JP2016171604A - Vibration element, vibrator, electronic device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece capable of simplifying its manufacturing process while suppressing bending vibration.SOLUTION: A vibration piece 10 includes a substrate 12 having a vibration portion 12a in which thickness-shear vibration is excited and an outer edge portion 12b disposed along an outer edge of the vibration portion 12a, the vibration portion 12a has a first protrusion portion 14 protruding from one principal surface 13a of the outer edge portion 12b and a second protrusion portion 16 protruding from the other principal surface 13b of a rear surface side with respect to the one principal surface 13a of the outer edge portion 12b, and the vibration portion 12a is provided with portions 15a and 15b where the first protrusion portion 14 and the second protrusion portion 16 do not overlap with each other in a plan view.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a resonator element and a manufacturing method thereof, a resonator element, a vibrator, an electronic device, and an electronic apparatus.

  A method of forming a mesa structure on a piezoelectric substrate is known as a method of confining energy of main vibration in a piezoelectric vibrating piece that excites thickness shear vibration. In such a mesa-type piezoelectric vibrating piece, spurious may increase due to bending vibration.

  Therefore, for example, in Patent Document 1, bending vibration is suppressed by optimizing the long side dimension of the vibration part and the long side dimension of the excitation electrode.

  Further, for example, in Patent Document 2, unnecessary vibration such as bending vibration is suppressed by optimizing the amount of excavation of the mesa (stepped portion). Specifically, the thickness of the step portion is Md, the length of the long side of the crystal substrate is x, and the thickness of the vibration portion is t. Assuming that the ratio of the ratio to t is y, y satisfies the relationship y = −1.32 × (x / t) +42.87 and y ≦ 30, and the length x of the long side of the quartz substrate The side ratio x / t with respect to the plate thickness t of the vibration part is 30 or less.

  Here, a method of forming a multistage mesa structure on a piezoelectric substrate is known as a method for more efficiently confining the energy of the main vibration in the piezoelectric vibration piece having the thickness shear vibration as the main vibration.

  For example, Patent Literature 3 discloses a piezoelectric vibrating piece that can efficiently confine energy of main vibration by using multiple stages of mesas.

  Such a piezoelectric vibrating piece is generally formed by processing a substrate made of a piezoelectric material such as quartz by machining or photolithography.

JP 2006-340023 A JP 2007-124441 A Japanese Patent Laid-Open No. 2-57009

  However, the piezoelectric vibrating piece of Patent Document 3 has a problem that the manufacturing process becomes complicated because a multistage mesa has to be formed on a substrate made of a piezoelectric material.

  One of the objects according to some aspects of the present invention is to provide a resonator element and a method for manufacturing the resonator element that can simplify the manufacturing process while suppressing flexural vibration. Another object of some aspects of the present invention is to provide a resonator element, a vibrator, an electronic device, and an electronic apparatus including the resonator element.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The resonator element according to this application example is
Including a vibration part that excites thickness shear vibration, and a substrate having an outer edge part disposed along an outer edge of the vibration part,
The vibrating part is
A first protrusion protruding from one main surface of the outer edge;
A second convex portion protruding from the other main surface on the back side with respect to one main surface of the outer edge portion, and
The vibrating portion includes a portion where the first convex portion and the second convex portion do not overlap in plan view.

  According to such a resonator element, as described later, the manufacturing process can be simplified while suppressing flexural vibration.

[Application Example 2]
In the resonator element according to this application example,
The width L of the non-overlapping portion may satisfy the relationship of the following formula.

L = (m × λ / 2) × k
However, m is an integer greater than or equal to 1, (lambda) is a wavelength of bending vibration, and it is 0.8 <k <1.2.

  According to such a resonator element, it is possible to sufficiently suppress spurious vibrations by suppressing flexural vibration.

[Application Example 3]
In the resonator element according to this application example,
The width of the non-overlapping portion may be a size in a direction along the vibration direction of the thickness shear vibration.

  According to such a resonator element, it is possible to sufficiently suppress spurious vibrations by suppressing flexural vibration.

[Application Example 4]
In the resonator element according to this application example,
The shape of the vibration part may be a rectangle in plan view.

  According to such a resonator element, it is possible to sufficiently suppress spurious vibrations by suppressing flexural vibration.

[Application Example 5]
In the resonator element according to this application example,
The first convex portion includes a plurality of steps on a side surface,
The second convex portion may include a plurality of steps on the side surface.

  According to such a resonator element, the energy of the main vibration can be confined efficiently.

[Application Example 6]
In the resonator element according to this application example,
The center of the first convex portion and the center of the second convex portion may be shifted in a direction along the vibration direction of the thickness shear vibration in plan view.

  According to such a resonator element, the manufacturing process can be simplified while suppressing the bending vibration.

[Application Example 7]
The manufacturing method of the resonator element according to this application example is as follows:
A step of preparing a substrate that vibrates in thickness and slips;
A first mask is disposed on one main surface of the substrate;
A second mask is disposed on the other main surface on the back surface side with respect to one main surface of the substrate, the second mask being smaller than the area of the first mask and overlapping the first mask in plan view.
Etching the substrate exposed from the first mask and the second mask,
A first convex portion including a vibrating portion and a substrate having an outer edge portion disposed along an outer edge of the vibrating portion, wherein the vibrating portion protrudes from one main surface of the outer edge portion; A second convex portion projecting from the other main surface on the back surface side with respect to one main surface of the outer edge portion, and the vibrating portion in plan view and the first convex portion Forming a mesa substrate having a portion that does not overlap the second convex portion;
A method for manufacturing a resonator element, comprising:

  According to such a method for manufacturing a piezoelectric substrate, the number of etching processes can be reduced, and the manufacturing process can be simplified. Furthermore, damage to the piezoelectric substrate caused by repeated etching can be reduced.

[Application Example 8]
The vibration element according to this application example is
A resonator element according to this application example;
A first excitation electrode that covers a surface of the first convex portion and a surface of a portion of the outer edge portion of the one main surface;
A second excitation electrode covering a surface of the second convex portion and a part of the outer edge portion of the other main surface;
May be included.

According to such a vibration element, the capacity ratio γ can be increased. The capacity ratio γ is obtained by dividing the capacity C ₀ determined by the size (size) of the excitation electrode by the capacity C ₁ determined by the substantial vibration region of the resonator element.

[Application Example 9]
The vibrator according to this application example is
A resonator element according to this application example;
A package for housing the resonator element;
including.

  According to such a vibrator, it is possible to have a resonator element that can simplify the manufacturing process while suppressing bending vibration.

[Application Example 10]
The electronic device according to this application example is
A resonator element according to this application example;
An electronic element;
including.

