JP2016171079A - Electrical connection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the drawback of the prior art.SOLUTION: In an electrical connection device between a control apparatus, specifically a motor control apparatus and/or a transmission control apparatus, and a base plate including a plurality of conductors, the control apparatus has a plurality of interface pads comprising a thermoplastic conductive plastic, each of the interface pads is welded to the conductors of the base plate in order to form an electrical connection, and the conductors comprise a conductive plastic.SELECTED DRAWING: Figure 1

Description

  Electronic system components in automobiles are becoming increasingly important. Especially in electronic system components, under severe environmental conditions in automobiles, reliable electrical connection between external electrical connections to sensors, actuators, plug-in connections etc. (eg mechatronic modules for transmission controllers) and electronic control equipment. It is extremely difficult to ensure an electrical contact connection. Currently, the electrical connection between the circuit carrier contained in the control device and the external connection “AVT” (Aeussere Verbindungstechnik) is often made by bonding wires. The bonding wire electrically connects the connection point of the circuit carrier and the connection pin fitted in the control device housing. This ensures a hermetic seal of the control device from harmful environmental influences. This environmental impact is for example chemically aggressive media, moisture, temperature fluctuations and external mechanical acceleration or deceleration. The circuit carrier is, for example, a multilayer conductor plate or a so-called “LTCC” (“Low-Temperature-Cofired-Ceramic”)-hybrid in which an electronic circuit is formed.

  Further, it is known that a circuit carrier is directly connected to a line carrier, in particular, a flexible flat conductor circuit (so-called “FPC”, Flexible Printed Circuit) by a bonding wire.

  From WO 98/44593 an electrical connection between a flexible conductor carrier and a circuit carrier is known. Here, the electrical contact connection is performed using a conductive adhesive in the overlap region. The disadvantage here is that the adhesive has to be deposited in the overlap area in a precisely metered amount and in a reproducible position. DE 198332062A1 discloses a control device for an automobile. In this document, the contact connection element of the circuit carrier is conductively connected to the flexible wire carrier via a laser welding location or a laser soldering location in the contact connection section. By providing the laser welding point or the laser soldering point, high heat is input into the contact connection region. Therefore, if a laser soldering process is performed, additional auxiliary substances in the form of soldering means must be added.

WO98 / 44593 DE19832062A1

  The object of the present invention is to remedy the drawbacks of the prior art as described above.

  Electrical connection device between a control device, in particular a motor control device and / or a transmission control device, and a flexible line carrier wire, in particular a multi-core flat conductor track wire, or a base plate with multiple conductors Disclose.

  In the present invention, the control device has a number of interface pads. These interface pads are made of a thermoplastic conductive plastic. Here, these interface pads are respectively melted by heat with the conductive pads of the conductor and / or the conductors of the base plate, respectively, to form an electrical connection. Here, the conductive pad and the conductor are made of conductive plastic.

  An interface pad made of thermoplastic conductive plastic is provided on the control device, and a correspondingly designed conductive pad (Leiterballen) is provided in the area of the flexible conductor Or by providing a conductor made of conductive plastic in the region of the base plate in the region of the base plate, so that the electrical contact can be made simply by thermally melting the interface pad and the conductive pad without using auxiliary substances. A connection can be formed. Here, the melting temperature of the thermoplastic conductive plastic used is relatively low.

  Unlike soldering and welding, the heat input into the contact area and thus the contacting components is minimized. This is because the temperature required to melt the thermoplastic conductive plastic is typically lower than 250 ° C to 400 ° C. This effect is further enhanced by the following. That is, during the contact connection process, the interface pads and conductive pads to be conductively connected are enhanced not by being completely melted but by melting only in a small connection area.

  Since no metallic auxiliary substances are required, no harmful electrochemical components that generate noise voltages are also present in the connection area. The formation of unwanted “whiskers” or needle crystals at the soldering locations, metal splashes during welding and soldering, and known corrosion problems during bonding connections are avoided. Furthermore, the conductive plastic ensures a large contact interface with reduced migration resistance. This resistance, if necessary, is precisely matched to the current intensity to be transmitted at that time.

  The conductive plastic is formed by particles having sufficient electrical conductivity. The particles are uniformly distributed and embedded in a matrix or base material made of a suitable thermoplastic material. For the matrix formation, all known thermoplastics with sufficient mechanical and thermal resistance can be used.

