JP2016150853A - Molding die, and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a molding die that improves releasability and a mold life and prevents seizing in molding, and a manufacturing method thereof.SOLUTION: A molding die includes a die base material 2, a barrier film, and a release film 4 on the molding surface of the die base material 2. The barrier film is composed of a strike nickel (Ni) plating film 31, an electrical Ni plating film 32, and an electrical gold (Au) plating film 33. The release film 4 is made of one of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), and ruthenium (Ru), or an alloy of a plurality of them. The molding die further includes a film 5 on the release film 4. The film 5 includes a dotted hydrophobic antifouling film 51 made of yttrium fluoride having either yttrium fluoride (YF3) or yttrium oxide (Y2O3), or both of them, and a hydrophilic antifouling film 52 made of yttrium oxide.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a molding die provided with an antifouling film having releasability and a method for producing the same.

Conventionally, when a molded product is manufactured using a mold having fine irregularities formed on the surface or a mold that requires high surface accuracy, the mold is not separated from a molded product such as plastic resin or glass. Due to inadequate moldability, it has been a problem that defects occur in molded products.
In general, the mold for molding is formed with a release film on the surface of the mold for the purpose of good mold release and improvement of repeated durability of molding.
For example, as a mold material, a cemented carbide whose main component is tungsten carbide (WC), cermet whose main component is tantalum carbide (TaC), titanium carbide (TiC), chromium carbide (CrC), and alumina (AL2O3). , Chromium (Cr), molybdenum (Mo), nickel (Ni), cobalt (Co), tungsten (W), titanium (Ti), stainless steel (SUS), silicon carbide (SiC), etc., and release film Precious metals such as platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), osmium (Os), ruthenium (Ru), rhenium (Re), tungsten (W) and tantalum (Ta) Metal molds are used to improve mold releasability.

JP 2005-231932 A JP 2009-0667607 A WO2011 / 092794 gazette

In a conventional mold having a mold release film as described above, if the mold temperature during molding is high, the molding durability is low, and it is common to remove and regenerate the mold release layer. It was.
In particular, in the case of a glass mold having a high molding temperature, since the heating temperature of the mold is 500 ° C. or higher, the mold release film deteriorates quickly, and the life of the mold release film is from several tens to several hundred shots. There was a problem that the durability was low.
In addition, when dirt is attached to the molding die due to high temperature molding at 500 ° C. or higher, there is a problem that seizure occurs on the mold surface and the mold release property and surface accuracy of the molding die are lowered.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a molding die having improved mold release properties and repeated durability, and a method for producing the same.

  A molding die according to the present invention is formed on a mold base material, a barrier film formed on the mold base material, a release film formed on the barrier film, and the release film. And the antifouling film comprises at least one of a hydrophilic antifouling film and a hydrophobic antifouling film.

The manufacturing method of the molding die according to the present invention includes a barrier film forming step of forming a barrier film that suppresses adhesion and diffusion of components of the mold base material on the surface of the mold base material by a wet plating method;
A release film forming step of forming a release film on the barrier film by wet plating;
An antifouling film forming step of forming an antifouling film on the release film by dry film formation.

According to the molding die according to the present invention, the antifouling film composed of at least one of the hydrophilic antifouling film and the hydrophobic antifouling film is formed on the release film. Thus, the mold releasability with glass is improved, and the fusion between the glass and the mold for molding, particularly the mold release film is reduced as compared with the conventional one, so that the life of the mold for molding is improved.
In addition, since adhesion and generation of dirt on the molding die are reduced, seizure on the surface of the molding die during molding is reduced as compared with the prior art.

It is sectional drawing which shows the metal mold | die of Embodiment 1 of this invention. It is a principal part enlarged view of FIG. It is an enlarged view which shows the surface of the metal mold | die of FIG. It is a principal part enlarged view which shows the metal mold | die for Embodiment 2 of this invention. It is principal part sectional drawing which shows the metal mold | die for Embodiment 3 of this invention. It is principal part sectional drawing which shows the metal mold | die for Embodiment 4 of this invention.

  Hereinafter, a molding die and a manufacturing method thereof according to each embodiment of the present invention will be described. In the drawings, the same or corresponding members and parts are denoted by the same reference numerals.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view showing a molding die 1 according to Embodiment 1 of the present invention, FIG. 2 is an enlarged view of a main part of a portion A in FIG. 1, and FIG. It is a principal part enlarged view shown.
The molding die 1 includes a mold base material 2 mainly composed of tungsten carbide (WC), a barrier film 3 formed on the surface of the mold base material 2, and a surface of the barrier film 3. The release film 4 and the antifouling film 5 formed in a sea-island shape on the release film 4 are provided. The antifouling film 5 includes a hydrophobic antifouling film 51 and a hydrophilic antifouling film 52.

