JP2013197801A - Vibration piece, oscillator, electronic device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece that can reduce a CI value while achieving a reduction in size.SOLUTION: A vibration piece 10 is provided with a substrate 12 including: a vibration section 12a vibrated by thickness-shear vibration; an outer edge portion 12b that is disposed along an outer edge of the vibration section 12a and has a thickness thinner than that of the vibration section 12a; and a joint region 19 that is provided on the outer edge portion 12b and is joined with a bonding agent 30 for fixing a vibration element 100 to a mounting substrate 40. When a length of the substrate 12 in a direction in which the substrate 12 is vibrated by the thickness-shear vibration is represented by x, the thickness of the vibration section 12a is represented by t and a distance between the vibration section 12a and the joint region 19 is represented by y, y falls within a range determined by an expression of -0.0139×(x/t)+0.3169≤y≤-0.0113×(x/t)+0.3169.

Description

  The present invention relates to a resonator element, a vibrator, an electronic device, and an electronic apparatus.

  In recent years, a reduction in CI (crystal impedance) value is desired in a piezoelectric vibrating piece that tends to be miniaturized. A device having a mesa structure is known for the purpose of reducing the CI value and confining vibration energy.

  For example, Patent Literature 1 proposes a piezoelectric vibrating piece in which an optimum value of the amount of substrate moat for obtaining a mesa structure is determined. More specifically, in Patent Document 1, the amount of moat Md, the length of the long side of the quartz substrate is x, and the thickness of the vibrating portion is t. Assuming that the ratio y of the ratio to the thickness t is y, the minimum moat amount Md at which the change in the CI value characteristic is flat is selected by satisfying the relationship y = −1.32 × (x / t) +42.87 It describes what you can do.

  Further, Patent Document 2 defines not only the optimum value of the substrate moat but also the range of the length of the long side in the application range of the conductive adhesive applied when the piezoelectric vibrating piece is mounted on the mounting substrate. By doing this, it is described that the reduction of the CI value is promoted while suppressing the coupling of the unnecessary mode.

  Patent Document 3 describes that characteristic deterioration such as an increase in CI value is suppressed by defining the length of the end portion of the excitation electrode from the end portion of the vibration portion.

  As described above, the CI value is reduced from various viewpoints.

JP 2007-124441 A JP 2008-263387 A JP 2010-28610 A

  One of the objects according to some aspects of the present invention is to provide a resonator element capable of reducing the CI value while reducing the size. Another object of some aspects of the present invention is to provide a vibrator having the vibrating piece. Another object of some embodiments of the present invention is to provide an electronic device having the vibrating piece. Another object of some embodiments of the present invention is to provide an electronic device having the above-described vibrating piece.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
The resonator element according to this application example is
A vibration part that vibrates due to thickness-slip vibration;
An outer edge portion disposed along the outer edge of the vibrating portion and having a thickness smaller than the thickness of the vibrating portion;
A bonding region provided on the outer edge and bonded with a bonding agent for fixing to the mounting substrate;
Comprising a substrate including
When the length along the direction of vibration of the thickness shear vibration of the substrate is x, the thickness of the vibration part is t, and the distance between the vibration part and the bonding region is y,
Y is
−0.0139 × (x / t) + 0.3169 ≦ y ≦ −0.0113 × (x / t) +0.3169
It is in the range.

  According to such a resonator element, it is possible to reduce the CI value while reducing the size (details will be described later).

[Application Example 2]
In the resonator element according to this application example,
When the difference between the thickness of the vibrating portion and the thickness of the outer edge portion is Md, and the percentage of the ratio of Md to the t is z,
−5 ≦ z + 1.32 × (x / t) −42.87 (%)
May be satisfied.

  According to such a resonator element, the CI value can be further reduced.

[Application Example 3]
In the resonator element according to this application example,
−5 ≦ z + 1.32 × (x / t) −42.87 ≦ 5 (%)
May be satisfied.

  According to such a resonator element, it is possible to reduce the possibility of etching erosion and deterioration of vibration characteristics, and to obtain good vibration characteristics.

[Application Example 4]
In the resonator element according to this application example,
The side ratio (x / t) of x to t may be 30 or less.

  According to such a resonator element, it is possible to reduce the CI value while further reducing the size.

[Application Example 5]
In the resonator element according to this application example,
The substrate may be a rotating Y-cut substrate.

  According to such a resonator element, it is possible to reduce the CI value while reducing the size.

[Application Example 6]
The vibrator according to this application example is
A resonator element according to this application example;
A package for housing the resonator element;
including.

