JP2016196579A - Inkjet marking material, method for manufacturing electronic component and electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inkjet marking material capable of increasing visibility of a marking part as well as enhancing adhesion reliability between a marking part and an adhesion object such as a solder resist layer.SOLUTION: The inkjet marking material of the present invention is to be used for forming a marking part in an electronic component, to be discharged by an inkjet device for use, and to be subjected to irradiation with light so as to promote curing and then further cured by heating for use. The inkjet marking material comprises a photocurable compound, a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and a colorant.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an inkjet marking material for forming a marking portion on which characters or symbols are drawn. Moreover, this invention relates to the manufacturing method of the electronic component which forms a marking part with the said marking material for inkjets. Furthermore, this invention relates to the electronic component which has a marking part formed with the said marking material for inkjets.

  Conventionally, a printed wiring board in which a solder resist layer is formed on a substrate on which wiring is provided on the upper surface is often used. With the miniaturization and high density of electronic devices, demands for reducing the thickness of printed wiring boards are increasing.

  In addition, in order to record the type of printed wiring board and manufacturing information, a marking portion on which characters or symbols are drawn may be formed on the surface of the solder resist layer.

  Patent Document 1 below discloses a printed wiring board in which a marking portion is formed on the surface of a solder resist layer by an inkjet printing method. In Patent Document 1, aqueous ultraviolet curable ink is used to form a marking portion.

Japanese Patent Application Laid-Open No. 11-87883

  In the method described in Patent Document 1, when the marking portion is formed using aqueous ultraviolet curable ink, the visibility of the marking portion may be low. Furthermore, the adhesion reliability between the marking part and the adhesion object such as a solder resist layer may be low.

  The objective of this invention is providing the marking material for inkjet which can improve the visibility of a marking part, and also can improve the contact | adherence reliability with adhesion objects, such as a marking part and a soldering resist layer. . Moreover, the objective of this invention is providing the manufacturing method of the electronic component which forms a marking part with the said marking material for inkjets. Furthermore, the objective of this invention is providing the electronic component which has a marking part formed with the said marking material for inkjets.

  According to a wide aspect of the present invention, in an electronic component, it is used for forming a marking portion, used by being ejected by an ink jet device, and cured by heating after being cured by light irradiation. An inkjet marking material comprising a photocurable compound, a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and a colorant (hereinafter abbreviated as a marking material). Is provided).

  On the specific situation with the marking material which concerns on this invention, the said photocurable compound contains the photocurable compound which has 1 or more of (meth) acryloyl groups.

  On the specific situation with the marking material which concerns on this invention, the said photocurable compound contains the photocurable compound represented by following formula (1).

  In the formula (1), R1 and R2 each represent a hydrogen atom or a methyl group.

  In a specific aspect of the marking material according to the present invention, the thermosetting agent is an aromatic amine, or a reaction viscosity obtained by reacting dicyandiamide with a functional group-containing compound having a functional group capable of reacting with dicyandiamide. It is a solid material.

  In a specific aspect of the marking material according to the present invention, the inkjet marking material 100 does not contain or contain light and thermosetting compounds, and the inkjet marking material does not contain the light and thermosetting compounds. In the case where the content of the photocurable compound is 40% by weight or more and 90% by weight or less and the inkjet marking material contains the light and thermosetting compound, the marking material for inkjet is 100% by weight. Among them, the total content of the photocurable compound and the light and thermosetting compound is 40% by weight or more and 90% by weight or less.

  In a specific aspect of the marking material according to the present invention, the marking material includes light and a thermosetting compound.

  In a specific aspect of the marking material according to the present invention, the light and thermosetting compound includes a light and thermosetting compound having at least one (meth) acryloyl group and at least one cyclic ether group. Including.

  According to a wide aspect of the present invention, the marking material described above is ejected to the surface of the electronic component main body or the surface of the solder resist layer formed on the surface of the electronic component main body by an ink jet apparatus, and the marking material is irradiated with light. There is provided a method for manufacturing an electronic component, which includes a step of curing by irradiation and then curing by heating to form a marking portion.

  According to a wide aspect of the present invention, the electronic component main body, a solder resist layer, and a marking portion are provided, and the solder resist layer is formed on a surface of the electronic component main body, and the marking portion is the electronic component. It is formed on the surface of the component main body or the surface of the solder resist layer, and the marking portion discharges the marking material described above by an ink jet device, and the marking material is cured by irradiation with light and then heated. An electronic component formed by curing is provided.

  Since the marking material for inkjet according to the present invention includes a photocurable compound, a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and a colorant, it is used to form a marking portion. When used by being ejected by an ink jet device and cured by light irradiation and then cured by heating, the visibility of the marking portion can be increased, and further, the marking portion and the solder resist layer It is possible to improve the adhesion reliability with a close contact object such as the above.

1A to 1C are schematic cross-sectional views for explaining a method for manufacturing an electronic component according to the first embodiment of the present invention. 2A to 2C are schematic cross-sectional views for explaining a method of manufacturing an electronic component according to the second embodiment of the present invention.

  Details of the present invention will be described below.

(Marking material for inkjet)
The inkjet marking material according to the present invention (hereinafter sometimes abbreviated as marking material) is used for forming a marking portion. A marking part is a character or a symbol, and is display information or recording information. In an electronic component such as a printed wiring board, for example, a marking portion is formed in order to record the type and manufacturing information.

  The marking material according to the present invention is used by being discharged by an ink jet apparatus. The marking material according to the present invention is different from a curable composition applied by screen printing and a curable composition applied by a dispenser.

  The marking material according to the present invention is used after being cured by irradiation with light and then cured by heating. The marking material which concerns on this invention is light and a thermosetting composition, and has photocurability and thermosetting. The marking material according to the present invention is different from a curable composition in which only photocuring is performed, a curable composition in which only thermal curing is performed, and the like.

  The marking material according to the present invention comprises a photocurable compound (A), a photopolymerization initiator (B), a thermosetting compound (C), a thermosetting agent (D), and a colorant (E). Including.

  Since the marking material which concerns on this invention is equipped with said structure, the visibility of the marking part formed with the marking material can be improved. Since the marking material has the above composition, it can be cured by heating after irradiating the marking material with light, and can suppress excessive wetting and spreading of the marking material after ejection by an inkjet device. Thus, the marking portion can be accurately formed at a specific position.

  Furthermore, since the marking material which concerns on this invention is equipped with said structure, it can improve the contact | adherence reliability with close_contact | adherence objects, such as a marking part and a soldering resist layer.

  Moreover, since the marking material which concerns on this invention contains a thermosetting compound (C) especially, it can improve the heat resistance of a marking part.

  The marking material is preferably colored. The marking portion is preferably colored and is preferably not transparent. The solder resist material described later is preferably colored. The solder resist layer described later is preferably colored. From the viewpoint of easily recognizing the marking portion, the marking material is preferably colored white. From the viewpoint of easily recognizing the marking portion, the marking portion is preferably colored white.

