JP2016192306A - Socket for electrical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a socket for electrical component in which the contact pressure of an electric contact can be reduced significantly for the electrode of an electrical component.SOLUTION: In an IC socket 12 where an IC package 11 is housed in an upper plate 14, a lower plate 16 is disposed oppositely on a wiring board 10, an intermediate plate 15 is located between the upper and lower plates 14, 16, and the IC package 11 and a wiring board 10 are connected electrically by a plurality of wire probes 13, the wire probes 13 includes a substantially hooked spring 13a inserted into the insertion hole 15a of the intermediate plate 15, a first contact part 13b extending from the first spring region 13e of the spring 13a, and inserted into the insertion hole 14a of the upper plate 14 so as to come into contact with the solder ball 11a of the IC package 11, and a second contact part 13c extending from the second spring region of 13f of the spring 13a, and inserted into the insertion hole 16a of the lower plate 16 so as to come into contact with the electrode 10a of the wiring board 10.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electrical component socket for electrically connecting a first electrical component such as a semiconductor device (hereinafter referred to as an “IC package”) to a second electrical component such as a wiring board.

  Conventionally, as an electrical component socket (hereinafter referred to as “IC socket”) using this type of wire probe, for example, the one described in Patent Document 1 below is known.

  In Patent Document 1, an IC socket is disposed on a wiring board, and an IC package is accommodated in the IC socket. Then, using the wire probe provided in the IC socket, the electrode of the wiring board and the electrode of the IC package are electrically connected.

  These wire probes are embedded in an elastomer material layer in a state where ball contacts are formed at both ends thereof and are deformed into a predetermined shape.

Japanese Patent No. 3206922

  In such an IC socket, when the contact portion of the wire probe and the terminal of the IC package are electrically connected, it is necessary to sufficiently ensure the stability and reliability of the connection.

  However, when such a conventional IC socket is used repeatedly over a long period of time, the material forming the terminals of the IC package adheres to the contact portion of the wire probe, and the electrical resistance of the contact portion As a result, the stability and reliability of electrical connection may not be ensured. For example, when the terminals of this IC package are formed of lead-free solder (tin) and a burn-in test is repeatedly performed at a high temperature for a large number of IC packages, the tin melts into the contact portion of the wire probe. Adhere and alloy. As a result, the contact resistance between the wire probe and the terminal of the IC packet increases, and the reliability of the operation test or the like is impaired.

  Here, in order to make it difficult for the material for forming the terminal of the IC package to adhere to the contact portion of the wire probe, it is desirable to make the contact pressure of the wire probe to the terminal of the IC package as small as possible.

  Therefore, an object of the present invention is to provide a socket for an electrical component that can greatly reduce the contact pressure of the electrical contact with the electrode of the electrical component.

  In order to solve such a problem, the invention of claim 1 includes a first plate that accommodates the first electrical component, a second plate that is disposed to face the second electrical component, and the first plate. A plurality of electrical contacts electrically connecting the first electrical component and the second electrical component, the insulating third plate disposed between the second plate and the second plate Each of the electrical contacts is inserted into a third insertion hole of the third plate, and is inclined and extended toward the first plate. A spring portion having a substantially straight first spring region and a substantially straight second spring region extending obliquely toward the second plate, and the first of the spring portion. Extending from the spring region of the first plate and inserted through a first insertion hole provided in the first plate. A first contact portion that is in contact with the first electrode of the first electrical component, and a second contact portion that extends from the second spring region of the spring portion and is provided on the second plate. An electrical component socket having a second contact portion that is inserted through the insertion hole and is in contact with the second electrode of the second electrical component.

  According to a second aspect of the present invention, in addition to the configuration according to the first aspect, the spring portion plastically deforms a central portion of the spring-like wire into a substantially “<” shape or a substantially “U” shape. It was formed by this.

  According to a third aspect of the present invention, in addition to the configuration of the first or second aspect, the first plate is provided so as to be movable up and down, and the second plate is fixed.

