JP2016164987A - Device and method for soldering using electric power and exhaust gas at power generation - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a soldering device enabling achieving a high temperature environment and a satisfactory inert gas atmosphere necessary for soldering, with the suppression of device running cost.SOLUTION: The soldering device includes: a power generation part which generates power using a supplied fuel and a gas which includes oxygen, and emits an exhaust gas; an inert gas supply part which supplies, as an inert gas, at least a part of the exhaust gas to the surrounding of a heating object; and a heater part which generates heat with the power, including power supplied from the power generation part, and heats the exhaust gas supplied to the surrounding of the heating object so as to heat the heating object at least through the exhaust gas. Thus, a satisfactory inert gas atmosphere and a high temperature environment necessary for soldering can be achieved using the power and the exhaust gas from the power generation part to which the fuel is supplied.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a soldering technique for electrically connecting an electronic component to a wiring on a wiring board.

  Conventionally, soldering technology in a mass production process is roughly divided into a flow method and a reflow method. Among them, the reflow method has become the mainstream of soldering technology with the recent progress of surface mount technology. This method enables high-density mounting using surface-mount type electronic components.

  As this reflow type soldering apparatus, for example, in Patent Document 1, a wiring board on which electronic components are mounted is transported into a heating furnace by a conveyor, and solder cream is applied on the wiring board to be soldered. A reflow soldering apparatus to perform is disclosed. In this device, nitrogen gas is supplied into the heating furnace so that the cream solder is not heated and melted by the heater in the furnace and then is oxidized and deteriorates in quality (especially wettability). Is done. At that time, the oxygen concentration in the furnace is maintained at a desired value by automatically adjusting the oxygen concentration of the nitrogen gas.

  Patent Document 2 discloses a technique for heating cream solder (wiring board) using a radiant tube heater instead of an electric heater. In the present technology, by adopting such a heating method, power consumption in the reflow soldering apparatus is suppressed, and a running cost is reduced.

  Furthermore, in the technique of Patent Document 2, exhaust gas discharged from a radiant tube heater is used as the gas supplied into the furnace instead of nitrogen gas. This eliminates the need for using expensive nitrogen gas and reduces the running cost. Furthermore, instead of the nitrogen gas used just before the cream solder is cured due to cost constraints, the exhaust gas is supplied also when the cream solder is heated. Thereby, the quality improvement of cream solder is aimed at.

  Patent Document 3 discloses a reflow device that performs preheating or solder melting in a state in which combustion gas is burned to dilute oxygen in the furnace. In this apparatus, a cooling catalyst or cooling water is passed through a tubular trap to remove moisture in the furnace that has condensed on the outside of the trap. Thereby, the quality improvement of cream solder is aimed at. Furthermore, Patent Document 3 discloses a technique for reducing the oxygen concentration in the furnace by burning powders or thread-like cuts of easily oxidizable metal such as magnesium.

  Patent Document 4 discloses a technique in which air in a reflow soldering apparatus is sucked into a combustion apparatus to burn a combustible gas, and exhaust gas after the combustion is recirculated to the reflow soldering apparatus to fill the apparatus. It is disclosed. Thereby, after reducing the oxygen concentration in the apparatus without using expensive nitrogen gas or the like, the wiring board on which the electronic component is mounted is heated and soldered.

JP 2005-246476 A Japanese Patent Laid-Open No. 2008-42070 JP-A-5-50285 Japanese Patent Laid-Open No. 5-161962

  However, even with the prior art as described above, it is very difficult to sufficiently suppress the running cost of the soldering apparatus while ensuring a sufficiently good quality of solder (wetting property, etc.). It was.

  In fact, most of the energy consumption in the reflow soldering apparatus is the power consumption in the electric heater in the heating furnace. For example, when lead-free solder is used as the solder component of cream solder, the wiring board must be heated to about 240 ° C., for example. As a result, the power consumption of the device reaches, for example, 30-50 kVA or more. Thus, an increase in the power consumption of the apparatus is very undesirable from the viewpoint of reducing the running cost and further considering environmental problems and power situations.

  Further, when nitrogen gas is used as the inert gas supplied into the furnace, an expensive nitrogen gas cylinder is required, and the running cost increases. In addition, it is possible to reduce the running cost by introducing a nitrogen generator, but a large initial investment is required.

  In order to solve these problems, in the technique of Patent Document 2, a radiant tube heater is used instead of an electric heater, and heating and supply of an inert gas are performed. However, this radiant tube heater itself consumes considerable power. Further, the exhaust gas discharged from the radiant tube heater contains water vapor in addition to nitrogen gas and carbon dioxide gas. No measures are taken in this document for the removal of water vapor.

  In the technique of Patent Document 3, too much electric power is consumed to generate and circulate hot air using a heater and a fan. In addition, power is consumed to flow the cooling catalyst or cooling water through the tubular trap. In addition, the amount of combustion gas that passes through without contacting the tubular trap is large, and moisture removal in the furnace is limited.

  In the technique of Patent Document 4, too much power is consumed for heat generation by the preheating heater and the soldering heater. Furthermore, since air in the reflow soldering apparatus is sucked into the combustion apparatus and then returned to the apparatus as exhaust gas, it is difficult to maintain a clean atmosphere during soldering. That is, a gas composed of a flux component generated when the cream solder is melted may fill the inside of the apparatus with the elapse of the apparatus operating time due to the reflux, and contaminate the atmosphere during soldering.

  In the wiring board manufacturing process using the reflow soldering apparatus, the occurrence of a large number of defective products at the time of power failure is also a big problem. That is, a reflow soldering apparatus that requires a considerably large external (commercial) power must be stopped in the event of a power failure. As a result, a large number of wiring boards in process are retained in the apparatus. In order to avoid this situation, it is necessary to install an uninterruptible power supply or the like, which requires a large initial investment. Such a problem is not solved by the prior art as described above.

  Moreover, although the problem in the reflow soldering apparatus has been described above, the same problem needs to be solved in the flow soldering apparatus that performs soldering using the flow method. That is, it is desired to further reduce the running cost of the apparatus while ensuring good solder quality.

  In particular, in the flow soldering apparatus, a great amount of electric power is consumed to maintain the entire solder in the solder bath in a molten state, but it is important how to suppress the running cost at that time. Another problem is how to preheat the solder surface coated with flux on the wiring board, and how to form an atmosphere for preventing solder oxidation after the solder is applied to the wiring board. Become.

  Therefore, an object of the present invention is to provide a soldering apparatus and a soldering method capable of realizing a high temperature environment and a good inert gas atmosphere necessary for soldering while suppressing the running cost of the apparatus.

According to the present invention, a soldering apparatus for soldering a soldering object to a heated object,
A power generation unit including a fuel cell that generates electric power using the supplied fuel and a gas containing oxygen and discharges exhaust gas;
An inert gas supply unit that supplies at least a part of the exhaust gas as an inert gas around the object to be heated;
A heater unit that generates heat by electric power including electric power supplied from a power generation unit, heats the exhaust gas supplied around the object to be heated, and heats the object to be heated through at least the exhaust gas A soldering apparatus is provided.