  According to such an electronic device, it is possible to have the resonator element that can simplify the manufacturing process while suppressing the bending vibration.

[Application Example 11]
The electronic device according to this application example is
The resonator element according to this application example is included.

  According to such an electronic device, it is possible to have a resonator element that can simplify the manufacturing process while suppressing bending vibration.

[Application Example 12]
In the resonator element according to this application example,
The center of the first convex portion and the center of the second convex portion may overlap in plan view.

[Application Example 13]
In the resonator element according to this application example,
The piezoelectric substrate is an XZ plane centering on an X axis of an orthogonal coordinate system including an X axis as an electric axis, a Y axis as a mechanical axis, and a Z axis as an optical axis, which are crystal axes of quartz. Is rotated about the X axis by an angle θ, the axis tilted by the angle θ of the Z axis is defined as the Z ′ axis, the axis tilted by the angle θ of the Y axis is defined as the Y ′ axis, and is parallel to the X axis and the Z ′ axis. The surfaces may be the first main surface and the second main surface, and the direction parallel to the Y ′ axis may be the thickness.

[Application Example 14]
In the resonator element according to this application example,
The position of the edge of the first convex part and the position of the edge of the second convex part may coincide with the position of the antinode of bending vibration.

The perspective view which shows typically the vibration element which concerns on this embodiment. FIG. 3 is a plan view schematically showing the resonator element according to the embodiment. FIG. 3 is a cross-sectional view schematically showing the resonator element according to the embodiment. The perspective view which shows an AT cut quartz substrate typically. The model figure which shows the structure of a mesa type vibration element. The graph which showed the energy of the bending vibration at the time of changing the long side dimension Mx1 of the 1st step, satisfying the condition of (Mx1-Mx2) / 2 = λ / 2. Sectional drawing which shows typically the vibrator | oscillator of a two-step mesa structure. Sectional drawing which shows typically the manufacturing process of the vibration element which concerns on this embodiment. Sectional drawing which shows typically the manufacturing process of the vibration element which concerns on this embodiment. The top view which shows typically the vibration element which concerns on the 1st modification of this embodiment. Sectional drawing which shows typically the vibration element which concerns on the 1st modification of this embodiment. The top view which shows typically the vibration element which concerns on the 2nd modification of this embodiment. Sectional drawing which shows typically the vibration element which concerns on the 2nd modification of this embodiment. The perspective view which shows typically the vibration element which concerns on the 3rd modification of this embodiment. Sectional drawing which shows typically the vibration element which concerns on the 3rd modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. Sectional drawing which shows typically the vibrator | oscillator which concerns on the modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing the electronic device according to the embodiment. Sectional drawing which shows typically the electronic device which concerns on the modification of this embodiment. FIG. 3 is a plan view schematically showing the electronic apparatus according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First, the vibration element according to the present embodiment will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a resonator element 100 according to the present embodiment. FIG. 2 is a plan view schematically showing the resonator element 100 according to this embodiment. FIG. 3 is a cross-sectional view schematically showing the resonator element 100 according to this embodiment. 3 is a cross-sectional view taken along line III-III in FIG.

  As shown in FIGS. 1 to 3, the resonator element 100 includes the resonator element 10, the first excitation electrode 20, the second excitation electrode 22, the connection electrode 24, and the mount electrode 26. Yes.

  The vibration piece 10 includes a substrate 12 having a vibration part 12a for exciting thickness shear vibration and an outer edge part 12b arranged along the outer edge of the vibration part 12a. For example, a piezoelectric substrate is used as the substrate 12. More specifically, as the substrate 12, a rotated Y-cut substrate such as an AT-cut quartz substrate is used.

  Here, FIG. 4 is a perspective view schematically showing the AT-cut quartz substrate 1. Piezoelectric materials such as quartz are generally trigonal and have crystal axes (X, Y, Z) as shown in FIG. The X axis is an electrical axis, the Y axis is a mechanical axis, and the Z axis is an optical axis. The rotated Y-cut substrate is a flat plate cut from a piezoelectric material (for example, artificial quartz crystal) along a plane obtained by rotating the XZ plane around the X axis by an angle θ. Here, for example, in the case of the AT-cut quartz crystal substrate 1, θ = 35 ° 15 ′. Further, the Y axis and the Z axis are also rotated around the X axis by θ to be the Y ′ axis and the Z ′ axis, respectively. Accordingly, the rotating Y-cut substrate has a crystal axis (X, Y ′, Z ′) axis. In the AT-cut quartz substrate 1 with θ = 35 ° 15 ′, the XZ ′ plane (plane including the X-axis and Z′-axis) orthogonal to the Y′-axis becomes the main surface (excitation surface), and the thickness-shear vibration is the main vibration. Can vibrate as. The substrate 12 can be obtained by processing the AT-cut quartz crystal substrate 1.

  That is, the substrate 12 is, for example, an orthogonal coordinate system comprising an X axis as an electrical axis, a Y axis as a mechanical axis, and a Z axis as an optical axis, which are crystal axes of quartz as shown in FIG. Axis with the Z axis tilted in the -Y direction of the Y axis around the X axis of the Y axis as the Z 'axis, an axis with the Y axis tilted in the + Z direction of the Z axis as the Y' axis, and the X axis and the Z 'axis And an AT-cut quartz substrate having a thickness in a direction parallel to the Y ′ axis.

The substrate 12 may be a substrate that excites thickness shear vibration. The substrate 12 may be, for example, a BT cut crystal substrate or an SC cut crystal substrate. For example, a BT cut crystal substrate can be obtained by setting θ = −49 ° (rotation by 49 ° opposite to the direction of the arrow θ shown in FIG. 4). In addition, the surface of the quartz crystal perpendicular to the Y-axis is rotated by about 33 ° about the X-axis, and further cut from the surface rotated about 22 ° about the Z-axis from this rotated position, thereby SC-cut. A quartz substrate can be obtained.

  The planar shape of the substrate 12 is rectangular, the long side of the substrate 12 is formed along the X axis of the quartz crystal, and the short side of the substrate 12 is along the Z ′ axis perpendicular to the X axis of the quartz crystal. Is formed.

  The substrate 12 has a vibrating part 12a and an outer edge part 12b. The vibration part 12a has a thickness larger than the thickness (size in the Y′-axis direction) t ′ of the outer edge part 12b. Specifically, the vibrating portion 12a has a portion having a thickness t1 larger than the thickness t ′ and a portion having a thickness t2 larger than the thickness t1. The vibration part 12a is excited by the thickness shear vibration and can vibrate with the thickness shear vibration as a main vibration. At this time, the thickness shear vibration vibrates along the X-axis direction. The shape of the vibration part 12a is rectangular in plan view, the long side of the vibration part 12a is formed along the X axis of the crystal crystal, and the short side of the vibration part 12a is orthogonal to the X axis of the crystal crystal. It is formed along the Z ′ axis. The outer edge portion 12b is disposed along the outer edge of the vibrating portion 12a.

