JP2007223846A - Molding mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding mold having more excellent durability than heretofore. <P>SOLUTION: The molding mold is formed by layering a diffusion preventing layer for preventing the diffusion of components of a mold base material part and those of a bond layer on the surface of the mold base material part while interposing the bond layer between them. The hardness of the diffusion preventing layer is made larger than that of the bond layer. It is better that the Vickers hardness of the bond layer is within 10-200 and that of the diffusion preventing layer is within a range of >200 and ≤1,500. A release layer for promoting the release of a molded article from the molding mold can further be layered on the surface of the diffusion preventing layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mold.

  In various industrial fields, molding with a mold is performed in order to impart a shape to a material. Molding with a molding die has an advantage that a relatively large number of the same shape can be easily produced as compared with grinding.

  Conventionally, a mold having various functional layers on the surface of the mold base is known. For example, Patent Document 1 discloses a mold in which a base material is coated with a diffusion prevention film and a release film in this order.

  In the molding die, the base material is made of WC. The diffusion prevention film is made of Nb, Hf, Ta or the like formed by sputtering. The release film is made of a Pt—Ir alloy formed by sputtering. In addition, the said diffusion prevention film has a function which prevents the spreading | diffusion of a base material component.

Japanese Patent Laid-Open No. 2002-60239 (Examples)

  Generally, this type of mold requires durability in order to make use of its advantages.

  However, the conventional mold has a problem that the durability is low, for example, the diffusion preventing film peels off during the production of the molded product. Therefore, the mold life is short and difficult to use in actual production.

  Moreover, once the diffusion preventing film is peeled off, it becomes impossible to prevent the diffusion of the mold base material component. Therefore, the molded product is easily contaminated by the mold base material component. Further, depending on the type of the molding material used, the molding material and the mold are likely to be fused, and molding may be difficult.

  As described above, the conventional mold having the diffusion barrier film is liable to cause various problems due to its low durability.

  Therefore, the problem to be solved by the present invention is to provide a mold having higher durability than conventional ones.

  In order to solve the above-described problems, the mold according to the present invention has a diffusion prevention layer that prevents diffusion of the components of the mold base part and the bond layer on the surface of the mold base part via the bond layer. It is summarized that the hardness of the diffusion preventing layer is larger than the hardness of the bond layer.

  Here, the Vickers hardness of the bond layer is preferably in the range of 10 or more and 200 or less, and the Vickers hardness of the diffusion preventing layer is preferably in the range of more than 200 and 1500 or less.

  The bond layer mainly contains at least one metal selected from Cr, Co, Ni, Cu, Ag and Au and / or an alloy containing one or more of the metals, It is preferable to mainly contain at least one metal selected from Nb, Mo, Ru, Rh and Ta and / or an alloy containing one or more of the metals.

  Further, the bond layer and / or the diffusion preventing layer may be formed by plating.

  Moreover, it is preferable that a release layer that facilitates release from the molded product is further laminated on the surface of the diffusion preventing layer.

  Meanwhile, the gist of the molded product according to the present invention is that the molded product according to the present invention is molded.

  In the mold according to the present invention, a diffusion prevention layer is laminated on the surface of the mold base portion via a bond layer. Further, the hardness of the diffusion preventing layer is larger than the hardness of the bond layer. Therefore, since the diffusion preventing layer is hardly peeled off due to the presence of the bond layer, the durability is excellent as compared with a conventional mold. Therefore, according to the mold according to the present invention, the life of the mold can be extended.

  Further, since the diffusion preventing layer is difficult to peel off, the molded product is hardly contaminated by the mold base part component. In addition, since diffusion of components below the diffusion preventing layer can be prevented over a long period of time, the molding material and the molding die are hardly fused, and the productivity is improved.

  Here, when the Vickers hardness of the bond layer and the diffusion prevention layer is within the specific range, and when the bond layer and the diffusion prevention layer are mainly composed of the specific metal or alloy, the above It is easy to exert the effect.

  Moreover, when the bond layer and / or the diffusion preventing layer are formed by plating, the mold surface can be easily flattened by appropriately selecting the plating conditions. Therefore, it becomes easy to obtain a molded product with less unevenness on the surface.

  In addition, when a release layer is further laminated on the surface of the diffusion preventing layer, the molded product is easily released.