  In the soldering apparatus of the present invention, a good inert gas atmosphere and high temperature environment necessary for soldering are realized by the electric power and exhaust gas from the power generation unit supplied with fuel. As a result, the running cost of the apparatus can be suppressed.

  Moreover, as one embodiment of the soldering apparatus of the present invention, the apparatus preferably further includes a deoxygenation unit that removes or reduces oxygen content from the exhaust gas discharged from the fuel cell. It is also preferable to further include a dehydrogenation section that removes or reduces the hydrogen content from the exhaust gas discharged from the fuel cell. Furthermore, it is preferable to further include a combustion conversion section for burning the hydrogen content and the oxygen content of the exhaust gas discharged from the fuel cell. Furthermore, it is preferable to further include a dehumidifying unit that removes or reduces water vapor or moisture from the exhaust gas discharged from the fuel cell. Furthermore, the apparatus preferably further includes a reforming unit that takes in and reforms the hydrocarbon gas and generates fuel to be supplied to the power generation unit.

Furthermore, as another embodiment of the soldering apparatus of the present invention,
A transport unit for transporting the heated object;
An exhaust unit for exhausting the exhaust gas discharged from the inert gas supply unit, which is installed before and after the exhaust gas heating region within the transport range of the object to be heated by the transport unit; Is also preferable.

  Further, according to the soldering apparatus of the present invention, the heater unit is configured to heat the heated object to which the solder-containing material is attached and the soldered object is disposed through at least the exhaust gas. It is also preferable to melt the solder-containing material. In addition, the reflow soldering apparatus using a reflow system corresponds to this soldering apparatus.

Furthermore, as one embodiment of this reflow soldering apparatus, external power is supplied to the heater unit in addition to the power from the power generation unit.
A transport unit for transporting the heated object;
By heating the object to be heated at a temperature below a predetermined temperature that does not melt the attached solder-containing material at the time of a power outage of external power, the heating unit is driven by the exhaust gas by using the power from the power generation unit. And a control unit for evacuating outside,
It is also preferable that the control unit completes the soldering process by driving the heater unit and the transport unit using the electric power from the power generation unit with respect to the object to be heated at a temperature exceeding a predetermined temperature.

Moreover, according to the soldering apparatus of the present invention, a transport unit that transports the object to be heated,
A solder bath for maintaining the solder in a molten state with electric power including electric power supplied from the power generation unit;
The transport unit transports the heated object so that at least a part of the heated object is immersed in the molten solder in the solder bath and the molten solder is attached to the heated object. Is also preferable. Note that a flow soldering apparatus using a flow method corresponds to this soldering apparatus.

  Furthermore, the soldering apparatus of the present invention further includes an exhaust gas heating unit that heats the exhaust gas supplied to the periphery of the object to be heated using heat generated when power is generated by the power generation unit. Is also preferable. Thereby, the running cost of the apparatus can be further reduced.

According to the present invention, the soldering object is further disposed on the object to be heated,
While generating electric power with a fuel cell using fuel and a gas containing oxygen, exhaust gas is discharged from the fuel cell,
Heat is generated by the electric power including the generated electric power, and at least a part of the exhaust gas discharged is heated;
Supply the heated exhaust gas as an inert gas around the heated object where the soldering object is arranged,
A soldering method is provided in which the object to be heated is heated by the supplied exhaust gas.

  According to the soldering apparatus and the soldering method of the present invention, a high temperature environment and a good inert gas atmosphere necessary for soldering can be realized while suppressing the running cost of the apparatus.

It is the schematic for demonstrating the structure and effect | action of the reflow soldering apparatus by this invention. It is the schematic which shows one Embodiment of the reflow soldering apparatus by this invention. It is the schematic which shows other embodiment of the reflow soldering apparatus by this invention. 3 is a flowchart schematically showing an embodiment of a reflow soldering method according to the present invention. It is the schematic which shows one Embodiment of the response method at the time of a power failure in the soldering apparatus of this invention. It is the schematic for demonstrating the structure and effect | action of the flow soldering apparatus by this invention. It is the schematic which shows one Embodiment of the flow soldering apparatus by this invention. 1 is a flowchart schematically showing an embodiment of a flow soldering method according to the present invention.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated in detail, referring an accompanying drawing. In the drawings, the same elements are denoted by the same reference numerals. In addition, the dimensional ratios in the components in the drawings and between the components are arbitrary for easy viewing of the drawings.

(Reflow soldering equipment)
FIG. 1 is a schematic diagram for explaining the configuration and operation of a reflow soldering apparatus according to the present invention.

According to FIG. 1, the reflow soldering apparatus according to the present invention comprises a power generation unit (10, 20) and a soldering unit (11). The power generation unit (10, 20) is supplied from the supplied "fuel"
“Electric power”, “exhaust gas”, and “heat” are generated and supplied to the soldering unit (11).

  The power generation unit (10, 20) includes a power generation unit (100, 200) that generates power using “fuel” and a heat exchange unit (101, 201) that receives reaction heat generated from the power generation unit. . Here, “electric power” and “exhaust gas” are output from the power generation unit (100, 200), and “heat” is output from the heat exchange unit (101, 201).

  The soldering unit (11) includes an inert gas supply unit (110), an exhaust gas heating unit (111), and a heater unit (112). The exhaust gas heating section (111) heats the supplied “exhaust gas” using the supplied “heat”. The inert gas supply unit (110) supplies at least a part of the “exhaust gas” as an inert gas around the wiring board (30). The heater unit (112) receives the supplied “electric power”, generates heat, and further heats the “exhaust gas” released from the inert gas supply unit (110).

  On the wiring board (30) that is the object to be heated, cream solder (32) that is a solder-containing object is applied. Further, on the cream solder (32), an electronic component (31) that is an object to be soldered is disposed.

  The wiring board (30) is put into an inert gas atmosphere and a high temperature environment (inert gas / high temperature environment) formed by heated high-temperature “exhaust gas”. As a result, the applied cream solder (32) (and its solder content) melts and then hardens as the wiring board (30) leaves the high temperature environment. Thereby, the soldering process of the electronic component (31) with respect to the wiring board (30) is completed.

  Thus, a high temperature environment necessary for soldering is realized by “electric power” from the power generation unit (100, 200) supplied with “fuel”. Further, the “exhaust gas” discharged from the power generation unit (100, 200) is also at a considerably high temperature from the beginning, and is further increased by the “heat” output from the heat exchange unit (101, 201). Therefore, the amount of “electric power” required to heat the “exhaust gas” to a temperature required for soldering can be sufficiently suppressed. As a result, the running cost of the apparatus can be reduced.

  Further, “exhaust gas” is generated by a so-called combustion action, and most is an inactive component. By using this “exhaust gas” as an inert gas instead of expensive nitrogen gas, a great cost for maintaining the preparation and supply system in the nitrogen gas supply facility does not occur. As a result, the running cost of the apparatus can be further reduced.

  As described above, according to the present invention, a high-temperature environment necessary for soldering and a good inert gas atmosphere can be realized while suppressing the running cost of the apparatus.