Here, the barrier film 3 is in contact with the mold base material 2 to prevent diffusion of the metal element contained in the mold base material 2. The release film 4 and the antifouling film 5 are formed of a material that is chemically stable with respect to the molding material, particularly the glass material here.
The mold base material 2 is formed of, for example, a cemented carbide containing tungsten carbide (WC) as a main component and another light metal element as a binder. Examples of other light metal elements contained in the mold base material 2 include cobalt (Co), nickel (Ni), and chromium (Cr). The mold base material 2 has a strength that can withstand molding.
The barrier film 3 may be a commonly used material that can suppress the diffusion of the light metal component contained in the mold base material 2 into the release film 4. For example, platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), ruthenium (Ru) at least one kind of noble metal, transition metal element and nickel (Ni), tungsten (W), tantalum (Ta), gold (Au) and molybdenum (Mo) It is formed of an alloy with at least one of these transition metal elements, or a single metal single layer or multiple layers.
Thus, since the barrier film 3 can be selected from a plurality of metal species, the width of the molding material constituting the usable molded product is increased.
The barrier film 3 is in contact with the mold base material 2 to form a film having excellent heat resistance. The barrier film 3 is composed of light metal elements constituting the binder component contained in the mold base material 2 and tungsten (W), tantalum (Ta), nickel (Ni), cobalt (free metal components in the main component). Co) is prevented from spreading. The barrier film 3 has a film thickness of, for example, 0.05 to 2 μm, and an average surface roughness Ra of, for example, 40 nm or less.

The release film 4 is formed of, for example, an alloy that combines one or more of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), and ruthenium (Ru). Since the release film 4 is in direct contact with the molding material, particularly in glass molding, it is formed of a chemically stable material that is difficult to oxidize at the softening temperature of the glass material. The release film 4 has a film thickness of, for example, 0.05 to 2 μm and an average surface roughness Ra of, for example, 40 nm or less. The release film 4 may contain the same metal element as that constituting the barrier film 3, and ensures good adhesion with the barrier film 3. As the adhesion, a strength of 0.05 kN / m or more is secured. The barrier film 3 and the release film 4 may contain a metal element that is compatible with bonding.
Thus, since the release film 4 can be selected from a plurality of metal species, the width of the molding material constituting the usable molded product is widened.

The antifouling film 5 includes a hydrophobic antifouling film 51 and a hydrophilic antifouling film 52. For example, a hydrophobic hydrophobic material such as yttrium fluoride (YF3), and a hydrophilic substance such as yttrium oxide (Y2O3). It is made of a functional material. The antifouling film 5 is not in a structure covering the entire surface of the release film 4 but is formed in a sea island shape. When the antifouling film 5 is expressed as an island and the release film 4 is expressed as the sea, the island-shaped antifouling film 5 has a thickness of 5 to 15 nm and a width of 5 to 15 nm, and the distance between the island and the island is 100 nm. It is formed as follows.
Here, when the molding material is a glass material, yttrium fluoride is optimal as the hydrophobic material, and yttrium oxide is optimal as the hydrophilic material.

Next, a manufacturing method of the molding die 1 of the first embodiment configured as described above will be described.
First, the mold base material 2 processed into a predetermined shape is prepared.
Next, the barrier film 3 and the release film 4 are formed. The barrier film 3 and the release film 4 can be formed by dry film formation such as sputtering or vacuum deposition, or wet film formation by electroplating. In order to ensure reliable adhesion, it is preferable to form by wet film formation.

Hereinafter, a specific wet film forming method of the barrier film 3 will be described.
First, the mold base material 2 processed into a predetermined shape is degreased to remove surface contaminants such as organic foreign matters from the tungsten carbide (WC) surface of the mold base material 2 to ensure wettability. .
Next, an etching process is performed to remove surface contaminants such as inorganic foreign matters and oxide films from the tungsten carbide (WC) surface of the mold base material 2 and to ensure wettability by exposing the active metal surface. The adhesion between the plating film formed in the subsequent plating step and tungsten carbide (WC) as the substrate is ensured.