  According to a fourth aspect of the present invention, in addition to the structure according to any one of the first to third aspects, the third plate includes the first spring region and the second spring of the plurality of electrical contacts. It is characterized by being supported by these electric contacts by being locked to the boundary portion of the region.

  According to the first aspect of the present invention, the urging force of the spring portion is inclined toward the substantially straight first spring region and the second plate that are inclined and extended toward the first plate. Since it is generated by the extended substantially straight second spring region, the contact pressure of the electric contact with the first electrode of the first electric component can be made extremely small. For this reason, it becomes difficult for the material for forming the first electrode of the first electrical component to adhere to the first contact portion of the electrical contact, and therefore when the electrical contact is brought into contact with the first electrical component. It is possible to provide a socket for an electrical component in which the contact resistance can be sufficiently lowered and the contact resistance does not easily increase after long-term use.

  According to the second aspect of the present invention, the spring portion is formed by plastically deforming the central portion of the spring wire into a substantially “<” shape or a substantially ““ ”shape, so that it is inexpensive in a simple process. It is possible to manufacture sockets for electrical parts.

  According to the invention of claim 3, since the second plate is fixed while the first plate is provided so as to be movable up and down, even if the contact pressure of the first electric component to the first electrode is very small. The contact pressure of the second electrical component with respect to the second electrode can be sufficiently increased.

  According to the invention of claim 4, since the third plate is locked to the boundary portion between the first spring region and the second spring region of the electric contactor, the first electric component is The electric contact can be smoothly deformed when accommodated in the plate.

It is sectional drawing which shows schematically the structure of the IC socket which concerns on Embodiment 1 of this invention, (a) is a top view, (b) is AA sectional drawing of (a). It is sectional drawing which shows roughly the principal part structure of the IC socket which concerns on the embodiment, (a) does not accommodate the IC package, (b) shows the state which accommodates the IC package. It is a top view which shows roughly the principal part structure of the IC socket which concerns on the same Embodiment 1, (a) shows an upper side plate, (b) shows an intermediate | middle plate, (c) shows a lower side plate. It is sectional drawing which shows the wire probe which concerns on the same Embodiment 1 roughly, (a) shows a 1st contact part, (b) shows a 2nd contact part. (A)-(e) is sectional drawing which shows schematically the manufacturing process of the IC socket which concerns on the same Embodiment 1. FIG. (A)-(c) is sectional drawing which shows schematically the manufacturing process of the IC socket which concerns on the same Embodiment 1. FIG. It is a figure which shows schematically the manufacturing process of the IC socket which concerns on the same Embodiment 1, (a) is a top view, (b) is sectional drawing.

Embodiments of the present invention will be described below.
Embodiment 1 of the Invention
As shown in FIGS. 1 and 2, in this embodiment, the IC socket 12 as the “electrical component socket” is disposed on the wiring board 10 as the “second electric component”, An IC package 11 as “1 electric component” is accommodated. Then, the solder balls 11 a as “first electrodes” of the IC package 11 and the electrodes 10 a as “second electrodes” of the wiring substrate 10 are electrically connected via the IC socket 12.

  The IC socket 12 includes a plurality of wire probes 13 as “electric contacts”, an upper plate 14 as a “first plate”, an intermediate plate 15 as a “third plate”, and a “second plate”. The lower plate 16 and the elastomer sheet 17 are provided.

  The wire probe 13 is an electrical contact that electrically connects the solder ball 11a of the IC package 11 and the electrode 10a of the wiring substrate 10, and is formed by plastically deforming one wire wire (described later). These wire probes 13 are arranged in the IC socket 12 in a matrix, for example, along the vertical direction.

  2A and 2B show only two of the plurality of wire probes 13. As shown in FIG. 2, these wire probes 13 are provided with a spring portion 13a, a first contact portion 13b extending upward from the spring portion 13a, and extending downward from the spring portion 13a. And a second contact portion 13c.