  In this reflow soldering apparatus, it is possible not to provide "heat" without providing the heat exchange units (101, 201) and the exhaust gas heating unit (111). Even in this case, the above-described effect is achieved. However, although it depends on conditions such as the temperature of the heat exchange fluid (heat exchange medium) in the heat exchange section (101, 201), "heat" using the heat exchange section (101, 201) and the exhaust gas heating section (111). By effectively utilizing, the running cost of the apparatus can be further reduced.

  Further, the exhaust gas heating unit (111) is disposed outside the inert gas supply unit (110), and the “exhaust gas” discharged from the inert gas supply unit (110) is heated by the exhaust gas heating unit (111). It is also possible. Further, the heater unit (112) may be disposed inside the inert gas supply unit (110), and the “exhaust gas” in the inert gas supply unit (110) may be heated by the heater unit (112). Is possible.

  Furthermore, not only the power from the power generation units (10, 20) but also external (commercial) power can be supplied to the soldering unit (11), and the power supply can be widened.

  FIG. 2 is a schematic view showing an embodiment of the reflow soldering apparatus according to the present invention.

(Power generation unit 10: Internal combustion engine)
According to FIG. 2A, the reflow soldering apparatus 1 includes a power generation unit 10 and a soldering unit 11. Among these, the power generation unit 10 includes a power generation unit 100 and a heat exchange unit 101, generates electric power using the supplied fuel, and discharges exhaust gas. The power generation unit 100 includes an internal combustion engine 100a and a generator 100b. Among these, the internal combustion engine 100a may be a gas combustion engine that generates power by burning fuel such as city gas or hydrocarbon gas such as LPG (Liquefied Petroleum Gas), and uses fuel such as gasoline or light oil. It may be an engine that generates power by burning. Further, the generator 100b generates alternating current (or direct current) power by electromagnetic induction using the power transmitted from the internal combustion engine 100a. The generator 100b preferably further includes a control circuit unit that controls the generated power to a power in a form suitable for each part of the soldering unit 11.

  As the power generation unit 10, for example, a power generation unit of Eco Will (registered trademark) which is a gas cogeneration system can be used. Furthermore, for example, a cogeneration apparatus disclosed in Japanese Patent Application Laid-Open No. 2011-21562 or Japanese Patent Application Laid-Open No. 8-4586 can be used.

  The reflow soldering apparatus 1 further includes a blower 12, a water vapor removing unit 13, an exhaust gas supply pipe 14, and a heat exchange pipe 15. The blower 12 is a fan, for example, and forcibly sends the exhaust gas discharged from the power generation unit 100 to the water vapor removal unit 13. The blower 12 may be driven by electric power generated by the power generation unit 10.

The water vapor removing unit 13 allows the exhaust gas to pass through water and removes water vapor (moisture) in the exhaust gas. By this passage treatment, exhaust gas particulates (including soot) present in the exhaust gas are also removed and reduced. This eliminates the concern of adverse effects on the wiring board and electronic components due to water vapor (moisture). Further, by using a calcium hydroxide (Ca (OH) ₂ ) solution instead of water and allowing the exhaust gas to pass through the calcium hydroxide solution, not only water vapor content (moisture) in the exhaust gas but also carbon dioxide (CO ₂ ) Gas can be removed. That is, the water vapor removing unit 13 can also function as a carbon dioxide gas removing unit. Of course, as a method for removing the carbon dioxide gas, another type of carbon dioxide removing device may be used.

Incidentally, as an example, the component of the exhaust gas when the city gas whose main component is methane (CH ₄ ) is burned in the internal combustion engine 100a which is a gas combustion engine is about 71.5% by weight of nitrogen gas. About 19.0% by weight of water vapor and about 9.5% by weight of carbon dioxide gas. Subsequently, as a result of processing this exhaust gas in the water vapor removing unit 13 in which water is stored, the component is changed to about 88.3 wt% nitrogen gas and 11.7 wt% carbon dioxide gas. Was almost completely removed. In the exhaust gas, trace amounts of argon (Ar), carbon monoxide gas (CO), and nitriding gas (NO _x ) were also detected as other components. It is also possible to remove these trace gases using a specific removal device.

  Here, the exhaust gas initially has a temperature significantly exceeding 100 ° C., but at least partially becomes 100 ° C. or less by passing through water (calcium hydroxide solution). Thereby, the water vapor | steam contained in waste gas is taken in into water. As a result, the temperature of water (calcium hydroxide solution) also rises to near 100 ° C., so that the exhaust gas taken out from the water vapor removing unit 13 also maintains a high temperature close to 100 ° C. This high-temperature exhaust gas is then supplied to an inert gas supply unit 110 described later via an exhaust gas supply pipe 14.

  When lead (Pb) -free solder is used as the solder component of cream solder, tin (Sn), copper (Cu), and silver (Ag) that can be the component elements do not react with water vapor. Therefore, when there is no harmful effect caused by water vapor (water) on the wiring board and the electronic component, it is possible to use the exhaust gas containing water vapor as the inert gas without using the water vapor removing unit 13.

  As described above, in this embodiment, instead of expensive nitrogen gas, exhaust gas from the power generation unit 100 or gas obtained by appropriately treating the exhaust gas is used as an inert gas. Therefore, a great cost for the preparation and maintenance of the supply system in the nitrogen gas supply facility does not occur. As a result, it is possible to provide a good inert gas atmosphere necessary for soldering while suppressing the running cost of the apparatus.

  Further, the heat exchange unit 101 receives heat (reaction heat) generated in the internal combustion engine 100a through the cooling system of the internal combustion engine 100a, and further transfers the heat to the heat exchange fluid filled in the heat exchange pipe 15. The heat exchange pipe 15 circulates this heat exchange fluid and transmits heat to the exhaust gas heating unit 111 described later. The heat exchange fluid may be circulated by the electric power generated by the power generation unit 10.

  In addition, it is also possible not to heat the exhaust gas by the heat generated in the internal combustion engine 100a without providing the heat exchange unit 101, the heat exchange pipe 15, and the exhaust gas heating unit 111. In this case, the exhaust gas is heated to a required temperature by a heater unit 112 described later.

(Soldering unit 11)
Similarly, according to FIG. 2A, the soldering unit 11 includes an inert gas supply unit 110, an exhaust gas heating unit 111, a heater unit 112, an exhaust unit 113, a transport unit 114, and a temperature sensor 115. I have. Here, in particular, it is also preferable that the inert gas supply unit 110, the exhaust gas heating unit 111, and the heater unit 112 be provided on the upper and lower sides (or the left and right sides), respectively, with the transport unit 114 (wiring board 30) interposed therebetween. Thereby, the wiring board 30 can be heated more efficiently and the cream solder can be melted.

  The inert gas supply unit 110 supplies the high-temperature exhaust gas supplied through the exhaust gas supply pipe 14 to the periphery of the wiring board 30 that is transported by the transport unit 114 (the cream solder is applied and the electronic components are disposed). To do. The exhaust gas heating unit 111 is charged in the inert gas supply unit 110 and heats the high-temperature exhaust gas in the inert gas supply unit 110. Specifically, the heat generated by the heat exchange fluid is transferred to the exhaust gas in contact with the outer surface of the exhaust gas heating unit 111 to further increase the temperature of the exhaust gas.