Next, the barrier film 3 is formed. The barrier film 3 becomes a multilayer when formed by a wet plating method, and also functions as a binder layer that ensures adhesion between the tungsten carbide (WC) of the mold base material 2 and the release film 4. As the barrier film 3, a strike nickel plating film 31 is formed on tungsten carbide (WC) of the mold base material 2 that has been subjected to acid etching. As the strike nickel plating solution, a conventionally used wood bath or a commercially available plating solution can be used. As a liquid composition of the wood bath, for example, a plating solution in which 37 wt% hydrochloric acid is 120 mL / L, nickel chloride hexahydrate is 240 g / L and pure water is added to adjust to 1 L can be used. As for the plating conditions, the immersion of the mold in the strike nickel plating solution, the energization time and the solution temperature can be appropriately set so that a strike nickel plating film having a desired film thickness can be obtained.
For example, when the liquid temperature is 25 ° C., the current density is 10 A / dm 2, and the plating time is 30 seconds, the strike nickel plating film 31 of about 1 μm can be obtained.
Next, an electro nickel plating process is performed to form an electro nickel plating film 32 on the strike nickel plating film 31. As the electric nickel plating solution, a conventionally used watt bath or a commercially available plating solution can be used. As the Watt bath solution composition, for example, nickel sulfate hexahydrate 250 g / L, nickel chloride hexahydrate 45 g / L, boric acid 40 g / L and pure water added to 1 L can be used. . As for the plating conditions, the immersion of the mold in the electric nickel plating solution, the energization time, and the liquid temperature can be appropriately set so that the electric nickel plating film 32 having a desired film thickness can be obtained.
For example, the electronickel plating film 32 of about 1 μm can be obtained by setting the liquid temperature to 50 ° C., the current density of 2 A / dm 2, and the plating time to 2 to 3 minutes.

Next, an electrogold plating film 33 is formed as the final layer of the barrier film 3. As the electrogold plating solution, a commercially available gold cyanide plating solution or acidic gold plating solution which has been conventionally used can be used. The composition of the gold cyanide plating solution was adjusted to 1 L by adding pure water to 8 g / L potassium gold cyanide, 30 g / L potassium cyanide, 30 g / L potassium phosphate, 15 g / L potassium carbonate, and the like. A plating solution can be used. As for the plating conditions, the immersion of the mold in the electrogold plating solution, the energization time and the solution temperature can be appropriately set so that the electrogold plating film 33 having a desired film thickness can be obtained.
For example, when the liquid temperature is 60 ° C., the current density is 0.5 A / dm 2, and the plating time is 1 minute, the electrogold plating film 33 of about 0.05 to 0.1 μm can be obtained.

Next, electroplating is performed, and one or more of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), and ruthenium (Ru) are formed on the electrogold plating film 33 as the barrier film 3. A release film 4 is formed which is formed from an alloy combining the above.
The electroplating solution is a platinum (Pt) plating solution with a platinum concentration of 15 to 25 g / L and a pH adjusted to 11 to 14, and the palladium plating solution with a palladium concentration of 1 to 5 g / L and pH. As a solution adjusted to 8 to 10 and an iridium plating solution, an iridium concentration of 10 to 20 g / L and a pH adjusted to 2 to 5 and as a rhodium plating solution, a rhodium concentration of 1 to 10 g / L and pH As a liquid adjusted to 0 to 3 and a ruthenium plating solution, a liquid adjusted to a ruthenium concentration of 1 to 5 g / L and a pH of 0 to 3 can be used. As for the plating conditions, the immersion of the mold in the electroplating solution, the energization time and the solution temperature can be appropriately set so that the electroplating film 3 having a desired film thickness can be obtained.

  For example, with a platinum plating solution, a liquid temperature of 90 ° C., a cathode current density of 2 to 3 A / dm 2, and a plating time of 3 minutes, a platinum plating film of about 1 μm is obtained. With a palladium plating solution, a liquid temperature of 55 ° C., a cathode current A palladium plating film with a density of 0.5 to 1 A / dm 2 and a plating time of 4 minutes, a plating temperature of about 1 μm, with an iridium plating solution, a liquid temperature of 85 ° C., a cathode current density of 0.2 to 0.5 A / dm 2, plating By setting the time to 15 minutes, an iridium plating film having a thickness of about 1 μm is used. For the rhodium plating solution, the liquid temperature is 50 ° C., the cathode current density is 0.5 to 2.0 A / dm 2, and the plating time is about 1 μm. In the ruthenium plating solution, a ruthenium plating solution having a liquid temperature of 65 ° C., a cathode current density of 0.5 to 2.0 A / dm 2, and a plating time of 10 minutes, a ruthenium plating film of about 1 μm is obtained. Can do.

Next, the antifouling film 5 which is a feature of the present invention is formed.
The antifouling film 5 is made of a hydrophobic and hydrophilic material, and is made of, for example, a fluoride hydrophobic material such as YF3 or a hydrophilic material such as Y2O3.
The antifouling film 5 is not in a structure covering the entire surface of the release film 4 but is formed in a sea island shape. The antifouling film 5 is formed by dry film formation such as sputtering or vacuum deposition.