  From the viewpoint of easily recognizing the marking portion, the solder resist material and the marking material are preferably colored in different colors. From the viewpoint of easily recognizing the marking portion, it is preferable that the solder resist layer and the marking portion are colored in different colors.

  In the marking material, the viscosity at 25 ° C. and 2.5 rpm measured in accordance with JIS K2283 is preferably 160 mPa · s or more, and preferably 1200 mPa · s or less. When the viscosity of the marking material is not less than the lower limit and not more than the upper limit, the marking material can be easily and accurately ejected from the inkjet head. Furthermore, even if the marking material is heated to 50 ° C. or higher, the marking material can be easily and accurately discharged from the inkjet head.

  The viscosity of the marking material is more preferably 1000 mPa · s or less, and even more preferably 500 mPa · s or less. When the above viscosity satisfies the preferable upper limit, when the marking material is continuously ejected from the head, the ejectability becomes even better. Further, from the viewpoint of further suppressing the wetting and spreading of the marking material and further increasing the resolution when forming the marking portion, the viscosity is preferably more than 500 mPa · s.

  The viscosity is measured at 25 ° C. using an E-type viscometer (“TPE100L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

  The marking material according to the present invention preferably contains light and a thermosetting compound (F).

  Hereinafter, the detail of each component contained in the marking material which concerns on this invention is demonstrated.

(Photocurable compound (A))
Examples of the photocurable compound include a curable compound having a (meth) acryloyl group, a curable compound having a vinyl group, and a curable compound having a maleimide group. From the viewpoint of forming the marking portion with higher accuracy, the photocurable compound preferably has a (meth) acryloyl group (one or more). As for the said photocurable compound, only 1 type may be used and 2 or more types may be used together.

  In the present specification, the curable compound having a (meth) acryloyl group means a compound having at least one of a methacryloyl group and an acryloyl group.

  As the photocurable compound, a photocurable compound having one (meth) acryloyl group (referred to as a first photocurable compound (A1)) may be used, and it has two or more (meth) acryloyl groups. A photocurable compound (referred to as a second photocurable compound (A2)) may be used. The first photocurable compound (A1) is, for example, a monofunctional compound. The second photocurable compound (A2) is, for example, a polyfunctional compound. Since the second photocurable compound (A2) has two or more (meth) acryloyl groups, polymerization proceeds and cures upon irradiation with light. As for a 1st photocurable compound (A1) and a 2nd photocurable compound (A2), only 1 type may respectively be used and 2 or more types may be used together.

  From the viewpoint of further suppressing voids and further improving adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability, the photocurable compound includes the first photocurable compound (A1) and the second photocurable compound. (A2) is preferably contained. Moreover, a marking part can be formed with high precision by using together a 1st photocurable compound (A1) and a 2nd photocurable compound (A2) as a photocurable compound.

  As the second photocurable compound (A2), (meth) acrylic acid adduct of polyhydric alcohol, (meth) acrylic acid adduct of alkylene oxide modified product of polyhydric alcohol, urethane (meth) acrylates, and Examples include polyester (meth) acrylates. Examples of the polyhydric alcohol include diethylene glycol, triethylene glycol, polyethylene glycol, dipropylene glycol, tripropylene glycol, polypropylene glycol, trimethylol propane, cyclohexane dimethanol, tricyclodecane dimethanol, an alkylene oxide adduct of bisphenol A, and Examples include pentaerythritol.

  The second photocurable compound (A2) may be a bifunctional (meth) acrylate, a trifunctional methacrylate, or a tetrafunctional or higher (meth) acrylate.

  Examples of the bifunctional (meth) acrylate include 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanedi (meth) acrylate, and 1,10- Decanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 2,4-dimethyl-1,5-pentanediol di (meth) acrylate, butylethylpropanediol (meth) acrylate, ethoxylated cyclohexanemethanol di ( (Meth) acrylate, polyethylene glycol di (meth) acrylate, oligoethylene glycol di (meth) acrylate, ethylene glycol di (meth) acrylate, 2-ethyl-2-butylbutanediol di (meth) acrylate, 2-ethyl-2- Butylp Panjioruji (meth) acrylate, tricyclodecane di (meth) acrylate, and dipropylene glycol di (meth) acrylate.

  Examples of trifunctional (meth) acrylates include trimethylolpropane tri (meth) acrylate, trimethylolethane tri (meth) acrylate, trimethylolpropane alkylene oxide-modified tri (meth) acrylate, and pentaerythritol tri (meth) acrylate. , Dipentaerythritol tri (meth) acrylate, trimethylolpropane tri ((meth) acryloyloxypropyl) ether, isocyanuric acid alkylene oxide modified tri (meth) acrylate, propionate dipentaerythritol tri (meth) acrylate, tri ((meta And acryloyloxyethyl) isocyanurate and sorbitol tri (meth) acrylate.

  Examples of the tetrafunctional (meth) acrylate include pentaerythritol tetra (meth) acrylate, sorbitol tetra (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate, and dipentaerythritol tetra (meth) acrylate propionate. It is done.

  Examples of pentafunctional (meth) acrylates include sorbitol penta (meth) acrylate and dipentaerythritol penta (meth) acrylate.

  Examples of the hexafunctional (meth) acrylate include dipentaerythritol hexa (meth) acrylate, sorbitol hexa (meth) acrylate, and phosphazene alkylene oxide-modified hexa (meth) acrylate.

  The term “(meth) acrylate” refers to acrylate or methacrylate. The term “(meth) acryl” refers to acryl or methacryl.

  The second photocurable compound (A2) is preferably a second photocurable compound having a polycyclic skeleton and having two or more (meth) acryloyl groups. The use of the second photocurable compound can increase the moisture and heat resistance of the marking portion. Therefore, the reliability of the electronic component can be increased.

  Specific examples of the second photocurable compound (A2) having a polycyclic skeleton and having two or more (meth) acryloyl groups include tricyclodecane dimethanol di (meth) acrylate, isobornyl dimethanol Examples include di (meth) acrylate and dicyclopentenyldimethanol di (meth) acrylate. From the viewpoint of further increasing the moisture resistance and heat-and-moisture resistance of the marking portion, the second photocurable compound (A2) is preferably tricyclodecane dimethanol di (meth) acrylate.

  The polycyclic skeleton indicates a structure having a plurality of cyclic skeletons continuously. Examples of the polycyclic skeleton include a polycyclic alicyclic skeleton and a polycyclic aromatic skeleton.

  Examples of the polycyclic alicyclic skeleton include a bicycloalkane skeleton, a tricycloalkane skeleton, a tetracycloalkane skeleton, and an isobornyl skeleton.

  Examples of the polycyclic aromatic skeleton include naphthalene ring skeleton, anthracene ring skeleton, phenanthrene ring skeleton, tetracene ring skeleton, chrysene ring skeleton, triphenylene ring skeleton, tetraphen ring skeleton, pyrene ring skeleton, pentacene ring skeleton, picene ring skeleton and Examples include perylene ring skeletons.

  The second photocurable compound (A2) preferably has a polyether bond from the viewpoint of further suppressing voids and further improving the adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability.