  According to such a vibrator, it is possible to have a resonator element capable of reducing the CI value while reducing the size.

[Application Example 7]
The electronic device according to this application example is
A resonator element according to this application example;
An electronic element;
including.

  According to such an electronic device, it is possible to have the resonator element that can reduce the CI value while reducing the size.

[Application Example 8]
The electronic device according to this application example is
The resonator element according to this application example is included.

  According to such an electronic device, it is possible to have the resonator element that can reduce the CI value while reducing the size.

The perspective view which shows typically the vibration element which concerns on this embodiment. FIG. 3 is a plan view schematically showing the resonator element according to the embodiment. FIG. 3 is a cross-sectional view schematically showing the resonator element according to the embodiment. The perspective view which shows an AT cut quartz substrate typically. The graph which shows the relationship between the distance Lx between a vibration part and a support part, and CI value. The graph which shows the relationship between side ratio (x / t) and minimum value Lx_min of distance Lx where the characteristic change of CI value becomes flat. The top view which shows typically the vibration element which concerns on the modification of this embodiment. Sectional drawing which shows typically the vibration element which concerns on the modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing a vibrator according to the embodiment. Sectional drawing which shows typically the vibrator | oscillator which concerns on the modification of this embodiment. FIG. 3 is a cross-sectional view schematically showing the electronic device according to the embodiment. Sectional drawing which shows typically the electronic device which concerns on the modification of this embodiment. FIG. 3 is a plan view schematically showing the electronic apparatus according to the embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. In addition, not all of the configurations described below are essential constituent requirements of the present invention.

1. First, the vibration element according to the present embodiment will be described with reference to the drawings. FIG. 1 is a perspective view schematically showing a resonator element 100 according to the present embodiment. FIG. 2 is a plan view schematically showing the resonator element 100 according to this embodiment. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2 schematically showing the resonator element 100 according to the present embodiment.

  As illustrated in FIGS. 1 to 3, the vibration element 100 can include a resonator element 10, excitation electrodes 20 a and 20 b, a connection electrode 22, and a mount electrode 24.

  The vibrating piece 10 includes a mesa structure substrate 12 having a vibrating portion 12a and an outer edge portion 12b. For example, a piezoelectric substrate is used as the substrate 12. More specifically, as the substrate 12, a rotated Y-cut substrate such as an AT-cut quartz substrate is used.

  Here, FIG. 4 is a perspective view schematically showing the AT-cut quartz crystal substrate 2. Piezoelectric materials such as quartz are generally trigonal and have crystal axes (X, Y, Z) as shown in FIG. The X axis is an electrical axis, the Y axis is a mechanical axis, and the Z axis is an optical axis. The rotated Y-cut substrate is a flat plate cut from a piezoelectric material (for example, artificial quartz crystal) along a plane obtained by rotating the XZ plane around the X axis by an angle θ. Here, for example, in the case of the AT cut quartz crystal substrate 2, θ = 35 ° 15 ′. Further, the Y axis and the Z axis are also rotated around the X axis by θ to be the Y ′ axis and the Z ′ axis, respectively. Accordingly, the rotating Y-cut substrate has a crystal axis (X, Y ′, Z ′) axis. In the AT-cut quartz crystal substrate 2 with θ = 35 ° 15 ′, the XZ ′ plane (plane including the X-axis and Z′-axis) orthogonal to the Y′-axis becomes the main surface (excitation surface), and the thickness-shear vibration is the main vibration. Can vibrate as. The substrate 12 can be obtained by processing the AT-cut quartz crystal substrate 2.

  That is, the substrate 12 is, for example, an orthogonal coordinate system comprising an X axis as an electrical axis, a Y axis as a mechanical axis, and a Z axis as an optical axis, which are crystal axes of quartz as shown in FIG. Axis with the Z axis tilted in the -Y direction of the Y axis around the X axis of the Y axis as the Z 'axis, an axis with the Y axis tilted in the + Z direction of the Z axis as the Y' axis, and the X axis and the Z 'axis And an AT-cut quartz substrate having a thickness in a direction parallel to the Y ′ axis.

  The substrate 12 is not limited to an AT cut quartz substrate. For example, a BT cut crystal substrate can be obtained by setting θ = −49 ° (rotation by 49 ° opposite to the direction of the arrow θ shown in FIG. 4). In addition, the surface of the quartz crystal perpendicular to the Y-axis is rotated by about 33 ° about the X-axis, and further cut from the surface rotated about 22 ° about the Z-axis from this rotated position, thereby SC-cut. A quartz substrate can be obtained.