As an example, a film forming method using a vacuum evaporation apparatus will be described.
An electron beam vapor deposition apparatus is used as the vacuum vapor deposition apparatus. The film-forming material is placed in a reduced pressure state, heated by an electron beam to raise the vapor pressure, evaporate as a solid gas, and form an antifouling film 5 on the release film 4.
First, after the electroplating treatment of the release film 4, the plating solution residue is removed and dried by a pure water washing process. At this point, if the plating film thickness differs from the desired product shape, the release film 4 is processed and reprocessed to the desired shape. After drying, the mold formed up to the release film 4 is put into a vacuum deposition apparatus. At the same time, a hydrophobic antifouling film material (YF3) and a hydrophilic material (Y2O3) are also put into a vacuum deposition apparatus to be in a vacuum state. After reaching a predetermined degree of vacuum, energy is input to the film forming material by an electron beam, and film formation is started.

Next, a film forming procedure will be described.
First, the hydrophilic antifouling film 52 is formed. For example, when yttrium oxide (Y2O3) is used as the hydrophilic antifouling film 52, an island having a width of 5 to 10 nm is formed by forming a film forming rate of 0.2 to 2.0 nm and a film thickness of 5 to 10 nm. The hydrophilic antifouling film | membrane 52 can be formed in a shape.
Next, a hydrophobic antifouling film 51 is formed. For example, when yttrium fluoride (YF3) is used as the hydrophobic antifouling film 51, the film forming rate is 0.2 to 2.0 nm and the film thickness is 5 to 10 nm, so that the width is 5 to 10 nm. The hydrophobic antifouling film 51 can be formed in an island shape.
By forming the antifouling film 5 in this way, a hybrid antibacterial film in which the island-like hydrophilic antifouling film 52 and the island-like hydrophobic antifouling film 51 are mixed without completely covering the release film 4. The dirty film 5 can be obtained.

The principle that the mold release property and the antifouling property are improved by forming the antifouling film 5 as described above and the life of the molding die 1 is improved will be described.
As foreign substances adhering to the molding die 1, there are hydrophilic substances such as dust, organic substances, and hydrophobic substances such as oily smoke.
As described above, the formed antifouling film 5 is formed with a mixture of a hydrophobic material and a hydrophilic material in the form of islands in a nano-order, and from the dirt on which the hydrophilic portion and the hydrophobic portion adhere. Since the structure is small and dispersed, both hydrophilic and hydrophobic stains are difficult to adhere.
In particular, the hydrophilic antifouling film 52 and the hydrophobic antifouling film 51 have a film thickness of 5 to 10 nm and a width of 5 to 10 nm, respectively, and between the hydrophilic antifouling film 52 and the hydrophobic antifouling film 51. In the case where there is a gap and the interval is 100 nm or less, the effect of hardly adhering both hydrophilic and hydrophobic stains is remarkable.

According to the molding die 1 of the first embodiment configured as above, platinum (Pt), palladium (Pd), iridium (Ir) on the mold base material 2 and the molding surface of the mold base material 2. ), Rhodium (Rh), ruthenium (Ru), or a release film 4 made of an alloy that combines a combination of yttrium fluoride (YF3) and yttrium oxide (Y2O3). In combination, the release film 4 is not completely covered but is dispersed in the form of islands in nano-order, so that the fusion between the molding material and the molding die 1, particularly the release film 4, is more than conventional. The life of the molding die 1 can be improved.
In addition, since adhesion and generation of dirt on the molding die 1 are reduced, seizure on the surface of the molding die 1 during molding is reduced as compared with the conventional case, and the life of the molding die 1 is improved. Can do.

Embodiment 2. FIG.
FIG. 4 is a cross-sectional view showing a molding die 1 and a manufacturing method thereof according to Embodiment 2 of the present invention.
In this embodiment, the antifouling film 5 is a hydrophobic antifouling film 51 made of a hydrophobic hydrophobic material such as YF3. The antifouling film 5 does not have a structure covering the entire surface of the release film 4 but is formed in a sea-island shape as in the first embodiment. When the hydrophobic antifouling film 51 is expressed as an island and the release film 4 is expressed as the sea, the island-like hydrophobic antifouling film 51 is formed with a width of 5 to 15 nm and a width of 5 to 15 nm. Is formed at 100 nm or less.
Other configurations are the same as those of the molding die 1 of the first embodiment.