  Examples of the second photocurable compound having a polyether bond include ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, and polyethylene glycol. Di (meth) acrylate, dipropylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, neopentyl glycol with ethylene oxide and propylene oxide Di (meth) acrylate of diol added with bisphenol A, di (meth) acrylate added with ethylene oxide to bisphenol A, and bisphenol Di (meth) acrylate of propylene oxide is added can be mentioned in the Le A.

  Specific examples of the first photocurable compound (A1) include methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, and n-butyl (meth). Acrylate, i-butyl (meth) acrylate, sec-butyl (meth) acrylate, t-butyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) ) Acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, allyl (meth) acrylate, benzyl (meth) acrylate, cyclohexyl (meth) acrylate, phenyl ( Meta Acrylate, 2-methoxyethyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meth) acrylate, methoxypropylene glycol (meth) acrylate, methoxydipropylene Glycol (meth) acrylate, isobornyl (meth) acrylate, dicyclopentadienyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, glycerol mono (meth) acrylate, 2-ethylhexyl (meth) acrylate, Dihydroxycyclopentadienyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, di Kuropentaniru (meth) acrylate, naphthyl (meth) acrylate, lauryl (meth) acrylate, and stearyl (meth) acrylate.

  From the viewpoint of further suppressing voids and further improving adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability, the first photocurable compound (A1) may contain 2-ethylhexyl (meth) acrylate. preferable.

  Examples of the photocurable compound having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethyl styrene, α-methyl styrene, maleic anhydride, dicyclopentadiene, N-vinyl pyrrolidone, and N-vinyl formamide.

  The photocurable compound having a maleimide group is not particularly limited. For example, N-methylmaleimide, N-ethylmaleimide, N-hexylmaleimide, N-propylmaleimide, N-butylmaleimide, N-octylmaleimide, N- Dodecylmaleimide, N-cyclohexylmaleimide, N-phenylmaleimide, Np-carboxyphenylmaleimide, Np-hydroxyphenylmaleimide, Np-chlorophenylmaleimide, Np-tolylmaleimide, Np-xylylmaleimide N-o-chlorophenylmaleimide, N-o-tolylmaleimide, N-benzylmaleimide, N-2,5-diethylphenylmaleimide, N-2,5-dimethylphenylmaleimide, Nm-tolylmaleimide, N-α -Naphthylmaleimide N-o-xylylmaleimide, Nm-xylylmaleimide, bismaleimide methane, 1,2-bismaleimide ethane, 1,6-bismaleimide hexane, bismaleimide dodecane, N, N′-m-phenylene dimaleimide N, N′-p-phenylenedimaleimide, 4,4′-bismaleimide diphenyl ether, 4,4′-bismaleimide diphenylmethane, 4,4′-bismaleimide-di (3-methylphenyl) methane, 4,4 '-Bismaleimide-di (3-ethylphenyl) methane, 4,4'-Bismaleimide-di (3-methyl-5-ethyl-phenyl) methane, N, N'-(2,2-bis- (4 -Phenoxyphenyl) propane) dimaleimide, N, N'-2,4-tolylenedialeimide, N, N'-2,6-tolylenedialeimi And N, N′-m-xylylene dimaleimide and the like.

  From the viewpoint of forming the marking portion with higher accuracy and making it more difficult to generate voids in the marking portion, the photocurable compound preferably contains a photocurable compound represented by the following formula (1). .

  In said formula (1), R1 and R2 represent a hydrogen atom or a methyl group, respectively.

  From the viewpoint of forming the marking portion with higher accuracy, the content of the photocurable compound, and the first photocurable compound (A1) and the second photocurable compound (100% by weight) are included in 100% by weight of the marking material. The total content of A2) is preferably 5% by weight or more, more preferably 10% by weight or more, still more preferably 20% by weight or more, particularly preferably 30% by weight or more, most preferably 40% by weight or more, Preferably it is 90 weight% or less, More preferably, it is 80 weight% or less, More preferably, it is 70 weight% or less.

  In addition, when the marking material does not contain light and a thermosetting compound, from the viewpoint of forming the marking portion with higher accuracy, the content of the photocurable compound in 100% by weight of the marking material is: Preferably 10% by weight or more, more preferably 20% by weight or more, still more preferably 30% by weight or more, particularly preferably 40% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 70% by weight. % By weight or less.

  From the viewpoint of further suppressing voids and further improving adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability, the total of the first photocurable compound (A1) and the second photocurable compound (A2) In 100% by weight, the content of the first photocurable compound (A1) is 50% by weight or more and 99.95% by weight or less, and the content of the second photocurable compound (A2) is 0.05% by weight. The content of the first photocurable compound (A1) is preferably 70% by weight or more and 99.9% by weight or less, and the second photocurable compound (A2) is contained. More preferably, the amount is 0.1 wt% or more and 30 wt% or less, and the content of the first photocurable compound (A1) is 80 wt% or more and 99.5 wt% or less, the second light The content of the curable compound (A2) is 0.5% by weight or more and 20% by weight or less. Theft is more preferable.

  From the viewpoint of further suppressing voids and further improving adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability, the content of the first photocurable compound (A1) in 100% by weight of the marking material, and 2 -Ethylhexyl (meth) acrylate content is preferably 0.05% by weight or more, more preferably 0.1% by weight or more, preferably 70% by weight or less, more preferably 50% by weight or less.

(Photopolymerization initiator (B))
Examples of the photopolymerization initiator include a radical photopolymerization initiator and a photocationic polymerization initiator. In the present invention, a radical photopolymerization initiator is used as the photopolymerization initiator. As for the said photoradical initiator, only 1 type may be used and 2 or more types may be used together.

  The photo radical polymerization initiator is not particularly limited. The photo radical polymerization initiator is a compound for generating radicals upon light irradiation and initiating a radical polymerization reaction. Specific examples of the photo radical polymerization initiator include, for example, benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; 2-hydroxy-2-methyl-1-phenyl-propan-1-one An acetophenone compound such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone; 2-methyl-1- [4- ( Methylthio) phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2-benzyl-2-dimethylamino-1- ( 4-morpholinophenyl) -butanone-1 Aminoacetophenone compounds such as 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone, N, N-dimethylaminoacetophenone; 2 -Anthraquinone compounds such as methyl anthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 2,4-diisopropylthioxanthone; Ketal compounds such as acetophenone dimethyl ketal and benzyl dimethyl ketal; reeds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide Phosphine oxide compound; 1,2-octanedione, 1- [4- (phenylthio) -2- (o-benzoyloxime)], ethanone, 1- [9-ethyl-6- (2-methylbenzoyl) -9H Oxime ester compounds such as -carbazol-3-yl] -1- (o-acetyloxime); bis (cyclopentadienyl) -di-phenyl-titanium, bis (cyclopentadienyl) -di-chloro-titanium, Bis (cyclopentadienyl) -bis (2,3,4,5,6-pentafluorophenyl) titanium, bis (cyclopentadienyl) -bis (2,6-difluoro-3- (pyrrol-1-yl) And titanocene compounds such as phenyl) titanium. As for the said radical photopolymerization initiator, only 1 type may be used and 2 or more types may be used together.