  The shape of the substrate 12 is rectangular in plan view (as viewed from the Y′-axis direction) as shown in FIG. The long side of the substrate 12 is formed along the X axis of the quartz crystal, and the short side of the substrate 12 is formed along the Z ′ axis orthogonal to the X axis of the quartz crystal.

  As shown in FIG. 3, the substrate 12 has a first main surface 13a and a second main surface 13b. The main surfaces 13a and 13b are surfaces parallel to the XZ ′ plane. In the illustrated example, the first main surface 13a is a surface facing the + Y′-axis direction, and the second main surface 13b is a surface facing the −Y′-axis direction.

  The vibration part 12a is surrounded by the outer edge part 12b in plan view. The vibration part 12a has a thickness t larger than the thickness t ′ of the outer edge part 12b. That is, a step is formed at the boundary between the vibrating portion 12a and the outer edge portion 12b, and the substrate 12 has a one-stage mesa structure. The planar shape of the vibration part 12 a is rectangular, the long side of the vibration part 12 a is parallel to the long side of the substrate 12, and the short side of the vibration part 12 a is parallel to the short side of the substrate 12. The vibration part 12a is excited by the thickness shear vibration and can vibrate with the thickness shear vibration as a main vibration. At this time, the thickness shear vibration vibrates along the X-axis direction.

  The outer edge part 12b is arrange | positioned along the outer edge of the vibration part 12a in planar view (periphery). The outer edge portion 12b has a thickness that is thinner than the thickness of the vibrating portion 12a. More specifically, the outer edge portion 12b has a thickness t ′ that is smaller than the thickness t of the vibrating portion 12a. The outer edge portion 12 b has a fixing portion 18 that is fixed by the bonding agent 30 when the vibration element 100 is fixed (bonded) to the mounting substrate 40. In the example shown in FIG. 3, the fixing portion 18 is a portion located above the contact surface 32 of the bonding agent 30 with the mount electrode 24. That is, the fixed portion 18 is a portion that overlaps the contact surface 32 in plan view as shown in FIG. For example, the fixed portion 18 is provided in the + X-axis direction with respect to the vibrating portion 12a. Although the planar shape of the fixing | fixed part 18 is not specifically limited, For example, it is a rectangle.

  The fixing portion 18 of the outer edge portion 12 b is provided with a bonding region 19 to which a bonding agent 30 for fixing (bonding) the vibration element 100 to the mounting substrate 40 is bonded. In the example shown in FIG. 3, the bonding agent 30 is bonded to the bonding region 19 via the mount electrode 24. The joining region 19 is the lower surface (second main surface 13b) of the fixing portion 18.

  For convenience, illustration of the bonding agent 30 and the mounting substrate 40 is omitted in FIG. 1, and illustration of the mounting substrate 40 is omitted in FIG. 2.

  The substrate 12 having the vibrating portion 12a and the outer edge portion 12b is formed by covering a portion that becomes the vibrating portion 12a of a plate-like piezoelectric substrate (not shown) with a protective film (not shown) and a portion that becomes the outer edge portion 12b chemically. It is formed by etching (etching).

Here, the length of the long side of the substrate 12 (the length along the vibration direction of the thickness shear vibration of the substrate 12) is x, the thickness of the vibration part 12a is t, and the distance between the vibration part 12a and the bonding region 19 is When the distance Lx is y, y is
−0.0139 × (x / t) + 0.3169 ≦ y ≦ −0.0113 × (x / t) +0.3169 (1)
It is in the range. By satisfying the expression (1), the resonator element 10 can reduce the CI value while reducing the size (details will be described later). The distance Lx between the vibration part 12a and the bonding area 19 is the shortest distance between the vibration part 12a and the bonding area 19 and represents the distance in the X-axis direction.

Further, when Md is a moat amount of the substrate 12 for obtaining a mesa structure (a difference between a thickness t of the vibrating portion 12a and a thickness t ′ of the outer edge portion 12b), a ratio of the moat amount Md to the thickness t of the vibrating portion 12a. The percentage z of
z = −1.32 × (x / t) +42.87 (%) (2)
It is desirable to satisfy the relationship.

