JP2016175674A - Blister pack mount, blister pack, and manufacturing method of blister pack mount - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a blister pack mount capable of preventing an adhesive or decoration ink from sticking to an article due to thermal compression bonding.SOLUTION: A mount 10 constituting a blister pack 1a is configured such that a resin container part 20 prepared by integrally forming a flange part 22 projected in a flange shape around a cup part 21 opened downward as the storage space of an article 30 is bonded in its positioned state on the front surface 11 side of the mount. A printing layer 15 having an ink draft 12 formed upward in a mount body 14 including a paper medium and an adhesive layer 16 formed by applying a thermoplastic adhesive are stacked in this order, a UV varnish layer 17 made of cured UV varnish is selectively formed in a region corresponding to the plane region of the cup part, and the UV varnish layer is exposed to the upper surface side of the mount.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a mount for a blister pack, a blister pack provided with the mount, and a method for manufacturing the blister pack.

  There is a blister pack as a package for displaying contents such as commodities from outside. FIG. 1 is a view showing an example of a blister pack. Here, a blister pack 1 in which a cylindrical battery is housed as an article 30 is shown. FIG. 1A is an external view of a blister pack, FIG. 1B is a longitudinal sectional view of the blister pack 1, and corresponds to a cross section taken along the line aa in FIG. As shown in FIG. 1 (A), the blister pack 1 is a container portion 20 made of a cup-shaped transparent resin having an internal space formed in the shape of a storage item on the front surface 11 of a base 10 made of cardboard or the like. Has a bonded structure. A decoration 12 such as a product description and a design is applied to the front surface 11 side of the mount 10 by printing.

  Specifically, the container portion 20 is opened to one main surface (hereinafter also referred to as the front surface 11 or the upper surface 11) side of the mount 10 and serves as a storage space for articles. It is comprised from the flange part 22 formed in the circumference | surroundings. As shown in FIG. 1B, the mount 10 has a mount body 14 made of plain cardboard or the like on the back surface 13 side, and a printing layer 15 for decorating the upper surface of the mount body 14. It has a laminated structure in which an adhesive layer 16 formed by applying a thermoplastic adhesive on the printed layer 15 is formed. And as a manufacturing procedure of such a blister pack 1, the container part 20 in the state in which the article 30 is accommodated on the front surface 11 of the mount 10 is arranged, and a heated metal block is pressed on the entire back surface 13 of the mount 10. The adhesive layer 16 of the mount 10 is melted by hitting it. When the adhesive is solidified by cooling after heating, the front surface 11 of the mount 10 and the back surface 23 of the flange portion 22 are bonded. A blister pack in which a container part is adhered on a mount is described in the following Patent Document 1 and the like.

JP 2000-007025 A

  As described above, the flange part of the container part of the blister pack is thermocompression bonded to the mount. However, in the conventional mount for blister packs, the ink constituting the printing layer melts into the heat-dissolved adhesive during the pressure bonding, and the adhesive is transferred to the article and a part of the printing layer is peeled off. There is a problem. Even when the adhesive is selectively applied only to a region of the mount that contacts the flange portion of the container portion, the ink dissolved by heat is transferred to the article, and the article as a commodity is contaminated with the ink. In particular, when the article is made of a metal such as a dry battery, the thermal conductivity is high, so even if the heating time during thermocompression bonding is instantaneous, the temperature of the article immediately rises due to the heat and stops heating. Even after this, the adhesive or ink near the article does not rapidly solidify and gives time to adhere to the article.

  Then, an object of this invention is to provide the base material for blister packs in which the adhesive agent and the ink for decorating do not adhere to articles | goods by thermocompression bonding. It is another object of the present invention to provide a blister pack provided with the mount and a manufacturing method thereof.

In order to achieve the above object, the present invention provides a resin container portion in which a flange portion projecting like a bowl is integrally formed around a cup portion that opens downward as a storage space for articles. The mount that forms a blister pack that is bonded in a state of being positioned on the surface side,
A print layer on which a design by ink is formed and an adhesive layer formed by applying a thermoplastic adhesive are laminated in this order on the mount body made of a paper medium,
A UV varnish layer made of a cured UV varnish is selectively formed in a region corresponding to the planar region of the cup part, and the UV varnish layer is exposed on the upper surface side of the mount,
It is a blister pack characterized by this.

  Moreover, it can also be set as the mount for blister packs in which the said adhesive layer is not formed in the formation area of the said UV varnish layer. Furthermore, it is good also as a mount for blister packs in which the printed layer is formed by a cured UV ink.