  The heater unit 112 is an electric heater, for example, and generates heat by electric power including electric power generated by the generator 100b. That is, it is preferable to cover all of the power generated by the generator 100b for generating heat from the heater unit 112, and it is also possible to cover external (commercial) power. The heater unit 112 heats the exhaust gas discharged from the discharge port of the inert gas supply unit 110 and passing through the heater unit 112 to a temperature necessary for melting the cream solder.

  At this time, the exhaust gas is already heated by the exhaust gas heating unit 111 and is heated to a high temperature. Therefore, the electric power to the heater unit 112 required for heating the exhaust gas does not have to be a very large amount. For example, when the exhaust gas is heated to 150 ° C. by the exhaust gas heating unit 111, heating to a temperature necessary for the soldering process by the heater unit 112, for example, 240 ° C. may be performed by a temperature increase of 90 ° C. Become.

  Therefore, the amount of electric power necessary for heating the exhaust gas to the required temperature can be sufficiently suppressed. As a result, the running cost (including the “fuel” cost) of the device is greatly reduced. Further, the time required for starting up the soldering unit 11 is also greatly reduced because the exhaust gas temperature at the time of supply is sufficiently high. Furthermore, the initial input power to the soldering unit 11 can also be reduced.

  Further, as shown in FIG. 2A, the discharge ports of the inert gas supply unit 110 are opened toward the temperature setting zones that are partitioned by the partition plates. Moreover, the heater part 112 is installed in each temperature setting zone, heats the exhaust gas discharged | emitted from the discharge port, and raises the exhaust gas temperature in each temperature setting zone separately. As a result, by controlling the power supplied to each heater unit 112 and controlling the heating of exhaust gas by the heater unit 112 for each temperature setting zone, the temperature distribution experienced as the wiring board 30 is transported to the transport unit 114 can be obtained. It becomes possible to control to a desired profile. The supply power control for each heater unit 112 is performed based on the measurement result of the temperature distribution by the temperature sensor 115.

  Here, the inert gas atmosphere by the exhaust gas can be provided to the wiring board 30 not from just before the cream solder is cured, but from the start of the melting of the cream solder before that. This also makes it possible to improve the quality of the solder, particularly the wettability.

  The transport unit 114 is, for example, a belt conveyor, and the wiring board 30 on which the electronic components are arranged with cream solder applied is placed in an inert gas / high temperature environment (inert gas atmosphere and high temperature environment) formed by high temperature exhaust gas. Carry in and melt the applied cream solder. Further, at a predetermined stage where the cream solder is melted, the wiring board 30 is taken out of the inert gas / high temperature environment to cure the cream solder (solder portion thereof), thereby completing the soldering process.

  The exhaust part 113 is arranged before and after the heating area by the exhaust gas within the transport range of the wiring board 30 and sucks the exhaust gas (inert gas) supplied around the wiring board 30 (transport part 114) from the intake port, Force exhaust to the outside. Here, the intake port includes a vicinity of a carry-in port where the wiring board 30 is carried into the inert gas / high-temperature environment by the transfer unit 114, and a vicinity of a carry-out port which is an exit carried out from the inert gas / high-temperature environment Is provided. Since the vicinity of the intake port in the exhaust part 113 is maintained at a negative pressure, the exhaust part 113 always sucks the exhaust gas. As a result, it is possible to prevent the exhaust gas that can contaminate the air from leaking into the environment around the apparatus. Furthermore, the exhaust gas forcedly exhausted by the exhaust part 113 is still at a considerably high temperature. Accordingly, it is possible to perform hot air heating or the like using the heat of the exhaust gas using a heat exchanger.

(Changed aspects related to exhaust gas treatment)
FIG. 2B shows a modified mode relating to the treatment of exhaust gas supplied from the power generation unit 10 to the soldering unit 11. According to the figure, the exhaust gas discharged from the power generation unit 10 is sent to the filter 16 by the blower 120. The filter 16 removes solid substances such as exhaust gas particulates (including soot) present in the exhaust gas. The exhaust gas from which the solid substance has been removed is then supplied to the inert gas supply unit 110 by the blower 121. By installing the blowers 120 and 121 at the front and rear positions of the filter 16, the flow rate of the exhaust gas treated by the filter 16 to the inert gas supply unit 110 can be matched with the flow rate of the exhaust gas discharged from the internal combustion engine 100a. .

  In this modified embodiment, since the exhaust gas does not pass through water or the like, the exhaust gas is supplied to the inert gas supply unit 110 with the temperature significantly exceeding 100 ° C. As a result, the power required for the heater unit 112 to heat the exhaust gas to a temperature necessary for melting the cream solder is further reduced as compared with the configuration shown in FIG. Thereby, the running cost of the apparatus can be further suppressed.

  FIG. 3 is a schematic view showing another embodiment of the reflow soldering apparatus according to the present invention.

(Power generation unit 20: Fuel cell)
According to FIG. 3A, the reflow soldering apparatus 2 includes a power generation unit 20 and a soldering unit 11. Among these, the soldering unit 11 has the same configuration as the soldering unit of the reflow soldering apparatus 1 (FIG. 2A), and will not be described below.

  The power generation unit 20 includes a fuel cell unit 200, which is a power generation unit, and a heat exchange unit 201. The power generation unit 20 generates electric power using the supplied fuel and discharges exhaust gas (off-gas). The discharged exhaust gas is sent to the inert gas supply unit 110 by the blower 22.

  For example, an ENE-FARM (registered trademark) fuel cell unit, which is a fuel cell cogeneration system, may be used as the power generation unit 20. Furthermore, for example, a fuel cell power generation system disclosed in Japanese Patent Laid-Open No. 2001-180911 can be used.

  The heat exchange unit 201 receives heat (reaction heat) generated in the fuel cell unit (power generation unit) 200 and further transfers it to a heat exchange fluid filled in the heat exchange pipe 25. The heat exchange pipe 25 circulates this heat exchange fluid and transmits heat to the exhaust gas heating unit 111. The heat exchange fluid may be circulated by electric power generated by the power generation unit 20.

  In addition, it is also possible not to heat the exhaust gas (off gas) by the heat generated in the fuel cell unit 200 without providing the heat exchange unit 201, the heat exchange pipe 25, and the exhaust gas heating unit 111. In this case, the exhaust gas is heated to a required temperature by the heater unit 112.

  FIG. 3B shows the configuration of the fuel cell unit 200. According to the figure, the fuel cell unit 200 includes a hydrogen generation reforming unit 200a, a CO modification removal unit 200b, a cell reaction unit 200c, a deoxygenation unit 200d, and an inverter 200e.

The hydrogen generation reforming unit 200a takes in a city gas or a hydrocarbon gas such as LPG, mixes the hydrocarbon gas and steam, and uses hydrogen (H ₂ ) as a main component from the mixed gas by a steam reforming reaction. Producing hydrogen-containing gas. The CO modification / removal unit 200b uses a CO modification catalyst or the like to reduce the carbon monoxide gas content contained in the generated hydrogen-containing gas. Note that a CO selective oxidation unit that further reduces the carbon monoxide concentration (for example, to about 10 ppm) using a CO selective oxidation catalyst may be further provided.