Next, a method for manufacturing the molding die 1 of the second embodiment configured as described above will be described.
The formation from the barrier film 3 to the release film 4 is the same as the method for manufacturing the molding die 1 of the first embodiment.
The difference from the first embodiment is the formation of the antifouling film 5.
As in the first embodiment, the hydrophobic antifouling film 51 is formed by dry film formation such as sputtering or vacuum deposition.
As in the first embodiment, a film forming method using a vacuum evaporation apparatus will be described. First, after the electroplating treatment of the release film 4, the plating solution residue is removed and dried by a pure water washing step. At this point, if the plating film thickness differs from the desired product shape, the release film 4 is processed and reprocessed to the desired shape.
After drying, the semi-finished mold formed up to the release film 4 is put into a vacuum deposition apparatus. At the same time, the material (YF3) of the hydrophobic antifouling film 51 is also put into a vacuum vapor deposition apparatus to be in a vacuum state. After reaching a predetermined degree of vacuum, energy is input to the film forming material by an electron beam, and film formation is started.

Next, a method for forming the hydrophobic antifouling film 51 will be described as a film forming procedure.
When yttrium fluoride (YF3) is used as the hydrophobic antifouling film 51, an island shape having a width of 5 to 15 nm is formed by forming a film forming rate of 0.2 to 2.0 nm and a film thickness of 5 to 15 nm. Further, the hydrophobic antifouling film 51 can be formed. By forming the hydrophobic water-proof antifouling film 52 in this way, the island-shaped hydrophobic antifouling film 51 is formed on the release film 4 without completely covering the release film 4, thereby forming the antifouling film 5. It becomes possible.

According to the molding die 1 of Embodiment 2 configured as described above, the mold base material and the molding surface of the mold base material are platinum (Pt), palladium (Pd), iridium (Ir), Using a release film 4 made of an alloy that combines one or more of rhodium (Rh) and ruthenium (Ru), and using yttrium fluoride (YF3) on the release film 4, the release film 4 is completely formed. Since it has a structure that forms a hydrophobic antifouling film 51 dispersed in islands in nano-order without coating, the hydrophilic molding material and the molding die 1, particularly the release film 4, can be fused. Thus, the life of the molding die 1 can be improved.
In addition, since adhesion and generation of hydrophilic dirt to the molding die 1 are reduced, seizure on the die surface during molding is reduced as compared with the prior art, and the life of the molding die 1 is improved. it can.

Embodiment 3 FIG.
FIG. 5 is a cross-sectional view showing a molding die 1 and a manufacturing method thereof according to Embodiment 3 of the present invention.
In the third embodiment, the antifouling film 5 is a hydrophilic antifouling film 52 made of a hydrophilic material such as Y2O3. The antifouling film 5 does not have a structure covering the entire surface of the release film 4, and is formed in a sea-island shape as in the first embodiment. When the hydrophilic antifouling film 52 is expressed as an island and the release film 4 is expressed as the sea, the island-shaped hydrophilic antifouling film 52 is formed with a thickness of 5 to 15 nm and a width of 5 to 15 nm. The distance between the islands is 100 nm or less.
Other configurations are the same as those of the molding die 1 of the first embodiment.

Next, a method for manufacturing the molding die 1 of the third embodiment configured as described above will be described.
The formation from the barrier film 3 to the release film 4 is the same as the method for manufacturing the molding die 1 of the first embodiment.
The difference from the first embodiment is the formation of the antifouling film 5. As in the first embodiment, the antifouling film 5 is formed by dry film formation such as sputtering or vacuum deposition.
As in the first embodiment, a film forming method using a vacuum vapor deposition apparatus will be described. First, after the electroplating treatment of the release film 4, the plating solution residue is removed and dried by a pure water washing step. At this point, if the plating film thickness differs from the desired product shape, the release film 4 is processed and reprocessed to the desired shape. After drying, the semi-finished mold formed up to the release film 4 is put into a vacuum deposition apparatus. At the same time, the material (Y 2 O 3) of the hydrophilic antifouling film 52 is also put into a vacuum vapor deposition apparatus to make a vacuum state. After reaching a predetermined degree of vacuum, energy is input to the film forming material by an electron beam, and film formation is started.

Next, a method for forming the hydrophilic antifouling film 52 will be described as a film forming procedure.
When yttrium oxide (Y 2 O 3) is used as the hydrophilic antifouling film 52, the film forming rate is 0.2 to 2.0 nm and the film thickness is 5 to 15 nm to form an island shape having a width of 5 to 15 nm. A hydrophilic antifouling film 52 can be formed.
By forming the antifouling film 5 in this way, an island-like hydrophilic antifouling film 52 is formed on the release film 4 without completely covering the release film 4 and the antifouling film 5 It becomes possible to do.