A blister pack in which the upper surface of the mount according to any one of the above and the lower surface of the flange portion of the container portion are bonded is also within the scope of the present invention. Furthermore, the present invention extends to a method for producing a mount for blister packs, and the invention of the production method includes the step of forming the printed layer on a mount body made of a paper medium,
Applying the UV varnish on the printed layer to a region corresponding to the cup portion in the container portion and irradiating ultraviolet rays to cure the UV varnish to form the UV varnish layer;
Applying a thermoplastic adhesive to a region including the region corresponding to the flange portion of the container portion and not including the formation region of the UV varnish layer;
It is characterized by performing.

Alternatively, using the UV varnish as one color of the plurality of colors in a printing apparatus capable of multicolor printing with a plurality of colors of UV ink,
Printing a design by the printing device on a mount body made of a paper medium;
A step of solid-printing the UV varnish on the printed design with the printing device in a region corresponding to the cup portion in the container portion;
Irradiating ultraviolet rays from the upper surface of the paper medium to cure the UV ink and the UV varnish to simultaneously form the printing layer and the UV varnish layer;
Applying a thermoplastic adhesive to a region including the region corresponding to the flange portion of the container portion and not including the formation region of the UV varnish layer;
It can also be set as the manufacturing method of the blister board | substrate characterized by performing these.

  According to the mount for blister packs and the method for manufacturing the same according to the present invention, it is possible to prevent the adhesive and the ink for decoration from adhering to the articles in the container when the container is thermocompression bonded to the mount. Other effects will be clarified in the following description.

It is a figure which shows the structure of the mount in a general blister pack. It is a figure which shows the structure of the mount for blister packs concerning 1st Example of this invention. It is a figure which shows the structure of the mount for blister packs concerning 2nd Example of this invention. It is a figure which shows the outline of the procedure which thermocompression-bonds a container part to the mount for blister packs. It is a figure which shows the structure of the sample blister pack base material produced as a performance comparison object with respect to the said 1st and 2nd Example.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that in the drawings used for the following description, the same or similar parts may be denoted by the same reference numerals and redundant description may be omitted. In some drawings, reference numerals may be assigned to parts that are not required in other drawings if unnecessary.

=== Example ===
As an embodiment of the present invention, a mount for a blister pack containing a cylindrical battery as an article is given. The basic structure of the blister pack using the mount for blister packs according to the embodiment of the present invention is the same as that shown in FIG. 1, and the manufacturing procedure thereof is also the same. However, the structure of the mount makes it possible to prevent the adhesive applied to the mount and the ink constituting the print layer from adhering to the battery. Schematically, a UV curable varnish, so-called “UV varnish”, is applied to a planar region corresponding to a cup portion that does not contribute to adhesion in a planar region occupied by a container portion in a blister pack. The embodiments of the present invention can be roughly divided into two embodiments according to the laminated structure of the mount.

<First embodiment>
FIG. 2 shows a blister pack 1a using a blister pack mount (hereinafter also referred to as a mount 10a) according to the first embodiment of the present invention. In FIG. 2, the blister is the same as FIG. 1 (B). The longitudinal cross-sectional view of the pack 1a is shown. As shown in FIG. 2, the mount 10 a according to the first embodiment is formed on a mount main body 14 made of cardboard by, for example, flexographic printing using water-based ink, and on the print layer 15. An adhesive layer 16 is formed. Then, on the front surface 11 side of the mount 10a, a UV curable varnish (for example, Dicure Scepter DT OP Varnish HB, manufactured by DIC Graphics Co., Ltd.) is provided in an area corresponding to the planar area of the cup part 21 of the container part 20. After being selectively applied by a method such as flexographic printing, a UV varnish layer 17 is formed which is cured by being irradiated with ultraviolet rays.