  The spring portion 13a has a center portion 13d inserted through the insertion hole 15a of the intermediate plate 15, and a first spring region 13e is formed upward from the center portion 13d (that is, in a direction approaching the upper plate 14). The second spring region 13f is inclined and extended from the central portion 13d in a downward direction (that is, a direction approaching the lower plate 16). As a result, the spring portion 13 a has a substantially “<” shape (may be a substantially “U” shape). By forming the spring portion 13a in the shape of a “<” or “U”, fluctuations in the urging force associated with the deformation of the spring portion 13a (up and down of the first contact portion 13b) are greatly reduced. be able to.

  The first contact portion 13 b is inserted through the insertion hole 14 a of the upper plate 14. As shown in the enlarged view of FIG. 4A, the first contact portion 13b is provided with a substantially conical tip portion 31 at the tip thereof. Further, a spherical portion 31 a having a radius of 2 μm or more and 10 μm or less (preferably 2 μm or more and 5 μm or less) is formed at the tip portion 31.

  Here, by setting the radius of the spherical surface portion 31a to 10 μm or less, the contact area between the first contact portion 13b and the solder ball 11a of the IC package 11 can be made sufficiently small, whereby the solder ball 11a. It is possible to make tin that is a forming material difficult to remain at the tip portion 31 of the first contact portion 13b. Further, by setting the radius of the spherical surface portion 31a to 2 μm or more, a wear-resistant contact film 31b (described later) can be formed on the spherical surface portion 31a in a state in which it is not easily peeled off. Even when the probe 13 is used, an increase in the contact area of the solder ball 11a due to wear of the tip 31 can be suppressed.

  Moreover, the 2nd contact part 13c is penetrated by the penetration hole 16a of the lower plate 16, and the penetration hole 17a of the elastomer sheet | seat 17, as shown to Fig.2 (a), (b). Further, as shown in an enlarged view in FIG. 4B, the second contact portion 13 c is bent at 90 degrees or more upward to constitute an L-shaped contact portion 32.

  The wire probe 13 is manufactured using a spring base material 30 such as stainless steel, piano wire (carbon steel), tungsten, or the like. As the base material 30, for example, a material having a length of 4 to 12 mm and a diameter of 0.05 to 0.2 mm can be used.

  In each wire probe 13, a conductive wear-resistant contact film 31 b (thickness is, for example, 0.1 to 3.0 μm) is formed on the distal end portion 31 of the first contact portion 13 b, for example, by CVD (Chemical The film is formed by using a film forming method such as a Vapor Deposition) method or a PVD (Physical Vapor Deposition) method. The wear-resistant contact film 31b only needs to be formed in a region including at least the spherical surface portion 31a. In this way, by forming the wear-resistant contact film 31b on the spherical surface portion 31a of the tip portion 31, the spherical surface portion 31a can be made hard to wear, whereby the solder balls of the first contact portion 13b and the IC package 11 can be made. An increase in contact area with 11a can be prevented. As the wear-resistant contact film 31b, for example, a carbon film, a ruthenium film, an iridium film, a gold film, a silver film, a palladium film, a rhodium film, or an alloy film of these films can be used. As long as it has sufficient wear resistance and is chemically inert to the solder balls 11a (tin) of the IC package 11 (that is difficult to be alloyed), other materials can be used. A film may be used.

  On the other hand, at least the surface region 31c between the formation region of the wear-resistant contact film 31b and the bent portion (tip portion) 32a of the L-shaped contact portion 32 is reduced in the surface of each wire probe 13. A highly conductive film 33 (having a thickness of, for example, 5 to 10 μm) is formed by, for example, a plating process. The highly conductive film 33 can be formed using, for example, silver, nickel, copper, or the like. However, as long as the electrical resistance is lower than that of the base material 30 of the wire probe 13, other materials can be used. A film may be used. In addition, the highly conductive film 33 may be inferior in wear resistance as compared with the above-described wear-resistant contact film 31b, but it is desirable to use a film having excellent electric conductivity. Note that the wear-resistant contact film 31b and the highly conductive film 33 may be formed of the same material.