  The substrate 12 has a first main surface 13a and a second main surface 13b. The 1st main surface 13a and the 2nd main surface 13b comprise the main surface of the outer edge part 12b. The second main surface 13b is the other main surface on the back surface side with respect to the first main surface 13a. In the illustrated example, the first main surface 13a is a surface facing the + Y′-axis direction, and the second main surface 13b is a surface facing the −Y′-axis direction. The vibration part 12a has the 1st convex part 14 provided in the 1st main surface 13a, and the 2nd convex part 16 provided in the 2nd main surface 13b.

  The 1st convex part 14 is provided in the 1st main surface 13a. The 1st convex part 14 protrudes rather than the main surface (1st main surface) 13a of the outer edge part 12b. The 1st convex part 14 has one level | step difference with respect to the 1st main surface 13a. As shown in FIG. 2, the planar shape of the first convex portion 14 is a rectangle, the long side of the first convex portion 14 is formed along the X axis, and the short side of the first convex portion 14 is Z It is formed along the 'axis. That is, the long side of the first convex portion 14 is parallel to the long side of the substrate 12, and the short side of the first convex portion 14 is parallel to the short side of the substrate 12.

  The 2nd convex part 16 is provided in the 2nd main surface 13b. The 2nd convex part 16 protrudes rather than the main surface (2nd main surface) 13b of the outer edge part 12b. The 2nd convex part 16 has one level | step difference. As shown in FIG. 2, the planar shape of the second convex portion 16 is a rectangle, the long side of the second convex portion 16 is formed along the X axis, and the short side of the second convex portion 16 is Z It is formed along the 'axis. In addition, the height of the step between the first convex portion 14 and the second convex portion 16 (size in the Y′-axis direction) is the same, for example.

  The center of the 1st convex part 14 and the center of the 2nd convex part 16 have overlapped in planar view (viewing from the Y'-axis direction). That is, the position of the center of the first convex portion 14 and the position of the center of the second convex portion 16 are the same in the position on the X axis (X coordinate) and the position on the Z ′ axis (Z ′ coordinate).

  The vibration part 12a has a part (first non-overlapping part 15a and second non-overlapping part 15b) where the first convex part 14 and the second convex part 16 do not overlap in plan view. Furthermore, the vibration part 12a has a part (overlapping part 15c) where the first convex part 14 and the second convex part 16 overlap in plan view. In the illustrated example, the first non-overlapping portion 15a is located on the + X axis direction side of the overlapping portion 15c, and the second non-overlapping portion 15b is located on the −X axis direction side of the overlapping portion 15c.

By forming the non-overlapping portions 15a and 15b on the vibrating portion 12a, the positions of the edges a1 and a2 of the first convex portion 14 and the positions of the edges b1 and b2 of the second convex portion 16 are in the X-axis direction. It ’s out of place. That is, the end edges a1 and a2 of the first convex portion 14 and the end edges b1 and b2 of the second convex portion 16 do not overlap in plan view. In addition, the edge of the 1st convex part 14 is an edge (outer edge) which prescribes | regulates the shape of the 1st convex part 14 in planar view. Similarly, the edge of the 2nd convex part 16 is an edge (outer edge) which prescribes | regulates the shape of the 2nd convex part 16 in planar view. As shown in FIG. 3, the thickness of the substrate 12 (the size in the Y′-axis direction) at the positions of the edges a1 and a2 of the first protrusion 14 and the positions of the edges b1 and b2 of the second protrusion 16. Changes.

  The positions of the edges a1 and a2 of the first convex part 14 and the positions of the edges b1 and b2 of the second convex part 16 are the positions of antinodes of bending vibration that occur in the direction along the long side of the substrate 12 (X-axis direction). This corresponds to the position of the antinode of the bending vibration displacement, that is, the position of the portion where the amplitude of the bending vibration is the largest. Specifically, the positions (X coordinates) of the edges a1, a2, b1, and b2 on the X axis coincide with the positions (X coordinates) of the antinodes of bending vibration on the X axis. As described above, the positions of the edges a1, a2, a3, a4 of the first convex portion 14 and the positions of the edges b1, b2 of the second convex portion 16 coincide with the positions of the antinodes of the bending vibration. The bending vibration can be suppressed.

  Here, the positions of the edges a1 and a2 of the first protrusion 14 and the positions of the edges b1 and b2 of the second protrusion 16 are shifted in the X-axis direction. In other words, the X coordinates of the edges a1 and a2 of the first convex portion 14 and the X coordinates of the edges b1 and b2 of the second convex portion 16 are different. Therefore, the substrate 12 can be provided with four positions (a1, a2, b1, b2) for suppressing bending vibration.

  As shown in FIG. 3, the width M1 of the first protrusion 14 is larger than the width M2 of the second protrusion 16. Here, the width M1 of the first convex portion 14 is the size of the first convex portion 14 in the X-axis direction (the direction along the vibration direction of the thickness shear vibration). Further, the width M2 of the second convex portion 16 is the size of the second convex portion 16 in the X-axis direction. The size of the first convex portion 14 in the Y′-axis direction and the size of the second convex portion 16 in the Y′-axis direction are the same. Further, the size of the first convex portion 14 in the Z′-axis direction and the size of the second convex portion 16 in the Z′-axis direction are the same.

  The width M1 of the first convex portion 14 and the width M2 of the second convex portion 16 satisfy, for example, the relationship of M1−M2 = mλ (m is an integer of 1 or more, and λ is the wavelength of bending vibration). Thereby, the position of the edge a1, a2 of the 1st convex part 14, and the position of the edge b1, b2 of the 2nd convex part 16 can be located in the position of the antinode of a bending vibration. However, the center of the 1st convex part 14 and the center of the 2nd convex part 16 have overlapped in planar view.

  Note that the width M1 of the first convex portion 14 and the width M2 of the second convex portion 16 may satisfy the relationship of M1-M2 = mλ × k (0.8 <k <1.2). That is, not only when the position of the edge of the convex portion coincides with the position of the antinode of the bending vibration (M1-M2 = mλ), but also the position of the edge of the convex portion deviates from the position of the antinode of the bending vibration. Even when the amount of deviation is less than 20% (M1-M2 = mλ × k (0.8 <k <1.2)), the bending vibration is suppressed and the spurious is sufficient. Can be suppressed. The reason will be described below.

  FIG. 5 is a model diagram showing the structure of the mesa type vibration element, and is a cross-sectional view of the mesa type vibration element using a rectangular AT-cut quartz substrate cut in the longitudinal direction.