<Second embodiment>
FIG. 3 is a view showing the structure of a blister pack mount (hereinafter also referred to as a mount 10b) according to a second embodiment of the present invention. Here, the state is shown in the state of the blister pack 1b in which the container portion 20 is bonded to the mount 10b. FIG. 3A is a plan view of the blister pack 1b using the mount 10b according to the second embodiment as viewed from above. FIG. 3B is a longitudinal sectional view of the blister pack 1b and corresponds to a cross section taken along the line bb in FIG. In the plan view of FIG. 3A, each layer constituting the laminated structure of the mount 10b is indicated by different types of hatching as in the longitudinal sectional view of FIG. In the mount 10b according to the second embodiment, the adhesive layer 16 and the UV varnish layer 17 are selectively formed so as not to overlap in the planar region. Specifically, the printing layer 15 is formed on the mount body 14, the adhesive layer 16 and the UV varnish layer 17 are formed on the printing layer 15, and the UV varnish layer 17 is a planar region of the cup portion 21 of the container portion 20. This is the same as the first embodiment in that it is selectively formed only in the region corresponding to. However, in the second embodiment, the adhesive layer 16 is not formed in the planar region corresponding to the cup portion 21. In the example shown in FIG. 3, the adhesive layer 16 is formed only in the region corresponding to the flange portion 22 of the container portion 20, but the region corresponding to the flange portion 22 and the region corresponding to the cup portion 21 is included. For example, the adhesive layer 16 may not be formed only in a region corresponding to the cup portion 21.

=== Test ===
A test of thermocompression-bonding the container part 20 in a state where the article 30 is stored is performed on the mounts (10a, 10b) according to the first and second embodiments, and ink and adhesive are attached to the article 30. Reliability, such as a state and the adhesive strength of the container part 20 with respect to mount (10a, 10b), was evaluated.

<Test method>
About the concrete test method, the same production line as the commercial blister pack which accommodated the cylindrical battery was used, and various blister packs which differ only in the structure of a mount were produced as a sample. Schematically, as shown in FIG. 4, a block-shaped jig 50 is placed in a state where the container 20 containing the battery 30 is positioned on the mount 10 corresponding to each sample and heated from below. Is pressed against the entire surface of the back surface 13 of the mount 10 while pressing the flange portion 22 from above using, for example, a frame-shaped jig 51 along the planar shape of the flange portion 22. The front surface 11 of the mount 10 is thermocompression bonded. In addition, a plurality of individuals (for example, 10) were prepared for each sample having different mount structures, and the reliability was evaluated for all individuals.

  FIG. 5 shows various blister packs prepared as samples. In FIG. 5, the blister pack 1a (hereinafter also referred to as sample a) shown in FIG. 2 corresponding to the embodiment of the present invention and the blister pack 1b (also referred to as sample b) shown in FIG. FIG. 5A shows a sample for comparison, and the blister pack 1c shown in FIG. 5A (hereinafter also referred to as sample c) does not have the UV varnish layer 17 and has a printing layer 15 and an adhesive layer 16 on the mount body 14. Uses the mount 10c formed in a region (hereinafter referred to as the entire surface) including the entire planar region of the container part 20, and the blister pack 1d (hereinafter also referred to as the sample d) shown in FIG. Uses a mount 10d that is selectively formed so that the UV varnish layer 17 is not provided and the adhesive layer 16 does not include a region corresponding to the cup portion 21 on the printing layer 15. That is, the printing layer 15 is the uppermost layer in the region corresponding to the cup portion 21 of the container portion 20. Samples c and d correspond to conventional blister packs. FIG. 4C shows a blister pack 1e (hereinafter also referred to as sample e) using a mount 10e in which an adhesive layer 16 and a UV varnish layer 17 are formed in this order on the printed layer 15. In the blister pack 1 f (hereinafter also referred to as sample f) shown in FIG. 4D, the UV varnish layer 17 is formed only on the region of the cup portion 21 on the printed layer 15, and the adhesive layer 16 is formed on the UV varnish layer 17. Is formed on the entire surface. In the blister pack 1g (hereinafter also referred to as sample g) shown in FIG. 4 (E), a printing layer 15 and an adhesive layer 16 are formed in this order on the mount body 14, and a well-known and general aqueous solution is formed on the adhesive layer 16. An OP varnish layer 18 made of OP (Over Print) varnish is formed only in the region of the cup portion 21.

<Test results>
Table 1 below shows the test results for each of the samples a to f produced.

“Top layer” in the “Structure” column in Table 1 indicates a layer exposed on the upper surface of the mount in the cup area, and “adhesive layer” and “varnish layer” only in the cup area. The case where it is formed is referred to as “selective formation”. The “entire surface” indicates that the entire flat area of the container portion is included as described above. In the test results, “adhesion” indicates the presence or absence of an individual with adhesive or printing layer ink attached to the battery, and “adhesion failure” means that the container part adhered to the mount is simply pulled by hand. It shows the presence or absence of an individual in which all or part of the container part has been peeled off from the mount during operation.