The battery reaction unit 200c has a hydrogen electrode (anode) and an air electrode (cathode) with an electrolyte sandwiched between them. A battery is formed from a hydrogen-containing gas (reformed hydrogen) and taken-in oxygen (O ₂ ). Causes a reaction to generate DC power. As a battery system in the battery reaction unit 200c, a polymer electrolyte fuel cell (PEFC) system, a phosphoric acid fuel cell (PAFC) system, a molten carbonate fuel cell (MCFC) system, or a solid oxide fuel cell (SOFC) ) Method can be adopted.

  Here, when employing the PEFC method and the PAFC method, a platinum (Pt) -based material is used as a reaction catalyst. Platinum-based materials generally degrade when exposed to carbon monoxide. Therefore, the above-described CO modification removal unit 200b is necessary. On the other hand, when adopting the MCFC method and the SOFC method, since at least a platinum-based material is not used as a catalyst, the above-described CO modification removal unit 200b is not necessarily required.

  The inverter 200e converts the DC power generated by the battery reaction unit 200c into AC power. The electric power converted into alternating current by the inverter 200e is supplied to the soldering unit 11. When the soldering unit 11 is driven by direct current instead of alternating current, it is preferable to install a stabilizing circuit device that generates the stabilized direct current required by each part of the soldering unit 11 instead of the inverter 200e.

  The deoxygenating unit 200d removes and reduces the oxygen gas content in the air off-gas released from the air electrode of the exhaust gas discharged using a deoxygenating agent, an oxidizing absorbent, an oxygen absorbing cartridge, or the like. This air off gas contains oxygen gas that has not been consumed at the air electrode. Further, as the deoxidation part 200d, oxygen is absorbed by using powders or fine pieces / thread pieces of metal (such as iron (Fe), magnesium (Mg), aluminum (Al), manganese (Mn)) that are easily oxidized. Is also possible. An example of the deoxidizer is disclosed in, for example, Japanese Patent Application Laid-Open No. 2005-319429.

  Furthermore, it is also preferable to provide a dehydrogenation section that removes and reduces the hydrogen gas content in the hydrogen offgas discharged from the hydrogen electrode in the exhaust gas (offgas) discharged. By removing the hydrogen gas component, it is possible to mitigate measures to prevent hydrogen explosion in the use of exhaust gas. Moreover, the technique which burns the hydrogen gas in hydrogen offgas and the oxygen gas in air offgas by an electrothermal heating part, and converts the hydrogen gas content in exhaust gas into water vapor (moisture) is also available (for example, JP, 2001-52730, A). Furthermore, it is also preferable to provide a dehumidifier that removes and reduces water vapor (moisture) from the exhaust gas (off-gas) discharged. In addition, an example of an oxygen removal apparatus and a dehumidifier is disclosed by Unexamined-Japanese-Patent No. 2005-63733, for example.

  As described above, in the present embodiment, instead of expensive nitrogen gas, exhaust gas (off gas) from the fuel cell unit 200 or gas obtained by appropriately treating the exhaust gas is used as an inert gas. Therefore, a great cost for the preparation and maintenance of the supply system in the nitrogen gas supply facility does not occur. As a result, it is possible to provide a good inert gas atmosphere necessary for soldering while suppressing the running cost of the apparatus.

(Reflow soldering method)
FIG. 4 is a flowchart schematically showing an embodiment of the reflow soldering method according to the present invention.

(S11) Cream solder 32 is applied on the wiring board 30. This application is performed using, for example, a cream solder printer.
(S12) The electronic component 31 is placed (mounted) on the portion of the wiring board 30 where the cream solder 32 is applied. This mounting is performed using, for example, a NC (Numerical Control) controlled chip mounter.

(S13) “Power” is generated using “fuel” and “exhaust gas” is discharged. The generation of the “electric power” and the discharge of the “exhaust gas” are performed by using the power generation unit 100 or 200.
(S14) The “exhaust gas” is heated using “heat (reaction heat)” generated when “electric power” is generated. The heating of the “exhaust gas” is performed by using the heat exchange unit 101 or 201 and the exhaust gas heating unit 111. In addition, although this step S14 is implemented, it is possible to effectively use “heat” and further reduce the running cost of the apparatus, but may be omitted.

(S15) Heat is generated using electric power including “electric power” generated using “fuel”, and the heated “exhaust gas” is further heated. This heat generation and heating is performed by using the heater unit 112.
(S16) Heated “exhaust gas” is supplied around the wiring board 30 on which the cream solder 32 is applied and the electronic component 31 is disposed. This supply is realized by using the transfer unit 114 to put the wiring board 30 into an inert gas / high temperature environment (inert gas atmosphere and high temperature environment) formed by “exhaust gas”. Further, the emission of “exhaust gas” toward the passage position (surrounding) of the wiring board 30 is performed by using the inert gas supply unit 110.

(S17) The wiring board 30 is heated by the supplied exhaust gas. Thereby, the cream solder 32 on the wiring board 30 is melted.
(S18) Thereafter, the wiring board 30 is cooled, and the cream solder 32 (the solder thereof) is cured, and the soldering of the electronic component 31 to the wiring board 30 is completed.

(Response during power failure)
FIG. 5 is a schematic view showing an embodiment of a method for dealing with a power failure in the soldering apparatus of the present invention.

  According to FIG. 5, the soldering unit 11 includes a power source / control unit 116 that receives power generated by the power generation unit 10 or 20 and external (commercial) power. The power supply / control unit 116 supplies power to each component of the soldering unit 11 and controls its operation. In particular, the power / control unit 116 controls driving of the heater unit 112 and the transport unit 114.

  In this embodiment, the transport unit 114 includes a plurality of belt conveyors arranged in series, and sequentially transports the plurality of wiring boards 30 from the carry-in port to the carry-out port. The plurality of belt conveyors can move (rotate) in the opposite direction with the belt conveyor on the carry-in side and the belt conveyor on the carry-out side at one of a plurality of positions in the transport range. It is configured. Thereby, it is also possible to move a part of the plurality of wiring boards 30 to be transferred to the carry-in side and the other to the carry-out side.

  Here, a description will be given of the response on the device side in a situation where external (commercial) power is blacked out due to a disaster or accident.

The power supply / control unit 116 moves the wiring board 30 by driving the transport unit 114 using the power from the power generation unit 10 or 20 during a power failure of external (commercial) power. At this time, a predetermined temperature at which irreversible alteration of the cream solder 32 does not occur is set in advance,
a) At the time of a power failure, for the wiring board 30 at a temperature equal to or lower than the predetermined temperature _Tth , the transfer unit (belt conveyor) 114 on which the wiring board 30 is placed is moved to the carry-in side, and the heating area by the exhaust gas On the other hand,
b) For a wiring board 30 at a temperature exceeding the predetermined temperature _Tth at the time of a power failure, by driving a transport unit (belt conveyor) 114 on which the wiring board 30 is placed and a heater unit 112 as usual. The soldering process is completed.

Therefore, for example, when the temperature at the position of the wiring board 30 carried into the first temperature setting zone from the carry-in port is a value exceeding the predetermined temperature T _th , all the carried wiring boards 30 are carried as usual. The soldering process will be completed.