  Here, the long side dimension of the quartz substrate is X, the thickness of the vibrating part is t, the long side of the first stage of the mesa is parallel to the long side of the quartz substrate, the dimension is Mx1, and the second stage of the mesa The long side is parallel to the long side of the quartz substrate, the dimension is Mx2, and the thickness of the outer edge is t ′. Further, the center of the first step of the mesa and the center of the second step of the mesa overlap in plan view. It is assumed that the long side of the quartz substrate is parallel to the X axis of the quartz crystal axis. Analysis using a two-dimensional finite element method was performed using the model shown in FIG.

FIG. 6 shows the long side dimension Mx of the first stage while satisfying the condition of (Mx1-Mx2) / 2 = λ / 2.
6 is a graph showing the energy of flexural vibration when 1 is changed. The horizontal axis is a value obtained by normalizing Mx1 by λ, and the vertical axis is the energy (relative value) of bending vibration. Note that λ is the wavelength of bending vibration.

  From FIG. 6, it can be seen that the value of Mx1 at which the energy of the bending vibration becomes small appears approximately every period λ. This means that the state in which the edge of the first stage and the edge of the second stage are both antinodes of bending vibration appears approximately every λ. Here, from the graph shown in FIG. 6, even when the energy attenuation peak is shifted by 20%, the bending vibration energy is attenuated to 1/3 or less as shown by the arrow in FIG. 6. Recognize. If the energy of bending vibration can be attenuated to 1/3 or less, spurious can be sufficiently suppressed. Therefore, by satisfying the relationship of M1-M2 = mλ × k (0.8 <k <1.2), the bending vibration can be suppressed and the spurious can be sufficiently suppressed. That is, unless the position of the edge of the convex portion is arranged so that k is included in this range, the bending vibration cannot be sufficiently suppressed, and the spurious cannot be sufficiently suppressed.

The width L1 of the first non-overlapping portion 15a satisfies the relationship L1 = (m ₁ × λ / 2) (where m ₁ is an integer equal to or greater than 1 and λ is the wavelength of bending vibration). Similarly, the width L2 of the second non-overlapping portion 15b satisfies the relationship L2 = (m ₂ × λ / 2) (where m ₂ is an integer of 1 or more). Thereby, the position of the edge a1, a2 of the 1st convex part 14, and the position of the edge b1, b2 of the 2nd convex part 16 can be located in the position of the antinode of a bending vibration. Furthermore, the width L1 of the first non-overlapping portion 15a may be (m ₁ × λ / 2) × k ₁ (where 0.8 <k ₁ <1.2). The width L2 = (m ₂ × λ / 2) × k ₂ (where 0.8 <k ₂ <1.2) may be satisfied. Thereby, as described above, the bending vibration can be suppressed and the spurious can be sufficiently suppressed. The width L1 of the first non-overlapping portion 15a is a direction along the vibration direction of the thickness shear vibration, and in the illustrated example, is the size of the first non-overlapping portion 15a in the X-axis direction. The width L2 of the second non-overlapping portion 15b is a direction along the vibration direction of the thickness shear vibration, and in the illustrated example, is the size of the second non-overlapping portion 15b in the X-axis direction.

  The outer edge portion 12b is disposed along the outer edge of the vibrating portion 12a. The outer edge portion 12b is provided around the vibration portion 12a. The outer edge portion 12b has a thickness t ′ that is smaller than the thicknesses t1 and t2 of the vibrating portion 12a.

  The first excitation electrode 20 is provided so as to cover the surface of the first convex portion 14. The first excitation electrode 20 covers the surface of the first convex portion 14 and the partial surface of the outer edge portion 12b of the first main surface 13a. The first excitation electrode 20 covers the surface of the first convex portion 14 and a part of the first main surface 13a. In the illustrated example, the first convex portion 14 is located inside the outer edge of the first excitation electrode 20 in plan view. That is, the surface of the first convex portion 14 is completely covered by the first excitation electrode 20.

  The second excitation electrode 22 is provided so as to cover the surface of the second convex portion 16. The second excitation electrode 22 covers the surface of the second convex portion 16 and a part of the surface of the outer edge portion 12b of the second main surface 13b. The second excitation electrode 22 covers the surface of the second convex portion 16 and a part of the second main surface 13b. In the illustrated example, the second convex portion 16 is located inside the outer edge of the second excitation electrode 22 in plan view. That is, the surface of the second convex portion 16 is completely covered by the second excitation electrode 22.

The excitation electrodes 20 and 22 are provided with the vibration part 12a interposed therebetween. The excitation electrodes 20 and 22 can apply a voltage to the vibration part 12a. The excitation electrodes 20 and 22 are connected to the mount electrode 26 via the connection electrode 24. The mount electrode 26 is provided on the second main surface 13b. The mount electrode 26 is provided, for example, on the outer edge portion 12b on the + X axis direction side of the vibration portion 12a.

  As the excitation electrodes 20 and 22, the connection electrode 24, and the mount electrode 26, for example, those obtained by laminating chromium and gold in this order from the substrate 12 side are used. The excitation electrodes 20 and 22, the connection electrode 24, and the mount electrode 26 are formed by, for example, a sputtering method or a vacuum evaporation method.

  For example, the resonator element 10 and the resonator element 100 according to the present embodiment have the following characteristics.

  According to the resonator element 10, the vibrating portion 12 a includes the first convex portion 14 projecting from the first main surface 13 a and the second convex portion 16 projecting from the second main surface 13 b. The vibration part 12a has portions 15a and 15b where the first convex part 14 and the second convex part 16 do not overlap in plan view. Thereby, in the long side direction (X-axis direction) of the board | substrate 12, the position (edge edge a1, a2, b1, b2) which suppresses bending vibration can be made into four places. Therefore, the manufacturing process can be simplified while suppressing the bending vibration. The reason will be described below.

  FIG. 7 is a cross-sectional view schematically showing a resonator element C having a two-stage mesa structure. Specifically, in the resonator element C, the first convex portion and the second convex portion are two steps, and the widths of the corresponding steps of the first convex portion and the second convex portion are the same. Moreover, the center of the 1st convex part and the center of the 2nd convex part have overlapped in planar view. In the example of the resonator element C, the edge c1 of the first protrusion and the edge d1 of the second protrusion have the same X coordinate, and similarly, the edge c2 of the first protrusion and the edge c2 of the second protrusion are the same. The edge d2, the edge c3 of the first protrusion and the edge d3 of the second protrusion, the edge c4 of the first protrusion and the edge d4 of the second protrusion have the same X coordinate. Therefore, in the resonator element C having the two-stage mesa structure, there are four positions where the bending vibration is suppressed. In addition, since the vibration piece C has two steps of the first and second protrusions, the etching process for forming the protrusions is required twice.