  As shown in Table 1, in samples c, d, f, and g having no UV varnish layer as the uppermost layer, an adhesive or ink adhered to the battery. In particular, in the sample g, the adhesive adhered even though the uppermost layer had the OP varnish layer. Even if the uppermost layer has a UV varnish layer, the sample e in which the UV layer is interposed between the adhesive layer and the flange portion of the container portion has insufficient adhesive strength. From the above, it was found that if the UV varnish layer is exposed on the upper surface only in the region corresponding to the cup portion of the container portion, the adhesive and ink do not adhere to the article, and the adhesive strength can be secured.

=== About Manufacturing Process ===
From the test results of sample e in Table 1 above, it was found that the adhesive strength was insufficient when a UV varnish layer was provided on the entire upper surface of the adhesive layer. For this reason, when the UV varnish layer is selectively formed, if the adhesive layer has already been formed, if the UV varnish droplets adhere to the adhesive layer in the step of applying the UV varnish, the adhesive strength is applied to the portion where the splashes adhere. May be reduced. Therefore, as a procedure for sequentially laminating each layer on the mount body, it is desirable to form a UV varnish layer after forming a printing layer on the mount body, and finally form an adhesive layer.

=== About the ink of the printing layer ===
In the first and second embodiments, any printing layer may be used as long as ink that can be printed on a paper material is used. For example, water-based ink for flexographic printing or offset printing can be considered. However, the mount according to the embodiment is characterized in that the UV varnish layer is selectively formed in the formation region of the cup portion in the container portion. Well-known UV ink is also widely used for printing on paper media. In the second embodiment, a UV varnish layer is provided immediately above the print layer, so that the UV varnish can be handled as a transparent UV ink. In this case, it is possible to continuously form the printing layer and the UV varnish layer.

  In other words, if a printing device capable of multicolor printing using a plurality of UV inks and one color of the plurality of UV inks is made into a UV varnish, the UV varnish can also be applied in the process of printing the design of the printed layer. . Then, the UV ink and the UV varnish can be simultaneously cured in a single UV irradiation step to form the printing layer and the UV varnish layer simultaneously. Thereby, the manufacturing cost of the mount can be reduced. In the mount according to the second example, when the printing layer was formed using UV ink, there was no defect such as adhesion of adhesive or ink, or insufficient adhesive strength.

1,1a-1g Blister pack, 10,10a-10g Mount,
11 Mount (front) surface, 14 Mount body, 15 Print layer, 16 Adhesive layer,
17 UV varnish layer, 18 OP varnish layer, 20 container part, 21 cup part,
22 flange part, 30 article (cylindrical battery)

Claims (6)

A resin container part formed by integrally forming a flange-like projecting flange around the cup part opening downward as an article storage space is bonded in a state where it is positioned on the front surface side of the mount. The mount constituting the blister pack comprising:
A print layer on which a design by ink is formed and an adhesive layer formed by applying a thermoplastic adhesive are laminated in this order on the mount body made of a paper medium,
A UV varnish layer made of a cured UV varnish is selectively formed in a region corresponding to the planar region of the cup part, and the UV varnish layer is exposed on the upper surface side of the mount,
Blister pack characterized by that.   2. The blister pack mount according to claim 1, wherein the adhesive layer is not formed in a region where the UV varnish layer is formed.   The blister pack mount according to claim 2, wherein the printed layer is formed of a cured UV ink.   The blister pack formed by the upper surface of the said mount in any one of Claims 1-3, and the lower surface of the said flange part of the said container part being adhere | attached. It is a manufacturing method of the mount for blister packs according to claim 2,
Forming the print layer on a mount body made of a paper medium;
Applying the UV varnish on the printed layer to a region corresponding to the cup portion in the container portion and irradiating ultraviolet rays to cure the UV varnish to form the UV varnish layer;
Applying a thermoplastic adhesive to a region including the region corresponding to the flange portion of the container portion and not including the formation region of the UV varnish layer;
The manufacturing method of the mount for blister packs characterized by performing these. A method for manufacturing the blister pack mount according to claim 3,
Using the UV varnish as one color of the plurality of colors in a printing apparatus capable of multicolor printing with a plurality of colors of UV ink,
Printing a design by the printing device on a mount body made of a paper medium;
A step of solid-printing the UV varnish on the printed design with the printing device in a region corresponding to the cup portion in the container portion;
Irradiating ultraviolet rays from the upper surface of the paper medium to cure the UV ink and the UV varnish to simultaneously form the printing layer and the UV varnish layer;
Applying a thermoplastic adhesive to a region including the region corresponding to the flange portion of the container portion and not including the formation region of the UV varnish layer;
A method of manufacturing a blister mount, characterized in that