  On the other hand, since the molded product according to the present invention is molded using the above mold, it is excellent in mass productivity.

  Hereinafter, the molding die according to this embodiment will be described in detail (hereinafter, the molding die according to this embodiment may be referred to as “main molding die”).

  First, the configuration of the main mold will be described. As illustrated in FIG. 1, the present mold 10 includes a mold base portion 12, a bond layer 14, and a diffusion prevention layer 16 as a basic configuration.

  The mold base part 12 forms a mold body. A transfer surface (not shown) for transferring a desired shape to the molding material is usually formed on the surface of the mold base 12. The bond layer 14 is interposed between the mold base portion 12 and the diffusion prevention layer 16 and mainly has a function of bonding both. The diffusion preventing layer 16 is formed on the surface of the bond layer 14 and mainly has a function of preventing the diffusion of the mold base material component and the bond layer component.

  In the present mold, the bond layer may be formed of one layer or may be formed of two or more divided layers. Moreover, when the bond layer is dividedly formed, each divided layer may have the same composition or may have a different composition. The same applies to the diffusion prevention layer.

  In this mold, the diffusion prevention layer basically affects the moldability of the mold base part component and the bond layer component, or lowers the commercial value of the molded product if it adheres to or mixes with the molded product. It is sufficient that at least one or more components to be diffused can be prevented from diffusing.

  Specifically, as such a component, for example, Ti, Cr, Fe, Co, Ni, Ta, W, etc., which may be contained in the mold base portion, Ti which may be contained in the bond layer, Examples of the components include Cr, Fe, Co, Ni, Cu, Ag, Ta, W, and Au.

  Here, in this mold, the hardness of the diffusion preventing layer is greater than the hardness of the bond layer. If the hardness of the bond layer is greater than the hardness of the diffusion preventing layer, sufficient bonding strength cannot be obtained between them. However, when there is no bond layer, the adhesion of the diffusion preventing layer is poor and sufficient durability cannot be obtained.

The hardness refers to Vickers hardness measured according to JIS Z 2244. Specifically, Vickers hardness of _{H VB} of the bond layer, the Vickers hardness of the diffusion preventing layer and _{H VDR,} may be within the range of _{10 ≦ H VB ≦ 200,200 <H} VDR ≦ 1500. This is because if both Vickers hardnesses are within these ranges, the bonding strength between the mold base portion and the diffusion preventing layer is excellent and the durability is excellent.

At this time, the hardness of the mold base part is preferably larger than the hardness of the bond layer. Specifically, when the Vickers hardness of the mold base portion and _{H VM,} may be within the range of 200 _{<H VM} ≦ 2100.

  Specific examples of the material of the bond layer include, for example, at least one metal selected from Cr, Co, Ni, Cu, Ag, and Au and / or an alloy containing one or more of these metals. Can do.

  Specific examples of the material for the diffusion prevention layer include at least one metal selected from Nb, Mo, Ru, Rh and Ta and / or an alloy containing one or more of these metals. it can.

  Specific examples of the material of the mold base part include WC-based cemented carbide, stainless steel, Si and ceramics made of a composite thereof.

  The crystal grain size of the bond layer is preferably in a specific range. When the crystal grain size of the bond layer becomes excessively large, there is a tendency for the mechanical strength to decrease, and when the crystal grain size of the bond layer becomes excessively small, the number of crystal grains becomes too large, and void portions in the layer are formed. This is because there is a tendency to increase and become brittle.

  Specific examples of the preferred upper limit of the crystal grain size of the bond layer include 1000 nm, 500 nm, 100 nm, and the like. On the other hand, specific examples of preferable lower limit values that can be combined with these preferable upper limit values include 1 nm, 5 nm, 10 nm, and 50 nm.

  Also, the crystal grain size of the diffusion preventing layer is preferably within a specific range. When the crystal grain size of the diffusion prevention layer is excessively large, there is a tendency for the mechanical strength to decrease, and when the crystal grain size of the diffusion prevention layer is excessively small, the number of crystal grains is excessively increased, resulting in voids in the layer. This is because a tendency to become brittle due to an increase in the portion is observed.