Here, the predetermined temperature _Tth is a temperature threshold value at which the cream solder 32 does not cause irreversible alteration at that temperature. Normally, the cream solder 32 is a material in which a solder metal powder and a flux are mixed to adjust the viscosity. Of these, the flux includes a resin, an activator, and a solvent. When this activator reacts and is consumed or the solvent volatilizes, the cream solder 32 is considered to cause irreversible alteration. If the cream solder 32 once altered is cooled and used again, the quality such as wettability is deteriorated. In consideration of the above, the predetermined temperature T _th is lower than the melting point T _{c of the} cream solder, and the experiment is performed to prevent the irreversible change in the activator and solvent in the flux. It can be set to a temperature confirmed experimentally or empirically.

  The power supply / control unit 116 determines the temperature of the wiring board 30 at the time of a power failure by obtaining an output from the temperature sensor 115 in the vicinity of each wiring board 30. The heater 112 is also driven using the power from the power generation unit 10 or 20.

  Further, at the time of a power failure, it is also preferable to stop the driving of the heater unit 112 installed at a position near the carry-in port among the plurality of heater units 112 (for example, shown in FIG. 2A). It is also preferable to close a discharge port provided at a position close to the carry-in port among a plurality of discharge ports of the inert gas supply unit 110 (for example, shown in FIG. 2A). By these measures, it is possible to avoid unnecessary heating of the wiring board 30 (cream solder 32) to be interrupted and returned to the state before the start of the process. As a result, the power from the power generation unit 10 or 20 can be used more effectively as a response to a power failure.

  As described above, according to the embodiment shown in FIG. 5, when the external (commercial) power is interrupted, the wiring board 30 in the soldering process in the apparatus is appropriately processed according to the state of the cream solder 32. be able to. As a result, it is possible to avoid a situation in which a large number of wiring boards 30 in process are accumulated in the apparatus and a large number of defective products are generated. Specifically, for the wiring board 30 in which the irreversible alteration described above has not yet occurred in the cream solder 32, the soldering process can be interrupted and returned to the state before the process start. On the other hand, for the wiring board 30 in which the irreversible alteration described above has occurred in the cream solder 32 or the cream solder 32 has melted, the soldering process can be completed despite a power failure. Therefore, the occurrence of a large number of defective products at the time of a power failure, which has been a problem in the past, is avoided.

  In the first place, such an effect can be achieved only by using the power generated by the power generation as emergency operation power and performing the soldering process in spite of a power failure.

(Flow soldering equipment)
FIG. 6 is a schematic diagram for explaining the configuration and operation of the flow soldering apparatus according to the present invention.

According to FIG. 6, the flow soldering apparatus according to the present invention comprises a power generation unit (10, 20) and a soldering unit (41). The power generation units (10, 20) have the same configuration as that shown in FIG. 1, and from the supplied “fuel”,
“Electric power”, “exhaust gas”, and “heat” are generated and supplied to the soldering unit (41).

  The soldering unit (41) includes an inert gas supply unit (410), an exhaust gas heating unit (411), a heater unit (412), and a solder bath (417). The exhaust gas heating section (411) heats the supplied “exhaust gas” using the supplied “heat”. The inert gas supply unit (410) supplies at least a part of the “exhaust gas” as an inert gas around the wiring board (50), particularly on the solder surface side. The heater unit (412) receives the supplied “electric power”, generates heat, and further heats the “exhaust gas” released from the inert gas supply unit (410). The solder tank (417) receives the supplied “electric power”, maintains the solder in a molten state, and stores the molten solder (52).

  On the wiring board (50) that is the object to be heated, the electronic component (51) that is the soldering object inserts the lead wire of the electronic component (51) into the hole of the wiring board (50), Has been placed. Here, a flux for removing the natural oxide film formed on the land (pad) of the solder surface is applied to the solder surface of the wiring board (50).

  The solder surface of the wiring board (50) to which this flux is applied is exposed to an inert gas atmosphere and a high temperature environment (inert gas / high temperature environment) formed by heated high temperature “exhaust gas”. Is done. By this preheating, unnecessary solvent components can be volatilized while the activator component of the flux remains, and the solder surface of the wiring board (50) is sufficiently heated to contact the molten solder (52) later. It is possible to mitigate the thermal shock during the process.

  Next, at least a part (solder surface) of the wiring substrate (50) is immersed in the molten solder (52) in the solder bath (417), and the molten solder is applied to the solder surface of the wiring substrate (50). Thereafter, the wiring board (50) is detached from the solder bath (417), and the applied solder is cured in an inert gas atmosphere. Thereby, the soldering process of the electronic component (51) with respect to the wiring board (50) is completed.

  In this way, the high-temperature environment necessary for soldering and the molten solder are realized by “electric power” from the power generation unit (100, 200) supplied with “fuel”. Further, the “exhaust gas” discharged from the power generation unit (100, 200) is also at a considerably high temperature from the beginning, and is further increased by the “heat” output from the heat exchange unit (101, 201). Therefore, the amount of “electric power” required to heat the “exhaust gas” to a temperature preferable as preheating before soldering can be sufficiently suppressed. As a result, the running cost of the apparatus can be reduced.

  Further, “exhaust gas” is generated by a so-called combustion action, and most is an inactive component. By using this “exhaust gas” as an inert gas instead of expensive nitrogen gas, a great cost for maintaining the preparation and supply system in the nitrogen gas supply facility does not occur. As a result, the running cost of the apparatus can be further reduced. Furthermore, since the inert gas atmosphere by "exhaust gas" is provided until the solder is applied to the wiring board (50) and further cured, deterioration of the solder quality (particularly wettability) due to oxidation is prevented.

  As described above, according to the present invention, a high-temperature environment necessary for soldering and a good inert gas atmosphere can be realized while suppressing the running cost of the apparatus.

  In addition, in this flow soldering apparatus, it is also possible not to provide "heat" without providing the heat exchange units (101, 201) and the exhaust gas heating unit (411). Even in this case, the above-described effect is achieved. However, depending on conditions such as the temperature of the heat exchange fluid in the heat exchange section (101, 201), the "heat" is effectively used by using the heat exchange section (101, 201) and the exhaust gas heating section (411). As a result, the running cost of the apparatus can be further reduced.

  Further, the exhaust gas heating section (411) is disposed outside the inert gas supply section (410), and the “exhaust gas” discharged from the inert gas supply section (410) is heated by the exhaust gas heating section (411). It is also possible. Further, the heater unit (412) may be disposed inside the inert gas supply unit (410), and the “exhaust gas” in the inert gas supply unit (410) may be heated by the heater unit (412). Is possible.

  Furthermore, not only the electric power from the power generation units (10, 20) but also the external (commercial) electric power can be supplied to the soldering unit (41) so that the power supply can be widened.

  FIG. 7 is a schematic view showing an embodiment of a flow soldering apparatus according to the present invention.

(Soldering unit 41)
According to FIG. 7A, the flow soldering apparatus 4 includes a power generation unit 10 and a soldering unit 41. Among these, the power generation unit 10 has the same configuration as the power generation unit of the reflow soldering apparatus 1 (FIG. 2A), and will not be described below. In this flow soldering apparatus 4, it is also preferable to use the power generation unit 20 (FIGS. 3A and 3B) instead of the power generation unit 10.