  As shown in FIG. 1, the upper plate 14 is provided with an accommodation member 21 for accommodating the IC package 11 on the upper surface side, and the above-described probe arrangement region 22 is provided at a substantially central portion of the accommodation member 21. Is provided. The accommodating member 21 is provided with a guide portion 21 a for guiding the IC package 11 on the probe arrangement region 22. And the above-mentioned insertion hole 14a is formed in this probe arrangement | positioning area | region 22, respectively. Further, as shown in FIGS. 2A and 2B, a conical ball guide 14 b is provided on the upper surface of the upper plate 14. The IC package 11 is positioned by accommodating the solder ball 11a in the ball guide 14b. The ball guide 14b may be provided corresponding to all the solder balls 11a, may be provided corresponding to only a part of the solder balls 11a, or may not be provided with the ball guide 14b. Good.

  The upper plate 14 is provided in the IC socket 12 and is supported so as to be movable up and down while being urged upward by support means (not shown). When the upper plate 14 is pressed downward, the upper plate 14 is guided by the guide pins 25 and descends against the urging force. Here, when the upper plate 14 is raised, the solder ball 11a of the IC package 11 is moved to the tip of the first contact portion 13b provided on the wire probe 13, as shown in FIG. It will be in the state separated from the part 31. On the other hand, when the IC package 11 is pressed downward and the upper plate 14 is lowered, as shown in FIG. 2 (b), the solder ball 11a of the IC package 11 is moved to the tip of the first contact portion 13b. 31 is pressed. At this time, the contact pressure between the solder ball 11a and the tip 31 is preferably 5 grams or less. By making this contact pressure 5 g or less, the wear-resistant contact film 31b formed on the spherical surface portion 31a of the wire probe 13 can be made difficult to peel off or wear, whereby the spherical surface portion 31a and the solder ball 11a An increase in the contact area can be prevented. Since the radius of the spherical surface portion 31a is 5 μm or less, even if the contact pressure is 5 grams or less, the contact resistance between the first contact portion 13b of the wire probe 13 and the solder ball 11a of the IC package 11 is sufficiently high. Lower. As described above, when the spring portion 13a is formed in a “<” shape or a “U” shape, the biasing force associated with the amount of deformation of the spring portion 13 a (the amount of elevation of the first contact portion 13 b) is reduced. Fluctuations can be greatly reduced, and for this reason, it is easy to set the contact pressure between the solder ball 11a and the tip 31.

  As shown in FIG. 3B, the intermediate plate 15 is provided with a probe arrangement region 23 corresponding to the probe arrangement region 22 of the upper plate 14. The insertion holes 15a described above are formed in the probe placement region 23, respectively.

  The intermediate plate 15 is formed of an insulating material and is a bent portion (here, a boundary between the central portion 13d of the wire probe 13 and the second spring region 13f) provided in the spring portion 13a of each wire probe 13. Part).

  By providing the intermediate plate 15, the wire probes 13 can be prevented from coming into contact with each other and short-circuiting.

  Since the intermediate plate 15 is merely locked to the wire probe 13, the upper plate 14 descends against the urging force, and the solder ball 11 a of the IC package 11 is attached to the distal end portion 31 of the wire probe 13. When pressed (that is, when the state shown in FIG. 2A changes to the state shown in FIG. 2B), it moves parallel to the lower right direction. On the contrary, when the upper plate 14 is raised and the solder ball 11a of the IC package 11 is separated from the tip 31 of the wire probe 13 (that is, from the state of FIG. 2B to the state of FIG. 2A). The intermediate plate 15 moves in the upper left direction. Thus, the intermediate plate 15 can freely move in the oblique direction, so that the contact and separation between the solder ball 11a and the tip portion 31 of the wire probe 13 (that is, the up and down movement of the upper plate 14) can be performed smoothly. .

  Note that the position of the intermediate plate 15 is not necessarily the center between the upper plate 14 and the lower plate 16, and may be a position shifted upward or downward.

  In the first embodiment, one intermediate plate 15 is used. However, a plurality of intermediate plates may be used. When there are a plurality of intermediate plates 15, the wire probe 13 is preferably formed in a substantially “U” shape.