  For example, metal particles and / or suitable conductive nanoparticles such as carbon nanotubes can be used as the conductive particles. In order to improve the mechanical adhesion of conductive plastics when manufacturing contact pads on metal substrates, especially metal pins, flat pins, connection terminal pins, metal strips, flexible conductors etc. An appropriate mechanical, chemical and / or physical surface treatment in the form of the treatment can be applied to the metal substrate.

  Each of the interface pads and conductors in the base plate has an advantageous circular or rectangular geometry. This provides the lowest possible electrical transition resistance over a sufficiently large transition area.

  The control device typically has a housing that houses at least one circuit carrier. Here, a large number of electronic and / or electromagnetic components and / or mechanical components are fixed on the circuit carrier and are electrically connected to each other. The control equipment is, for example, a transmission control unit or a motor control unit, the so-called “TCM” / “MCU” (Transmission Control Unit or Motor Control Unit), which often has a severe ambient environment, ie particularly high temperature fluctuations, Used under humidity and chemically aggressive media. The circuit carrier is constituted, for example, by an epoxy resin plate with printed copper conductors or as LTCC (Low-Temperature-Cofired-Ceramic or Low-temperature co-fired ceramics). In addition, the control device can have a base plate which is advantageously arranged on the underside for mechanical reinforcement. This base plate is simultaneously used as a heat sink.

  In order to realize the function of the control device, the control device must be electrically connected to a number of actuators and sensors. Such a connection is made, for example, via a known flat conductor path. In a flat conductor track, a large number of conducting copper lines or cores are preferably extended parallel and spaced apart and covered on both sides by insulating the upper and insulating the lower. In particular, the electrical connection device of the present invention is capable of forming an electrical connection between such a flexible flat conductor track and a control device easily, inexpensively and reliably in terms of manufacturing technology. to enable. Here, this electrical connection can also be completely hermetically sealed. Therefore, the harmful surrounding environment does not adversely affect the electrical contact connection.

  In addition, an electrical connection device between a control device having a metal connection without an interface pad and a base plate having a large number of conductors is disclosed.

  In the present invention, the control device has a large number of metal connections. These metal connections are melted by heat in the base plate conductors and / or conductive transitions, respectively, to achieve an electrical connection. Here, the conductor is made of a conductive plastic.

  In one embodiment, the control device has, for example, a round pin-shaped metal connection. It has no interface pad and is melted directly into a parallelepiped conductive transition or conductor guide made of conductive plastic to form an electrical connection.

  The invention is explained in more detail below on the basis of the drawings.

Electrical connection device according to the invention between a flexible flat conductor track (FPC) and a (transmission) control unit (TCU) One embodiment of a connection device between a flat conductor track in a control device and a circuit carrier Detailed view of the connecting device shown in FIG. Another embodiment of the connecting device between the control device and the base plate carrying the control device FIG. 4 is a schematic plan view of the connecting device shown in FIG. Another embodiment of the electrical connection device Embodiment of connecting device with additional insulating flat conductor track Schematic plan view of the connection device shown in FIG. The connection device shown in FIG. 7 in a contact-connected state Another embodiment of an electrical connection device having a control device with a metal connection without an interface pad Schematic side view of the connection device shown in FIG. 10 without contact connection Schematic partial cross-sectional view of the connection device shown in FIG. 10 in an electrically connected state with an optional cover part Another embodiment of a connection device having a control device with a metal connection without an interface pad Another embodiment of a connection device for a control device, comprising a metal connection Another embodiment of a connection device with an interface pad incorporated in a control device

  FIG. 1 shows a first embodiment of the electrical connection device of the present invention for electrically connecting a flexible flat conductor path (FPC) to a control device (TCU).

  The control device 10 is conductively connected to a known flexible flat conductor path 12. The flexible flat conductor path 12 has a conductor 14 (made of copper) inside. Both sides of this conductor are covered with an upper plastic film 16 and a lower plastic film 18 for electrical insulation. These plastic films 16 and 18 are made of a plastic material having a high electrical insulating property, such as a polyimide material or a polyester material. These materials have a thickness between 25 μm and 250 μm. The plastic films 16 and 18 are bonded to the conductor 14 on the entire surface by an adhesive layer (not shown) made of an acrylic adhesive or an epoxide adhesive. The conducting wire 14 represents a large number of copper conducting wires each having a material thickness of 30 μm to 300 μm. These copper conductors are advantageously arranged equidistantly in parallel to the conductor 14 and are not shown here for the sake of clarity.

