2016017663A JP 2016017663 A JP2016017663 A JP 2016017663A JP 2016204628 A5 JP2016204628 A5 JP 2016204628A5
- Authority
- JP
- Japan
- Prior art keywords
- carboxyl group
- parts
- thermosetting resin
- mass
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 15
- 229920005989 resin Polymers 0.000 claims 15
- 239000011347 resin Substances 0.000 claims 15
- 229920001187 thermosetting polymer Polymers 0.000 claims 15
- 229920005749 polyurethane resin Polymers 0.000 claims 12
- 239000006087 Silane Coupling Agent Substances 0.000 claims 10
- 239000000853 adhesive Substances 0.000 claims 10
- 230000001070 adhesive effect Effects 0.000 claims 10
- -1 diol compound Chemical class 0.000 claims 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 8
- 229910052802 copper Inorganic materials 0.000 claims 8
- 239000010949 copper Substances 0.000 claims 8
- 239000011247 coating layer Substances 0.000 claims 7
- 239000011231 conductive filler Substances 0.000 claims 7
- 239000002253 acid Substances 0.000 claims 6
- 229920002635 polyurethane Polymers 0.000 claims 6
- 239000004814 polyurethane Substances 0.000 claims 6
- 239000004020 conductor Substances 0.000 claims 4
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 230000003014 reinforcing effect Effects 0.000 claims 4
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 claims 3
- 239000005062 Polybutadiene Substances 0.000 claims 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric Acid Chemical compound [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 125000005442 diisocyanate group Chemical group 0.000 claims 3
- 229920002857 polybutadiene Polymers 0.000 claims 3
- 229920000515 polycarbonate Polymers 0.000 claims 3
- 239000004417 polycarbonate Substances 0.000 claims 3
- 229920000728 polyester Polymers 0.000 claims 3
- 229920000570 polyether Polymers 0.000 claims 3
- 229920005862 polyol Polymers 0.000 claims 3
- 229910052709 silver Inorganic materials 0.000 claims 3
- 239000004332 silver Substances 0.000 claims 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016017663A JP6508078B2 (ja) | 2016-02-02 | 2016-02-02 | 導電性接着剤、導電性接着シート、および配線デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016017663A JP6508078B2 (ja) | 2016-02-02 | 2016-02-02 | 導電性接着剤、導電性接着シート、および配線デバイス |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015090211A Division JP5892282B1 (ja) | 2015-04-27 | 2015-04-27 | 導電性接着剤、導電性接着シート、および配線デバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016204628A JP2016204628A (ja) | 2016-12-08 |
| JP2016204628A5 true JP2016204628A5 (cg-RX-API-DMAC7.html) | 2018-06-14 |
| JP6508078B2 JP6508078B2 (ja) | 2019-05-08 |
Family
ID=57489049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016017663A Active JP6508078B2 (ja) | 2016-02-02 | 2016-02-02 | 導電性接着剤、導電性接着シート、および配線デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6508078B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6969165B2 (ja) * | 2017-06-02 | 2021-11-24 | 昭和電工マテリアルズ株式会社 | 異方導電性接着剤組成物、異方導電性フィルム、及び接続構造体 |
| US20230018491A1 (en) * | 2019-12-09 | 2023-01-19 | Sumitomo Bakelite Co., Ltd. | Thermosetting resin composition, resin sheet, and metal base substrate |
| US20240145113A1 (en) * | 2021-01-14 | 2024-05-02 | Namics Corporation | Conductive composition, conductive paste, electric circuit, flexible electric circuit body and method of producing molded body |
| CN119896051A (zh) * | 2022-10-12 | 2025-04-25 | 拓自达电线株式会社 | 电磁波屏蔽膜和屏蔽印刷配线板 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07268303A (ja) * | 1995-03-13 | 1995-10-17 | Soken Kagaku Kk | 異方導電性接着剤組成物 |
| JP2003206452A (ja) * | 2002-01-10 | 2003-07-22 | Toray Ind Inc | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体接続用基板ならびに半導体装置 |
| JP4593123B2 (ja) * | 2004-02-13 | 2010-12-08 | ハリマ化成株式会社 | 導電性接着剤 |
| JP2007051212A (ja) * | 2005-08-17 | 2007-03-01 | Shin Etsu Chem Co Ltd | 接着剤組成物ならびにそれを用いたカバーレイフィルムおよび接着シート |
| JP4825830B2 (ja) * | 2008-03-11 | 2011-11-30 | 住友電気工業株式会社 | 金属補強板を備えたフレキシブルプリント配線板 |
| CN104487534B (zh) * | 2012-07-11 | 2016-11-09 | 大自达电线股份有限公司 | 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板 |
| JP2014141603A (ja) * | 2013-01-25 | 2014-08-07 | Toyo Ink Sc Holdings Co Ltd | 誘電特性に優れる接着剤組成物、それを用いた接着剤シート、およびプリント配線板 |
| JP6255816B2 (ja) * | 2013-09-09 | 2018-01-10 | 東洋インキＳｃホールディングス株式会社 | 電磁波シールドシートおよびプリント配線板 |
| JP5892282B1 (ja) * | 2015-04-27 | 2016-03-23 | 東洋インキＳｃホールディングス株式会社 | 導電性接着剤、導電性接着シート、および配線デバイス |
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2016
- 2016-02-02 JP JP2016017663A patent/JP6508078B2/ja active Active