  By satisfying Expression (2), it is possible to select the minimum moat amount Md value at which the CI value characteristic change becomes flat. That is, as the moat amount Md increases, the CI value tends to decrease. However, if the etching time for forming the moat amount Md is lengthened, the protective film formed in a portion other than the etched portion deteriorates, and the etching is eroded. May occur. Etching erosion tends to vary depending on the state of the protective film and the state of the substrate. Therefore, variation in substrate shape may increase due to the influence of etching erosion. Also, the manufacturing cost may increase due to the longer etching time. Furthermore, the coupling of the unnecessary mode to the main vibration mode shows a tendency opposite to the decrease in the CI value with the increase in the moat amount Md. For this reason, when the moat amount Md is increased, the bending mode, which is an unnecessary mode, can be easily applied to the thickness-slip mode, which is the main mode, and vibration characteristics may be deteriorated. Therefore, if the minimum value at which the CI value characteristic change becomes flat can be selected as the moat amount Md, the possibility of the above-described etching erosion and the deterioration of the vibration characteristic can be reduced, and good vibration characteristics can be obtained. Can do.

Here, even if the percentage z of the ratio of the moat amount Md to the thickness t of the vibrating portion 12a is 5% smaller than the value calculated from the equation (2), the CI value can be sufficiently reduced. Therefore, z is
−5 ≦ z + 1.32 × (x / t) −42.87 (%) (3)
As long as the relationship is satisfied.

Furthermore, even if the percentage z of the ratio of the moat amount Md to the thickness t of the vibrating portion 12a is larger by 5% than the value calculated from the equation (2), the etching biting occurs and the main vibration mode Combining unnecessary modes can be suppressed. Therefore, z is
−5 ≦ z + 1.32 × (x / t) −42.87 ≦ 5 (%) (4)
As long as the relationship is satisfied.

  Equation (2) analyzes the change in the CI value by changing the moat amount Md for each side ratio x / t (a ratio representing the length x of the long side of the substrate 12 with respect to the thickness t of the vibrating portion 12a). This is an equation calculated by conducting an experiment to obtain the minimum value Md_min of the moat amount Md at which the CI value characteristic change becomes flat.

  The side ratio x / t is desirably 30 or less. When the side ratio x / t exceeds 30, the value of Md_min becomes remarkably small, so that it is not necessary to form the piezoelectric substrate in a mesa shape. That is, a low CI value can be obtained without forming the piezoelectric substrate in a mesa shape. Therefore, by forming a substrate having a side ratio x / t of 30 or less in a mesa shape, it is possible to reduce the CI value while reducing the size.

  The excitation electrodes 20a and 20b are provided on the surface of the vibration part 12a. The excitation electrodes 20a and 20b are provided, for example, inside the outer edge of the vibration part 12a in plan view as shown in FIG. In the example shown in FIG. 3, the excitation electrodes 20a and 20b are provided with the vibrating portion 12a interposed therebetween. The excitation electrode 20a is provided in the + Y′-axis direction with respect to the excitation electrode 20b. The centers of the excitation electrodes 20a and 20b overlap, for example, the center of the vibration part 12a in plan view. The excitation electrodes 20a and 20b can apply a voltage to the vibration part 12a.

  The excitation electrodes 20 a and 20 b are connected to the mount electrode 24 through the connection electrode 22. The mount electrode 24 is provided in the bonding region 19 of the fixed portion 18 (outer edge portion 12b). The mount electrode 24 can be in contact with the bonding agent 30. In the example shown in FIG. 2, the planar shape of the mount electrode 24 is the same as the planar shape of the contact surface 32 of the bonding agent 30 with the mount electrode 24.

  As the excitation electrodes 20a and 20b, the connection electrode 22, and the mount electrode 24, for example, those obtained by laminating chromium and gold in this order from the substrate 12 side are used. The excitation electrodes 20a and 20b, the connection electrode 22, and the mount electrode 24 are formed by, for example, a sputtering method or a vacuum evaporation method.

  The bonding agent 30 can fix (bond) the vibration element 100 to the mounting substrate 40. In the example illustrated in FIG. 3, the bonding agent 30 bonds the mount electrode 24 provided on the outer edge portion 12 b of the vibrating piece 10 and the terminal 42 provided on the mounting substrate 40. As the bonding agent 30, a conductive adhesive can be used. More specifically, as the bonding agent 30, a silver paste can be used.

  The mounting substrate 40 is a substrate to which the vibration element 100 is bonded (mounted). The shape of the mounting substrate 40 is not particularly limited as long as the vibration element 100 can be bonded. More specifically, as the mounting substrate 40, a package base 40 (for example, see FIG. 9 described later) that constitutes a package can be used.

  The vibration element 100 (vibration piece 10) according to the present embodiment has the following characteristics, for example.

  According to the resonator element 10, the expression (1) can be satisfied. Accordingly, the resonator element 10 can reduce the CI value while reducing the size (details will be described later).

  According to the resonator element 10, the expression (3) can be satisfied, and further, the expression (4) can be satisfied. Thereby, as described above, the resonator element 10 can select the minimum value at which the CI characteristic change is flat. As a result, the resonator element 10 can reduce the possibility of etching erosion and deterioration of vibration characteristics, and can obtain good vibration characteristics.