  In the connection area 20, the lower plastic film 18 is not provided or has been removed. A conductive pad 22 is disposed in the connection region 20 and is formed of a suitable conductive thermoplastic material or conductive plastic in the present invention. A conductive connection is formed between the conductor 14 and the conductive pad 22. An interface pad 24 is disposed on the control device 10, and the interface pad 24 is similarly conductively connected to electronic components and / or electromechanical components (not shown) included in the control device 10. ing. Each of the conductive pad 22 and the interface pad 24 has a cross-sectional shape that approximates a circle or an ellipse. Alternatively, the conductive pad 22 and the interface pad 24 may have a parallelepiped shape, or a space shape such as a cube shape or a sphere cut shape.

In order to form a conductive connection between the flat conductor track 12 and the control device 10, the conductive pad 22 is shielded in the melting zone 26 and then thermally fused with the interface pad 24. For this purpose, relatively little heat input is required. This is because the thermoplastic conductive plastic used is usually sufficiently soft at a temperature of 300 ° C., and neither the conductive pad 22 nor the interface pad 24 is completely melted. These pads are melted by, for example, an infrared beam and / or a laser beam supplied in the form of dots. For this purpose, the beam is focused and / or masked by a cover. Alternatively, a hot air supply along a point or a light guide that supplies a laser beam can be used. Further heat input, can also be carried out by the heating member, or by the so-called Thermoden ^(R) method which is similar to the soldering process. In this case, unlike the laser welding method or laser soldering method which forms a point-like contact connection, the electrical connection zone between the conductive plastic pads is planar, in particular circular or rectangular on the entire surface. Configured. This reduces the electrical transfer resistance. Furthermore, the flat extension of the connection zone can be flexibly adjusted to a predetermined current intensity. The conductive pads 22 and the interface pads 24 are preferably made of the same conductive plastic. As an alternative, it is also possible to use thermoplastics of different conductivity.

  In order to make the control device 10 completely conductively connected to the flat conductor track 12, a number of interface pads are melted or welded to the corresponding conductive pads. Besides the fact that the heat input is reduced, an important advantage of the connection device according to the invention is that the pad can already be constructed on the manufacturer side with a flat conductor track or control device. Thus, it is no longer necessary to use auxiliary substances in the original contact connection process.

  FIG. 2 shows one form of the connection device between the flexible flat conductor track and the circuit carrier in the control device. Here, unlike FIG. 1, an electrical connection is formed between the flat conductor track 12 and the control device 10 in the housing. The control device 10 includes in particular a housing 28 in which the circuit carrier 30 is arranged. A number of electronic and / or electromechanical components, not shown in detail, are provided on the circuit carrier 30. This includes, for example, a microcontroller, a memory, a plurality of separate transistors, diodes, resistors, capacitors, coils, relays, plug connections, etc., which constitute a circuit. Furthermore, the housing 28 has a lead-in portion 32 for the flat conductor path 12. In order to further improve the sealing action and to achieve a hermetic sealed connection of the circuit carrier 30, the housing 28 is additionally in this embodiment an electrically insulating filling compound 34 (so-called so-called plastic material). It is completely filled by “mold compound”). The circuit carrier 30 is constituted by, for example, a conventional epoxy resin plate. It has a number of surfaces with copper conductors and / or LTCC hybrid modules. In order to form an electrical contact connection between the flat conductor track 12 and the control device 10, the conductive pad 22 is melted in the interface pad 24 and the melting zone 26. The embodiment according to FIG. 2 has the advantage that, unlike the configuration shown in FIG. 1, the circuit carrier 30 can be hermetically sealed and encapsulated. Thus, the circuit carrier 30 is completely protected from the harmful surrounding environment described above, including the electrical connection to the flat conductor track 12.

  FIG. 3 shows a detailed partial view of the connecting device shown in FIG.

  The interface pad 24 is incorporated in the circuit carrier 30 and is conductively connected to the electronic components present on the circuit carrier 30 via connection lines 36. The connection line 36 is made of a metal material, such as a copper alloy, and / or a conductive plastic. Here, the conductive plastic is also used for the conductive pad 22 or the interface pad 24. Alternatively, the interface pad 24 can be injection-molded integrally with the connecting line 36 made of a conductive plastic, or the interface pad 24 can be formed by combining the printing of the conductive wire 36 and the filling of the cavity. .