  A photopolymerization initiation assistant may be used together with the photo radical polymerization initiator. Examples of the photopolymerization initiation assistant include N, N-dimethylaminobenzoic acid ethyl ester, N, N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Photopolymerization initiation assistants other than these may be used. As for the said photoinitiation adjuvant, only 1 type may be used and 2 or more types may be used together.

  The content of the photopolymerization initiator in 100% by weight of the marking material is preferably 0.1% by weight or more, more preferably 0.2% by weight or more, preferably 10% by weight or less, more preferably 5% by weight or less. It is.

(Thermosetting compound (C))
Examples of the thermosetting compound include a thermosetting compound having a cyclic ether group and a thermosetting compound having a thiirane group. From the viewpoint of forming the marking portion with higher accuracy, a thermosetting compound having one or more cyclic ether groups is used as the thermosetting compound. The thermosetting compound having a cyclic ether group is more preferably a thermosetting compound having an epoxy group (epoxy compound). As for the said thermosetting compound, only 1 type may be used and 2 or more types may be used together.

  The epoxy compound is not particularly limited, and examples thereof include novolak type epoxy compounds and bisphenol type epoxy compounds. Examples of the novolak type epoxy compound include a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, a biphenyl novolak type epoxy compound, a trisphenol novolak type epoxy compound, a dicyclopentadiene novolak type epoxy compound, and the like. Examples of the bisphenol type epoxy compound include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a 2,2′-diallyl bisphenol A type epoxy compound, a hydrogenated bisphenol type epoxy compound, and a polyoxypropylene bisphenol A type epoxy compound. Can be mentioned. In addition, examples of the epoxy compound include a cycloaliphatic epoxy compound and glycidylamine.

  The thermosetting compound preferably has an aromatic skeleton from the viewpoint of forming the marking portion with higher accuracy and making it more difficult to generate voids in the marking portion.

  From the viewpoint of further suppressing voids and further improving adhesion, moisture-proof adhesion reliability, and cooling cycle reliability, the thermosetting compound having one or more cyclic ether groups is preferably solid at 25 ° C. From the viewpoint of further suppressing voids and further improving adhesion, moisture-resistant adhesion reliability, and cooling cycle reliability, the softening point of the thermosetting compound having one or more cyclic ether groups is preferably 25 ° C or more. More preferably, it is 30 degreeC or more, More preferably, it is 40 degreeC or more. The upper limit of the softening point is not particularly limited. The softening point of the thermosetting compound having one or more cyclic ether groups is preferably 150 ° C. or lower.

  The softening point can be measured according to JIS K7234.

  From the viewpoint of forming the marking portion with higher accuracy, the content of the thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more, preferably 80% in 100% by weight of the marking material. % By weight or less, more preferably 70% by weight or less.

(Thermosetting agent (D))
Examples of the thermosetting agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. A modified polyamine compound such as an amine-epoxy adduct may be used as the thermosetting agent. Thermosetting agents other than these may be used.

  The amine compound means a compound having one or more primary to tertiary amino groups. Examples of the amine compound include (1) aliphatic amine, (2) alicyclic amine, (3) aromatic amine, (4) hydrazide, and (5) guanidine derivative. In addition, epoxy compound addition polyamine (reaction product of epoxy compound and polyamine), Michael addition polyamine (reaction product of α, β unsaturated ketone and polyamine), Mannich addition polyamine (condensate of polyamine, formalin and phenol), thiourea addition Adducts such as polyamine (reaction product of thiourea and polyamine) and ketone-capped polyamine (reaction product of ketone compound and polyamine [ketimine]) may also be used.

  Examples of the (1) aliphatic amine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

  Examples of the (2) alicyclic amine include mensendiamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraoxaspiro (5, 5) Undecane adduct, bis (4-amino-3-methylcyclohexyl) methane, bis (4-aminocyclohexyl) methane and the like.

  As the above (3) aromatic amine, 1,3-diaminotoluene, 1,4-diaminotoluene, 2,4-diaminotoluene, 3,5-diethyl-2,4-diaminotoluene, 3,5-diethyl- 2,6-diaminotoluene, 2,4-diaminoanisole, 4,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylsulfone, 4,4′-methylene-bis [2-chloroaniline], 4,4 ′ -Diaminodiphenyl ether, 2,2-bis [4- [4-aminophenoxy] phenyl] propane, bis [4- [4-aminophenoxy] phenyl] sulfone, 1,3-bis [4-aminophenoxy] benzene, methylenebis -(2-ethyl-6methylaniline), 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 3,3 ', , 5'-tetraethyl-4,4'-diaminodiphenylmethane and the like.

  Examples of (4) hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.

  Examples of the guanidine derivative (5) include dicyandiamide, 1-o-tolyldiguanide, α-2,5-dimethylguanide, α, ω-diphenyldiguanide, α, α-bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, Examples include α, α-hexamethylenebis [ω- (p-chlorophenol)] diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

  Examples of the phenol compound include polyhydric phenol compounds. Examples of the polyhydric phenol compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, naphthalene skeleton-containing phenol novolac resin, Examples thereof include a xylylene skeleton-containing phenol novolak resin, a dicyclopentadiene skeleton-containing phenol novolak resin, and a fluorene skeleton-containing phenol novolak resin.

  Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methyl nadic anhydride, dodecyl succinic anhydride, chlorendic acid, pyromellitic anhydride, Examples include benzophenone tetracarboxylic acid anhydride, methylcyclohexene tetracarboxylic acid anhydride, trimellitic anhydride, and polyazeline acid anhydride.

  From the viewpoint of further increasing the thickness accuracy of the marking part and further making it difficult to generate voids in the marking part, the thermosetting agent preferably contains an acid anhydride or an aromatic amine, and contains an aromatic amine. More preferably.

  From the viewpoint of further improving the visibility of the marking part and further improving the adhesion reliability of the marking part, the thermosetting agent is an aromatic amine or has a functional group capable of reacting with dicyandiamide and dicyandiamide. A viscous reaction product obtained by reacting a functional group-containing compound is preferable.

  From the viewpoint of further improving the inkjet dischargeability, the reaction viscous material is preferably not a solid, preferably not a crystal, and preferably not a crystalline solid. The reaction viscous material is preferably in a liquid or semi-solid form.

  The reaction viscous product is preferably transparent or translucent. Whether or not the reaction viscous material is transparent or translucent can be determined by whether or not the object is visible when the object is viewed through the reaction viscous material having a thickness of 5 mm.

  In 100% by weight of the marking material, the content of the thermosetting agent is preferably 1% by weight or more, more preferably 5% by weight or more, preferably 60% by weight or less, more preferably 50% by weight or less.

(Colorant (E))
Examples of the colorant include titanium oxide, zinc oxide, zirconium oxide, antimony oxide, magnesium oxide, phthalocyanine compounds, anthraquinone compounds, azo compounds, nigrosine compounds, and perylene compounds. As for the said coloring agent, only 1 type may be used and 2 or more types may be used together.