  The soldering unit 41 includes an inert gas supply unit 410, an exhaust gas heating unit 411, a heater unit 412, an exhaust unit 413, a transport unit 414, a temperature sensor 415, and a solder tank 417. Here, it is also preferable that the inert gas supply unit 410 is provided on each of the upper and lower sides (or the left and right sides) with the transfer unit 114 (wiring board 50) interposed therebetween. This makes it possible to provide an inert gas atmosphere to the wiring board 50 more reliably during the soldering process.

  The inert gas supply unit 410 supplies the exhaust gas supplied through the exhaust gas supply pipe 14 to the periphery of the wiring board 50 that is transferred by the transfer unit 414 (where electronic components are arranged). The exhaust gas heating unit 411 is charged inside the inert gas supply unit 410 installed on the solder surface side (the lower side in FIG. 7A) of the wiring board 50, and the high temperature inside the inert gas supply unit 410. The exhaust gas is heated. Specifically, the heat generated by the heat exchange fluid is transferred to the exhaust gas in contact with the outer surface of the exhaust gas heating unit 411 to further increase the temperature of the exhaust gas.

  The heater unit 412 is an electric heater, for example, and generates heat by electric power including electric power generated by the power generation unit 10. That is, it is preferable to cover all of the power generated by the power generation unit 10 for generating heat from the heater unit 412, and it is also possible to cover external (commercial) power. The heater unit 412 is an exhaust gas discharged from the discharge port of the inert gas supply unit 410 installed on the solder surface side of the wiring substrate 50 and passes through the exhaust gas that is in contact with the heater unit 412 before the flow soldering. Heat to a preferred temperature for preheating.

  At this time, the exhaust gas is already heated by the exhaust gas heating unit 411 and is heated to a high temperature. Therefore, the electric power to the heater unit 412 required for heating the exhaust gas does not have to be a very large amount. Therefore, the amount of electric power necessary for heating the exhaust gas to the required temperature can be sufficiently suppressed. As a result, the running cost (including the “fuel” cost) of the device is greatly reduced. Also, the time required for starting up the soldering unit 41 is greatly reduced because the exhaust gas temperature at the time of supply is sufficiently high. Furthermore, the initial input power to the soldering unit 41 can also be reduced.

  Further, as shown in FIG. 7A, the discharge ports of the inert gas supply unit 410 are opened toward the temperature setting zones that are partitioned by the partition plates. Moreover, the heater part 412 is installed in each temperature setting zone, heats the exhaust gas discharged | emitted from the discharge port, and raises the exhaust gas temperature in each temperature setting zone separately. As a result, the power supplied to each heater unit 412 is controlled, and the heating of exhaust gas by the heater unit 412 is controlled for each temperature setting zone, so that the solder surface of the wiring board 50 is experienced as it is transported to the transport unit 414. The temperature distribution can be controlled to a desired profile. This allows the wiring board 50 to experience an appropriate temperature for volatilizing an unnecessary solvent component while leaving the activator component of the flux applied to the solder surface, and further with the subsequent molten solder 52. The thermal shock received by the solder surface during the contact can be sufficiently mitigated. The supply power control for each heater unit 412 is performed based on the measurement result of the temperature distribution by the temperature sensor 415.

  Here, the inert gas atmosphere by the exhaust gas is not only before applying solder to the wiring board 50 (during preheating) but also after applying solder to the wiring board 50 via the solder bath 417 (during solder application / curing). Can also be provided. This makes it possible to further improve the quality of solder, particularly wettability.

  In addition, it is preferable that the heater unit 412 is not installed at the tip of the discharge port in the inert gas supply unit 410 installed on the component surface side (the upper side in FIG. 7A) of the wiring board 50. As a result, it is not necessary to directly apply heated exhaust gas to the component surface of the wiring board 50, so that the temperature rise of the arranged electronic component 51 is suppressed, and as a result, performance deterioration and destruction of the electronic component 51 are avoided. be able to. Furthermore, the discharge port of the inert gas supply unit 410 installed on the solder surface side (lower side in FIG. 7A) of the wiring substrate 50 and the tip of the discharge port located at the post-process side of the solder bath 417. In this case, the heater unit 412 may not be installed. The exhaust gas supplied from the discharge port cools and hardens the solder applied to the solder surface of the wiring substrate 50 via the solder bath 417 described later.

  The transport unit 414 is, for example, a belt conveyor, and carries the solder surface of the wiring board 50 on which electronic components are arranged into an inert gas / high temperature environment (inert gas atmosphere and high temperature environment) formed by exhaust gas. Further, the transfer unit 414 is configured such that at least a part (solder surface) of the wiring substrate 50 is immersed in the molten solder (molten solder) 52 in the solder bath 417 and the molten solder is applied to the solder surface of the wiring substrate 50. Then, the wiring board 50 is transferred. The transport unit 414 further removes the wiring board 50 from the solder bath 417, cures the solder while passing through an inert gas atmosphere, and then carries it out of the environment to complete the soldering process.

  The exhaust unit 413 has the same configuration and function as the exhaust unit 113 of the reflow soldering apparatus 1 (FIG. 2A), and exhausts exhaust gas (inert gas) to the outside.

  As shown in FIG. 7B, the solder tank 417 maintains the solder in a molten state with the electric power including the electric power supplied from the power generation unit 10 (power generation unit 100) and stores it as the molten solder 52. That is, it is preferable to cover all the power for driving the solder tank 417 by the amount generated by the power generation unit 10, and it is also possible to cover external (commercial) power. The solder tank 417 is provided with a stirring fin 418, and the stirring fin 418 is rotated to cause a jet flow in the molten solder 52, and a wave is generated on the liquid surface of the molten solder 52.

  At this time, at least a part (solder surface) of the wiring substrate 50 receives the wave of the molten solder 52 and is immersed in the molten solder 52, and the molten solder is applied to the solder surface of the wiring substrate 50. As a modification, the solder bath 417 may be a static DIP bath, and the wiring board 50 may be immersed while the molten solder 52 is kept stationary without providing the stirring fin 418.

  Here, it is preferable that the liquid surface of the molten solder 52 in the solder bath 417 is also covered with an exhaust gas (inert gas) atmosphere. As a result, the liquid surface of the molten solder 52 in a high temperature state is prevented from being oxidized, and good quality solder can be applied to the wiring board 50.

  As described above, in this embodiment, instead of expensive nitrogen gas, exhaust gas from the power generation unit 100 or gas obtained by appropriately treating the exhaust gas is used as an inert gas. Therefore, a great cost for the preparation and maintenance of the supply system in the nitrogen gas supply facility does not occur. As a result, it is possible to provide a good inert gas atmosphere necessary for soldering while suppressing the running cost of the apparatus.

  In this flow soldering apparatus, it is possible not to heat the exhaust gas by the heat generated in the power generation unit 100 without providing the heat exchange unit 101, the heat exchange pipe 15, and the exhaust gas heating unit 411. In this case, the exhaust gas supplied to the solder surface of the wiring board 50 is heated to a required temperature by the heater unit 412.