  In order to form a conductive connection between the flat conductor track 12 and the circuit carrier 30 or electronic and / or electromechanical components mounted on the circuit carrier 30, the conductive pads 22 and the interface pads 24 are electrically conductive. Heated to a range of plastic melting temperature. The conductive pad 22 is then pressed against the interface pad 24 in the direction of the white arrow. As a result, the conductive pad and the interface pad are melted or bonded by heat in the region of the melting zone. At the same time, a mechanically sufficiently resistant connection is formed between the conductive pad 22 and the interface pad 24. The device is then placed in the housing 28 and the housing is sealed with a filling compound.

  4 and 5 which are referred to simultaneously in the subsequent specification show another embodiment of the electrical connection device of the present invention. Here, an electrical connection is formed between the control device and the base plate carrying the control device. The control device 10 is fixed, for example, bonded on the base plate 38. In the base plate, for example, two conductive channel-like conductors 40 and 42 are placed. They are likewise formed by a conductive plastic that is also used for the conductive pads and interface pads. The base plate 38 is made of a nonconductive insulating material. The conductors 40 and 42 are formed by grooves carved in the base plate 38, for example. The conductive plastic is then injected into this groove. The control device 10 has two interface pads 44 and 46, which are made of conductive plastic. The electrical contact connection between the control device 10 and the base plate 38 is made simply by thermally melting the interface pads 44, 46 and the conductors 40, 42. This is done during or after fixing the control device 10 on the base plate 26. Under the interface pads 44 and 46, there is optionally provided a notch 48 in the base plate 38, each indicated by a broken line. This notch is used to concentrate heat energy or heat necessary for melting the interface pads 44 and 46 and the conductors 40 and 42. The notches 48 underneath the interface pad, as well as all notches not shown, are preferably constituted by conical holes. The conductors 40, 42 can be similarly conductively connected to a flexible flat conductor track (not shown here).

  FIG. 6 illustrates another embodiment of an electrical connection device having a control device with an alternative housing shape.

  Here, the control device 50 includes a substantially pan-shaped housing 52 opened downward. The housing 52 includes a circuit carrier 54 incorporated in the housing. Arranged on the circuit carrier 54 are a large number of electronic components not marked with reference numerals forming a circuit. The control device 50 is fixed on a base plate 56, and an electrical conductor 58 formed of conductive plastic extends on the base plate 56. Again, the electrical connection between the control device 50 and the conductor 58 is performed by simply thermally melting the interface pad 60 with the conductor 58 to form a melting zone 62. The heat of fusion can be supplied to the melting zone 62 as desired by the notch 64 provided on the lower side of the base plate 56.

  Unlike the housing shape shown so far, the housing 52 has a cross-sectional shape that approximates a trapezoidal shape and includes a flange that surrounds a periphery that is not provided with reference numerals. The flange is fixedly connected, for example, bonded to the base plate 56 or the conductor 58. Alternatively, an elastic gasket can be provided between the flange and the base plate 56 or conductor 58. In this case, the housing 52 is fastened to the base plate 56 by suitable mechanical means such as, for example, screw or clamp connections. In order to hermetically seal the control device 50, the housing 52 is additionally filled with an insulating filling compound 66 made of plastic material, or the circuit carrier 54 is completely injected by means of the filling compound 66 by injection molding. Besieged. The housing 52 can be formed of any suitable metal material and / or optionally a fiber reinforced plastic material.

  7-9, which are referred to simultaneously in the following specification, illustrate another embodiment of an electrical connection device. Here, unlike FIG. 1, an additional insulating portion is provided in the interface pad and the conductive pad.

  The conductive pad 22 of the flat conductor path 12 is oriented so that a complete cover portion is formed ideally so that heat melting is performed as much as possible in the horizontal direction with respect to the interface pad of the control device 10. Has been. The electrical contact resistance becomes as small as possible due to thermal melting on the entire surface. In the welding process, the plasticized conductive pad 22 is pressed in the direction of the white arrow against the fully softened interface pad 24, with the conductive plastic alternating slightly in the region of the melting zone 26. Mix. A connection line 36 further extends inside the control device 10. The connection line 36 is used to electrically connect electronic components or circuit carriers not shown here. Unlike the embodiment based on FIGS. 1-3, both the conductive pad 22 and the interface pad 24 are completely surrounded by insulating layers 68, 70 that are highly electrically insulating and substantially non-conductive. The insulating layers 68 and 70 can be formed of thermoplastic and / or thermosetting plastic.