  Specific examples of the preferable upper limit of the crystal grain size of the diffusion preventing layer include 500 nm, 120 nm, 110 nm, 100 nm, and 90 nm. On the other hand, specific examples of preferable lower limit values that can be combined with these preferable upper limit values include 1 nm, 5 nm, 7.5 nm, 10 nm, 12.5 nm, and 15 nm.

  Further, the purity of the bond layer is preferably 2N (99%) or more, more preferably 3N (99.9%) or more, from the viewpoint of excellent mechanical strength.

  Further, the purity of the diffusion preventing layer is preferably 2N (99%) or more, more preferably 3N (99.9%) or more from the viewpoint of excellent diffusion preventing effect.

  In the present mold, the thickness of the bond layer is preferably within a specific range. This is because when the bond layer is excessively thick, the mechanical strength tends to decrease, and when the bond layer is excessively small, a sufficient bonding force cannot be obtained.

  Specific examples of the preferable upper limit of the thickness of the bond layer include 0.1 μm, 0.05 μm, and 0.03 μm. On the other hand, specific examples of preferable lower limit values that can be combined with these preferable upper limit values include 0.01 μm.

  The thickness of the diffusion preventing layer is also preferably within a specific range. If the thickness of the diffusion prevention layer is excessively thick, the unevenness of the mold surface becomes large, and it may be difficult to obtain a molded product having a good surface. If the thickness of the diffusion prevention layer is excessively thin, the diffusion prevention effect is reduced. This is because there is a tendency to do.

  Specific examples of the preferable upper limit of the thickness of the diffusion preventing layer include 1 μm and 0.5 μm. On the other hand, specific examples of preferable lower limit values that can be combined with these preferable upper limit values include 0.2 μm and 0.3 μm.

  In the above description, the case where the present mold has the diffusion preventing layer as the outermost layer has been described. In addition to this, the mold may further include a release layer 18 on the surface of the diffusion preventing layer 16 as shown in FIG.

  The release layer mainly has a function of promoting release from the molded product. Whether or not the release layer is laminated can be appropriately determined as necessary in consideration of molding conditions such as the type of molding material and molding temperature.

  That is, depending on the molding conditions and the like, there is a case where there is no hindrance to mold release even if the lamination is up to the diffusion preventing layer. In such a case, it is not necessary to layer a release layer. On the other hand, for example, when a molding material such as glass is molded at a high temperature, the molded product may be difficult to release. In such a case, a release layer may be further laminated.

  The release layer may be composed of one layer or may be composed of two or more layers. Moreover, when a mold release layer consists of two or more layers, each layer may consist of the same composition and may consist of a different composition.

  Specific examples of the material of the release layer include Ir, Ir alloy, diamond-like carbon (DLC), Pt, Pt alloy, Pd, Pd alloy, TiC, TiN, TiCN, (TiAl) N, and (TiCr). ) N, Cr / CrN, Cr / TiN, and the like. These may be contained alone or in combination of two or more.

  Further, the thickness of the release layer is not particularly limited, and may be appropriately selected in consideration of release properties.

  Specific examples of the preferable upper limit of the thickness of the release layer include 1 μm and 0.5 μm. On the other hand, specific examples of preferable lower limit values that can be combined with these preferable upper limit values include 0.1 μm and 0.2 μm.

  This mold can be used for any molding material of inorganic materials and organic materials. Specifically as an inorganic material, glass, ceramics, a metal etc. can be illustrated, for example. Examples of the organic material include various resins and rubber. These molding materials may be used alone or in combination.

  Specific examples of the molded article molded by the present mold include various uses such as an optical member such as a glass lens and a substrate used in the optical communication field.

  Moreover, the said molded object can be obtained if it passes through the process of shape | molding the said molding material by various shaping | molding methods, such as press molding, mold shaping | molding, injection molding, using this shaping | molding die.

  Next, an example of a manufacturing method of the main mold (hereinafter, also referred to as “main manufacturing method”) will be described.

  This manufacturing method includes at least a step of laminating a bond layer on the surface of the mold base portion and a step of laminating a diffusion prevention layer on the surface of the bond layer. In these steps, the materials of the diffusion prevention layer and the bond layer are selected so that at least the hardness of the diffusion prevention layer is larger than the hardness of the bond layer.

  In addition, before laminating | bonding a bond layer on the type | mold base material part surface, you may perform pre-processings, such as a degreasing process, the removal of a passive film, and washing | cleaning as needed.