  According to the resonator element 10, the side ratio x / t is 30 or less. As described above, when the side ratio x / t exceeds 30, the value of Md_min becomes remarkably small, so that it is not necessary to form the substrate in a mesa shape. Therefore, by forming a substrate having a side ratio x / t of 30 or less in a mesa shape, the CI value can be reduced while further reducing the size.

2. Experimental Example Next, an experimental example will be described. The present invention is not limited by the following experimental examples.

  The inventors of the present application conduct an experiment using the vibration element 100 shown in FIGS. 1 to 3, and FIG. I found a similar trend. According to FIG. 5, the CI value of the vibrating element 100 (vibrating piece 10) tends to decrease as the distance Lx increases, but when the distance Lx reaches a certain value, the distance Lx is increased thereafter. It can be seen that the change in the CI value characteristic is substantially flat. In FIG. 5, the minimum value Lx_min of the distance Lx at which the CI value characteristic change becomes flat is 0.04 mm. That is, in the example illustrated in FIG. 5, by setting the distance Lx to 0.04 mm, the resonator element 10 can reduce the CI value while reducing the size. For example, even if the distance Lx is set to 0.10 mm, the resonator element 10 can have a CI value equivalent to 0.04 mm. However, since the value of the distance Lx is larger than 0.04 mm, the size can be reduced accordingly. I can't plan. The relationship between the distance Lx and the CI value shown in FIG. 5 relates to the resonator element 10 having the side ratio x / t of 22.94 (frequency 26 MHz).

  As shown in FIG. 5, the reason why the CI value increases as the distance Lx is smaller is, for example, that the influence fixed by the bonding agent 30 as the distance Lx is smaller easily affects the vibration part 12a. This is thought to be due to a reduction in the confinement effect of the main vibration.

  In this experimental example, the length x of the long side of the substrate 12 is constant, the size Sx of the bonding region 19 in the X-axis direction is constant, the end of the vibration part 12a in the −X-axis direction, and the excitation electrode 20 The distance d1 between the end in the −X-axis direction of the X-axis direction is constant, and the distance d2 between the end in the + X-axis direction of the vibration part 12a and the end in the + X-axis direction of the excitation electrode 20 is constant. Lx was changed. Furthermore, in the present experimental example, the distance Lx was changed in a state where the centers of the vibrating portion 12a and the excitation electrodes 20a and 20b overlap in plan view. Further, in this experimental example, an AT-cut quartz crystal substrate was used as the substrate 12, and a one-step mesa structure with a trench amount Md satisfying the formula (2) was formed. In this experimental example, a conductive adhesive of silver paste was used as the bonding agent 30. Further, in this experimental example, the planar shape of the substrate 12 and the vibration part 12a is a rectangle having a long side along the X axis, and the bonding agent 30 is arranged in the + X axis direction from the vibration part 12a.

  The inventors of the present application have found the relationship shown in FIG. FIG. 6 is a graph showing the minimum value Lx_min of the distance Lx at which the change in the CI value characteristic becomes flat when the change in the CI value is examined by changing the distance Lx for each side ratio x / t. More specifically, the resonator element 10 having side ratios x / t = 2.18, 22.94, 23.83, and 25.59 was used. Table 1 shows the frequency F of each resonator element 10, the length x of the long side of the substrate 12, the size Mx in the X-axis direction of the vibrating portion 12a, the side ratio x / t, and Lx_min.

It can be said that the relationship between the side ratio x / t and Lx_min is substantially proportional as can be seen from FIG. When Lx_min is represented by y in the mathematical formula, the minimum value y of the distance Lx at which the characteristic change of the CI value becomes flat is:
y = −0.0126 × (x / t) + 0.3169 ± 0.0013 × (x / t) (1 ′)
It can be expressed as. That is, by satisfying the formula (1 ′), the resonator element 10 can reduce the CI value while achieving downsizing.

  In Expression (1 ′), “± 0.0013 × (x / t)” on the right side indicates an error. For example, as illustrated in FIG. 6, the resonator element 10 having the side ratio x / t of 21.18 may have Lx_min of 0.02 mm and 0.08 mm, and the difference between the two may be an error. The value normalized by the ratio x / t is “± 0.0013 × (x / t)”.

Equation (1 ′) is
−0.0139 × (x / t) + 0.3169 ≦ y ≦ −0.0113 × (x / t) +0.3169 (1)
It can be expressed as. That is, by satisfying the formula (1), the resonator element 10 can reduce the CI value while reducing the size.