  As can be seen from FIG. 8, the insulating layers 68 and 70 are for the electrical contact connection points 74 and 76 formed by the hot melt or hot welded interface pad 22 and the conductive pad 24 (the original electrical contact after the melt process). The electrical insulation between the interface pad and the conductive pads 22 and 24 is improved. This is particularly advantageous when it is desired to electrically connect a multi-conductor flat conductor path with a small contact interval to the control device 10. Furthermore, the insulating layers 68, 70 improve the mechanical resistance of the contact connection points 72-76, while at the same time intruding contaminant particles and / or chemically aggressive fluids in the boundary region of the electrical contact connection points 72-76. To prevent.

  In FIG. 9, the conductive pad 22 is welded to the interface pad 24 in the region of the melting zone 26 to form an electrical connection and a mechanical connection between the flat conductor track 12 and the control device 10. The conductive pad 22 is melted with the interface pad 24, and the upper insulating layer 68 is melted with the lower insulating layer 70.

  FIGS. 10-12, which are referred to simultaneously in the subsequent specification, illustrate another embodiment of an electrical connection device comprising a control device provided with a number of metal connections.

  The control device 90 has a large number of linear metal connection portions, and one of these metal connection portions is given a reference numeral 92 as a representative of all the remaining metal connection portions. The metal connection portion 92 is conductively connected to electronic components and / or electromechanical components in the control device 90. A large number of conducting wires extending at equal intervals in parallel to each other are embedded in the flat conductor path 12. The lead wire 14 at the foremost side is conductively connected to the metal connection portion 92. The remaining metal connections are also connected to the conductors of the flat conductor track 12 correspondingly. In this embodiment, the metal connection portion or flat pin of the control device 90 has a cross-sectional shape that approximates a rectangle.

  FIG. 11 is a schematic partial cross-sectional view of the connection device of FIG. 10 in a state where no contact connection is made. The copper wire 14 is covered on both sides by upper and lower plastic films 16 and 18. In the connection area 20, a conductive pad 22 made of conductive plastic is located. On the lower side of the metal connection portion 92, an interface pad 94 similarly formed of conductive plastic is located. Basically, in order to improve the adhesion of the conductive plastic, it is necessary to subject the metal connection 92 to an appropriate mechanical, chemical and / or physical pretreatment such as plasma radiation treatment. is there. Alternatively, the metal connection 92 can be mechanically roughened and / or chemically cleaned with a suitable solvent.

  In order to further improve the adhesion of the interface pad 94 to the metal connection 92, a hole 96 can be provided in the metal connection, which is preferably completely penetrated by conductive plastic. ing. Alternatively, it is possible to provide conductive plastic on both sides of the metal connection portion 92 as indicated by a broken line, and as a result, an interface pad 98 having a cross-sectional shape approximate to an ellipse is formed. Is done. After sufficient heating of the conductive pads 22 and interface pads 94-98, they are pressed together in the direction of the white arrow to form a melt, and thus an electrical contact connection, between the conductor 14 and the metal connection 92.

  In FIG. 12, the conductive pad 22 is melted by heat with the interface pad 94, whereby the flat conductor path 12 is conductively connected to the control device 90. In order to hermetically seal this electrical connection between the control device 90 and the flat conductor track 12, the surrounding lid 100 with two lateral flange portions 102, 104 that are vertically offset from each other. Is provided. The lid 100 can be formed of a metal material and / or a thermoplastic or thermosetting plastic material. The flange portions 102 and 104 are connected to the upper side of the flat conductor path 12 and the upper side of the control device by an adhesive layer 106. Alternatively, a screw connection and / or a clamp connection can be implemented to fix the position of the lid 100. Between the right flange portion 104 and the metal connection 92, an elastic sealing means 108 having another cross-sectional shape different from a circle is arranged, for example in the form of an O-shaped ring or a ring gasket. The lower sealing is performed by a flat carrier plate 110. The carrier plate 110 is bonded to the flat conductor path 12 and the lower side of the control device by an adhesive layer 106. The carrier plate 110 can be made of a metal material and serves not only as a pure sealing function but also as a heat sink for cooling the electronic and / or electromechanical components contained in the control device 90. Further, if necessary, electrical insulation for sealing is provided in a hollow space between the lid portion 100 and the metal connection portion 92 and between the metal connection portion 92 and the carrier plate 110 without reference numerals. It is possible to accommodate a functional filling compound. The size, in particular the height, of the sealing means 108 is such that the metal end 92 presses the flat conductor track 12 with a certain force so that the sealing means is under some mechanical preload after the lid 100 is installed. To be selected. At this time, the carrier plate 110 functions as a correspondence receiver. With this configuration, an electrical contact connection between the flat conductor path 12 and the control device 90 is ensured, and the mechanical resistance of the connection is further optimized. Furthermore, sealing against harmful environmental effects is guaranteed.