  On the other hand, in the resonator element 10, the number of steps of the first convex portion 14 is one stage even though the number of positions (4 locations) where the bending vibration is suppressed is the same as that of the resonator element C having the two-step mesa structure. Since the number of steps of the second protrusion 16 is one, the etching process for forming the protrusions 14 and 16 may be performed once. Therefore, the manufacturing process can be simplified.

  Thus, according to the resonator element 10, the manufacturing process can be simplified while having the same number of positions for suppressing the bending vibration as the resonator element C having the two-stage mesa structure. That is, according to the resonator element 10, it is possible to simplify the manufacturing process while suppressing the bending vibration to the same extent as the resonator element having the two-stage mesa structure.

  Further, according to the resonator element 10, for example, the thickness (the size in the Y′-axis direction) of the protrusions 14 and 16 can be twice the thickness of each step of the resonator element having the two-step mesa structure. it can. That is, the thickness of the vibrating portion 12a can be made the same as the thickness of the vibrating portion of the vibrating piece having the two-step mesa structure. Thereby, the energy of the main vibration can be efficiently confined similarly to the vibrating piece having the two-stage mesa structure.

According to the resonator element 10, the width L1 of the first non-overlapping portion 15a satisfies the relationship L1 = (m ₁ × λ / 2) × k ₁ (where 0.8 <k ₁ <1.2), The width L2 of the second non-overlapping portion 15b = (m ₂ × λ / 2) × k ₂ (where 0.8 <k ₂ <1.2) is satisfied. Thereby, as described above, the bending vibration can be suppressed and the spurious can be sufficiently suppressed.

According to the vibration element 100, the first excitation electrode 20 that covers the surface of the first convex portion 14 and the partial surface of the outer edge portion 12b on the first main surface 13a side, the surface of the second convex portion 16, and the second surface. It has the 2nd excitation electrode 22 which covers the one part surface of the outer edge part 12b by the side of the main surface 13b. Thereby, the capacity ratio γ can be increased. The capacity ratio γ is obtained by dividing the capacity C ₀ determined by the dimensions (sizes) of the excitation electrodes 20 and 22 by the capacity C ₁ determined by the substantial vibration region of the resonator element 10.

  Furthermore, the vibration element 100 includes the first excitation electrode 20 that covers the surface of the first convex portion 14 and the second excitation electrode 22 that covers the surface of the second convex portion 16, and the first convex portion 14. Is located inside the outer edge of the first excitation electrode 20 in a plan view, and the second convex portion 16 is located inside the outer edge of the second excitation electrode 22 in a plan view. That is, the first excitation electrode 20 completely covers the surface of the first convex portion 14, and the second excitation electrode 22 completely covers the surface of the second convex portion 16. Thereby, compared with the case where the excitation electrode does not completely cover the convex portion, the capacitance ratio γ can be increased.

2. Next, a method for manufacturing a vibration element according to the present embodiment will be described with reference to the drawings. 8 to 9 are cross-sectional views schematically showing the manufacturing process of the vibration element 100.

  As shown in FIG. 8, a substrate 2 is prepared. The substrate 2 is a quartz substrate such as an AT cut quartz substrate. Next, a first mask M1 including a resist film 6a and a corrosion-resistant film 4a is disposed on one main surface 13a of the substrate 2, and on the other main surface 13b on the back surface side with respect to one main surface 13a of the substrate 2. The second mask M2 is arranged so as to be smaller than the area of the first mask M1 and overlap in plan view.

  Specifically, first, the corrosion resistant film 4 is formed on both the main surfaces 13 a and 13 b of the substrate 2. The corrosion resistant film 4 is formed by, for example, a sputtering method or a vacuum deposition method. The corrosion resistant film 4 has, for example, a laminated structure in which chromium and gold are laminated in this order. In the corrosion-resistant film 4, for example, chromium, nickel, an alloy of nickel and chromium can be used for the lower layer, and gold, silver, or the like can be used for the upper layer. The corrosion resistant film 4 has corrosion resistance against buffered hydrofluoric acid that becomes an etching solution when the substrate 2 is etched. Next, a resist film 6 is formed on the surface of the corrosion resistant film 4. The resist film 6 is, for example, a positive type photoresist. The resist film 6 is formed by, for example, a spin coat method. Next, the resist film 6a and the corrosion-resistant film 4a on the first main surface 13a side are patterned. Next, the resist film 6b and the corrosion resistant film 4b on the second main surface 13b side are patterned. Specifically, the resist films 6a and 6b are exposed, developed, and patterned, and the corrosion resistant films 4a and 4b are etched using the resist films 6a and 6b as a mask. Etching of the corrosion resistant films 4a and 4b is performed, for example, by first etching gold using an iodine-based etching solution and then etching chromium using an etching solution containing cerium ammonium nitrate. Through the above steps, the first mask M1 having the resist film 6a and the corrosion-resistant film 4a and the second mask M2 having the resist film 6b and the corrosion-resistant film 4b can be formed. The area of the second mask M2 is smaller than the area of the first mask M1, and the first mask M1 and the second mask M2 are formed so as to partially overlap in plan view. In the illustrated example, the size of the second mask M2 in the X-axis direction is smaller than the size of the first mask M1 in the X-axis direction. Therefore, the area of the second mask M2 is smaller than the area of the first mask M1.

As shown in FIG. 9, the substrate 2 is etched using the masks M1 and M2 as masks. Specifically, the portion of the substrate 2 exposed from the masks M1 and M2 is etched. Thereby, the 1st convex part 14 is formed in the 1st main surface 13a, and the 2nd convex part 16 is formed in the 2nd main surface 13b. Thereby, the vibration part 12a and the outer edge part (thin wall part) 12b are formed in the board | substrate 12. FIG. Here, the sizes (areas) of the masks M1 and M2 formed on the front and back surfaces of the substrate 2 are as follows.
Since they are different, the vibration portion 12a is provided with portions 15a and 15b and a portion 15c where the first convex portion 14 and the second convex portion 16 do not overlap in a plan view. Through the above steps, the mesa substrate 12 (vibrating piece 10) is formed.

  As shown in FIGS. 1 to 3, after removing the masks M <b> 1 and M <b> 2, excitation electrodes 20 and 22, connection electrodes 24, and mount electrodes 26 are formed on the substrate 12. The excitation electrodes 20 and 22, the connection electrode 24, and the mount electrode 26 are formed by, for example, laminating chromium and gold in this order by sputtering or vacuum deposition, and then patterning the chromium and gold. The

  Through the above steps, the vibration element 100 can be manufactured.

  The manufacturing method of the vibration element 100 (vibration piece 10) according to the present embodiment has the following features, for example.