Note that the straight line shown in FIG.
y = −0.0126 × (x / t) +0.3169 (5)
It can be expressed as.

  In this experimental example, an AT-cut quartz substrate is used as the substrate 12. However, this experimental example can also be applied to the case where a piezoelectric substrate other than the AT-cut quartz substrate is used. However, it is desirable to use a quartz substrate as the substrate 12 from the side of substrate processing, that is, mesa processing ease.

  Moreover, although the silver paste was used as the bonding agent 30 in this experimental example, this experimental example can also be applied to the case where a conductive adhesive other than the silver paste is used.

  In this experimental example, the resonator element 10 in which the excitation electrodes 20a and 20b are provided inside the outer edge of the vibration part 12a in plan view is used. However, in this experimental example, the excitation electrodes 20a and 20b in plan view are used. The present invention can also be applied to a vibrating piece (see a vibrating element 200 described later) provided on the inner side of the outer edge.

3. Next, a vibration element according to a modification of the present embodiment will be described with reference to the drawings. FIG. 7 is a plan view schematically showing a resonator element 200 according to a modification of the present embodiment. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7 schematically showing a resonator element 200 according to a modification of the present embodiment. For convenience, the mounting substrate 40 is not shown in FIG. Hereinafter, in the vibration element 200, members having the same functions as those of the constituent members of the vibration element 100 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the vibration element 100, the excitation electrodes 20a and 20b are provided inside the outer edge of the vibration part 12a in a plan view as shown in FIG. On the other hand, in the vibration element 200, as shown in FIG. 7, the vibration portion 12a is provided inside the outer edges of the excitation electrodes 20a and 20b in a plan view. That is, in the vibration element 200, the excitation electrodes 20a and 20b are provided so as to completely cover the surface of the vibration part 12a, as shown in FIGS.

According to the vibration element 200, similarly to the vibration element 100, the CI value can be reduced while reducing the size by satisfying the expression (1). Furthermore, according to the vibration element 200, the capacitance ratio γ can be increased as compared with the vibration element 100. The capacity ratio γ is obtained by dividing the capacity C ₀ determined by the dimensions (sizes) of the excitation electrodes 20 a and 20 b by the capacity C ₁ determined by the substantial vibration region of the resonator element 10.

4). Next, the vibrator according to the present embodiment will be described with reference to the drawings. FIG. 9 is a cross-sectional view schematically showing the vibrator 300 according to the present embodiment.

  As shown in FIG. 9, the vibrator 300 includes a resonator element according to the present invention and a package 55. More specifically, the vibrator 300 includes the vibration element according to the present invention. Below, the example using the vibration element 100 provided with the vibration piece 10 is demonstrated as a vibration element which concerns on this invention.

  The package 55 accommodates the vibration element 100. The package 55 can include a package base (mounting substrate) 40 and a lid 50.

  A recess 48 is formed in the package base 40, and the vibration element 100 is disposed in the recess 48. The planar shape of the package base 40 is not particularly limited as long as the vibration element 100 can be disposed in the recess 48. As the package base 40, for example, a material such as an aluminum oxide sintered body, quartz, glass, silicon, or the like, which is formed by stacking and firing ceramic green sheets, is used.

  A first terminal 42 is provided on the first surface 40a of the package base 40 (the bottom surface inside the recess 48 in the illustrated example). The first terminal 42 is provided with a bonding agent (conductive adhesive) 30, and the first terminal 42 and the excitation electrode 20 a are electrically connected.

  On the second surface (the surface opposite to the first surface 40a) 40b of the package base 40, second terminals 44a and 44b used when mounted on an external member such as an electronic device are provided. The second terminal 44 a may be connected to the first terminal 42 via a contact portion (not shown) that penetrates the package base 40. Thereby, the 2nd terminal 44a and the 1st excitation electrode 20a can be electrically connected.

  The first surface 40a is provided with a terminal (not shown), and the terminal and the excitation electrode 20b may be electrically connected. The terminal and the second terminal 44b may be connected via a contact portion (not shown) penetrating the package base 40. Thereby, the 2nd terminal 44b and the 2nd excitation electrode 20b can be electrically connected.

  As the first terminal 42 and the second terminals 44a and 44b, for example, a metal film obtained by laminating a film of nickel, gold or the like on a metallized layer of tungsten or the like by a method such as plating is used.

  The lid 50 is provided so as to cover the recess 48 of the package base 40. In the illustrated example, the shape of the lid 50 is a plate shape. As the lid 50, for example, the same material as that of the package base 40, or a metal such as Kovar, 42 alloy, or stainless steel is used. The lid 50 is bonded to the package base 40 via a bonding member 60 such as a seam ring, low-melting glass, or adhesive.

