JP2016157752A5 - - Google Patents

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Publication number
JP2016157752A5
JP2016157752A5 JP2015033418A JP2015033418A JP2016157752A5 JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5 JP 2015033418 A JP2015033418 A JP 2015033418A JP 2015033418 A JP2015033418 A JP 2015033418A JP 2016157752 A5 JP2016157752 A5 JP 2016157752A5
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JP
Japan
Prior art keywords
laminated film
flexible wiring
breaking stress
wiring board
mpa
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Application number
JP2015033418A
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English (en)
Japanese (ja)
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JP6403095B2 (ja
JP2016157752A (ja
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Priority to JP2015033418A priority Critical patent/JP6403095B2/ja
Priority claimed from JP2015033418A external-priority patent/JP6403095B2/ja
Publication of JP2016157752A publication Critical patent/JP2016157752A/ja
Publication of JP2016157752A5 publication Critical patent/JP2016157752A5/ja
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Publication of JP6403095B2 publication Critical patent/JP6403095B2/ja
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JP2015033418A 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板 Active JP6403095B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015033418A JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Publications (3)

Publication Number Publication Date
JP2016157752A JP2016157752A (ja) 2016-09-01
JP2016157752A5 true JP2016157752A5 (enrdf_load_stackoverflow) 2017-06-22
JP6403095B2 JP6403095B2 (ja) 2018-10-10

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ID=56826490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015033418A Active JP6403095B2 (ja) 2015-02-23 2015-02-23 フレキシブル配線用基板およびフレキシブル配線板

Country Status (1)

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JP (1) JP6403095B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6904194B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 配線基板用積層体及びその製造方法
JP6904195B2 (ja) * 2017-09-22 2021-07-14 住友金属鉱山株式会社 フレキシブル配線基板及びその製造方法
JP7550599B2 (ja) 2020-10-14 2024-09-13 日東電工株式会社 金属層、導電性フィルム、および、金属層の製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008149772A1 (ja) * 2007-06-08 2008-12-11 Mitsui Mining & Smelting Co., Ltd. 電子部品実装用積層フィルム、電子部品実装用フィルムキャリアテープ及び半導体装置
WO2013002275A1 (ja) * 2011-06-28 2013-01-03 古河電気工業株式会社 電解銅箔、該電解銅箔を使用した配線板及びフレキシブル配線板
JP6083433B2 (ja) * 2012-04-24 2017-02-22 住友金属鉱山株式会社 ２層フレキシブル配線用基板及びフレキシブル配線板並びにそれらの製造方法
JP5769030B2 (ja) * 2012-04-26 2015-08-26 住友金属鉱山株式会社 金属化樹脂フィルムおよびその製造方法

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