  According to the method for manufacturing the resonator element 10, the step of etching the substrate 2 to form the first convex portion 14 on the first main surface 13 a and the second convex portion 16 on the second main surface 13 b is performed. The first convex portion 14 and the second convex portion 16 include portions 15a and 15b that do not overlap in a plan view. Thereby, the resonator element 10 can be manufactured by one etching process. Therefore, the number of etching processes can be reduced and the manufacturing process can be simplified as compared with a resonator element having a two-stage mesa structure. Furthermore, sagging of the edge of the substrate and variation in shape caused by repeated etching can be reduced, and damage to the substrate can be reduced.

  In the above-described embodiment, the case where the resist film and the corrosion-resistant film are used as the mask has been described. However, the mask is not particularly limited as long as the substrate can be patterned into a desired shape. For example, a metal mask may be used as the mask.

3. Modification Example of Vibration Element 3.1. First Modification Example Next, a vibration element according to a first modification example of the present embodiment will be described with reference to the drawings. FIG. 10 is a plan view schematically showing the resonator element 200 according to the first modification example of the embodiment. FIG. 11 is a cross-sectional view schematically showing a resonator element 200 according to a first modification of the present embodiment, and is a cross-sectional view taken along the line XI-XI in FIG. Hereinafter, in the vibration element 200, members having the same functions as those of the constituent members of the vibration element 100 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the example of the vibration element 100, as shown in FIGS. 2 and 3, the center of the first protrusion 14 and the center of the second protrusion 16 overlap each other in plan view.

  On the other hand, in the vibration element 200, as shown in FIGS. 10 and 11, the center position α of the first convex portion 14 and the center position β of the second convex portion 16 have a thickness slip in plan view. It is shifted in the direction along the vibration direction of the vibration. In the illustrated example, the center position α of the first protrusion 14 and the center position β of the second protrusion 16 are shifted in the direction along the long side of the substrate 12 (X-axis direction) in plan view. ing.

  In the vibration element 200, the width (the size in the X-axis direction) M1 of the first convex portion 14 and the width M2 of the second convex portion 16 are the same size. The center position α of the first convex portion 14 and the center position β of the second convex portion 16 are shifted in the X-axis direction. Thereby, the vibration part 12a can have the 1st non-overlap part 15a, the 2nd non-overlap part 15b, and the overlap part 15c.

In the illustrated example, the width L1 of the first non-overlapping portion 15a is the same as the width L2 of the second non-overlapping portion 15b. Note that L1 = (m ₁ × λ / 2) × k ₁ (where 0.8 <k ₁ <1.2), L2 = (m ₂ × λ / 2) × k ₂ (where 0. As long as the relationship of 8 <k ₂ <1.2) is satisfied, the width L1 and the width L2 may have different sizes. That is, the width M1 of the first convex portion 14 and the width M2 of the second convex portion 16 may have different sizes.

  Further, in the long side direction (X-axis direction) of the substrate 12 where bending vibration occurs, the positions of the edges a1 and a2 of the first protrusion 14 and the positions of the edges b1 and b2 of the second protrusion 16 are shifted. Yes. Therefore, four positions for suppressing bending vibration can be provided.

  According to the resonator element 101, similarly to the resonator element 10, four positions for suppressing bending vibration can be provided in the long side direction (X-axis direction) of the substrate 12. Thereby, like the vibrating piece 10, the manufacturing process can be simplified while suppressing the bending vibration.

  Note that the method for manufacturing the resonator element 101 is the same as the method for manufacturing the resonator element 10 described above, and a description thereof will be omitted.

3.2. Second Modification Example Next, a vibration element according to a second modification example of the present embodiment will be described with reference to the drawings. FIG. 12 is a plan view schematically showing a resonator element 300 according to the second modification example of the present embodiment. FIG. 13 is a cross-sectional view schematically showing a resonator element 300 according to a second modification of the present embodiment, and is a cross-sectional view taken along the line XIII-XIII in FIG. Hereinafter, in the vibration element 300, members having the same functions as those of the constituent members of the vibration element 100 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the example of the vibration element 100, as shown in FIGS. 1 to 3, the first convex portion 14 and the second convex portion 16 have one step.

  On the other hand, in the example of the vibration element 300, as shown in FIGS. 12 and 13, the first convex portion 14 and the second convex portion 16 have two steps. The first convex portion 14 includes two steps on the side surface, and the second convex portion 16 includes two steps on the side surface.

  In the vibration element 300, the first stage portion 14a of the first convex portion 14 and the second stage portion 14b of the first convex portion 14 are overlapped at the center in plan view. Therefore, the position on the X axis (X coordinate) is the same, and this position is set as the position α of the center of the first convex portion 14. In addition, the first stage portion 16a of the second convex portion 16 and the second stage portion 16b of the second convex portion 16 are overlapped at the center in plan view. Therefore, the position on the X axis (X coordinate) is the same, and this position is set as the center position β of the second convex portion 16. As shown in FIG. 13, the position α and the position β are shifted. That is, the center of the first protrusion 14 and the center of the second protrusion 16 are shifted in the X-axis direction (the direction along the long side of the substrate 12). Thereby, the vibration part 12a can have the 1st non-overlap part 15a, the 2nd non-overlap part 15b, and the overlap part 15c.

  The first convex portion 14 and the second convex portion 16 each have two steps and the non-overlapping portions 15a and 15b are provided, so that the substrate 12 suppresses bending vibration in the X-axis direction. Eight positions (positions of end edges of the convex portions) are provided. Note that the number of steps of the first protrusion 14 and the number of steps of the second protrusion 16 are not particularly limited.

The first step width M1 of the first convex portion 14, the second step width M2 of the first convex portion 14, the first step width M3 of the second convex portion 16, and the second step width of the second convex portion 16. M4 has a relationship of M1 = M3> M2 = M4. The width L1 of the first non-overlapping portion 15a and the width L2 of the second non-overlapping portion 15b are L1 = (m ₁ × λ / 2) × k ₁ (where 0.8 <k ₁ <1.2), L2 = (m ₂ × λ / 2) × k ₂ (where 0.8 <k ₂ <1.2) is satisfied.

  According to the vibration element 300 (vibration piece 102), since the number of steps of the first protrusion 14 and the second protrusion 16 is larger than in the example of the vibration element 100 (vibration piece 10), the main vibration is more efficiently performed. Energy can be confined.