  The lower plate 16 is provided in the IC socket 12 and is fixed by fixing means (not shown). An elastomer sheet 17 is provided on the lower surface of the lower plate 16.

  As shown in FIG. 3C, the lower plate 16 is provided with a probe arrangement region 24 corresponding to the probe arrangement region 22 of the upper plate 14. An insertion hole 16 a is provided in the probe arrangement region 24. In addition, the elastomer sheet 17 is provided with insertion holes 17 a corresponding to the insertion holes 16 a of the lower plate 16. As shown in FIGS. 2A and 2B, the second contact portion 13 c of the wire probe 13 is inserted through the insertion holes 16 a and 17 a of the lower plate 16 and the elastomer sheet 17. Then, by pressing the elastomer sheet 17 against the lower plate 16, the elastomer sheet 17 is elastically deformed, and the bent portion 32a of the L-shaped contact portion 32 is pressed against the wiring board 10 by the elastic reaction force. The second contact portion 13c is electrically connected to the electrode 10a.

  In the first embodiment, the pressing force of the elastomer sheet 17 is received by the L-shaped contact portion 32. However, the stress at the time when the elastomer sheet 17 is elastically deformed is applied to the second contact by using another structure. You may add to the part 13c.

  However, by using the L-shaped contact portion 32, it is only necessary to bend the second contact portion 13c, and further, it is not necessary to make the cutting portion 13g of the second contact portion 13c contact the electrode 10a. The manufacturing cost of the wire probe 13 can be reduced by eliminating the need for surface processing of the cutting portion 13g.

  As described above, in the first embodiment, the contact pressure between the second contact portion 13c and the electrode 10a is given not by the urging force of the spring portion 13a of the wire probe 13 but by the pressing force of the lower plate 16. Therefore, according to this Embodiment 1, the contact pressure of each wire probe 13 can be made uniform. Furthermore, the first contact portion 13b side and the second contact portion 13c side can be set to different values. Therefore, even if the contact pressure of the IC package 11 to the solder ball 11a is sufficiently reduced. The reliability of the electrical connection between the wire probe 13 and the electrode 10a of the wiring board 10 is not impaired.

  Next, a method for manufacturing the IC socket 12 according to the first embodiment will be described.

  First, a method for manufacturing a wire for the wire probe 13 will be described with reference to FIGS.

  First, a highly conductive film (for example, silver, nickel, copper, or the like) 33 is formed on a wire base material 30 (see FIGS. 4A and 4B) by, for example, plating. Then, this wire is cut, for example, every 50 mm. Thereby, the wire wire 41 as shown to Fig.5 (a) is produced.

  Subsequently, one end portion of each wire wire 41 is polished to form a substantially conical tip portion 31 as shown in FIG. At this time, a spherical portion 31 a having a radius of 2 μm to 10 μm (preferably 2 μm to 5 μm) is formed at the tip of the tip 31.

  Next, carbon (ruthenium, iridium film, gold film, silver film, palladium film, rhodium film) is applied to the tip 31 of each wire wire 41 by using, for example, PVD (Physical Vapor Deposition) or CVD (Chemical Vapor Deposition). Alternatively, an alloy film of these films or the like may be coated. As a result, the wear-resistant contact film 31b as shown in FIG. 5C is formed.

  Further, the wire wire 41 is cut into a length (for example, 6 to 10 mm) to be used as the wire probe 13. Thereby, the probe wire 42 as shown in FIG. 5D is obtained.

  As described above, in the first embodiment, in order to facilitate polishing, a polishing process (see FIG. 5B) is performed with a long (here, about 50 mm) wire wire 41, and further a wear-resistant contact film. After forming 31b (see FIG. 5C), the wire wire 41 was cut (see FIG. 5D). However, it is good also as not cutting the length of the wire probe 13 by the first cutting | disconnection (refer FIG. 5A) and performing the cutting process of FIG. 5D. Further, after the polishing step (see FIG. 5B), the cutting step (see FIG. 5D) is performed, and thereafter the wear-resistant contact film 31b is formed (see FIG. 5C). Also good.