  Here, the bond layer and the diffusion preventing layer can be laminated on the surface of the mold base portion using various methods.

  Specific examples of methods for forming the bond layer and the diffusion prevention layer include physical vapor deposition methods (PVD) such as sputtering, vacuum deposition, ion plating, MBE, and laser ablation, and thermal CVD. Vapor phase methods such as chemical vapor deposition (CVD) such as plasma CVD, plating methods such as electrolytic plating and electroless plating, liquid phase methods such as anodic oxidation method, coating method, sol-gel method, etc. It can be illustrated. Note that the bond layer and the diffusion prevention layer may be formed using the same method, or may be formed using different methods.

  The bond layer and / or the diffusion preventing layer is preferably formed by a plating method from the viewpoints of easily flattening the mold surface and lowering the cost compared with the vapor phase method.

  FIG. 3 is a diagram schematically illustrating, for example, the difference in surface irregularity when a bond layer is formed by a vapor phase method and a plating method. (A) shows the case where the bond layer is not formed yet, (b) shows the case where the bond layer is formed by the vapor phase method, and (c) shows the case where the bond layer is formed by the plating method.

As shown to (a), the mold base part 12 before forming the bond layer 14 usually has a relatively large uneven part 22 and a relatively small uneven part 24 on the surface. There are many. Examples of the relatively large concavo-convex portion 22 include a processing mark formed during molding processing. On the other hand, as the relatively small uneven portion 24, for example, particles dropped off during molding processing, pores existing on the surface of the mold base portion, and the like can be exemplified.

  When the bond layer 14 is formed by the vapor phase method when the surface of the mold base portion 12 is in the state (a), the relatively small uneven portion 24 is flattened as shown in (b). The relatively large uneven portion 22 is difficult to be flattened.

  In contrast, when the bond layer 14 is formed by plating, both the relatively small uneven portion 24 and the relatively large uneven portion 22 are easily flattened as shown in FIG. Therefore, there exists an advantage which becomes easy to obtain the molding with few unevenness | corrugations on the surface. The same applies to the case where a diffusion preventing layer is formed on the surface of the bond layer.

  When using a plating method, the plating conditions such as the type of plating solution, the plating current density, the plating time, the plating bath temperature, the type and amount of additives that impart flatness added to the plating bath, and the like are adjusted appropriately. be able to.

  For example, the plating current density and the plating time may be selected so that the mechanical strength does not decrease due to the coarsening of the deposited plating particles so as to be a relatively high current density and a short time, although it depends on the type of plating solution. .

For the bond layer, as a preferable upper limit value of the plating current density, specifically, for example, 6, 5 A / dm ^{2 and the} like can be exemplified. On the other hand, as a preferable lower limit value that can be combined with these preferable upper limit values, Specifically, for example, 0.1, 0.2 A / dm ^{2 and the} like can be exemplified.

  The plating time may be appropriately adjusted according to the plating current density, preferably within 60 seconds, more preferably within 30 seconds, and even more preferably within 10 seconds.

On the other hand, for the diffusion preventing layer, specific examples of the preferable upper limit value of the plating current density include, for example, 6, 5 A / dm ^{2 and the} like. On the other hand, a preferable lower limit value that can be combined with these preferable upper limit values. Specific examples of the value include 0.1 and 0.2 A / dm ² .

  The plating time may be appropriately adjusted according to the plating current density, preferably within 3 minutes, more preferably within 2 minutes, and even more preferably within 1 minute.

  When a plating method is used for forming the bond layer and / or the diffusion preventing layer, the formed plating layer may be subjected to an annealing treatment or the like. When annealing is performed, component diffusion due to pinholes or the like can be effectively prevented.

  In addition, this manufacturing method may have the process of laminating | stacking a mold release layer further on the surface of a diffusion prevention layer as needed. In this case, in consideration of the material of the release layer to be laminated, it can be laminated by using various methods similar to the above bond layer and diffusion preventing layer. Preferably, a plating method is used.

Hereinafter, the present invention will be described in detail using examples.
1. Preparation of mold base part and pre-treatment on its surface As a mold base part, a sintered mold was prepared by sintering tungsten carbide powder containing 12% by weight of Co. The mold base part contained 1000 ppm or less of Fe, Ni, and Cr as impurity components.