(Flow soldering method)
FIG. 8 is a flowchart schematically showing an embodiment of a flow soldering method according to the present invention.

(S21) The lead wire of the lead type electronic component 51 is inserted into the hole of the wiring board 50, and the electronic component 51 is arranged. This insertion step is performed using, for example, an axial insertion machine or a radial insertion machine. Here, it is preferable to apply a flux to the solder surface of the wiring board 50 on which the electronic component 51 is arranged.
(S22) “Power” is generated using “fuel” and “exhaust gas” is discharged. The generation of the “electric power” and the discharge of the “exhaust gas” are performed by using the power generation unit 100 or 200.

(S23) The “exhaust gas” is heated using “heat (reaction heat)” generated when “electric power” is generated. The heating of the “exhaust gas” is performed by using the heat exchange unit 101 or 201 and the exhaust gas heating unit 411. In addition, although this step S23 makes effective use of “heat” and can reduce the running cost of the apparatus more, it can be omitted.
(S24) Heat is generated using electric power including “electric power” generated using “fuel”, the solder in the solder bath 417 is melted to maintain the molten state, and the heated “exhaust gas” is further discharged. Heat. This heat generation, melting and heating are performed by using the solder bath 417 and the heater unit 112.

(S25) Heated “exhaust gas” is supplied around the solder surface of the wiring board 50 on which the electronic component 51 is disposed. This supply is realized by using the transfer unit 414 to put the solder surface of the wiring board 50 into an inert gas / high temperature environment (inert gas atmosphere and high temperature environment) formed by “exhaust gas”. Further, the emission of “exhaust gas” toward the passage position (surrounding) of the wiring board 50 is performed by using the inert gas supply unit 410.
(S26) The solder surface of the wiring board 50 is heated by the supplied exhaust gas. Thereby, preheating of the wiring board 50 immediately before the flow soldering is performed.

(S27) At least the solder surface of the wiring board 50 is immersed in molten solder. This is realized by transporting the wiring board 50 to the position of the solder bath 417 using the transport unit 414 and driving the solder bath 417. Thereby, solder is applied to the wiring board 50.
(S28) The solder applied to the wiring board 50 is cured in an inert gas atmosphere by exhaust gas, and the soldering of the electronic component 51 to the wiring board 50 is completed. The hardening of the solder is realized by separating the wiring board 50 from the solder tank 417 using the transport unit 414.

  As described above, according to the present invention, the inert gas / high temperature environment necessary for soldering is realized by the electric power and exhaust gas from the power generation unit supplied with fuel. Furthermore, it is also possible to provide a further high-temperature environment by combining heat generated by the power generation unit. As a result, the running cost of the apparatus can be further reduced while realizing good solder quality. In addition, since the soldering process can be performed using electric power generated by power generation, it is possible to avoid a situation in which many defective products are generated at the time of a power failure of external (commercial) power.

  It should be noted that all of the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

1, 2 Reflow soldering equipment (soldering equipment)
10, 20 Power generation unit 100 Power generation unit 100a Internal combustion engine 100b Generator 101, 201 Heat exchange unit 11, 41 Soldering unit 110, 410 Inert gas supply unit 111, 411 Exhaust gas heating unit 112, 412 Heater unit 113, 413 Exhaust unit 114, 414 Conveying section 115, 415 Temperature sensor 116 Power source / control section 12, 120, 121, 22 Blower 13 Water vapor removing section 14, 24 Exhaust gas supply pipe 15, 25 Heat exchange pipe 16 Filter 200 Fuel cell section (power generation section)
200a Hydrogen generation reforming unit 200b CO modification removal unit 200c Battery reaction unit 200d Deoxygenation unit 200e Inverter 30, 50 Wiring board (object to be heated)
31, 51 Electronic parts (objects to be soldered)
32 Cream solder (solder-containing material)
52 Molten solder (solder)
4 Flow soldering equipment 417 Solder tank 418 Stirring fin

Claims (12)

A soldering apparatus for soldering an object to be heated to an object to be heated,
A power generation unit including a fuel cell that generates electric power using the supplied fuel and a gas containing oxygen and discharges exhaust gas;
An inert gas supply unit that supplies at least a part of the exhaust gas as an inert gas around the object to be heated;
A heater unit that generates heat by electric power including electric power supplied from the power generation unit, heats the exhaust gas supplied around the target object, and heats the target object through at least the exhaust gas; A soldering apparatus characterized by comprising:   The soldering apparatus according to claim 1, further comprising a deoxygenation unit that removes or reduces oxygen content from the exhaust gas discharged from the fuel cell.   The soldering apparatus according to claim 1, further comprising a dehydrogenation unit that removes or reduces a hydrogen content from the exhaust gas discharged from the fuel cell.   4. The soldering apparatus according to claim 1, further comprising a combustion conversion unit configured to combust a hydrogen content and an oxygen content of the exhaust gas discharged from the fuel cell. 5.   5. The soldering apparatus according to claim 1, further comprising a dehumidifying unit that removes or reduces water vapor or moisture from the exhaust gas discharged from the fuel cell. 6.   The soldering apparatus according to claim 1, further comprising a reforming unit that takes in and reforms hydrocarbon gas and generates fuel to be supplied to the power generation unit. A transport unit for transporting the heated object;
An exhaust unit for exhausting the exhaust gas discharged from the inert gas supply unit, which is installed before and after the exhaust gas heating region within the transport range of the object to be heated by the transport unit; The soldering device according to claim 1, wherein the soldering device is a soldering device.   The heater unit is characterized by melting the solder-containing material by heating the heated object to which the solder-containing material is attached and the soldering object is disposed through at least the exhaust gas. The soldering apparatus of any one of Claim 1 to 7. External power is supplied to the heater unit in addition to the power from the power generation unit,
A transport unit for transporting the heated object;
Due to the exhaust gas, the heated object is driven at a temperature equal to or lower than a predetermined temperature that does not melt the attached solder-containing material at the time of a power failure of the external power, by driving the transport unit using power from the power generation unit. And further has a control unit for retreating from the heating area,
The control unit completes the soldering process by driving the heater unit and the transport unit using electric power from the power generation unit with respect to the object to be heated that is at a temperature exceeding the predetermined temperature. The soldering apparatus according to claim 8, wherein: A transport unit for transporting the heated object;
A solder bath for maintaining the solder in a molten state by electric power including electric power supplied from the power generation unit,
The conveyance unit conveys the heated object so that at least a part of the heated object is immersed in the molten solder in the solder bath and the molten solder is attached to the heated object. The soldering apparatus according to claim 1, wherein:   The exhaust gas heating part which heats the said exhaust gas supplied to the circumference | surroundings of the said to-be-heated object using the heat | fever generate | occur | produced in the case of the electric power generation by the said electric power generation part is further provided. The soldering apparatus according to any one of the above. Place the soldering object on the object to be heated,
While generating electric power with a fuel cell using fuel and a gas containing oxygen, exhaust gas is discharged from the fuel cell,
Heat is generated by the electric power including the generated electric power, and at least a part of the exhaust gas discharged is heated;
Supply the heated exhaust gas as an inert gas around the heated object where the soldering object is arranged,
A soldering method, wherein the object to be heated is heated by the supplied exhaust gas.

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