  Then, the L-shaped contact portion 32 is formed by bending the end portion of the probe wire 42 on the side not subjected to the polishing process. As described above, in the first embodiment, the end of the wire wire 41 (probe wire 42) may be polished only on the first contact portion 13b side, and an L-shaped contact is provided on the second contact portion 13c side. Since only the portion 32 is formed, the polishing process is simple.

  Thus, the probe wire 42 is completed.

  Next, a method for assembling the IC socket 12 will be described with reference to FIGS. 6A to 6C and FIGS. 7A and 7B.

  First, the upper plate 14, the intermediate plate 15, the lower plate 16, and the elastomer sheet 17 are produced as described above. Then, the elastomer sheet 17 is disposed on the lower plate 16 by bonding or the like. Subsequently, the upper plate 14, the intermediate plate 15, the lower plate 16, and the elastomer sheet 17 from the bottom in this order (that is, in a state reverse to the stacking order in use as shown in FIG. 2), Laminate. At this time, alignment is performed so that the positions of the insertion holes 14a, 15a, 16a, and 17a coincide.

  Further, a mask plate 51 is disposed on the elastomer sheet 17. As shown in FIGS. 6A and 7A, the mask plate 51 includes a plurality of grooves 52 provided corresponding to the insertion holes 14a, 15a, 16a, and 17a. These groove portions 52 are formed at positions and sizes that can accommodate the L-shaped contact portions 32 of the probe wire 42.

  Thereafter, as shown in FIGS. 6 (a) and 7 (a), the probe wire 42 extends from the upper side of the mask plate 51 to the groove 52 and the insertion holes 14a, 15a, 16a, and 17a. Inserted with 32 up. At this time, the L-shaped contact portion 32 is accommodated in the groove portion 52 of the mask plate 51. By accommodating the L-shaped contact portions 32 in the groove portions 52, the directions of the L-shaped contact portions 32 of the probe wires 42 can be aligned, and the L-shaped contact portions 32 can be prevented from contacting each other.

  Subsequently, as shown in FIG. 6B, the upper plate 14, the intermediate plate 15, and the lower plate 16 are separated from each other. At this time, the position of the intermediate plate 15 is not necessarily at the center between the upper plate 14 and the lower plate 16, and may be a position shifted upward or downward. Then, as shown in FIGS. 6B and 7B, the lower plate 16 is translated along the first circumferential direction C1 in a state where the intermediate plate 15 is fixed by fixing means (not shown). Let Similarly, with the intermediate plate 15 fixed in this manner, the upper plate 14 is also moved along the second circumferential direction C2 (see FIG. 6B). As a result, as shown in FIG. 6C, the probe wire 42 is plastically deformed to form a substantially "<"-shaped spring portion 13a and a first extending upward from the spring portion 13a. The contact portion 13b and the second contact portion 13c extending downward from the spring portion 13a can be formed simultaneously.

  In the first embodiment, the lower plate 16 and the upper plate 14 are simultaneously circumferentially moved. However, these circumferential movements may be performed separately.

  Thereafter, the mask plate 51 is removed. Then, using an unillustrated support means, the upper plate 14 is attached to the IC socket 12 so as to be movable up and down, and the lower plate 16 is fixedly attached to complete the IC socket 12.

  Next, a method of using the IC socket 12 having such a configuration will be described.

  The IC socket 12 is fixed on the wiring board 10 in advance. By this fixing, the lower plate 16 of the IC socket 12 comes to press the elastomer sheet 17, and as a result, the elastomer sheet 17 is elastically deformed. The bent portion 32 a of the L-shaped contact portion 32 is pressed against the wiring board 10 by the reaction force of this elastic deformation. Thereby, the 2nd contact part 13c and the electrode 10a conduct | electrically_connect.

  Then, the IC package 11 is transported by an automatic machine, guided by the guide portion 21a of the housing member 21, and housed on the probe placement region 22 of the upper plate 14 (see FIG. 2A).