  FIG. 13 shows another embodiment of a connection device having a control device with a metal connection without an interface pad.

  Unlike the embodiments described so far, the control device 120 may use a downwardly angled metal connection 122 or a round pin having a cross-sectional shape approximating a circle. This metal connection or round pin is not provided with an interface pad (“does not have an interface pad”). In order to form an electrical connection between the metal connection 122 and the conductor 124 in the base plate 126, the conductor 124 formed by a thermoplastic conductive plastic is sufficiently plasticized by the supply of heat so that the metal connection 122 is pressed into this conductor 124, melted, and thereby electrically contacted and fixed in position.

  In the base plate 126 formed of an insulating material, the conductor 124 is realized, for example, by milling grooves and / or other recesses. The grooves and / or recesses are supplied with conductive plastic in such an amount that the conductor 124 is advantageously flush with the upper side of the base plate 126 that is not labeled.

  In order to further optimize the electrical insulation action of the control device 120 on adjacent metal connections and to further optimize the resistance to adverse environmental effects, the metal connection 122 is provided with a suitable insulating thermoplastic. A hollow cylindrical insulating sleeve 128 formed of a plastic material can be provided. For complete electrical contact connection of the control device 120, the base plate 126 basically incorporates a number of conductors 124. To further improve the resistance to harmful media, the entire device can be further coated with a filling compound (“mold compound”).

  FIG. 14 illustrates another embodiment of the connection device.

  Unlike the embodiment according to FIG. 13, a conductor 130 formed of a conductive plastic and having a cross section approximating a rectangle extends on the surface of the base plate 126, which is not labeled, and is connected to the control device 120. Has a straight metal connection 132 or a round or flat pin. The conductor 130 can be manufactured, for example, by injecting a conductive plastic onto the base plate 126 by an extrusion nozzle.

  Here, a notch 134 is further provided in the base plate 126 configured to be electrically insulating. The depth of the notch 134 without a reference sign corresponds to the structural height of the control device 120 without a reference sign. On the edge side of the notch 134 is located at least one conductive transition 136, which is similar in shape to a rectangular parallelepiped and is also made of conductive plastic. Basically, a large number of conductive transitions are required, but one or more conductive transitions 136 inject, for example, plasticized conductive plastic using an extrusion nozzle of a corresponding structure. Or by adhering a pre-manufactured conductive transition. In this case, the number of rectangular parallelepiped conductive transitions 136 to be provided corresponds to the number of electrical transition contacts (Uebergangskontakt) to be obtained between the conductor 130 and the metal connection 132 of the control device 120. Each of the plurality of conductive transitions 136 in this case extends perpendicularly to the drawing plane and in parallel with each other.

  The substantially rectangular parallelepiped conductive transition portion 136 has a rectangular cross-sectional shape, and the height of the conductive transition portion 136 substantially corresponds to the structural height of the control device 120. In order to form an electrical connection between the conductor 130 and the metal connection 132, the metal connection 132 and the housing portion on the edge side of the control device 120 are contained in a conductive transition 136 that has been softened by sufficient heating. At the same time, the conductive transition 136 is melted with the conductor 130 by heat in the region of the melting zone 138.