According to the molding die 1 of the third embodiment configured as described above, the mold base 2 and the molding surface of the mold base 2 are made of platinum (Pt), palladium (Pd), iridium (Ir ), Rhodium (Rh), ruthenium (Ru), or a release film 4 made of an alloy, and yttrium oxide (Y 2 O 3) is used on the release film 4 to completely form the release film 4. In particular, the hydrophilic antifouling film 52 is dispersed in the form of islands in a nano-order without coating, so that the fusion between the hydrophobic molding material and the molding die 1, particularly the release film 4, is particularly good. Adhesion is reduced as compared with the conventional case, and the life of the molding die 1 can be improved.
In addition, since the adhesion and generation of hydrophobic dirt on the molding die 1 are reduced, seizure on the surface of the molding die 1 during molding is reduced as compared with the conventional case, and the life of the molding die 1 is increased. Can be improved.

Embodiment 4 FIG.
FIG. 6 is a cross-sectional view showing a molding die 1 and a manufacturing method thereof according to Embodiment 4 of the present invention.
In this embodiment, the antifouling film 5 is composed of a hydrophobic material and a hydrophilic material, and is formed of, for example, a fluoride hydrophobic material such as YF3 and a hydrophilic material such as Y2O3. .
The antifouling film 5 completely covers the entire surface of the release film 4, and a hydrophobic antifouling film 51 formed on the hydrophilic antifouling film 52 is formed in a sea-island shape. When the hydrophobic antifouling film 51 is expressed as an island and the hydrophilic antifouling film 52 is expressed as the sea, the island-like hydrophobic antifouling film 51 is formed with a thickness of 5 to 15 nm and a width of 5 to 15 nm. The gap between the island and the island is formed with a thickness of 100 nm or less.
Other configurations are the same as those of the molding die 1 of the first embodiment.

Next, a method for manufacturing the molding die 1 of Embodiment 4 configured as described above will be described.
The formation from the barrier film 3 to the release film 4 is the same as the method for manufacturing the molding die 1 of the first embodiment.
The difference from the first embodiment is the formation of the antifouling film 5. As in the first embodiment, the antifouling film 5 is formed by dry film formation such as sputtering or vacuum deposition.
As in the first embodiment, a film forming method using a vacuum evaporation apparatus will be described. First, after the electroplating treatment of the release film 4, the plating solution residue is removed and dried by a pure water washing step. At this point, if the plating film thickness differs from the desired product shape, the release film 4 is processed and reprocessed to the desired shape.
After drying, the semi-finished mold formed up to the release film 4 is put into a vacuum deposition apparatus. At the same time, the material (YF3) of the hydrophobic antifouling film 51 and the antifouling material (Y2O3) of the hydrophilic antifouling film 52 are also put into a vacuum deposition apparatus to be in a vacuum state. After reaching a predetermined degree of vacuum, energy is input to the film forming material by an electron beam, and film formation is started.

Next, a method for forming the antifouling film 5 will be described as a film forming procedure.
First, the hydrophilic antifouling film 52 is formed. When yttrium oxide (Y2O3) is used as the hydrophilic antifouling film 52, the film forming rate is 0.2 to 2.0 nm and the film thickness is 50 to 200 nm.
Next, a hydrophobic antifouling film 51 is formed. When yttrium fluoride (YF3) is used as the hydrophobic antifouling film 51, an island shape having a width of 5 to 15 nm is formed by forming a film forming rate of 0.2 to 2.0 nm and a film thickness of 5 to 15 nm. Further, the hydrophobic antifouling film 51 can be formed.
By forming such an antifouling film 5, it is possible to completely cover the release film 4 and obtain an antifouling film 5 having an island-like hydrophobic antifouling film 51.

According to the molding die 1 of the fourth embodiment configured as described above, the mold base material 2 and the molding surface of the mold base material 2 are made of platinum (Pt), palladium (Pd), iridium (Ir ), Rhodium (Rh), ruthenium (Ru), and a release film 4 made of an alloy of a combination of one or more and a hydrophilic antifouling film 52 made of hydrophilic yttrium oxide on the release film 4 And a hydrophobic antifouling film 51 in which hydrophobic yttrium fluoride (YF3) is dispersed in the form of islands on a nano-order is formed on the hydrophilic antifouling film 52. Regardless of the property and hydrophobicity, the fusion between the molding material and the molding die 1, particularly the release film 4, can be reduced as compared with the conventional one, and the life of the molding die 1 can be improved.
In addition, since adhesion and generation of both hydrophilic and hydrophobic stains to the molding die 1 are reduced, seizure on the surface of the molding die 1 at the time of molding is reduced as compared with the conventional molding die. 1 lifespan can be improved.