  From the viewpoint of further improving the visibility of the marking portion, the colorant is preferably titanium oxide, a nigrosine compound or a phthalocyanine compound. The colorant is preferably titanium oxide, and is preferably a nigrosine compound or a phthalocyanine compound.

  When the colorant is a particle such as titanium oxide, the average particle diameter of the colorant as a particle is preferably 0.1 μm or more, and preferably 40 μm or less.

  The average particle size of the colorant as the particle is a particle size value when the integrated value is 50% in the volume-based particle size distribution curve. The average particle size can be measured using, for example, a laser beam type particle size distribution meter. As a commercial product of the laser beam type particle size distribution analyzer, “LS 13 320” manufactured by Beckman Coulter, Inc. can be cited.

  Specific examples of the phthalocyanine compound include copper phthalocyanine and iron phthalocyanine. Specific examples of the anthraquinone compounds include alizarin and dihydroxyanthraquinone. Specific examples of the azo compound include p- (phenylazo) phenol and 1,5-dioxynaphthalene.

  Examples of commercially available phthalocyanine compounds include 650M, varifest 2610, varifest 2620, varifest blue 1605, and varifest blue 2670 manufactured by Orient Chemical Industries. As a commercial item of the said anthraquinone type compound, NUBIAN BLUE PS-5630 by Orient Chemical Industry Co., Ltd. is mentioned. Examples of commercially available products of the azo compound include valentest black 3804, valentest black 3820, and valentest black 3870 manufactured by Orient Chemical Industries. Examples of commercially available products of the nigrosine compound include varifest black 1821 manufactured by Orient Chemical Industry Co., Ltd.

  The blending amount of the colorant is appropriately adjusted so that the marking portion shows a desired color, and is not particularly limited. In 100% by weight of the marking material, the content of the colorant is preferably 0.1% by weight or more, and preferably 50% by weight or less.

(Light and thermosetting compound (F))
The marking material does or does not contain light and thermosetting compounds.

  From the viewpoint of further increasing the thickness accuracy of the marking portion and further making it difficult to generate voids in the marking portion, the marking material preferably contains light and a thermosetting compound. Examples of the light and thermosetting compounds include compounds having various photocurable functional groups and various thermosetting functional groups. From the viewpoint of forming the marking portion with higher accuracy, the light and thermosetting compound preferably has at least one (meth) acryloyl group and at least one cyclic ether group. ) It is preferable to have at least one acryloyl group and at least one epoxy group. As for the said light and a thermosetting compound, only 1 type may be used and 2 or more types may be used together.

  The photocurable compound, the first photocurable compound, the second photocurable compound, and the thermosetting compound are preferably blended as components different from the light and thermosetting compound. .

  Although it does not specifically limit as said light and a thermosetting compound, The compound which has a (meth) acryloyl group and an epoxy group, the partial (meth) acrylate of an epoxy compound, a urethane modified (meth) acryl epoxy compound, etc. are mentioned.

  Examples of the compound having the (meth) acryloyl group and the epoxy group include glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether.

  The partial (meth) acrylated product of the epoxy compound can be obtained by reacting an epoxy compound and (meth) acrylic acid in the presence of a catalyst according to a conventional method. Examples of the epoxy compound that can be used for the partial (meth) acrylate of the epoxy compound include novolac-type epoxy compounds and bisphenol-type epoxy compounds. Examples of the novolak type epoxy compound include a phenol novolak type epoxy compound, a cresol novolak type epoxy compound, a biphenyl novolak type epoxy compound, a trisphenol novolak type epoxy compound, a dicyclopentadiene novolak type epoxy compound, and the like. Examples of the bisphenol type epoxy compound include a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a 2,2′-diallyl bisphenol A type epoxy compound, a hydrogenated bisphenol type epoxy compound, and a polyoxypropylene bisphenol A type epoxy compound. Can be mentioned. By appropriately changing the blending amount of the epoxy compound and (meth) acrylic acid, an epoxy compound having a desired acrylate ratio can be obtained. The blending amount of the carboxylic acid with respect to 1 equivalent of epoxy group is preferably 0.1 equivalent or more, more preferably 0.2 equivalent or more, preferably 0.7 equivalent or less, more preferably 0.5 equivalent or less.

  The urethane-modified (meth) acryl epoxy compound is obtained, for example, by the following method. A polyol and a bifunctional or higher functional isocyanate are reacted, and the remaining isocyanate group is reacted with a (meth) acryl monomer having an acid group and glycidol. Alternatively, a (meth) acryl monomer having a hydroxyl group in a bifunctional or higher isocyanate and glycidol may be reacted without using a polyol. Alternatively, the urethane-modified (meth) acryl epoxy compound can be obtained by reacting glycidol with a (meth) acrylate monomer having an isocyanate group. Specifically, for example, first, 1 mol of trimethylolpropane and 3 mol of isophorone diisocyanate are reacted under a tin-based catalyst. The urethane-modified (meth) acrylic epoxy compound is obtained by reacting the isocyanate group remaining in the obtained compound with hydroxyethyl acrylate which is an acrylic monomer having a hydroxyl group and glycidol which is an epoxy having a hydroxyl group.

  The polyol is not particularly limited, and examples thereof include ethylene glycol, glycerin, sorbitol, trimethylolpropane, and (poly) propylene glycol.

  The isocyanate is not particularly limited as long as it is bifunctional or higher. Examples of the isocyanate include isophorone diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, hexamethylene diisocyanate, trimethylhexamethylene diisocyanate, diphenylmethane-4,4′-diisocyanate (MDI), and hydrogenated MDI. , Polymeric MDI, 1,5-naphthalene diisocyanate, norbornane diisocyanate, tolidine diisocyanate, xylylene diisocyanate (XDI), hydrogenated XDI, lysine diisocyanate, triphenylmethane triisocyanate, tris (isocyanatophenyl) thiophosphate, tetramethylxylene Examples include diisocyanate and 1,6,10-undecane triisocyanate.

  From the viewpoint of further increasing the thickness accuracy of the marking portion and further suppressing the generation of voids, it is preferable that the light and the thermosetting compound contain 4-hydroxybutyl acrylate glycidyl ether.

  From the viewpoint of forming the marking portion with higher accuracy, the content of the light and thermosetting compound and the content of 4-hydroxybutyl acrylate glycidyl ether in 100% by weight of the marking material are each preferably 0.00. It is 5% by weight or more, more preferably 1% by weight or more, preferably 80% by weight or less, more preferably 70% by weight or less.

  From the viewpoint of forming the marking portion with higher accuracy, the total content of the photocurable compound and the light and thermosetting compound is preferably 10% by weight or more in 100% by weight of the marking material. More preferably, it is 20% by weight or more, more preferably 30% by weight or more, particularly preferably 40% by weight or more, preferably 90% by weight or less, more preferably 80% by weight or less, still more preferably 70% by weight or less.

(Curing accelerator)
Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organometallic salts, phosphorus compounds, urea compounds, and the like. As for the said hardening accelerator, only 1 type may be used and 2 or more types may be used together.