  The hermetically sealed recess 48 of the package base 40 is in a vacuum state (high vacuum state) or a state filled with an inert gas such as nitrogen, helium, or argon.

  According to the vibrator 300, it is possible to have the resonator element 10 capable of reducing the CI value while reducing the size.

5. Next, a vibrator according to a modification of the present embodiment will be described with reference to the drawings. FIG. 10 is a cross-sectional view schematically showing a vibrator 400 according to a modification of the present embodiment. Hereinafter, in the vibrator 400, members having the same functions as those of the constituent members of the vibrator 300 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the vibrator 300, as shown in FIG. 9, a recess 48 is provided in the package base 40. On the other hand, in the vibrator 400, as shown in FIG. 10, the package base 40 is not provided with the recess 48, and the package base 40 has a flat plate shape.

  In the vibrator 400, the lid 50 has a cap shape (container shape) in which a flange portion 52 is provided on the entire circumference, and the vibration element 100 can be accommodated in a space 54 inside the lid 50. The collar portion 52 is joined to the package base 40 via the joining member 60. As the lid 50, for example, a metal such as Kovar, 42 alloy, or stainless steel is used.

  According to the vibrator 400, it is not necessary to provide the recess 48 in the package base 40 as compared with the vibrator 300, and accordingly, the manufacture of the package base 40 becomes easier and the manufacturing cost can be reduced.

6). Next, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 11 is a cross-sectional view schematically showing the electronic device 500 according to the present embodiment.

  As shown in FIG. 11, the electronic device 500 includes a resonator element according to the invention and an electronic element 70. More specifically, the electronic device 500 includes the vibrator according to the present invention. Hereinafter, an example in which the vibrator 300 including the resonator element 10 is used as the vibrator according to the invention will be described.

  The electronic element 70 is accommodated in the package 55. More specifically, the electronic element 70 is disposed in a recess 48 provided in the package base 40. As the electronic element 70, for example, an IC chip including an oscillation circuit that drives the resonator element 10 is used. Further, the IC chip may include a temperature compensation circuit that corrects a frequency variation accompanying a temperature change of the resonator element 10. When using an IC chip including an oscillation circuit as the electronic element 70, the electronic device 500 can function as an oscillator. The electronic element 70 is not limited to the IC chip as described above, and may be, for example, a thermistor, a capacitor, or a reactance element.

  The electronic element 70 is electrically connected to the third terminal 46 provided on the first surface 40 a of the package base 40 via the bump 72. The third terminal 46 is connected to the first terminal 42 by, for example, a wiring (not shown). Thereby, the electronic element 70 and the excitation electrode 20a can be electrically connected. Further, the electronic element 70 may be electrically connected to the excitation electrode 20b by a wiring (not shown).

  As the bump 72, for example, metal bumps such as gold and nickel are used. As the third terminal 46, for example, a metal film obtained by laminating a film of nickel, gold or the like on a metallized layer of tungsten or the like by a method such as plating is used.

  Although not shown, the electronic element 70 may be electrically connected to the third terminal 46 by a wire instead of the bump 72.

  According to the electronic device 500, the resonator element 10 that can reduce the CI value while reducing the size can be provided.

7). Next, an electronic device according to a modification of the present embodiment will be described with reference to the drawings. FIG. 12 is a cross-sectional view schematically showing an electronic device 600 according to a modified example of the present embodiment. Hereinafter, in the electronic device 600, members having the same functions as the components of the electronic device 500 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the electronic device 500, as shown in FIG. 11, the electronic element 70 is provided on the first surface 40 a side of the package base 40 and is disposed in the recess 48 provided in the package base 40. On the other hand, in the electronic device 600, as shown in FIG. 12, the second surface 40b of the package base 40 is provided in the recess 49 serving as a bottom surface. In the electronic device 600, the package base 40 may have a substantially H shape.

  The electronic element 70 may be bonded to the second surface 40b with an adhesive (not shown). The electronic element 70 is electrically connected to the third terminal 46 provided on the second surface 40 b via the wire 74. The material of the wire 74 is, for example, gold.

  Although not shown, the electronic element 70 may be electrically connected to the third terminal 46 by a bump instead of the wire 74.

  According to the electronic device 600, since the vibration element 100 and the electronic element 70 are separated and the vibration element 100 is hermetically sealed alone, the electronic device 600 can have good frequency aging characteristics.