3.3. Third Modification Example Next, a vibration element according to a third modification example of the present embodiment will be described with reference to the drawings. FIG. 14 is a perspective view schematically showing a resonator element 400 according to a third modification of the present embodiment. FIG. 15 is a cross-sectional view schematically showing a resonator element 400 according to a third modification of the present embodiment. Hereinafter, in the vibration element 400, members having the same functions as the constituent members of the vibration element 100 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the example of the vibration element 100, as illustrated in FIGS. 1 to 3, the first excitation electrode 20 completely covers the surface of the first protrusion 14, and the second excitation electrode 22 is the second protrusion 16. Completely covered the surface.

  On the other hand, in the vibration element 400, as shown in FIGS. 14 and 15, the first excitation electrode 20 covers a part of the surface of the first convex portion 14, and the second excitation electrode 22 is the second excitation electrode 22. A part of the surface of the convex portion 16 is covered. For example, the first excitation electrode 20 is provided inside the outer edge of the first convex portion 14 in plan view. The second excitation electrode 22 is provided inside the outer edge of the second convex portion 16 in plan view. In the illustrated example, the excitation electrodes 20 and 22 are provided on the convex portions 14 and 16.

  According to the vibration element 400, the same operational effects as those of the vibration element 100 described above can be achieved.

  Further, according to the vibration element 400, a corrosion-resistant film (see FIG. 9) can be used as the excitation electrodes 20 and 22 in the manufacturing process. Thereby, a manufacturing process can be simplified.

4). Next, the vibrator according to the present embodiment will be described with reference to the drawings. FIG. 16 is a cross-sectional view schematically showing a vibrator 500 according to this embodiment.

  As shown in FIG. 16, the vibrator 500 includes a resonator element according to the present invention and a package 55. More specifically, the vibrator 500 includes the vibration element according to the present invention. Below, the example using the vibration element 100 provided with the vibration piece 10 is demonstrated as a vibration element which concerns on this invention.

  The package 55 accommodates the vibration element 100. The package 55 can include a package base (mounting substrate) 40 and a lid 50.

  A recess 48 is formed in the package base 40, and the vibration element 100 is disposed in the recess 48. The planar shape of the package base 40 is not particularly limited as long as the vibration element 100 can be disposed in the recess 48. As the package base 40, for example, a material such as an aluminum oxide sintered body, quartz, glass, silicon, or the like, which is formed by stacking and firing ceramic green sheets, is used.

  A first terminal 42 is provided on the first surface 40a of the package base 40 (the bottom surface inside the recess 48 in the illustrated example). The first terminal 42 is provided with an adhesive (conductive adhesive) 30, and the first terminal 42 and the first excitation electrode 20 are electrically connected. Although not shown, the first surface 40 a is further provided with a first terminal that is electrically connected to the second excitation electrode 22.

  On the second surface (surface opposite to the first surface 40a) 40b of the package base 40, a second terminal 44 used when mounted on an external member such as an electronic device is provided. The second terminal 44 may be connected to a first terminal electrically connected to the first terminal 42 and the second excitation electrode 22 via a contact portion (not shown) penetrating the package base 40. .

  As the first terminal 42 and the second terminal 44, for example, a metal film obtained by laminating a film of nickel, gold or the like on a metallized layer such as tungsten by a method such as plating is used.

  The lid 50 is provided so as to cover the recess 48 of the package base 40. In the illustrated example, the shape of the lid 50 is a plate shape. As the lid 50, for example, the same material as that of the package base 40, or a metal such as Kovar, 42 alloy, or stainless steel is used. The lid 50 is bonded to the package base 40 via a bonding member 60 such as a seam ring, low-melting glass, or adhesive.

  The hermetically sealed recess 48 of the package base 40 is in a vacuum state (high vacuum state) or a state filled with an inert gas such as nitrogen, helium, or argon.

  According to the vibrator 500, it is possible to have the vibration element 100 (the vibration piece 10) that can simplify the manufacturing process while suppressing the bending vibration.

5. Next, a vibrator according to a modification of the present embodiment will be described with reference to the drawings. FIG. 17 is a cross-sectional view schematically showing a vibrator 600 according to a modification of the present embodiment. Hereinafter, in the vibrator 600, members having the same functions as those of the constituent members of the vibrator 500 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the vibrator 500, as shown in FIG. 16, the package base 40 has a recess 48. On the other hand, in the vibrator 600, as shown in FIG. 17, the package base 40 is not provided with the recess 48, and the package base 40 has a flat plate shape.

  In the vibrator 600, the lid 50 has a cap shape (container shape) in which a collar portion 52 is provided on the entire circumference, and the vibration element 100 can be accommodated in the space 54 inside the lid 50. The collar portion 52 is joined to the package base 40 via the joining member 60. As the lid 50, for example, a metal such as Kovar, 42 alloy, or stainless steel is used.

  According to the vibrator 600, it is not necessary to provide the recess 48 in the package base 40 as compared with the vibrator 500, and accordingly, the manufacture of the package base 40 becomes easier and the manufacturing cost can be reduced.

6). Next, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 18 is a cross-sectional view schematically showing an electronic device 800 according to this embodiment.

  As shown in FIG. 18, the electronic device 700 includes a resonator element according to the invention and an electronic element 70. More specifically, the electronic device 700 includes a vibrator according to the present invention. Hereinafter, an example in which the vibrator 500 including the resonator element 10 is used as the vibrator according to the invention will be described.

  The electronic element 70 is accommodated in the package 55. More specifically, the electronic element 70 is disposed in a recess 48 provided in the package base 40. As the electronic element 70, for example, an IC chip including an oscillation circuit that drives the resonator element 10 is used. Further, the IC chip may include a temperature compensation circuit that corrects a frequency variation accompanying a temperature change of the resonator element 10. In the case where an IC chip including an oscillation circuit is used as the electronic element 70, the electronic device 700 can function as an oscillator. The electronic element 70 is not limited to the IC chip as described above, and may be, for example, a thermistor, a capacitor, or a reactance element.

  The electronic element 70 is electrically connected to the third terminal 46 provided on the first surface 40 a of the package base 40 via the bump 72. The third terminal 46 is connected to the first terminal 42 by, for example, a wiring (not shown). Thereby, the electronic element 70 and the excitation electrodes 20 and 22 can be electrically connected.

  As the bump 72, for example, metal bumps such as gold and nickel are used. As the third terminal 46, for example, a metal film obtained by laminating a film of nickel, gold or the like on a metallized layer of tungsten or the like by a method such as plating is used.

  Although not shown, the electronic element 70 may be electrically connected to the third terminal 46 by a wire instead of the bump 72.

  According to the electronic device 700, it is possible to have the vibration element 100 (the vibration piece 10) that can simplify the manufacturing process while suppressing the bending vibration.