Unlike the molding die 1, the antifouling film 5 completely covers the entire surface of the release film 4, and the hydrophilic antifouling film 52 formed on the hydrophobic antifouling film 51 is in the shape of a sea island. It may be a formed mold. In this case, when the hydrophilic antifouling film 52 is expressed as an island and the hydrophobic antifouling film 51 is expressed as the sea, the island-shaped hydrophilic antifouling film 52 is formed with a thickness of 5 to 15 nm and a width of 5 to 15 nm. The distance between the islands is 100 nm or less.
Further, this molding die 1 is also manufactured with the same contents as the manufacturing method of the molding die 1 shown in the fourth embodiment, and the same effect as the molding die 1 shown in FIG. 6 is obtained. Can do.

  Examples of the present invention and comparative examples will be described in detail below. The present invention is not limited to these examples.

Example 1.
Example 1 is based on the first embodiment described above.
Specifically, degreasing treatment was performed on the glass molding die 1 having a film formation surface of φ30 mm by the method described in the first embodiment. In the degreasing treatment step, degreasing treatment is performed using a degreasing agent ELC-400 (manufactured by World Metal Co., Ltd.) to remove organic substances, and then the above mold 1 is immersed in pure water. After leaving for a minute, it was taken out.
Next, the etching process was performed in accordance with the etching process described in the first embodiment. HS-55 (manufactured by World Metal Co., Ltd.) is used for acid electrolytic etching, and HC-55 (manufactured by World Metal Co., Ltd.) is used for normal etching after acid electrolytic etching. Thereafter, the molding die 1 was immersed in pure water, left for 1 minute, and then taken out.
Next, the strike nickel plating, electro nickel plating, and electro gold plating described in the first embodiment are applied, the strike nickel plating film having a thickness of 1 μm, the electro nickel plating having a thickness of 1 μm, and the electro gold having a thickness of 0.05 μm. A plating film was formed. In strike nickel plating, NI-STK (manufactured by World Metal Co., Ltd.) was used, in electro nickel plating, Watt bath was used, and in electro gold plating, Tempelx 8400 (EEJA Corporation) was used. The treatment was performed under the standard conditions shown in Form 1.

Next, a platinum plating film having a thickness of 500 nm was formed by the electroplating method described in the first embodiment. The electroplated plating film was processed under the standard conditions shown in Embodiment 1 using Platinumate 100 (manufactured by EEJA).
Next, a sea-island structure of yttrium fluoride and yttrium oxide was formed to a thickness of 15 nm or less by the dry film formation described in Embodiment 1. After confirming the result of film formation by surface SEM observation, a molding test was performed.

Example 2
Example 2 is based on the second embodiment described above.
Using the same molding die 1 as in Example 1 above, the same processing was performed from degreasing to electroplating. After electroplating, the sea-island structure of yttrium fluoride was formed to a thickness of 15 nm or less by the dry film formation described in the second embodiment.

Example 3
Example 3 is based on the third embodiment described above.
Using the same molding die 1 as in Examples 1 and 2 above, the same processing was performed from degreasing to electroplating. After electroplating, the sea-island structure of yttrium oxide was formed to a thickness of 15 nm or less by the dry film formation described in Embodiment 3.

Example 4
Example 4 is based on the fourth embodiment described above.
Using the same molding die 1 as in Examples 1 to 3, the same treatment was performed from degreasing to electroplating. After electroplating, yttrium oxide was deposited to a thickness of 100 nm by the dry deposition described in Embodiment 4, and then the yttrium fluoride sea-island structure was deposited to a thickness of 15 nm or less.

Comparative Example 1 in Table 1 is for comparison with the present invention.
In Comparative Example 1, the same molding die 1 as in Examples 1 to 4 was used, and the same treatment from degreasing treatment to electroplating was performed, and there was no subsequent antifouling film forming step.

  Next, as a comparison between Examples 1 to 4 according to the present invention and Comparative Example 1, continuous molding of biconvex lenses was performed using the molds of the obtained Examples and Comparative Examples. A spherical abrasive B270 (manufactured by Schott) is installed on the mold surface as a glass glass material, and a preheating time of 120 seconds is provided at 600 ° C. to soften the glass in a nitrogen atmosphere, and then a 0.7 MPa press at 630 ° C. After holding at a pressure for 120 seconds, it was cooled to 550 ° C. while holding at 0.2 MPa, and thereafter, it was cooled to 200 ° C. without applying pressure, and the molded lens was taken out. The above molding process was repeated 1000 times, and this was taken as a continuous molding test. After the continuous molding test, the crack occurrence rate of the glass, the presence or absence of fogging of the glass lens, and the fused state of the glass to the mold were investigated. About the crack of glass, it calculated as an incidence rate of the crack of all enforcement 1000 times. As for the fogging of the glass lens, the 991 to 1000th lenses were inspected with transmitted light. Whether the glass component (mainly Si) was detected in the fused state to the glass mold was examined by elemental analysis using SEM-EDX. Table 2 shows the results of the continuous molding test.