  Next, the surface of the mold base portion sintered in a predetermined shape was anodic electrolytic degreased with an aqueous NaOH solution to dissolve organic impurities present on the surface. Next, the mold base is immersed in a 60 ml / L solution containing EDTA (70 g / L) and hydrogen peroxide (35% by weight) to remove the passive film present on the surface of the mold base. did. Furthermore, the surface of the mold base part was washed with hydrochloric acid, and then washed with water.

2. Formation of Bond Layer 2.1 Formation Method 1
Using the gold strike plating bath (manufactured by Nippon Electroplating Engineers Co., Ltd., “Nutronex Strike”), the above pretreatment was performed under the conditions of a plating current density of 3 A / dm ² and a plating bath temperature of 50 ° C. An Au layer (bond layer) made of Au strike plating was formed on the surface of the mold base part.

  At this time, as shown in Table 1 described later, for Examples 1, 2, 3, and 4, the plating time was 10 seconds, and for Example 7, the plating time was 50 seconds.

2.2 Formation method 2
An Au layer (bond layer) was formed on the surface of the mold base portion by sputtering.
2.3 Formation method 3
An Nb layer (bond layer) was formed on the surface of the mold base portion by sputtering.

3. Formation of diffusion prevention layer 3.1 Formation method 1
Using a plating solution containing 80 g / L of Rh ₂ (SO ₄ ) ₃ and 180 g / L of sulfuric acid, with a plating current density of 1.3 A / dm ² , a plating time of 2.5 minutes, and a plating bath temperature of 45 ° C. A Rh layer (diffusion prevention layer) made of Rh plating was formed on the surface of the Au layer (bond layer).

3.2 Formation method 2
An Nb layer (diffusion prevention layer) was formed on the surface of the Au layer (bond layer) by sputtering.

4). Release layer formation 4.1 Formation method 1
Using a plating solution containing 8 g / L of (NH ₄ ) ₂ IrCl ₆ and 0.8 g / L of sulfuric acid, with a plating current density of 1.0 A / dm ² , a plating time of 5 minutes, and a plating bath temperature of 50 ° C. An Ir layer (release layer) made of Ir plating was formed on the surface of the Rh layer (diffusion prevention layer), Nb layer (diffusion prevention layer) or Au layer (bond layer).

4.2 Formation method 2
An Ir / Re layer (release layer) made of an Ir / Re alloy was formed on the surface of the Rh layer (diffusion prevention layer) by sputtering.

5). Measurement of Hardness of Bond Layer and Diffusion Prevention Layer The hardness of each layer was measured by measuring the Vickers hardness of the bond layer and diffusion prevention layer of about 1 μm formed on the copper plate (in accordance with JIS Z 2244). At this time, “Nano Hard Nestester NHT” manufactured by Nanotech Co., Ltd. was used as the hardness measuring apparatus. In addition, it was 2040 (Hv) when the Vickers hardness of the mold base part was also measured (based on JIS Z 2244).

6). Bond layer, diffusion prevention layer, and release layer thickness measurement After performing etching using a focused ion beam (FIB) apparatus ("FIB200" manufactured by FEI), by performing SIM (scanning ion microscope) observation, The thickness of each layer was measured. In addition, the thickness in Table 1 is an average value of thicknesses measured at five arbitrary points in the center of the sample.

7). Measurement of average particle diameter of bond layer and diffusion preventing layer Etching was performed using the above-described focused ion beam (FIB) apparatus, and SIM observation was carried out to measure the average particle diameter of the bond layer and diffusion preventing layer. In addition, the average particle diameter in Table 1 is an average value of the particle diameters measured for any 10 particles in the center of the sample.

8). Durability Evaluation Durability was evaluated for the molds according to Examples and Comparative Examples shown in Table 1 described later. That is, a cycle in which each mold was held at 800 ° C. for 1 hour in an Ar atmosphere and then allowed to cool to 100 ° C. was performed 20 times.

  Next, in accordance with the cross cut tape test defined in JIS D0202-1988, cellophane tape (“CT24” manufactured by Nichiban Co., Ltd.) was adhered to the outermost surface of each mold, and then the tape was peeled off.