  In 100% by weight of the marking material, the content of the curing accelerator is preferably 0.01% by weight or more, more preferably 0.1% by weight or more, preferably 10% by weight or less, more preferably 5% by weight or less. is there.

(solvent)
The marking material may or may not contain a solvent. The marking material may or may not contain a solvent. From the viewpoint of further increasing the thickness accuracy of the marking portion and further making it difficult for voids to be generated in the marking portion, the lower the solvent content in the marking material, the better.

  Examples of the solvent include water and organic solvents. From the viewpoint of further improving the removability of the residue, an organic solvent is preferable. Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, cellosolve, methyl cellosolve, butyl cellosolve, carbitol, and methylcarbitol. , Butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, glycol ethers such as tripropylene glycol monomethyl ether, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol Acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene Recall monomethyl ether acetate, esters such as propylene carbonate, octane, aliphatic hydrocarbons decane, and petroleum ether, petroleum solvents such as naphtha.

  When the marking material contains the solvent, the content of the solvent is preferably 5% by weight or less, more preferably 1% by weight or less, and still more preferably 0.5% by weight or less in 100% by weight of the marking material. It is.

(Filler)
The marking material may or may not contain a filler. The marking material may or may not contain a filler. From the viewpoint of further increasing the thickness accuracy of the marking portion and further making it difficult to generate voids in the marking portion, the smaller the filler content in the marking material, the better. Furthermore, the smaller the filler content in the marking material, the lower the occurrence of ejection failure by the ink jet apparatus.

  Examples of the filler include silica, talc, clay, mica, hydrotalcite, alumina, magnesium oxide, aluminum hydroxide, aluminum nitride, and boron nitride.

  When the marking material contains the filler, the content of the filler is preferably 5% by weight or less, more preferably 1% by weight or less, still more preferably 0.5% by weight or less in 100% by weight of the marking material. It is.

(Other ingredients)
The marking material may contain other components. Although it does not specifically limit as another component, Adhesion adjuvants, such as a coupling agent, a pigment, dye, a leveling agent, an antifoamer, a polymerization inhibitor, etc. are mentioned.

(Electronic component and electronic component manufacturing method)
The electronic component according to the present invention includes an electronic component main body, a solder resist layer, and a marking portion. The solder resist layer is formed on the surface of the electronic component body. The marking part is formed on the surface of the electronic component main body or the surface of the solder resist layer. The marking portion is formed by ejecting the marking material by an ink jet apparatus, curing the marking material by light irradiation, and then curing by heating.

  The method for manufacturing an electronic component according to the present invention preferably includes a step of forming a solder resist layer (solder resist layer forming step, first step) on the surface of the electronic component main body. The method of manufacturing an electronic component according to the present invention is such that the marking material is ejected onto the surface of the electronic component main body or the surface of the solder resist layer formed on the surface of the electronic component main body by an ink jet apparatus, and the marking material is optically emitted. After the curing is progressed by irradiation, the step of curing by heating to form a marking portion (marking portion forming step, second step) is provided.

  In the method of manufacturing an electronic component according to the present invention, preferably, the surface of the solder resist layer in the formation region of the marking part formed later is formed on the surface of the electronic component main body including the formation region of the marking part formed after (1A). A solder resist layer is formed so as to be concave, or (2A) a marking that is formed later without forming a solder resist layer on the surface of the electronic component body in the formation area of the marking portion formed after A solder resist layer forming step (first step) for forming a solder resist layer on the surface of the electronic component main body in a region excluding the portion forming region, and (1B) an ink jet in a concave region on the surface of the solder resist layer. The marking material is discharged by an apparatus to form a marking portion, or (2B) the solder resist layer is not formed. In the region, discharging marking material by an ink jet device, and a marking portion forming step of forming a marking portion (second step).

  In the first preferred example of the method for manufacturing an electronic component according to the present invention, in the solder resist layer forming step, the electronic component body is formed later on the surface of the electronic component main body including the formation region of the marking portion formed after (1A). A solder resist layer is formed so that the surface of the solder resist layer in the marking portion forming region is concave, and in the marking portion forming step, (1B) the concave region on the surface of the solder resist layer is marked by an inkjet device. Material is discharged to form a marking portion.

  In the second preferred example of the method for producing an electronic component according to the present invention, in the solder resist layer forming step, a solder resist layer is formed on the surface of the electronic component main body in the formation region of the marking portion formed after (2A). And a solder resist layer is formed on the surface of the electronic component main body in a region excluding the formation region of the marking portion to be formed later, and (2B) the solder resist layer is not formed in the marking portion forming step. A marking material is ejected onto the region by an inkjet device to form a marking portion.

  In the electronic component obtained by the first and second examples, peeling of the marking portion can be suppressed. Further, the protrusion of the marking portion from the surface of the solder resist layer can be suppressed, and the flatness of the surface formed by the solder resist layer and the marking portion can be enhanced. By suppressing the protrusion of the marking portion, the marking portion is hardly rubbed and the marking portion is hardly peeled off. In the present invention, since the marking material is discharged by the ink jet apparatus, the marking portion can be formed with high definition and high accuracy.

  From the viewpoints of further suppressing the peeling of the marking part and easily increasing the flatness of the surface formed by the solder resist layer and the marking part, the first example and the second example are the first ones. Two examples are preferred. From the viewpoint of further suppressing the corrosion by the solder resist layer, the first example is preferable among the first example and the second example.

  In addition, after forming the solder resist layer with a flat surface, you may form a marking part on the surface of the formed solder resist layer.

  In the present invention, an electronic component having a conductor exposed portion may be obtained. In the solder resist layer forming step, the solder resist layer is not formed in a region to be a conductor exposed portion in the obtained electronic component.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

  A method for manufacturing an electronic component according to the first embodiment of the present invention, which is the first example, will be described with reference to FIGS.

  As shown in FIG. 1A, an electronic component body 11 is prepared. The electronic component main body 11 includes a marking portion forming region 11a to be formed later and another region 11b. The electronic component body 11 has a conductor exposed portion at a position not shown. In addition, wiring may be formed on the surface of the electronic component main body 11. The marking portion forming region 11a is a position where the electronic component main body 11 and a marking portion to be formed later face each other.

  Next, as shown in FIG. 1 (b), it is formed later on the surface of the electronic component body 11 including the marking portion forming region 11a to be formed later and the other region 11b excluding the marking portion forming region 11a. The solder resist layer 12 is formed so that the surface opposite to the electronic component main body 11 side of the solder resist layer 12 in the marking portion forming region 11a is concave (solder resist layer forming step). Preferably, the solder resist layer 12 is formed by discharging a solder resist material by the ink jet apparatus 51. The solder resist layer may be a single layer or a multilayer.

  Between the regions of the solder resist layer 12 formed in the other regions 11b, the surface of the solder resist layer 12 formed in the formation region 11a of the marking portion to be formed later becomes a concave region 12a.

  Next, as shown in FIG.1 (c), marking material is discharged to the concave area | region 12a of the surface of the soldering resist layer 12 with the inkjet apparatus 52, and the marking part 13 is formed (marking part formation process). As a result, the electronic component 10 is obtained.