  In order to ensure sufficient electrical insulation of the metal connection part 132 and the conductive transition part 136, the conductive transition parts 136 are basically insulated transitions arranged between the conductive transition part and the conductive transition part. It is necessary to separate from each other by the part. These insulating transitions are not shown in FIG. 14, but are likewise preferably rectangular parallelepiped. The above described structure in which the conductive transitions and the insulating transitions are alternately arranged in series is similar to the structure of conductive rubber for contact connection of LCD displays. In particular, the control device 120 can be glued to the base plate 126 as required in order to optimize the mechanical resistance. The embodiments described so far ensure a hermetic complete hermetic seal of the electrical connection between the conductor 130, the control device 120 and the base plate 126, and prevent the electrical connection or contact from having a harmful environmental impact. Can be made sufficiently independent. The base plate 126 is covered with a metallic material on the underside, i.e. outside the region of the conductor 130 and the conductive transition 136, to improve heat removal.

  FIG. 15 illustrates another embodiment of the electrical connection device.

  Unlike the embodiment according to FIGS. 13, 14, the control device 140 has at least one interface pad 142 arranged directly in or in contact with a housing not labeled. The interface pad 142 is conductively connected to electronic and / or mechanical components included in the control device 140. In the connection region 20, the upper and lower plastic films 16, 18 are removed from the flat conductor path 12. That is, the flat conductor path is completely insulated and removed in this connection region, and the conductive (copper) conductor 14 is exposed. The conductive wire 14 is covered on all sides with a conductive pad 144 made of conductive plastic. The conductive pad 144 has a shape similar to a pan shape or a cap shape, and is connected to the remaining plastic films 16 and 18, thus preventing foreign matter and / or fluid from entering the region. The The conductive pad 144 can be easily manufactured in a corresponding shape by, for example, immersing the conductive wire 14. The conductive wire 14 is at least partially filled with a sufficiently soft or plasticized conductive plastic. Therefore, an electrical contact connection exists between the conductive pad 144 and the conductive wire 14.

  To form an electrical connection between the flat conductor track 12 and the control device 140, the interface pad 142 and the conductive pad 144 are sufficiently plasticized by heating and pressed together with a small pressure in the region of the melting zone 146, Melted. The electrical connection thus formed between the flat conductor track 12 and the control device is hermetically encapsulated from the beginning and is therefore completely protected from harmful environmental influences.

  With this embodiment, the electrical connection between the control device 140 and the flat conductor path 12 is very space-saving and can be handled easily and reliably in terms of manufacturing technology, and can be multi-core as required. Can be configured.

Claims (9)

In an electrical connection device between a control device (10, 50, 90, 140) and a base plate (38, 56, 126) with a number of conductors (40, 42, 58),
The control device (10, 50, 90, 140) has a large number of interface pads (24, 44, 46, 60, 94, 98, 142) made of thermoplastic conductive plastic,
The interface pads (24, 44, 46, 60, 94, 98, 142) are respectively welded to the conductors (40, 42, 58) of the base plate (38, 56) to form an electrical connection. And
The conductor (40, 42, 58) is made of conductive plastic,
An electrical connection device characterized by the above. The conductive plastic is a thermoplastic material mixed with conductive particles.
The electrical connection device according to claim 1. The conductive particles are metal particles and / or conductive nanoparticles.
The electrical connection device according to claim 2. The control device (10, 50, 90, 140) has a housing (28, 52) that houses at least one circuit carrier (30, 54);
The circuit carrier (30, 54) has a number of electronic and / or electromechanical components for forming a circuit,
The electrical connection device according to any one of claims 1 to 3, wherein The interface pads (24, 44, 46, 60, 94, 98, 142) are arranged on the housing (28, 52) and / or the circuit carrier (30, 54) and / or the metal connection (92). Each electrically conductively connected to at least one component of the circuit carrier (30, 54),
The electrical connection device according to any one of claims 1 to 4, wherein the electrical connection device is provided. The metal connection (92) is electrically connected to the components of the circuit carrier (30, 54);
The electrical connection device according to any one of claims 1 to 5, wherein At least one conductor (40, 42, 58) is formed by a channel provided in the base plate (38, 56);
The channel is at least partially filled with conductive plastic;
The base plate (38, 56) is made of an electrically insulating material,
The electrical connection device according to claim 1, wherein the electrical connection device is a device. At least one conductor (40, 42, 58) is formed by a conductive plastic provided on the base plate;
The base plate (38, 56) is made of an electrically insulating material.
The electrical connection device according to claim 1, wherein the electrical connection device is a device. The control device (10, 50, 90, 140) is a motor control device and / or a transmission control device.
The electrical connection device according to claim 1, wherein the electrical connection device is a device.

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