7). Next, an electronic device according to a modification of the present embodiment will be described with reference to the drawings. FIG. 19 is a cross-sectional view schematically showing an electronic device 800 according to a modification of the present embodiment. Hereinafter, in the electronic device 800, members having the same functions as those of the components of the electronic device 700 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the electronic device 700, as shown in FIG. 18, the electronic element 70 is provided on the first surface 40 a side of the package base 40 and is disposed in the recess 48 provided in the package base 40. On the other hand, in the electronic device 800, as shown in FIG. 19, the second surface 40b of the package base 40 is provided in the recess 49 serving as a bottom surface. In the electronic device 800, the package base 40 may have a substantially H shape.

  The electronic element 70 may be bonded to the second surface 40b with an adhesive (not shown). The electronic element 70 is electrically connected to the third terminal 46 provided on the second surface 40 b via the wire 74. The material of the wire 74 is, for example, gold.

  Although not shown, the electronic element 70 may be electrically connected to the third terminal 46 by a bump instead of the wire 74.

According to the electronic device 800, the vibration element 100 and the electronic element 70 are separated, and the vibration element 1
Since 00 is hermetically sealed alone, it can have good frequency aging characteristics.

8). Next, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 20 is a plan view schematically showing a form phone (smart phone) as an electronic apparatus according to the present embodiment.

  Smartphone 1000 includes the resonator element according to the invention. More specifically, the smartphone 1000 includes the electronic device according to the present invention. Hereinafter, as illustrated in FIG. 20, an example in which an electronic device 700 including the resonator element 10 is used as an electronic device according to the present invention will be described. For convenience, FIG. 20 illustrates the electronic device 700 in a simplified manner.

  The smartphone 1000 uses the electronic device 700 as a timing device such as a reference clock oscillation source, for example. The smartphone 1000 can further include a display unit (such as a liquid crystal display or an organic EL display) 1001, an operation unit 1002, and a sound output unit 1003 (such as a microphone). The smartphone 1000 may also use the display unit 1001 as an operation unit by providing a contact detection mechanism for the display unit 1001.

  According to the smartphone 1000, it is possible to have the vibration element 100 (the vibration piece 10) that can simplify the manufacturing process while suppressing bending vibration.

  Note that, as described above, an electronic device typified by the smartphone (morphological phone) 1000 includes an oscillation circuit that drives the vibration piece 10 and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the vibration piece 10. It is preferable to provide.

  According to this, since the electronic device represented by the smartphone 1000 includes the oscillation circuit that drives the resonator element 10 and the temperature compensation circuit that corrects the frequency variation accompanying the temperature change of the resonator element 10, the oscillation circuit Therefore, it is possible to provide temperature compensation for the resonance frequency at which oscillation occurs and to provide an electronic device having excellent temperature characteristics.

  The electronic device provided with the resonator element according to the invention is not limited to the above smartphone, but an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a navigation device, a pager, an electronic notebook, a calculator, a word processor, a work It can be suitably used as a timing device such as a station, a videophone, a POS terminal, or a device equipped with a touch panel.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 1 ... AT cut quartz substrate, 2 ... Substrate, 4 ... Corrosion-resistant film, 6 ... Resist film, 10 ... Vibrating piece, 12 ... Substrate, 12a ... Vibrating part, 12b ... Outer edge part, 13a ... 1st main surface, 13b ... 1st 2 principal surfaces, 14 ... 1st convex part, 15a ... 1st non-overlapping part, 15b ... 2nd non-overlapping part, 15c ... Overlapping part, 16 ... 2nd convex part, 20 ... 1st excitation electrode, 22 ... 2nd Excitation electrode, 24 ... Connection electrode, 26 ... Mount electrode, 30 ... Adhesive, 40 ... Package base, 40a ... First surface, 40b ... Second surface, 42 ... First terminal, 44 ... Second terminal, 46 ... First 3-terminal, 48 ... concave portion, 49 ... concave portion, 50 ... lid, 52 ... collar portion, 54 ... space, 55 ... package, 60 ... joining member, 70 ... electronic element, 72 ... bump, 74 ... wire, 100 ... vibration element , 101, 102... Vibrating piece, 200, 300, 400. 500, 600 ... vibrator, 700, 800 ... electronic devices, 1000 ... smartphone, 1001 ... the display unit, 1002 ... the operating unit, 1003 ... the sound output section

Claims (11)

Including a vibration part that excites thickness shear vibration, and a substrate having an outer edge part disposed along an outer edge of the vibration part,
The vibrating part is
A first protrusion protruding from one main surface of the outer edge;
A second convex portion protruding from the other main surface on the back side with respect to one main surface of the outer edge portion, and
The vibration part includes a part in which the first convex part and the second convex part do not overlap in a plan view. In claim 1,
The width L of the non-overlapping portion is a resonator element that satisfies the relationship of the following formula.
L = (m × λ / 2) × k
However, m is an integer greater than or equal to 1, (lambda) is a wavelength of bending vibration, and it is 0.8 <k <1.2. In claim 1 or 2,
The width of the non-overlapping portion is a resonator element having a size in a direction along a vibration direction of the thickness shear vibration. In any one of Claims 1 thru | or 3,
The shape of the vibrating part is a vibrating piece that is rectangular in plan view. In any one of Claims 1 thru | or 4,
The first convex portion includes a plurality of steps on a side surface,
The second convex portion is a resonator element including a plurality of steps on a side surface. In any one of Claims 1 thru | or 5,
The center of the said 1st convex part and the center of the said 2nd convex part have shifted | deviated to the direction in alignment with the vibration direction of the said thickness shear vibration in planar view. Preparing a substrate that vibrates due to a thickness slip;
A first mask is disposed on one main surface of the substrate;
A second mask is disposed on the other main surface on the back surface side with respect to one main surface of the substrate, the second mask being smaller than the area of the first mask and overlapping the first mask in plan view.
Etching the substrate exposed from the first mask and the second mask,
A first convex portion including a vibrating portion and a substrate having an outer edge portion disposed along an outer edge of the vibrating portion, wherein the vibrating portion protrudes from one main surface of the outer edge portion; A second convex portion projecting from the other main surface on the back surface side with respect to one main surface of the outer edge portion, and the vibrating portion in plan view and the first convex portion Forming a mesa substrate having a portion that does not overlap the second convex portion;
A method for manufacturing a resonator element, comprising: The vibrator element according to any one of claims 1 to 6,
A first excitation electrode that covers a surface of the first convex portion and a surface of a portion of the outer edge portion of the one main surface;
A second excitation electrode covering a surface of the second convex portion and a part of the outer edge portion of the other main surface;
Including a vibrating element. A vibrating piece according to any one of claims 1 to 6,
A package for housing the resonator element;
Including a vibrator. A vibrating piece according to any one of claims 1 to 6,
An electronic element;
Including electronic devices.   An electronic apparatus comprising the resonator element according to claim 1.

Images