  At this time, the case where the number of non-peeled squares in 100 squares was smaller than that in Comparative Example 1 was regarded as acceptable. In Table 2, “X / 100” (where X is an integer of 0 to 100) indicates that the functional layer was peeled in the X cell in 100 cells.

9. Evaluation of Diffusion Prevention Effect The diffusion prevention effect was evaluated for the molds according to Examples and Comparative Examples shown in Table 1 described later. That is, each mold was held for 100 hours at 800 ° C. in an Ar atmosphere, and then allowed to cool to room temperature.

  Next, by Auger spectroscopy, W, Co, Fe, Ni, Cr, Au, and Nb, which are components that may diffuse from the lower layer, are confirmed on the surface of the surface layer (diffusion prevention layer or release layer). We investigated whether or not. As the component detection device, “Scanning Auger Electron Spectrometer PH1700” manufactured by ULVAC-PHI Co., Ltd. was used.

  At this time, the case where no component other than the surface layer component was confirmed or the case where the component other than the surface layer component was 15 atom% or less was regarded as acceptable as the diffusion of the lower layer component could be prevented. On the other hand, those other than the constituent components of the surface layer exceeded 15 atom%, and those in which the lower layer components were recognized to be diffused were rejected.

  Table 1 shows a summary of the layer configuration, Vickers hardness, thickness, average particle diameter, and the like of each functional layer formed on the surface of the mold base part for the molds according to Examples and Comparative Examples. Table 2 summarizes the evaluation results of the molds according to Examples and Comparative Examples. In Table 2, a case where both the durability and the anti-diffusion effect are both passed is evaluated as a comprehensive evaluation.

  According to Tables 1 and 2, the following can be understood. That is, the molding according to Comparative Example 1 in which the diffusion preventing layer is laminated without interposing the bond layer on the surface of the mold base part, and the molding according to Comparative Example 2 in which the hardness relationship between the bonding layer and the diffusion preventing layer does not satisfy the scope of the present application. The mold was found to be extremely low in durability with peeling of the functional layer.

  Further, the molding die according to Comparative Example 3 having no diffusion prevention layer was not able to sufficiently suppress the component diffusion in the lower layer.

  On the other hand, in the mold according to the example, a diffusion prevention layer is laminated on the surface of the mold base via a bond layer. Further, the hardness of the diffusion preventing layer is larger than the hardness of the bond layer. Therefore, it was confirmed that the diffusion preventing layer was difficult to peel off due to the presence of the bond layer, and thus the durability was excellent.

  Moreover, it has confirmed that the shaping | molding die which concerns on an Example has prevented the spreading | diffusion of a lower layer component effectively by the diffusion prevention layer.

  As mentioned above, although the shaping | molding die concerning this embodiment and an Example was demonstrated, this invention is not limited to the said embodiment and Example at all, and various modification | change is possible within the range which does not deviate from the meaning of this invention. It is.

It is sectional drawing which showed an example of the basic composition of the shaping | molding die concerning this embodiment. FIG. 2 is a cross-sectional view showing a configuration when a release layer is further laminated in the mold of FIG. 1. It is the figure which illustrated typically the difference in the unevenness | corrugation state of the surface at the time of forming a bond layer with a gaseous-phase method and a plating method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mold 12 Mold base part 14 Bond layer 16 Diffusion prevention layer 18 Release layer

Claims (6)

A diffusion preventing layer for preventing diffusion of the components of the mold substrate part and the bond layer is laminated on the surface of the mold substrate part via a bond layer,
The mold according to claim 1, wherein the diffusion preventing layer has a hardness greater than that of the bond layer.   2. The Vickers hardness of the bond layer is in the range of 10 to 200, and the Vickers hardness of the diffusion prevention layer is in a range of greater than 200 and 1500 or less. Mold. The bond layer mainly contains at least one metal selected from Cr, Co, Ni, Cu, Ag and Au and / or an alloy containing one or more of the metals,
3. The diffusion preventing layer mainly contains at least one metal selected from Nb, Mo, Ru, Rh and Ta and / or an alloy containing one or more of the metals. The mold described in 1.   The mold according to claim 1, wherein the bond layer and / or the diffusion preventing layer is formed by plating.   The mold according to any one of claims 1 to 4, wherein a release layer that facilitates release from the molded product is further laminated on the surface of the diffusion preventing layer.   A molded article molded using the mold according to any one of claims 1 to 5.

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