  In the first example, from the viewpoint of further improving the smoothness of the surface, it is preferable to form the marking portion so as to fill the concave region. From the viewpoint of further improving the flatness of the surface, it is preferable to form the marking portion so that the marking portion does not protrude from the surface of the solder resist layer.

  A method for manufacturing an electronic component according to the second embodiment of the present invention, which is the second example, will be described with reference to FIGS.

  As shown in FIG. 2A, an electronic component main body 21 is prepared. The electronic component main body 21 includes a marking portion forming region 21a to be formed later and another region 21b. The electronic component body 21 has a conductor exposed portion at a position not shown. In addition, wiring may be formed on the surface of the electronic component main body 21.

  Next, as shown in FIG. 2 (b), the marking resist forming area is formed on the surface of the electronic component main body 21 in the marking forming area 21a to be formed later, and the marking forming area to be formed later is formed. A solder resist layer 22 is formed on the surface of the electronic component main body in the other region 21b excluding 21a (solder resist layer forming step). Between the solder resist layers 22 formed in the other regions 21b, no solder resist layer is formed in the marking region forming region 21a to be formed later. Preferably, the solder resist layer 22 is formed by discharging the solder resist material by the ink jet apparatus 51. The solder resist layer may be a single layer or a multilayer.

  Next, as shown in FIG. 2C, a marking material is discharged by an inkjet device 52 to a region where the solder resist layer 22 is not formed to form a marking portion 23 (marking portion forming step). As a result, the electronic component 20 is obtained. A marking portion 23 is formed on the surface of the electronic component main body 21 in the marking portion forming region 21a.

  In the second example, from the viewpoint of further improving the flatness of the surface, it is preferable to form the marking portion so as to fill the region where the solder resist layer is not formed. From the viewpoint of further improving the flatness of the surface, it is preferable to form the marking portion so that the marking portion does not protrude from the surface of the solder resist layer.

  From the viewpoint of further suppressing the peeling of the marking portion and further improving the flatness of the surface formed by the solder resist layer and the marking portion, in the electronic component, the solder resist layer excluding the formation region of the marking portion The difference between the height of the surface opposite to the electronic component main body side and the height of the surface of the marking portion opposite to the electronic component main body side is preferably 10 μm or less, more preferably 5 μm or less, still more preferably 0.5 μm or less, most preferably 0 μm.

  The height is measured using a laser microscope (“OLS4100” manufactured by OLYMPUS). Moreover, the said height is calculated | required by measuring arbitrary several places and averaging a measured value.

  Of the surface opposite to the electronic component body side of the marking portion, the surface portion located outside the surface opposite to the electronic component body side of the solder resist layer excluding the formation region of the marking portion The ratio of (protruding surface portion) is preferably 50% or less, more preferably 20% or less, still more preferably 10% or less, and most preferably 0%.

  In order to color the solder resist material, dyes, pigments, fillers, and the like can be appropriately used.

  From the viewpoint of further suppressing the peeling of the marking portion, it is preferable that the solder resist material has thermosetting properties. In this case, the solder resist material and the marking material are thermally cured. After the solder resist material is thermally cured, the marking material may be thermally cured. From the viewpoint of further suppressing the peeling of the marking portion, both the solder resist material and the marking material were thermally cured, or the solder resist material was thermally cured without previously curing the solder resist material. Thereafter, both the solder resist material and the marking material may be thermally cured.

  From the viewpoint of further suppressing peeling of the marking portion, it is preferable that the solder resist material has photocurability and thermosetting. In this case, the solder resist material and the marking material are photocured and thermally cured. After the solder resist material is light-cured and heat-cured, the marking material may be light-cured and heat-cured. From the viewpoint of further suppressing the peeling of the marking portion, both the solder resist material and the marking material are photocured and heat cured without precuring and curing the solder resist material in advance. After the photocuring is advanced, the solder resist material may be thermally cured and the marking material may be photocured and thermally cured.

  In the said soldering resist material, in order to express thermosetting, a thermosetting compound and a thermosetting agent can be used. In order to develop photocurability, a photocurable compound and a photopolymerization initiator can be used. Moreover, in order to express photocurability and thermosetting, you may use light and a thermosetting compound.

  In the solder resist material, the thermosetting compound is preferably a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. From the viewpoint of enhancing curability and further enhancing heat resistance and insulation reliability, the cyclic ether group is preferably an epoxy group. The compound having a cyclic ether group preferably has two or more cyclic ether groups. As for the said thermosetting compound, only 1 type may be used and 2 or more types may be used together.

  In the solder resist material, examples of the thermosetting agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. As for the said thermosetting agent, only 1 type may be used and 2 or more types may be used together.

  In the solder resist material, examples of the photocurable compound include a curable compound having a (meth) acryloyl group, a curable compound having a vinyl group, and a curable compound having a maleimide group. As for the said photocurable compound, only 1 type may be used and 2 or more types may be used together.

  In the solder resist material, examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator. As for the said photoinitiator, only 1 type may be used and 2 or more types may be used together.

  Examples of the light and thermosetting compounds include compounds having a (meth) acryloyl group and a cyclic ether group. As for the said light and a thermosetting compound, only 1 type may be used and 2 or more types may be used together.

  The inkjet apparatus has an inkjet head. The ink jet apparatus has a nozzle. The inkjet apparatus may include a heating unit for heating the temperature in the inkjet apparatus or the inkjet head to 50 ° C. or higher. In this case, the viscosity at the time of discharging the marking material and the solder resist material can be lowered, and by increasing the viscosity by lowering the temperature after discharging, the excessive wetting and spreading of the marking material and the solder resist material can be suppressed. it can.

  In the said soldering resist material, the viscosity in 25 degreeC and 2.5 rpm measured based on JISK2283 becomes like this. Preferably it is 160 mPa * s or more, Preferably it is 1200 mPa * s or less. When the viscosity of the solder resist material is not less than the above lower limit and not more than the above upper limit, the solder resist material can be easily and accurately discharged from the inkjet head. Furthermore, even if the solder resist material is heated to 50 ° C. or higher, the solder resist material can be easily and accurately discharged from the inkjet head.

  The viscosity of the solder resist material is more preferably 1000 mPa · s or less, and even more preferably 500 mPa · s or less. When the above viscosity satisfies the preferable upper limit, when the solder resist material is continuously ejected from the ink jet head, the ejectability is further improved. From the viewpoint of further suppressing the wetting and spreading of the solder resist material and further increasing the resolution when forming the solder resist layer, the viscosity is preferably more than 500 mPa · s.

  The viscosity is measured at 25 ° C. using an E-type viscometer (“TPE100L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

  Examples of the electronic component include a printed wiring board and a touch panel component. Since reliability can be improved by the present invention, it is preferable to obtain an electronic component which is a printed wiring board.

  Hereinafter, the present invention will be specifically described with reference to Examples and Comparative Examples. The present invention is not limited only to the following examples.