  As is clear from the evaluation results shown in Table 2, in Comparative Example 1 where the antifouling coating was not applied to the mold, the glass lens was cracked and fogged, and the glass was fused to the mold. However, in the present invention, as shown in Examples 1 to 4 in which the mold was antifouling-coated, the occurrence of cracking and fogging of the glass lens was less than in the comparative example, and the glass was fused to the substrate. Neither was wearing. Thus, the clear effect of this invention was able to be confirmed.

  DESCRIPTION OF SYMBOLS 1 Mold for molding, 2 Mold base material, 3 Barrier film, 4 Release film, 5 Antifouling film, 31 Strike nickel plating film, 32 Electro nickel plating film, 33 Electro metal plating film, 4 Release film, 5 Antifouling film, 51 Hydrophobic antifouling film, 52 Hydrophilic antifouling film.

Claims (16)

  A mold base material, a barrier film formed on the mold base material, a release film formed on the barrier film, and an antifouling film formed on the release film, The antifouling film is a molding die comprising at least one of a hydrophilic antifouling film and a hydrophobic antifouling film.   The barrier film includes at least one precious metal selected from platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), and ruthenium (Ru), transition metal element and nickel (Ni), tungsten (W). 2. The molding according to claim 1, comprising an alloy with at least one transition metal element of tantalum (Ta), gold (Au) and molybdenum (Mo), or a single metal single layer or multiple layers. Mold.   3. The molding according to claim 1, wherein the release film is made of an alloy in which one or more of platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), and ruthenium (Ru) are combined. Mold.   The mold for molding according to any one of claims 1 to 3, wherein the antifouling film is the hydrophilic antifouling film and the hydrophobic antifouling film interspersed on the release film.   The hydrophilic antifouling film and the hydrophobic antifouling film each have a film thickness of 5 to 10 nm and a width of 5 to 10 nm, and a gap between the hydrophilic antifouling film and the hydrophobic antifouling film The molding die according to claim 4, wherein an interval of is 100 nm or less.   The mold for molding according to any one of claims 1 to 3, wherein the antifouling film is the hydrophobic antifouling film interspersed on the release film.   7. The molding according to claim 6, wherein the hydrophobic antifouling film has a film thickness of 5 to 15 nm and a width of 5 to 15 nm, and a gap between adjacent hydrophobic antifouling films is 100 nm or less. Mold.   The mold for molding according to any one of claims 1 to 3, wherein the antifouling film is the hydrophilic antifouling film interspersed on the release film.   9. The molding gold according to claim 8, wherein the hydrophilic antifouling film has a thickness of 5 to 15 nm and a width of 5 to 15 nm, and a gap between adjacent hydrophilic antifouling films is 100 nm or less. Type.   2. The antifouling film is composed of the hydrophilic antifouling film formed on the entire surface of the release film and the hydrophobic antifouling film interspersed on the hydrophilic antifouling film. The molding die according to any one of to 3.   11. The molding according to claim 10, wherein the hydrophobic antifouling film has a thickness of 5 to 10 nm and a width of 5 to 10 nm, and a gap between adjacent hydrophobic antifouling films is 100 nm or less. Mold.   The antifouling film is composed of the hydrophobic antifouling film formed on the entire surface of the release film and the hydrophilic antifouling film interspersed on the hydrophobic antifouling film. The molding die according to any one of to 3.   13. The molding according to claim 12, wherein the hydrophilic antifouling film has a film thickness of 5 to 10 nm and a width of 5 to 10 nm, and a gap between adjacent hydrophilic antifouling films is 100 nm or less. Mold.   The molding die according to claim 1, wherein the hydrophobic antifouling film is made of yttrium fluoride.   The molding die according to any one of claims 1 to 5 and 8 to 13, wherein the hydrophilic antifouling film is composed of yttrium oxide. It is a manufacturing method of the metallic mold according to claim 1,
A barrier film forming step of forming the barrier film on the surface of the mold base material to suppress diffusion of components of the mold base material by a wet plating method; and
A release film forming step of forming a release film on the barrier film by wet plating;
An antifouling film forming step of forming the antifouling film by dry film formation on the release film.

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