  Thereafter, when the IC package 11 is pressed downward by pressing means (not shown), the upper plate 14 is guided by the guide pins 25 and descends against the urging force of the supporting means (not shown). As a result, the solder ball 11a of the IC package 11 is pressed against the tip portion 31 of the wire probe 13 with a predetermined contact pressure (see FIG. 2B). As a result, the solder ball 11a and the first contact portion 13b of the wire probe 13 are electrically connected. As the upper plate 14 descends, the intermediate plate 15 translates in the lower right direction.

  In this way, after the IC package 11 is electrically connected to the wiring board 10 via the wire probe 13, a burn-in test or the like is performed.

  As described above, according to the first embodiment, the wire probe 13 having a very small contact pressure with respect to the solder ball 11a of the IC package 11 can be configured. This makes it difficult for tin, which is a material for forming the solder ball 11a, to adhere to the first contact portion 13b of the wire probe 13, so that the contact resistance when the wire probe 13 is brought into contact with the IC package 11 is sufficiently high. The contact resistance is difficult to increase with long-term use.

  Further, according to the first embodiment, the spring portion 13a only needs to be formed by plastically deforming the central portion of the spring-like wire rod into a substantially “K” shape or a substantially “U” shape. The IC socket 12 can be manufactured inexpensively with a simple process.

  Furthermore, according to the first embodiment, the second plate is fixed while being supported by the upper plate 14 so as to be movable up and down. Therefore, even if the contact pressure of the IC package 11 with respect to the solder ball 11a is very small, The contact pressure with respect to the electrode 10a of the wiring board 10 can be sufficiently increased.

  In addition, according to the first embodiment, since the intermediate plate 15 is locked to the boundary portion between the first spring region 13e and the second spring region 13f of the wire probe 13, the IC package 11 The wire probe 13 can be smoothly deformed when being accommodated in the upper plate 14.

  In the first embodiment, the case where the present invention is applied to the IC socket 12 for the IC package 11 has been described as an example. However, the present invention can also be applied to sockets for other types of electrical components. .

DESCRIPTION OF SYMBOLS 10 Wiring board 10a Electrode 11 IC package 11a Solder ball 12 IC socket 13 Wire probe 13a Spring part 13b 1st contact part 13c 2nd contact part 13d 1st spring area 13e 2nd spring area 14 Upper plate 14a, 15a , 16a, 17a Insertion hole 14b Ball guide 15 Intermediate plate 16 Lower plate 17 Elastomer sheet 21 Housing member 22, 23, 24 Probe placement region 30 Base material 31 Tip portion 31a Spherical surface portion 31b Abrasion resistant contact film 31c Surface region 32 L-shaped contact portion 32a bent portion 33 highly conductive film 41 wire wire 42 probe wire 42 wire 51 mask plate 52 groove portion

Claims (4)

A first plate containing a first electrical component;
A second plate disposed opposite the second electrical component;
An insulative third plate disposed intermediate the first plate and the second plate;
A plurality of electrical contacts for electrically connecting the first electrical component and the second electrical component;
A socket for an electrical component having
Each said electrical contact is
The first plate is inserted into the third insertion hole of the third plate and is inclined toward the first plate, and is inclined toward the second plate. A spring portion having a substantially straight second spring region extending in a straight line,
A first portion extending from the first spring region of the spring portion, inserted through a first insertion hole provided in the first plate, and in contact with a first electrode of the first electrical component. 1 contact portion;
A second portion extending from the second spring region of the spring portion, inserted through a second insertion hole provided in the second plate, and in contact with a second electrode of the second electrical component. Two contact portions;
A socket for electrical parts, characterized by comprising:   2. The electrical component according to claim 1, wherein the spring portion is formed by plastically deforming a central portion of the spring wire into a substantially “<” shape or a substantially ““ ”shape. Socket.   The electrical component socket according to claim 1 or 2, wherein the first plate is provided so as to be movable up and down, and the second plate is fixed.   The third plate is supported by these electric contacts by being locked to a boundary portion between the first spring region and the second spring region of the plurality of electric contacts. The electrical component socket according to claim 1, wherein the socket is an electrical component socket.

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