(Synthesis Example 1)
In a three-necked flask equipped with a stirrer, a thermometer, and a dropping funnel, 50 g of methyl cellosolve, 15 g of dicyandiamide, and 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s -1 g of triazine was added and heated to 100 ° C to dissolve dicyandiamide. After dissolution, 130 g of butyl glycidyl ether was added dropwise from the dropping funnel over 20 minutes and reacted for 1 hour. Thereafter, the temperature was lowered to 60 ° C., and the solvent was removed under reduced pressure to obtain a yellow and translucent reaction viscous product. The resulting reaction viscous product did not contain a solvent.

Example 1
Preparation of solder resist material:
65 parts by weight of tricyclodecane dimethanol diacrylate (“IRR214-K” manufactured by Daicel Ornex Co.) corresponding to the photocurable compound (A), and α-aminoalkylphenone type corresponding to the photopolymerization initiator (B) 5 parts by weight of photo radical polymerization initiator (“Irgacure 907” manufactured by BASF) and bisphenol A type epoxy resin corresponding to thermosetting compound (C) (“YD-127” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Part, 10 parts by weight of the reaction viscous product obtained in Synthesis Example 1, and 1 part by weight of 650M (oriental chemical industry, phthalocyanine compound) corresponding to the colorant (E) are cured. Sex composition was obtained.

Preparation of marking material:
65 parts by weight of tricyclodecane dimethanol diacrylate (“IRR214-K” manufactured by Daicel Ornex Co.) corresponding to the photocurable compound (A), and α-aminoalkylphenone type corresponding to the photopolymerization initiator (B) 5 parts by weight of a photo-radical polymerization initiator (“Irgacure 907” manufactured by BASF) and 25 parts by weight of a bisphenol A type epoxy resin (“YD-127” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) corresponding to the thermosetting compound (C) White marking material by blending 10 parts by weight of the reaction viscous product obtained in Synthesis Example 1 and 10 parts by weight of titanium oxide (“R-21” manufactured by Sakai Chemical Industry Co., Ltd.) as a colorant. Got.

Fabrication of printed wiring board:
A printed wiring board body having a copper wiring formed on the surface was prepared. A printed wiring board was formed according to FIGS. In the solder resist layer forming step, the solder resist material was thermoset, and in the marking portion forming step, the marking material was thermoset. Moreover, the solder resist layer was not formed in the region where the copper wiring was exposed in the obtained electronic component.

  In the obtained electronic component, the difference between the height of the surface of the solder resist layer opposite to the printed wiring board body side and the height of the surface of the marking portion opposite to the printed wiring board body side is 0 μm. Met.

(Examples 2 to 17 and Comparative Examples 1 to 3)
A marking material was obtained in the same manner as in Example 1 except that the type and amount of the blending component of the marking material were changed as shown in Tables 1 to 3 below.

  A printed wiring board was obtained in the same manner as in Example 1 except that the obtained marking material was used.

(Example 18)
According to FIGS. 2A to 2C, a printed wiring board was formed in the same manner as in Example 1 except that the printed wiring board was formed.

  In the obtained electronic component, the difference between the height of the surface of the solder resist layer opposite to the printed wiring board body side and the height of the surface of the marking portion opposite to the printed wiring board body side is 0. It was 5 μm.

(Evaluation)
(1) Visibility of the marking portion The surface of the obtained printed wiring board on which the solder resist layer and the marking portion were formed was visually confirmed to evaluate the visibility of the marking portion. The visibility of the marking part was determined according to the following criteria.

[Judgment criteria for marking section visibility]
○: Marking part can be easily recognized ×: Marking part cannot be easily recognized

(2) Adhesion reliability of marking part About the obtained printed wiring board, after hold | maintaining for 10 minutes at -55 degreeC using a liquid tank type | mold thermal shock tester ("TSB-51" by ESPEC), 150 degreeC A heat cycle test was performed in which the process of holding the temperature at 150 ° C. for 10 minutes and then lowering the temperature to −50 ° C. was taken as one cycle. The printed wiring board was taken out after 50 cycles, 100 cycles and 200 cycles. Evaluation of the adhesion reliability of the marking part by observing the peeling of the marking part of the obtained printed wiring board using an ultrasonic exploration imaging device (“mi-scope hyper II” manufactured by Hitachi Construction Machinery Finetech Co., Ltd.) did. The adhesion reliability of the marking part was evaluated according to the following criteria.

[Judgment criteria for adhesion reliability of marking parts]
○○: Not peeled ○: Slightly peeled (no problem in use)
×: Exfoliated greatly (problems in use)

  The composition and evaluation results of the marking part are shown in Tables 1 to 3 below.

DESCRIPTION OF SYMBOLS 10,20 ... Electronic component 11, 21 ... Electronic component main body 11a, 21a ... Marking part formation area 11b, 21b ... Other area 12, 22 ... Solder resist layer 12a ... Concave area 13, 23 ... Marking part 51, 52 ... Inkjet device

Claims (9)

In an electronic component, it is used to form a marking portion, is used by being ejected by an inkjet device, and is cured by heating after being cured by light irradiation, and is used for an inkjet marking material,
An ink-jet marking material comprising a photocurable compound, a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and a colorant.   The inkjet marking material according to claim 1, wherein the photocurable compound includes a photocurable compound having one or more (meth) acryloyl groups. The marking material for inkjet according to claim 2, wherein the photocurable compound contains a photocurable compound represented by the following formula (1).

In the formula (1), R1 and R2 each represent a hydrogen atom or a methyl group.   The thermosetting agent is an aromatic amine or a reaction viscous product obtained by reacting dicyandiamide with a functional group-containing compound having a functional group capable of reacting with dicyandiamide. Item 2. An inkjet marking material according to Item 1. Does not contain or contain light and thermosetting compounds,
When the marking material for inkjet does not contain the light and thermosetting compound, the content of the photocurable compound is 40% by weight or more and 90% by weight or less in 100% by weight of the marking material for inkjet.
When the marking material for inkjet includes the light and thermosetting compound, the total content of the photocurable compound and the light and thermosetting compound is 40% by weight in 100% by weight of the marking material for inkjet. The inkjet marking material according to any one of claims 1 to 4, which is 90% by weight or less.   The marking material for inkjet according to any one of claims 1 to 5, comprising light and a thermosetting compound.   The inkjet marking material according to claim 6, wherein the light and thermosetting compound includes a light and thermosetting compound having one or more (meth) acryloyl groups and one or more cyclic ether groups.   The marking material according to any one of claims 1 to 7 is discharged by an inkjet device onto the surface of the electronic component body or the surface of the solder resist layer formed on the surface of the electronic component body, A method for manufacturing an electronic component, comprising: a step of forming a marking portion by curing by heating and then curing by heating. An electronic component main body, a solder resist layer, and a marking part are provided.
The solder resist layer is formed on the surface of the electronic component body,
The marking part is formed on the surface of the electronic component body or the surface of the solder resist layer,
The marking portion is formed by ejecting the marking material according to any one of claims 1 to 7 by an inkjet apparatus, curing the marking material by irradiation with light, and then curing the marking material by heating. Electronic parts.

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