8). Next, an electronic device according to the present embodiment will be described with reference to the drawings. FIG. 13: is a top view which shows typically a form telephone (smart phone) as an electronic device which concerns on this embodiment.

  Smartphone 700 includes the resonator element according to the invention. More specifically, the smartphone 700 includes the electronic device according to the present invention. Hereinafter, as illustrated in FIG. 13, an example in which an electronic device 500 including the resonator element 10 is used as an electronic device according to the present invention will be described. For convenience, FIG. 13 illustrates the electronic device 500 in a simplified manner.

  The smartphone 700 uses the electronic device 500 as a timing device such as a reference clock oscillation source, for example. The smartphone 700 can further include a display unit (such as a liquid crystal display or an organic EL display) 701, an operation unit 702, and a sound output unit 703 (such as a microphone). The smartphone 700 may also use the display unit 701 as an operation unit by providing a contact detection mechanism for the display unit 701.

  According to the smartphone 700, it is possible to have the resonator element 10 that can reduce the CI value while reducing the size.

  Note that, as described above, an electronic device typified by the smartphone (form phone) 700 includes an oscillation circuit that drives the resonator element 10 and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the resonator element 10. It is preferable to provide.

  According to this, since the electronic device represented by the smartphone 700 includes the oscillation circuit that drives the vibration piece 10 and the temperature compensation circuit that corrects the frequency variation caused by the temperature change of the vibration piece 10, the oscillation circuit Therefore, it is possible to provide temperature compensation for the resonance frequency at which oscillation occurs and to provide an electronic device having excellent temperature characteristics.

  The electronic device provided with the resonator element according to the invention is not limited to the above smartphone, but an electronic book, a personal computer, a television, a digital still camera, a video camera, a video recorder, a navigation device, a pager, an electronic notebook, a calculator, a word processor, a work It can be suitably used as a timing device such as a station, a videophone, a POS terminal, or a device equipped with a touch panel.

  The above-described embodiments and modifications are merely examples, and the present invention is not limited to these. For example, it is possible to appropriately combine each embodiment and each modification.

  The present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same objects and effects). In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 2 ... AT cut quartz substrate, 10 ... Vibrating piece, 12 ... Substrate, 12a ... Vibrating part, 12b ... Outer edge part, 13a ... 1st main surface, 13b ... 2nd main surface, 18 ... Fixed part, 19 ... Joining area | region, 20a, 20b ... excitation electrode, 22 ... connection electrode, 24 ... mount electrode, 30 ... bonding agent, 32 ... contact surface, 40 ... mounting substrate (package base), 40a ... first surface, 40b ... second surface, 42 ... 1st terminal, 44a, 44b ... 2nd terminal, 46 ... 3rd terminal, 48 ... recessed part, 49 ... recessed part, 50 ... lid, 52 ... collar part, 54 ... space, 55 ... package, 60 ... joining member, 70 ... Electronic element, 72 ... Bump, 74 ... Wire, 100,200 ... Vibrating element, 300,400 ... Vibrator, 500,600 ... Electronic device, 700 ... Smartphone, 701 ... Display part, 702 ... Operating part, 703 ... Sound output Part

Claims (8)

A vibration part that vibrates due to thickness-slip vibration;
An outer edge portion disposed along the outer edge of the vibrating portion and having a thickness smaller than the thickness of the vibrating portion;
A bonding region provided on the outer edge and bonded with a bonding agent for fixing to the mounting substrate;
Comprising a substrate including
When the length along the direction of vibration of the thickness shear vibration of the substrate is x, the thickness of the vibration part is t, and the distance between the vibration part and the bonding region is y,
Y is
−0.0139 × (x / t) + 0.3169 ≦ y ≦ −0.0113 × (x / t) +0.3169
Vibrating piece in the range of. In claim 1,
When the difference between the thickness of the vibrating portion and the thickness of the outer edge portion is Md, and the percentage of the ratio of Md to the t is z,
−5 ≦ z + 1.32 × (x / t) −42.87 (%)
Vibrating piece that satisfies the relationship. In claim 2,
−5 ≦ z + 1.32 × (x / t) −42.87 ≦ 5 (%)
Vibrating piece that satisfies the relationship. In any one of Claims 1 thru | or 3,
The resonator element, wherein a side ratio (x / t) of the x to the t is 30 or less. In any one of Claims 1 thru | or 4,
The substrate is a vibrating piece, which is a rotating Y-cut substrate. The resonator element according to any one of claims 1 to 5,
A package for housing the resonator element;
Including a vibrator. The resonator element according to any one of claims 1 to 5,
An electronic element;
Including electronic devices.   An electronic device comprising the resonator element according to claim 1.

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